coil component

Abstract

coil component (10) which has the following features: a core (10C) comprising a winding core section (11) with a central axis, a first flange section (12) connected to a first end of the winding core section (11) in a direction along the central axis and projecting outwards from a circumferential surface of the winding core section in a radial direction centered on the central axis, and a second flange section (13) connected to a second end of the winding core section (11), the second end being arranged on a side opposite the first end and projecting outwards from the circumferential surface of the winding core section (11) in a radial direction centered on the central axis; a wire (30) having a section that extends spirally along the circumferential surface of the winding core section (11) with respect to the central axis as a spiral axis; and an upper plate (40) which is longer in one direction along the central axis than the winding core section (11), and which is attached to the first flange section (12) and the second flange section (13) via an adhesive (50), wherein the adhesive (50) is not in contact with the winding core section (11) and if a first area is an area in which the adhesive (50) is present on a surface of the upper plate, and a second area is a combined area comprising an area in which the adhesive (50) is present on a surface of the first flange section (12) and an area in which the adhesive (50) is present on a surface of the second flange section (13), the first area is larger than the second area, whereby a section of the first area faces the winding core section (11), wherein in the first area the adhesive (50) comprises a thick film section and a thin film section, The thick film section is a section with a thickness that exceeds the thickness from the surface of the upper plate to peak points on the surface of the upper plate. The thin-film section is a section with a thickness that is less than the thickness from the surface of the upper plate to the peak points on the surface of the upper plate, and the thin film section faces the winding core section (11).

Description

[0001] The present invention relates to a coil component.

[0002] A coil component disclosed in JP 6477622 B comprises a core, which includes a winding core section with a central axis, a first flange section, a second flange section, and a top plate. The winding core section has a square column shape. The first flange section is connected to a first end of the winding core section. The first flange section projects outward from a circumferential surface of the winding core section in a radial direction centered on the central axis. The second flange section is connected to a second end of the winding core section. The second flange section projects outward from the circumferential surface of the winding core section in a radial direction centered on the central axis. The top plate extends through a longer area in a direction along the central axis than the winding core section.The upper plate is connected to the first flange section and the second flange section via an adhesive.

[0003] A load can act on the upper plate of the coil component disclosed in JP 6477622 B.

[0004] More precisely, if, for example, the coil component is mounted on a substrate, the top plate can be pressed against the substrate. If a load is applied to the top plate in this way, there is a risk that the top plate will not be able to withstand the load and will be damaged. JP 2001-93756A discloses a common-mode filter used in small electronic devices.

[0005] The object of the present invention is to create a coil component with improved characteristics.

[0006] This problem is solved by a coil component according to claim 1.

[0007] To solve the problem described above, one aspect of the present disclosure provides a coil component comprising the following features: a core comprising a winding core section with a central axis, a first flange section connected to a first end of the winding core section in a direction along the central axis and projecting outward from a circumferential surface of the winding core section in a radial direction centered on the central axis, and a second flange section connected to a second end of the winding core section, the second end being located on a side opposite the first end and projecting outward from the circumferential surface of the winding core section in a radial direction centered on the central axis; a wire with a portion extending helically along the circumferential surface of the winding core section,wherein the central axis is a spiral axis; an upper plate extending through a longer region in one direction along the central axis than the winding core section and connected to the first flange section and the second flange section via an adhesive. The adhesive does not contact the winding core section. If a first region is a region where the adhesive is present on a surface of the upper plate, and a second region is a combined region comprising a region where the adhesive is present on a surface of the first flange section and a region where the adhesive is present on a surface of the second flange section, the first region being larger than the second region, with a section of the first region facing the winding core section, wherein in the first region the adhesive comprises a thick-film section and a thin-film section,The thick-film section is a section with a thickness exceeding the thickness from the surface of the top plate to the apex points on the surface of the top plate. The thin-film section is a section with a thickness less than the thickness from the surface of the top plate to the apex points on the surface of the top plate, and the thin-film section faces the winding core section. If the area where the adhesive is present on a top surface of the top plate is called a first presence area, and a combined area consisting of the area where the adhesive is present on a surface of the first flange area and an area where the adhesive is present on a surface of the second flange area is called a second presence area, then the first presence area is larger than the second presence area.

[0008] With this configuration, a portion of the adhesive spreading along the surface of the top plate acts as a protective layer. The adhesive spreads over the areas of the top plate's surface necessary to secure the flange sections to the top plate. Thus, the adhesive is present over a wide area of ​​the top plate's surface, improving the overall mechanical strength of both the top plate and the adhesive. As a result, damage to the top plate can be suppressed, even under load.

[0009] When a load acts on the upper plate, the upper plate easily withstands the load and damage to the upper plate is suppressed.

[0010] Preferred embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. These show: Fig. 1 a side view of a coil component; Fig. 2 a bottom view of the coil component in Fig. 1; Fig. 3 a sectional view along line 3-3 in Fig. 2; Fig. 4 a sectional view along line 4-4 in Fig. 3; Fig. 5 a bottom view of an upper plate; Fig. 6. An explanatory diagram to describe a first thick film section; Fig. 7. An explanatory diagram to describe a first thin-film section; Fig. 8. An explanatory diagram to describe a process for manufacturing a coil component. Coil component of the exemplary embodiment

[0011] The following describes a coil component according to an exemplary embodiment. In the drawings, some components may be enlarged for clarity. The dimensional relationships of the components may differ from the actual dimensions or from those shown in other drawings. Furthermore, hatching is used in the sectional views, but the hatching of some components may be omitted for clarity. Overall configuration

[0012] As it is in Fig. As shown in Figure 1, a coil component 10 comprises a core 10C. The core 10C comprises a winding core section 11. The winding core section 11 has a rectangular column shape. Therefore, the winding core section 11 has a central axis CA and extends in one direction along the central axis CA. Furthermore, the winding core section 11 has a circumferential surface 11F that surrounds the central axis CA.

[0013] In the following description, a first axis X is an axis that extends in one direction along the central axis CA. Furthermore, as described in Fig. As shown in Figure 2, a second axis Y is an axis extending parallel to each of the four sides forming the square shape of a cross-section of the winding core 11, and perpendicular to the central axis CA. Then, as shown in Figure 2, Fig. As shown in Figure 1, a third axis Z is an axis perpendicular to the first axis X and the second axis Y. In other words, the third axis Z is a perpendicular axis perpendicular to the central axis CA. Furthermore, a direction along the first axis Z is called the first positive direction XY, and the other direction along the first axis X is called the first negative direction X2. Additionally, as shown in Figure 1, the third axis Z is a third axis Z. Fig. As shown in Figure 2, one direction along the second axis Y is called a second positive direction Y1, and the other direction along the second axis Y is called a second negative direction Y2. Furthermore, as shown in Figure 2, one direction along the second axis Y is called a second positive direction Y1, and the other direction along the second axis Y is called a second negative direction Y2. Fig. As shown in Figure 1, a direction along the third axis Z is called the third positive direction Z1, and the other direction along the third axis Z is called the third negative direction Z2. In other words, a direction opposite to the third positive direction Z1 is the third negative direction Z2.

[0014] As it is in Fig. As shown in Figure 1, the core 10C further comprises a first flange section 12 and a second flange section 13. The first flange section 12 is connected to a first end of the winding core section 11, the first end being the end on the side of the first positive direction X1. The first flange section 12 projects outwards from the circumferential surface 11F of the winding core section 11 in a radial direction centered on the central axis CA. As shown in Figure 1, the first flange section 12 is connected to the first end of the winding core section 11, the first end of the first flange section 12 being the end of the first flange section 11, the second flange section 12 being the end of the first flange section 11, the first ... Fig. As shown in Figure 2, the first and second flange sections 12 and 13 project from the circumferential surface 11F by the same amount in the second positive direction Y and the second negative direction Y2. As shown in Figure 2, the first and second flange sections 12 and 13 project from the circumferential surface 11F by the second positive direction Y and the second negative direction Y2. Fig. As shown in Figure 1, the first and second flange sections 12 and 13 project from the circumferential surface 11F of the winding core section 11 by a greater amount in the third negative direction Z2 than in the third positive direction Z1. In other words, the center of the first flange section 12 is displaced in one direction along the third axis Z relative to the third negative direction Z2 from the central axis CA of the winding core section 11.

[0015] The second flange section 13 is connected to a second end of the winding core section 11, the second end being the end of the winding core section 11 on the side of the first negative direction X2. The second flange section 13 is shaped to be symmetrical with the first flange section 12 in one direction along the first axis X, with the winding core section 11 positioned between them. The cross-sections of the first flange section 12 and the second flange section 13 perpendicular to the central axis CA of the winding core section 11 are square.

[0016] The material forming the core 10C is a non-conductive material. The core material 10C is, for example, aluminum oxide, a nickel-zinc ferrite, a resin, or a mixture of these materials. The coil component 10 has a first terminal electrode 21 and a second terminal electrode 22.

[0017] As it is in Fig. As shown in Figure 3, the first terminal electrode 21 is located on a surface of the first flange section 12. More precisely, the first terminal electrode 21 is located on a surface of the first flange section 12 at one end in the third negative direction Z2. The second terminal electrode 22 is located on a surface of the second flange section 13. More precisely, the second terminal electrode 22 is located on a surface of the second flange section 13 at one end in the third negative direction Z2.

[0018] The first terminal electrode 21 and the second terminal electrode 22 each consist of a metal layer formed of silver and a plating layer formed of copper, nickel, or tin, which is applied to the surface of the metal layer. In this embodiment, the surface of the coil component 10 on which the first terminal electrode 21 and the second terminal electrode 22 are arranged, that is, the surface oriented in the third negative direction Z2, is the surface facing a substrate when the coil component 10 is mounted on a substrate.

[0019] As it is in Fig. As shown in Figure 1, the coil component 10 comprises a wire 30. A first end of the wire 30 is connected to the first terminal electrode 21. A second end of the wire 30 is connected to the second terminal electrode 22. A portion of the wire 30 extends in a spiral shape along the circumferential surface 11F of the winding core section 11, with the central axis CA acting as the axis of the spiral. More precisely, a central portion of the wire 30 extends in a spiral shape between the first and second ends of the wire 30 along the circumferential surface 11F. Conversely, a portion of the wire 30 extending from the first end of the wire 30 also extends spirally with the central axis CA as the axis of the spiral, thus separating it from the circumferential surface 11F.Similarly, a portion of the wire 30 extending from the second end of the wire 30 spirals with the central axis CA as the axis of the spiral, so that it is separated from the circumferential surface 11F.

[0020] The coil component 10 has an upper plate 40. The upper plate 40 has a rectangular, plate-like shape that is longer in one direction along the first axis X than in one direction along the second axis Y. The upper plate 40 is connected to an end of the core 10C located on the side of the third positive direction Z1. In other words, the upper plate 40 is connected to the end of the core 10C located on the opposite side from the end where the first terminal electrode 21 and the second terminal electrode 22 are located. The upper plate 40 is connected to the core 10C to extend between the end surface of the first flange section 12 on the side of the third positive direction Z1 and the end surface of the second flange section 13 on the side of the third positive direction Z1.Therefore, the dimension of the upper plate 40 in one direction along the first axis X is larger than the dimension of the winding core section 11 in one direction along the first axis X. In other words, the upper plate 40 extends over a longer area in one direction along the central axis CA than the winding core section 11. Furthermore, as shown in . Fig. As shown in Figure 2, the dimension of the upper plate 40 in one direction along the second axis Y is essentially the same as the dimension of the first flange section 12 in one direction along the second axis Y and the dimension of the second flange section 13 in one direction along the second axis J.

[0021] Next, the surface roughness of core 10C and the surface roughness of the upper plate 40 are described. The following values ​​were measured on the surface of the upper plate 40, which is oriented in the third negative direction Z2, and on the surface of the first flange section 12, which is oriented in the third positive direction Z1.

[0022] The surface roughness of core 10C has a developed interfacial area ratio (Sdr, ISO 25178) of 0.08. The arithmetic mean (Spc) of the peak points (TP) of core 10C's surface is 2160. The arithmetic mean (Sa) of core 10C's height is 0.40. These values ​​were measured using a non-contact method according to ISO 25178.

[0023] On the other hand, for the surface roughness of the upper plate 40, the developed interfacial area ratio Sdr of the surface of the upper plate 40 is 0.19. The arithmetic mean Spc of the peak points TP of the surface of the upper plate 40 is 2860. The arithmetic mean height Sa of the surface of the upper plate 40 is 0.28. Therefore, the developed interfacial area ratio Sdr of the surface of the upper plate 40 is greater than or equal to 0.15 and less than or equal to 0.50. Furthermore, the developed interfacial area ratio Sdr of the surface of the upper plate 40 is greater than the developed interfacial area ratio Sdr of the surface of the core 10C.

[0024] Thus, the surfaces of core 10C and the upper plate 40 both have a certain roughness. The surface of the upper plate 40 is rougher than the surface of core 10C. As shown in Fig. As shown in Figure 1, the upper plate 40 is connected to the first flange section 12 and the second flange section 13 via an adhesive 50. The adhesive does not, however, contact the winding core section 11. The adhesive 50 is divided into a first adhesive section 51, which connects the upper plate 40 and the first flange section 12, and a second adhesive section 52, which connects the upper plate 40 and the second flange section 13. The adhesive 50 is a thermosetting adhesive and is, for example, made of an epoxy resin.

[0025] As it is in Fig. As shown in Figure 4, the first adhesive section 51 connects the first flange section 12 and the upper plate 40. Furthermore, as shown in Figure 4, the first adhesive section 51 connects the first flange section 12 and the upper plate 40. Fig. As shown in Figure 5, the first adhesive section 51 is arranged on a surface of the upper plate 40, which is oriented in the third negative direction Z2, towards the side of the first positive direction X1, with respect to the center of the surface in a direction along the first axis X.

[0026] Then, as it is in Fig. 3 and Fig. As shown in Figure 4, the first adhesive section 51 spreads over a first area A11 from the surface of the upper plate 40, which is oriented in the third negative direction Z2. As shown in Fig. As shown in Figure 5, the first adhesive section 51 in the first area A11 comprises a first thick-film section 51A and a first thin-film section 51B.

[0027] As it is in Fig. As shown in Figure 6, the first thick-film section 51A is the part that has a thickness extending to a position farther from the surface of the upper plate 40, which has a roughness greater than the peak points TP on the surface. On the surface of the upper plate 40, which is oriented in the third negative direction Z2, the first thick-film section 51A is located towards the side of the first positive direction X1, relative to the center of the upper plate 40 in a direction along the first axis X.

[0028] On the other hand, the first thin-film section 51B is the part that has a thickness less than the thickness extending to the peak points TP on the surface of the upper plate 40, which has a roughness. In other words, as it is described in Fig. As shown in Figure 7, the first thin-film section 51B spreads into valley sections between the peaks TP on the surface of the upper plate 40, which exhibits roughness, but the peaks TP of the upper plate 40 are not covered. Furthermore, as shown in Fig. As shown in Figure 5, the first thin-film section 51B surrounds the perimeter of the first thick-film section 51A in a direction along the third axis Z. The edge of the first thin-film section 51B on the side of the first negative direction X2 does not reach the center of the upper plate 40 in a direction along the first axis X.

[0029] As it is in Fig. As shown in Figure 4, the surface of the first flange section 12, which is oriented in the third positive direction Z1, faces a portion of the first thin-film section 51B of the first adhesive 51. As shown in Fig. 3 and Fig. As shown in Figure 4, the first flange section 12 is connected to the upper plate 40 via a portion of the first thick-film section 51A of the first adhesive section 51. Therefore, as shown in Fig. As shown in Figure 5, a second region A21, which is the region where the adhesive 50 is present on the surface of the first flange section 12, is smaller than the region where the first thick-film section 51A is present in the first adhesive section 51. Therefore, the first region A11 is larger than the second region A21.

[0030] Furthermore, as it is in Fig. As shown in Figure 3, the second adhesive section 52 spreads over a third area A12 from the surface of the upper plate 40, which is oriented in the third negative direction Z2. As shown in Figure 3, the second adhesive section 52 extends over a third area A12 from the surface of the upper plate 40, which is oriented in the third negative direction Z2. Fig. As shown in Figure 5, the second adhesive section 52 in the third area A12 comprises a second thick-film section 52A and a second thin-film section 52B.

[0031] Viewed in a direction along the third axis Z, the second adhesive section 52 has line symmetry with the first adhesive section 51, with an axis parallel to the second axis Y, which extends through the center of the upper plate 40 in a direction along the first axis X, which serves as the axis of symmetry. Therefore, the second thick-film section 52A, similar to the first thick-film section 51A, is the portion with a thickness that extends to a position farther from the surface of the upper plate 40, which has a roughness, than the peak points TP on the surface. On the surface of the upper plate 40, which is oriented in the third negative direction Z2, the second thick-film section 52A is located at one end towards the side of the first negative direction X2, relative to the center of the upper plate 40, in a direction along the first axis X.

[0032] Furthermore, the second thin-film section 52B, similar to the first thin-film section 51B, is the part that has no thickness and extends to the peaks TP on the surface of the upper plate 40, which has a roughness. In other words, the second thin-film section 52B spreads into valleys between the peaks TP on the surface of the upper plate 40, which has a roughness, but the peaks TP of the upper plate 40 are not covered. Additionally, the second thin-film section 52B surrounds the perimeter of the second thick-film section 52A in a direction along the third axis Z. The edge of the second thin-film section 52B in the first positive direction X1 does not reach the center of the upper plate 40 in a direction along the first axis X. Therefore, the second thin-film section 52B and the first thin-film section 51B do not contact each other.In other words, the first region A11 is separated from the third region A12. If the area of ​​the surface of the upper plate 40 where the adhesive 50 is present is designated as a first presence region A1, then the first presence region A1 is the region consisting of the first region A11 and the third region A12.

[0033] As it is in Fig. As shown in Figure 4, the surface of the second flange section 13, which is oriented in the third positive direction Z1, faces a portion of the second thin-film section 52B of the second adhesive section 52. Furthermore, as shown in Figure 4, the surface of the second flange section 13, which is oriented in the third positive direction Z1, faces a portion of the second thin-film section 52B of the second adhesive section 52. Fig. As shown in Figure 3, the second flange section 13 is connected to the upper plate 40 via a portion of the second thick-film section 52A of the second adhesive section 52. Therefore, as ... Fig. As shown in Figure 5, a fourth region A22, which is the area where the adhesive 50 is present on the surface of the second flange section 13, is smaller than the area where the second thick-film section 52A is present in the second adhesive section 52. Therefore, the third region A12 is larger than the fourth region A22.

[0034] An area consisting of the second area A21 and the fourth area A22 is referred to as a second presence area A2. The first presence area A1 is larger than the second presence area A2. More precisely, the first presence area A1 is at least 1.1 times larger than the second presence area A2.

[0035] Furthermore, viewed in one direction along the third axis Z, the surface of the winding core section 11 facing the upper plate 40 overlaps part of the first region A11 and part of the third region A12. In other words, parts of the first presence region A1 face the winding core section 11. The first thin-film section 51b and the second thin-film section 52b are contained within the parts of the first presence region A1 that face the winding core section 11. Manufacturing process

[0036] Next, a method for manufacturing the coil component 10 is described. As it is in Fig. Figure 8 shows a method for manufacturing the coil component 10 comprising a core preparation step S10, a wire winding step S11, a top plate preparation step S12, a deposition step S13, an arrangement step S14 and a curing step S15.

[0037] In core preparation step S10, the core 10C is first prepared. For example, a shaped body obtained by pressing ferrite powder into a mold is fired. After firing, a deburring process is carried out to remove burrs. Thus, the core 10C, comprising the winding core section 11, the first flange section 12, and the second flange section 13, is formed.

[0038] Next, the first terminal electrode 21 is formed on a surface of the first flange section 12 of the core 10C, and the second terminal electrode 22 is formed on a surface of the second flange section 13 of the core 10C. For example, the terminal electrodes are formed by cladding.

[0039] Next, wire winding step S11 is performed. In wire winding step S11, the wire 30 is wound around the winding core section 11. Approximately one turn is wound at each end of the wire in the direction of the first axis X to separate it from the circumferential surface 11F of the winding core section 11. Then, one end of the wire 30 is crimp-fitted to the first terminal electrode 21. A second end of the wire 30 is crimp-fitted to the second terminal electrode 22. Thus, the core 10C, around which the wire 30 is wound, is prepared.

[0040] Next, the top plate preparation step S12 is performed. In top plate preparation step S12, the top plate 40 is prepared with a specific surface roughness. More precisely, as described above, a top plate 40 with a developed surface area ratio Sdr greater than or equal to 0.15 and less than or equal to 0.50 is prepared. In top plate preparation step S12, similar to core preparation step S10, the top plate 40 is formed by firing a shaped body obtained by pressing ferrite powder into a mold, and subsequently performing a deburring process on the fired shaped body.

[0041] Next, application step S13 is performed. In application step S13, the adhesive 50 is first applied to two locations on the two end sections in one direction along the first axis X of the surface of the upper plate 40 facing the core 10C. More precisely, predetermined quantities of the adhesive 50 are dispensed from a dispenser. At this point, the adhesive 50 placed on the upper plate 40 has a sufficient thickness due to its surface tension. Next, a predetermined time period elapses. This predetermined period is, for example, from several seconds to several tens of seconds and is a duration during which the fluidity of the adhesive 50 is not lost. Therefore, the adhesive 50 gradually spreads to the perimeter of the surface of the upper plate 40, which has a roughness, in one direction along the third axis Z.Therefore, the thickness of the adhesive 50 gradually decreases, and the area over which the adhesive 50 is applied increases in one direction along the third axis Z. More precisely, a central portion of the spread adhesive 50 has a thickness extending to a position farther from the surface of the upper plate 40, which has a roughness, than the peak points TP. Conversely, a peripheral portion of the spread adhesive 50 has no thickness extending to the peak points TP on the surface of the upper plate 40, which has a roughness. One of the two locations where the adhesive 50 is applied forms the first adhesive section 51, and the other forms the second adhesive section 52.

[0042] Next, assembly step S14 is performed. In assembly step S14, the first flange section 12 and the second flange section of the core 10C are arranged so that their surfaces face the surface of the upper plate 40, onto which the adhesive 50 has been applied. Thus, parts of the adhesive 50, which is applied to the two points on the upper plate 40, that have a thickness extending to a position farther from the surface of the upper plate 40, which has a roughness greater than the peak points TP on the surface, contact the first flange section 12 and the second flange section 13.In other words, the area where the adhesive 50 was applied to the surface of the upper plate 40 during application step S13 is larger than the combined area consisting of the area where the adhesive 50 contacts the first flange section 12 during arrangement step S14 and the area where the adhesive 50 contacts the second flange section 13.

[0043] Furthermore, the area where the adhesive 50 was applied to the upper plate 50 also contacts parts of the wire 30 that extend away from the circumferential surface 11F. However, the first flange section 12 and the second flange section 13 are brought into contact with the adhesive 50 without the adhesive 50 contacting the winding core section 11. More precisely, the thickness of the spread adhesive 50 is less than the amount by which the first flange section 12 and the second flange section 13 protrude from the circumferential surface 11F of the winding core section 11 in the third positive direction Z1. Furthermore, marginal parts of the spread adhesive 50, which do not have a thickness that reaches the peaks TP on the rough surface of the upper plate 40, do not contact the core 10C.

[0044] Next, the curing step S15 is performed. In curing step S15, the core 10C and the upper plate 40, which are positioned between them with the adhesive 50, undergo heat treatment. This cures the adhesive 50. As a result, the upper plate 40 is bonded to the core 10C via the adhesive 50. More precisely, the first adhesive section 50, which is located on the side of the first positive direction X1 relative to the center of the upper plate 40 in a direction along the first axis X, and the second adhesive section 52, which is located on the side of the first negative direction X2 relative to the center of the upper plate 40 in a direction along the first axis X, are cured.In the first adhesive section 51, the first region A11, where the adhesive 50 is present on the surface of the upper plate 40, is larger than the second region A21, where the adhesive 50 is present on the surface of the first flange section 12. In the second adhesive section 52, the third region A12, where the adhesive 50 is present on the surface of the upper plate 40, is larger than the fourth region A22, where the adhesive 50 is present on the surface of the second flange section 13. In other words, the first presence region A1 is larger than the second presence region A2. Thus, the coil component 10 is complete. Steps of the exemplary implementation

[0045] When the coil component 10 is mounted on a substrate, the surface of the upper plate 40, which is oriented in the third positive direction Z1, is held and fixed to the substrate by a holding tool. At this point, a load is applied to the upper plate 40 in the third negative direction Z2. If such a load is applied when the upper plate 40 is thin, it may, for example, be unable to withstand the load and could be damaged.

[0046] According to the embodiment described above, the first presence area A1, which is a combined area consisting of the first area A11 and the third area A12, is larger than the second presence area A2, which consists of the second area A21 and the fourth area A22. Therefore, the parts of the first presence area A1 of the adhesive 50 that face the second presence area A2 act to fix the first flange section 12 and the second flange section 13 to the upper plate.

[0047] On the other hand, in the regions of the first presence area A1 that do not face the second presence area A2, the adhesive 50 spreads over a wider area than the second presence area A2 along the surface of the upper plate 40, and there is an area where the adhesive 50 is not present, in addition to the thickness of the upper plate 40. Effects of the exemplary embodiment

[0048] 1. According to the embodiment described above, the components of the adhesive agent that spread along the surface of the upper plate 40 act as a protective layer for the upper plate 40. On the surface of the upper plate 40, the first presence area A1, in which the adhesive agent 50 is present, is larger than the second presence area A2, which consists of the area in which the adhesive agent 50 is present on the surface of the first flange section 12 and the area in which the adhesive agent 50 is present on the surface of the second flange section 13. Therefore, the adhesive agent 50 spreads over the areas on the surface of the upper plate 40 that would be necessary to fix the first flange section 12 and the second flange section 13 to the upper plate 40.Thus, the adhesive 50 is present over a wide area on the surface of the upper plate 40, and loads acting on the upper plate 40 in directions along the third axis Z can be more easily withstood due to the amount of adhesive 50 present. As a result, the occurrence of damage can be suppressed, even when a load acts on the upper plate 40.

[0049] The adhesive 50 does not contact the winding core section 11. If the adhesive 50 were to reach the winding core section 11, there would be a risk of damaging a large portion of the wire 30 in contact with the adhesive 50 and the coating film of the wire 30. Therefore, the occurrence of short circuits between adjacent parts of the wire caused by such damage can be avoided. Furthermore, compared to the minimal amount of adhesive required to bond the first flange section 12 and the second flange section 13 to the upper plate 40, an excessively large quantity of adhesive 50 is needed.

[0050] 2. According to the embodiment described above, viewed in one direction along the third axis Z, the surface of the winding core section 11 facing the upper plate 40 overlaps a portion of the first region A11 and a portion of the third region A12. In other words, portions of the first presence region A1 face the winding core section 11. The winding core section 11 is located in the center of the coil component 10 in one direction along the second axis Y. Since the upper plate 40 is reinforced by the adhesive 50, the upper plate 40 can withstand the load even when a load acts upon it when the coil component 10 is mounted on a substrate.

[0051] 3. According to the embodiment described above, the size of the first presence area A1 is greater than or equal to 1.1 times the size of the second presence area A2. Provided that the area of ​​the first presence area A1 is at least 1.1 times the size of the second presence area A2, there is a sufficiently large area to reinforce the upper plate 40.

[0052] 4. According to the embodiment described above, the developed interfacial area ratio Sdr of the surface of the upper plate 40 is greater than or equal to 0.15 and less than or equal to 0.50. Therefore, when the adhesive 50 is applied to the surface of the upper plate 40, it readily spreads between the fine projections and recesses on the upper plate 40. Consequently, the adhesive 50 can be applied over a wide area on the surface of the upper plate 40 without the need for a special application method.

[0053] 5. According to the embodiment described above, the developed interfacial area ratio Sdr of the surface of the upper plate 40 is greater than the developed interfacial area ratio Sdr of the surfaces of the first flange section 12 and the second flange section 13. Therefore, the adhesive 50 spreads more readily along the surface of the upper plate 40 than along the surfaces of the first flange section 12 and the second flange section 13. As a result, the area over which the adhesive 50 spreads along the surface of the upper plate 40 is readily made larger than the area over which the adhesive 50 spreads along the surfaces of the first flange section 12 and the second flange section 13. Other examples of implementation

[0054] The embodiment described above can be modified in the following ways. The embodiment and the following modifications can be combined to the extent that they are not technically contradictory.

[0055] The shape of the winding core section 11 in the embodiment described above is not limited to the example given in the embodiment described above. For example, the shape can be cylindrical or polygonal, which differs from a rectangular shape.

[0056] In the embodiment described above, a plurality of wires 30 can be wound around the winding core section 11. The number of terminal electrodes can be suitably adjusted according to the number of wires 30.

[0057] In the embodiment described above, part of the wire 30 does not need to contact the adhesive 50.

[0058] In the embodiment described above, the shape of the upper plate 40 is not limited to the example given in the embodiment. It is sufficient that the upper plate 40 extends between the first flange section 12 and the second flange section 13, and, for example, a projection can be provided on the upper surface of the upper plate 40, which is oriented in the third negative direction Z2.

[0059] In the embodiment described above, the first presence area A1 need not be provided in a part facing the winding core section 11. For example, the first area A11 can only be provided in a part facing the first flange section 12, and the second area A21 can only be provided on the part of the surface of the first flange section 12 that is oriented in the third positive direction Z1.

[0060] In the embodiment described above, the first area A11 and the third area A12 are separate from each other, but can instead contact each other to form a single first presence area A1. Furthermore, the first presence area A1 can consist of three or more separate areas.

[0061] In the embodiment described above, the adhesive 50 can be formed entirely from thick-film sections. For example, a suitable amount of adhesive 50 can be applied to the entire surface of the upper plate 40, which is oriented in the third negative direction Z2, such that the adhesive 50 is formed entirely from thick-film sections. In this case as well, the adhesive preferably does not contact the winding core section 11.

[0062] In the embodiment described above, the developed interfacial area ratio Sdr of the upper plate 40 and the developed interfacial area ratio Sdr of the core 10C are not limited to the examples given in the embodiment. The developed interfacial area ratio Sdr of the upper plate 40 can be less than 0.15 or more than 0.50. Furthermore, the developed interfacial area ratio Sdr of the upper plate 40 can be less than or equal to the developed interfacial area ratio Sdr of the core 10C. In this case, the adhesive 50 can be pre-applied to the upper plate 40 to spread it over a large area on the surface of the upper plate 40, which is oriented in the third negative direction Z2. Alternatively, after the adhesive 50 has been placed on the upper plate 40, it can be spread using a tool or by a centrifugal coating process.

[0063] In the embodiment described above, the size of the first presence area A1 can be smaller than 1.1 times the size of the second presence area A2. As long as it is unlikely that fluctuations will occur in the area over which the adhesive 50 is applied, it is very likely during the application step that the size of the first presence area A1 will be larger than the size of the second presence area A2, even if the size of the first presence area A1 is smaller than 1.1 times the size of the second presence area A2.

[0064] In the embodiment described above, the adhesive 50 is a thermosetting adhesive 50, but the type of adhesive 50 can be changed as required. The adhesive 50 can consist solely of resin or can be formed by adding an inorganic filler, such as silicon dioxide filler, to the resin. In the case where the adhesive 50 contains an inorganic filler, the inorganic filler tends to be present only in the thick-film sections.

[0065] In the application step S13 of the manufacturing process of the embodiment described above, the adhesive agent 50 is not applied to the first flange section 12 and the second flange section 13, but the adhesive agent 50 can also be applied to the surfaces of the first flange section 12 and the second flange section 13.

[0066] Furthermore, in application step S13, in addition to waiting for a predetermined time period to allow the adhesive 50 to spread over the surface of the upper plate 40, a material with greater wettability than the material of the upper plate 40 can be used, or an adhesive 50 with higher viscosity can be used.

Claims

[1] Coil component (10) which has the following features: a core (10C) comprising a winding core section (11) with a central axis, a first flange section (12) connected to a first end of the winding core section (11) in a direction along the central axis and projecting outwards from a circumferential surface of the winding core section in a radial direction centered on the central axis, and a second flange section (13) connected to a second end of the winding core section (11), the second end being arranged on a side opposite the first end and projecting outwards from the circumferential surface of the winding core section (11) in a radial direction centered on the central axis; a wire (30) having a section which extends spirally along the circumferential surface of the winding core section (11) with respect to the central axis as a spiral axis; and an upper plate (40) which is longer in one direction along the central axis than the winding core section (11), and which is attached to the first flange section (12) and the second flange section (13) via an adhesive (50), wherein the adhesive (50) is not in contact with the winding core section (11) and if a first area is an area in which the adhesive (50) is present on a surface of the upper plate, and a second area is a combined area comprising an area in which the adhesive (50) is present on a surface of the first flange section (12) and an area in which the adhesive (50) is present on a surface of the second flange section (13), the first area is larger than the second area, whereby a section of the first area faces the winding core section (11), wherein in the first area the adhesive (50) comprises a thick film section and a thin film section, The thick film section is a section with a thickness that exceeds the thickness from the surface of the upper plate to peak points on the surface of the upper plate. The thin-film section is a section with a thickness that is less than the thickness from the surface of the upper plate to the peak points on the surface of the upper plate, and the thin film section faces the winding core section (11). [2] Coil component (10) according to claim 1, wherein a size of the first area is greater than or equal to 1.1 times a size of the second area. [3] Coil component (10) according to one of claims 1 or 2, wherein a developed interfacial ratio of the surface of the upper plate is greater than or equal to 0.15 and less than or equal to 0.

50. [4] Coil component (10) according to any one of claims 1 to 3, wherein a developed interfacial ratio of the surface of the upper plate is greater than a developed interfacial ratio of the surfaces of the first flange section (12) and the second flange section (13).

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