Electronic module and arrangement

Abstract

Electronic module (1), comprising - at least one functional circuit component (10), - a module body (2), - a first interface (6) configured to connect a power module (91), - a second interface (7) which is designed to connect a power supply (92), - a first capacitance unit (3) configured to reduce external high-frequency noise, and a second capacitance unit (4) configured to reduce external low-frequency noise, so that the first and second capacitance units (3, 4) form an EMC filter structure, and - at least one cooling plate (11) which at least partially surrounds the functional circuit component (10), wherein - the first capacitance unit (3), the second capacitance unit (4) and the functional circuit component (10) are integrated into the module body (2), - the cooling plate (11) is connected to a heat sink (8) which is arranged on a lower surface (23) of the module body (2), and - the cooling plate (11) is designed to dissipate heat from the electronic module (1) to the lower surface (23).

Description

[0001] The invention relates to an electronic module according to claim 1 and an arrangement according to claim 18 comprising such an electronic module.

[0002] The publication DE 10 2020 108 879 Al refers to a DC link component and increased electromagnetic compatibility.

[0003] From the document DE 10 2008 054 923 A1 a power semiconductor module with a capacitor integrated in a housing wall is known.

[0004] One problem to be solved is, among other things, to specify an improved electronic module that is characterized, in particular, by reduced size and weight, as well as improved noise suppression and heat dissipation. Another problem to be solved is, among other things, to specify an assembly comprising such an electronic module.

[0005] These objects are achieved by an electronic module comprising the features of independent claim 1 and by an arrangement comprising the features of claim 19.

[0006] The electronic module comprises at least one functional circuit component, a module body, a first interface configured for electrical connection to a power module, and a second interface configured for electrical connection to a power supply. The electronic module further comprises a first capacitance unit configured to reduce external high-frequency noise and a second capacitance unit configured to reduce external low-frequency noise, such that the first and second capacitance units form a filter structure for electromagnetic compatibility (EMC). The first and second capacitance units and the functional circuit component are integrated into the module body.

[0007] The electronic module further comprises at least one cooling plate that at least partially surrounds the functional circuit component. In particular, the cooling plate is arranged between the functional circuit component and the upper surface, between the functional circuit component and the first side surface, and between the functional circuit component and a second side surface opposite the first side surface.

[0008] The cooling plate is connected to a heat sink located on the lower surface of the module body.

[0009] The heat sink may at least partially form the lower surface. In particular, the lower surface of the module body is opposite the upper surface of the module body. It is possible for the heat sink to completely cover the functional circuit component as viewed from the lower surface.

[0010] The cooling plate is designed to dissipate heat from the electronic module to the lower surface. This means, in particular, that the heat is dissipated to the heat sink. The heat sink can also be connected to an external heat sink or the like.

[0011] The functional circuit component is, in particular, a component of the electronic module that determines the functionality of the electronic module. The functional circuit component can, for example, be at least one DC link circuit, which in particular comprises at least one DC link capacitor. In this case, the electronic module is a DC link module. The DC link capacitor is preferably a thin-film capacitor.

[0012] It is possible for the functional circuit component to comprise a plurality of DC link circuits. For example, the DC link circuits are formed as individual components that are connected to form the functional circuit component. By forming the functional circuit component with a plurality of DC link circuits, the properties of the functional circuit component can be advantageously tuned.

[0013] The module body determines, in particular, the dimensions of the electronic module. In particular, the externally accessible surfaces of the electronic module determine the module body. The integration of the first capacitance unit and the second capacitance unit together with the functional circuit component into the module body enables a reduction in the size of the electronic module. In particular, the footprint of the electronic module can be reduced. Conversely, the weight of the electronic module can also be reduced.

[0014] A power module can be connected to the electronic module via the first interface. The first interface comprises, for example, a plurality of electronic contacts. In particular, the first interface comprises at least two electronic contacts that carry different electrical potentials. For example, the first interface can comprise four or six electronic contacts, with two of the electronic contacts forming a pair that carries different electronic potentials.

[0015] A power supply can be connected to the electronic module via the second interface. The second interface includes, for example, a plurality of electronic contacts. In particular, the second interface includes at least two electronic contacts that carry different electrical potentials.

[0016] For example, if the electronic module is a DC-link module, the power module can be an inverter and the power supply a high-voltage (HV) battery with a high-voltage DC output. Such an arrangement of HV battery, DC-link module, and inverter is used, for example, in a motor switching configuration.

[0017] Modern inverters typically include semiconductor switches that convert the DC voltage from the high-voltage battery into an AC voltage suitable for a downstream application, such as a motor drive. During operation, these switches generate noise at the DC link module, which includes high-frequency and low-frequency components. Because the inverter operates at a comparatively high current, the noise intensity can be relatively high.

[0018] Conventionally, an additional EMC filter element is therefore required on the power input side of the DC-link module to reduce the noise generated by a switching power module via the DC link to the power supply, for example, the high-voltage battery. This EMC filter element is typically a discrete unit connected to the DC-link module via electrical wires or leads. Consequently, this EMC filter element requires additional space, and the electrical wires or leads introduce additional equivalent series inductance, which reduces the filtering performance.

[0019] The electronic module described here utilizes the concept of integrating a first capacitance unit and a second capacitance unit, forming an EMC filter structure within the module body of the electronic module, in which the functional circuit component, such as a DC-link circuit component, is also located. Consequently, additional EMC filter elements can be omitted, and the size and weight of the electronic module can be reduced. Furthermore, the use of electrical wiring can be reduced or eliminated entirely, significantly reducing parasitic inductances and resistances, also known as equivalent series inductances (ESL) and resistances (ESR).

[0020] In particular, all components of the electronic module, such as the first and second capacitance units, the first and second interfaces, and the functional circuit component, are directly electrically connected. "Directly electrically connected" means, in particular, that the electrical connection is established without a wire or electrical line. For example, different units that are directly electrically connected can be in direct physical contact, i.e., touching each other. For example, elements or components of the electronic module can be directly connected, in particular directly electrically, by soldering or welding or the like. In the following, direct electrical connections may also be referred to as "wireless."

[0021] Since the first capacitance unit is configured to reduce external high-frequency noise, and the second capacitance unit is configured to reduce external low-frequency noise, noise emanating from other electrical units used with the electronic module during operation, such as the power module or the power supply, can be efficiently reduced over a wide frequency range. For this purpose, each of the first and second capacitance units preferably comprises at least one capacitor whose capacitance is adapted to the high-frequency and low-frequency components of the noise, respectively.

[0022] The first capacitance unit can be electrically arranged between the first interface and the functional circuit component, and the second capacitance unit can be electrically arranged between the second interface and the functional circuit component. This means, in particular, that an output of the first capacitance unit can be electrically connected to the first interface, and an input of the first capacitance unit can be electrically connected to an output of the functional circuit component. Furthermore, the second interface can be electrically connected to an input of the second capacitance unit, and an output of the second capacitance unit can be electrically connected to an input of the functional circuit component. Preferably, all electrical connections between the first and second interfaces, the first and second capacitance units, and the functional circuit components are direct electrical connections.

[0023] Preferably, the first capacitance unit comprises at least one first plate capacitor, and the second capacitance unit comprises at least one second plate capacitor. In particular, each of the plate capacitors is connected to a ground contact of the electronic module. This means that the plate capacitors are preferably CY capacitors.

[0024] Preferably, the first capacitance unit comprises a pair of first plate capacitors, and the second capacitance unit comprises a pair of second plate capacitors. Here and below, it is assumed that features disclosed for the at least one first plate capacitor and / or the at least one second plate capacitor are also disclosed correspondingly for the pair of first plate capacitors and / or the pair of second plate capacitors, and vice versa.

[0025] In particular, the at least one first plate capacitor at least partially forms a first side surface of the module body. Preferably, the first side surface is formed substantially entirely with the at least one first plate capacitor.

[0026] In particular, the first interface is arranged on the first side surface of the module body. In this case, the at least one first plate capacitor is arranged between the functional circuit component and the first interface. This means that at least one first capacitor pair is arranged between the functional circuit component and the power module when a power module is connected to the first interface. If the power module is a noise source, the EMC filter structure of the electronic module is arranged closer to the noise source than in comparable conventional systems in which the EMC filter element is arranged on the side of a power input. This can increase the EMC of the electronic module.

[0027] Furthermore, the at least one second plate capacitor can at least partially form an upper surface of the module body. Preferably, the upper surface is formed substantially entirely with the at least one second plate capacitor.

[0028] In a circuit configuration representing the electronic module, the second interface is connected to the functional circuit component, for example, via two power lines, each power line carrying a different electronic potential. If the functional circuit component comprises a DC link capacitor, the DC link capacitor is preferably arranged between the power lines, i.e., parallel to the second interface. The functional circuit component can further be electrically connected to the first interface via the power lines. The first capacitance unit can be arranged between the first interface and the functional circuit component. For example, each power line is connected to ground via a capacitor of the first capacitance unit. The second capacitance unit can be arranged between the second interface and the functional circuit component.For example, each power line is connected to ground via a capacitor of the second capacitance unit. The capacitors of the first and second capacitance units are preferably parallel-plate capacitors.

[0029] By using plate capacitors, the first capacitance unit and the second capacitance unit can be designed to be particularly thin and thus save space. This enables miniaturization of the electronic module. If, in addition, the at least one first plate capacitor forms at least a portion of the first side surface of the module body and the at least one second plate capacitor forms at least a portion of the upper surface of the module body, a variety of advantages can be achieved.

[0030] For example, the first and second parallel-plate capacitors can provide additional shielding against disturbing noise for the functional circuit component. In particular, such shielding can efficiently reduce noise-field coupling.

[0031] Furthermore, the first and second plate capacitors can dissipate heat generated during operation from the functional circuit component. Heat can be generated during operation, for example, by an equivalent series resistance (ESR) of the functional circuit component and / or by a so-called ripple current. Consequently, the need for additional cooling media can be reduced or heat dissipation can be increased compared to comparable conventional electronic modules that require a discrete EMC filter element. This can result in a smaller electronic module or an electronic module with increased performance, respectively.

[0032] Furthermore, the first and second plate capacitors can be arranged advantageously and particularly space-savingly if the first and second pairs of plate capacitors each form at least part of an outer surface of the module body. Thus, the size of the electronic module can be further reduced.

[0033] For example, the at least one first and at least one second plate capacitors are each formed by a printed circuit board (PCB). This means that the at least one first capacitor and the at least one second capacitor are preferably each formed by a layer structure comprising at least two electrically conductive layers alternating with at least one electrically insulating layer. The electrically insulating layers of the circuit board comprise, for example, an aluminum nitride substrate, a ceramic material and / or FR4 and / or capacitors made of a material with high permittivity. Optimal values ​​for capacitance, ESL, and ESR of the first and second plate capacitors depend in particular on the materials of the insulating layers and the layout design of the electrically conductive layers.

[0034] By forming the first and second plate capacitors each by a printed circuit board, the first and second plate capacitors can be made particularly thin and advantageously cost-effective. Furthermore, the material of the insulating layers of the printed circuit board can be selected such that, for example, effective heat dissipation can occur through the first and second plate capacitors, while a capacitance of the capacitors is suitable for noise attenuation. In addition, printed circuit boards can be easily applied to the functional circuit component, in particular with no or only a few electrical wires or lines.

[0035] It is possible for at least one electrical component to be arranged on the at least one circuit board forming the first plate capacitor and / or the second plate capacitor. For example, additional discrete passive components such as capacitors or active filter circuits can be arranged on the circuit board. Such additional components can increase the noise reduction of the first and second capacitance units.

[0036] The electronic module may further comprise a choke. The choke is preferably at least partially integrated into the module body. The choke is electrically connected, in particular, to the functional circuit component and the second capacitance unit. For example, in a circuit configuration of the electronic module, the choke is arranged between the functional circuit component and the second capacitance unit. In particular, the choke is part of the EMC filter structure.

[0037] The choke is typically a common-mode choke (CMC). In this case, the choke is designed to attenuate disruptive electromagnetic interference and / or radio frequency interference frequencies. This means that the use of a choke can further reduce noise that interferes with the functional circuit component.

[0038] Preferably, the first capacitance unit comprises a capacitance of 1 nF or less, and the second capacitance unit comprises a capacitance between 1 nF and 500 nF. For example, if the first capacitance unit comprises at least one first plate capacitor, each of the at least one first plate capacitor has a capacitance of 1 nF or less. For example, if the second capacitance unit comprises at least one second plate capacitor, each of the at least one second plate capacitor has a capacitance between 1 nF and 500 nF.

[0039] Advantageously, a capacitance unit comprising a capacitance of 1 nF or less is particularly effective at attenuating high-frequency noise containing frequencies above 50 MHz. Conversely, a capacitance unit comprising a capacitance between 1 nF and 500 nF is particularly effective at attenuating low-frequency noise containing frequencies below 50 MHz. This means that by using a combination of the first capacitance unit comprising a capacitance of 1 nF or less and the second capacitance unit comprising a capacitance between 1 nF and 500 nF, noise over a wide frequency range can be covered by the first and second capacitance units.

[0040] Preferably, the first capacitance unit is connected to the first interface in a wire-free manner. Alternatively or additionally, the second capacitance unit is connected to the second interface in a wire-free manner. For example, the first capacitance unit and the first interface and / or the second capacitance unit and the second interface are electrically directly connected to one another. In particular, the first / second capacitance unit is arranged near the first / second interface such that the first / second capacitance unit can be connected directly to the first / second interface, for example by soldering or welding or the like. This means that an electrical wire or an electrical line can advantageously be omitted. Consequently, a parasitic inductance, i.e. an ESL, can be reduced. This can increase the performance of the electronic module.

[0041] Advantageously, the first and / or second capacitance unit can also shield the electronic module against high-frequency noise, such as high-frequency switching noise caused by the power module.

[0042] The electronic module further comprises at least one cooling plate that at least partially surrounds the functional circuit component. In particular, the cooling plate is arranged between the functional circuit component and the upper surface, between the functional circuit component and the first side surface, and between the functional circuit component and a second side surface opposite the first side surface.

[0043] The cooling plate is connected to a heat sink located on the lower surface of the module body.

[0044] The heat sink may at least partially form the lower surface. In particular, the lower surface of the module body is opposite the upper surface of the module body. It is possible for the heat sink to completely cover the functional circuit component as viewed from the lower surface.

[0045] The cooling plate is designed to dissipate heat from the electronic module to the lower surface. This means, in particular, that the heat is dissipated to the heat sink. The heat sink can also be connected to an external heat sink or the like.

[0046] The heat sink may, for example, comprise a heat dissipation plate configured to dissipate heat from the electronic module. It is possible for the heat sink to be formed by the heat dissipation plate. Preferably, the heat dissipation plate is formed from a metal plate and comprises, for example, copper or aluminum. A thickness of the heat dissipation plate may be approximately or substantially the same as a thickness of the cooling plate. In particular, the heat dissipation plate is connected to an external heat sink. That is, the heat dissipation plate is configured to dissipate heat from the electronic module, in particular the functional circuit component, to the external heat sink. The external heat sink may be a cooling element of a power module connected to the electronic module.Preferably, the heat dissipation plate is electrically insulated from the electronic module and / or at least some or all components of the electronic module.

[0047] By using a heat dissipation plate, the electronic module can be advantageously free of a heat sink. Especially when the electronic module is used together with a power module, the cooling element of the power module can be used as a heat sink for the electronic module. This reduces the space requirements of the electronic module and the cost of the electronic modules, as expensive and space-consuming heat sinks for the electronic module can be omitted.

[0048] Additionally or alternatively, it is possible that the heat dissipation plate is connected to a heat sink arranged on the lower surface of the electronic module.

[0049] Heat can be generated during operation, for example, by the equivalent series resistance (ESR) of the functional circuit component and / or by a so-called ripple current. Comparable conventional electronic modules, such as conventional DC-link modules, only include a cooling element on the bottom surface. By additionally arranging a cooling plate surrounding the primary circuit function, the heat can be dissipated more efficiently. This can increase the performance of the electronic module. Additionally or alternatively, the size of the electronic module can be reduced because the heat can be dissipated more efficiently.

[0050] The cooling plate preferably comprises an electrically conductive material with a high thermal conductivity coefficient. The cooling plate comprises, for example, at least one metal such as copper, aluminum, and / or iron. Preferably, the cooling plate comprises aluminum or is made of aluminum. Advantageously, the use of aluminum for the cooling plate allows the weight of the electronic module to be kept comparatively low.

[0051] Alternatively or additionally, the cooling plate may comprise a ceramic material. In this case, it is possible for the ceramic material to form a matrix material into which filler particles are integrated to adjust physical properties such as thermal or electrical conductivity.

[0052] In particular, if the first capacitance unit comprises at least one first plate capacitor and / or the second capacitance unit comprises at least one second plate capacitor, the cooling plate is arranged at least partially between the functional circuit component and at least one of the at least one first plate capacitor and the at least one second plate capacitor. In this preferred configuration, the functional circuit component is covered, for example, by the at least one first plate capacitor when viewed from the first side surface, by the at least one second plate capacitor when viewed from the upper surface, by the cooling plate when viewed from the second side surface, and by the heat sink when viewed from the lower surface.

[0053] Preferably, a grounding contact of each of the first capacitance unit and the second capacitance unit is directly connected to the cooling plate. For example, each capacitor of the first and second capacitance unit comprises a grounding contact structure that is directly connected to the cooling plate. This means that the cooling plate serves as a grounding element for the first capacitance unit and the second capacitance unit. In this context, "directly connected" means in particular that the first and second capacitance units are each in direct physical contact and direct electrical contact with the cooling plate. This allows, in particular, an electrical connection between the first and second capacitance units and the cooling plate to be conduction-free.

[0054] It is possible for the cooling plate to completely cover the functional circuit component, both from the top surface and from the first side surface. Preferably, the cooling plate is configured to reduce noise coupling to the functional circuit component. In other words, the cooling plate acts as a shield for the functional circuit component.

[0055] The cooling plate can be firmly connected to the heat sink via a connecting means.

[0056] Preferably, the connecting means comprises an electrically conductive material, so that the heat sink is electrically conductively connected to the cooling plate. Preferably, the heat sink is a grounding contact for the entire electronic module. In particular, the heat sink is configured to provide a grounding contact for the electronic module.

[0057] The connecting means is, for example, at least one screw. The at least one screw can be made of steel. Furthermore, the connecting means is designed to dissipate heat from the cooling plate to the heat sink.

[0058] Preferably, the first and second capacitance units are each electrically connected to the heat sink via the cooling plate in a conducting manner. In particular, the cooling plate serves as a grounding contact for the first capacitance unit and the second capacitance unit. Preferably, the cooling plate is a grounding contact for the entire electronic module. For example, each of the first and second capacitance units is directly electrically connected to the cooling plate, and the cooling plate is electrically connected to the heat sink via the connecting means. This means that no electrical wires or lines are required to connect the first and second capacitance units to ground. This advantageously reduces the ESL of the electronic module.

[0059] Furthermore, electromagnetic fields induced in the cooling plate due to noise coupling can be effectively diverted to the heat sink, i.e., to the ground contact of the electronic module. Additionally or alternatively, electromagnetic fields induced in the first and second capacitance units can also be diverted to the heat sink via the cooling plate. Such electromagnetic fields can be induced, for example, in the plate capacitors of the first and second capacitance units.

[0060] Furthermore, an arrangement is specified. In particular, the arrangement comprises an electronic module described herein. This means that all features disclosed for the electronic module are also disclosed for the arrangement, and vice versa.

[0061] The arrangement may comprise a power module and a power supply, as well as an electronic module described herein. The power module may be connected to the first interface of the electronic module, and the power supply may be connected to the second interface of the electronic module. The arrangement is, for example, part of a motor circuit designed in particular to supply an electronic motor drive. In this case, the power supply may be an HV battery, the electronic module a DC link module, and the power module an inverter.

[0062] It is possible for the power module to comprise a semiconductor material. In particular, the power module is an inverter and is configured to be additionally connected to a motor drive. The semiconductor material can be based on silicon, silicon carbide, and / or gallium nitride technology. In particular, the semiconductor material can be used for switches of the power module.

[0063] The power module may be a power module comprising one or more switches.

[0064] The semiconductor material can be a wide band gap material (WBG). Such WBG semiconductors are used, for example, for switches in the power module, i.e., the inverter. By using WBG semiconductors, particularly short switching times can be achieved. However, such switching times generate particularly high-frequency noise. By using the cooling plate in combination with the first and second capacitance units, this high-frequency noise can also be efficiently reduced and suppressed, thus protecting the functional circuit component from this noise. Examples of WBG semiconductor materials are SiC or GaN.

[0065] Further advantages and advantageous embodiments and further developments of the electronic module and the arrangement will become apparent from the following exemplary embodiments, which are shown in conjunction with schematic drawings. Identical elements, similar elements, or elements with the same effect are provided with the same reference numerals in the figures. The figures and the proportions of the elements shown in the figures are not to be considered true to scale. Rather, individual elements may be exaggerated for clarity and / or clarity.

[0066] In the figures: The Fig. 1 to 4 show an electronic module described herein in various views according to an embodiment; Fig. 5 illustrates a circuit configuration of an electronic module described herein according to an embodiment; Fig. 6 and Fig. 7 show diagrams illustrating the noise reduction achieved by the electronic module described here; Fig. 8 shows a schematic illustration of an arrangement described herein according to an embodiment; Fig. 9 shows a schematic sectional view illustrating cooling of an arrangement described herein according to an embodiment.

[0067] The Fig. 1 to 4 show an electronic module 1 described herein according to an exemplary embodiment in various perspective views. The electronic module 1 comprises a module body 2.

[0068] A first side surface 21 of the module body 2 is formed with a first capacitance unit 3. The first capacitance unit 3 comprises a pair of first plate capacitors 30 (see Fig. 1 and Fig. 3). The pair of first plate capacitors 30 is directly electrically connected to a first interface 6. The first interface 6 is configured to establish an electrical connection to a power module (not shown) via first to sixth electrical contacts 61 to 66 of the first interface 6. The power module is, for example, an inverter.

[0069] An upper surface 20 of the module body 2 is formed with a second capacity unit 4 (see Fig. 1 to 3). The second capacitance unit 4 comprises a pair of second plate capacitors 40. The pair of second plate capacitors 40 is directly electrically connected to a second interface 7. The second interface 7 is configured to establish an electrical connection to a power supply (not shown) via a first electrical contact 71 and a second electrical contact 72. The power supply is, for example, an HV battery.

[0070] The plate capacitors 30, 40 of the first and second capacitance units 3, 4 are formed with printed circuit boards (PCBs), in particular multilayer printed circuit boards. Electrically insulating layers of printed circuit boards are formed, for example, with FR4 or a ceramic material.

[0071] The electronic module 1 further comprises a choke 5. The choke 5 is partially arranged within the module body 2 and is a common-mode choke. Together with the first capacitance unit 3 and the second capacitance unit 4, the choke 5 forms an EMC filter structure.

[0072] Inside the module body 2, the electronic module 1 comprises a functional circuit component 10 (see Fig. 3). The functional circuit component 10 determines the electrical functionality of the electronic module 1. The functional circuit component 10 comprises, for example, a DC link capacitor 10a. This means that the electronic module 1 is a DC link module. The DC link capacitor 10a is preferably a thin-film, ceramic, or electrolytic capacitor, or another capacitor made of a material with high permittivity.

[0073] The EMC filter structure is configured to protect the functional circuit component 10, in particular the DC link capacitor 10a, from external noise. In other words, the EMC filter structure is configured to increase the EMC of the DC link capacitor 10a. Such noise may include low-frequency and high-frequency components.

[0074] Low-frequency noise specifically includes frequencies of 50 MHz or less, and high-frequency noise includes frequencies of 50 MHz or more. To achieve said protection, the capacitors of the first capacitance unit 3 each have a capacitance of 1 nF or less and are configured to attenuate high-frequency components of the noise. Furthermore, the capacitors of the second capacitance unit 4 each have a capacitance between 1 nF and 500 nF and are configured to attenuate low-frequency components of the noise.

[0075] Optimal values ​​for capacitance, ESL and ESR of the first and second plate capacitors depend in particular on the materials of the insulating layer and the layout design of the electrically conductive layers relative to the circuit board.

[0076] By forming the first capacitance unit 3 as the upper surface 20 of the module body 2 and the second capacitance unit 4 as the first side surface 21 of the module body 2, the EMC filter structure can be integrated into the module body 2. This means that the additional separate EMC filter elements commonly used in comparable DC-link applications can be omitted. This significantly reduces the size and weight of the electronic module 1 while simultaneously achieving efficient noise attenuation.

[0077] In particular, the electronic module 1 is free of a printed circuit board on which the first and second capacitance units 3, 4 and the functional circuit component 10 would be arranged. Instead, the first and second capacitance units 3, 4 are directly connected to the functional circuit component 10. Since the first and second capacitance units 3, 4 are additionally directly connected to the first interface 6 and the second interface 7, the electronic module 1 can be designed essentially free of wires or electrical lines. This significantly reduces the parasitic inductance, also referred to as equivalent series inductance (ESL), of the electronic module 1.

[0078] A cooling plate 11 is arranged between the functional circuit component 10 and the first and second capacitance units 3, 4. The cooling plate 11 is formed from a material with good thermal conductivity, such as copper, iron, and / or aluminum. Preferably, the cooling plate 11 is formed from an electrically conductive material, such as a metal. The cooling plate 11 completely covers the functional circuit component 10 as viewed from the first side surface 21, as viewed from a second side surface 22 opposite the first side surface 21, and as viewed from the upper surface 20 (see Fig. 1 and Fig. 2).

[0079] A heat sink 8 is arranged on a lower surface 23 of the module body 2, which is arranged opposite the upper surface 20. The heat sink 8 preferably covers the functional circuit component 10 in view of the lower surface 23 (see Fig. 4). The cooling plate 11 is connected to the heat sink 8 by a connecting means 9, which in the present embodiment are screws 9. The screws 9 form both a fixed connection and an electrical connection between the cooling plate 11 and the heat sink 8.

[0080] The cooling plate 11 enables increased heat dissipation of the functional circuit component 10. Since the cooling plate 11 is arranged near the functional circuit component 10 and connected to the heat sink 8, the cooling plate 11 forms a heat dissipation path for the heat generated in the functional circuit component 10 during operation. This heat can originate from an ESR of the functional circuit component 10 and / or a so-called ripple current. Since the cooling plate 11 covers the functional circuit component 10 on at least three sides, heat dissipation is particularly effective.

[0081] In addition, the cooling plate 11 serves as a shield for the functional circuit component 10, which reduces or attenuates the noise coupling of the functional circuit component 10.

[0082] The heat sink 8 is, in particular, grounded. Since the cooling plate 11 is electrically connected to the heat sink 8, the cooling plate 11 is also grounded. Grounding contact structures 50 of the first and second capacitance units 3, 4 are directly electrically connected to the cooling plate 11. Thus, the first and second capacitance units 3, 4 are grounded without conduction via the cooling plate 11 connected to the heat sink 8. Therefore, if external noise induces an electromagnetic field in the cooling plate 11, the first capacitance unit 3, and / or the second capacitance unit 4, this noise field can be dissipated by the cooling plate 11 and the heat sink 8.

[0083] In an alternative embodiment, the cooling plate 11 can be omitted. In this case, the first and / or second capacitor unit 3, 4 can advantageously shield the electronic module 1 from high-frequency noise, such as high-frequency switching noise emanating from the power module. In particular, the electronic module 1 can be a DC link capacitor and the power module 91 can be a switching module in this alternative embodiment.

[0084] Fig. 5 shows a circuit configuration of an electronic module 1, in particular the electronic module 1 according to the Fig. 1 to 4. The first capacitance unit 3 is arranged between the first interface 6 and the functional circuit component 10, which includes the DC link capacitor 10a. The first capacitance unit 3 includes the pair of first plate capacitors 30. The choke 5 is arranged between the functional circuit component 10 and the second capacitance unit 4, which includes the pair of second plate capacitors 40. The second capacitance unit 4 is arranged between the choke 5 and the second interface 7.

[0085] The first interface 6 is connected to the functional circuit component 10 via a first power line 12 and a second power line 13. Since the electronic module 1 is in particular free of a printed circuit board on which the first and second capacitance units 3, 4 and the functional circuit component 10 would be arranged, the lines connecting the power lines 12, 13 in Fig. 5, in particular, are to be understood as purely illustrative and not to indicate the presence of electrical wires or lines connecting the various components. The DC link capacitor 10a is arranged between the power lines 12, 13 in the functional circuit component 10.

[0086] Each of the first and second plate capacitors 30, 40 is connected to one of the power lines 12, 13 and the ground 80. That is, the first and second plate capacitors 30, 40 are CY capacitors. The ground 80 is formed, in particular, by the cooling plate 11 together with the heat sink 8.

[0087] The second interface 7 is connected to the functional circuit component 10 via the power lines 12, 13.

[0088] The Fig. 6 and Fig. 7 show attenuation diagrams to illustrate the attenuation of external noise by the EMC structure of the electronic module 1. The diagram in Fig. Figure 6 shows a noise attenuation 101 in dB as a function of frequency 100 in Hz in common mode. As can be seen, frequencies above 0.2 MHz are attenuated by the EMC filter structure comprising the first and second capacitance units 3, 4 and the choke 5. The noise attenuation increases with frequency, up to approximately 300 MHz. Above this frequency, the attenuation value 101 decreases but remains below approximately -40 dB. This means that the electronic module 1 enables efficient noise attenuation over a wide frequency range. This attenuation value depends on the performance of the choke 5 and the first and second capacitance units 3, 4.

[0089] The diagram in Fig. Figure 7 shows the noise attenuation 101 in dB as a function of frequency 100 in Hz in differential mode. As can be seen, the attenuation value 101 remains below approximately -40 dB at all frequencies. This means that the electronic module 1 enables efficient noise attenuation over a wide frequency range.

[0090] Fig. Figure 8 shows an arrangement 90 described herein according to an embodiment. The arrangement 90 comprises an electronic module 1, which is in particular the electronic module 1 according to the embodiment of the Fig. 1 to 4. At the second interface 7, the electronic module 1 is electrically connected to a power supply 92. The power supply 92 in this example is an HV battery.

[0091] At the first interface 6, a power module 91 is electrically and mechanically connected to the electronic module 1. The power module 91 is, for example, an inverter. The power module 91 may include a plurality of switches comprising a wide bandgap semiconductor material. Each of the first to sixth electrical contacts 61 to 66 of the first interface 6 is connected to a counterpart on the power module 91.

[0092] If the electronic module 1 is a DC-link module, the arrangement 90 is, for example, part of a motor circuit. In this case, the power supply 92 supplies a direct current to the power module 91 via the electronic module 1. The direct current is converted into an alternating current by the power module 91. The alternating current is then fed to a motor drive (not shown). The electronic module 1 then serves in particular as a buffer, for example as an energy buffer, and is also referred to as a DC-link module. During operation, the switches of the power module 91 generate noise that can be coupled into the electronic module 1. This noise can impair the performance of the electronic module 1. This noise is attenuated by the EMC filter structure of the electronic module 1, which comprises the first capacitance unit 3 and the second capacitance unit 4. This improves the EMC of the electronic module 1.

[0093] The power module 91 includes a heat sink 93 for dissipating the heat generated during operation of the power module 91. The heat sink 93 is arranged on an underside of the power module 91. Optionally, the heat sink 93 can be connected to a heat sink 8 of the electronic module 1 via a heat dissipation plate 81 of the heat sink 8. The heat dissipation plate 81 is configured to dissipate heat generated by the electronic module 1 to the heat sink 93 of the power module 91. This can increase the heat dissipation of the electronic module 1. Preferably, the heat dissipation plate 81 is electrically insulated from the first interface 6.

[0094] A section plane of the sectional view in Fig. 9 is perpendicular to the lower surface 23 and to the first side surface 21 of the electronic module 1. For illustration purposes, the cooling plate 11 and the first and second capacitance units 3, 4 are in Fig. not shown.

[0095] In the embodiment of Fig. 9, a heat sink 8 of an electronic module 1 is formed as a heat dissipation plate 81. The heat dissipation plate 81 is electrically insulated from the first interface 6 by electrically insulating layers 82.

[0096] The power module 91 includes a heat sink 93 on a bottom side. This means that the heat sink 93 is an external heat sink for the electronic module 1. The heat dissipation plate 81 is connected to the heat sink 93. In particular, the heat dissipation plate 81 is configured to dissipate heat generated during operation of the electronic module 1, i.e., the functional circuit component 10, to the heat sink 93. This advantageously allows the electronic module 1 to be designed without a heat sink. Thus, space, weight, and costs for the electronic module 1 can be reduced if the electronic module 1 can be designed without a separate heat sink.

[0097] The invention is not limited to the embodiments described based on these embodiments. Rather, the invention encompasses any novel feature and also any combination of features, including in particular any combination of features in the claims and any combination of features in the embodiments, even if this feature or combination itself is not explicitly stated in the claims or the embodiments. References 1 electronic module 2 module bodies 3, 4 first, second capacity unit 5 Throttle 6, 7 first, second interface 8 heat sinks 9 connecting devices 10 functional circuit components 10a DC link capacitor 10b Connection of the first power line 10c Connection of second power line 11 Cooling plate 12, 13 first, second power line 20 upper surface 21, 22 first, second side surface 23 lower surface 30, 40 first, second plate capacitor 50 Grounding contact structure 61...66 first to sixth electrical contact of the first interface 71, 72 first and second electrical contact of the second interface 80 Grounding 81 Heat dissipation plate 82 electrically insulating layer 90 Arrangement 91 Power module 92 Power supply 93 Heat sink 100 Frequency in Hz 101 Attenuation in dB

Claims

[1] Electronic module (1), comprising - at least one functional circuit component (10), - a module body (2), - a first interface (6) configured to connect a power module (91), - a second interface (7) which is designed to connect a power supply (92), - a first capacitance unit (3) configured to reduce external high-frequency noise, and a second capacitance unit (4) configured to reduce external low-frequency noise, so that the first and second capacitance units (3, 4) form an EMC filter structure, and - at least one cooling plate (11) which at least partially surrounds the functional circuit component (10), wherein - the first capacitance unit (3), the second capacitance unit (4) and the functional circuit component (10) are integrated into the module body (2), - the cooling plate (11) is connected to a heat sink (8) which is arranged on a lower surface (23) of the module body (2), and - the cooling plate (11) is designed to dissipate heat from the electronic module (1) to the lower surface (23). [2] Electronic module (1) according to claim 1, wherein - the first capacitance unit (3) is electrically arranged between the first interface (6) and the functional circuit component (10) and - the second capacitance unit (4) is electrically arranged between the second interface (7) and the functional circuit component (10). [3] Electronic module (1) according to claim 1 or 2, wherein the first capacitance unit (3) comprises at least one first plate capacitor (30) and the second capacitance unit (4) comprises at least one second plate capacitor (40). [4] Electronic module (1) according to claim 3, wherein - the at least one first plate capacitor (30) at least partially forms a first side surface (21) of the module body (2), and - the at least one second plate capacitor (40) at least partially forms an upper surface (20) of the module body (2). [5] Electronic module (1) according to claim 3 or 4, wherein each of the at least one first and at least one second plate capacitors (30, 40) is formed by a printed circuit board. [6] Electronic module (1) according to claim 5, wherein at least one electrical component is arranged on at least one of the circuit boards. [7] Electronic module (1) according to one of the preceding claims, further comprising a choke (5), wherein the choke (5) is integrated into the module body (2). [8] Electronic module (1) according to one of the preceding claims, wherein - the first capacitance unit (3) has a capacitance of 1 nF or less, and - the second capacitance unit (4) comprises a capacitance between 1 nF and 500 nF. [9] Electronic module (1) according to one of the preceding claims, wherein the first capacitance unit (3) is connected wirelessly to the first interface (6) and the second capacitance unit (4) is connected wirelessly to the second interface (7). [10] Electronic module according to (1) one of the preceding claims, wherein the functional circuit component (10) is a DC link circuit and the electronic module (1) is a DC link module. [11] Electronic module (1) according to one of claims 3 to 6, wherein the cooling plate (11) is arranged at least partially between the functional circuit component (10) and at least one of the at least one first plate capacitor (30) and the at least one second plate capacitor (40). [12] Electronic module (1) according to one of the preceding claims, wherein a ground contact of the first capacitance unit (3) and the second capacitance unit (4) is each directly connected to the cooling plate (11). [13] Electronic module (1) according to one of the preceding claims, wherein - the cooling plate (11) completely covers the functional circuit component (10) in view of the upper surface (20) and the first side surface (21), and - the cooling plate (11) is designed to reduce noise coupling to the functional circuit component (10). [14] Electronic module (1) according to one of the preceding claims, wherein the cooling plate (11) is fixedly connected to the heat sink (8) by a connecting means (9). [15] Electronic module (1) according to claim 14, wherein - the connecting means (9) comprises an electrically conductive material, so that the heat sink (8) is electrically conductively connected to the cooling plate (11), and - the heat sink (8) is designed to provide an earth contact for the electronic module (1). [16] Electronic module (1) according to claim 14 or 15, wherein each of the first and second capacitance units (3, 4) is electrically connected to the heat sink (8) via the cooling plate (11) in a conducting manner. [17] Electronic module (1) according to one of claims 1 to 14, wherein - the heat sink (8) comprises a heat dissipation plate (81), - the heat dissipation plate (81) is adapted to dissipate heat from the electronic module (1) to an external heat sink (93), and - the external heat sink (93) is a cooling element of the power module (91). [18] Arrangement (90) comprising - a power module (91) - an electronic module (1) according to one of the preceding claims, - a power supply (92), wherein - the power module (91) is connected to the first interface (6) of the electronic module (1) and - the power supply (92) is connected to the second interface (7) of the electronic module (1). [19] Arrangement (90) according to claim 18, wherein - the power module (91) comprises a semiconductor material, and - the power module (91) is an inverter and is designed to be additionally connected to a motor drive.

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