Device for treating substrates

Abstract

The invention relates to a device for processing substrates comprising two cooperating processing cylinders, which are mounted via bearing points in frame walls and between which the substrate can be inserted, wherein the substrate undergoes processing as it passes through tool parts acting in the cylinder gap from the group consisting of cutting tools, punching tools, grooving tools, perforating tools and / or slotting tools, wherein at least one frame wall consists of a material having a coefficient of thermal expansion of less than 3 × 10 -6 K -1 exhibits or wherein at least one frame wall has a partial area consisting of a material having a coefficient of thermal expansion less than 2 × 10 -6 K -1 has.

Description

[0001] The invention relates to a device for treating substrates.

[0002] Substrates are understood to mean, in particular, sheet-shaped substrates that are preferably printable or printed. Such substrates are processed by one or more processing steps, such as printing and / or coating and / or varnishing and / or cutting and / or punching and / or embossing and / or creasing and / or perforating.

[0003] For the continuous processing of sheet-shaped substrates, rotary systems with paired processing cylinders are known. The processing cylinders carry tools and form a cylinder gap into which the substrates can be inserted. As they pass through the cylinder gap, they are processed, and any resulting waste can be removed and disposed of in an orderly manner. Precise positioning of the processing cylinders relative to each other is required to ensure high processing quality.

[0004] DE 103 56 405 A1 discloses a device for finishing processes, e.g., cutting, punching, embossing, foil transfer, and / or coating, of printed paper, cardboard, cardboard packaging, corrugated cardboard, and plastics using a rotating process. In this process, the substrate can be inserted in the feed direction between a rotating counterpressure processing roller and a rotating processing roller and undergoes processing as it passes through tool parts operating in the working gap. A delivery conveyor belt for form-free substrates, which is aligned approximately horizontally, is arranged directly downstream of the processing roller.

[0005] The device is designed exclusively for processing web-shaped substrates.

[0006] DE 103 56 413 A1 discloses a device for the finishing processing of printed paper or similar web-like substrates using a rotation process. The substrate can be inserted in the feed direction between a rotating counterpressure processing roller and a rotating processing roller and is processed as it passes through tool parts acting in the working gap. The counterpressure processing roller is arranged essentially next to a processing roller, and a delivery conveyor belt for form-free substrates, which is aligned approximately horizontally, is arranged directly downstream of the processing roller. The processing roller is double-sized and has grippers.

[0007] EP 0 281 064 A1, WO 2006 / 117646 A1, DE 1 486 958 A and GB 969,753 A disclose devices for treating substrates with separating devices.

[0008] The problem with the operation of known devices is that parts of the device heat up and expand, primarily due to drive friction, which leads to an undesirable impact on the functioning of the known devices. Particularly problematic is the thermal expansion of the frame between the bearing points of interacting machine parts, such as rollers or cylinders, which together form a functionally essential cylinder gap. When using adjustably mounted rollers or cylinders, the thermal expansion can be counteracted by adjusting the rollers or cylinders. This proves to be complex, especially if the thermal expansion is not constant over time.

[0009] From DE 10 2016 226 167 A1 a device for treating substrates is known in which undesirable thermal expansion effects are counteracted by the use of a tempering device for exclusively tempering a frame wall close to the drive.

[0010] DE 10 2018 219 708 B3 discloses a device for treating substrates, in which an opening in the front side of a processing cylinder is penetrated by a tube through which a temperature control medium can flow, which tube is a component of a temperature control device.

[0011] According to DE 10 2018 219 709 B3, undesirable heating of a processing cylinder is counteracted by the targeted generation of an air flow that sweeps over the front side of the processing cylinder.

[0012] From DE 10 2018 219 710 B3 the use of heat-insulating layers to reduce heat propagation in processing cylinders is known.

[0013] DE 10 2017 222 716 B3 describes a printing material processing machine with a device for measuring and regulating the thermally variable distance between two rotational axes of die-cutting cylinders. The device uses a rod attached to a bearing of a processing cylinder and interacts with a sensor for detecting the distance between two rotational axes. The device does not detect the changes in the frame walls due to thermal expansion with sufficient accuracy in relation to the cylinder gap formed between the processing cylinders.

[0014] The invention is based on the object of creating a device for treating substrates with which the processing quality during separation or punching is improved.

[0015] The object is achieved according to the invention by the features of claim 1.

[0016] The advantages achievable with the invention are that substrates can be separated or punched with good processing quality.

[0017] The device for treating substrates can have a double-sized processing cylinder which carries positioning means designed to receive two tools which can be arranged one behind the other in the circumferential direction of the processing cylinder, and has a sheet holding system for fixing the front edges of the sheet-shaped substrate and interacts with a single-sized processing cylinder.

[0018] The invention is also applicable to any other configurations of processing cylinder sizes, such as systems whose processing cylinder pairings are double-sized / double-sized or single-sized / single-sized, etc.

[0019] Embodiments of the invention are illustrated in the drawings and are described in more detail below.

[0020] They show: Fig. 1 a schematic representation of a sheet processing machine with a device for treating substrates in a schematic representation; Fig. 2 a schematic representation of a device for treating substrates in side view.

[0021] The device for treating substrates can be designed as a stand-alone machine.

[0022] According to a further embodiment, the device for treating substrates is a component of a substrate-processing machine, in particular a sheet-processing machine, and is operated inline with the components of the sheet-processing machine. The sheet-processing machine is, in particular, a sheet-fed printing press, as used, for example, in Fig. 1. The invention is described below using the example of a sheet-fed printing press, in particular an offset sheet-fed printing press. This description also applies analogously to other sheet-processing machines, in particular punching machines, as well as to a design of the device as a stand-alone machine. A design as a punching machine can, in particular, have the features of a sheet-fed printing press without printing units.

[0023] The sheet-fed printing press comprises a feed system for substrates, also referred to as a feeder 07. Substrates are understood to be, in particular, sheet-shaped workpieces made of paper, cardboard, paperboard, corrugated cardboard, plastic, or the like, which are preferably printable or printed. The substrates are present in the feeder 07 of the sheet-fed printing press as a stack, from which they are separated and fed to the units of the sheet-fed printing press downstream of the feeder 07 via an acceleration system 08 and moved in a feed direction 11 through the units of the machine. The sheet-fed printing press comprises at least one, preferably several, printing units 06. The printing units 06 each comprise, in particular, a printing cylinder 41 and a sheet guide cylinder 42, preferably designed as a transfer drum 42. The printing cylinder 41 is assigned a blanket cylinder 43 carrying a rubber blanket, and this, in turn, is assigned a plate cylinder 44 carrying a printing plate.The plate cylinder 44 is in contact with an inking unit 45 and preferably also a dampening unit. In the printing unit 06, the substrate sheet is guided in a conventional manner by the sheet holding systems provided on the impression cylinder 41 and sheet guide cylinder 42, printed in the printing nip formed between the impression cylinder 41 and the blanket cylinder 43, and transferred to the subsequent unit of the sheet-fed printing press, e.g., in the form of the next printing unit 06. One or more processing units 46 can be provided downstream of the printing unit(s) 06 or between the printing units 06.

[0024] The processing units 46 preferably comprise two processing cylinders 96; 97, one of which, preferably the lower one, has a sheet holding system, and the other, preferably the upper one, has a tool carrier. The sheet holding system of the processing cylinder 96 can be designed as a clamping gripper system or a suction gripper system. The processing cylinders 96; 97 can have lateral measuring rings 196; 197.

[0025] The processing cylinders 96; 97 are arranged relative to each other, forming a cylinder gap. At least one of the processing cylinders 96; 97 carries a tool, preferably selected from the group of cutting tools, punching tools, creasing tools, perforating tools, or grooving tools.

[0026] In the simplest case, a processing cylinder pair 96; 97 is formed by the printing cylinder 41 and blanket cylinder 43 of a printing unit 06. In this case, one printing unit 06 serves as the processing unit 46. In this case, the tensioning device for the blanket serves to secure the tool to the blanket cylinder 43.

[0027] The processing cylinders 96; 97 can be designed in a variety of ways.

[0028] According to an embodiment which is particularly suitable for punching and perforating applications, the upper processing cylinder 97 is designed as a full magnetic cylinder or carrier cylinder with magnetic segments for receiving magnetic sheets or magnetic sheets and the lower processing cylinder 96 is designed as a surface-hardened cylinder or with a hardened sheet fastened thereon.

[0029] According to another embodiment, which is particularly suitable for embossing or creasing or grooving applications, the upper processing cylinder 97 is designed as a full magnetic cylinder or carrier cylinder with magnetic segments for receiving magnetic sheets or magnetic sheets and the lower processing cylinder 96 is designed as a surface-hardened cylinder or with a hardened sheet fastened thereon or with a sheet with hard rubber / plastic.

[0030] In all of the above-mentioned cases, the lower machining cylinder 96 can be provided with mechanically acting tool carriers or lifting supports, in particular with a positive or non-positive engagement. The non-positively acting tool carriers or lifting supports are, in particular, designed to act magnetically.

[0031] A counter cylinder 98 can be assigned to the processing cylinder 97 on its side facing away from the processing cylinder 97, which counter cylinder is in surface contact with the second processing cylinder 97. The counter cylinder 98 is shown schematically only in Fig. 1 shown.

[0032] The counter cylinder 98 is assigned to the processing cylinder 97 in such a way that when the processing cylinder 97 is deflected, as occurs when processing substrate sheets in the gap between the two processing cylinders 96; 97, the force effect of the resulting bending force of the second processing cylinder 97 hits the counter cylinder 98, preferably in its center or near its center.

[0033] The counter cylinder 98 can have the same diameter as the second processing cylinder 97.

[0034] According to a further preferred embodiment, the device for processing substrates comprises a separating device 02 with a transport cylinder 03 and a stripping cylinder 04, between which the substrate can be inserted. The separating device 02 can be part of a separating unit 02, in particular a stripping unit. As the substrate passes through the cylinder gap between the transport cylinder 03 and the stripping cylinder 04, it is separated by at least one elevator into at least one waste part and at least one blank. The transport cylinder 03 and / or the stripping cylinder 04 are preferably designed as magnetic cylinders. A peeling device, which can be selectively attached to or detached from the cylinders, can be assigned to the transport cylinder 03 and / or the stripping cylinder 04 and / or the processing cylinders 96; 97.

[0035] Openings that can preferably be supplied with air supply means are formed in the outer surface of the transport cylinder 03.

[0036] In order to facilitate the replacement of tool parts or elevators, one or both processing cylinders 96; 97 can be assigned a peeling device for peeling at least one tool part.

[0037] The machining cylinders 96; 97 are mounted in a frame via bearings 111; 112. The frame comprises lateral frame walls 109; 110 in which the bearings 111; 112 are formed. The bearings 111; 112 are preferably designed as multi-ring bearings, in particular three-ring bearings.

[0038] At least one frame wall 109; 110 consists of a material having a thermal expansion coefficient of less than 2 × 10 -6 K -1 or less than 3 × 10 -6 K -1 has.

[0039] The material is preferably Invar or an alloy that exhibits the Invar effect.

[0040] In particular, the material may be an alloy containing more than fifty percent iron, or more than sixty percent iron, or exactly fifty-four percent iron, or exactly sixty-four percent iron.

[0041] More preferably, the material is an alloy containing more than twenty-five percent nickel or more than thirty percent nickel or exactly twenty-nine percent nickel or exactly thirty-six percent nickel.

[0042] The material can also be an alloy that contains, in particular, more than fifteen percent or exactly seventeen percent cobalt in addition to iron and nickel.

[0043] As an alternative to a material made entirely of a material with a thermal expansion coefficient of less than 2 × 10 -6 K -1 or as 3 × 10 -6 K -1existing frame wall 109; 110, at least one frame wall 109; 110 can be formed with a partial area 100 which consists of a material having a thermal expansion coefficient of less than 2 × 10 -6 K -1 or as 3 × 10 -6 K -1 The material properties of the partial area 100 preferably correspond to the material properties described for a frame wall 109; 110 consisting entirely of one material, and to which reference is hereby made.

[0044] Preferably, the bearing points 111; 112 of the interacting processing cylinders 96; 97 are formed in the partial area 100. In particular, a partial area 100 is formed in each respective frame wall 109; 110, in which partial area the bearing points 111; 112 of the interacting processing cylinders 96; 97 are formed. In the area of ​​the bearing points 111; 112, the partial area 100 can have an outer contour that corresponds to the enlarged outer contour of the bearing points 111; 112 or is adapted thereto. Preferably, the bearing points 111; 112 are arranged in a respective partial area 100 such that the bearing points 111; 112 are spaced from the outer contour of the respective partial area 100 by at least 5 millimeters or at least 10 millimeters. In the area of ​​the bearing points 111; 112, the respective partial region 100 can in particular be formed with outer radii that are greater than 110 percent of the outer radii of the bearing points 111; 112.

[0045] The partial area 100 is preferably formed at least over the extent of the respective frame wall 109; 110 between the rotation axes 203; 204 of the processing cylinders 96; 97.

[0046] In particular, the respective partial area 100 is formed contiguously between the rotation axes 203; 204 of the processing cylinders 96; 97 and over the entire extent of the respective frame wall 109; 110.

[0047] The respective sub-region 100 can be arranged in a form-fitting manner in a base body or connected to a base body that forms a respective frame wall 109; 110 with the sub-region 100. The base body preferably consists of a further material that is different from the material from which the sub-region 100 is made.

[0048] The additional material contains a higher proportion of iron than the material from which sub-area 100 consists; preferably, the additional material contains more than ninety percent iron.

[0049] In particular, the frame can be designed as a cast box, as a welded part, or in another suitable form. Likewise, the subregion 100 and / or the base body can each be designed as a cast box, as a welded part, or in another suitable form.

[0050] Each processing cylinder 96; 97 or an individual processing cylinder 96; 97 can be assigned an adjusting device, in particular an actuator, with which the rotation axis 203; 204 of the respective processing cylinder 96; 97 can be displaced in relation to the rotation axis 204; 203 of the other processing cylinder 97; 96. The adjusting device enables an adjustment of the cylinder gap between the processing cylinders 96; 97, e.g. to adapt to the thickness of the substrate to be processed. The adjusting device is in particular designed such that the distance between the processing cylinders 96; 97 in the region of the frame wall 109 near the drive can be adjusted independently of the distance between the processing cylinders 96; 97 in the region of the frame wall 110 remote from the drive. In other words, an inclination of the processing cylinders 96; 97 to each other or balanced.

[0051] The processing cylinders 96; 97 are preferably driven on one side, i.e., a drive torque is introduced only at one end of the respective processing cylinder 96; 97. For driving, a common drive with a gear train comprising drive gears or several individual drives can be provided. If drive gears are provided, a drive gear is preferably arranged on each leg of the respective processing cylinder 96; 97, preferably outside the frame or in a hollow space of the frame. The hollow space can be delimited by a frame wall 109; 110 from the space in the frame that accommodates the processing cylinders 96; 97. The drive gears of the two processing cylinders 96; 97 preferably mesh with one another and are preferably connected via additional gear elements (not shown), in particular gears, to a drive motor, which can be designed as a central drive.

[0052] Further preferably, a frame wall 109 close to the drive can be made of the material having a thermal expansion coefficient of less than 3 × 10 -6 K -1 and a frame wall 110 remote from the drive consists of one or more materials which have a thermal expansion coefficient greater than 3 × 10 -6 K -1 has.

[0053] A frame wall 109 close to the drive can also have a partial area 100 made of the material having a thermal expansion coefficient of less than 3 × 10 -6 K -1 and a frame wall 110 remote from the drive is made of the material having a thermal expansion coefficient greater than 3 × 10 -6 K -1 has.

[0054] The device for treating substrates can comprise one or more temperature control devices. According to one embodiment, the temperature control device can be designed to exclusively temperature control the frame wall 109 near the drive, i.e., without temperature control of the frame wall 110 remote from the drive. In this case, the other frame wall 110 does not have a temperature control device. According to a further embodiment, the temperature control device can be designed to temperature control the frame wall 109 near the drive and the frame wall 110 remote from the drive. The one or more temperature control devices are designed in particular to temperature control the respective frame wall 109 near the drive and / or the frame wall 110 remote from the drive between the bearing points 111; 112 of the processing cylinders 96; 97.

[0055] The one or each temperature control device preferably comprises one or more cooling devices and / or one or more heating devices. The one or more cooling devices and / or the one or more heating devices are designed to temperature-control the frame wall 109 near the drive independently of the temperature-control of the frame wall 110 remote from the drive and are preferably, but not necessarily, arranged exclusively between the bearing points 111; 112 of the processing cylinders 96; 97.The one or each temperature control device can have a temperature control medium circuit formed in at least one of the frame walls 109; 110 or a heating plate fixed to at least one of the frame walls 109; 110 or an induction coil fixed, in particular glued, to at least one of the frame walls 109; 110 or an induction pad fixed, in particular glued, to at least one of the frame walls 109; 110 or a Peltier element fixed to at least one of the frame walls 109; 110.

[0056] More preferably, the at least one temperature control device comprises one or two control circuits with which the temperature of the frame wall 109 near the drive can be controlled independently of the temperature of the frame wall 110 remote from the drive. The control circuits are designed in a conventional manner and each comprise a temperature sensor, a controller, and a controlled system. The respective temperature sensor is assigned to the respective frame wall 109; 110 such that it detects the temperature of the respective frame wall 109; 110 in the area between the bearing points 111; 112. The temperature forms the controlled variable of the respective control circuit.

[0057] Preferably, a setpoint for controlling the frame wall 109 near the drive to a temperature greater than the temperature of the frame wall 110 far from the drive is input to the temperature control device. This setpoint forms the reference variable of the respective control loop. A further setpoint for controlling the frame wall 110 far from the drive to a temperature lower than the temperature of the frame wall 109 near the drive can also be input to the temperature control device, which can form the reference variable of a further control loop.

[0058] The setpoint and the further setpoint represent the temperature or the state that occurs when the processing cylinders 96; 97 are continuously driven.

[0059] Preferably, before commissioning or after a prolonged downtime, one of the frame walls 109; 110 or both frame walls 109; 110 are tempered. The tempering is preferably carried out such that the frame wall 109 near the drive is heated to a temperature above the temperature of the frame wall 110 far from the drive. The distance between the processing cylinders 96; 97 is then adjusted. This is preferably carried out such that the distance has the same values ​​everywhere, or the processing cylinders 96; 97 are aligned parallel to one another. The substrate can then be inserted and processed between the processing cylinders 96; 97. Preferably, the frame wall 110 far from the drive is tempered to a temperature below the temperature of the frame wall 109 near the drive during the tempering of the frame wall 109 near the drive. The temperature of the frame wall 110 far from the drive is preferably above the ambient temperature.In particular, to support tempering or preheating, the processing cylinders 96; 97 can also be driven during tempering. Further preferably, the frame wall 109 near the drive is tempered to a setpoint for tempering the frame wall 109 near the drive, and the frame wall 110 far from the drive is tempered to a further setpoint that differs from the setpoint for tempering the frame wall 109 near the drive, wherein the setpoint for tempering the frame wall 109 near the drive and the further setpoint represent the temperatures that result from continuous driving of the processing cylinders 96; 97 in the respective frame wall 109; 110, in particular at an ambient temperature between 17 and 23 degrees Celsius, e.g., due to the frictional heat of the drive and / or the bearing points 111; 112 and / or due to other influences.Ideally, the setpoint and the additional setpoint are selected such that, during continuous operation, the temperatures set for the two frame walls 109; 110 remain constant without the need for temperature control by the temperature control device. This condition is achieved when the amount of heat supplied by friction is equal to the amount of heat dissipated to the environment due to the temperature gradient between the frame walls 109; 110 and the ambient temperature. List of reference symbols 01 - 02 Separator, separating device 03 Transport cylinder 04 Stripping cylinder 05 - 06 Printing unit 07 Investors 08 Acceleration system 09 - 10 - 11 Feed direction 41 printing cylinders 42 sheet guiding cylinder, transfer drum 43 blanket cylinders 44 plate cylinders 45 inking units 46 machining center 96 machining cylinders, first 97 machining cylinder, second 98 counter cylinders 100 sub-area 109 Frame wall, near drive 110 Frame wall, remote from drive 111 storage location 112 storage location 196 measuring ring 197 measuring ring 198 - 199 - 200 - 201 - 202 - 203 Rotation axis (96) 204 Rotation axis (97) QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 103 56 405 A1

[0004] DE 103 56 413 A1

[0006] EP 0 281 064 A1

[0007] WO 2006 / 117646 A1

[0007] DE 1 486 958 A

[0007] GB 969,753 A

[0007] DE 10 2016 226 167 A1

[0009] DE 10 2018 219 708 B3

[0010] DE 10 2018 219 709 B3

[0011] DE 10 2018 219 710 B3

[0012] DE 10 2017 222 716 B3

[0013]

Claims

[1] Device for treating substrates comprising two interacting processing cylinders (96; 97) which are mounted via bearing points (111; 112) in frame walls (109; 110) and between which the substrate can be introduced, wherein the substrate undergoes processing when passing through tool parts active in the cylinder gap from the group of cutting tools, punching tools, creasing tools, perforating tools and / or grooving tools, wherein at least one frame wall (109; 110) consists of a material which has a thermal expansion coefficient of less than 3 × 10 -6 K -1 or wherein at least one frame wall (109; 110) has a partial region (100) made of a material having a thermal expansion coefficient of less than 3 × 10 -6 K -1 has. [2] Device according to claim 1, characterized by that the material is Invar or an alloy that exhibits the Invar effect. [3] Device according to claim 1 or 2, characterized by that the material is an alloy containing iron and nickel. [4] Device according to claim 1, 2 or 3, characterized by that the material is an alloy containing more than fifty percent iron or more than sixty percent iron or exactly fifty-four percent iron or exactly sixty-four percent iron. [5] Device according to claim 1, 2, 3 or 4, characterized by that the material is an alloy containing more than twenty-five percent nickel or more than thirty percent nickel or exactly twenty-nine percent nickel or exactly thirty-six percent nickel. [6] Device according to claim 1, 2, 3, 4 or 5, characterized by that the material is an alloy containing more than fifteen percent or exactly seventeen percent cobalt. [7] Device according to claim 1, 2, 3, 4, 5 or 6, characterized bythat in at least one frame wall (109; 110) the bearing points (111; 112) of the cooperating processing cylinders (96; 97) are formed in the partial area (100). [8] Device according to claim 1, 2, 3, 4, 5, 6 or 7, characterized by that the partial area (100) is formed coherently. [9] Device according to claim 1, 2, 3, 4, 5, 6, 7 or 8, characterized by that the partial region (100) is formed at least over the extent of the respective frame wall (109; 110) between the rotation axes (203; 204) of the processing cylinders (96; 97). [10] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8 or 9, characterized by that the partial area (100) is arranged in a form-fitting manner in a base body or is connected to a base body which forms a respective frame wall (109; 110) with the partial area (100). [11] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, characterized bythat one or the base body consists of a further material which is different from the material from which the partial region (100) consists. [12] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11, characterized by that one or the base body consists of another material which contains a higher proportion of iron than the material from which the partial area (100) consists or which contains more than ninety percent iron. [13] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12, characterized by that the processing cylinders (96; 97) are driven on one side and a frame wall (109) close to the drive is made of the material having a thermal expansion coefficient of less than 3 × 10 -6 K -1 and a frame wall (110) remote from the drive consists of one or the further material which has a thermal expansion coefficient greater than 3 × 10 -6 K -1 has. [14] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or 13, characterized by that the processing cylinders (96; 97) are driven on one side and a frame wall (109) close to the drive has a partial area (100) which consists of the material having a thermal expansion coefficient of less than 3 × 10 -6 K -1 and a frame wall (110) remote from the drive consists of the material having a thermal expansion coefficient greater than 3 × 10 -6 K -1 has. [15] Device according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 or 14, characterized by that at least one of the processing cylinders (96; 97) has a sheet holding system for fixing the leading edges of sheet-shaped substrate.

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