Semiconductor module and method for manufacturing a semiconductor module

Abstract

The invention comprises a semiconductor module (100) with the following features: - an integrated semiconductor circuit (105) that can be electrically contacted or connected via at least one connection area (145, 145a); - a printed circuit board (120) with at least one electronic component (125) that can be electrically contacted or connected via at least one printed circuit board connection area (140, 140a); and a bridging element (110) with at least one electrical bridging line (115, 115a), wherein the bridging line (115, 115a) can be contacted or connected to the connection area (145, 145a) of the integrated semiconductor circuit (105) by means of a first contact element (150, 150a) and to the printed circuit board connection area (140, 140a) by means of a second contact element (155, 155a). A method for manufacturing the module is also described.

Description

The approach presented here provides a semiconductor module and a method for producing a semiconductor module according to the main claims.In previous projects, ICs-in particular camera sensors-have already been bonded to form a PCB wedge wedge (PCB=printed circuit board=conductor board). However, processing the PCB (soldering the components to the PCB) contaminate the bond pads of the PCB, resulting in reduced yield of the bond to the PCB, even if the PCB is heavily cleaned. This problem has been compensated for heretofore by enlarged bond pads on the IC side (i.e., the semiconductor integrated circuit side) which permit post-bonding in the case of poor bonding. However, as the structures on the IC side become smaller and smaller, these bond pads are also made smaller in size in such a way that subsequent bonding in the future or in the case of commercially available sensors is no longer possible. This results in a very poor yield or a relatively high reject rate which can no longer be repaired.In the prior art, ICs can be bonded into a package. The package itself is very clean and no soldering processes have been carried out therewith until the time of bonding. This results in a high crop yield (engl. for example in the case of the pentium processor in its package) industrially. Yield). An alternative to this is ball bonding, which also has a relatively high yield on contaminated surfaces. However, such a solution requires a high outlay with regard to the design and production of such semiconductor circuits or components connected thereto. In addition, a ball bond is possible only on one side, and the other side of the bond wire has to be edge-bonded (wedge bond). A possibility of the manufacturer of an integrated semiconductor circuit such as an optical sensor or a camera (such as, for example, Jenoptics) intervening in the design process of the ASIC (i.e., here the camera sensor) is also conceivable. However, this is not always a feasible possibility during development because of the project phase which has already advanced to a great extent in most cases. Alternatively, one package would be necessary for each ASIC. In particular in the case of image sensors which are produced in small numbers, this is not competitive at price. An alternative is the acceptance of a low yield or the changeover to more complex bonding methods, which, however, likewise proves to be unfavourable from a manufacturing point of view.US 2016 / 0148966 A1 discloses an image sensor in which the semiconductor chip is fastened to a printed circuit board and is contacted at the edge by means of bonding wires. However, bonding connections on a printed circuit board can have a high defect rate, so that the yield of material parts is low. It is also disadvantageous that during bonding the chip height must be bridged.EP 2 575 175 B1 discloses an image sensor in which the sensor chip is bonded to a chip carrier and the chip carrier is bonded to a circuit carrier. This has the disadvantage of a large overall height. This disadvantage can only be alleviated by the fact that a cavity which accommodates the chip carrier has to be introduced into the circuit carrier. Steps must also be overcome during bonding. It is also disadvantageous that conductor tracks and bond pads have to be provided on the chip carrier.The object of the invention is to specify a semiconductor module and method for producing a semiconductor module with a high yield of material.The approach presented here creates a semiconductor module having the following features:an integrated semiconductor circuit which is electrically contactable or contacted via at least one connection region;a printed circuit board having at least one electronic component which is electrically contactable or contacted via at least one printed circuit board connection region; anda bridging element having at least one electrical bridging line, wherein the bridging line can be contacted or is contacted by means of a first contact element with the connection region of the semiconductor circuit and by means of a second contact element with the printed circuit board connection region.An integrated semiconductor circuit can be understood to mean, for example, an electronic circuit embedded in a semiconductor substrate, which is in external contact here, for example, via a housing. Here, outside the housing, a connection region is first provided, via which the semiconductor circuit can be electrically contacted or is contacted. The semiconductor substrate may have a normal in a z-direction. It can be formed as a semiconductor chip. A printed circuit board (PCB) can be understood to mean, for example, a conventional circuit carrier element, for example made of laminated plastic layers, on which, for example, further electronic components such as resistors, capacitors, other integrated circuits or the like are fastened or can be fastened. The electronic component can, however, also be an electrical connection element such as, for example, a plug socket or clamping element for printed circuit board connectors. The printed circuit board can be, for example, an epoxy resin printed circuit board or a hard paper printed circuit board. The printed circuit board may have a normal oriented in the z-direction. In the present case, a bridging element can be understood to mean an element on which at least one electrical bridging line is provided, which can be electrically contacted from outside the bridging element. For example, this bridging line can be electrically contacted by contact elements, which can be designed, for example, as bonding wire, on the one hand to the connection region (of the integrated semiconductor circuit) and on the other hand to the printed circuit board connection region of the printed circuit board. The bridging element thus essentially serves as an intermediate piece for a possibility of producing the electrical connection between the connection region and the printed circuit board connection region.The approach presented here is based on the finding that, by using the bridging element, contact can be made very easily around the connection region with the printed circuit board connection region, wherein this bridging element can be kept very clean in particular, so that contact can be made reliably between the connection region of the integrated semiconductor circuit and the bridging line, since a corresponding contact point of the first contact element on the bridging line is highly likely not contaminated, since the bridging element essentially only serves for electrically bridging the connection region with the printed circuit board connection region and is not contaminated, for example, by further components on the printed circuit board at a processing level. In contrast, the second contact element can be attached from the printed circuit board connection region to the jumper line, if appropriate in a plurality of tests, in order reliably to also contaminate the contacting between the jumper line and the printed circuit board connection region (which may also be soiled, for example, by the preceding processing of the printed circuit board, in particular the soldering of further components on the printed circuit board.The approach presented offers the advantage that, due to the technically simple use of the bridging element, a significant improvement in the contacting possibility of the connection region with the printed circuit board connection region is made possible without the risk of such contacting being particularly prone to faults due to the different yield values of the integrated semiconductor circuit and of the printed circuit board. This allows a significant improvement in the production of a semiconductor module to be achieved using technically simple means. In particular, the approach presented is advantageous if the connection region of the integrated semiconductor circuit is formed with such a small area that it permits only a single bonding process. If this bonding location or the bonding location on the other side of the bonding wire is faulty, it may be impossible to perform a re-bonding operation because then there is no longer any space on the connection area for a second bonding wire attachment. The connection region can no longer be usable for a further bonding process, because the faulty bonding wire cannot be removed from the connection region without leaving any residue. Advantageously, a high-quality bridging element can be provided which has a higher yield of material (yield) during bonding than the printed circuit board. This situation can also be considered by means of an error rate, for example as an expected value of the number of errors of one million parts each. The first contact element can have a first error rate and the second contact element can have a second error rate. Advantageously, the first error rate may be less than half as great as the second error rate. The second fault rate can be caused predominantly by the failure of the fastening point of the second contact element on the printed circuit board connection region. If the second contact element can be removed in the event of a fault and a new second contact element can be attached, it can thereby be possible to considerably increase the yield of crop material.An embodiment of the approach proposed here is favorable, in which the bridging line of the bridging element is designed to electrically contact only the connection region with the printed circuit board connection region and / or wherein the first and / or second contact element is designed as a bonding wire. Such an embodiment of the approach presented here offers the advantage of being able to make contact with the electrical semiconductor circuit with the printed circuit board even at different yield values in a technically simple manner. Particularly advantageously, both the first and the second contact element can each be configured as a bonding wire. The first contact element may have a first bonding direction oriented in a y-direction. The second contact element can have a second bonding direction which is oriented in the y direction.A bonding wire can be understood in the sense of this invention to mean, for example, a round wire or a wire with a rectangular cross section. The latter can also be referred to as bonding tapes. The bonding wire can consist, for example, of gold, copper or aluminum. In a special embodiment, the use of different bonding wires may be advantageous. For example, the first contact element may be a bond wire made of gold, while the second contact element may be a bond wire made of aluminum. Alternatively, both contact elements can be produced from the same bonding wire material. Then both contact elements can be manufactured with the same machine. Advantageously, the first and the second contact element can each be configured as a bonding wire with edge bonding (wedge-wedge bonding) on both sides. A particularly flat design is then possible.The bridging element can be designed in the form of a plate with a plate top side and an opposite plate bottom side, which represent the two largest plate surfaces. The plate normal of the bridging element can be arranged in the z direction. According to a particularly favorable embodiment of the approach proposed here, the bridging element can have a ceramic bridging element substrate. The bridging line can be formed as a conductor track on the bridging element substrate. The bridging element can have one or advantageously a plurality of bridging lines. These may be arranged on the plate top side of the bridging element. The plurality of jumper lines may be offset from each other in a direction x.The integrated semiconductor circuit can be designed as an optical sensor, in particular a camera chip. Such an embodiment offers the advantage of a technically simple and robust configuration of the bridging element. Additionally or alternatively, a sensitive semiconductor integrated circuit in the form of an optical sensor can also be efficiently coupled to the printed circuit board.An embodiment of the approach proposed here is advantageous in which the bridging line extends substantially across a width of the bridging element and / or wherein the bridging line substantially has a width which corresponds within a tolerance range to a width of the connection region and / or of the printed circuit board connection region. Such an embodiment of the approach proposed here offers the advantage that contacting of the connection region and / or of the printed circuit board connection region can be carried out reliably. At the same time, an excessively large bridging element does not need to be provided.Furthermore, according to another embodiment of the approach proposed here, at least the semiconductor circuit and the bridging element can be arranged and / or fastened on a common substrate. The substrate can be plate-shaped. The semiconductor integrated circuit and the bridging element may be arranged side by side on the same side of the substrate, which may be referred to as substrate top side. For example, the integrated semiconductor circuit and the bridging element can be fastened, for example adhesively bonded or soldered, to a common substrate such as an aluminum oxide substrate, an aluminum nitride substrate, a diamond substrate, a silicon carbide substrate or an MMC substrate, e.g. an aluminum silicon carbide substrate. The fastening can advantageously be embodied over the full surface. Such an embodiment offers the advantage that the semiconductor circuit can hold the bridging element very stably with respect to one another, so that, for example, the application of the first contact element between the connection region and the bridging line can take place without errors and quickly. Also, the semiconductor integrated circuit may be soldered to the substrate, while the bridging element may be bonded to the substrate. However, it may be advantageous to glue the semiconductor integrated circuit and the bridging element both to the substrate so that the semiconductor module can be produced as inexpensively as possible.Advantageously, the integrated semiconductor circuit, the bridging element and the printed circuit board can be arranged and / or fastened on the upper side of the common substrate. In this case, the printed circuit board connection region can be arranged on the side of the printed circuit board facing away from the substrate. The circuit board may have a recess in which the semiconductor integrated circuit and the bridging element are arranged. In this case, an edge region of the recess can be connected all around to the substrate.Furthermore, it is advantageous if, according to one embodiment, the bridging line is formed as a strip-shaped electrically conductive, in particular metallic surface. The strip-shaped configuration can mean that the bridging line has a length of at least three times the strip width. The strip width of the bridging line can be an extension in the x direction, the strip length the extension in a y direction. The directions x, y and z can span a Cartesian coordinate system. The bridging line can in particular be rectangular, optionally with rounded corners. Such a strip-shaped embodiment offers the advantage of a large available area in order to be able to electrically contact the corresponding contact elements on the bridging line. In this way, possible faulty contacts can also be removed and new contact elements can be fastened or electrically contacted at another location on the checking line. The other location can be offset with respect to the miscontacted first bonding location in the direction y, i.e. in the strip longitudinal direction.A particularly further-directed embodiment of the approach proposed here, in which the integrated semiconductor circuit is electrically contactable or contacted via at least one second connection region electrically insulated from the first connection region, and in which the electronic component or a further electronic component of the printed circuit board is electrically contactable or contacted via at least one further printed circuit board connection region; wherein the bridging element has at least one further electrical bridging line which is contactable or contacted by means of a third contact element with the further connection region of the integrated semiconductor circuit and by means of a fourth contact element with the further printed circuit board connection region. The corresponding further components can be constructed or designed in a manner corresponding to the analog components described above. Such an embodiment of the approach proposed here offers the advantage of being able to make reliable contacting of connection regions of the integrated semiconductor circuit with corresponding printed circuit board connection regions of the printed circuit board by using a plurality of bridging lines on the bridging element. In this way, the above-mentioned advantages can be realized for a plurality of electrical connections between the semiconductor integrated circuit and the printed circuit board.A bridging element can be realized in a very compact and efficient manner if, according to one embodiment of the approach presented here, the further bridging line is arranged and / or aligned on the bridging element substantially parallel to the bridging line and / or wherein the further bridging line and the bridging line are substantially identically shaped or removed.Furthermore, an embodiment of the approach proposed here is conceivable in which the integrated semiconductor circuit is electrically contactable or contacted via at least one third connection region electrically insulated from the first and second connection regions and in which the electronic component, the further electronic component and / or an additional component of the printed circuit board is electrically contactable or contacted via at least one additional printed circuit board connection region; wherein the bridging element has at least one additional electrical bridging line which is contactable or contacted by means of a fifth contact element with the third connection region of the integrated semiconductor circuit and by means of a sixth contact element with the further additional additional bridging line, in particular wherein the bridging line, the further bridging line and the additional bridging line are of the same configuration and / or are arranged at equal distances from one another. Such an embodiment enables a bridging element to be designed very efficiently, in which a plurality of bridging lines are provided which are advantageously formed in the same manner or at equal distances. The bypass lines can be arranged offset with respect to one another in the direction x. Such a bridging element can be easily produced on the one hand and on the other hand it offers a very efficient possibility of realizing the above-mentioned advantages.Advantageously, the bypass line can be arranged in a plane, for example an xy plane, wherein the connection region of the integrated semiconductor circuit has a distance from the plane of the bypass line of less than 0.2 mm. Likewise advantageously, the printed circuit board connection region can have a distance from the plane of the jumper line of less than a thickness of the printed circuit board, in particular of less than 0.2 mm. As a result, the step heights during the attachment of the contact elements, for example during bonding, can be kept low.The substrate can advantageously comprise a metal matrix composite (MMC), in particular an electrically conductive metal matrix composite. The substrate can have a base body made of a metal matrix composite material. A metallic covering layer can be arranged on the base body, at least on the side on which the integrated semiconductor circuit, the bridging element and the printed circuit board are arranged. The substrate may be formed free of an electrical insulation layer, at least on the side on which the semiconductor integrated circuit, the bridging element and the printed circuit board are arranged. As a result, optimum heat dissipation of the waste heat of the semiconductor integrated circuit can be achieved. In addition, a substrate without an insulation layer can be cheaper. Advantageously, the substrate can be formed free of conductor tracks and free of bond pads. This is possible because bonds on the substrate are unnecessary in the present approach. The integrated semiconductor circuit can be electrically conductively connected to the substrate on a rear side if the latter is configured to be electrically conductive. Thereby, the semiconductor substrate can be electrically connected to the substrate. As a result, the electromagnetic compatibility can be positively influenced. Bonding pads, which may also be referred to as bonding pads, may be understood to mean metallic surface regions which are provided for wire bonding.Furthermore, an embodiment of the approach proposed here is advantageous as a method for producing a variant of a semiconductor module presented here, wherein the method has the following steps:providing an integrated semiconductor circuit, which is electrically contactable or contacted via at least one connection region, of a printed circuit board having at least one electronic component, which is electrically contactable or contacted via at least one printed circuit board connection region, and a bridging element having at least one electrical bridging line;connecting the jumper line to the terminal portion of the semiconductor integrated circuit by means of a first contact element and to the circuit board terminal portion by means of a second contact element to produce the semiconductor module.Such an embodiment offers the advantage of realizing the aforementioned advantages as well by the (electrical) connection of the bridging line to the connection region on the one hand and the circuit board connection region on the other hand, in particular if the connection regions on the integrated semiconductor circuit and the yield values on the circuit board have different in terms of the fastening of the contacting elements, e.g. bond wires. By using the bridging element, the corresponding electrical contacting can thus be carried out reliably with very little error or easily corrected.An embodiment of the approach proposed here is particularly advantageous as a method in which the further steps are provided:testing an electrical conductivity between the connection region and the bridging line and / or between the bridging line and the printed circuit board connection region and / or between the connection region and the printed circuit board connection region;removing the first and / or second contact element if no electrical conductivity has been detected between the bridging line and the printed circuit board connection region and / or between the connection region and the printed circuit board connection region; andconnecting the bridging line again to the printed circuit board connection region by means of a new second contact element in order to produce the semiconductor module.Such an embodiment of the approach proposed here offers the advantage of being able to make reliable electrical contacting, even if this electrical contacting was not effective in the case of a first connection, for example due to impurities. By using the bypass line, a very clean region is now available at which the connection region of the integrated semiconductor circuit can be reliably contacted, so that damage to the integrated semiconductor circuit due to a plurality of attempts at contacting can be avoided. At the same time, a multiple attempt to contact the bridging line with the printed circuit board connection region is not critical thermally or in terms of production technology.An embodiment of the approach proposed here is particularly advantageous in which, in the step of renewed connection, the new second contact element is fastened at a different point on the bridging line than the second contact element was fastened. Such an embodiment offers the advantage that by fastening or contacting a contact element at another location of the bridging line, it can be avoided that multiple use of the same location on the bridging line leads to damage to the bridging line and, if applicable, to ineffective electrical contacting.This method can be implemented, for example, in software or hardware or in a mixed form of software and hardware, for example in a control device.The approach presented here furthermore provides a control unit which is designed to carry out, actuate or implement the steps of a variant of a method presented here in corresponding devices. This embodiment variant of the invention in the form of a device also enables the object on which the invention is based to be achieved quickly and efficiently.For this purpose, the control unit can have at least one arithmetic unit for processing signals or data, at least one memory unit for storing signals or data, at least one interface to a sensor or an actuator for reading in sensor signals from the sensor or for outputting data or control signals to the actuator and / or at least one communication interface for reading in or outputting data which are embedded in a communication protocol. The computing unit can be, for example, a signal processor, a microcontroller or the like, wherein the memory unit can be a flash memory or a magnetic memory unit. The communication interface can be designed to read in or output data wirelessly and / or in a wired manner, wherein a communication interface that can read in or output wired data can read in this data, for example electrically or optically, from a corresponding data transmission line or output it into a corresponding data transmission line.In the present case, a control unit can be understood to mean an electrical device which processes sensor signals and outputs control and / or data signals as a function thereof. The device can have an interface which can be designed as hardware and / or software. In the case of a hardware configuration, the interfaces can be part of a so-called system ASIC, for example, which contains a wide variety of functions of the device. However, it is also possible for the interfaces to be dedicated, integrated circuits or to consist at least partially of discrete components. In the case of a software configuration, the interfaces can be software modules which are present, for example, on a microcontroller in addition to other software modules.A computer program product or computer program with program code which can be stored on a machine-readable carrier or storage medium such as a semiconductor memory, a hard disk memory or an optical memory and is used for carrying out, implementing and / or controlling the steps of the method according to one of the embodiments described above is also advantageous, in particular if the program product or program is executed on a computer or a device.Advantageous exemplary embodiments are explained in more detail below with reference to the attached drawings. The following are shown: FIG. 1 shows a schematic cross-sectional illustration through an exemplary embodiment of a semiconductor module; FIG. 2 shows a plan view illustration and an enlarged detail of a bridging element for use in an exemplary embodiment of the semiconductor module presented in FIG. 1 ; FIG. 3 shows a perspective view of a second exemplary embodiment of a semiconductor module; FIG. 4 is a perspective view of a third embodiment of a semiconductor module; FIG. 5 shows an enlarged detail of the contact elements with an example of a repaired second contact element; FIG. 6 is an enlarged plan view of the arrangement of the individual components of a fourth exemplary embodiment of a semiconductor module; FIG. 7 shows a flow diagram of an exemplary embodiment of a method for producing a variant of a semiconductor module presented here; and FIG. 8 shows a block diagram of an exemplary embodiment of a control unit for controlling steps of a method for producing a variant of a semiconductor module presented here.The same or similar elements are denoted by the same or similar reference numerals in the following figures, and repeated description of these elements is omitted.FIG. 1 shows a schematic cross-sectional illustration through an exemplary embodiment of a semiconductor module 100. The semiconductor module 100 here comprises an integrated semiconductor circuit 105, which is embodied, for example, as an ASIC. In a modification of the exemplary embodiment, the integrated semiconductor circuit 105 is designed as an optical image sensor, for example as a CCD or CMOS matrix sensor, in order thus to realize a camera function, for example. Furthermore, the semiconductor module 100 comprises a bridging element 110 having a bridging line 115 and a printed circuit board 120. On the printed circuit board 120, which is configured, for example, as a PCB, a component 125 is electrically contacted, for example soldered. Of course, a plurality of components can also be on the printed circuit board. The integrated semiconductor circuit 105, the bridging element 110 and also partly the printed circuit board 120 are furthermore arranged on a common (for example as an AlSiC-based) substrate 130, for example using an adhesive layer 135. In order to now contact a printed circuit board connection region 140 of the printed circuit board 120 (for example for electrically contacting an electrical component 125 provided on the printed circuit board 120) with a connection region 145 of the integrated semiconductor circuit 105, a first contact element 150, for example a bonding wire, is inserted between the connection region 145 and the bridging line 115, for example soldered in, or, as illustrated in FIG. 1, wire-bonded. Similarly, a second contact element 155 is also inserted between the jumper line 115 and the printed circuit board connection region 140, for example soldered, or, as illustrated in FIG. 1, wire-bonded.Such an arrangement now enables a very efficient use or connection of a printed circuit board 120 having a very low yield value, which is caused, for example, by the prior processing or soldering of the components 125 on the printed circuit board 120, in which the corresponding printed circuit board connection regions 140 may be partly contaminated or oxidized, for example, with a semiconductor integrated circuit 105 having a very high yield value, since this semiconductor integrated circuit 105 has not yet been processed or processed before contacting the connection region or regions 145 and has thus been substantially less contaminated. By using the bridging element 110, which has likewise not yet been processed in advance and thus has a high yield value, reliable contacting of the connection region 145 with the bridging line 115 can thus be produced by the first contact element 150, whereas a plurality of attempts at attachment can also be carried out for the second contact element 155 in order to achieve a fault-free connection, especially if the second contact element 155 can be contacted at different points of the bridging line 115 or of the printed circuit board connection region 140. An example of this procedure is shown below in FIG. 5. For this purpose, the corresponding printed circuit board connection regions 140 can also have a larger area, which is usually not possible or very cost-intensive for the area of the connection regions 140 of the integrated semiconductor circuit 105 for production engineering reasons.FIG. 2 shows a plan view illustration and an enlarged detail of a bridging element 110 for use in an exemplary embodiment of the semiconductor module 100 presented in FIG. 1. It can be seen here that the bridging element 110 has a plurality of substantially rectangular bridging lines 115 which likewise extend substantially across a width of the bridging element 110. It can also be seen that the individual bypass lines in 115 are substantially uniform and are substantially at the same distance from one another. For example, a bypass line 115 ais thus arranged in parallel with a further bypass line 115 band / or an additional bypass line 115 con the bypass element 110. The bridging lines 115 can be formed individually or all by a metallic surface on a ceramic bridging element substrate of the bridging element 110, which has been formed on the ceramic bridging element substrate, for example, by a corresponding etching process. Dimension specifications entered in FIG. 2 are selected here merely by way of example in order to clarify a basic arrangement and size of the individual jumper lines 115 for use in a corresponding semiconductor module. FIG. 2 shows, by way of example, advantageous geometric dimensions which can be used for the construction of the bridging element.FIG. 3 shows a perspective view of a semiconductor module in which a semiconductor integrated circuit 105 is provided, which is configured, for example, as an optical sensor or camera. In this exemplary embodiment, the semiconductor circuit 105, the bridging element 110 and the printed circuit board 120 are fastened on an upper side of the common substrate 130, wherein the printed circuit board connection region 140, 140 ais arranged on the side of the printed circuit board 120 facing away from the substrate 130, and the printed circuit board 120 has a recess 160 in which the semiconductor circuit 105 and the bridging element 110 are arranged. The edge region of the recess 160 is connected all around to the substrate 130, as a result of which a particularly stable connection between the printed circuit board 120 and the substrate 130 is made possible. For this purpose, the area of the recess 160 is formed to be somewhat smaller than the substrate, whereby overlapping bonding of the substrate upper side to the printed circuit board is possible.In this example, a plurality of electronic components 125 are present on the printed circuit board 120, two being shown by way of example.FIG. 4 shows a perspective view of a further exemplary embodiment of a semiconductor module 100. In contrast to the example according to FIG. 3, the printed circuit board 120 is here designed to be smaller in area and is mounted on the substrate 130 on one side next to the bridging element 110.FIG. 5 shows a detail in which some first and second contact elements 150 and 155, respectively, can be seen. A faulty second contact element 155f was removed, leaving residues at the ends. A new contact element 155n was inserted at new fastening points on the bridging line 115 and on the printed circuit board connection region 140. As a result, it was possible to avoid a waste specimen of the semiconductor module and to convert it into a functional specimen in order to drive the sustainability of the production process into the height as a result of the increased product yield.Individual connection regions 145 a, 145 band / or 145 cof the integrated semiconductor circuit 105, which are provided for contacting individual pins of the integrated semiconductor circuit 105, can be contacted onto the corresponding printed circuit board connection regions 140 a, 140 band / or 140 cof the printed circuit board 120 by the bridging lines 115 a, 115 b, and / or 115 cof the bridging element 110 illustrated in this figure and also in further figures. By using this bridging element 110, the individual, usually very small, connection regions 145 of the integrated semiconductor circuit 105 can thus be electrically connected very efficiently to the corresponding printed circuit board connection regions 140 of the printed circuit board 120.FIG. 6 shows an enlarged plan view of the arrangement of the individual components of a semiconductor module 100. It can be seen here that the individual connection regions 145 of the integrated semiconductor circuit 105 can be contacted with the corresponding connection regions 145 of the integrated semiconductor circuit 105 via the respective bridging lines 115 of the bridging element onto the individual printed circuit board connection regions 140 of the printed circuit board 120 by means of the corresponding contact elements 150 a, 150 band / or 150 cor 155 a, 155 band / or 155 c. The arrow heads in the illustration at the contact elements 150 a- cand 155 a- cindicates in which direction it is possible to bond advantageously. It can also be seen from FIG. 6 that the individual printed circuit board connection regions 140 spatially assume a larger area than the corresponding connection regions 145 of the integrated semiconductor circuit, so that, for example, a faulty setting of the second contact elements 155 for contacting the respective jumper line 115 with the corresponding printed circuit board connection region 140 can also be corrected again in the event of a fault by virtue of the fact that this faulty set second contact element 145 can be removed again and set again at a new location of the respective jumper line 115 or of the corresponding printed circuit board connection region 140. In this way, even in the case of contaminated printed circuit board connection regions 140, by virtue of such a multiple "probing" of the production of an electrical connection, said electrical connection can also be actually implemented with high probability or reliability, with the result that reliable electrical contacting of the integrated semiconductor circuit 105 with the corresponding connections of the printed circuit board 120 is possible.FIG. 7 shows a flow diagram of an exemplary embodiment of a method 500 for producing a variant of a semiconductor module presented here, wherein the method 500 comprises a step 510 of providing an integrated semiconductor circuit, which is electrically contactable or contacted via at least one connection region, a printed circuit board having at least one electronic component, which is electrically contactable or contacted via at least one printed circuit board connection region and comprises a bridging element having at least one electrical bridging line. Furthermore, the method 500 comprises a step 520 of connecting the jumper line by means of a first contact element to the connection region of the semiconductor circuit and by means of a second contact element to the printed circuit board connection region, in order to produce the semiconductor module. Optionally, the method 500 comprises a further step 530 of checking an electrical conductivity between the connection region and the jumper line and / or between the jumper line and the printed circuit board connection region and / or between the connection region and the printed circuit board connection region. Following this, a step 540 of removing the first and / or second contact element can be provided if no electrical conductivity has been detected between the connection region and the jumper line and / or between the jumper line and the circuit board connection region and / or between the connection region and the circuit board connection region. Finally, a step 550 of renewed connection of the bridging line to the connection region of the semiconductor circuit by means of a new first contact element and / or to the printed circuit board connection region by means of a new second contact element in order to produce the semiconductor module can also be provided.FIG. 8 shows a block diagram of an exemplary embodiment of a control unit 600 for controlling steps of a method 500 for producing a variant of a semiconductor module presented here, wherein the control unit 600 comprises a unit 610 for providing an integrated semiconductor circuit, which is electrically contactable or contacted via at least one connection region, a printed circuit board having at least one electronic component, which is electrically contactable or contacted via at least one printed circuit board connection region and comprises a bridging element having at least one electrical bridging line. Furthermore, the control unit 600 comprises a unit 620 for connecting the jumper line by means of a first contact element to the connection region of the semiconductor circuit and by means of a second contact element to the printed circuit board connection region, in order to produce the semiconductor module. Optionally, the control unit 600 comprises a further unit 630 for checking an electrical conductivity between the connection region and the bridging line and / or between the bridging line and the printed circuit board connection region and / or between the connection region and the printed circuit board connection region. This can be followed by provision in a unit 640 for removing the second contact element if no electrical conductivity has been detected between the bridging line and the printed circuit board connection region and / or between the connection region and the printed circuit board connection region. Finally, a unit 650 for renewed connection of the jumper line to the printed circuit board connection region by means of a new second contact element can also be provided in order to produce the semiconductor module.The approach presented here addresses the aim of achieving a high bonding yield, which can be achieved by reliably connecting ASICs / sensors to a PCB with a very small bonding pad. Here, a small interposer board, which is made of, for example, a ceramic bridging element substrate and contains metallic conductor tracks on the surface, is used. This board is also considered "clean" because it also does not go through a soldering process in advance, unlike the circuit board. Thus, the yield from the sensor to the intermediate board is to be regarded as very high. The yield from the interposer to the PCB is relatively low, but may be post-bonded to both the interposer and the PCB. The relatively poor yield of the bond to the PCB and the subsequent bonding resulting therefrom no longer plays a role for the ASIC / sensor. A change to another, more expensive bonding system or redesign of an ASIC (under the proviso of "no active blow bonds) can thus be omitted. This allows a very cost-effective solution to be opened for broad application in the special sensor sector by using the intermediate board to increase the bond yield between ICs and PCBs.If an exemplary embodiment comprises an "and / or" combination between a first feature and a second feature, this is to be read in such a way that the exemplary embodiment has both the first feature and the second feature according to one embodiment and either only the first feature or only the second feature according to a further embodiment.Reference numerals denote reference numerals100 Semiconductor module 105 Semiconductor integrated circuit 110 Bridging element 115 Bridging line 120 Printed circuit board 125 Electronic component 130 Substrate 135 Adhesive layer 140 Printed circuit board connection region 145 Connection region of the semiconductor integrated circuit 150 First contact element 155 Second contact element 160 Recess 500 Method 510 Provision 520 Connection 530 Checking 540 Removal 550 Renewed connection 600 Control unit 610 Unit for providing a semiconductor integrated circuit 620 Unit for connecting the bridging line to the connection region of the semiconductor circuit 630 Unit for checking an electrical conductivity 640 Unit for removal 650 Unit for renewed connection of the bridging lineReferences included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedUS 2016 / 0148966 A1

[0004] EP 2 575 175 B1

[0005]

Claims

Semiconductor module (100) having the following features: - an integrated semiconductor circuit (105) which is electrically contactable or contacted via at least one connection region (145, 145a); - a printed circuit board (120) having at least one electronic component (125) which is electrically contactable or contacted via at least one printed circuit board connection region (140, 140a); and - a bridging element (110) having at least one electrical bridging line (115, 115a), wherein the bridging line (115, 115a) is contactable or contacted by means of a first contact element (150, 150a) with the connection region (145, 145a) of the integrated semiconductor circuit (105) and by means of a second contact element (155, 155a) with the printed circuit board connection region (140, 140a).Semiconductor module (100) according to Claim 1, wherein the bridging line (115, 115a) of the bridging element (110) is designed to electrically contact only the connection region (145, 145a) with the printed circuit board connection region (140, 140a), and / or wherein the first and / or second contact element (150, 150a, 155, 155a) is designed as a bonding wire.Semiconductor module (100) according to one of the preceding claims, in which the bridging element (110) has a ceramic bridging element substrate and / or wherein the integrated semiconductor circuit (105) is designed as an optical sensor, in particular a camera chip.Semiconductor module (100) according to one of the preceding claims, in which the jumper line is arranged in a plane, wherein the connection region (145, 145a) of the integrated semiconductor circuit (105) has a distance to the plane of the jumper line (115, 115a) of less than 0.2 mm and / or wherein the printed circuit board connection region (140, 140a) has a distance to the plane of the jumper line (115, 115a) of less than a thickness of the printed circuit board (120), in particular of less than 0.2 mm.Semiconductor module (100) according to one of the preceding claims, in which the bridging line (115, 115a) extends substantially over a width of the bridging element (110), and / or wherein the bridging line (115, 155a) substantially has a width which corresponds within a tolerance range to a width of the connection region (145, 145a) and / or of the printed circuit board connection region (140, 140a).Semiconductor module (100) according to one of the preceding claims, in which at least the integrated semiconductor circuit (105) and the bridging element (110) are arranged and / or fastened on a common substrate (130).Semiconductor module (100) according to Claim 6, in which the substrate (130) comprises a metal matrix composite (MMC), in particular an electrically conductive metal matrix composite, and / or the substrate (130) is formed free of conductor tracks and free of bond pads.Semiconductor module (100) according to Claim 6 or 7, in which the integrated semiconductor circuit is electrically conductively connected to the substrate (130) on a rear side.Semiconductor module (100) according to Claims 6 to 8, in which at least the integrated semiconductor circuit (105), the bridging element (110) and the printed circuit board (120) are arranged and / or fastened on an upper side of the common substrate (130), wherein the printed circuit board connection region (140, 140a) is arranged on the side of the printed circuit board (120) facing away from the substrate (130) and / or the printed circuit board (120) has a cutout (160) in which the integrated semiconductor circuit (105) and the bridging element (110) are arranged, in particular wherein an edge region of the cutout (160) is connected all around to the substrate (130).Semiconductor module (100) according to one of the preceding claims, in which the bridging line (115, 115a) is formed as a strip-shaped electrically conductive, in particular metallic surface.Semiconductor module (100) according to one of the preceding claims, in which the integrated semiconductor circuit (105) can be electrically contacted or is electrically contacted via at least one second connection region (145b) electrically insulated from the first connection region (145a), and in which the electronic component (125) or a further electronic component of the printed circuit board (120) can be electrically contacted or is electrically contacted via at least one further printed circuit board connection region (140b); wherein the bridging element (110) has at least one further electrical bridging line (115b) which can be contacted or is contacted by means of a third contact element (150b) with the further connection region (145b) of the integrated semiconductor circuit (105) and by means of a fourth contact element (155b) with the further printed circuit board connection region (140b).Semiconductor module (100) according to Claim 7, in which the further jumper line (115b) is arranged and / or aligned on the jumper element (110) substantially parallel to the jumper line (115a), and / or wherein the further jumper line (115b) and the jumper line (115a) are substantially identically shaped or removed.Semiconductor module (100) according to Claim 7 or 8, in which the integrated semiconductor circuit (105) is electrically contactable or contacted via at least one third connection region (145c) electrically insulated from the first and second connection regions (145a, 145b), and in which the electronic component (125), the further electronic component (125) and / or an additional component of the printed circuit board (120) is electrically contactable or contacted via at least one additional printed circuit board connection region (140c); wherein the bridging element (110) has at least one additional electrical bridging line (115c), which can be contacted or is contacted by means of a fifth contact element (150c) with the third connection region (145c) of the integrated semiconductor circuit (105) and by means of a sixth contact element (155c) with the further additional bridging line, in particular wherein the bridging line (115), the further bridging line (115b) and the additional bridging line (115c) are of the same design and / or are arranged at equal distances from one another.Semiconductor module (100) according to one of the preceding claims, in which the first and the second contact element (150, 150a, 155, 155a) are each formed as a bonding wire with edge bonding (wedge-wedge bonding) on both sides.Method (500) for producing a semiconductor module (100) according to one of Claims 1 to 9, wherein the method (500) has the following steps: - providing (510) a semiconductor integrated circuit (105) which is electrically contactable or contacted via at least one connection region (145, 145a), a printed circuit board (120) having at least one electronic component (125) which is electrically contactable or contacted via at least one printed circuit board connection region (140, 140a) and a bridging element (110) having at least one electrical bridging line (115, 115a); - connecting (520) the bridging line (115, 115a) by means of a first contact element (150, 150a) to the connection region (145, 145a) of the semiconductor integrated circuit (105) and by means of a second contact element (155, 155a) to the printed circuit board connection region (140, 140a) in order to produce the semiconductor module (100).Method (500) according to claim 10, comprising the further steps of: - checking (530) an electrical conductivity between the connection region (145, 145a) and the jumper line (115, 115a) and / or between the jumper line (115, 115a) and the printed circuit board connection region (140, 140a) and / or between the connection region (145, 145a) and the printed circuit board connection region (140, 140a); - removing (540) the first and / or second contact element (150, 150a, 155, 155a) if no electrical conductivity has been detected between the jumper line (115, 115a) and the printed circuit board connection region (140, 140a) and / or between the connection region (145, 145a) and the printed circuit board connection region (140, 140a); and - renewed (550) connection of the bridging line (115, 115a) to the printed circuit board connection region (140, 140a) by means of a new second contact element (150, 150a) in order to produce the semiconductor module (100).The method (500) of claim 11, wherein in the reconnect step (550), the new second contact element (155, 155a) is attached to a different location on the jumper line (115, 115a) than the second contact element (155, 155a) was attached.Control unit (600), which is configured to execute and / or control the steps (510, 520, 530, 540, 550) of the method (500) according to one of the preceding claims in corresponding units (610, 620, 630, 640, 650).

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