Method for cooling a distribution unit of automation technology using a microcontroller

Abstract

Method for cooling a distribution unit of automation technology with a microcontroller arranged in a plastic block, characterized in that compressed air at ambient temperature T1 is supplied to the microcontroller via a compressed air channel provided in the plastic block, the compressed air exiting from a nozzle provided at the end of the compressed air channel, wherein the compressed air nozzle is directed towards the microcontroller and the airflow, cooled to a temperature T2 due to expansion, serves to cool the microcontroller.

Description

[0001] The invention relates to a method for cooling a distribution unit in automation technology with a microcontroller.

[0002] Typical methods for cooling microcontrollers use fans that are placed near the microcontroller and create an airflow that serves to dissipate heat.

[0003] Such processes cannot be used for overmolded microcontrollers that are completely enclosed in a plastic block. Since microcontrollers encased in a plastic block can generate significant amounts of heat, effective cooling is always a challenge. The heat generated during operation is only insufficiently dissipated by the plastic. In some cases, the microcontroller's performance may need to be reduced to prevent overheating.

[0004] The object of the invention is to provide a method for cooling a distribution unit of automation technology with a microcontroller, which ensures effective cooling of the microcontroller.

[0005] This problem is solved by the method specified in claim 1.

[0006] The key idea of ​​the invention is to provide a compressed air duct in the plastic block that supplies compressed air at ambient temperature T1 to the microcontroller. This air exits from a nozzle provided at the end of the compressed air duct. The compressed air nozzle is directed toward the microcontroller. Due to the expansion of the compressed air, the air stream cooled to a temperature T2 serves to cool the microcontroller.

[0007] The invention is described in more detail below with reference to a drawing.

[0008] They show: Fig. 1 distribution unit for automation technology Fig. 2 Partial section of the printed circuit board from a distribution unit according to Fig. 1

[0009] Fig. Figure 1 shows an automation technology distribution unit with twelve M12 connectors (ifm electronic IO-Link Master AL1322). A plastic block, manufactured using injection molding technology, completely surrounds a printed circuit board located inside the housing.

[0010] Fig. 2 shows a section of the circuit board with several assembled electronic components and the M12 connectors before overmolding.

[0011] According to the invention, several compressed air ducts are provided in the plastic block, leading to individual components that can generate significant heat during operation, such as microcontrollers. Outlet nozzles are provided at the end of each compressed air duct. The outlet nozzles are arranged to direct the air flow toward the microcontrollers.

[0012] The ducts are supplied via a central compressed air connection. Compressed air is widely available in many manufacturing plants.

[0013] The function of the invention is explained in more detail below. The expansion of the compressed air (room temperature T1) at the outlet nozzles significantly cools the air. The air flow at temperature T2 can thus be used to effectively cool the microcontroller.

Claims

[1] Method for cooling a distribution unit of automation technology with a microcontroller arranged in a plastic block, characterized by that compressed air at ambient temperature T1 is fed to the microcontroller via a compressed air duct provided in the plastic block, which exits from a nozzle provided at the end of the compressed air duct, wherein the compressed air nozzle is directed towards the microcontroller and the air flow cooled to a temperature T2 due to the expansion serves to cool the microcontroller.

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