LASER LIGHT PROFILE MEASURING DEVICE AND LASER LIGHT PROFILE MEASURING METHOD

Abstract

Laser light profile measuring device (30), comprising: a reflection attenuation part (31) that reflects and attenuates at least part of an incident laser light (L) from a first direction (D1) in a direction different from the first direction in order to generate target laser light (L3) that propagates in the first direction; a detection unit (32) which is arranged on one side of the reflection attenuation part in the first direction and is configured to detect the target laser light; a heat sink (33) which covers at least part of the reflection attenuation part and the detection unit in a circumferential direction with respect to the first direction; a coolant supply unit (34) configured to forcibly supply a coolant towards the heat sink; and a rotating carrier part (35) which carries the reflection attenuation part, the heat sink and the coolant supply unit in order to be able to rotate them about a rotation axis (O) which extends in a horizontal direction.

Description

[0001] The present disclosure relates to a laser light profiling device and a laser light profiling method.

[0002] A well-known three-dimensional additive manufacturing process is selective laser melting (SLM). In this process, a desired modeled object is obtained by repeatedly applying heat with laser light to a metal powder placed in a chamber, then melting and curing it several times for each layer.

[0003] To obtain a satisfactory shaped object, it is necessary to accurately determine and adjust the laser light profile. A laser light profile refers to the beam diameter of the laser light and the spatial intensity distribution. In an SLM modeling device, it is important to directly measure the profile of the laser light used for the actual processing. Therefore, a measuring device must be arranged within the chamber. For example, Japanese Patent No. JP 6384589 B2 discloses a measuring device that includes a laser light attenuation device and a measuring unit for measuring the profile of the attenuated laser light.

[0004] Further prior art can be found in document US 2021 / 0 402 477 A1, which describes a laminating molding device.

[0005] The present invention is defined by the appended claims. In an SLM modeling apparatus, a square processing area is arranged in the chamber. Naturally, a laser light profile must be measured at a central portion of the processing area, and furthermore, a laser light profile must also be measured at a peripheral edge portion thereof in the same manner. However, the measuring apparatus disclosed in Japanese Patent No. JP 6384589 B2 is not only large in size with respect to its body but also only capable of measuring laser light in a predetermined direction. Therefore, there is a problem that accurate measurement of a laser light profile cannot be performed at the peripheral edge portion where the laser light is irradiated from a different direction and at a different angle than that in the central area.

[0006] The present disclosure has been made to solve the problems described above, and an object thereof is to provide a smaller laser light profile measuring apparatus and a laser light profile measuring method capable of measuring a laser light profile more accurately.

[0007] To solve the problems described above, a laser light profile measuring device according to the present disclosure includes a reflection attenuation part that reflects and attenuates at least a portion of the laser light incident from a first direction in a direction different from the first direction to generate measurement target laser light propagating in the first direction, a detection unit arranged on one side of the reflection attenuation part in the first direction and configured to detect the measurement target laser light, a heat sink covering at least a portion of the reflection attenuation part and the detection unit in a circumferential direction with respect to the first direction, a coolant supply unit configured to forcibly supply a coolant toward the heat sink, and a rotation support part supporting the reflection attenuation part, the heat sink, and the coolant supply unit.in order to be able to rotate them around a rotation axis that extends in a horizontal direction.

[0008] A laser light profile measuring method according to the present disclosure is a method for measuring the laser light profile of a laser processing apparatus comprising a chamber having a square processing area on which a workpiece is arranged, and a laser irradiation unit that irradiates laser light from an irradiation point above onto the processing area and scans the processing area, and the laser light profile measuring method includes a first step of arranging the above-described laser light profile measuring device at a central portion of the processing area to measure a laser light profile, and a second step of arranging the laser light profile measuring device along a peripheral edge portion of the processing area to sequentially measure a laser light profile, wherein the rotation support member is rotated,to align a radiation direction of the laser light with a first direction in the second step.,

[0009] Another laser light profile measuring method according to the present disclosure is a method for measuring the laser light profile of a laser processing apparatus including a chamber having a square-shaped processing area on which a workpiece is placed, and a laser irradiation unit that emits laser light, and the laser light profile measuring method includes an arranging step of arranging a near-field coupling element that reflects and attenuates at least a part of the laser light emitted from the laser irradiation unit to generate a measurement target laser light outside the chamber, and a measuring step of measuring a profile of the measurement target laser light.

[0010] According to the present disclosure, it is possible to provide a smaller laser light profile measuring apparatus and a laser light profile measuring method capable of measuring a laser light profile more accurately. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of a configuration of a laser processing apparatus according to a first embodiment of the present disclosure. Fig. 2 is a cross-sectional view showing a configuration of a laser light profiling device according to the first embodiment of the present disclosure. Fig. 3 is an enlarged view showing a configuration of a heat sink according to the first embodiment of the present disclosure. Fig. 4 is a cross-sectional view showing a configuration of a dissipation part according to the first embodiment of the present disclosure. Fig. 5 is a flowchart showing steps of a laser light profile measuring method according to the first embodiment of the present disclosure. Fig. 6 is an explanatory view showing a state of a second step of the laser light profile measuring method according to the first embodiment of the present disclosure. Fig. 7 is a view showing a modified example of a heat sink according to the first embodiment of the present disclosure, and is a view from a circumferential direction. Fig. 8 is a view showing a modified example of the heat sink according to the first embodiment of the present disclosure, and is a view from a radial direction. Fig. 9 is a cross-sectional view showing a configuration of a heat sink according to a second embodiment of the present disclosure. Fig. 10 is a schematic view showing a configuration of a laser light profiling apparatus according to a third embodiment of the present disclosure. Fig. 11 is a flowchart showing steps of a laser light profile measuring method according to the third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION<Erste Ausführungsform>

[0011] Hereinafter, a laser processing apparatus 1 and a laser light profile measuring apparatus 30 according to a first embodiment of the present disclosure will be described with reference to FIG. Fig. 1 to 6. (Laser processing device configuration)

[0012] The laser processing apparatus 1 according to the present embodiment is a modeling apparatus that uses a three-dimensional additive manufacturing method called selective laser melting (SLM). In this method, a desired modeled object is obtained by repeatedly applying heat with laser light to a metal powder contained in a chamber, followed by melting and curing each of a plurality of layers.

[0013] As in Fig. 1, the laser processing apparatus 1 includes a chamber 10 and a laser irradiation unit 20. The chamber 10 is box-shaped with a square processing area 11 on an inner bottom surface. The laser irradiation unit 20 irradiates and scans laser light L from an irradiation point P provided above onto the processing area 11. When the laser light L is irradiated and scanned along a predetermined path with a metal powder supplied from a powder supply device (not shown), the metal powder is melted and solidified to form a layer of the modeled object. The modeled object is formed by repeating this process over a plurality of layers. (Configuration of the laser light profile measuring device)

[0014] To obtain a satisfactory shaped object by the laser processing apparatus 1 described above, it is necessary to accurately determine and adjust a profile of the laser light L. The profile of the laser light L refers to a beam diameter of the laser light L and a spatial intensity distribution. The laser light profile measuring device 30 according to the present embodiment is used to measure such a profile of the laser light L at a central portion 11a and a peripheral edge portion 11b of the processing area 11. Further, the peripheral edge portion 11b, as used herein, refers to a corner portion and a portion along a side portion of the square processing area 11. The laser light profile measuring device 30 is used while being arranged at the central portion 11a and the peripheral edge portion 11b.

[0015] As in Fig. 2, the laser light profile measuring device 30 comprises a reflection attenuation part 31, a detection unit 32, a heat sink 33, a coolant supply unit 34 and a rotation support part 35.

[0016] The reflection attenuation part 31 reflects at least a portion of the incident laser light L in a direction deviating from the incident direction and attenuates the remaining non-reflected portions, thereby generating the measurement target laser light L3. Here, the incident direction of the laser light L is referred to as the first direction D1.

[0017] The reflection attenuation part 31 includes a reflection attenuation element 31a and a near-field coupling element 31b. The reflection attenuation element 31a is an optical element formed in a plate shape and arranged on a path of the laser light L in a state inclined by approximately 45° with respect to the first direction D1. The reflection attenuation element 31a reflects at least a portion of the incident laser light L in a direction intersecting the first direction D1 by 90°, thereby generating a first reflected light L1. Of all the components of the laser light L, the remaining components except for the first reflected light L1 travel in the first direction D1.

[0018] The near-field coupling element 31b is provided on one side of the reflection attenuation element 31a in the first direction D1, i.e., below the reflection attenuation element 31a. The near-field coupling element 31b is a known optical element, as disclosed, for example, in PCT International Publication No. WO 2017 / 209277. The near-field coupling element 31b is configured such that two prisms oppose each other with a gap between them. By generating near-field light and coupling it between opposing surfaces, it is possible to change the ratio of transmission and reflection of light at the opposing surfaces.

[0019] In the present embodiment, when the above-described laser light L is incident on the near-field coupling element 31b, some of the components are reflected and travel in a direction other than the first direction D1 (second reflected light L2). The remaining components of the laser light L, except for the second reflected light L2, pass through the near-field coupling element 31b and travel in the first direction D1. The light that thus passes through the reflection attenuation element 31a and the near-field coupling element 31b and travels in the first direction D1 is referred to as measurement target laser light L3. The measurement target laser light L3 has the same beam diameter and spatial intensity distribution as the original laser light L, while the intensity is reduced compared to the original laser light L.

[0020] The detection unit 32 is arranged below the reflection attenuation part 31 (on one side in the first direction D1). The detection unit 32 is, for example, a CCD camera. The detection unit 32 detects the measurement target laser light L3 and transmits it as image data to an external computing device or the like. A laser light profile of the measurement target laser light L3 can be obtained by calculation by the computing device.

[0021] The reflection attenuation part 31 and the above-described detection unit 32 are supported by a support frame 31c. The support frame 31c includes a first opening 31d for guiding the first reflected light L1 outward and a second opening 31e for guiding the second reflected light L2 outward. The support frame 31c is supported by the coolant supply unit 34 (described later) from one side (bottom side) in the first direction D1.

[0022] The heat sink 33 is provided on an outer peripheral side of the reflection attenuation part 31 and the detection unit 32. The heat sink 33 covers at least a part of the reflection attenuation part 31 and the detection unit 32 in a circumferential direction relative to the first direction D1. In the present embodiment, the heat sink 33 has a cylindrical shape that covers the reflection attenuation part 31 and the detection unit 32 in the entire circumferential direction.

[0023] The heat sink 33 includes a cylindrical portion 33a, fins 33b, a heat shield plate 33c, and a heat-insulating material 33d. The cylindrical portion 33a has a cylindrical shape centered along the first direction D1. The fins 33b protrude radially outward from an outer peripheral surface of the cylindrical portion 33a and are spaced apart in the circumferential direction. The fins 33b each have a plate shape that extends continuously in the first direction D1 of the cylindrical portion 33a.

[0024] As in Fig. As shown in Figure 3, the rib 33b is shaped such that its circumferential thickness gradually increases from a radially inner side to an outer side when viewed from the first direction D1. Therefore, a space between the circumferentially adjacent ribs 33b has a rectangular shape when viewed from the first direction D1. Furthermore, a space between the ribs 33b serves as a coolant flow path F through which air flows as a coolant, which will be described later.

[0025] As in Fig. As shown in Figure 2, the fins 33b are covered by double concentric heat shield plates 33c, which have a cylindrical shape from an outer peripheral side. It is advantageous for the heat shield plates 33c to be made of aluminum, for example. A gap extending in the radial direction is formed between the heat shield plates 33c. A portion of the air, which will be described later, also flows into the gap as a coolant. The heat-insulating material 33d is provided on another outer peripheral side of the outer heat shield plate 33c.

[0026] Here, an opening 33g is formed in a region of the cylindrical part 33a through which the first reflected light L1 passes. Furthermore, a deflection part 33f is provided on the outer peripheral side of the opening 33g. That is, the above-described ribs 33b are not provided in the region where the deflection part 33f is provided. The deflection part 33f is provided to attenuate the first reflected light L1. As shown in Fig. As shown in FIG. 4, the deflection part 33f includes a conical part 331 and an outer peripheral wall part 332. The conical part 331 has a conical shape with a diameter that gradually increases toward a front side in a propagation direction of the first reflected light L1 (i.e., radially outward with respect to the first direction D1). The outer peripheral wall part 332 has a cylindrical shape that covers the conical part 331 from the outside.

[0027] The first reflected light L1 incident on the diverting part 33f passes through an apex part of the conical part 331, repeats the reflection between an inner peripheral surface of the outer peripheral wall part 332 and an outer peripheral surface of the conical part 331, and is finally scattered and attenuated.

[0028] As in Fig. As shown in Figure 2, the coolant supply unit 34 is provided on one side of the reflection-attenuating part 31, the detection unit 32, and the heat sink 33 in the first direction D1, i.e., below the reflection-attenuating part 31, the detection unit 32, and the heat sink 33. The coolant supply unit 34 is, for example, a fan. The coolant supply unit 34 forcibly supplies air as the coolant to the above-described coolant flow path F. Furthermore, it is also conceivable to use liquid nitrogen as the coolant in addition to air.

[0029] The reflection attenuation part 31, the detection unit 32, the heat sink 33, and the coolant supply unit 34 configured as described above are supported on a plane (on the machining area 11) by the rotation support part 35 from one side (i.e., from below) in the first direction D1. The rotation support part 35 includes a base 35a, a first frame 35b, and a second frame 35c. The first frame 35b is in the shape of a plate that rises from the base 35a in the first direction D1. The second frame 35c is connected to the first frame 35b and can be rotated about a rotation axis O extending in the horizontal direction. That is, angles of the reflection attenuation part 31, the detection unit 32, the heat sink 33, and the coolant supply unit 34 can be integrally changed with respect to the base 35a with the rotation axis O as the center.Furthermore, although not shown in detail, an actuator may be provided for driving the rotary support member 35, or a configuration for manually rotating the rotary support member 35 may be used. (Measurement method of the laser light profile)

[0030] Next, an example of a method of using the laser light profile measuring device 30 (measuring method of a laser light profile) will be described with reference to FIG. Fig. 5 and Fig. 6. As described in Fig. 5, this measuring method comprises a first step S11 and a second step S12. In the first step S11, the laser light profile measuring device 30 is arranged at the central portion 11a of the above-described processing area 11 to measure a laser light profile. At this time, the laser light L moves vertically downward from the irradiation point P. Therefore, the laser light profile measuring device 30 is in a Fig. 2 shown condition.

[0031] Next, in the second step S12, the laser light profile measuring device 30 is arranged at the peripheral edge portion 11b of the processing area 11, and the laser light profile measurement is performed. At this time, the laser light L is emitted obliquely downward from the irradiation point P. Therefore, as shown in Fig. 6 illustrates a position of the laser light profiling device 30 in a state where an incident direction of the laser light L is aligned with the first direction D1 by rotating the rotary support member 35. All steps of the laser light profiling method are completed by performing the second step S12 for each of a plurality of peripheral edge portions 11b. (Functionality and effects)

[0032] When measuring a laser light profile of an SLM modeling device, there is a problem that the measurement can only be performed in the central portion 11a of the processing area 11 due to the large body size of the measuring device or the laser can only be measured in a predetermined direction. That is, it is difficult to perform accurate measurement of a laser light profile in the peripheral edge region 11b where the laser light L is emitted from a different direction and at a different angle than the central region 11a. Furthermore, since a high-power laser with a power of several hundred watts is used in the SLM modeling device, it is difficult to manage the generated heat while adequately attenuating the laser light. Therefore, the laser light profile measuring device 30 according to the present embodiment adopts the configurations described above.

[0033] According to the configuration described above, the reflection attenuation part 31 and the detection unit 32 can be cooled via the heat sink 33 when the coolant is supplied to the heat sink 33. This allows the heat generated by the reflection and attenuation of the high-power laser light L to be dissipated into the coolant. Since the device is equipped with the rotation support part 35, the laser light profile can be measured even when the emission direction of the laser light L changes. That is, even in the peripheral edge portion 11b where the emission direction of the laser light L is different from that of the central portion 11a, the laser light profile can be accurately measured by changing a posture of the entire device using the rotation support part 35.Furthermore, according to the above-described configuration, the fins 33b of the heat sink 33 are each formed such that the circumferential thickness gradually increases from the radially inner side to the outer side. As a result, a space (coolant flow path F) between the fins 33b is rectangular when viewed from the first direction D1. Therefore, unlike a case where the fin 33b has, for example, a simple rectangular plate-shaped cross section, the width of the flow path through which the coolant flows can be kept constant inside and outside the radial direction. As a result, the flow rate distribution of the coolant between the fins 33b in the radial direction is constant, and the heat sink 33 can be cooled more efficiently.Furthermore, according to the above-described configuration, since the device is provided with the diverter 33f, the laser light (first reflected light L1) reflected by the reflection attenuation part 31 is attenuated and converted into heat by being radiated to the diverter 33f. This can further reduce the likelihood that the heat generated by the reflection of the laser light will affect other external devices and components.

[0034] According to the configuration described above, the deflection part 33f also has the conical part 331. Laser light incident on the apex of the conical part 331 is scattered around the apex. This allows the laser light to be attenuated more effectively.

[0035] Furthermore, according to the laser light profile measurement method described above, in the first step S11, a laser light profile is measured at the central portion 11a of the processing area 11, and then in the second step S12, a laser light profile is measured at the peripheral edge portion 11b. At this time, a direction of the reflection attenuation part 31 and the detection unit 32 can be aligned with the irradiation direction of the laser light L by rotating the rotary support part 35. Therefore, the laser light profile measurement can be performed with high accuracy even at the peripheral edge portion 11b, similar to the central portion 11a.

[0036] The first embodiment of the present disclosure has been described above. Furthermore, various changes and modifications can be made to the above-described configurations and methods without departing from the gist of the present disclosure. For example, the above-described configuration of the rotation support part 35 is an example, and any configuration that can rotate (change) a posture of the entire apparatus is encompassed by the present disclosure. In the above-described first embodiment, an example was also described in which the detection unit 32 is supported so as to be rotatable by the rotation support part 35. In this case, defocusing of the laser light can be detected even at the peripheral edge portion 11b of the processing area 11.On the other hand, it is also possible to employ a configuration in which the detection unit 32 is disposed on a floor surface (machining area 11) to restrict rotation while being isolated from the rotation support member 35 and maintained parallel to the machining area 11. Furthermore, the term "parallel" as used herein refers to substantially parallel, and a slight error is acceptable. In this case, the ovalized appearance of the laser light profile on the floor surface can be detected in addition to the defocusing of the laser light at the peripheral edge portion 11b.

[0037] As a modified example for the rib 33b, the Fig. 7 and Fig. 8 shown configurations can be used. In the configuration shown in the Fig. 7 and Fig. In the example shown in Figure 8, the rib 33b is curved such that a first end surface 332b facing one side in the first direction D1 is convex toward one side (bottom side) in the first direction D1 when viewed from the circumferential direction. Furthermore, a second end surface 331b facing the other side is curved such that it is concave toward one side (bottom side) in the first direction D1.

[0038] As in Fig. 8, the positions in the circumferential direction between the ribs 33b adjacent in the first direction D1 are also different.

[0039] According to the above-described configuration, the first and second end surfaces of the fin 33b are each curved toward one side in the first direction D1. That is, both the first and second end surfaces of the fin 33b are curved toward a side into which the coolant flows. This can reduce the likelihood of flow separation occurring during the inflow of the coolant. As a result, the heat sink 33 can be cooled more efficiently. <Zweite Ausführungsform>

[0040] Next, a second embodiment of the present disclosure will be described with reference to Fig. 9. Furthermore, the same components as in the first embodiment described above are denoted by the same reference numerals, and a detailed description thereof will be omitted. As in Fig. 9, the configuration of a heat sink 33 is different in the present embodiment. The heat sink 33 further includes a transmission window 33h that blocks the above-described opening 33g from an inner peripheral side. The transmission window 33h is a transparent member made of, for example, glass, capable of transmitting first reflected light L1. Furthermore, a space V defined by the transmission window 33h, a dissipation part 33f, and an inner wall surface of the opening 33g is filled with water W (liquid).

[0041] According to the configuration described above, the space V defined by the transmission window 33h and the dissipation part 33f is filled with water W, whereby the energy of the laser light (first reflected light L1) is absorbed by the water. As a result, the probability of the heat of the laser light leaking out can be further reduced.

[0042] The second embodiment of the present disclosure has been described above. Furthermore, various changes and modifications can be made to the above-described configurations and methods without departing from the essence of the present disclosure. For example, other liquids such as alcohol, oil, or the like can be used instead of the above-described water W. <Dritte Ausführungsform>

[0043] Next, a third embodiment of the present disclosure will be described with reference to the Fig. 10 and Fig. 11. Furthermore, the same components as in the above-described embodiments are denoted by the same reference numerals, and a detailed description thereof will be omitted. As in Fig. 10, a laser processing apparatus 1b according to the present embodiment includes a chamber 10 having a processing area 11, a laser irradiation unit 20 for irradiating laser light L, a near-field coupling element 31b arranged on a path of the laser light L, a measuring unit 40, and a laser scanning unit 50.

[0044] The near-field coupling element 31b reflects at least a portion of the laser light L emitted by the laser irradiation unit 20 and directs it as main laser light L4 to the laser scanning unit 50. The laser scanning unit 50 scans the processing area 11 with the incident main laser light L4. The remaining components transmitted through the near-field coupling element 31b, however, are measurement target laser light L3. The measuring unit 40 is arranged in a path of the measurement target laser light L3. The measuring unit 40 is, for example, a CCD camera and measures the laser light profile of the measurement target laser light L3.

[0045] An example of a laser light profile measurement method using the laser processing apparatus 1b described above will be described. As shown in Fig. As shown in Figure 11, the near-field coupling element 31b is first arranged at the above-described position outside the chamber 10 (arrangement step S21). Subsequently, the laser light L is emitted from the laser irradiation unit 20, thereby modeling a workpiece on the processing area 11. In the middle of this, the laser light profile of the measurement target laser light L3 transmitted through the near-field coupling element 31b is measured (measurement step S22). This measurement step S22 is performed intermittently or continuously until the processing of a modeled object is completed.

[0046] According to the method described above, the measurement target laser light L3 is generated from a portion of the laser light L by the near-field coupling element 31b arranged outside the chamber 10. In measurement step S22, a profile of the measurement target laser light L3 is measured. This allows a profile of the laser light used for actual machining (main laser light L4) outside the chamber 10 to be measured in real time. As a result, molding can be performed with higher accuracy, and at the same time, if an abnormality occurs, it can be detected immediately, and countermeasures can be taken.

[0047] The third embodiment of the present disclosure has been described above. Furthermore, various changes and modifications may be made to the above-described configurations and methods without departing from the spirit of the present disclosure. <Zusätzliche Erklärung>

[0048] The laser light profiling device 30 and the laser light profiling method described in the embodiments are, for example, as follows. (1) A laser light profiling device 30 according to a first aspect includes a reflection attenuation part 31 that reflects and attenuates at least a portion of the laser light L incident from a first direction D1 in a direction deviating from the first direction D1 to generate measurement target laser light L3 propagating in the first direction D1; a detection unit 32 disposed on a side of the reflection attenuation part 31 in the first direction D1 and configured to detect the measurement target laser light L3; a heat sink 33 covering at least a portion of the reflection attenuation part 31 and the detection unit 32 in a circumferential direction with respect to the first direction D1; and a coolant supply unit 34 configured toto forcibly supply a coolant toward the heat sink 33, and a rotation support member 35 which supports the reflection attenuation member 31, the heat sink 33 and the coolant supply unit 34 to rotate them about a rotation axis O extending in a horizontal direction.

[0049] According to the configuration described above, the reflection attenuation part 31 and the detection unit 32 can be cooled via the heat sink 33 when a coolant is supplied to the heat sink 33. This allows the heat generated by the reflection and attenuation of the high-power laser light L to be dissipated into the coolant. Since the device is equipped with the rotation support part 35, even if the radiation direction of the laser light L changes, a laser light profile can be measured that follows the change.

[0050] (2) A laser light profiling device 30 according to a second aspect is the laser light profiling device 30 of the first aspect, in which the heat sink 33 may include a plurality of fins 33b extending in the first direction D1 and arranged at intervals in the circumferential direction, and the fins 33b may each be formed such that the circumferential thickness gradually increases from a radially inner side to an outer side.

[0051] According to the above-described configuration, each fin 33b is formed such that the circumferential thickness gradually increases from the radially inner side to the outer side. Therefore, a space between the fins 33b is rectangular when viewed from the first direction D1. Therefore, unlike a case where the fin 33b has, for example, a simple rectangular plate-shaped cross section, the width of a flow path through which the coolant flows can be kept constant inside and outside the radial direction. As a result, the flow distribution of the coolant between the fins 33b in the radial direction is constant, and the heat sink 33 can be cooled more efficiently.

[0052] (3) A laser light profiling device 30 according to a third aspect is the laser light profiling device 30 of the first aspect, in which the heat sink 33 may include a plurality of fins 33b arranged at intervals in the first direction D1 and the circumferential direction, and the fins 33b adjacent in the first direction D1 may have different positions from each other in the circumferential direction.

[0053] According to the configuration described above, the circumferential positions between the fins 33b adjacent in the first direction D1 are different. This increases the contact area of ​​the coolant with respect to the fins 33b, and the heat sink 33 can be cooled more efficiently.

[0054] (4) A laser light profile measuring device 30 according to a fourth aspect is the laser light profile measuring device 30 of the third aspect, in which a first end surface of the rib 33b facing one side in the first direction D1 may be convexly curved to one side in the first direction D1 as viewed from the circumferential direction, and a second end surface of the rib 33b facing the other side in the first direction D1 may be concavely curved to one side in the first direction D1 as viewed from the circumferential direction.

[0055] According to the above-described configuration, the first and second end surfaces of the fin 33b are each curved toward one side in the first direction D1. That is, the first and second end surfaces of the fin are curved toward a side into which the coolant flows. This can reduce the likelihood of flow separation occurring when the coolant flows in, and the heat sink 33 can be cooled more efficiently.

[0056] (5) A laser light profiling device 30 according to a fifth aspect is the laser light profiling device 30 according to any one of the first to fourth aspects, in which the reflection attenuation part 31 and the detection unit 32 can be continuously covered in the circumferential direction by the heat sink 33.

[0057] According to the configuration described above, the reflection attenuation part 31 and the detection unit 32 can be cooled uniformly in the entire circumferential direction by the heat sink 33.

[0058] (6) A laser light profiling device 30 according to a sixth aspect is the laser light profiling device 30 according to any one of the first to fifth aspects, in which an opening 33g through which the laser light reflected by the reflection attenuation part 31 passes may be formed in the heat sink 33, and a diverting part 33f which attenuates the reflected laser light may be arranged on an outer peripheral side of the opening 33g.

[0059] According to the configuration described above, since the device is provided with the diverter 33f, the laser light reflected by the reflection attenuation part 31 is attenuated by being radiated to the diverter 33f. This can further reduce the likelihood that the heat generated by the reflection of the laser light will affect other external devices and components.

[0060] (7) A laser light profile measuring device 30 according to a seventh aspect is the laser light profile measuring device 30 of the sixth aspect, in which the diverting part 33f may include a conical part 331 having a diameter that gradually increases toward a front side in a propagation direction of the reflected laser light.

[0061] According to the configuration described above, laser light incident on an apex portion of the conical portion 331 scatters around the apex portion. This allows the laser light to be attenuated more effectively.

[0062] (8) A laser light profiling device 30 according to an eighth aspect is the laser light profiling device 30 of the sixth or seventh aspect, in which the heat sink 33 may further include a transmission window 33h that blocks the opening 33g through which the reflected laser light can be transmitted, and a space V defined by the transmission window 33h and the dissipation part 33f may be filled with a liquid.

[0063] According to the configuration described above, the space V defined by the transmission window 33h and the dissipation part 33f is filled with a liquid. As a result, the energy of the laser light is absorbed by the liquid. As a result, the probability of the heat of the laser light leaking out can be further reduced.

[0064] (9) A laser light profile measuring device 30 according to a ninth aspect is the laser light profile measuring device 30 according to any one of the first to eighth aspects, in which the detection unit 32 can be supported by the rotation support part 35 to be able to rotate it about the rotation axis O.

[0065] According to the configuration described above, defocusing of the laser light profile can be detected by the detection unit 32 even at a peripheral edge portion of a processing area.

[0066] (10) A laser light profile measuring device 30 according to a tenth aspect is the laser light profile measuring device 30 according to any one of the first to eighth aspects, in which the detection unit 32 can be arranged on a floor surface to restrict rotation while being isolated from the rotation support part and to be parallel to the machining area 11 separated from the rotation support part 35.

[0067] According to the configuration described above, defocusing of the laser light profile and the occurrence of it being ovalized can be detected by the detection unit 32 even at the peripheral edge portion of the processing area.

[0068] (11) A laser light profile measuring method according to an eleventh aspect is a method for measuring the laser light profile of a laser processing apparatus 1 comprising a chamber 10 having a square-shaped processing area 11 on which a workpiece is arranged, and a laser irradiation unit 20 that irradiates laser light L from an irradiation point P above the processing area 11 onto the processing area 11 and scans the processing area 11. The laser light profile measuring method includes a first step S11 in which a laser light profile measuring device 30 according to any one of the first to tenth aspects is arranged at a central portion 11a of the processing area 11 to measure a laser light profile, and a second step S12 in which the laser light profile measuring device 30 is arranged along a peripheral edge portion 11b of the processing area 11 to sequentially measure a laser light profile.wherein the rotation support member 35 is rotated to align the radiation direction of the laser light L with a first direction D1 in the second step S12.

[0069] According to the method described above, in the first step S11, a laser light profile is measured at the central portion 11a of the processing area 11, and then in the second step S12, a laser light profile is measured at the peripheral edge portion 11b. At this time, a direction of the reflection attenuation part 31 and the detection unit 32 can be aligned with the irradiation direction of the laser light L by rotating the rotary support part 35. Therefore, the measurement of the laser light profile can be performed with high accuracy even at the peripheral edge portion 11b, similar to the central portion 11a.

[0070] (12) A laser light profile measuring method according to a twelfth aspect is a method for measuring the laser light profile of a laser processing apparatus 1b including a chamber 10 having a square processing area on which a workpiece is placed, and a laser irradiation unit 20 that emits laser light. The laser light profile measuring method includes an arrangement step S21 in which a near-field coupling element 31b that reflects and attenuates at least a part of the laser light L emitted from the laser irradiation unit 20 to generate measurement target laser light L3 is arranged outside the chamber 10, and a measurement step S22 in which a profile of the measurement target laser light L3 is measured. According to the method described above, the measurement target laser light L3 is generated from a part of the laser light by the near-field coupling element 31b arranged outside the chamber 10. In measurement step S22, a profile of the target laser light L3 is measured.In this way, a profile of the laser light used for the actual processing can be measured outside the chamber 10 in real time.

[0071] While preferred embodiments of the invention have been described and illustrated above, it should be understood that these are exemplary of the invention and are not to be considered limiting. Accordingly, the invention is not to be considered limited by the foregoing description, but is limited only by the scope of the appended claims. 1, 1b Laser processing device 10 chambers 11 Editing area 11a Central Section 11b Peripheral edge section 20 laser irradiation units 30 laser light profile measuring device 31 Reflection attenuation part 31a Reflection attenuation element 31b Near-field coupling element 31c supporting frame 31d First opening 31e Second Opening 32 registration unit 33 heat sinks 33a Cylinder part 33b Rib 33c heat shield plate 33d Heat-insulating material 33f discharge section 33g opening 33h transmission window 34 Coolant supply unit 35 Rotation support part 35a socket 35b First frame 35c Second frame 40 measuring units 50 laser scanning unit 331 Conical part 332 Perimeter wall section 331b, 332b end face D1 First Direction F Coolant flow path L Laser light L1 First reflected light L2 Second reflected light L3 Target laser light L4 Main laser light O axis of rotation P Irradiation point V Room W Water (liquid)

Claims

[1] Laser light profile measuring device (30), comprising: a reflection attenuation part (31) that reflects and attenuates at least a part of a laser light (L) incident from a first direction (D1) in a direction different from the first direction to generate measurement target laser light (L3) propagating in the first direction; a detection unit (32) arranged on one side of the reflection attenuation part in the first direction and configured to detect the measurement target laser light; a heat sink (33) covering at least a part of the reflection attenuation part and the detection unit in a circumferential direction with respect to the first direction; a coolant supply unit (34) configured to forcibly supply a coolant toward the heat sink; and a rotation support part (35) which supports the reflection attenuation part, the heat sink and the coolant supply unit in order to be able to rotate them about a rotation axis (O) extending in a horizontal direction. [2] Laser light profile measuring device according to claim 1, wherein the heat sink comprises a plurality of fins (33b) extending in the first direction and arranged at intervals in the circumferential direction, and the ribs are each formed such that the circumferential thickness gradually increases from a radial inner side to an outer side. [3] Laser light profile measuring device according to claim 1, wherein the heat sink comprises a plurality of fins (33b) arranged at intervals in the first direction and the circumferential direction, and the ribs which are adjacent in the first direction have different positions relative to each other in the circumferential direction. [4] Laser light profile measuring device according to claim 3, wherein a first end surface (332b) of the rib (33b) facing a side in the first direction is curved so as to be convex toward a side in the first direction as viewed from the circumferential direction, and a second end surface (331b) of the rib (33b) facing the other side in the first direction is curved so as to be concave toward one side in the first direction as viewed from the circumferential direction. [5] The laser light profile measuring device according to any one of claims 1 to 4, wherein the reflection attenuation part and the detection unit are continuously covered by the heat sink in the circumferential direction. [6] Laser light profile measuring device according to one of claims 1 to 5, wherein an opening (33g) through which the laser light reflected by the reflection attenuation part passes is formed in the heat sink, and a diverting part (33f) which attenuates the reflected laser light is arranged on an outer peripheral side of the opening. [7] The laser light profile measuring device according to claim 6, wherein the diverting part comprises a conical part (331) having a diameter gradually increasing toward a front side in a propagation direction of the reflected laser light. [8] Laser light profile measuring device according to claim 6 or 7, wherein the heat sink further comprises a transmission window (33h) blocking the opening through which the reflected laser light can be transmitted, and wherein a space (V) defined by the transmission window and the discharge part is filled with a liquid (W). [9] Laser light profile measuring device according to one of claims 1 to 8, wherein the detection unit is supported by the rotation support part in order to be able to rotate it about the rotation axis. [10] A laser light profile measuring device according to any one of claims 1 to 8, wherein the detection unit is arranged on a bottom surface to restrict rotation while being isolated from the rotation support member, and is supported to be parallel to a square-shaped machining area (11) on which a workpiece is arranged. [11] A laser light profile measuring method, which is a method for measuring the laser light profile of a laser processing device (1, 1b), comprising: a chamber (10) having a square machining area on which a workpiece is placed; and a laser irradiation unit (20) which radiates laser light from an irradiation point (P) above onto the processing area and scans the processing area, wherein the laser light profile measurement method comprises: a first step of arranging a laser light profile measuring device according to any one of claims 1 to 10 at a central portion of the processing area to measure a laser light profile; and a second step in which the laser light profile measuring device is arranged along a peripheral edge portion (11b) of the processing area to sequentially measure a laser light profile, wherein the rotation support member (35) is rotated to align a radiation direction of the laser light with a first direction in the second step.

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