Device and method for the thermal treatment of a body to be thermally treated

Abstract

The invention relates to a device (100) for the thermal treatment of a body (101, 102, 103) to be thermally treated, in particular for the thermal joining of a first partial body (101) with a second partial body (102) to form a composite body (103) at an interface (104) formed between the first partial body (101) and the second partial body (102). The device (100) further comprises a jacket body (105), a temperature-controlled chamber (108) within a temperature control unit (106), and a heating element (109), wherein the jacket body (105) is configured to enclose the body (101, 102, 103) to be thermally treated without contact before, during, and after the thermal treatment.The invention also relates to a method for thermally treating a body (101, 102, 103) to be thermally treated, and in particular to high-temperature bonding of a first partial body (101) with a second partial body (102) to form a composite body (103) by means of the device (100). The invention further relates to an optical element (609), in particular a reflective optical element, further in particular for reflecting EUV radiation (610), and further in particular an optical element (609) tempered via a channel (208) through which a medium flows, in particular a tempered reflective optical element (609).The invention also relates to a semiconductor technology system (700) with at least one optical element (609), in particular with a temperature-controlled optical element (609), and further in particular with a temperature-controlled, reflective optical element (609) which is temperature-controlled via a channel (208) by means of one of the temperature control devices (723-733).

Description

Background of the invention

[0001] The invention relates to a device for thermally treating a body to be thermally treated, in particular for thermally bonding a first partial body to a second partial body to form a composite body, furthermore, in particular for high-temperature bonding. Furthermore, the invention relates to a method for thermally treating a body to be thermally treated, in particular for thermally bonding a first partial body to a second partial body to form a composite body, furthermore, in particular for high-temperature bonding, at an interface formed between the first partial body and the second partial body.The invention further relates to an optical element, in particular a reflective optical element for reflecting EUV radiation, furthermore in particular to an element tempered via a channel through which a medium flows, in particular to an element tempered via a channel through which a medium flows, furthermore in particular to an optical element tempered via a channel through which a medium flows, furthermore in particular to a reflective optical element tempered via a channel through which a medium flows. The invention furthermore relates to a semiconductor technology system having at least one optical element, furthermore in particular a reflective optical element, which is tempered via a channel by means of one of the tempering devices, furthermore in particular to a projection exposure system for EUV semiconductor lithography or a mask inspection system, or a wafer inspection system.

[0002] In microlithography, micro- and nano-structured elements are produced, for example, as integrated circuits, where the structuring properties are defined by irradiating a substrate with a directed radiation source, which uses, for example, light. Projection exposure systems are used for this purpose, in particular, which comprise, among other things, a radiation source, an illumination system, a photomask (a so-called reticle), and a projection system. Such subsystems of a projection exposure system are each composed of separate optical units, which first direct the radiation used for lithography from a radiation source via an illumination system to a photomask, and from there, using the projection system to generate a corresponding image of the photomask on a photosensitive layer of a substrate.The photosensitive layer can be a photoresist and the substrate can be a silicon wafer.

[0003] In order to create the smallest possible structures on a substrate using microlithography in projection exposure systems, devices have been used for several years that utilize particularly short-wavelength light from the so-called extreme ultraviolet (EUV) wavelength range, with wavelengths between 0.1 nm and 30 nm, particularly 13.5 nm. Due to the inherent radiation absorption of matter in this wavelength range, transmission optics cannot be used for this type of radiation in a multi-unit beam path of a projection exposure system. Therefore, for EUV radiation, only reflection optics, such as mirrors, are used.In order to continuously reduce the feature size of integrated circuits, projection exposure systems have recently been proposed or manufactured that utilize optical elements with a high numerical aperture (high-NA) or very high numerical aperture (hyper-NA). As the numerical aperture increases, the surface area of ​​an optical element required and utilized for reflecting radiation becomes correspondingly larger.

[0004] Elements, in particular optical elements, further in particular reflective optical elements, for use in EUV semiconductor lithography in a projection exposure system, e.g. EUV mirrors, must withstand high thermal loads because the EUV radiation sources in the projection exposure systems for EUV semiconductor lithography emit EUV radiation with high radiant power and part of this radiant power is absorbed by the reflective coating of the optical element. The thermal energy is accordingly transferred to all elements directly or indirectly connected to the optical element. This effect leads to heating of all elements directly or indirectly in contact with the optical element, which in turn can lead to deformations of the optical elements within a projection exposure system for EUV semiconductor lithography.In the beam path of a projection exposure system for EUV semiconductor lithography, there must be no time-varying and uncontrollable shape changes of the optical elements or other elements, as such an effect leads to corresponding wavefront changes in the EUV radiation reflected by the optical elements. To counteract operational temperature changes of the optical elements within a semiconductor lithography system, temperature-controlled optical elements are proposed for use in such applications. Temperature control involves, on the one hand, heating, for example, to ensure a defined operating temperature before irradiating a wafer; on the other hand, it involves cooling, to dissipate the amount of energy introduced into an optical element via radiation.Such elements, particularly optical elements, are disclosed, for example, as water-cooled mirrors in [DE102019405265A1]. These mirrors use channels within the mirror substrate for cooling the mirrors, into which a temperature-controlled fluid flows to cool the mirror substrate. The materials used for the substrates of the elements have sufficient thermal conductivity so that the thermal energy introduced by the irradiation is distributed within the substrate and dissipated from the substrate via fluid, particularly water, flowing through the channels within the substrate.

[0005] Such elements, in particular optical elements, for applications in the field of semiconductor lithography are manufactured, for example, from monolithic substrates, or alternatively from two or more sub-bodies. In the latter case, the individual sub-bodies of an optical element, for example a mirror substrate, are bonded together to form a composite body at high temperature (between 750°C and 1500°C) by thermal treatment, in particular by a high-temperature bonding process. For example, sub-bodies can be arranged vertically on top of one another and then thermally bonded, so that the composite body is composed of at least two layers of original sub-bodies. Likewise, sub-bodies can be arranged laterally next to one another and then thermally bonded, so that the composite body is composed of several segments.The composite body is then processed into a form for its subsequent use using a chemical and / or physical processing method. This may be a substrate for an optical element, for example a mirror or a lens. In this case, in particular, a portion of the composite body is converted into a shape containing a region encompassing the subsequent optical surface of the optical element. This surface is either planar, convex, concave, or designed as a freeform surface. An element produced in this way can also be a substrate with a mechanical use in the field of semiconductor lithography, for example a mirror, wafer, or reticle recording device.

[0006] If, after the thermal treatment of a body, for example a monolithic substrate, or a composite body, but in particular after the high-temperature bonding of a first partial body and a second partial body to form a composite body, during a cooling process of the hot body or composite body, different strain states ∈̃1 or ∈̃2 and thus density states of individual partial areas of a monolithic body, or of the individual original first partial bodies and second partial bodies with respective heights h1 and h2 of a composite body have been frozen in due to the formation of temperature inhomogeneities in different spatial directions, the body or the composite body bends with the formation of a three-dimensional elastic stress distribution with the curvature ℵ ℵ=6h1h2(h1+h2)3(ε˜1−ε˜2) until the free energy F per unit area A becomes minimal as in a leaf spring with elastic modulus E and Poisson's ratio v FA=E1−vh1h2h13+h23(h1+h2)4(ε˜1−ε˜2)2

[0007] In such a process, a jump in density is formed, followed by a density gradient in at least one spatial direction.

[0008] The free energy dissipates further when, for example, a weak connection formed between individual sub-bodies of a composite body, a so-called bond, begins to flow, whereby the stored energy is converted into friction. In the case of a monolithic substrate, the same effect occurs, for example, at theoretically individual, infinitesimally small volume elements of the monolithic substrate. The dissipation depends on the unknown viscosity η across the unknown thickness d of the bond of a composite body. ddtF+η⋅d∫∫(dγdt)2dxdy=0

[0009] The bond is sheared outwards with increasing radius r at an increasing rate with γ as soon as the first subbody and the second subbody relax. dγdt⋅d=d(ε1−ε2)dt⋅r

[0010] This results in an exponentially decaying drift with a characteristic time constant τ against the stress-free, steady state. τ=(1−v)ηEd⋅2IA⋅(h1+h2)44h1h2(h13+h23) which depends on the thickness d and the area moment of inertia I of the bond area A.

[0011] The described overall deflection of the body, or the composite body, compared to the original state of the partial bodies is in the range of hundreds of micrometers and depends on the size of the body or the composite body, with the deflection increasing with increasing size and surface area of ​​the mirror. The conceptually separated regions of the body, particularly the bond in the case of a composite body, are subject to increasing shear forces from the interior of the body or the composite body outward, as long as the conceptually separated regions of the body or the first partial body and the second partial body of the composite body expand or shrink. Such thermally treated bodies or bonded composite bodies typically drift at rates of a few picometers per year.This drift effect severely limits the use of substrates produced in this way for the production of mirrors in an application in the field of EUV semiconductor lithography.

[0012] However, it is possible to achieve low-stress states of a tempered body or a composite body, namely when the desired strain state can be derived as a tensor ε̃ from a deformation field u ε˜=ε˜(r)1=12deg u+12deg uT.

[0013] These Saint Venant integrability conditions cannot be satisfied for general tensor distributions ∈̃(r). However, a solution exists for the case of a linear density distribution ε˜(x,y,z)=ℵ⋅z namely ux=ℵ⋅xz uy=ℵ⋅yz uz=12ℵ⋅(z2−x2−y2)

[0014] In such a case, for example, a first sub-body and a second sub-body bend in the same way at the common contact surface, so that the formation of a bond between the first sub-body and the second sub-body does not cause any stresses. Therefore, the aim is to achieve a linear progression of the described frozen strain states ∈ i by forcing a tempered body to cool in only one spatial direction, thereby creating a constant temperature gradient within the body. The same effect also occurs between individual sub-areas of a tempered monolithic body, without the need for a bonded area created by a joining process.

[0015] In a technical review article by Schott AG, the thermally induced straining of glass bodies is described, as well as its effect on the optical properties of the corresponding glass bodies (“Stress in optical glass”, July 2004, pp. 1-13, https: / / www.schott.com / shop / medias / schott-tie-27-stress-in-optical-glass-eng.pdf?context=bWFzZdGVyfHJvb3R8NjkzNjASfGFweGxpY2F0aW9uL3BkZnxoYW MvaGViLzg4MT cOMDkONT gyMDYucGRmfGY50DdhODU3Mj U4ZGNj NT c3M 0 IxOG JIYTY4OTY3NTA2MGQ4ZDg0NWJjMjE5N2E0MjkxMzg0NDYxM2U0ZjJhM2U, accessed on 26.01.2023).

[0016] In [US1 1028006BB] the annealing of doped TiO2 / SiO2 mixed glasses with high homogeneity in the thermal expansion of the glasses is described by doping with special chemical materials, as well as a targeted choice of thermal and temporal parameters.

[0017] In [DE102019205265A1] a method is described for producing an EUV mirror from a glass body as a composite body, wherein the composite body is produced from a first partial body and a second partial body by high-temperature bonding, and wherein a channel is formed in the resulting composite body from a structure in a surface of one of the partial bodies and via stabilizing elements in the structure, which channel is used to cool the mirror.

[0018] The solutions known in the prior art do not, overall, meet the high requirements for the production of low-stress bodies, in particular for the production of low-stress composite bodies consisting of at least two partial bodies by thermal treatment, where the body or the composite body can be configured with channels. Furthermore, the solutions known in the prior art do not meet the high requirements regarding the geometric design of interfaces between at least two partial bodies of a composite body, nor the occurrence of temperature inhomogeneities within a body during a tempering process or within a composite body during high-temperature bonding. Object of the invention

[0019] It is the object of the present invention to overcome the disadvantages of the prior art so that bodies or composite bodies with as little stress as possible can be produced, so that the body or the composite body serves as a substrate for producing an element, in particular an optical element, further in particular a mirror for reflecting EUV radiation, so that the element serves as a component of a semiconductor technology system. Subject of the invention

[0020] The object underlying the invention is achieved by a device, a method, and an element, in particular an optical element, more particularly a reflective optical element, as well as a semiconductor technology system having the features of the independent claims. Further advantageous embodiments of the invention are the subject of the dependent claims and the exemplary embodiments of the invention described below.

[0021] In the following statements, counting terms such as "a" or "an" do not necessarily refer to a specific partial body, composite body, shell, element, component, method, and / or the like. Rather, multiple partial bodies, composite bodies, shells, elements, components, methods, and / or the like, such as two, three, or more, may be provided. Any other counting term used herein should not be interpreted as implying a limitation to the exact number of partial bodies, composite bodies, shells, elements, components, or methods. Rather, numerical deviations upwards and downwards are possible unless otherwise stated.

[0022] Further possible implementations of the invention also include combinations of features or embodiments described above or below with respect to the exemplary embodiments that are not explicitly mentioned. In this case, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

[0023] For the sake of simplicity, the term "thermal treatment" is used below as a generic term for a method according to the invention and thus, by definition, includes a high-temperature bonding method. Furthermore, the term "body to be thermally treated" is used below as a generic term for all inventive arrangements of bodies for thermal treatment and thus, by definition, includes a monolithic body, a composite body, a first partial body and / or a second partial body, as well as the arrangement of a first partial body and a second partial body.

[0024] A device according to the invention for thermally treating a body to be thermally treated comprises a casing, a temperature-controlled space within a temperature control unit, and a heating element. In one variant of the invention, the device also comprises a control unit. In a further variant of the invention, the device further comprises a recirculation unit. Furthermore, a medium or vacuum is located in the temperature-controlled space within a temperature control unit. The device according to the invention is characterized in that the casing non-contactingly encloses the body to be thermally treated both before, during, and after the thermal treatment. According to the invention, the casing advantageously fulfills the function of an insulating body, enabling a temperature distribution inside the body to be thermally treated that is advantageous for stress-free high-temperature bonding.

[0025] In one variant, the temperature control unit of the device is a furnace, preferably a tempering furnace. The temperature control unit is designed to achieve temperatures for thermal treatment, in particular for tempering glass substrates and / or for performing a high-temperature bonding process, and to maintain them constant over time.

[0026] In a further embodiment, the device according to the invention is characterized in that the casing body takes on the shape of a cylinder on the outside. The cylinder is ellipsoidal in shape, i.e. the cylinder has a numerical eccentricity in a range of 0 - 0.1 in cross-section, preferably an eccentricity of less than 0.05, more preferably an eccentricity of less than 0.01. A usable eccentricity of the casing body depends on an inhomogeneity of the temperature distribution inside a temperature control unit, with the usable eccentricity becoming smaller with increasing inhomogeneity of the temperature distribution inside the temperature control unit. For a maximum temperature difference inside a temperature control unit of a maximum of 25 K, an eccentricity of up to 0.1 can be used. For a maximum temperature difference of 250 K inside a temperature control unit, an eccentricity of up to 0.01 can be used.

[0027] It is possible for the shell cylinder to be positioned at an angle to the enclosed body to be thermally treated. The angle depends on the temperature differences and the body's aspect ratio. With a height-to-diameter aspect ratio of 1:10 and a temperature difference of 250 K, the shell may be tilted up to an angle of 0.1 rad. The same applies to the opening angle if the shell deviates conically from the ideal cylindrical shape.

[0028] In a preferred variant of the invention, the jacket body is open on at least one side. An outer, approximately cylindrical shape of the jacket body advantageously supports the formation of a constant temperature gradient along an axis of the jacket body, in particular the longitudinal axis of the cylindrical jacket body, as well as a homogeneous profile of the temperature distribution along the cylinder radius. In a further variant of the invention, it is also advantageous if the jacket body is at least as high as the body to be thermally treated. The use of this embodiment optimally supports the formation of a constant temperature gradient along the longitudinal axis and a homogeneous profile of the temperature distribution along the radius of the cylindrical arrangement of the jacket body of the body to be thermally treated.Depending on a temperature distribution and thermal movement within a medium in the space tempered by the temperature control unit, it is further advantageous for a minimization of a local temperature gradient, for example within any sectional plane of constant height of the body to be thermally treated, that the jacket body according to the invention continuously continues the top side or the bottom side of the body to be thermally treated.

[0029] In a variant of the invention, the wall thickness of the jacket body is at least one tenth and at most ten times the height of the body to be thermally treated, but preferably the diameter of the entire arrangement comprising the jacket body and the body to be thermally treated is equal to the height of the same arrangement.

[0030] The jacket body is arranged as close as possible to the body to be thermally treated, so that a local temperature gradient formed inside the body to be thermally treated, for example within any sectional plane of constant height, is advantageously suppressed as much as possible after the thermal treatment and at the same time no physical contact occurs between the jacket body and the body to be thermally treated, which is caused by a change in shape of the jacket body and / or the body to be thermally treated due to thermal expansion.

[0031] In a further preferred embodiment of the device according to the invention, each surface of the casing body directed towards a surface of the body to be thermally treated has a distance of at least 0.1 mm from the body to be thermally treated and has a distance of at most 30 mm. In this way, it is possible to reuse the casing body after thermal treatment. It is further advantageous if the distance between the casing body and the body to be thermally treated is constant along a complete circumference of the body to be thermally treated. A further advantage of such an embodiment is that the outer contour of the body to be thermally treated is not subject to any shape restrictions, as long as the casing body is suitable for enclosing the body to be thermally treated in the manner described without contact.In one variant of the invention, the body to be thermally treated has, for example, a polygonal or oval perimeter. In further variants of the invention, the body to be thermally treated has an arbitrary free-form perimeter.

[0032] In a further advantageous embodiment of the device according to the invention, the body to be thermally treated comprises an amorphous silicon-containing glass and / or a semi-crystalline ceramic. It is advantageous to use materials for the body to be thermally treated that exhibit very good or excellent thermal conductivity, so that temperature distributions inside the body to be thermally treated equilibrate as quickly as possible after a temperature change during high-temperature bonding, and heat contained in the body to be thermally treated can be conducted to a surface as quickly as possible and dissipated into an ambient medium or directly to a furnace wall.

[0033] In a further advantageous embodiment of the device according to the invention, the body to be thermally treated comprises titanium-doped quartz glass. Titanium-doped quartz glass has an extremely low coefficient of thermal expansion in the zero-crossing temperature range. This makes titanium-doped quartz glass suitable as a substrate material for EUV optics, since during operation in the zero-crossing temperature range, virtually no deformation of the substrate material is to be expected, which could negatively impact the imaging properties.

[0034] In a further advantageous embodiment of the device according to the invention, the casing body is made of the same material as the body to be thermally treated. In this way, the temperature-induced deformations of the casing body and the body to be thermally treated can be easily accounted for, and no material-related changes in the heat flow occur.

[0035] The usability of materials for the jacket body with chemical compositions that differ slightly from the material of the body to be thermally treated depends on the similarity of the thermal conductivity of the jacket body material compared to the material of the body to be thermally treated. The thermal conductivity of the jacket body may differ from the thermal conductivity of the material of the body to be thermally treated by a maximum of one-tenth of the thermal conductivity of the material of the body to be thermally treated, preferably one-twentieth, more preferably one-hundredth.

[0036] A method according to the invention for thermally treating a body to be thermally treated by means of the device according to the invention described above comprises the following steps: providing at least one body to be thermally treated, arranging the at least one body to be thermally treated and the casing body in the temperature-controlled space with the medium of the device according to the invention in such a way that the casing body encloses the at least one body to be thermally treated without contact, and thermally treating the body to be thermally treated.

[0037] During thermal treatment, the at least one body to be thermally treated is typically heated to a temperature between 750 and 1500°C. This allows, for example, the respective surfaces of the partial bodies to be joined during thermal treatment to be bonded together without the use of a joining agent.

[0038] In one embodiment of the method according to the invention, the body to be thermally treated is formed from amorphous silicon-containing glass and / or from a semi-crystalline ceramic.

[0039] In one embodiment of the method according to the invention, the body to be thermally treated is made of titanium-doped quartz glass. Regarding the advantages for amorphous silicon-containing glass, semi-crystalline ceramics, and titanium-doped quartz glass, reference is made to the above description.

[0040] In one embodiment of the method according to the invention, the at least one body to be thermally treated is processed on a surface before or after the thermal treatment by a chemical and / or physical processing method. In one variant of the invention, this is, for example, a cleaning method in which one or more surfaces of the body to be thermally treated are cleaned. In a further variant, this is, for example, a shaping method in which one or more surfaces of the at least one body to be thermally treated are provided with a shape. In a first aspect, a physical processing method is a machining method in which material is removed from one or more surfaces of the body to be thermally treated, thereby changing the shape of the processed surface.In a further aspect, for example, this is a polishing process in which one or more surfaces of the at least one body to be thermally treated are polished to a target value for a surface roughness. In a further aspect, for example, this is an erosion process. In a further aspect, for example, this is a chemical etching process in which material is removed from one or more surfaces of the at least one body to be thermally treated, thereby changing the shape of the processed surface. In a further aspect, for example, this is a coating process, for example chemical vapor deposition, sputtering, atomic layer deposition, pulsed laser deposition, or an electroplating process. In a further aspect of the invention, two or more of the described processes are carried out sequentially.

[0041] In a further embodiment of the method, for example, an interface between the first partial body and the second partial body is formed as a planar interface. In a further variant, the interface is formed as a concave or convex interface. In a further variant of the method, the interface is formed as a freeform surface.

[0042] Since the at least one body to be thermally treated can deform during a temperature change, starting from a state at room temperature to a state at a temperature during high-temperature bonding, such a temperature-induced deformation is advantageously taken into account in the shapes of the at least one body to be thermally treated and is provided for in a chemical and / or physical processing method prior to the thermal treatment. Accordingly, the expected temperature-induced deformation of the at least one body to be thermally treated is advantageously taken into account in the shape design of the jacket body and is provided for in such a way that the jacket body does not establish direct physical contact with the at least one body to be thermally treated.

[0043] In a further embodiment of the method according to the invention, a first structure comprising at least one groove and at least one web is formed on a first surface of the at least one first partial body by chemical and / or physical processing of the surface. In a variant of the method, a second structure comprising at least one groove and at least one web is formed on a second surface of, for example, the second partial body by chemical and / or physical processing.During, for example, high-temperature bonding of the first partial body and the second partial body to form a composite body, according to the invention at least one continuous channel is formed in the interior of the composite body at an interface formed by the first surface of the first partial body and the second surface of the second partial body, from the structure located in the first surface of the first partial body and / or the structure located in the second surface of the second partial body, wherein parts of the at least one continuous channel and / or parts of different several continuous channels are separated from one another by webs. Such at least one channel is formed, for example, spiral-shaped, meander-shaped, linear, curved towards the center of the composite body or outwards, or also as a pseudo-two-dimensional network. In one variant, such at least one channel has at least one symmetry element.The webs which separate parts of the at least one channel, or several individual channels, from one another have identical or different web widths and web shapes over the entire surface. In one variant, the at least one channel is round. In another variant, the channel is oval. In a further variant, the channel comprises at least one angular structure and / or at least one rounded structure. The at least one continuous channel configured in this way inside the composite body is advantageously used to conduct gaseous and / or liquid media at a defined temperature through the composite body and to temper the material of the composite body by heat transfer between the medium and the composite body.

[0044] According to the invention, predefined structures designed in this way are produced in the surfaces of a first partial body and / or a second partial body by machining processes such as milling, turning, or drilling. In one variant of the method, a predefined structure is alternatively produced by a chemical machining process, for example an etching process. In a further variant, the method for producing the channel structure in a partial region of the partial body comprises the irradiation of electromagnetic radiation. In a further variant, the production of the at least one channel is carried out by an ablation process, for example by means of laser radiation or by means of electron radiation or by means of ion radiation. The grooves of the structured surfaces used to produce the at least one channel are designed with flat surfaces or surfaces provided with a curve.In one variant of the method, at least two of the aforementioned methods are applied consecutively to produce the predefined structures in the surfaces of the first partial body and / or the second partial body. In this variant, the surface quality of the predefined structures is advantageously adjusted after the application of a first method step. In one variant of the invention, the surface roughness has RMS values ​​of at most 10 micrometers, in particular at most 5 micrometers, more particularly at most 2 micrometers.

[0045] In a further embodiment of the method, a plurality of sub-bodies are joined together to form a composite body by thermal treatment, in particular high-temperature bonding (stack sealing method), wherein a first sub-body and a second sub-body from the plurality of sub-bodies contact each other at at least one interface. To produce a composite body with at least one internal channel, predefined structures are advantageously contained in at least one surface of the sub-bodies in a first sub-body, in a second sub-body, or in a plurality of sub-bodies, which structures each combine to form the at least one channel within the composite body through the formation of the composite body.

[0046] In one embodiment of the method, the first partial body and the second partial body are connected to one another by wringing before the start of the high-temperature bonding in such a way that the wringing surface corresponds to the interface at which the first partial body is connected to the second partial body to form a composite body. If a plurality of partial bodies is used to form a composite body, in one variant of the method, the individual partial bodies of the plurality of partial bodies are also connected to one another by wringing before the start of the high-temperature bonding in such a way that the at least one wringing surface between a first partial body and a second partial body corresponds to the at least one interface at which at least one first partial body is connected to at least one second partial body to form a composite body.

[0047] A further embodiment of the method according to the invention is characterized in that, within the body to be thermally treated, a first local temperature of any first infinitesimal surface element within any first sectional plane of a first constant height of the body to be thermally treated and a second local temperature of any second infinitesimal surface element within the same first sectional plane of constant height of the body to be thermally treated differ by no more than 1 K. Within such any sectional plane of constant height, a local temperature gradient is minimally formed according to the invention as an effect of the insulating effect of the casing body, although not completely suppressed.Furthermore, the method according to the invention is characterized in that the first local temperature of any first infinitesimal surface element within any first sectional plane of the first constant height of the body to be thermally treated and a third local temperature of any third infinitesimal surface element within any second sectional plane of a second constant height of the same body to be thermally treated have a temperature difference other than zero.In such a method, a local temperature gradient is advantageously formed between any first sectional plane of the first constant height and any second sectional plane of the second constant height by a structure of the casing body surrounding the body to be thermally treated that is open on at least one side. This local temperature gradient allows heat to diffuse from a warm point inside the body to be thermally treated to a surface of the body to be thermally treated. This heat diffusion is advantageously used to cool the body to be thermally treated.

[0048] A further embodiment of the method according to the invention is characterized in that within the body to be thermally treated, starting from the arbitrary first infinitesimal surface element with the first local temperature within the arbitrary first sectional plane of the first constant height along a first normal of the arbitrary first sectional plane of the first constant height to the arbitrary third infinitesimal surface element with the third local temperature within the arbitrary second sectional plane of the second constant height, the gradient of a first local temperature profile at any height of the body to be thermally treated differs by a maximum of 5% from an averaged temperature gradient which is calculated over a corresponding temperature profile over the entire height of the body to be thermally treated.Such a first local temperature profile between any first infinitesimal surface element and any third infinitesimal surface element always results in a local density gradient and a density profile due to the thermal expansion of the material of the body to be thermally treated. Since such a temperature profile inside the body to be thermally treated is accordingly approximately linear, a density profile can also have an approximately linear profile. In one aspect of the invention, the at least one density gradient exists along an axis of symmetry of the body to be thermally treated, in particular along the gravitational axis. In a further aspect, the at least one density gradient exists parallel to the gravity of the body to be thermally treated.

[0049] Over a wide temperature range, an approximately linear temperature profile can result in a nonlinear density profile within the body to be thermally treated. A temperature difference according to the invention along the temperature profile within the body to be thermally treated is advantageously more than 5 K but less than 500 K.

[0050] Furthermore, a method according to the invention is characterized in that, starting from the arbitrary second infinitesimal surface element with the second local temperature within the arbitrary first sectional plane of the first constant height along a second normal of the arbitrary first sectional plane of the first constant height to an arbitrary fourth infinitesimal surface element with a fourth local temperature within the arbitrary second sectional plane of the second constant height, the gradient of a second local temperature profile at an arbitrary height of the body to be thermally treated differs by a maximum of 5% from an averaged temperature gradient calculated over a corresponding temperature profile over the entire height of the body to be thermally treated,the temperature gradient averaged over the first local temperature profile and the temperature gradient averaged over the second local temperature profile differ by no more than 5%. This is advantageous in order to ensure an approximately homogeneous heat transfer within the body to be thermally treated across any first sectional plane of the first constant height and / or any second sectional plane of the second constant height, and to avoid mechanical stresses, particularly at the bond formed in the composite body in the case of high-temperature bonding of a first partial body to a second partial body. This is necessary,Because different local temperatures within theoretically finite surface elements of the body to be thermally treated translate into locally different thermal expansions and locally different material densities. If three-dimensional finite volume elements within the body to be thermally treated are arranged seamlessly, theoretically no stresses arise within the body to be thermally treated, especially in the area of ​​the interface of the composite body. This is the case when a linear progression of an isotropic strain occurs within the body to be thermally treated, which is caused by a spatially homogeneous temperature gradient within the body to be thermally treated. In such a case, two theoretically separate finite volume elements bend similarly at a common interface within a body to be thermally treated.so that no strain-induced stresses occur, especially when joining finite volume elements of a body to be thermally treated. In the latter case, no temporal drift occurs during high-temperature bonding, for example, after the bond has formed due to slow stress relaxation. In general, minimized stresses occur within the body to be thermally treated, as long as the Saint-Venant compatibility condition is met.

[0051] According to the invention, it was therefore recognized overall that a jacket body is advantageously used to enable stress-free thermal treatment of a body to be thermally treated, for example, for the stress-free production of a composite body by high-temperature bonding. The jacket body enables the formation of a spatially homogeneous, unidirectional temperature profile within the body to be thermally treated after thermal treatment. Furthermore, the jacket body enables low-stress cooling of the body to be thermally treated, in particular of the bond after high-temperature bonding. A unidirectional temperature profile according to the invention during cooling of the body to be thermally treated advantageously leads to increased dimensional stability of the body to be thermally treated, in particular of the bond within the composite body produced by high-temperature bonding.

[0052] In a further embodiment of a method according to the invention, the thermal treatment of the body to be thermally treated comprises, as temperature progression phases, a heating phase starting from a first temperature to a second temperature, in which the at least one body to be thermally treated is heated with a temporal temperature ramp for heating, a holding phase in which the at least one body to be thermally treated is heated with the approximately time-constant second temperature, and a cooling phase starting from the second temperature to the first or a third temperature, in which the at least one body to be thermally treated is cooled with a temporal temperature ramp for cooling.

[0053] In one variant of the process, all or only selected process steps are carried out under an inert gas atmosphere, e.g., argon or nitrogen. During the heating phase, the at least one body to be thermally treated and the shell body are heated to a temperature above a lower cooling point. During the holding phase, the at least one body to be thermally treated, e.g., the first partial body and the second partial body, are annealed while inducing targeted, stress-relieving distortions and are joined together at an interface. This creates residual stresses of a maximum of 1 kPa - 1 MPa. A density gradient caused by a temperature gradient advantageously has values ​​of at least 3 ppm / m.Since the degree of crystallization of the composite body material also depends on temperature, different degrees of crystallization and possibly different crystallization states can develop in the form of thermodynamic phases of the material in the direction of the temperature gradient. In one aspect of a process according to the invention, the degree of crystallization advantageously changes by more than 5 ppm / m, but not by more than 10%, across the body to be thermally treated.

[0054] According to the invention, the time-constant temperature set during a holding phase is above a glow point of the material of the body to be thermally treated, preferably above the glass transition temperature of the material of the at least one body to be thermally treated, for example at more than approximately 600°C, generally between approximately 800°C and 1500°C, preferably between 900° and 1200°C. In an advantageous variant of the method, the duration of the holding phase is less than ten weeks, advantageously less than six weeks, further advantageously less than four weeks.

[0055] In a further embodiment of the method according to the invention, a temperature ramp with a temporally nonlinear progression is applied for cooling in the body to be thermally treated, as well as in the jacket body with the temperature control unit and a medium. One form of application according to the invention uses temperature ramps with continuous progressions. The total duration and the temporal gradients of actual temperature ramps depend heavily on various parameters of the embodiment and must be approximately determined using finite element calculations.Key parameters include the number, geometry, and dimensions of the body to be thermally treated and the shell used, the material of the body to be thermally treated and the shell used, and its phase diagram with any phase transitions that may occur within the temperature and pressure range used. Furthermore, characteristic material properties such as the density, heat capacity, thermal conductivity, hardness, or ductility of the material used are also important. It should be noted that the above list is not exhaustive, and other common material properties are used to determine and predict a temporal temperature ramp using the finite element method.For a mass with a cylindrical geometry of the at least one body to be thermally treated and / or a jacket body of 3-5000 kg and with a radius and a cylinder height of 10 -300 cm, when using TiO2-doped silicate glasses as material for the at least one body to be thermally treated and / or the jacket body, linearly approximated temperature changes in, in comparison to the total duration of a ramp, infinitesimal temperature intervals of the temperature ramps are 0.1 - 10 K / h.

[0056] Since local differences in the temperature gradients within any first sectional plane of the first constant height and / or any second sectional plane of the second constant height of a body to be thermally treated are not perfectly suppressed by the jacket body, as described above, a further aspect of the invention proposes a method extension in order to further minimize residual inhomogeneities of the temperature gradients within any first sectional plane of the first constant height and / or any second sectional plane of the second constant height of the body to be thermally treated.

[0057] In a further embodiment of the method according to the invention, the temperature ramp for cooling has a superposition of the following components: a first component with a continuously falling temperature profile starting from a first temperature to a second temperature with a cooling rate that can be set via the control unit, a first temperature, and a second temperature, and a second component with a periodic temperature change starting from a third temperature to a fourth temperature with a third temperature that can be set via the control unit, a fourth temperature, an amplitude, a period, a phase, and an attenuation and / or an amplification.The parameters mentioned for the periodic temperature change of the temperature ramp depend heavily on various parameters of the design, can vary over time, and must also be approximately determined using finite element calculations. Other key parameters here include the number, geometry, and dimensions of the bodies to be thermally treated, as well as the jacket body used, the material of the bodies to be thermally treated and the jacket body, as well as its phase diagram with any phase transitions that may occur within the temperature and pressure range used, as well as characteristic material properties such as the density, heat capacity, thermal conductivity, hardness, or ductility of the material. However, this list is not exhaustive and other common material properties can be used.Simple considerations yield guideline values ​​for the amplitude and period of the oscillation based on the thermal conductivity constant and the geometry of a substrate. For a mass of the at least one body to be thermally treated and / or a shell body of 3–5000 kg and with a radius and cylinder height of 10–300 cm, when using titanium-doped silicate glasses as the material for the at least one body to be thermally treated and / or the shell body, linearly approximated temperature changes in temperature ramp intervals, infinitesimal compared to the total duration of a ramp, are 0.1–10 K / h.

[0058] In a variant of the embodiment of the method according to the invention, the period of the temporally periodic component of the temperature ramp is selected such that the amplitude of the thermal waves near the center of mass of the at least one body to be thermally treated and the casing body is attenuated to less than half the amplitude of the periodic temperature changes of the surrounding medium. The period advantageously assumes values ​​between 1 s and 1 month.

[0059] In a further advantageous embodiment of the method according to the invention, the temperature ramp for cooling generates a temperature distribution within the body to be thermally treated, which temperature distribution is characterized within the arbitrary first sectional plane of the first constant height of the body to be thermally treated by a first spatial temperature profile at an arbitrary first point in time, and a second spatial temperature profile at a second point in time, wherein the second point in time is shifted in time by half a period of the second component of the temperature ramp for cooling relative to the arbitrary first point in time, and wherein the first spatial temperature profile at the arbitrary first point in time has an at least partially inverted profile relative to the second spatial temperature profile at the second point in time.In a variant of the method, the first spatial temperature profile and the second spatial temperature profile are approximately parabolic temperature profiles along the coordinates of the arbitrary first section plane of constant height.

[0060] Naturally, the amplitude of the temporally periodic component of the temperature ramp of the temperature control unit and that of the medium surrounding the composite body exceeds the maximum achievable temperature difference near the center of mass of the body to be thermally treated and the casing body. Furthermore, the amplitude of the temporally periodic component exceeds the maximum deviation of a continuously decreasing or continuously increasing component of the temperature ramp of the temperature control unit within a time interval defined by a period according to the invention. The amplitude of the temporally periodic component according to the invention ranges between 5 K and 250 K. At the beginning of the temperature ramp and at its end, the amplification, or attenuation, of the amplitude is advantageously set such that the resulting periodic component of the non-linear temperature ramp has a value of zero.

[0061] According to the invention, it was recognized that the formation of a unidirectional temperature profile within the body to be thermally treated, in particular after high-temperature bonding of the first partial body and the second partial body with the aid of the jacket body, is supported by an additional temporally periodic modulation of the temperature ramp for cooling the at least one body to be thermally treated.

[0062] By applying such periodic modulation, the duration of the cooling phase can also be advantageously reduced, since stresses in the body to be thermally treated are at least partially leveled out over the period of the temporally periodic modulation of a temperature ramp for cooling, which enables an overall higher cooling rate on average over time, compared to a purely linear temperature ramp for cooling.

[0063] An optical element according to the invention, in particular for reflecting EUV radiation, comprises a substrate produced from a body to be thermally treated produced by a method according to the invention, and a reflective coating, in particular one that reflects EUV radiation, applied to a surface of the substrate, in particular applied by a second chemical and / or physical processing method. In one aspect of the invention, the substrate is produced from the body to be thermally treated according to the invention by a chemical and / or physical processing method on at least one surface. In one variant of the invention, this is, for example, a cleaning method in which one or more surfaces of the first partial body and / or the second partial body are cleaned.In a further variant, for example, it is a shaping process in which one or more surfaces of the composite body are provided with a shape. In one aspect, for example, it is a machining process in which material is removed from one or more surfaces of the body to be thermally treated, thereby changing the shape of the machined surface. In a further aspect, for example, it is a polishing process in which one or more surfaces of the body to be thermally treated are polished to a target surface roughness. In a further aspect, a chemical and / or physical machining process is an erosion process.In another aspect, for example, it is a chemical etching process in which material is removed from one or more surfaces of the composite body, thereby changing the shape of the machined surface. In another aspect, it is, for example, a coating process, such as chemical vapor deposition, sputtering, atomic layer deposition, pulsed laser deposition, or a plating process. In another aspect of the invention, two or more of the described processes are carried out sequentially.

[0064] The reflective coating is designed to reflect EUV radiation at a wavelength between approximately 5 nm and approximately 30 nm, in particular to reflect radiation with a wavelength of approximately 13.5 nm (lithography) or in the range of approximately 2.3 nm to 4.4 nm (water window). In another variant, the specific design of the reflective coating comprises, in addition to the layers that actually reflect the radiation, one or more additional layers, such as absorber layers, protective layers, base layers, or adhesion-promoting layers.

[0065] In one embodiment of the invention, the optical element is characterized in that at least one continuous channel, produced according to a method according to the invention, is used within the substrate of the reflective optical element for actively tempering the substrate and a reflective coating, in particular reflecting EUV radiation, applied to a surface of the substrate, in particular by a chemical and / or physical processing method, by means of liquid and / or gaseous media.

[0066] In one variant, the fluid used for active temperature control of the optical element is water, in particular ultra-pure water with a conductivity of <0.1 µS / cm. The reflective optical element can thus be actively temperature controlled in a temperature range of approximately 0°C - 100°C. In other variants, the fluid used for active temperature control is a ultra-pure gaseous fluid, in particular ultra-pure compressed air. In a special variant, the gaseous fluid used for active temperature control is a ultra-pure inert gas such as nitrogen or argon, or mixtures of ultra-pure gases. In another variant, the fluid used for active temperature control is a suspension of condensed CO2 and organic solvents, for example isopropyl alcohol.In another variant, the fluid used for active temperature control is a medium analogous to that used in a heat pipe, for example low-boiling organic hydrocarbons, ammonia or alkali metals.

[0067] Such tempering methods are used during none, one, or a plurality of manufacturing steps of the reflective optical element after the thermal treatment of the body to be thermally treated according to the invention, as well as during the use of the reflective optical element according to the invention.

[0068] The material of the body to be thermally treated is based, for example, on silicate as the base material. In other variants, one or more chemical components are added to the base material as dopants, for example, titanium dioxide (TiO2). Ideally, the percentage of the dopant material is less than 10 wt%. In other variants, other chemical compounds with high thermal conductivity are used, as well as alternative common dopants.

[0069] A semiconductor technology system according to the invention is characterized in that it comprises at least one optical element according to the invention. In one variant, a semiconductor technology system is a system for producing structured semiconductor substrates, or a system for qualifying optics used in the field of semiconductor technology. In specific variants, it is, in particular, a system from the field of EUV semiconductor technology, furthermore, in particular, a projection exposure system for EUV semiconductor lithography of wafers or similar substrates, furthermore, in particular, a mask inspection system for EUV semiconductor lithography, and furthermore, in particular, a wafer inspection system for EUV semiconductor lithography.In a further variant, the at least one optical element is designed with at least one continuous channel, which is used during operation of the semiconductor technology system to temper the reflective optical element, ie to cool and / or heat it.

[0070] In a further variant, the body to be thermally treated is used for purposes other than the production of a (reflective) optical element. In this case, too, at least one optionally present continuous channel can be used to heat and / or cool the body to be thermally treated when a fluid flows through it.

[0071] Further features and advantages of the invention will become apparent from the following description of exemplary embodiments of the invention, with reference to the figures of the drawing, which illustrate details essential to the invention, and from the claims. The individual features can be implemented individually or in combination in a variant of the invention. Character list

[0072] Exemplary embodiments are shown in the schematic drawings and are explained in the following description. Fig. 1 a schematic representation of a device according to the invention. Fig. 2 a a schematic representation of a first partial body and a second partial body each with a surface structure Fig. 2 b a schematic representation of the body to be thermally treated using the example of a composite body Fig. 2 c a schematic representation of the body to be thermally treated using the example of a composite body. Fig. 3 a a schematic representation of the body to be thermally treated using the example of a composite body with cutting planes of constant height Fig. 3 b a schematic representation of spatial temperature distributions within the body to be thermally treated Fig. 3 c a schematic representation of two spatial temperature curves within the body to be thermally treated. Fig. 4 a schematic representation of a temporal temperature profile of a medium of a temperature control unit during high-temperature bonding Fig. 5 a a schematic representation of individual components of a phase of a temporal temperature profile Fig. 5 b a schematic representation of a phase of a temporal temperature curve Fig. 5 c a schematic representation of spatial temperature profiles inside the body to be thermally treated at different times during the cooling phase of the high-temperature bonding Fig. 6 a reflective optical element Fig. 7 a schematic representation of a semiconductor technology system in meridional section using the example of a projection exposure system for EUV semiconductor lithography Description of the drawings

[0073] Fig. 1 shows an embodiment of a device (100) according to the invention, comprising a casing body (105), a temperature control unit (106), a heating element (109), and a medium (111) located in a space (108) of the temperature control unit (106) that can be temperature-controlled via the heating element (109). The temperature control unit (106) is designed such that, in the temperature-controlled space (108) containing the medium (111), the casing body (105) non-contactingly encloses a body to be thermally treated, shown here using the example of an arrangement comprising a first partial body (101) and a second partial body (102). By means of a heating element (109), the temperature control unit (106) temperature-controls the body to be thermally treated enclosed by the casing body (105).In this variant of the embodiment, the device (100) is used for thermally bonding the first partial body (101) to the second partial body (102) to form a composite body (103) at an interface (104) formed between the first partial body (101) and the second partial body (102) by means of high-temperature bonding. Before the high-temperature bonding is carried out, the jacket body (105) non-contactingly encloses an arrangement of first partial bodies (101) and second partial bodies (102) contacting each other at an interface (104). The jacket body (105) also non-contactingly encloses the composite body (103) during and after the high-temperature bonding. The same applies to the use of the device (100) for the thermal treatment of a body (101, 102, 103) to be thermally treated in the case of tempering a monolithic body.

[0074] In one variant of the device (100) according to the invention, the device (100) further comprises a control unit (110). In this variant of the embodiment, the control unit (110) is designed to adjust the temperature of at least one of the elements inside the temperature control unit (106), preferably of all elements inside the temperature control unit (106), at at least one point in time during a process of thermally treating a body (101, 102, 103) to be thermally treated.

[0075] In a variant of an embodiment according to the invention, the dimensions of the casing body (105) are selected such that each surface (107) of the casing body (105) directed toward a surface (112) of the body (101, 102, 103) to be thermally treated, for example toward a surface (114) of the first partial body (101) and / or toward a surface (113) of the second partial body (102), has a distance of at least 1 mm, preferably at least 0.1 mm, from the body (101, 102, 103) to be thermally treated. To ensure the inventive function of the casing body (105), it is necessary to limit the distance between the casing body (105) and the body (101, 102, 103) to be thermally treated. The distance of each surface (107) of the casing body (105) directed towards the surface (112, 113, 114) of the body (101, 102, 103) to be thermally treated is at most 30 mm, preferably 7 mm, more preferably 5 mm.The distance between the jacket body (105) and the body to be thermally treated (101, 102, 103) is ideally constant along a complete circumference of the body to be thermally treated (101, 102, 103), so that the surface (107) follows the shape of the body to be thermally treated (101, 102, 103). However, there is the restriction that after thermal treatment, the jacket body (105) must be able to be removed from the body to be thermally treated (101, 102, 103) without causing mechanical damage to the jacket body (105) or the body to be thermally treated (101, 102, 103). Likewise, during and after the thermal treatment, the distance of each surface (107) directed to the surface (112) is up to a maximum of 10 mm, preferably 7 mm, more preferably 5 mm.This dimensioning of the jacket body (105) ensures that the jacket body (105) is suitable for reuse after thermal treatment.

[0076] According to the invention, the casing body (105) is configured externally in the shape of a cylinder. In one variant of the invention, the cylinder is ellipsoidal, i.e. the cylinder has a numerical eccentricity in a cross-section in a range of 0 - 0.1, preferably an eccentricity of less than 0.05, more preferably an eccentricity of less than 0.01. A usable eccentricity of the casing body (105) depends on an inhomogeneity of the temperature distribution inside a temperature control unit (106), wherein the usable eccentricity becomes smaller with increasing inhomogeneity of the temperature distribution inside the temperature control unit (106). For a maximum temperature difference inside a temperature control unit (106) of a maximum of 25 K, an eccentricity of up to 0.1 can be used. For a temperature distribution of maximum 250 K inside a temperature control unit (106), an eccentricity of up to 0.01 can be used.According to the invention, the height of the jacket body (105) is selected such that the jacket body (105) is at least as high as the body (101, 102, 103) to be thermally treated. Since, for example, the composite body (103) is created during the thermal treatment in the embodiment of high-temperature bonding, the jacket body (105) must also be at least as high as the expected height of the composite body (103) during and after the high-temperature bonding. In one variant of the invention, the wall thickness of the jacket body (105) is at least one-tenth and at most ten times the height of the body to be thermally treated; however, the diameter of the arrangement comprising the body to be thermally treated (101, 102, 103) and the jacket body (105) is preferably equal to the height of the same arrangement.

[0077] Due to thermal expansion, the jacket body (105) and the body to be thermally treated (101, 102, 103) undergo a change in shape during a temperature change during high-temperature bonding. The expected change in shape in the temperature range applied during thermal treatment must be taken into account when selecting the geometry of the jacket body (105) relative to the body to be thermally treated (101, 102, 103), as well as the composite body (103) produced, for example, during thermal treatment, and must be maintained in such a way that the jacket body (105) is in contact with the body to be thermally treated (101, 102, 103) before, during, and after thermal treatment.In order to advantageously account for changes in shape that occur during high-temperature bonding for the body to be thermally treated (101, 102, 103) and the jacket body (105), the individual thermal expansion coefficients of the materials involved must be selected to be as similar as possible, ideally the same. Therefore, the jacket body (105) is advantageously made of the same material as the body to be thermally treated (101, 102, 103). This advantageously ensures that no contact occurs between the body to be thermally treated (101, 102, 103) and the jacket body (105) before, during, or after the thermal treatment. Furthermore, this advantageously ensures that the distance between the body to be thermally treated (101, 102, 103) and the jacket body (105) exhibits spatially homogeneous changes during the thermal treatment.The usability of materials for the casing body (105) with chemical compositions that differ slightly from the material of the body to be thermally treated (101, 102, 103) depends on the similarity of the thermal conductivity of the material of the casing body (105) compared to the material of the body to be thermally treated (101, 102, 103). The thermal conductivity of the casing body (105) can differ from the thermal conductivity of the material of the body to be thermally treated (101, 102, 103) by a maximum of one-tenth of the thermal conductivity of the material of the body to be thermally treated (101, 102, 103), preferably one-twentieth, more preferably one-hundredth.

[0078] If the thermal properties of the jacket body differ too significantly from the composite body, the asymmetric temperature distribution inside can be avoided by carefully shaping the outer geometry. In the ideal extreme case, the jacket perfectly insulates the heat, and its geometry then no longer influences the temperature gradients. In one variant of the invention, the materials used for the jacket body (105) and the body to be thermally treated (101, 102, 103) are, for example, amorphous silicon-containing glasses or semi-crystalline ceramics. In further variants, the materials used are enriched with other components to improve chemical, physical, or optical properties. In particular, the material is a titanium-doped silicate compound.

[0079] In one embodiment, the body (101, 102, 103) to be thermally treated, enclosed by the casing body (105), has, as in Fig. 1, have round cross-sections. In one variant, the body (101, 102, 103) to be thermally treated, enclosed by the casing body (105), has oval cross-sections. In special alternatives, the body (101, 102, 103) to be thermally treated, enclosed by the casing body (105), has polygonal cross-sections.

[0080] The medium (111) in the temperature-controlled chamber (108) of the temperature control unit (106) is heated to a freely adjustable temperature within a temperature range between 50 and 1500°C by means of the heating element (109) and, as described above in a special variant of the invention, with the control unit (110). In one variant of the invention, the medium (111) is an inert gas, for example nitrogen or argon. In another variant, it is high-purity compressed air. In another variant, gaseous water is added to the gaseous medium in a controlled manner. In further variants, the medium (111) is exchanged during the thermal treatment, with the exchange occurring either sequentially or continuously. The exchangeability of the medium (111) serves, for example, to remove gaseous substances formed from the temperature-controlled chamber (108).The medium (111) is exchanged from the temperature-controlled space (108) at a variable exchange rate. It is also possible, in one application of the device (100), to at least partially remove the medium (111) by continuously evacuating the temperature-controlled space (108). For this purpose, a pumping device (not shown) is used to generate a negative pressure relative to the ambient pressure surrounding the device (100). In a further variant of the invention, the medium (111) has a higher pressure than a standard pressure during the thermal treatment.

[0081] In one variant of the invention, current-carrying wires, for example heating coils, are used as heating elements (109). In a further variant of the invention, gas-carrying heating elements are used as heating elements (109). In a further variant of the invention, the device (100) comprises a plurality of heating elements (109) arranged at various locations in the temperature-controlled space (108). In particular, the heating elements (109) are located on the ceiling of the temperature-controlled space (108), on its walls, or on the floor.

[0082] According to the invention, the temperature of the medium (111) can be set and regulated via the control unit (110) and the heating element (109) to a value with an accuracy of at least 10 K, preferably + / -1 K, more preferably + / -0.1 K. In one embodiment, the device (100) and in particular the control unit (110) therefore contain at least one sensor to measure the temperature of the medium (111). The temperature signals measured by the sensor are then processed in an evaluation unit and returned to the control unit (110) in a feedback loop for regulating a temperature. In one variant of the invention, the control unit (110) alternatively or additionally comprises a sensor which measures the temperature on a surface inside the temperature control unit (106) or the temperature within the medium (111).A corresponding surface is a surface of the jacket body (105), or a surface of the body to be thermally treated (101, 102, 103).

[0083] Fig. 2 a, b show a specific embodiment of the invention using the example of high-temperature bonding of the first partial body (101) with the second partial body (102) to form the composite body (103). In a method according to the invention of this embodiment, the first partial body (101) and the second partial body (102) are first provided. In the aspect of the method shown, the first partial body (101) is designed as an upper partial body and the second partial body (102) is designed as a lower partial body, so that the first partial body (101) with a surface (204) is placed on the second partial body (102) with a surface (205) in such a way that the surface (204) and the surface (205), as in Fig. 2b, touch each other. This forms an interface (104). The positions of the first partial body (101) and the second partial body (102) are interchangeable.

[0084] A further variant of the method according to the invention is described in Fig. 2 c, in which a plurality of partial bodies (200) are positioned against one another using a stack sealing process such that a composite body (103) is created from the corresponding plurality of partial bodies (200) using high-temperature bonding as a special variant of thermal treatment. In this case, two partial bodies (101, 102) of the plurality of partial bodies (200) each form at least one interface (104), at which the composite body (103) is created during the high-temperature bonding.

[0085] In a further embodiment, the first partial body (101) and the second partial body (102) are each processed on the surface (204) and on the surface (205) before or after provision by means of a chemical and / or a physical processing method, whereby the surface (204) and / or the surface (205) are brought into a predefined and mutually corresponding shape, so that the surface (204) and the surface (205) at least partially contact each other when the first partial body (101) and the second partial body (102) are brought together.Since the first partial body (101), the second partial body (102) or the plurality of partial bodies (200) can deform during a temperature change from a state at room temperature to a state at an elevated temperature during high-temperature bonding, such a temperature-induced change in shape is taken into account in the shapes of the first partial body (101), the second partial body (102) or the plurality of partial bodies (200) to be achieved via a chemical and / or physical processing method and is provided for in the processing method.

[0086] In one variant of the invention, a physical machining process is, for example, a polishing process or a lapping process to polish the surface (204) and the surface (205) to a defined roughness. In another variant, a physical machining process is a machining and / or other shaping process.

[0087] In a further embodiment according to the invention, channels are formed in the body (101, 102, 103) to be thermally treated. For this purpose, the surface (204) and / or the surface (205) is machined as follows. Using a physical machining process, e.g. a machining process, a structure (206) of the first partial body and / or a structure (207) of the second partial body, each having at least one groove (209) and / or one groove (212) and / or at least one web (210) and / or one web (213), is introduced, for example, into the surface (204) and / or into the surface (205). In a further variant, the physical processing method is an ablation method in which the structure (206) of the first partial body and / or the structure (207) of the second partial body are introduced into the surface (204) and / or the surface (205) by means of a light, radical, electron or ion source.In one variant of the method, during thermal treatment, in particular during high-temperature bonding, at least one continuous channel (208) is formed in the interior of the composite body (103) from the structure (206) of the first partial body and / or the structure (207) of the second partial body. In one variant, the channel (208) consists of several sub-channels, with each two sub-channels being separated from one another by at least one wall (211). In a further variant, several independent continuous channels (208) are formed.

[0088] If a chemical process is used to process the surface of the first partial body (204) and / or the second partial body (205), a material is applied to the surface of the first partial body (204) and / or the surface of the second partial body (205) and / or removed from the surface of the first partial body (204) and / or the surface of the second partial body (205). In one variant of the invention, a chemical process for processing the surfaces (20, 205) is an additive manufacturing process.

[0089] In one variant of a method according to the invention, for example, an etching process is used to remove material from the surface of the first partial body (204) and / or the surface of the second partial body (205). Preferably, a wet-chemical etching process is used in which liquid and / or gaseous chemicals are used. In one variant of the invention, such a wet-chemical etching process is used to introduce the first structure (206) into the surface of the first partial body (204) and / or the second structure (207) into the surface of the second partial body (205). Instead of a wet-chemical etching process, a dry etching process is used as an alternative processing method in a further variant.In this case, the surface of the first partial body (204) and / or the surfaces (205) are brought into a defined shape, for example by means of a plasma source or an ion beam source, and / or the first structure (206) and the second structure (207) are introduced into the surface of the first partial body (204) and / or into the surface of the second partial body (205). It is also possible for the first structure (206) and the second structure (207) to be introduced using a lithographic process.

[0090] In a further variant of the invention, the method for processing the surface (204) and / or the surface of the second partial body (205) is a method by means of which material is deposited on the surface of the first partial body (204) and / or the surface of the second partial body (205), or only on a part of the surface of the first partial body (204) and / or the surface of the second partial body (205), using a chemical and / or physical method. In one variant, for example, a thin layer comprising at least one atomic layer of a material is applied by means of atomic layer deposition. In other embodiments, for example, chemical vapor deposition methods or sputtering methods are used to deposit a layer of a material on the surface of the first partial body (204) and / or the surface of the second partial body (205), or on part of the surfaces.

[0091] In a further aspect, the interface (104) is designed as a planar interface. In this case, the surface of the first partial body (204) and the surface of the second partial body (205) are also designed as planar surfaces. In a further aspect, the interface (104) is designed as a concave or convex surface. In a further aspect, the interface (104) is configured as a free-form surface. In cases where the interface (104) is designed as a concave surface, a convex surface, or a free-form surface, the surface of the first partial body (204) and the surface of the second partial body (205) are each designed as mutually complementary surfaces, so that planar contact results between the surface of the first partial body (204) and the surface of the second partial body (205).

[0092] In a further aspect, the first partial body (101) and the second partial body (102) are particularly advantageously connected to one another by means of wringing, so that a simpler production of an arrangement comprising the first partial body (101) and the second partial body (102) can be achieved.

[0093] If the body (101, 102, 103) to be thermally treated, for example the first partial body (101) and the second partial body (102), is arranged in an arrangement according to the invention as described above, the body (101, 102, 103) to be thermally treated is provided as in Fig. 1, the casing body (105) is positioned within the temperature-controlled space (108) containing the medium (111). The casing body (105) encloses the body (101, 102, 103) to be thermally treated in a contactless manner, as described above. Subsequently, a body (101, 102, 103) to be thermally treated is produced by thermal treatment. For example, a composite body (103) is produced from the first partial body (101) and the second partial body (102) at the interface (104) by high-temperature bonding.

[0094] Fig. Figure 3a shows a schematic representation of a body (101, 102, 103) to be thermally treated during the thermal treatment, wherein all parts of the device (100) according to the invention have been deliberately omitted for a better illustration of the partial aspects during the thermal treatment explained below. The body (101, 102, 103) to be thermally treated according to the invention comprises a first arbitrary sectional plane of a first constant height (305) and an arbitrary second sectional plane of a second constant height (306). The first arbitrary sectional plane of the first constant height (305) further comprises a first arbitrary infinitesimal surface element (302) and an arbitrary second infinitesimal surface element (304). Likewise, the arbitrary second sectional plane of the second constant height (306) comprises an arbitrary third infinitesimal surface element (308) and an arbitrary fourth infinitesimal surface element (314).

[0095] Fig. Figure 3b shows a schematic representation of an embodiment during a method for thermal treatment according to the invention. As illustrated by a first temperature distribution (316) within the arbitrary first sectional plane of the first constant height (305), a first local temperature (301) prevails at any first infinitesimal surface element (302) during thermal treatment, and a second local temperature (303) prevails at any second infinitesimal surface element (304). Likewise, according to a second temperature distribution (317) within the arbitrary second sectional plane of the second constant height (306), a third local temperature (307) prevails at any third infinitesimal surface element (308) during high-temperature bonding, and a fourth local temperature (309) prevails at any fourth infinitesimal surface element (314).In this definition of the cutting planes of constant height (305, 306), the infinitesimal surface elements (302, 304, 308, 314), etc. used below, any choice of the height of the corresponding cutting plane of constant height (305, 306) of the body to be thermally treated (101, 102, 103), for example within the composite body (103), means any choice of the position of the infinitesimal surface element (302, 304, 308, 314) within a cutting plane of constant height (305, 306), etc., with the restriction that any cutting plane (305, 306), any surface element (302, 304, 308, 314), etc., does not always involve the same cutting plane (305, 306), the same infinitesimal surface element (302, 304, 308, 314), etc.

[0096] Since in the inventive use of the device (100), as in Fig. 1, the jacket body (105) encloses the body (101, 102, 103) to be thermally treated without contact during high-temperature bonding, the jacket body (105) at least partially prevents an unhindered heat exchange between the medium (111) and the body (101, 102, 103) to be thermally treated, for example via the surface (112) of the composite body (103). According to the invention, such an unhindered heat exchange between the medium (111) and the body (101, 102, 103) to be thermally treated takes place via the surface (315) of Fig. 3a, since the surface (315) is not enclosed by the casing body (105) without contact. As a result, the first temperature (301) and the second local temperature (303) assume values ​​that differ from one another by a maximum of 1 K. Since an insulating effect of the casing body (105) according to the invention does not perfectly suppress heat conduction within any first sectional plane of the first constant height (305), it is possible that slight temperature differences exist between the first local temperature (301) and the second local temperature (303), which, however, should not be greater than 1 K according to the invention.

[0097] Since an unhindered heat exchange between the medium (111) and the body to be thermally treated (101, 102, 103) takes place via the surface (315) not enclosed by the casing body (105), a first local temperature (301) and a third local temperature (307) can differ from one another at least temporarily due to an ongoing heat exchange between the body to be thermally treated (101, 102, 103) and the medium (111) at the surface (315), as well as a resulting entropy-driven heat transport within the body to be thermally treated (101, 102, 103).In this case, a difference between a first local temperature (301) and a third local temperature (307) is greater, the further apart the arbitrary first cutting plane of the first constant height (305) and the arbitrary second cutting plane of the second constant height (306) are and the greater an at least temporarily existing temperature difference between a temperature of the medium (111) or the furnace bottom and a temperature at the surface (315) is.

[0098] Fig. Figure 3 c shows a schematic representation of a further aspect of a method according to the invention for thermally treating the body (101, 102, 103) to be thermally treated. In this aspect, a first local temperature profile (311) is approximately linear within the body (101, 102, 103) to be thermally treated, starting from the arbitrary first infinitesimal surface element (302) with a first local temperature (301) along a first normal (310) to the arbitrary third infinitesimal surface element (308) with the third local temperature (307).In the sense of the invention, a linearity of the temperature profile (311) means that the gradient of a first local temperature profile (311) at any height of the body to be thermally treated (101, 102, 103) differs by a maximum of 5% from an averaged temperature gradient which is calculated via a corresponding local temperature profile (311) over the entire height of the body to be thermally treated (101, 102, 103).At the same time, within the same body to be thermally treated (101, 102, 103), starting from the arbitrary second infinitesimal surface element (304) with the second local temperature (303) along the second normal (312) of the arbitrary first sectional plane of the first constant height (305) to the arbitrary fourth infinitesimal surface element (314) with the fourth local temperature (309), the second local temperature profile (313) is also approximately linear, wherein a linearity of the second local temperature profile (313) in the sense of the invention is defined analogously to the linearity of the first local temperature profile (311).

[0099] Since different expansion states of the material of the body to be thermally treated (101, 102, 103) develop during the formation of the temperature profile (311) and / or the temperature profile (313) inside the body to be thermally treated (101, 102, 103), the temperature profile (311) and / or the temperature profile (313) is accompanied by a density profile within the material of the body to be thermally treated (101, 102, 103), wherein the density changes by at least 10 ppm along the temperature profile (311) and / or the temperature profile (313).Since the degree of crystallization of the material of the body to be thermally treated (101, 102, 103) also depends on the temperature, this can lead to the formation of different degrees of crystallization and possibly different crystallization states in the form of thermodynamic phases of the material along the temperature profile (311) and / or the temperature profile (313). In one aspect, the degree of crystallization changes by more than 10 ppm, but not more than 10%, along the temperature profile (311) and / or the temperature profile (313). If a temperature profile (311) and / or a temperature profile (313) has a linear profile within the meaning of the invention, a density profile in the same direction can also have an analogous linear profile.According to the invention, a temperature gradient of the temperature profile (311) and / or a temperature gradient of the temperature profile (313) is 20-1000 K / m, wherein the temperature gradient averaged over the first local temperature profile (311) and the temperature gradient averaged over the second local temperature profile (313) differ by no more than 5%. In this case, an approximately homogeneous heat transport to the surface (315) takes place across the entire cross-section of the body to be thermally treated (101, 102, 103). By cooling the body to be thermally treated (101, 102, 103) to room temperature according to the invention, a constant density gradient exists within the body to be thermally treated (101, 102, 103), which causes a reduced formation of stresses in the interior of the body to be thermally treated (101, 102, 103).

[0100] Fig. 4 shows, in a further aspect of an embodiment of the method according to the invention, a schematic representation of a temporal temperature profile (400) of the medium (111) in the space (108) which can be tempered via the heating element (109) and the control unit (110).The temporal temperature profile (400) for a complete high-temperature bonding process comprises a heating phase (401) starting from a first temperature (402) to a second temperature (403), in which the body to be thermally treated (101, 102, 103) is heated with a temporal temperature ramp for heating (404), a holding phase (405) in which the body to be thermally treated (101, 102, 103) is thermally treated with a temporally constant second temperature (403), and a cooling phase (406) starting from the second temperature (403) to the first temperature (402), in which the body to be thermally treated (101, 102, 103) thermally treated by the above process is cooled with a temporal temperature ramp for cooling (407).

[0101] In a specific variant of the invention, the temperature of the medium (111) is controlled in a time-varying manner via the control unit (110) throughout the entire temperature profile (400), in particular during the heating phase (401) and the cooling phase (406). A temperature change controlled via the control unit (110) within the temperature profile (400), in particular during the heating phase (401) or the cooling phase (406), translates into a corresponding heating rate or cooling rate.

[0102] In a further variant of a method according to the invention, this is a constant heating rate or a constant cooling rate, which leads to a linear temperature change during, for example, the heating phase (401) and the cooling phase (406).

[0103] In a further variant of a method according to the invention, a heating rate and a cooling rate are set to vary over time, resulting in correspondingly nonlinear temperature changes during the temperature profile (400), in particular for the temperature ramp for heating (404) and for the temperature ramp for cooling (407). A temperature change that varies nonlinearly over time involves, for example, sigmoidal temperature changes, a logarithmic temperature change, exponential temperature changes, or step-like temperature changes.

[0104] The precise durations of the individual heating phases (401), the holding phase (405), and the cooling phase (406) depend on the materials used for the body to be thermally treated (101, 102, 103) and the casing body (105), as well as on their existing shapes and geometries. Precise experimental values ​​can be calculated, for example, using finite element simulations. According to the invention, the duration of the heating phase (401) and the holding phase (405) is in the range of a few hours to a few days. According to the invention, the duration of the cooling phase (406) is in the range of a few hours to three months, preferably in the range of one week to two months, more preferably in the range of one week to one month.

[0105] Since, in order to effect heat exchange, there must be direct contact between the medium (111) and the body (101, 102, 103) to be thermally treated, as well as the jacket body (105), the temperature profile (400) at a position inside the body (101, 102, 103) to be thermally treated or the jacket body (105) is fundamentally similar to a Fig. 4. A thermal conductivity coefficient of the materials used for the body (101, 102, 103) to be thermally treated, as well as for the casing body (105), determines how quickly a temperature change at a position inside the body (101, 102, 103) to be thermally treated or the casing body (105) follows a temperature change in a temperature profile (400) of a medium (111). In order to achieve the most uniform temperature distribution possible in all gaseous and solid materials located in a temperature-controlled space (108) of the temperature control unit (106), temperature changes in the temperature profile (400) of the medium (111) of at most 100 K / hour, preferably 1 K / hour, more preferably 0.01 K / hour are specified according to the invention.

[0106] Fig. 5 a shows, in a further aspect of an embodiment of the method according to the invention, a schematic representation of a part of the temperature profile (400) during the thermal treatment.In this aspect, the adjustable temperature ramp for cooling (407) with a temporally non-linear course of the medium (111) surrounding the casing body (105) and the body to be thermally treated (101, 102, 103) consists of a first component (506) which continuously decreases from a first temperature (504) to a second temperature (505) and has an adjustable cooling rate, the first temperature (504), and the second temperature (505), as well as a second component (509) with a periodic temperature change starting from a third temperature (507) to a fourth temperature (508) with the third temperature (507) which can be adjusted in each case via the control unit (110), the fourth temperature (508), an amplitude, a period, a phase, as well as an attenuation and / or an amplification.The first temperature (504) is advantageously set such that the value of the first temperature (504) corresponds to the first temperature (403) set during the holding phase (405). The second temperature (505) is advantageously set such that the value of the second temperature (505) corresponds to the second temperature (402) set during the cooling phase (406). The temperature profile of the first component (506) is designed as a linear profile, an exponential profile, a sigmoidal profile, or a logarithmic profile. The third temperature (507) is advantageously likewise set such that the value of the third temperature (507) corresponds to the second temperature (403) set during the holding phase (405). The fourth temperature (508) is also advantageously set such that the value of the fourth temperature (508) corresponds to the first temperature (402) set during the cooling phase (406).For the sake of clarity, the first component (506) and the second component (509), as well as the associated temperatures, are shown offset on the y-axis representing the temperature. The value of the third temperature (507) and the fourth temperature are defined by setting a period and a phase of a second component (509). In one variant of the invention, the period of the second component (509) is constant over time. In a further variant of the invention, the period of the second component is variable over time. The parameters of a temperature ramp for cooling (407), which can be set according to the invention via the control unit (110), depend on influences of the embodiment and are determined using finite element calculations.These include the geometry and dimensions, the material, the thermodynamic phase diagram, the density, the heat capacity, the thermal conductivity, the hardness, or the ductility of the material of the body to be thermally treated (101, 102, 103) and / or the shell body (105). It should be noted that the above list is not exhaustive.

[0107] In Fig. Figure 5b shows a schematic representation of a further aspect of an embodiment of the method according to the invention of a portion of the temperature profile (400) during thermal treatment. In this aspect, a periodic component (509) of the temperature ramp for cooling (407), which is controlled via the operating parameters of the temperature control unit (106) and optionally in a specific embodiment of the control unit (110), effects a first periodic profile of a temperature ramp (511) inside the body (101, 102, 103) to be thermally treated, wherein the first periodic temporal profile of the temperature ramp (511) and a second periodic temporal profile of a temperature ramp (510) of the medium (111) differ in the respective amplitude, the respective phase, the respective frequency, the respective attenuation, and / or the respective amplification.The first periodic course of the temperature ramp (511) inside the body to be thermally treated (101, 102, 103) at any first time (513) and at any second time (515) always follows the second periodic course of the temperature ramp (510) in a delayed and damped manner due to a heat exchange between the medium (111) and the body to be thermally treated (101, 102, 103) as well as a heat diffusion within the body to be thermally treated (101, 102, 103) during the thermal treatment.

[0108] In Fig. Figure 5 c shows a schematic representation of a further aspect of an embodiment of the thermal treatment method according to the invention.In this aspect, an adjustment of the operating parameters of the temperature control unit (106), and in a specific embodiment of the control unit (110), the periodic component (509) of the temperature ramp for cooling (407) of the medium (111) within the arbitrary first sectional plane of constant height (305) effects the first spatial temperature profile (512) at the arbitrary first point in time (513), as well as the second spatial temperature profile (514) at the second point in time (515), wherein the second point in time (515) is shifted in time by half a period of the second component (509) of the temperature ramp for cooling (407) relative to the arbitrary first point in time (513), and wherein the first spatial temperature profile (512) has an at least partially inverted profile relative to the second spatial temperature profile (514).Since an insulating effect of the casing body (105) according to the invention does not perfectly suppress heat conduction within the body to be thermally treated (101, 102, 103) to the surface (114) of the body to be thermally treated (101, 102, 103), slight temperature differences occur during the cooling phase (406) within the arbitrary first sectional plane of the first constant height (305) between the first local temperature (301) of the arbitrary first infinitesimal surface element (302) and the second local temperature (303) of the arbitrary second infinitesimal surface element (304), which lead to the formation of the first spatial temperature profile (512). The fundamental formation of such a first spatial temperature profile (512) is independent of the type of temporal profile of the temperature ramp for cooling (407), which is controlled, for example, via the control unit (110).However, the temperature profile (512) and the magnitude of the local temperature gradient depend on a temporary cooling rate during the cooling phase (406), as well as on the physical and geometric properties of the body to be thermally treated (101, 102, 103) and the shell body (105). Determining properties include, for example, the geometry, dimensions, chemical composition, density, heat capacity, thermal conductivity, hardness, ductility, and the presence of any phase transitions occurring in the considered temperature and pressure range in the material of the body to be thermally treated (101, 102, 103) and the shell body used (105).By an inversion of the first spatial temperature profile (512) towards the second temperature profile (514), which is brought about at least partially over a periodic profile of the temperature ramp (511) during the cooling phase (406), mechanical stresses at the interface (104) are at least partially compensated in such a way that a spatial temperature profile averaged over the temporal profile of a full period of the periodic profile of the temperature ramp (511) is minimized, wherein according to the invention the spatial temperature profile averaged over the temporal profile of a full period of the periodic profile of the temperature ramp (511) has a temperature range of < 10 K.Since viscosity in glasses changes nonlinearly with temperature, mechanical stresses dissipate more quickly in the case of a temperature inversion than they build up in non-temporarily inverted temperature gradients caused purely by heat diffusion. Therefore, short and weak temperature inversions are sufficient to relieve the residual stresses.

[0109] The amplitude and period of the periodic temperature change of component (509) determine the Fig. 5 b and Fig. 5 c during the thermal treatment. In a variant of the method according to the invention, the period of the component (509) is selected such that an amplitude of a wave-shaped heat diffusion in the interior of the body to be thermally treated (101, 102, 103) during the cooling phase (406) is damped to less than half the amplitude of the periodic temperature change of the component (509) in the medium (111). A period according to the invention therefore lies in a time range greater than one second and less than one month. The amplitude of the periodic temperature change of the component (509) is set according to the invention such that an amplitude in Fig. 5 c, the inversion of a temperature profile is achieved at any first point in time (513) relative to the second point in time (515). According to the invention, the amplitude of the periodic temperature change of the component (509) in the medium (111) exceeds a maximum temperature difference occurring during the thermal treatment inside the body (101, 102, 103) to be thermally treated during the cooling phase (406). A maximum amplitude of a periodic temperature change (509) according to the invention is selected in the range greater than 5K and less than 250K, wherein the damping and / or amplification of the amplitude during the cooling phase is taken into account according to the invention.

[0110] In a further variant of the invention, the entire tempering process is carried out according to the Fig. 4 and Fig. 5, several times in succession. In a further variant of the invention, the parameters of the tempering process are identical between the individual runs. In a further variant, the parameters of the tempering process are different between the individual runs. In a further variant of the method, chemical, structural and / or physical properties of the body to be thermally treated (101, 102, 103) are compared with desired specified values ​​between individual runs of the tempering process using a suitable chemical and / or physical measuring method.

[0111] In Fig. Figure 6 shows a schematic representation of an optical element (609) produced from the body (101, 102, 103) to be thermally treated according to the method according to the invention. In the example shown, this is in particular a reflective optical element (609), further in particular a reflective optical element (609) for reflecting EUV radiation (610).

[0112] In the example shown, the body (101, 102, 103) to be thermally treated is machined on the surface (315) by means of a chemical and / or physical machining process to form a substrate (611) according to the invention. In the embodiment shown, a surface (612) of the substrate (611) is machined by means of a chemical and / or physical machining process to form a concavely curved surface. Alternatively, the surface (612) can be machined by means of a chemical and / or physical machining process to form a planar surface. In a further variant of the invention, the surface (612) can be machined by means of a chemical and / or physical machining process to form a convex surface or a freeform surface.Furthermore, a reflective coating (613), in particular one that reflects EUV radiation, is applied to the surface (612) of the substrate (611) by a second chemical and / or physical processing method. In the example shown, the coating (613) is composed of a plurality of alternating layers, each with differing physical properties, in particular optical properties, e.g., differences in refractive index. In one variant, the coating (613) comprises, for example, alternating layers of molybdenum and silicon, so that the coating (613) is designed as a coating that reflects EUV light in the spectral range between 5 - 30 nm, in particular at 13.5 nm.

[0113] In a further aspect of an embodiment of the optical element (609) according to the invention, at least one continuous channel (208) is configured within the substrate (611) for actively heating and / or actively cooling the substrate (611) and the reflective coating (613), in particular a coating reflecting EUV radiation, applied to the surface (612) of the substrate (611), by means of liquid and / or gaseous media. The at least one continuous channel (208) has, as in Fig. 6, has a round cross-sectional shape. In one variant of the invention, the cross-sectional shape of the continuous channel (208) is angular or oval. In a further variant of the invention, the at least one continuous channel (208) extends over the entire cross-section of the substrate (611), or only over parts of the cross-section of the substrate (611), with individual sub-channels of the continuous channel (208) being separated from one another by walls (211). In one variant of the invention, the channel (208) is a spiral-shaped channel (208) configured over the cross-section of the substrate (611). In another variant, a channel (208) configured over the cross-section of the substrate (611) is meander-shaped.In further embodiments, linear geometries, geometries curved towards the center of the body to be thermally treated (101, 102, 103) or towards a surface of the substrate (611), or variants of the at least one channel (208) designed as pseudo-two-dimensional networks across the cross-section of the substrate (611) are used. In a further variant, there are a plurality of channels, wherein each individual channel (208) of the plurality of channels is designed as an independent channel (208). In a specific variant of the embodiment, the distance between the channels is constant. In a further specific variant, the distance between the channels is spatially varying. In a further variant, the distance between the channels and a surface of the body to be thermally treated (101, 102, 103) is constant.In a further variant, the distance of the channels to a surface of the body to be thermally treated (101, 102, 103) varies. In a further variant, the diameter of the channels of the body to be thermally treated (101, 102, 103) is spatially constant. In a further variant, the diameter of the channels of the body to be thermally treated (101, 102, 103) varies spatially. In a further variant, the shape of the channels of the body to be thermally treated (101, 102, 103) is spatially constant. In a further variant, the shape of the channels of the body to be thermally treated (101, 102, 103) varies spatially.

[0114] In Fig. Figure 7 shows a schematic representation of the use of the optical element (609) within a semiconductor technology system (700). A projection exposure system is shown as an example of the semiconductor technology system (700). The reflective optical element (609) is configured as one or more mirrors M1-M11 for reflecting radiation, in particular EUV radiation. In a further embodiment, the semiconductor technology system (700) can be designed as a wafer inspection system. In a further embodiment, the semiconductor technology system (700) can be designed as a mask inspection system.The semiconductor technology system (700) is characterized in that an optical element (609), in particular a reflective optical element (609), is temperature-controlled by means of a temperature-control device (723-733) via a channel (208) according to the invention located in the optical element (609), in particular in the reflective optical element (609). The process of temperature-controlling the optical element (609), in particular the reflective optical element (609), via a channel (208), involves a heating process and / or a cooling process. During a heating process and / or a cooling process, a medium flows through a channel (208). The temperature of the medium is regulated via one of the temperature-control devices (723-733). The temperature-control devices (723-733) have corresponding connections and lines for supplying or discharging the medium into or from the at least one channel (208).In one variant of the invention, the temperature control devices (723-733) comprise at least one pump or the like to continuously circulate the medium. It is also possible for the temperature control devices (723-733) to be connected to a supply unit via a connection, in which case the supply unit is not part of the semiconductor technology system (700).

[0115] In one variant of the invention, the medium used for a heating process and / or a cooling process is water, in particular ultra-pure water, wherein the water has a conductivity of < 0.1 µS / cm. In a further variant, chemical compounds are added to the water to prevent contamination of the water with biological material. In a further variant, chemical compounds are added to the water to extend the applicable temperature range for the flowing medium or to reduce corrosion in elements contacted by the water. In a further variant of the invention, the medium used for a heating process and / or a cooling process is a gas, in particular ultra-pure compressed air, furthermore in particular an inert gas, for example nitrogen or argon, or volatile organic compounds or alkali metals.

[0116] It is understood that the use of the substrate (611) and the channel (208) contained therein for tempering the substrate (611), as well as the optical element (609) and the channel (208) contained therein for tempering the one optical element (609) is not limited to use within a semiconductor technology system (700).

[0117] In the following, and with reference to the Fig. 7 describes the essential components of a system for semiconductor technology (700) using the example of a projection exposure system for microlithography.

[0118] One embodiment of an illumination system (701) of the projection exposure system has, in addition to a radiation source (702), an illumination optics (703) for illuminating an object field (704) in an object plane (705). In an alternative embodiment, the light source (702) is also provided as a module separate from the rest of the illumination system. In this case, the illumination system does not include the light source (702).

[0119] A reticle (706) arranged in the object field (704) is illuminated. The reticle (706) is held by a reticle holder (707). The reticle holder (707) can be displaced, in particular in a scanning direction, via a reticle displacement drive (708).

[0120] In the Fig. For illustrative purposes, a Cartesian xyz coordinate system is shown in Figure 7. The x-direction is perpendicular to the plane of the drawing. The y-direction is horizontal, and the z-direction is vertical. The scanning direction is in the Fig. 7 along the y-direction. The z-direction is perpendicular to the object plane (705).

[0121] The projection exposure system comprises projection optics (709). The projection optics (709) serve to image the object field (704) into an image field (710) in an image plane (711). The image plane (711) runs parallel to the object plane (705). Alternatively, an angle other than 0° between the object plane (705) and the image plane (711) is also possible.

[0122] A structure located on the reticle (706) is imaged onto a light-sensitive layer of a substrate (712) arranged in the image plane (711) in the region of the image field (710). This substrate (712) is generally a wafer. The wafer (712) is held by a wafer holder (713). The wafer holder (713) can be displaced, in particular along the y-direction, via a wafer displacement drive (714). In one variant of the invention, the displacement of the reticle (706) via the reticle displacement drive (708) on the one hand and the wafer (712) via the wafer displacement drive (714) on the other hand are synchronized with one another.

[0123] The radiation source (702) is an EUV radiation source. The radiation source (702) emits, in particular, EUV radiation (715), which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation has, in particular, a wavelength in the range between 5 nm and 30 nm. In one variant of the invention, the radiation source (702) is a plasma source, for example, an LPP source (laser produced plasma, plasma generated by a laser) or a GDPP source (gas discharged produced plasma, plasma generated by gas discharge). In another variant, it is a synchrotron-based radiation source or a free-electron laser (FEL).

[0124] The illumination radiation (715) emanating from the radiation source (702) is concentrated by a collector (716). In one variant of the invention, the collector (716) is a collector with one or more spherical, ellipsoidal, parabolic, cylindrical, and / or hyperboloidal reflection surfaces, for example with nested Wolter-type shells. In a specific embodiment, the at least one reflection surface of the collector (716) is exposed to the illumination radiation (715) at grazing incidence (GI), i.e., at angles of incidence greater than 45° relative to the normal direction of the mirror surface, or at normal incidence (NI), i.e., at angles of incidence less than 45°. In a further variant, the collector (716) is structured and / or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.

[0125] After the collector (716), the illumination radiation (715) propagates through an intermediate focus in an intermediate focal plane (717). In one variant of the invention, the intermediate focal plane (717) represents a separation between a radiation source module, comprising the radiation source (702) and the collector (716), and the illumination optics (703).

[0126] The illumination optics (703) comprise a deflecting mirror (718) and, downstream of this in the beam path, a first facet mirror (719). In one variant of the invention, the deflecting mirror (718) is a planar deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. In further variants, alternatively or additionally, the deflecting mirror (718) is designed as a spectral filter that separates a useful light wavelength of the illumination radiation (715) from stray light of a different wavelength. If the first facet mirror (719) is arranged in a plane of the illumination optics (703) that is optically conjugated to the object plane (705) as a field plane, it is also referred to as a field facet mirror. The first facet mirror (719) comprises a plurality of individual first facets (720), which are also referred to below as field facets. Of these facets (720), Fig. 7 only some examples are shown.

[0127] In one variant, the first facets (720) are designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour. In another variant, the first facets (720) are designed as flat facets or, alternatively, as convex, concave, or astigmatically curved facets.

[0128] As is known, for example, from [DE 102008009600A1], in a further variant, the first facets (720) themselves are also composed of a plurality of individual mirrors, in particular a plurality of micromirrors. In a specific variant, the first facet mirror (719) is designed, in particular, as a microelectromechanical system (MEMS system). For details, reference is made to [DE 102008009600A1].

[0129] Between the collector (716) and the deflecting mirror (718), the illumination radiation (715) runs horizontally, i.e. along the y-direction.

[0130] In the beam path of the illumination optics (703), a second facet mirror (721) is arranged downstream of the first facet mirror (719). If the second facet mirror (721) is arranged in a pupil plane of the illumination optics (703), it is also referred to as a pupil facet mirror. In a further variant, the second facet mirror (721) is also arranged at a distance from a pupil plane of the illumination optics (703). In this case, the combination of the first facet mirror (719) and the second facet mirror (721) is also referred to as a specular reflector. Specular reflectors are known from [US20060132747A1] and [US6573978].

[0131] The second facet mirror (721) comprises a plurality of second facets (722). In the case of a pupil facet mirror, the second facets (722) are also referred to as pupil facets.

[0132] In a specific embodiment, the second facets (722) are macroscopic facets, for example, with round, rectangular, or hexagonal edges, or alternatively facets composed of micromirrors. Reference is also made to [DE102008009600A1] in this regard.

[0133] In a variant of the invention, the second facets (722) have planar or alternatively convex or concave or astigmatically curved reflection surfaces.

[0134] The illumination optics (703) thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (fly's eye integrator).

[0135] In one embodiment, it is advantageous not to arrange the second facet mirror (721) exactly in a plane that is optically conjugated to a pupil plane of the projection optics (709). In one variant, in particular, the pupil facet mirror (721) is arranged tilted relative to a pupil plane of the projection optics (709), as described, for example, in [DE102017220586A1].

[0136] The second facet mirror (721) projects the individual first facets (720) into the object field (704). The second facet mirror (721) is the last beam-forming mirror, or indeed the last mirror for the illumination radiation (715) in the beam path before the object field (704).

[0137] In a further, not shown embodiment of the illumination optics (703), a transmission optics is arranged in the beam path between the second facet mirror (721) and the object field (704), which transmission optics contributes in particular to the imaging of the first facets (720) in the object field (704). The transmission optics has exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics (703). In further variants, the transmission optics comprises in particular one or two mirrors for normal incidence (NI mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors).

[0138] The projection exposure system comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system.

[0139] The illumination optics (703) has in the version shown in the Fig. 7, after the collector (716) (M1) there are, for example, three mirrors, a deflection mirror (718) (M2), a field facet mirror (719) (M3) and a pupil facet mirror (721) (M4).

[0140] In a further embodiment of the illumination optics (703), the deflection mirror (718) is omitted, so that the illumination optics (703) then has two mirrors after the collector (716), namely the first facet mirror (719) and the second facet mirror (721).

[0141] The imaging of the first facets (720) by means of the second facets (722) or with the second facets (722) and a transmission optics into the object plane (705) is usually only an approximate imaging.

[0142] In the Fig. In the example shown in Figure 7, the projection optics (709) comprises six mirrors M6 to M11. Alternatives with four, eight, ten, twelve, or a different number of mirrors Mi are also possible. Odd numbers of mirrors are also possible. The penultimate mirror M10 and the last mirror M11 each have a passage opening for the illumination radiation (715). The projection optics (709) are doubly obscured optics. The projection optics (709) have an image-side numerical aperture that is greater than 0.5, for example, greater than 0.6, or that is, for example, 0.7 or 0.75. Numerical apertures of less than 0.5, for example, 0.25 or 0.33, are also possible.

[0143] In one variant of the invention, the reflection surfaces of the mirrors Mi are designed as freeform surfaces without a rotational symmetry axis. In an alternative, the reflection surfaces of the mirrors Mi are designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. According to the invention, the mirrors Mi, just like the mirrors of the illumination optics (703), have highly reflective coatings for the illumination radiation (715). These coatings are designed according to the invention as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0144] The projection optics (709) have a large object-image offset in the y-direction between a y-coordinate of a center of the object field (704) and a y-coordinate of the center of the image field (710). This object-image offset in the y-direction is approximately equal to a z-distance between the object plane (705) and the image plane (711).

[0145] Each of the pupil facets (722) is assigned to precisely one of the field facets (720) to form a respective illumination channel for illuminating the object field (704). It is also possible for a reflection from one field facet (720) to be directed onto different pupil facets (722). This results, in particular, in illumination according to the Köhler principle. The far field of the source is divided into a plurality of object fields (704) with the aid of the field facets (720). The field facets (720) generate a plurality of images of the intermediate focus on the pupil facets (722) assigned to them.

[0146] The field facets (720) are each imaged onto the reticle (706) by one or more associated pupil facets (722) in a superimposed manner to illuminate the object field (704). The illumination of the object field (704) is, in particular, as uniform as possible. It preferably has a uniformity error of less than 2%. In one variant, the field uniformity is achieved by superimposing different illumination channels.

[0147] The illumination of the entrance pupil of the projection optics (709) is geometrically defined by arranging the pupil facets. The intensity distribution in the entrance pupil of the projection optics (709) is adjusted by selecting the illumination channels, particularly the subset of the pupil facets that guide light. This intensity distribution is also referred to as the illumination setting.

[0148] A likewise preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics (703) is achieved by a redistribution of the illumination channels.

[0149] In the following, further aspects and details of the illumination of the object field (704) and in particular of the entrance pupil of the projection optics (709) are described.

[0150] The projection optics (709) particularly have a homocentric entrance pupil. In one variant of the invention, this is accessible. In another variant of the invention, it is inaccessible.

[0151] The entrance pupil of the projection optics (709) cannot usually be precisely illuminated with the pupil facet mirror (721). When the projection optics (709) images the center of the pupil facet mirror (721) telecentrically onto the wafer (712), the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugated to it in spatial space. In particular, this surface exhibits a finite curvature.

[0152] In one embodiment, the projection optics (709) have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror (721) and the reticle (706). This optical element takes into account the different positions of the tangential entrance pupil and the sagittal entrance pupil.

[0153] In the Fig. In the arrangement of the components of the illumination optics (703) shown in Figure 7, the pupil facet mirror (721) is arranged in a surface conjugated to the entrance pupil of the projection optics (709). The field facet mirror (719) is arranged tilted relative to the object plane (705). The first facet mirror (719) is arranged tilted relative to an arrangement plane defined by the deflection mirror (718).

[0154] The first facet mirror (719) is arranged tilted to an arrangement plane which is defined by the second facet mirror (721).

[0155] In a further variant, one or more of the mirrors M1-M11 are designed as reflective optical elements (609) with at least one channel (208) located inside the reflective optical element (609). In this case, the temperature control devices (723-733) belong to the mirrors M1-M11. In this case, one of the temperature control devices (723-733) is assigned to one of the elements M1-M11. It is also possible for one of the temperature control devices (723-733) to be used to control the temperature of more than one reflective optical element (609). In this case, the required number of temperature control devices (723-733) is reduced accordingly. In one variant of the invention, the temperature control devices (723-733) are designed such that a fluid flowing in the at least one channel (208) is temperature-controlled.

[0156] In one variant, the temperature control devices (723-733) comprise sensors that measure a temperature of the fluid flowing through the at least one channel (208) during operation of the projection exposure system and regulate the temperature of the fluid to a defined target value via an integrated control system of the temperature control devices (723-733). The temperature control devices (723-733) additionally contain sensors for measuring temperatures at positions on the reflective surface of the mirrors M1-M11 or in the vicinity of the reflective surface of the mirrors M1-M11. In this case, the temperature of the fluid flowing through the channel (208) is determined by comparing the temperatures of the fluid flowing through the channel (208) and the positions on the reflective surface of the mirrors M1-M11 or in the vicinity of the reflective surface of the mirrors M1-M11.In further embodiments, the temperature control devices (723-733) additionally comprise various further sensors, which, for example, determine the quality of the fluid flowing in the channel (208) via conductivity measurements of the fluid, via pH measurements of the fluid, or via spectroscopic measurements of the fluid. In further embodiments, sensors are also used which measure the flow velocity of the fluid. Furthermore, in further variants, sensors are used which measure the pressure of the fluid inside the channel (208). All sensors contained in the temperature control devices (723-733) are described in the . Fig. 7 signal line units and evaluation units not explicitly shown are used. List of reference symbols 100 device 101 First partial body 102 Second part of the body 103 composite bodies 104 Interface 105 mantle body 106 Temperature control unit 107 Surface 108 Temperature-controlled room 109 Heating element 110 Control unit 111 Medium 112 Surface of a first partial body 113 Surface of a second partial body 114 Surface of a composite body 200 variety of partial bodies 204 First Surface 205 Second Surface 206 First Structure 207 Second Structure 208 channel 209 groove 210 jetty 211 Wall 212 groove 213 jetty 301 First local temperature 302 First infinitesimal surface element 303 Second Local Temperature 304 Second infinitesimal area element 305 First cutting plane of a first constant height 306 Second cutting plane of a second constant height 307 Third local temperature 308 Third infinitesimal area element 309 Fourth Local Temperature 310 First Normal 311 First local temperature trend 312 Second Normal 313 Second local temperature profile 314 Fourth Infinitesimal Area Element 315 Surface 316 First temperature distribution 317 Second temperature distribution 400 Temperature curve 401 Heating phase 402 First Temperature 403 Second Temperature 404 Temperature ramp for heating 405 Connection phase 406 Cooling phase 407 Temperature ramp for cooling 504 First Temperature 505 Second Temperature 506 First component 507 Third Temperature 508 Fourth Temperature 509 second component 510 First periodic course of a temperature ramp 511 Second periodic course of a temperature ramp 512 First spatial temperature profile 513 First point in time 514 Second spatial temperature profile 515 Second point in time 609 Element 610 EUV radiation 611 Substrat 612 Surface 613 Coating 700 semiconductor technology plant 701 lighting system 702 Radiation source 703 Lighting optics 704 Object field 705 Object level 706 reticles 707 Reticle holder 708 Reticle displacement drive 709 Projection optics 710 image field 711 Image plane 712 wafers 713 wafer holder 714 wafer relocation drive 715 EUV radiation 716 collector 717 Intermediate focal plane 718 Deflecting mirror 719 facet mirrors 720 facets 721 facet mirror 722 facets 723 - 733 Temperature control devices 734 Cooling of the wafer chuck M1-M11 Mirror of a projection exposure system M5 Reticle QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 102019405265A1

[0004] US 1 1028006

[0016] DE 102019205265A1

[0017] DE 102008009600A1 [0128, 0132] US 20060132747A1

[0130] US 6573978

[0130] DE 102017220586A1

[0135] Cited non-patent literature

[0000] Stress in optical glass“, Juli 2004, S. 1- 13, https: / / www.schott.com / shop / medias / schott-tie-27-stress-in-optical-glass-eng.pdf?context=bWFzZdGVyfHJvb3R8NjkzNjASfGFweGxpY2F0aW9uL3BkZnxoYW MvaGViLzg4MT cOMDkONT gyMDYucGRmfGY50DdhODU3Mj U4ZGNj NT c3M 0 IxOG JIYTY4OTY3NTA2MGQ4ZDg0NWJjMjE5N2E0MjkxMzg0NDYxM2U0ZjJhM2U

[0015]

Claims

[1] Device (100) for thermally treating a body (101, 102, 103) to be thermally treated, wherein the body (101, 102, 103) to be thermally treated is designed as - a monolithic body, - or a composite body (103), - or an arrangement of first partial bodies (101) and second partial bodies (102) contacting each other at an interface (104), wherein the device (100) further comprises - a jacket body (105), - a temperature-controlled space (108) within a temperature control unit (106), - one or more heating elements (109), characterized by , that the jacket body (105) encloses the body (101, 102, 103) to be thermally treated without contact both before, during and after the thermal treatment. [2] Device (100) according to claim 1, characterized bythat the casing body (105) takes on the outside the shape of a cylinder with an elliptical shape in the cross-section of the cylinder with a numerical eccentricity in the range 0-0.

1. [3] Device (100) according to one of the preceding claims, characterized by that each surface (107) of the casing body (105) has a distance of at least 0.1 mm and a distance of at most 30 mm from a surface (112, 113, 114) of the body to be thermally treated (101, 102, 103). [4] Device (100) according to one of the preceding claims, characterized by that the body to be thermally treated comprises an amorphous silicon-containing glass and / or a semi-crystalline ceramic. [5] Device according to one of the preceding claims, characterized by that the body to be thermally treated comprises a titanium-doped quartz glass. [6] Device (100) according to one of the preceding claims, characterized bythat the jacket body (105) consists of the same material as the body to be thermally treated (101, 102, 103). [7] Method for the thermal treatment of a body to be thermally treated (101, 102, 103), by means of the device (100) according to one of claims 1-5, comprising: - Providing the body to be thermally treated (101, 102, 103), - arranging the body to be thermally treated (101, 102, 103) and a jacket body (105) in the temperature-controlled space (108) such that the jacket body (105) encloses the body to be thermally treated (101, 102, 103) without contact, - Thermally treating the body to be thermally treated (101, 102, 103) and the jacket body (105) arranged on the body to be thermally treated in the temperature-controlled space (108). [8] Method according to claim 7, characterized by that includes thermal treatment - a tempering process and / or - a high-temperature bonding process or stack sealing. [9] Method according to one of claims 7 or 8, characterized by that the body to be thermally treated (101, 102, 103) is formed from amorphous silicon-containing glass and / or from a semi-crystalline ceramic. [10] Method according to one of claims 7 to 9, characterized by that the body to be thermally treated (101, 102, 103) is made of titanium-doped quartz glass. [11] Method according to claims 7-10, characterized by that after the provision of the body to be thermally treated (101, 102, 103), the body to be thermally treated (101, 102, 103) is processed on a surface by a physical and / or chemical processing method. [12] Method according to claims 7-11, characterized by that an interface (104) between a first partial body (101) and a second partial body (102) is formed as - planar interface, - concave or convex interface, - as a freeform surface. [13] Method according to claim 12, characterized by , that - a first structure (206) comprising a groove (209) and a web (210) is formed in a first surface (204) of the first partial body (101) by physical and / or chemical processing and / or - a second structure (207) comprising a groove (212) and a web (213) is formed in a second surface (205) of the second partial body (102) by physical and / or chemical processing, and - during the thermal bonding of the first partial body (101) and the second partial body (102) to form a composite body (103) from the structure (206) located in the first surface (204) and / or the structure (207) located in the second surface (205), at least one continuous channel (208) is formed in the interior of the composite body (103). [14] Method according to one of claims 12 or 13, characterized by that a plurality of partial bodies (200) are joined together to form the composite body (103) using the stack sealing method, wherein the first partial body (101) and the second partial body (102) from the plurality of partial bodies (200) contact each other at the interface (104). [15] Method according to one of claims 7-14, characterized by that within the body to be thermally treated (101, 102, 103) - a first local temperature (301) of any first infinitesimal surface element (302) within any first sectional plane of a first constant height (305) and a second local temperature (303) of any second infinitesimal surface element (304) within the same arbitrary first sectional plane of a first constant height (305) differ by no more than 1 K, and - the first local temperature (301) and a third local temperature (307) of any third infinitesimal surface element (308) within any second section plane of a second constant height (306) have a temperature difference other than zero. [16] Method according to claim 15 characterized by that within the body to be thermally treated (101, 102, 103) - starting from the arbitrary first infinitesimal surface element (302) with the first local temperature (301) within the arbitrary first section plane of the first constant height (305) along a first normal (310) of the arbitrary first section plane of the first constant height (305) to the arbitrary third infinitesimal surface element (308) with the third local temperature (307) within the arbitrary second section plane of the second constant height (306), a gradient of a first local temperature profile (311) at any height differs by a maximum of 5% from an averaged temperature gradient calculated over a corresponding temperature profile (311) over the entire height, and - starting from the arbitrary second infinitesimal surface element (304) with the second local temperature (303) within the arbitrary first section plane of the first constant height (305) along a second normal (312) of the arbitrary first section plane of the first constant height (305) to an arbitrary fourth infinitesimal surface element (314) with a fourth local temperature (309) within the arbitrary second section plane of the second constant height (306), a gradient of a second local temperature profile (313) at an arbitrary height differs by a maximum of 5% from an averaged temperature gradient calculated over a corresponding temperature profile (313) over the entire height, wherein - the temperature gradient averaged over the first local temperature profile (311) and the temperature gradient averaged over the second local temperature profile (313) do not differ by more than 5%. [17] Method according to one of claims 7-16, characterized by that the method for thermally treating the body to be thermally treated (101, 102, 103) comprises the following temperature progression phases: - a heating phase (401) starting from a first temperature (402) to a second temperature (403), in which the body to be thermally treated (101, 102, 103) is heated with a temporal temperature ramp for heating (404), - a holding phase (405) in which the body to be thermally treated (101, 102, 103) is tempered with the approximately time-constant second temperature (403), and - a cooling phase (406) starting from the second temperature (403) to the first temperature (402), in which the body to be thermally treated (101, 102, 103) is cooled with a temporal temperature ramp for cooling (407). [18] Method according to claim 17, characterized bythat during the heating phase (401) and / or the holding phase (405) and / or the cooling phase (406) the first partial body (101) and the second partial body (102) are connected to one another by means of high-temperature bonding or stack sealing. [19] Method according to claim 17 or 18, characterized by that in the body to be thermally treated (101, 102, 103) and the casing body (105) the temperature ramp for cooling (407) is driven with a temporally non-linear course. [20] Method according to one of claims 17-19, characterized by that the temperature ramp for cooling (407) comprises a superposition of the following components: - a first component (506) with a continuously decreasing temperature profile starting from a first temperature (504) to a second temperature (505), and - a second component (509) with a periodic temperature change starting from a third temperature (507) to a fourth temperature (508) with an amplitude, a period, a phase, and an attenuation and / or an amplification. [21] Method according to claim 20, characterized by , that within the arbitrary first sectional plane of a first constant height (305) of the temperature ramp for cooling (407) at least once generates a first spatial temperature profile (512) at any first time (513), as well as at least once a second spatial temperature profile (514) at any second time (515), wherein at any first time (513) or at any second time (515) the first local temperature (301) at the first infinitesimal surface element (302) is greater than the second local temperature (303) at the second infinitesimal surface element (304), wherein the first infinitesimal surface element (302) has a smaller distance from the surface (114) than the second infinitesimal surface element (304). [22] Substrate (611) manufactured by a method according to any one of claims 7-21. [23] Optical element (609), in particular reflective optical element (609) for reflecting EUV radiation (610), comprising: - a substrate (611) made from a body (101, 102, 103) to be thermally treated according to claim 22, and - a reflective coating (613), in particular one reflecting EUV radiation, applied to a surface (612) of the substrate (611). [24] Optical element (609) according to claim 23, further comprehensive at least one continuous channel (208) within the substrate (611) for actively tempering the substrate (611) by means of liquid, vaporous and / or gaseous media. [25] Optical element (609) according to claim 23 or 24, characterized by that along a spatial direction, in particular along an axis of symmetry of the element (609), further in particular along the gravitational axis of action, there is a constant density gradient which changes by no more than 5% over the extension of the element (609) along the spatial direction, in particular along the axis of symmetry of the element (509). [26] Semiconductor technology system (700), comprising at least one optical element (609), in particular a reflective optical element (609) according to one of claims 23-25.

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