Temperature control device for at least one object to be temperature controlled

Abstract

The invention relates to a temperature control device (10) for at least one object to be temperature controlled, comprising an elastic multilayer foil body (20) in which a closed channel system (28) with at least one channel for guiding an electrically and thermally conductive medium (29) is formed, and at least one magnetohydrodynamic pump module (30) which is integrated into the elastic multilayer foil body (20) and has at least one electrode device (34) with two electrodes (34.1, 34.2) and at least one magnet device (36) which generates a magnetic field (B1, B2), wherein in the at least one magnetohydrodynamic pump module (30) a first electrode (34.1) of the at least one electrode device (34) introduces an electric current flow (I) with a predetermined current density into the electrically and thermally conductive medium (29) at at least one channel section (28A, 28B) and a second electrode (34.2) the at least one electrode device (34) directs the electric current flow (I) out of the electrically and thermally conductive medium (29) at the at least one channel section (28A, 28B), such that an interaction of the electrically and thermally conductive medium (29) guided in the closed channel system (28) with the introduced electric current flow (I) and with the generated magnetic field (B1, B2) generates a Lorentz force (FL) which selectively drives the electrically and thermally conductive medium (29) in the at least one channel section (28A, 28B) wherein a resulting pressure build-up causes a desired volume flow of the electrically and thermally conductive medium (29) through the at least one channel of the closed channel system (28), as well as a temperature control arrangement (1) with at least one such temperature control device (10) and a method for manufacturing such a temperature control device (10).

Description

[0001] The invention relates to a temperature control device for at least one object to be temperature-controlled. The present invention also relates to a temperature control arrangement comprising at least one such temperature control device and a method for producing such a temperature control device.

[0002] Magnetohydrodynamics (MHD) is a branch of physics. It describes the behavior of electrically conductive fluids penetrated by magnetic and electric fields. Magnetohydrodynamics in the narrower sense deals with liquids, especially plasmas, which are described as fluids within the framework of MHD. Typical areas of application of magnetohydrodynamics are flow control and flow measurement in metallurgy and semiconductor single crystal growth. In metallurgy, for example, magnetic fields can be used to influence the flow of liquid metals such as steel or aluminum. In their application, a distinction must be made between static and time-dependent magnetic fields. Static, i.e. time-independent, magnetic fields lead to a dampening of turbulence and are therefore used, for example, in the form of magnetic brakes in the continuous casting of steel.Time-dependent magnetic fields are used, for example, for electromagnetic support during the casting of aluminum.

[0003] From the applicant's older DE 10 2021 210 606.4, a temperature control device for a microelectrical system and a microelectrical system with such a temperature control device are known. The temperature control device comprises a closed channel system, which includes at least one channel for conducting an electrically and thermally conductive medium and is thermally coupled to at least one object of the microelectrical system to be temperature-controlled, and a magnetohydrodynamic pump with several magnetohydrodynamic modules, each of which has an electrode device with two electrodes and a magnet device that generates a magnetic field. At least two magnetohydrodynamic modules are designed as pump modules and are electrically connected in series.In each of the pump modules, a first electrode of the electrode device introduces an electrical current flow with a predetermined current density into the electrically and thermally conductive medium at at least one channel section, and a second electrode of the electrode device discharges the electrical current flow from the electrically and thermally conductive medium at the at least one channel section, so that an interaction of the electrically and thermally conductive medium guided in the closed channel system with the introduced electrical current flow and with the generated magnetic field generates a Lorentz force which specifically accelerates the electrically and thermally conductive medium in the at least one channel section, and a resulting pressure build-up brings about a desired volume flow of the electrically and thermally conductive medium through the at least one channel of the closed channel system.The volume flow of the electrically and thermally conductive medium causes the at least one object to be tempered to be tempered. The electrically and thermally conductive medium transfers heat to the at least one object to be tempered during a heating process or absorbs heat from the at least one object to be tempered during a cooling process. Disclosure of the invention

[0004] The temperature control device for at least one object to be temperature-controlled, having the features of independent patent claim 1, has the advantage that the elastic or flexible film body can bridge different gaps between the at least one object to be temperature-controlled and a heat exchanger, which can be coupled to a heat source or a heat sink. Furthermore, no structural adjustments are required given comparatively large manufacturing tolerances. This advantageously enables the use of identical parts for many different applications that utilize the same object to be cooled. Furthermore, embodiments of the temperature control device according to the invention, due to the elastic or flexible film body, enableThe flexible film body provides mechanical decoupling between the at least one object to be tempered and the heat exchanger, so that no or at least only a minimal force is applied to the at least one object to be tempered, which can be designed, for example, as an electronic component. This can increase the reliability of the product, in particular the solder joints of the electronic component. The elastic or flexible film body advantageously enables easy scalability for mass production, since the individual film bodies are produced in a large film and can then be cut into any desired shape.

[0005] Embodiments of the present invention provide a temperature control device for at least one object to be temperature-controlled, comprising an elastic multilayer film body in which a closed channel system with at least one channel for conducting an electrically and thermally conductive medium is formed, and at least one magnetohydrodynamic pump module integrated into the elastic multilayer film body. Furthermore, the temperature control device comprises at least one electrode device with two electrodes and at least one magnetic device that generates a magnetic field.In the at least one magnetohydrodynamic pump module, a first electrode of the at least one electrode device introduces an electrical current flow with a predetermined current density at at least one channel section into the electrically and thermally conductive medium, and a second electrode of the at least one electrode device leads the electrical current flow out of the electrically and thermally conductive medium at the at least one channel section, so that an interaction of the electrically and thermally conductive medium guided in the closed channel system with the introduced electrical current flow and with the generated magnetic field generates a Lorentz force which specifically drives the electrically and thermally conductive medium in the at least one channel section.A resulting pressure build-up causes a desired volume flow of the electrically and thermally conductive medium through at least one channel of the closed channel system.

[0006] In addition, a tempering arrangement with at least one object to be tempered, at least one heat exchanger and at least one such tempering device is proposed.

[0007] Furthermore, a method for manufacturing such a temperature control device is proposed. In this method, elastic multilayer film bodies from several temperature control devices are each produced as an array on a film package and then separated.

[0008] Embodiments of the temperature control device according to the invention enable scalable temperature control (cooling or heating) of at least one object to be temperature-controlled without disturbing it through unwanted electrical or electromagnetic effects. For example, embodiments of the temperature control device according to the invention enable targeted and / or uniform cooling of individual electronic or electrical components of a temperature control arrangement to be cooled. If required, additionally or alternatively, targeted and / or uniform heating of the individual electronic or electrical components of the temperature control arrangement is also possible.

[0009] An electrically and thermally conductive medium is understood below to mean a medium with an electrical conductivity greater than 1 S / m (Siemens per meter). Preferably, the electrically and thermally conductive medium has a significantly higher electrical conductivity (100 to 1000 S / m). Examples of electrically and thermally conductive media that can be used are an electrically and thermally conductive liquid, an electrically and thermally conductive gas, an ionic liquid, at least one electrolyte, at least one plasma, at least one liquid metal such as gallium, lithium, sodium, or mercury, and / or at least one liquid metal alloy such as a sodium-potassium alloy. A non-toxic liquid metal alloy of gallium, indium, and tin can be used as the electrically and thermally conductive medium.At atmospheric pressure, this material is already liquid at temperatures as low as -20°C and can easily be heated from a lower temperature to a temperature of -20°C or higher. However, the examples of electrically and thermally conductive media described here are not exhaustive.

[0010] The elastic, multilayer film body can preferably consist of several flexible and heat-resistant plastic layers. The closed channel system can be formed in at least one of these plastic layers. The at least one magnetohydrodynamic pump module integrated into the multilayer film body moves the electrically and thermally conductive medium in the closed channel system.

[0011] The measures and further developments listed in the dependent claims enable advantageous improvements to the tempering device specified in independent patent claim 1 for at least one object to be tempered and to the tempering arrangement specified in independent patent claim 11.

[0012] It is particularly advantageous that the elastic multi-layer film body can form a first planar thermal contact region at one end and a second planar thermal contact region at another end. In this case, a preferably narrower connecting region connects the first planar thermal contact region and the second planar thermal contact region to one another. In addition, the closed channel system can each have a plurality of fluidically parallel channels in the first planar thermal contact region and in the second planar thermal contact region. This can advantageously reduce flow resistance and improve heat absorption and heat dissipation. Preferably, only two channels can be arranged in the connecting region, of which a first channel can be designed as a supply line and a second channel as a return line.Alternatively, the supply line and / or the return line can each have multiple channels. Preferably, the first planar thermal contact area of ​​the elastic, multilayer film body can be designed to be thermally coupled to the at least one object to be temperature-controlled. The second planar thermal contact area can be designed to be thermally coupled to at least one heat exchanger. Thus, the film body can have a particularly smooth or flat surface at least at the two planar thermal contact areas to improve heat transfer. Additionally, a thermal interface material (TIM) can be applied to the thermal contact areas of the film body.

[0013] In an advantageous embodiment of the temperature control device, the at least one magnetohydrodynamic pump module can be arranged at the connection area or at the first planar thermal contact area or at the second planar thermal contact area of ​​the elastic multilayer film body. Preferably, the at least one magnetohydrodynamic pump module can be arranged at the connection area between the two planar thermal contact areas. However, if magnetic fields already present at the installation site can be utilized, the at least one magnetohydrodynamic pump module can also be arranged at the first planar thermal contact area or at the second planar thermal contact area of ​​the elastic multilayer film body.

[0014] In a further advantageous embodiment of the temperature control device, the elastic multilayer film body can comprise at least two carrier films. The closed channel system and / or electrically conductive line sections, which form the electrodes of the electrode device or a connecting line, can be formed in at least one of the carrier films. The at least one magnetic device can be arranged in at least one outer carrier film. The carrier films of the elastic multilayer film body can preferably be made of a flexible and heat-resistant plastic.

[0015] In a further advantageous embodiment of the temperature control device, the at least one magnetic device can comprise at least one permanent magnet or at least one electrical coil structure. By using the at least one permanent magnet, a static magnetic field can be easily provided. A time-varying magnetic field can be provided by the at least one coil structure.

[0016] In a further advantageous embodiment of the temperature control device, at least two magnetohydrodynamic pump modules can be arranged fluidically in series one behind the other on a common channel. Such an electrical and fluidic series connection increases electrical efficiency and reduces EMC problems. The series connection of the at least two pump modules generates a pressure in the electrically and thermally conductive medium of the corresponding channel that increases with each pump module, which drives the volume flow through the at least one channel of the closed channel system. The at least two pump modules arranged fluidically in series can, for example, be arranged one behind the other upstream or downstream of the at least one object to be temperature-controlled. The adjacent arrangement of the at least two pump modules allows a partial flow through the electrically and thermally conductive medium.This partial flow can be used to heat the electrically and thermally conductive medium in the duct system at temperatures below the lowest specified temperature. Alternatively, the at least two pump modules arranged fluidically in series can be arranged separately from one another. In this case, at least one first pump module can be arranged upstream and at least one second pump module downstream of the at least one object to be temperature-controlled. With this arrangement, the at least one first pump module upstream of the object to be temperature-controlled can only be designed such that the pressure is sufficient to drive a sufficient volume flow through the duct system in the region of the object to be temperature-controlled. The at least one second pump module downstream of the object to be temperature-controlled can then be designed such that it can drive a sufficient volume flow through the remaining duct system. To a limited extent, the at least one second pump module can also suction.The advantage of this arrangement is that there is no unnecessary pressure load on the closed channel system in the area of ​​the object to be tempered, and thus no mechanical stress on the object to be tempered. This allows for thinner walls of the closed channel system. Pendulum cooling is also conceivable, meaning that the electrically and thermally conductive medium can be moved in one direction and then the other by reversing the current direction in the magnetohydrodynamic pump.

[0017] In a further advantageous embodiment of the temperature control device, at least two pump modules can be arranged in fluidic parallel connection on at least one common channel or on two mutually parallel channels. This enables targeted control of individual channels of the closed channel system. In this case, at least two magnetohydrodynamic modules arranged fluidically in series one behind the other can also be arranged in at least one of the at least two parallel channels. This fluidic parallel connection of the at least two pump modules allows the total volume flow in the closed channel system to be increased without further increasing the pressure.

[0018] In an advantageous embodiment of the temperature control arrangement, the first planar thermal contact area of ​​the at least one temperature control device can be thermally coupled to the at least one object to be temperature controlled. The second planar thermal contact area of ​​the at least one temperature control device can be thermally coupled to the at least one heat exchanger. In this case, the at least one heat exchanger can be designed as a heating element or heat source for a heating process or as a cooling element or heat sink for a cooling process. This means that the heat exchanger thermally coupled to the channel system can supply heat to the electrically and thermally conductive medium during a heating process and can absorb heat from the electrically and thermally conductive medium during a cooling process.

[0019] In a further advantageous embodiment of the temperature control arrangement, at least one EMC discharge element (EMC: Electromagnetic Compatibility) can be arranged in the region of the temperature control device, which can discharge displacement currents between the at least one heat exchanger and the at least one object to be temperature controlled. The at least one EMC discharge element is arranged outside the second planar thermal contact region, which is thermally coupled to the at least one heat exchanger, and electrically connects the heat exchanger to a ground surface of a circuit carrier on which the object to be temperature controlled is arranged, such that a displacement current can flow over a short path from an upper side of the object to be cooled via the elastic film body of the temperature control device and the at least one EMC discharge element to the ground surface of the circuit carrier and to the underside of the object to be temperature controlled.The number of EMC discharge elements used depends on the requirements regarding compliance with necessary EMC standards (Electro Magnetic Compatibility).

[0020] Embodiments of the invention are illustrated in the drawings and explained in more detail in the following description. In the drawings, like reference numerals designate components or elements that perform the same or similar functions. Short description of the drawings Fig. 1 shows a schematic representation of an embodiment of a tempering arrangement according to the invention with an embodiment of a tempering device according to the invention for at least one object to be tempered. Fig. 2 shows a schematic plan view of a section of a film package with several elastic multi-layer film bodies for the temperature control device according to the invention from Fig. 1. Fig. 3 shows a schematic plan view of a first embodiment of a magnetohydrodynamic pump module for the temperature control device according to the invention from Fig. 1. Fig. 4 shows a schematic plan view of a second embodiment of a magnetohydrodynamic pump module for the temperature control device according to the invention from Fig. 1. Fig. 5 shows a schematic exploded view of a section of the multilayer film body from Fig. 2. Fig. 6 to 9 each show a schematic representation of an arrangement of at least one magnetohydrodynamic pump module for a temperature control device according to the invention. Embodiments of the invention

[0021] As from Fig. 1, the illustrated embodiment of a tempering arrangement 1 according to the invention comprises at least one object 3 to be tempered, at least one heat exchanger 5 and at least one tempering device 10 according to the invention for tempering the at least one object 3 to be tempered.

[0022] In the illustrated embodiment, the object 3 to be temperature-controlled is a semiconductor component 3A arranged in a component housing 4. The semiconductor component 3A is electrically connected to a circuit carrier 7 embodied as a printed circuit board via a contacting device (not further described). In the illustrated embodiment, the heat exchanger 5 corresponds to a metallic housing 5A of a control unit, in which the circuit carrier is arranged with the object 3 to be temperature-controlled. Additionally, the housing 5A can be thermally connected to a cooling element.

[0023] As from Fig. As can be seen from Figures 1 to 5, the illustrated embodiments of a temperature control device 10 according to the invention for at least one object 3 to be temperature-controlled comprise an elastic multi-layer film body 20, in which a closed channel system 28 with at least one channel for guiding an electrically and thermally conductive medium 29 is formed, and at least one magnetohydrodynamic pump module 30, 30A, 30B, which is integrated into the elastic multi-layer film body 20 and has at least one electrode device 34, 34A, 34B with two electrodes 34.1, 34.2 and at least one magnetic device 36, 36A, 36B, which generates a magnetic field B1, B2. A first electrode 34 conducts in the at least one magnetohydrodynamic pump module 30.1 of the at least one electrode device 34, 34A, 34B introduces an electrical current flow I with a predetermined current density at at least one channel section 28A, 28B into the electrically and thermally conductive medium 29, and a second electrode 34.2 of the at least one electrode device 34, 34A, 34B discharges the electrical current flow I at the at least one channel section 28A, 28B from the electrically and thermally conductive medium 29, so that an interaction of the electrically and thermally conductive medium 29 guided in the closed channel system 28 with the introduced electrical current flow I and with the generated magnetic field B1, B2 generates a Lorentz force FL, which specifically drives the electrically and thermally conductive medium 29 in the at least one channel section 28A, 28B.A resulting pressure build-up causes a desired volume flow of the electrically and thermally conductive medium 29 through the at least one channel of the closed channel system 28.

[0024] As from Fig. 3 and Fig. As can be further seen in Figure 4, the illustrated embodiments of the magnetohydrodynamic pump module 30, 30A, 30B each comprise two electrode devices 34, 34A, 34B and two magnetic devices 36, 36A, 36B.

[0025] As from Fig. 3, in the illustrated first embodiment of the magnetohydrodynamic pump module 30A, a first magnetic device 36A, which cooperates with a first electrode device 34A, generates a first magnetic field B1 at a first channel section 28A. A second magnetic device 36B, which cooperates with a second electrode device 34B, generates a second magnetic field B2 at a second channel section 28B. The field lines of the first magnetic field B1 and the second magnetic field B2 run parallel to each other. As can be seen from Fig. 3, the second electrode 34.2 of the first electrode device 34A is electrically connected to the first electrode 34.1 of the second electrode device 34B via a connecting line 32 designed as a meandering or S-shaped line structure 32A, so that the currents I introduced into the electrically and thermally conductive medium 29 through the two electrode devices 34A, 34B flow in the same direction.

[0026] As from Fig. 4, in the illustrated second embodiment of the magnetohydrodynamic pump module 30B, a first magnetic device 36A, which cooperates with the first electrode device 34A, generates a first magnetic field B1 at the first channel section 28A. The second magnetic device 36B, which cooperates with the second electrode device 34B, generates a second magnetic field B2 at the second channel section 28B. The field lines of the first magnetic field B1 and the second magnetic field B2 run antiparallel to each other. As can be seen from Fig. 4, the second electrode 34.2 of the first electrode device 34A is electrically connected to the first electrode 34.1 of the second electrode device 34B via a connecting line 32 designed as a U-shaped line structure 32B, so that the currents I introduced into the electrically and thermally conductive medium 29 through the two electrode devices 34A, 34B flow in opposite directions.

[0027] As is particularly evident from Fig. 2, the elastic multi-layer film body 20 forms a first planar thermal contact region 12 at one end and a second planar thermal contact region 14 at another end, wherein a preferably narrower connecting region 16 connects the first planar thermal contact region 12 and the second planar thermal contact region 14 to one another. As can be seen from Fig. 2, the closed channel system 28 has a plurality of fluidically parallel channels in the first planar thermal contact region 12 and in the second planar thermal contact region 14. In the illustrated embodiment, only two channels are arranged in the connecting region 15, of which a first channel is designed as the supply line VL and a second channel as the return line RL. Of course, the supply line and the return line can each have more than one channel. In addition, the first planar thermal contact region 12 of the elastic multi-layer film body 20 is designed to be thermally coupled to the at least one object 3 to be temperature-controlled. The second planar thermal contact region 14 is designed to be thermally coupled to at least one heat exchanger 5.

[0028] As from Fig. As can be further seen in Figure 2, in a method according to the invention for producing the temperature control device 10 according to the invention, a film package 40 is produced with a plurality of arrays 42, each of which corresponds to an elastic multilayer film body 20 of the temperature control device 10 according to the invention. These arrays 42 are then separated.

[0029] As from Fig. 1, the first planar thermal contact area 12 of the illustrated temperature control device 10 is thermally coupled to the at least one object 3 to be temperature-controlled, here to the component housing 4 of the semiconductor component 3A. The second planar thermal contact area 14 of the illustrated temperature control device 10 is thermally coupled to the heat exchanger 5, here to the housing 5A. Fig. 1, arrows show the heat transfer from the object 3 to be tempered via the temperature control device 10 to the heat exchanger 5 and via the contacting device to the circuit carrier 7. In addition, at least one EMC discharge element 9 is arranged in the area of ​​the temperature control device 10, which discharges displacement currents between the at least one heat exchanger 5 and the at least one object 3 to be tempered. In the illustrated embodiment of the temperature control arrangement 1, two EMC discharge elements 9 designed as contact springs 9A are arranged outside the second flat thermal contact area 14 of the temperature control device 10, which EMC discharge elements 9 electrically connect the housing 5A to a ground surface (not designated in more detail) of the circuit carrier 7.

[0030] In the illustrated embodiment of the temperature control arrangement 1, the at least one heat exchanger 5 is designed as a heat sink for a cooling process of the semiconductor component 3A. In an alternative embodiment of the temperature control arrangement 1 (not shown), the heat exchanger 5 is designed as a heat source or heating element for a heating process.

[0031] As from Fig. As can be further seen in Figures 1 to 5, the magnetohydrodynamic pump module 30 is arranged in the illustrated embodiments at the connecting region 16 of the elastic multilayer film body 20. In alternative embodiments not shown, the magnetohydrodynamic pump module 30 is arranged at the first planar thermal contact region 12 or at the second planar thermal contact region 14.

[0032] As from Fig. 5, the elastic multilayer film body 20 has at least two carrier films 22, 24, 26. The closed channel system 28 and / or electrically conductive line sections 33, which form the electrodes 34A, 34B of the electrode device 34 or a connecting line 32, are formed in at least one of the carrier films 22, 24, 26. The at least one magnetic device 36 is arranged in at least one outer carrier film 22, 26. In the illustrated embodiment, the elastic multilayer film body 20 comprises two outer carrier films 22, 26 and an inner carrier film 24, which is arranged between the two outer carrier films 22, 26. In this case, two magnetic films 36.1 of the magnetic devices 36, 36A, 36B are arranged in each of the two outer carrier films 22, 26, each forming a permanent magnet.The closed channel system 28 with the electrically and thermally conductive medium 29 is formed in the inner carrier film 24 in the illustrated embodiment. The electrically conductive line sections 33, which form the electrodes 34.1, 34.2 of the electrode device 34, 34A, 34B, are also arranged in the inner carrier film in the illustrated embodiment. The electrically conductive line sections 33, which form the connecting lines 32 of the electrode device 34, 34A, 34B, are arranged in the lower outer carrier film 26 in the illustrated embodiment. Of course, a different structure of the elastic multilayer film body 20 with more or fewer than three carrier films 22, 24, 26 or layers is also possible.

[0033] In an alternative embodiment of the temperature control device 10 (not shown), at least one electrical coil structure is integrated into each of the magnetic foils, which forms an electromagnet.

[0034] As from Fig. As can be further seen in Figure 6, in the illustrated first embodiment of the temperature control device 10A, only one magnetohydrodynamic pump module 30 is arranged on a channel K1 of the closed channel system 28 and drives the electrically and thermally conductive medium 29. In an alternative embodiment of the temperature control device 10 (not shown), several channels run parallel to one another. In this case, the magnetohydrodynamic pump module 30 is designed and arranged such that it simultaneously drives the thermally conductive medium 29 in the multiple channels in the same flow direction.

[0035] As from Fig. As can be further seen in Figure 7, in the illustrated second embodiment of the temperature control device 10B, two magnetohydrodynamic pump modules 30 are arranged one behind the other on a channel K2 of the closed channel system 28. The two magnetohydrodynamic pump modules 30 are fluidically connected in series and drive the electrically and thermally conductive medium 29. In an alternative embodiment of the temperature control device 10 (not shown), several channels run parallel to one another.

[0036] The two magnetohydrodynamic pump modules 30 can be designed and arranged in such a way that they simultaneously drive the thermally conductive medium 29 in the multiple channels in the same flow direction.

[0037] As from Fig. 8, in the illustrated third embodiment of the temperature control device 10C, a first magnetohydrodynamic pump module 30 is arranged on a first channel K1 of the closed channel system 28. A second magnetohydrodynamic pump module 30 is arranged on a second channel K2 of the closed channel system 28. This means that the two magnetohydrodynamic pump modules 30 are fluidically connected in series but arranged separately from one another. Here, the first pump module 30 is arranged before and the second pump module 30 after the object 3 to be temperature-controlled. In an alternative embodiment of the temperature control device 10 (not shown), a plurality of first channels K1 and a plurality of second channels K2 each run parallel to one another.Here, the first magnetohydrodynamic pump module 30 is designed and arranged such that it simultaneously drives the thermally conductive medium 29 in the plurality of first channels K1 in the same flow direction. The second magnetohydrodynamic pump module 30 is designed and arranged such that it simultaneously drives the thermally conductive medium 29 in the plurality of second channels K2 in the same flow direction.

[0038] As from Fig.As can be further seen in Figure 9, in the illustrated fourth embodiment of the temperature control device 10B, two magnetohydrodynamic pump modules 30 are arranged in parallel on a channel K1 of the closed channel system 28. The two magnetohydrodynamic pump modules 30 are fluidically connected in parallel and drive the electrically and thermally conductive medium 29. In an alternative embodiment of the temperature control device 10 (not shown), several channels run parallel to one another. In this case, the two magnetohydrodynamic pump modules 30 can be designed and arranged such that they simultaneously drive the thermally conductive medium 29 in the several channels in the same flow direction.

[0039] Of course, other combinations and arrangements of magnetohydrodynamic pump modules 30 and channels are also conceivable in order to drive the electrically and thermally conductive medium 29 in the closed channel system 28. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 210 606.4

[0003]

Claims

[1] Temperature control device (10) for at least one object (3) to be temperature controlled, comprising an elastic multi-layer film body (20) in which a closed channel system (28) with at least one channel (K1, K2) for guiding an electrically and thermally conductive medium (29) is formed, and at least one magnetohydrodynamic pump module (30) which is integrated into the elastic multi-layer film body (20) and has at least one electrode device (34) with two electrodes (34.1, 34.2) and at least one magnetic device (36) which generates a magnetic field (B1, B2), wherein in the at least one magnetohydrodynamic pump module (30), a first electrode (34.1) of the at least one electrode device (34) introduces an electric current flow (I) with a predetermined current density at at least one channel section (28A, 28B) into the electrically and thermally conductive medium (29) and a second electrode (34.2) the at least one electrode device (34) discharges the electrical current flow (I) at the at least one channel section (28A, 28B) from the electrically and thermally conductive medium (29), so that an interaction of the electrically and thermally conductive medium (29) guided in the closed channel system (28) with the introduced electrical current flow (I) and with the generated magnetic field (B1, B2) generates a Lorenz force (FL) which specifically drives the electrically and thermally conductive medium (29) in the at least one channel section (28A, 28B), a resulting pressure build-up bringing about a desired volume flow of the electrically and thermally conductive medium (29) through the at least one channel (K1, K2) of the closed channel system (28). [2] Tempering device (10) according to claim 1, characterized bythat the elastic multi-layer film body (20) forms a first planar thermal contact region (12) at one end and a second planar thermal contact region (14) at another end, wherein a narrower connecting region (16) connects the first planar thermal contact region (12) and the second planar thermal contact region (14) to one another. [3] Tempering device (10) according to claim 2, characterized by that the closed channel system (28) has a plurality of fluidically parallel channels (K1, K2) in the first planar thermal contact area (12) and in the second planar thermal contact area (14). [4] Tempering device (10) according to claim 2 or 3, characterized byin that the first planar thermal contact region (12) of the elastic multi-layer film body (20) is designed to be thermally coupled to the at least one object (3) to be tempered, wherein the second planar thermal contact region (14) is designed to be thermally coupled to at least one heat exchanger (5). [5] Tempering device (10) according to one of claims 2 to 4, characterized by that the at least one magnetohydrodynamic pump module (30) is arranged on the connecting region (16) or on the first planar thermal contact region (12) or on the second planar thermal contact region (14) of the elastic multi-layer film body (20). [6] Tempering device (10) according to one of claims 1 to 5, characterized byin that the elastic multi-layer film body (20) has at least two carrier films (22, 24, 26), wherein the closed channel system (28) and / or electrically conductive line sections (33) which form the electrodes (34.1, 34.2) of the electrode device (34) or a connecting line (32) are formed in at least one of the carrier films (22, 24, 26), and wherein the at least one magnetic device (36) is arranged in at least one outer carrier film (22, 26). [7] Tempering device (10) according to one of claims 1 to 6, characterized by that the at least one magnetic device (36) comprises at least one permanent magnet or at least one electrical coil structure. [8] Tempering device (10) according to one of claims 1 to 7, characterized by that at least two magnetohydrodynamic pump modules (30) are fluidically arranged one behind the other in series on a common channel (K1, K2). [9] Tempering device (10) according to one of claims 1 to 7, characterized by that at least two magnetohydrodynamic pump modules (30) arranged fluidically in series are arranged separately from one another, wherein at least one first pump module (30) is arranged before and at least one second pump module (30) is arranged after the at least one object (3) to be tempered. [10] Tempering device (10) according to one of claims 1 to 9, characterized by that at least two pump modules (30) are arranged fluidically parallel on at least one common channel (K1, K2) or on two channels (K1, K2) running parallel to one another. [11] Tempering arrangement (1) with at least one object (3) to be tempered, at least one heat exchanger (5) and at least one tempering device (10), which is designed for tempering the at least one object (3) to be tempered according to one of claims 1 to 10. [12] Tempering arrangement (1) according to claim 11, characterized by that the first planar thermal contact region (12) of the at least one temperature control device (10) is thermally coupled to the at least one object (3) to be temperature controlled and the second planar thermal contact region (14) of the at least one temperature control device (10) is thermally coupled to the at least one heat exchanger (5). [13] Tempering arrangement (1) according to claim 11 or 12, characterized by that the at least one heat exchanger (5) is designed as a heat source for a heating process or as a heat sink for a cooling process. [14] Tempering arrangement (1) according to one of claims 11 to 13, characterized by that in the region of the temperature control device (10) at least one EMC discharge element (9) is arranged, which discharges displacement currents between the at least one heat exchanger (5) and the at least one object (3) to be temperature controlled. [15] Method for producing a temperature control device (1) which is designed according to one of claims 1 to 10, wherein elastic multi-layer film bodies (20) of several temperature control devices (1) are each produced as an array (42) on a film package (40) and then separated.

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