WORKPIECE SUPPORT

Abstract

The present disclosure describes a method for providing a workpiece support unit for supporting a workpiece. The method comprises the steps of providing a carrier having a first side and a second side opposite the first side, providing a protective surface material, and providing an intermediate layer. The method further comprises the step of arranging the protective surface material and the intermediate layer on the first side of the carrier by at least partially inserting the intermediate layer between the protective surface material and the carrier, such that the bonding force between the protective surface material and the carrier is greater in a peripheral region of the first side of the carrier than in a central region of the first side of the carrier. The disclosure also proposes a workpiece support unit.

Description

TECHNICAL AREA

[0001] The present disclosure relates to a method for providing a workpiece support unit for supporting a workpiece, a method for preparing a workpiece for machining, a method for machining a workpiece and a workpiece support unit. BACKGROUND OF THE INVENTION

[0002] For handling thin workpieces or applying high temperatures or chemical treatments to a workpiece, such as a substrate or wafer, conventional protective tapes are insufficient to achieve the desired results. Therefore, support systems have been developed that utilize a carrier, such as a supporting substrate made of glass or silicon. Such a support system often employs an adhesive to fix the wafer to the carrier.

[0003] Although these systems allow for the processing of thin wafers and the use of chemically demanding processes, removing a wafer from a substrate is often difficult due to strong fixation combined with the relatively high stiffness of the substrate material. More specifically, the stability of the processing unit, which consists of the wafer, the adhesive, and the substrate, makes it difficult to peel, slide, or lift the wafer from the substrate and can cause cracking, chipping, or even breakage. Furthermore, when reusing a substrate, any residue left on its surface during a previous use must be removed to prevent an uneven processing result for the next wafer placed on the substrate.

[0004] Furthermore, the supports typically have a slightly larger diameter than the wafer to ensure proper support of the wafer's edge. It has been found that the adhesive tends to be present on the wafer's periphery. This results, for example, in the case of grinding as a machining process, in the unintended removal of the adhesive by a grinding wheel, particularly when machining a wafer to a very low thickness. The rotation of the grinding wheel grinds away the adhesive, which damages the grinding wheel due to clogging and burning of abraded adhesive particles. Additionally, during rotation, the grinding wheel carries abrasive particles onto the wafer's grinding surface, potentially resulting in an uneven finish due to scratches as well as contamination with the remaining adhesive. SUMMARY OF THE INVENTION

[0005] Accordingly, the task was to provide a workpiece support unit for machining a workpiece, a method for preparing a workpiece for machining, a method for machining a workpiece, and a support unit that address the disadvantages of existing support systems described above.

[0006] The disclosure provides a method for providing a workpiece support unit for supporting a workpiece. The method comprises the steps of providing a carrier having one side and a second side opposite the first side, providing a protective surface material, and providing an intermediate layer. The protective surface material and the intermediate layer are arranged on the first side of the carrier by at least partially inserting the intermediate layer between the protective surface material and the carrier, such that the bonding force between the protective surface material and the carrier is greater in a peripheral region of the first side of the carrier than in a central region of the first side of the carrier.

[0007] Arranging the intermediate layer on the substrate such that the bonding force between the protective surface material and the substrate is greater in an edge area of ​​the first side of the substrate than in a central area of ​​the first side of the substrate facilitates the removal of the protective surface material from the substrate.

[0008] In other words, the intermediate layer is designed to prevent it from adhering to the substrate's first side during and after its application. Consequently, it can be easily removed from the substrate after processing. Therefore, the intermediate layer is specifically designed to retain non-adherent properties when subjected to subsequent processing of the workpiece. This includes processes such as grinding, laser processing, etc. This is particularly relevant for high-temperature processes such as metallization, curing, etc., used to process a workpiece, especially one used for semiconductor manufacturing.

[0009] The edge area extends along the circumferential direction of the support and is preferably a ring-shaped area.

[0010] The intermediate layer can be located in the central area of ​​the first side of the carrier and / or can be in contact with the carrier and / or with the protective surface material.

[0011] In other words, the intermediate layer can be applied directly to the substrate or it can be applied with another layer or surface material inserted between the intermediate layer and the substrate / protective surface material.

[0012] The intermediate layer can be made of a material different from that of the protective surface material. It is preferably a sheet material, in particular a polyimide film or a polyethylene terephthalate film (PET film). The intermediate layer can be applied by coating the protective surface material and / or the substrate.

[0013] Preferably, the protective surface material is arranged in contact with the edge area of ​​the first side of the carrier.

[0014] The protective surface material can have a protective layer, the protective layer preferably being in contact with the edge region of the first side of the carrier. The protective layer is preferably a polyolefin film.

[0015] The protective surface material may have one or more additional layers, wherein the one or more additional layers are in particular an adhesive layer, a damping layer and / or a base surface material.

[0016] The method may also include the steps of providing one or more additional intermediate layers and inserting at least part of the one or more additional intermediate layers between the intermediate layer and the protective surface material. The one or more additional intermediate layers (31) may be, for example, an adhesive and / or a damping layer and / or a base surface material.

[0017] The protective surface material preferably has an adhesive agent arranged on a side that is to face the workpiece and / or on a side that is to face the carrier, wherein the adhesive agent is preferably provided on a circumferential section or an annular section of the respective sides.

[0018] The workpiece has, in particular, a central component area and a circumferential edge area surrounding the component area, and the protective surface material or adhesive comes into contact with the workpiece in the circumferential edge area of ​​the workpiece.

[0019] If a ring frame is attached to the protective surface material, the method preferably further comprises, after arranging the protective surface material on the carrier, cutting the protective surface material to separate the ring frame from the protective surface material.

[0020] The carrier preferably comprises a carrier substrate having a first side facing the protective surface material and the intermediate layer, and a second side opposite the first side. The carrier further preferably comprises an adhesive, wherein the adhesive is preferably arranged on the first side of the carrier substrate, particularly in an edge region of the first side of the carrier substrate.

[0021] The support may further comprise at least one additional protective surface material. This at least one additional protective surface material may be arranged on the first side of the support or support substrate and / or on the second side of the support or support substrate. The at least one additional protective surface material preferably comprises a protective layer, in particular a protective film. A ring frame may be attached to the at least one additional protective surface material.

[0022] After the protective surface material is applied to the first side of the substrate, the protective surface material and at least one additional protective surface material preferably come into contact with each other around the substrate. In other words, they come into contact with each other in a radial direction of the substrate outside the substrate or in an area extending (partially or completely) around the substrate. This area may or may not adjoin a circumferential edge of the substrate.

[0023] The description also discloses a method for preparing a workpiece for machining, wherein the method comprises providing a workpiece and arranging the workpiece on a protective layer of the protective surface material, with or without an adhesive agent between the protective layer and the workpiece. The step of arranging the workpiece on a protective layer is performed before, during, or after one of the steps of the method for providing a workpiece support unit described above.

[0024] In the aforementioned method for preparing a workpiece for machining, a support is provided. However, the method for preparing a workpiece for machining can also initially prepare a workpiece without a support. Accordingly, a method for preparing a workpiece for machining is disclosed that comprises the steps of providing a workpiece, wherein the workpiece has a front and a rear side, providing a protective surface material, and providing an intermediate layer. The protective surface material is arranged on the front or rear side of the workpiece.The intermediate layer is arranged on the protective surface material such that the intermediate layer and the protective surface material form an end face. This end face is configured to accommodate a first side of a carrier and is further configured to provide a bonding force for the carrier that is greater in an edge region of the first side of the carrier than in a central region of the first side of the carrier. This distribution of a bonding force across the end face of the protective surface material and the intermediate layer is implemented particularly for a uniform, adhesive-free first side of a carrier.

[0025] In other words, the front face formed by the intermediate layer and the protective surface material is designed to provide the advantages mentioned above, which are further explained in more detail below.

[0026] The present disclosure further presents a method for machining a workpiece, wherein the method comprises the steps of providing a workpiece support unit to support the workpiece in accordance with the above description, arranging the workpiece on the protective surface material on a side opposite a side facing the carrier and the intermediate layer, and machining the workpiece.

[0027] The present disclosure also provides a workpiece support unit for supporting a workpiece, comprising a carrier with a first side and a second side opposite the first side, a protective surface material, and an intermediate layer. The protective surface material and the intermediate layer are arranged on the first side of the carrier, the intermediate layer being inserted at least partially between the protective surface material and the carrier, such that a bonding force between the protective surface material and the carrier is greater in a peripheral region of the first side of the carrier than in a central region of the first side of the carrier.

[0028] The workpiece support unit is provided in particular using the method for providing a workpiece support unit in accordance with the present disclosure.

[0029] In the workpiece support unit, the intermediate layer is preferably arranged in the central area of ​​the first side of the carrier and / or in contact with the carrier and / or with the protective surface material.

[0030] The intermediate layer can be made of a material different from that of the protective surface material and is preferably a sheet material, in particular a polyimide film or a polyethylene terephthalate film (PET film). It can be provided as a coating on the protective surface material and / or the substrate.

[0031] The protective surface material is preferably arranged in contact with the edge area of ​​the first side of the carrier.

[0032] The protective surface material includes in particular a protective layer, wherein the protective layer is preferably arranged in contact with the edge area of ​​the first side of the carrier, wherein the protective layer is preferably a polyolefin film.

[0033] The protective surface material may have one or more additional layers, where the one or more additional layers may be, for example, an adhesive layer, a damping layer and / or a base surface material.

[0034] The workpiece support unit can further comprise one or more additional intermediate layers, wherein the one or more additional intermediate layers are preferably inserted at least partially between the intermediate layer and the protective surface material. The one or more additional intermediate layers can be, for example, an adhesive layer, a damping layer, and / or a base surface material.

[0035] The protective surface material mentioned above can have an adhesive agent arranged on a side facing the workpiece and / or a side facing the carrier, the adhesive agent preferably being provided on a circumferential section of the respective sides.

[0036] The workpiece can have a central component area and a circumferential edge area surrounding the component area, wherein the protective surface material in particular has an adhesive agent arranged on a side facing the workpiece, such that when the protective surface material is in contact with the workpiece, the adhesive agent is in contact with the circumferential edge area of ​​the workpiece.

[0037] A ring frame may be attached to the protective surface material.

[0038] The carrier has in particular a carrier substrate with a first side facing the protective surface material and the intermediate layer, and a second side opposite the first side, wherein the carrier preferably also has an adhesive agent, wherein the adhesive agent is preferably arranged on the first side of the carrier substrate, in particular in the edge area.

[0039] The support may further comprise at least one additional protective surface material, wherein the at least one additional protective surface material is arranged on the first side of the support or the support substrate and / or the at least one additional protective surface material is arranged on the second side of the support or the support substrate.

[0040] The at least one additional protective surface material preferably has a protective layer, in particular a polyolefin film.

[0041] Furthermore, a ring frame may be attached to at least one additional protective surface material.

[0042] The protective surface material and the at least one additional protective surface material are preferably in contact with each other, wherein the protective surface material and the at least one additional protective surface material are even more preferably in contact with each other around the carrier substrate.

[0043] The aspects described in this disclosure particularly facilitate the separation of a wafer from the workpiece support unit (layer / area material by layer / area material or all layers and areas material(s) simultaneously), thus making its reuse more economical. Furthermore, the support and protection of a wafer to be joined with the workpiece support unit can be improved, which can result in a reduced overall thickness variation due to machining.

[0044] Furthermore, the workpiece can be easily separated before or after the removal of the support (layer / surface material by layer / surface material or all layers and surface material(s) simultaneously).

[0045] In other words, the workpiece support unit and the associated methods enable complete removal of the carrier and preferably the workpiece from the workpiece support unit. SHORT DESCRIPTION OF THE CHARACTERS

[0046] The following figures illustrate exemplary embodiments of a workpiece support unit for supporting a workpiece and a method for providing a workpiece support unit in accordance with the present disclosure. In these figures, identical reference numerals refer to features throughout the drawings that have the same or an equivalent function and / or structure. It is understood that the figures illustrate examples of the workpiece support unit and the corresponding method for providing the workpiece support unit in accordance with the present disclosure, without limiting the invention thereto. The Fig. 1a and Fig. Figure 1b illustrates an exemplary embodiment of a workpiece support unit for supporting a workpiece in accordance with the present disclosure and a workpiece supported therein. The Fig. Figures 2a to 2e illustrate variations of the exemplary embodiment of the workpiece support unit for supporting a workpiece in accordance with the one described in the Fig. 1a and Fig. 1b illustrated the present revelation and a work supported by it. The Fig. 3a and Fig. 3b illustrates a further exemplary embodiment of a workpiece support unit for supporting a workpiece in accordance with the present disclosure and a workpiece supported therein, wherein the support has an additional protective surface material. Fig. Figure 4 illustrates an exemplary step involving cutting the protective surface material of a workpiece support unit in a method for providing a workpiece support unit to support a workpiece in accordance with the present disclosure. Fig. Figure 5 illustrates a further exemplary embodiment of a workpiece support unit for supporting a workpiece in accordance with the present disclosure, wherein a ring frame is attached to a protective surface material. Fig. Figure 6 illustrates an exemplary step involving cutting a protective surface material of a workpiece support unit to separate a ring frame from the protective surface material in a method for providing a workpiece support unit to support a workpiece in accordance with the present disclosure. Fig. Figure 7 illustrates a further exemplary embodiment of a workpiece support unit for supporting a workpiece in accordance with the present disclosure, in which the support has an additional protective surface material. Fig. Figure 8 illustrates the exemplary embodiment of the workpiece support unit of the Fig. 7 in a state in which protective surface materials have been brought into contact around the carrier substrate. Fig. Figure 9 illustrates the state of the exemplary embodiment of the workpiece support unit as shown in Fig. Figure 8 is shown, with dashed lines indicating positions along which protective surface materials are cut to separate ring frames attached to the protective surface materials in a method for providing a workpiece support unit in accordance with the present disclosure. Fig. Figure 10 illustrates a further exemplary embodiment of a workpiece support unit in accordance with the present disclosure, in which no ring frame is attached to the additional protective surface material belonging to the carrier in a state in which protective surface materials have been brought into contact around the carrier substrate. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0047] The workpiece support unit for supporting a workpiece, the method for providing a workpiece support unit, and the method for machining a workpiece in accordance with the present disclosure are described in more detail below with reference to the accompanying drawings.

[0048] The present disclosure generally relates to a workpiece support unit 100 for supporting a workpiece 10 during its machining, a corresponding method for providing the workpiece support unit 100 and a method for machining the workpiece 10 while it is supported by the workpiece support unit 100.

[0049] The workpiece 10 to be supported by the workpiece support unit 100 can generally be any (semiconductor) substrate or any (semiconductor) wafer.

[0050] The substrate can contain, for example, a semiconductor, glass, sapphire (Al2O3), a ceramic such as an aluminum oxide ceramic, quartz, zirconium oxide, PZT (lead zirconate tanate), a polycarbonate, an optical crystal material or similar.

[0051] In particular, the substrate may consist of silicon carbide (SiC), silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), gallium phosphide (GaP), indium arsenide (InAs), indium phosphide (InP), silicon nitride (SiN), lithium tantalate (LT), lithium niobate (LN), aluminum nitride (AlN), silicon oxide (SiO2) or similar materials.

[0052] The substrate can be a single-crystal substrate, a glass substrate, a composite substrate, such as a composite semiconductor substrate, such as a SiC, SiN, GaN or GaAs substrate, or a polycrystalline substrate, such as a ceramic substrate.

[0053] The substrate can be a wafer. For example, the substrate can be a semiconductor-sized wafer. The term "semiconductor-sized wafer" refers to a wafer with the dimensions (standard dimensions), in particular the diameter (standard diameter), that is, the outer diameter, of a semiconductor wafer. The dimensions, especially the diameters, that is, the outer diameters, of semiconductor wafers are defined in the SEMI standards. For example, the dimensions of polished single-crystal silicon wafers (Si wafers) are defined in the SEMI standards M1 and M76. The semiconductor-sized wafer can be a 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, 12-inch, or 18-inch wafer.

[0054] The substrate can be a semiconductor wafer. For example, the substrate can be made from any of the semiconductor materials listed above.

[0055] The substrate, such as a wafer, can be made from a single material or from a combination of different materials, for example, two or more of the materials identified above. For example, the substrate can be a silicon-glass composite wafer, in which a silicon wafer element is bonded to a glass wafer element.

[0056] Active layers or components can be formed on the substrate. Such active layers or components are preferably formed on one side of the substrate. On this side, the substrate has a central component area in which components or active layers are formed, and a circumferential edge area surrounding the component area. Preferably, no components or active layers are formed in the circumferential edge area. In the following, the side of the substrate on which the component area is formed is generally referred to as the front side of the substrate. Correspondingly, the opposite side of the substrate is referred to as the back side of the substrate.

[0057] The components in this component area can be ICs (integrated circuits) and LSIs (large-area integrations). For example, the components can also be semiconductor devices, power devices, optical devices, medical devices, electrical components, MEMS devices, or combinations thereof. The components can be, for example, transistors such as MOSFETs or insulated-gate bipolar transistors (IGBTs), or diodes such as Schottky diodes.

[0058] The substrate can be supported either on the side of the substrate with the active layers or components (i.e., on the front side of the substrate) or on the opposite side (i.e., on a rear side of the substrate).

[0059] The front and / or back side of the substrate can be essentially parallel. Furthermore, the front and / or back side of the substrate can be essentially flat or level. However, the substrate may also exhibit height differences on at least one side. In particular, the component area of ​​the substrate may be formed with multiple protrusions, such as contact bumps, that rise from a flat surface of the substrate. These protrusions are used, for example, to establish electrical contact with the components. The protrusions may result in an uneven surface structure of the substrate.

[0060] The workpiece 10 is not restricted to a specific shape. The workpiece 10 can be cylindrical and / or plate-shaped and can have cross-sections with outlines (defining a circumferential edge of the workpiece 10) that are essentially round, oval, or circular. In other words, in a top view, the workpiece 10 can have a round, oval, or circular shape.

[0061] However, the workpiece 10 can also have at least one linear section along the outline of the cross-sections. In particular, in a top view (or a cross-section perpendicular to its longitudinal axis), the workpiece 10 can also have a polygonal (plate) shape, such as a square or rectangular shape. Plate-shaped in this context means that the workpiece 10 has a thickness, i.e., a longitudinal dimension, that is significantly less than a transverse or lateral dimension, such as a diameter, of the workpiece 10 (furthermore, the workpiece is preferably cylindrical). The circumferential edge of the workpiece 10 can be rounded or chamfered.

[0062] The Fig. 1a and Fig. Figure 1b illustrates an embodiment of a workpiece support unit 100 for supporting a workpiece 10 and a workpiece 10 that is arranged on the workpiece support unit 100. Fig. Figure 1a is an exploded view of the workpiece support unit 100 together with the workpiece 10. Fig. Figure 1b illustrates an assembled state in which the individual parts of the workpiece support unit 100 have been combined. Furthermore, a workpiece 10 is supported by the workpiece support unit 100.

[0063] In accordance with the in the Fig. 1a and Fig. In the illustrated embodiment 1b, the workpiece support unit 100 has a carrier 20, a protective surface material 30 and an intermediate layer 40, each of which is described in more detail below.

[0064] It should be noted that the figures are schematic representations used to illustrate various configurations of the wafer support unit. For illustrative purposes, the thicknesses of the surface materials, workpieces, and supports are exaggerated. Consequently, it only appears that the surface materials overlap with the workpieces and supports in the thickness direction or are arranged in recesses by them, although this is not the case; it is a result of the exaggerated representation.

[0065] It should also be noted that "arranged" on, for example, the first side of the substrate does not require physical contact between the protective surface material and the first side of the substrate. For example, additional layers, such as an adhesive layer, can be inserted between the protective surface material and the first side of the substrate.

[0066] The support 20 provides support for the workpiece, particularly when a load is applied to the workpiece 10 during machining. The support 20 has a first side 21 and a second side 22 opposite the first side 21. The first side 21 of the support 20 faces the protective surface material 30 and the intermediate layer 40.

[0067] The carrier 20 can have a carrier substrate 23 with a first side facing the protective surface material 30 and the intermediate layer 40, and a second side opposite the first side. The first side and the second side of the carrier substrate 23 are preferably substantially parallel to each other.

[0068] The support substrate 23 is preferably plate-shaped and can have a cross-section with an outline (defining a circumferential edge of the support substrate 23) that is substantially round, oval, or circular. However, the support substrate 23 can also have at least one linear section along the outline of the cross-section. In particular, the support substrate 23 can also be a square or rectangular, preferably plate-shaped body. The circumferential edge of the support substrate 23 can be formed as a rounded or chamfered edge.

[0069] It is preferred that the support substrate 23 be made of a relatively hard or stiff material or substrate so that it can provide the desired support to the workpiece 10. In particular, the support substrate 23 can provide greater resistance to bending than the workpiece 10. The support substrate 23 can be made of the same substrate as the workpiece 10, but is not limited to a specific material or substrate. It is particularly preferred that the support substrate 23 be made of glass or silicon (Si).

[0070] The support substrate 23 is preferably heat-resistant to temperatures that occur during processing, such as grinding, laser processing, etc. This applies in particular to high-temperature processing, such as metallization, curing, etc., of the workpiece material 10 (for the production of semiconductors, i.e., a semiconductor material or workpiece). Accordingly, the support substrate 23 preferably has the same level of heat resistance as the workpiece 10.

[0071] The support 20 and / or the support substrate 23 preferably has a (slightly) larger lateral dimension than the workpiece 10 to be supported by it. For example, the diameter of the support 20 and / or support substrate 23 can be (slightly) larger than the diameter of the workpiece 10. For example, the support 20 and / or the support substrate 23 projects beyond the edge of the workpiece by a distance of 0.1 to 5.0 mm, in particular 0.5 mm to 2.5 mm.

[0072] This ensures that the workpiece 10, in particular its circumferential edge, is properly supported by the carrier 20, thus preventing damage to the workpiece 10 during machining.

[0073] Nevertheless, the support 20 and / or the support substrate 23 can have a lateral dimension that is essentially the same as the lateral dimension of the workpiece 10. This has the advantage that existing equipment does not need to be adjusted, making the implementation of the present method and the workpiece support unit into existing production processes particularly easy.

[0074] The second side 22 of the support 20 and / or the second side of the support substrate 23 can be held on a clamping table (not illustrated). The support 20 can be held on a clamping table, in particular, when the workpiece 10 is being machined. The support 20 can be held on the clamping table by suction.

[0075] In a method for providing a workpiece support unit in accordance with the present disclosure, the method comprises the step described above with a provision of a carrier 20.

[0076] The protective surface material 30 serves as a protective layer for the workpiece 10 and / or for the support 20. The protective surface material 30 can provide protection against breakage, deformation, and / or contamination by residues, for example, during machining of the workpiece 10. One side of the protective surface material 30 faces the workpiece 10 to be supported, and the other side of the protective surface material 30, opposite the first side, faces the intermediate layer 40 and the support 20.

[0077] The protective surface material 30 can be made of a material that adheres to the support 20 and / or the workpiece 10, for example by applying heat. In particular, the protective surface material 30 can be made of a plastic material, such as a polymer. For example, the protective surface material 30 can be made of a polyolefin, such as polyethylene (PE), polypropylene (PP), or polybutylene (PB).

[0078] The protective surface material 30 can have a thickness in the range of 5 to 500 µm, preferably 5 to 200 µm, particularly preferably 8 to 100 µm, even more preferably 10 to 80 µm and most preferably 12 to 50 µm.

[0079] In the present embodiment, the protective surface material 30 has a substantially circular shape in a top view and an outer diameter that is larger than the outer diameter of the workpiece 10 and / or the support 20 (support substrate 23). In other embodiments, the outer diameter of the protective surface material 30 can be smaller, for example slightly smaller, or substantially the same as the outer diameter of the workpiece 10 and / or the support 20 (support substrate 23).

[0080] The protective surface material 30 is preferably a sheet-like material. As in the Fig. 1a and Fig. As illustrated in Figure 1b, the protective surface material 30 has a (single) protective layer 31. It is particularly preferred that the protective layer 31 is a polyolefin film.

[0081] In further embodiments, the protective surface material 30 can also have one or more additional layers. These additional layers of the protective surface material 30 can be made of the same or a different material than the protective layer 31. In particular, these additional layers of the protective surface material can be an adhesive layer, a damping layer, and / or a base surface material.

[0082] The base surface material and / or the damping layer may be desirable to accommodate height differences or an uneven surface structure of the workpiece 10. In particular, protrusions, such as contact bumps, may be embedded in the damping layer. This makes it possible to improve the support of the workpiece 10 on the carrier 20 even if the workpiece 10 has an uneven surface structure, while reducing the risk of damage to the workpiece 10 during its machining.

[0083] The material of the damping layer is not particularly restricted. In particular, the damping layer can be made of any type of material that allows the workpiece 10's protruding ridges along the thickness direction to be embedded within it. For example, the damping layer can be made of a resin, an adhesive, a gel, or the like.

[0084] The damping layer can be cured by an external stimulus, such as UV radiation, heat, an electric field, and / or a chemical substance. In this case, the damping layer cures at least partially upon application of the external stimulus. For example, the damping layer can be made of a curable resin, a curable adhesive, a curable gel, or similar material.

[0085] The damping layer can be designed to exhibit a degree of compressibility, elasticity, and / or flexibility after hardening. For example, the damping layer can be designed to assume a rubber-like state upon hardening. Alternatively, the damping layer can be designed to achieve an essentially rigid, hard state after hardening.

[0086] A base material can be attached to the damping layer. The material of the base material is not particularly restricted. The base material can be made of a soft or malleable material, such as a polymer, for example, polyvinyl chloride (PVC), ethylene vinyl acetate (EVA), or a polyolefin. Alternatively, the base material can be made of a rigid or hard material, such as polyethylene terephthalate (PET), silicon, glass, and / or stainless steel (SUS).

[0087] In the state where workpiece 10 is supported on workpiece support unit 100, workpiece 10 is, as in Fig. Figure 1b illustrates contact with one side of the protective surface material 30. In particular, the side of the workpiece 10 on which components or active layers are formed (i.e., the front side) or the opposite side (i.e., the rear side) can be in contact with one side of the protective surface material 30. However, in other embodiments, at least one additional layer 41 can also be located between the protective surface material 30 and the intermediate layer 40.

[0088] In the method for providing a workpiece support unit 100 in accordance with the present disclosure, the method, as described above, comprises the step of providing a protective surface material 30.

[0089] The workpiece support unit 100 further comprises an intermediate layer 40. The intermediate layer 40 has one side facing the protective surface material 30 (or an optional additional intermediate layer 41) and another side opposite the first side, facing the carrier 20.

[0090] The intermediate layer 40 is preferably made of a material that differs from the material of the protective surface material 30. In particular, the intermediate layer 40 can be made of a material that exhibits only a weak or essentially no bonding strength to other layers or components, especially to the substrate 20. Furthermore, it is preferred that the material of the intermediate layer 40 is heat-resistant. Preferably, the intermediate layer is heat-resistant up to 180°C and more preferably up to 400°C. This ensures, in particular, that the intermediate layer retains its non-adherent properties during machining of the workpiece.

[0091] It is particularly preferred that the intermediate layer 40 is a polyimide film, such as poly(4,4'-oxydiphenylenepyromellitimide; trade name: Kapton) or a polyethylene terephthalate (PET) film.

[0092] The intermediate layer 40 can be a sheet-like material or can be applied as a coating to the protective sheet material 30 and / or the carrier 20.

[0093] In the present embodiment, the intermediate layer 40 has a substantially circular shape in plan view. A lateral dimension (for example, width or diameter) of the intermediate layer 40 can be larger or smaller than a lateral dimension (for example, width or diameter) of the support 20 (support substrate 23) and / or the protective surface material 30. In some embodiments, the intermediate layer 40 has substantially the same or a larger lateral dimension (for example, width or diameter) than the component area formed on the workpiece 10.

[0094] In the method for providing a workpiece support unit 100 in accordance with the present disclosure, the method comprises, as described above, the step of providing an intermediate layer 40.

[0095] How the Fig. 1a and Fig. As can be seen from Figure 1b, the protective surface material 30 is arranged together with the intermediate layer 40 on the first side 21 of the support 20. The intermediate layer 40 is inserted between the protective surface material 30 and the support 20, such that the bonding force between the protective surface material 30 and the support 20 is greater in an edge region of the first side 21 of the support 20 than in a central region of the first side 21 of the support 20.

[0096] In the method for providing a workpiece support unit 100 in accordance with the present disclosure, the method comprises the step of arranging the protective surface material 30 and the intermediate layer 40 on the first side 21 of the carrier 20 by at least partially inserting the intermediate layer 40 between the protective surface material 30 and the carrier 20, such that a bonding force between the protective surface material 30 and the carrier 20 is greater in a peripheral region of the first side 21 of the carrier 20 than in a central region of the first side 21 of the carrier 20.

[0097] The workpiece support unit 100 disclosed herein provides an effective alternative for reliably fixing and supporting a workpiece 10 on a carrier 20 without the use of an adhesive. Even if the workpiece 10 is machined to a relatively low thickness, there is no risk of a machining unit, such as a grinding wheel, being affected by an adhesive on the circumferential surface of the workpiece 10. Furthermore, no additional steps are necessary to clean the workpiece 10 and / or the carrier 20 (especially for reusing the latter to support another workpiece 10) of adhesive residue.

[0098] The intermediate layer 40 further provides the technical benefit of preventing the protective surface material 30 from being directly attached to the support 20 across the entire side of the protective surface material 30 facing the support 20. This effectively reduces the bonding force between the protective surface material 30 and the support 20, particularly in the central area of ​​the first side 21 of the support 20. However, the bonding force between the protective surface material 30 and the support 20 in a peripheral area of ​​the first side 21 of the support 20 is maintained (preferably by the intermediate layer 40, which has a smaller lateral dimension than the protective surface material 30 and the support 20).

[0099] This allows for easier removal or separation (i.e., peeling, sliding, or lifting) of the workpiece 10 (together with the protective surface material 30) from the carrier 20, while significantly reducing the risk of damage to the workpiece 10 during the removal or separation process. At the same time, the bonding force between the protective surface material 30 and the carrier 20 is maintained in an edge region of the first side 21 of the carrier 20, thus ensuring reliable fixation of the workpiece 10 (together with the protective surface material 30) to the carrier 20.

[0100] The protective surface material 30 also provides a sealing effect for the intermediate layer 40. In particular, the intermediate layer 40 can be sealed by the protective surface material 30 along its perimeter. This prevents or even completely avoids the ingress of air between the intermediate layer 40 and the substrate 20, which could cause an unintentional separation of the protective surface material 30 from the substrate 20.

[0101] Furthermore, the protective surface material 30 also provides a protective effect to the carrier 20 and / or the carrier substrate 23. For example, the carrier 20 can be protected against residues generated during machining of the workpiece 10. This promotes the maintenance and simplification of the reusability of the carrier 20.

[0102] If the intermediate layer 40 is substantially the same size (or even larger) than a component area formed on the workpiece 10, the bonding force of the protective surface material 30 to the substrate 20 can be reduced, particularly in the area where components or active layers are present on the workpiece 10. During peeling, sliding, or lifting of the workpiece 10 together with the protective surface material 30 from the substrate 20, the load applied to the components or active layers can be significantly reduced. Consequently, the risk of damage to components or active layers during separation or removal of the workpiece 10 from the substrate 20 is noticeably reduced.

[0103] Furthermore, the workpiece support unit 100 disclosed herein can be used for several processing steps of the workpiece 10, thus preventing the need to reattach the workpiece 10 to a different belt or substrate. In other words, the workpiece support unit 100 is suitable for use, for example, for grinding, polishing, etching, curing, metallizing, lithography, plasma cutting, laser processing, and / or mechanical cutting of the workpiece.

[0104] After the protective surface material 30 and the intermediate layer 40 have been arranged on the first side 21 of the carrier 20, the intermediate layer 40 can be at least partially integrated or embedded in the protective surface material 30. In other words, the protective surface material 30 can at least partially surround the intermediate layer 40.

[0105] In other words, the intermediate layer 40 can be held to the carrier 20 by the protective surface material 30 via a positive fit. This is particularly advantageous in cases where the intermediate layer 40 itself does not exert a strong bond to the carrier 20 or is not intended to do so. This prevents unintentional displacement of the intermediate layer 40 on the carrier 20.

[0106] In accordance with the Fig. In the illustrated embodiment 1b, the protective surface material 30, in particular the protective layer 31, is in contact with the edge region of the first side 21 of the carrier 20 and / or with the intermediate layer 40. However, this is not to be understood as a limitation. In other embodiments, additional layers, such as an adhesive layer, can also be arranged between the protective surface material 30 and the carrier 20 and / or between the protective surface material 30 and the intermediate layer 40, so that there is no contact there.

[0107] This improves the reliability of the fixation of the workpiece 10, which is combined with the protective surface material, to the carrier 20, so that if a load is applied to the workpiece 10 during machining, an unintentional separation of the protective surface material 30 from the carrier 20 is avoided.

[0108] The intermediate layer 40 can be in contact with the first side 21 of the carrier 20, in particular with the first side of the carrier substrate 23. It is particularly preferred that no adhesive is arranged between the intermediate layer 40 and the carrier 20.

[0109] Since the intermediate layer 40 is made of a material that exhibits little or no bonding force to the carrier 20, the bonding force between the protective surface material 30 and the carrier 20 can be significantly reduced. This facilitates peeling, sliding, or lifting of the workpiece 10 together with the protective surface material 30 from the carrier 20.

[0110] As in the Fig. 1a and Fig. As illustrated in Figure 1b, the intermediate layer 40 is completely inserted between the protective surface material 30 and the carrier 20. In other embodiments, the intermediate layer 40 can be inserted at least partially between the two.

[0111] It is preferred that the intermediate layer 40 is arranged in the central region of the first side 21 of the support 20. In other words, it is preferred that the intermediate layer 40 is not present in at least part or parts of an edge region of the first side 21 of the support 20.

[0112] Optional and as schematically shown in Fig. As illustrated in Figure 1a, one or more additional intermediate layers 41 may be provided. If the one or more additional intermediate layers 41 are present, they are arranged on the first side 21 of the carrier 20 by being inserted, at least partially, between the intermediate layer 40 and the protective surface material 30. As described above, additional intermediate layers 41 may, for example, be an adhesive layer, a damping layer, and / or a base surface material.

[0113] In the method for providing a workpiece support unit 100 in accordance with the present disclosure, the method may further comprise the step of providing one or more additional intermediate layers 41 and inserting the one or more additional intermediate layers 41 at least partially between the intermediate layer 40 and the protective surface material 30.

[0114] In particular, an additional intermediate layer 41 can be used to attach the intermediate layer 40 to the protective surface material 30 and / or to prevent unintentional separation of the protective surface material 30 and the intermediate layer 40.

[0115] If the protective surface material 30 and the intermediate layer 40 (and optionally one or more additional intermediate layers 41) are arranged on the first side 21 of the carrier 20, each individual layer can be arranged or laminated successively on the first side 21 of the carrier 20 or on the second side of the protective surface material 30.

[0116] Alternatively, the protective surface material 30 and the intermediate layer 40 (and optionally one or more additional intermediate layers 41) can be pre-arranged with some or all of the individual layers. In this case, the pre-arranged layers are placed or laminated onto the first side 21 of the carrier 20 in one step.

[0117] The protective surface material 30 can also be arranged or laminated on the front or rear side of the workpiece 10 and then arranged or laminated on the first side 21 of the carrier 20.

[0118] During and / or after the application of the protective surface material 30 and the intermediate layer 40 (and possibly additional intermediate layers 41) to the first side 21 of the substrate 20, an external stimulus can be applied to the protective surface material 30, causing it to adhere to the first side 21 of the substrate 20. The application of the external stimulus thus generates a bonding force between the protective surface material 30 and the substrate 20, holding the protective surface material 30 in position on the substrate 20. Consequently, no additional adhesive is required to adhere the protective surface material 30 to the first side 21 of the substrate 20.

[0119] In particular, by applying the external stimulus to the protective surface material 30, a positive fit, such as a form-fit connection (especially if no adhesive is used) and / or a material bond, such as an adhesive bond, can be formed between the protective surface material 30 and the substrate 20. The terms "material bond" and "adhesive bond" define an attachment or connection between the protective surface material 30 and the substrate 20 due to atomic and / or molecular forces acting between these two components.

[0120] The term “adhesion” refers to the presence of these atomic and / or molecular forces that cause the protective surface material 30 to adhere to the substrate 20 and does not indicate the presence of an additional adhesive between the protective surface material 30 and the substrate 20.

[0121] Applying the external stimulus to the protective surface material 30 may include or consist of heating and / or cooling the protective surface material 30 and / or applying pressure to the protective surface material 30 and / or applying a vacuum to the protective surface material 30 and / or irradiating the protective surface material 30 with radiation, such as light or UV radiation, for example by using a laser beam.

[0122] The external stimulus may include or be a chemical compound and / or electron or plasma irradiation and / or mechanical treatment, such as negative pressure, pressure, friction, or the application of ultrasound and / or static electricity.

[0123] If applying the external stimulus to the protective surface material 30 involves or consists of heating the protective surface material 30, the method may further include allowing the protective surface material 30 to cool down after the heating process. In particular, it may be permitted for the protective surface material 30 to cool down to its initial temperature, that is, to the temperature before the heating process.

[0124] A bond is created between the protective surface material 30 and the substrate 20 by the heating process. The adhesion of the protective surface material 30 to the substrate 20 can occur during the heating process itself and / or in a subsequent cooling process. The protective surface material 30 can be softened by the heating process. Upon cooling, for example, generally back to its initial temperature, the protective surface material 30 can harden again to create, for example, a positive fit and / or a material bond with the substrate 20.

[0125] During and / or after the protective surface material 30 and the intermediate layer 40 are arranged on the first side 21 of the support 20, the method can further include applying pressure to the protective surface material 30 and / or the support 20. In this way, the protective surface material 30 and the intermediate layer 40 are pressed against the first side 21 of the support 20. Consequently, it can be ensured in a particularly efficient manner that the protective surface material 30 is reliably attached to the support 20. The pressure can be applied, for example, by a pressure mechanism.

[0126] The protective surface material 30 and the intermediate layer 40 can be arranged on the first side 21 of the carrier 20 in a negative pressure atmosphere, in particular under a vacuum. This reliably ensures that no voids and / or air bubbles are present between the protective surface material 30 and the first side 21 of the carrier or between the intermediate layer 40 and the first side 21 of the carrier, which could cause the risk of unintentional separation of the protective surface material 30 or the intermediate layer 40 from the carrier 20. The workpiece 10 (together with the protective surface material 30) can thus be more reliably fixed to the carrier 20.

[0127] For example, the step(s) of arranging the protective surface material 30 and the intermediate layer 40 on the first side 21 of the carrier 20 can be carried out in a vacuum chamber. After the carrier 20 and the protective surface material 30 and intermediate layer 40 have been loaded into the vacuum chamber, the chamber is evacuated. Optionally, air can be supplied through an air inlet opening of a rubber membrane, causing the rubber membrane to expand into the evacuated chamber. In this way, the rubber membrane is moved downwards into the vacuum chamber, pressing the protective surface material 30 and the intermediate layer 40 against the first side 21 of the carrier 20.

[0128] Subsequently, the vacuum in the vacuum chamber is released, and the protective surface material 30 and the intermediate layer 40 are held in position on the first side 21 of the support 20 by the bonding force generated between the protective surface material 30 and the support 20. When the vacuum is released, atmospheric pressure can also exert a pressure force that causes the protective surface material 30, the intermediate layer 40, and the support 20 to be compressed together.

[0129] In this way, it may not be necessary to use a separate pressure mechanism or rubber membrane as described above.

[0130] The Fig. Figures 2a to 2e illustrate modifications of the embodiment of the workpiece support unit 100 in accordance with the present disclosure and in the Fig. 1a and Fig. Figure 1b, referenced above, illustrates this. Different embodiments of a workpiece support unit 100 with an adhesive applied thereto are described below. In general, it is preferred that no adhesive material comes into contact with components or active layers formed on the workpiece 10 (in a state in which the workpiece 10 is supported by the workpiece support unit 100). It is further preferred that no adhesive material comes into contact with the central area of ​​the first side 21 of the carrier 20.

[0131] This ensures that components or active layers formed on the workpiece 10 are not contaminated with adhesive. Furthermore, it facilitates the removal of the workpiece 10 from the protective surface material 30, the removal of the workpiece 10 (together with the protective surface material) from the substrate 20, and the cleaning of the workpiece 10 and the substrate 20.

[0132] As in Fig. As illustrated in Figure 2a, the protective surface material 30 described above can have an adhesive agent 32. The adhesive agent 32 can be arranged on the side facing the workpiece 10, which is to be supported by the workpiece support unit 100. The adhesive agent 32 can be provided on a circumferential section of the protective surface material 30, in particular on a circumferential section of the protective layer 31. The circumferential section provided with an adhesive agent preferably corresponds to a circumferential edge region that surrounds the component area of ​​the workpiece 10.

[0133] In embodiments where the protective surface material 30 has an adhesive 32 arranged on the side facing the workpiece 10, it is preferred that, in a state where the front side of the workpiece 10 is arranged against the protective surface material 30, the adhesive 32 comes into contact with the circumferential edge region surrounding the component area of ​​the workpiece 10. In other words, it is particularly preferred that the adhesive 32 does not come into contact with the component area of ​​the workpiece 10. Even in a state where the rear side of the workpiece 10 is arranged against the protective surface material 30, the adhesive 32 comes into contact with a circumferential edge region of the rear side of the workpiece that is opposite and corresponds to the circumferential edge region on the front side surrounding the component area of ​​the workpiece 10.Consequently, it is equally preferred that, in the event that the adhesive 32 comes into contact with the rear side, it does not come into contact with an area of ​​the rear side that corresponds to the component area of ​​the workpiece 10 on its front side.

[0134] In accordance with Fig. 2b The protective surface material 30 may, in addition to or as an alternative to the adhesive 32, have an adhesive 33 which is arranged on the side facing the carrier 20 and the intermediate layer 40. The adhesive 33 may be provided on a circumferential section of the protective surface material, in particular on a circumferential section of the protective layer 31 (i.e., in a ring shape). However, the adhesive 33 may also be provided over (essentially) the entire side of the protective surface material 30 (protective layer 31) facing the carrier 20.

[0135] Fig. 2c is an embodiment of the workpiece support unit 100, which combines the features described in the Fig. 2a and Fig. The embodiments illustrated in Figure 2b are shown. In this embodiment, the protective surface material 30 includes the adhesive agents 32 and 33 on the side facing the workpiece 10 and on the side facing the carrier 20 and the intermediate layer 40, respectively. The adhesive agents 32 and 33 can be arranged in relation to the embodiments illustrated in the Fig. 2a and Fig. 2b illustrated embodiments as described above.

[0136] In other embodiments and as described in Fig. As illustrated in Figure 2d, the carrier 20 can have an adhesive 24. The adhesive 24 can be arranged at the edge region of the carrier 20. In particular, the adhesive 24 can be arranged on the first side of the carrier substrate 23, which faces the protective surface material 30 and the intermediate layer 40, and especially at an edge region or annular edge region of the first side of the carrier substrate 22.

[0137] Although not illustrated, other embodiments of the workpiece support unit 100 can connect the carrier 20 with the adhesive 24 as above with respect to Fig. 2d described and the protective surface material 30 with the adhesive 32 and / or the adhesive 33 as above with regard to the Fig. 2a, Fig. 2b or Fig. 2c described, exhibit.

[0138] In alternative embodiments and as in Fig. As illustrated in Figure 2e, neither the protective surface material 30 nor the carrier 20 has an adhesive agent. Such an embodiment corresponds to the one shown in the Fig. 1a and Fig. 1b illustrated embodiment.

[0139] By applying the adhesives described above, the bonding force between the individual layers or components can be adjusted according to the application of the workpiece support unit 100. This reduces the risk of unintentional separation of the individual layers or components of the workpiece support unit 100.

[0140] The Fig. 3a and Fig. Figure 3b illustrates a further exemplary embodiment of a workpiece support unit 100 for supporting a workpiece 100 in accordance with the present disclosure. Fig. Figure 3a illustrates an exploded view of the workpiece support unit 100 together with the workpiece 10 supported by it. Fig. Figure 3b illustrates an assembled state in which the individual parts of the workpiece support unit 100 have been combined with the workpiece 10 supported by it.

[0141] The workpiece 10, the carrier 20, the protective surface material 30 and the intermediate layer 40 are the same as those above with respect to those in the Fig. The embodiments described in Figures 1a to 2e are illustrated above. Therefore, the above description, including the technical effects achieved by the workpiece support unit 100, applies equally to the embodiments described in the figures. Fig. 3a and Fig. 3b illustrates the embodiment.

[0142] In accordance with the Fig. 3a and Fig. 3b The carrier 20 further comprises an additional protective surface material 25. The additional protective surface material 25 has one side facing the protective surface material 30 and the intermediate layer 40, and another side opposite this side, facing the carrier substrate 23. The additional protective surface material 25 can be arranged on the first side of the carrier substrate 23.

[0143] The additional protective surface material 25 can be of the same type as the protective surface material 30. Therefore, the preceding description regarding the design of the protective surface material 30 and regarding the method for arranging the protective surface material 30 on the support 20 preferably applies equally to the additional protective surface material 25 and the method for arranging the additional protective surface material 25 on the support substrate 23.

[0144] Again Fig. As can be seen from Figure 3b, in a state where the protective surface material 30 and the intermediate layer 40 are arranged on the first side 21 of the carrier 20, the protective surface material 30 and the additional protective surface material 25, in particular its (ring-shaped) circumferential sections, are in contact with each other. In other words, the protective surface material 30 and the additional protective surface material 25 are in contact around the intermediate layer 40. The protective surface material 30 and the additional protective surface material 25 are in contact with each other along a predetermined width in the lateral direction.

[0145] In this case, the intermediate layer 40 between the protective surface material 30 and the additional protective surface material 25 is sealed. Sealing the intermediate layer 40 between the two protective surface materials 25 and 30 prevents air from entering the space between the intermediate layer 40 and the protective surface materials 25 and 30. Furthermore, the additional protective surface material 25 enables the space between the first side 21 of the carrier 20 and the additional protective surface material 25 to be sealed, particularly by applying an external stimulus. As in the case of the protective surface material 30, the protective surface material 25 can be softened by heat, resulting in the interlocking and / or bonding described above.

[0146] Consequently, arranging the protective surface materials 25 and 30 can prevent air from entering at the level of the intermediate layer 40, while the intermediate layer further facilitates the removal of the workpiece 10 and the protective surface material 30, as well as the additional protective surface material 25. In particular, applying an external stimulus, such as heat and / or a vacuum, improves the sealing effect to prevent the ingress of surrounding air.

[0147] The absence of an adhesive between the first side 21 of the carrier 20 and the additional protective surface material 25 facilitates the removal or peeling of these material layers from the carrier after machining of the workpiece 10.

[0148] Furthermore, the risk of unintentional separation of the protective surface material 30 from the support 20, particularly when a load is applied to the workpiece 10 during machining, can be prevented. Unintentional separation can also be prevented when the workpiece 10 and the workpiece support unit 100 are exposed to high temperatures (for example, in the range of 100°C to 400°C) or a vacuum. This is the case, for example, during metallization, curing, or plasma treatment. Under these circumstances, it is advantageous to prevent air from entering between the layers. Accordingly, the above enables more reliable fixation and support of the workpiece 10 on the support 20.

[0149] At the same time, this embodiment retains the effect of simplifying the separation of the workpiece 10 from the carrier 20. Although the protective surface material 30 and the additional protective surface material 25 are sealed along a circumferential (ring-shaped) section, a sharp or pointed element (not illustrated), such as a blade, cutter, knife, or wedge, can be inserted from an outer circumferential position between the surface materials 25 and 30. This allows the protective surface materials 25 and 30 to be easily separated. The intermediate layer 40 reduces the bonding force between the protective surface material 30 and the central area of ​​the first side 21 of the carrier 20, which tends to be more difficult to access with the sharp element.Therefore, the workpiece 10 (together with the protective surface material 30) can still be easily separated from the carrier 20.

[0150] The additional protective surface material 25 may or may not include an adhesive 26. The adhesive 26 may be provided on the side facing the carrier substrate 23, in particular on a circumferential section (annular section) of the additional protective surface material 25. This facilitates peeling off the additional protective surface material 25. However, the adhesive 26 may also be provided on the entire side facing the carrier substrate 23.

[0151] Although not illustrated, the additional protective surface material 25 may additionally or alternatively also include an adhesive provided on the side facing the protective surface material 30 and the intermediate layer 40. The adhesive may be provided only in a circumferential section (annular section) of the side facing the protective surface material 30 and the intermediate layer 40, or over substantially the entire side.

[0152] As in the Fig. 3a and Fig. As illustrated in Figure 3b, in this embodiment neither the protective surface material 30 nor the additional protective surface material 25 includes an adhesive on the sides facing the intermediate layer 40. However, in alternative embodiments, either the protective surface material 30 or (alternatively) the additional protective surface material 25 includes an adhesive on the side facing the intermediate layer 40. In other words, it is preferred that either the protective surface material 30 or the additional protective surface material 25 has an adhesive on the side facing the intermediate layer 40.

[0153] Fig. Figure 4 illustrates a step involving the cutting of an arrangement of protective surface materials 25 and 30 of a workpiece support unit 100 of the method for providing a workpiece support unit 100 in accordance with the present disclosure.

[0154] The protective surface material 30 and / or the additional protective surface material 25 may have a circumferential excess section that extends laterally over the lateral dimensions of the workpiece 10 and / or the support substrate 23 (for example, for attaching the workpiece support unit 100 to a ring frame). The protective surface material 30 and / or the additional protective surface material 25 can be cut to separate the circumferential excess sections.

[0155] The position along which the protective surface material 30 and / or the additional protective surface material 25 is cut is shown in Fig. Figure 4 is illustrated by the dashed lines. The position along which the protective surface materials 25, 30 are cut is preferably predetermined such that, after cutting, the width along which the protective surface material 30 and the additional protective surface material 25 are in contact is equal to or greater than a predetermined minimum width. This minimum width is designed so that the protective surface material 30 and the additional protective surface material 25 adhere to each other in an area surrounding the perimeter of the intermediate layer 40. Preferably, the surrounding area has a width in the range of 1 mm to 5 mm, particularly 1 mm to 3 mm.

[0156] This ensures that the sealing effect of the intermediate layer 40 between the protective surface materials 25 and 30, as described above, is maintained.

[0157] After the cutting step, the protective surface material 30 and / or the additional protective surface material 25 can no longer have the circumferential excess sections that extend laterally over lateral dimensions of the workpiece 10 and / or the support substrate 23.

[0158] The cutting step described above simplifies the handling of the workpiece support unit 100 and the workpiece 10 attached to it for certain processing steps, since unnecessary excess circumferential sections of the protective surface materials 25 and 30 have been removed. At the same time, the sealing effect of the intermediate layer 40 between the two protective surface materials 25 and 30 is maintained for reliable fixation of the workpiece 10 to the carrier 20.

[0159] Although Fig. 4 the cutting step with regard to the embodiment of the workpiece support unit 100, as described in the Fig. 3a and Fig. As shown in 3b, the cutting step can be carried out in a corresponding manner in the examples shown in the Fig. The embodiments illustrated in 1a to 2e are applied.

[0160] Fig. Figure 5 illustrates a further exemplary embodiment of a workpiece support unit 100 in accordance with the present disclosure. In accordance with this embodiment, a ring frame (annular frame) 50 can be attached to the protective surface material 30, in particular to the protective layer 31. A circumferential section of the protective surface material 30 (protective layer 31) is attached to the ring frame 50 such that the protective surface material 30 closes a central opening of the ring frame 50, that is, the area inside the inner diameter of the ring frame 50.

[0161] As in Fig. As illustrated in Figure 5, the ring frame 50 can be attached to the side of the protective surface material 30 facing the workpiece 10 to be supported. However, the ring frame 50 can also be located on the side of the protective surface material 30 facing the intermediate layer 40 and the support 20. The ring frame 50 can surround the workpiece 10 and / or the support 20 (support substrate 23).

[0162] In the present invention, the step of attaching the ring frame 50 to the protective surface material 30 is performed before the protective surface material 30 is positioned on the support 20. This facilitates the handling of the protective surface material 30, particularly when positioning it on the support 20. Furthermore, after the protective surface material 30 is positioned on the support 20, the workpiece support unit 100 can be held by the ring frame 50 over the protective surface material 30. Consequently, handling and transport of the workpiece support unit 100 are also facilitated.

[0163] Although Fig. 5 the ring frame 50 with regard to the embodiment of the workpiece support unit 100 as in the Fig. 1a and Fig. As illustrated in Figure 1b, a ring frame 50 attached to the protective surface material 30 is not limited to this. That is to say, a ring frame can also be attached to the protective surface material 30 and / or the additional protective surface material 25 by any of the elements shown in the Fig. can be attached in the embodiments shown in 2a to 4.

[0164] In Fig. Figure 6 illustrates a further step for cutting the protective surface material 30 of the workpiece support unit 100 in accordance with the procedure for providing the workpiece support unit 100.

[0165] For all or some processing steps of the workpiece, it may be desirable to separate the ring frame 50 from the protective surface material 30. However, the present disclosure is not limited to this. To do this, the protective surface material 30 can be separated by means of dashed lines in Fig. The protective surface material 30 is cut at six indicated positions. The position along which it is cut is preferably predetermined, such that after cutting, the width along which the protective surface material 30 is in contact with the carrier 20 is equal to or greater than a predetermined minimum width (for example, a minimum width in the range of 1 mm to 5 mm or 1 mm to 3 mm). This maintains the sealing effect of the intermediate layer 40, as well as a reliable fixation of the protective surface material 30 (and consequently the workpiece 10) to the carrier 20.

[0166] Since the workpiece support unit 100 can generally be used for several machining steps of the workpiece 10, the cutting step described above allows for relatively simple adaptation of the workpiece support unit 100 for individual machining steps. Consequently, it is not necessary to reattach the wafer to a different support device.

[0167] The Fig. Figures 7 to 10 illustrate further embodiments of the workpiece support unit 100 in accordance with the present disclosure. Fig. Figure 7 illustrates an exploded view of the workpiece support unit 100 together with the workpiece 10 supported by it. Fig. Figures 8 to 10 illustrate assembled states in which individual parts of the workpiece support unit 100 have been brought together with the workpiece 10 supported by it.

[0168] The workpiece 10, the carrier 20, the protective surface material 30 and the intermediate layer 40 are the same as those above with respect to the Fig. 1a to 6 described. Therefore, the above description, including the technical effects achieved by the workpiece support unit 100, also applies accordingly to those described in the Fig. 7 to 10 illustrated embodiments.

[0169] In accordance with the Fig. 7 to 10, the carrier 20 further comprises an additional protective surface material 27. The additional protective surface material 27 can be arranged on the second side of the carrier substrate 23 (i.e., the side opposite the side facing the protective surface material 30 and the intermediate layer 40).

[0170] The additional protective surface material 27 can be of the same type as the protective surface material 25 or 30 described above. Therefore, the preceding description regarding the structural aspects of the protective surface material 25 and 30, as well as regarding the method for arranging the protective surface materials 25 and 30 on the support 20, also applies to the additional protective surface material 27 and the method for arranging the additional protective surface material 27 on the support substrate 23.

[0171] Preferably, the additional protective surface material 27 is a heat-resistant tape.

[0172] Optional and as in the Fig. As shown in Figures 7 to 9, a ring frame 51 can be attached to the additional protective surface material 27, particularly on the side facing the support substrate 23. However, the ring frame 51 can also be provided on the side opposite the side facing the support substrate 23.

[0173] Ring frame 51 can be of the same type and / or dimensions as ring frame 50. Ring frame 51 can also be larger or smaller than ring frame 50. For example, a lateral dimension (e.g., width or diameter) of ring frame 51 can be larger than a lateral dimension (e.g., width or diameter) of ring frame 50. In other words, ring frames 50 and 51 are different in the Fig. 7 to 9 illustrated embodiment preferably arranged so that they can be built up with the protective surface material 30 inserted in between.

[0174] The step of attaching the ring frame 51 to the additional protective surface material 27 is carried out before the protective surface material 27 is positioned on the support substrate 23. The ring frame 51 has the same technical effect as the ring frame 50 described above, namely a simplification of the handling of the protective surface material 27 and the workpiece support unit 100.

[0175] In the Fig. Figures 8 to 10 illustrate a condition in which the protective surface material 30 and the intermediate layer 40 have been arranged on the side 21 of the support 20. As shown, the protective surface material 30 and the additional protective surface material 27 are in contact around the support substrate 23 (in particular along an annular section).

[0176] In this case, the intermediate layer 40 between the protective surface material 30 and the additional protective surface material 27 is sealed in such a way that the sealing effect described above applies.

[0177] Fig. Figure 10 corresponds to an alternative embodiment in which no ring frame 51 is attached to the additional protective surface material 27. In this embodiment, the width along which the protective surface materials 27 and 30 are in contact with each other is greater. This enables an improved sealing effect of the intermediate layer 40 between the surface materials 27 and 30.

[0178] In alternative embodiments, however, the protective surface material 30 and the additional protective surface material 27 may not be in contact with each other.

[0179] As from the Fig. As can be seen in Figures 8 to 10, the protective surface material 30 closely follows the outline of the support substrate 23, particularly along the rounded or chamfered edge of the support substrate 23. Consequently, the contact area of ​​the protective surface material 30 on the support 20 (support substrate 23) is increased. This serves the purpose of improved adhesion between the protective surface material 30 and the edge region of the first side 21 of the support 20. The fixation of the workpiece 10 and the protective surface material 30 to the support 20 is thus improved.

[0180] As further in the Fig. 8 and Fig. Figure 9 illustrates embodiments with ring frames 50 and 51. In a state in which the protective surface material 30 has been arranged on the first side 21 of the carrier 20, a (ring-shaped) circumferential section of the protective surface material 30 can be inserted between the ring frame 50 and the ring frame 51.

[0181] In Fig. Figure 9 shows the positions along which the protective surface materials 27 and 30 can be cut to separate the ring frames 50 and 51 from the protective surface materials 27 and 30. The step of cutting the protective surface materials 27 and 30 is essentially the same as described above with respect to the Fig. 4 and Fig. The cutting steps described in 6. It is clear to the expert that the cutting step also applies to the steps described in Fig. 10 illustrated embodiment is applicable.

[0182] In further embodiments of the workpiece support unit 100 in accordance with the present disclosure, the carrier 20 can have both additional protective layers 25 and 27.

[0183] In a method for machining a workpiece 10, the method, as described above, comprises the step of providing a workpiece support unit 100 to support the workpiece 10. Subsequently, the workpiece 10 is positioned on the protective surface material 30, in particular on a side of the protective surface material 30 that is opposite the side facing the carrier 20 and the intermediate layer 40.

[0184] However, in accordance with the present disclosure, the order of an arrangement of the surface material(s), the layer(s), the support and the workpiece is not particularly restricted.

[0185] For example, the method can include the step of applying a protective layer 31, as described, with or without an adhesive 32 to a front or rear side of a workpiece 10. The application of the protective layer 31 is preferably carried out in a vacuum (i.e., using a vacuum chamber) and even more preferably using heat during and / or after the application or lamination of the protective layer 31.

[0186] The use of a vacuum and / or heat results in the protective layer 31 conforming to the height differences (i.e., protrusions and depressions) on the surface of the workpiece 10. Consequently, the protective layer 31, particularly in its central area (which corresponds specifically to a component area on one of the sides of the workpiece 10), can be securely attached to the workpiece without the use of an adhesive. Furthermore, the protective layer 31 (especially as part of a workpiece support unit 100) can be easily and completely removed, so that essentially no post-processing of the workpiece is necessary to remove residual material from the workpiece support unit.

[0187] The protective layer 31 can also be applied to a ring frame 50 before or after the application of the protective layer 31 to a front or rear side of a workpiece 10. The application of a ring frame 50 can also be carried out during or substantially simultaneously with the application of the protective layer 31 to the workpiece.

[0188] Either before, during (especially simultaneously) or after the application of the protective layer 31 to the workpiece 10, an intermediate layer 40 can be applied to the protective layer 31 on the side of the protective layer 31 that is opposite the side facing the workpiece 10 (optionally with an additional layer 41 arranged / inserted in between).

[0189] This aspect of the process allows multiple workpieces (for example, wafers) to be prepared for further processing, resulting in an improvement in efficient manufacturing.

[0190] Then the workpiece 10 is machined by performing one or more machining steps.

[0191] Machining of the workpiece 10 while it is supported on the workpiece support unit 100 may include (but is not limited to) grinding, polishing, etching, plasma dicing, laser machining, and / or mechanical dicing. Machining of the workpiece 10 may also additionally or alternatively include the formation of modified layers within the workpiece 10 by focusing a pulsed laser beam with a transmission wavelength onto the material of the workpiece 10 inside the workpiece 10. Furthermore, machining of the workpiece 10 may be performed for curing, metallization, or lithography.

[0192] For some applications, it is preferred that after one or more machining steps have been performed on the workpiece 10, the structure of the workpiece support unit 100 is modified before one or more further machining steps are performed on the workpiece 10. For example, the structure of the workpiece support unit 100 can be modified by cutting one or more of the protective surface materials 25, 27 and 30 as described above.

Claims

[1] A method for providing a workpiece support unit (100) for supporting a workpiece (10), the method comprising: Providing a carrier (20) having a first side (21) and a second side (22) opposite the first side (21); Providing a protective surface material (30); Providing an intermediate layer (40); and Arranging the protective sheet material (30) and the intermediate layer (40) on the first side (21) of the carrier (20) by at least partially inserting the intermediate layer (40) between the protective sheet material (30) and the carrier (20) such that a bonding force between the protective sheet material (30) and the carrier (20) is greater in an edge region of the first side (21) of the carrier (20) than in a central region of the first side (21) of the carrier (20). [2] A method for providing a workpiece support unit (100) according to claim 1, in which the intermediate layer (40) is arranged in the central region of the first side (21) of the carrier (20), and / or wherein the intermediate layer (40) is arranged in contact with the carrier (20) and / or with the protective surface material (30). [3] A method of providing a workpiece support unit (100) according to claim 1 or 2, wherein the intermediate layer (40) is formed from a material different from a material of the protective sheet material (30). [4] A method for providing a workpiece support unit (100) according to any one of the preceding claims, wherein the intermediate layer (40) is a sheet material, in particular a polyimide film or a polyethylene terephthalate (PET) film. [5] A method for providing a workpiece support unit (100) according to any one of the preceding claims, wherein the intermediate layer (40) is applied by coating the protective surface material (30) and / or the carrier (20). [6] A method of providing a workpiece support unit (100) according to any one of the preceding claims, wherein the protective sheet material (30) is arranged in contact with the edge region of the first side (21) of the carrier (20). [7] Method for providing a workpiece support unit (100) according to one of the preceding claims, in which the protective surface material (30) has a protective layer (31), wherein the protective layer (31) is preferably arranged in contact with the edge region of the first side (21) of the carrier (20), and wherein the protective layer (31) is preferably a polyolefin film. [8] Method for providing a workpiece support unit (100) according to one of the preceding claims, in which the protective surface material (30) has one or more additional layers, wherein the one or more additional layers may be an adhesive layer, a cushioning layer and / or a base surface material. [9] A method of providing a workpiece support unit (100) according to any one of the preceding claims, the method further comprising: Providing one or more additional intermediate layers (41); and at least partially inserting the one or more additional intermediate layers (41) between the intermediate layer (40) and the protective surface material (30), wherein the one or more additional intermediate layers (31) can be an adhesive and / or a damping layer and / or a base surface material. [10] Method for providing a workpiece support unit (100) according to one of the preceding claims, in which the protective surface material (30) has an adhesive (32, 33) which is arranged on a side which is to face the workpiece (10) and / or on a side which is to face the carrier (20), wherein the adhesive (32, 33) is preferably provided on a peripheral portion of the respective sides. [11] Method for providing a workpiece support unit (100) according to one of the preceding claims, in which the carrier (20) comprises a carrier substrate (23) having a first side facing the protective surface material (30) and the intermediate layer (40) and a second side opposite the first side, wherein the carrier (20) preferably further comprises an adhesive (24), wherein the adhesive (24) is preferably arranged on the first side of the carrier substrate (23), in particular in an edge region of the first side (21) of the carrier substrate (23). [12] A method of providing a workpiece support unit (100) according to any one of the preceding claims, wherein the carrier (20) further comprises at least one additional protective sheet material (25, 26, 27). [13] A method for providing a workpiece support unit (100) according to claim 12, in which the at least one additional protective surface material (25, 26) is arranged on the first side of the carrier (20), and / or in which the at least one additional protective surface material (27) is arranged on the second side of the carrier (20). [14] Method for providing a workpiece support unit (100) according to claim 12 or 13, wherein the at least one additional protective surface material (25, 26, 27) comprises a protective layer, in particular a protective film. [15] A method for providing a workpiece support unit (100) according to any one of claims 11 to 14, wherein, after arranging the protective sheet material (30) on the first side (21) of the carrier (20), the protective sheet material (30) and the at least one additional protective sheet material (27) come into contact with each other around the carrier substrate (23). [16] A method for preparing a workpiece (10) for machining, the method comprising: Providing a workpiece (10) having a front side and a rear side; Providing a protective surface material (30) and an intermediate layer (40); Arranging the protective surface material (30) on the front side or the rear side of the workpiece (10); Arranging the intermediate layer (40) on the protective sheet material (30) such that the intermediate layer (40) and the protective sheet material (30) form an end face, wherein the end face is configured for attaching a first side (21) of a carrier (20) thereto and is further configured to provide a bonding force for the carrier (20) which is greater in an edge region of the first side (21) of the carrier (20) than in a central region of the first side (21) of the carrier (20). [17] A method for machining a workpiece (10), the method comprising: Providing a workpiece support unit (100) for supporting the workpiece (10) according to any one of the preceding claims; Arranging the workpiece (10) on the protective sheet material (30) on a side opposite a side facing the carrier (20) and the intermediate layer (40); and Machining the workpiece (10). [18] Workpiece support unit (100) for supporting a workpiece (10), comprising: a carrier (20) having a first side (21) and a second side (22) opposite the first side (21); a protective surface material (30); and an intermediate layer (40); wherein the protective surface material (30) and the intermediate layer (40) are arranged on the first side (21) of the carrier (20), wherein the intermediate layer (40) is at least partially inserted between the protective sheet material (30) and the carrier (20) such that a bonding force between the protective sheet material (30) and the carrier (20) is greater in an edge region of the first side (21) of the carrier (20) than in a central region of the first side (21) of the carrier (20). [19] A workpiece support unit (100) according to claim 18, wherein the carrier (20) further comprises at least one additional protective sheet material (25, 26, 27). [20] Workpiece support unit (100) according to claim 19, in which the at least one additional protective surface material (25, 26) is arranged on the first side of the carrier (20), and / or wherein the at least one additional protective surface material (27) is arranged on the second side of the carrier (20). [21] Workpiece support unit (100) according to claim 19 or 20, wherein the at least one additional protective surface material (25, 26, 27) comprises a protective layer, in particular a polyolefin film. [22] Workpiece support unit (100) according to one of claims 19 to 21, in which the protective surface material (30) and the at least one additional protective surface material (25, 26, 27) are in contact with each other, wherein the protective sheet material (30) and the at least one additional protective sheet material (25, 26, 27) are in contact with each other around the carrier substrate (23).

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