Projection exposure system with one element made of an elastic material

Abstract

The invention relates to a projection exposure system (1,101) for semiconductor lithography with an element (40,50,70,90,120,140), wherein the element (40,50,70,90,120,140) comprises an elastic material. The projection exposure system is characterized in that the element (40,50,70,90,120,140) has a core area (48,58,78,98,128,148) comprising the elastic material and a shell area (49,59,79,99,129,149) at least partially surrounding it, wherein the shell area (49,59,79,99,129,149) comprises at least one barrier layer (81,141,143) and wherein the core area (48,58,78,98,128,148) comprises an elastomer and / or a thermoplastic.

Description

[0001] The invention relates to a projection exposure system with an element comprising an elastic material.

[0002] Projection exposure systems for semiconductor lithography are used to create extremely fine structures, particularly on semiconductor devices or other microstructured components. The operating principle of these systems is based on creating extremely fine structures down to the nanometer range by means of a generally reduced-size image of structures on a mask, a so-called reticle, on an element to be structured, such as a wafer, which is coated with photosensitive material. The minimum dimensions of the created structures depend directly on the wavelength of the light used.

[0003] The light sources used have wavelengths from 100 nm to 400 nm in an emission wavelength range known as the DUV range. Recently, light sources with an emission wavelength in the range of a few nanometers, for example, between 1 nm and 120 nm, particularly in the range of 13.5 nm, have been increasingly used. This emission wavelength range is also referred to as the EUV range.

[0004] The projection exposure systems must meet stringent and sometimes seemingly mutually exclusive requirements. These requirements include, for example, requirements regarding dynamics, the temperature control of individual components, the sealing of selected areas of the projection exposure system from each other, the sealing of lines for temperature control fluids, and the transmission of power and signals.

[0005] To meet these requirements, elastic and / or damping materials, particularly elastomers and thermoplastics, hereinafter referred to collectively as elastomers, are commonly used in the prior art. These materials must exhibit little or no change in their physical properties under changing operating conditions and over the lifetime of the projection exposure system.

[0006] In particular, the elastomers must exhibit minimal outgassing and low permeability to undesirable substances (e.g., water, oxygen, or nitrogen) that could lead to contamination or degradation of optical elements. Furthermore, high resistance to UV radiation, reactive elements such as reactive oxygen species, and / or hydrogen plasma, which can be generated from a (residual) gas in conjunction with UV radiation, is required.

[0007] The elastomers currently used include, in particular, fluoroelastomers, often referred to by the abbreviations FKM and FFKM, which sufficiently meet the requirements of existing systems.

[0008] Due to the increasing demands of new generations of projection exposure systems, particularly in the field of EUV lithography, the elastomers used to date can no longer adequately meet the requirements for their mechanical properties and / or outgassing rates. This can have an immediate (mechanical properties) or over time (outgassing) negative impact on the image quality of the projection exposure system.

[0009] The object of the present invention is to provide a device which eliminates the described disadvantages of the prior art.

[0010] This object is achieved by a device having the features of independent claim 1. The subclaims relate to advantageous developments and variants of the invention.

[0011] A projection exposure system for semiconductor lithography according to the invention comprises an element, wherein the element comprises an elastic material. The element is characterized in that it has a core region comprising the elastic material and a cladding region at least partially surrounding said core region, wherein the cladding region comprises at least one barrier layer. The core region comprises an elastomer and / or a thermoplastic. These materials have very good elastic properties with rigidity that can be adjusted by the geometry and material composition, which are advantageous when the element is used as a sealing or connecting element. The cladding region can consist of materials with a higher specific rigidity if their thickness is selected such that the rigidity of the cladding is smaller than that of the core region, preferably smaller by a factor of 2, particularly preferably smaller by a factor of 10.

[0012] A barrier layer within the meaning of the invention is a layer that is impermeable to various influences. Such influences can, for example, arise from fluids (liquid, gaseous) and / or electromagnetic radiation, such as DUV radiation (wavelength from 100 nm to 300 nm) or EUV radiation (wavelength from 1 nm to 100 nm, in particular 13.5 nm).

[0013] The measure according to the invention makes it possible to meet requirements that cannot be met by a single material by distributing them across different regions of the element and thus also across different materials. The core region primarily addresses physical properties, such as the desired elasticity and rigidity, whereas the barrier layer in the cladding region primarily prevents the release of substances from the core region to the environment as much as possible. Conversely, the cladding region can also at least partially prevent external media from coming into contact with the core region and ensure that the core region is protected as much as possible from potentially harmful UV radiation.

[0014] The element itself can, for example, serve to reduce or prevent the gas exchange between two different areas of a projection exposure system and / or to ensure protection against electromagnetic radiation for another component of an assembly or the projection exposure system.

[0015] The connection between the core and cladding regions can be point-like or flat. The ratio of the thickness of the core to that of the cladding region can be very high, especially when metals are chosen for the cladding region, which have orders of magnitude higher stiffness than elastomers. For example, an elastomer several millimeters thick can be coated with a layer of gold or aluminum only 10 nm thick. The ratio depends primarily on the elasticity and stiffness of the materials used.

[0016] Furthermore, the barrier layer can comprise a material that reduces or completely prevents outgassing of a material in the core region into the environment. This has the advantage that the physical properties can be the primary consideration when selecting the material for the core region, with less or no attention being paid to the often comparatively high requirements for material outgassing behavior, particularly in the EUV range. For materials frequently used in elastomers and thermoplastics, such as ethylene propylene diene (monomer) rubber (EPDM) or acrylonitrile butadiene rubber (NBR), which outgas hydrocarbons, and silicones, which outgas volatile siloxanes, thin metallic layers such as aluminum, gold, or nickel, or other inorganic materials such as silicon oxide, aluminum oxide, or titanium oxide, are suitable for the barrier layer.Polymers that are too stiff as a core but can be used in a thin layer as a sheath, such as polyethylene terephthalate or polyimide, are also suitable.

[0017] In an advantageous embodiment of the invention, the barrier layer can have a transmittance of less than 1%, preferably less than 0.1%, in the UV radiation range, preferably for UV radiation in the range from 1 nm to 300 nm. It is advantageous if, in particular, the wavelengths commonly used in semiconductor lithography (13.5 nm, 193 nm, 248 nm, 365 nm) are blocked. This has the advantage that outgassing and degeneration of the core region caused by exposure to UV radiation can be reduced or completely prevented. For this purpose, the barrier layer can comprise, for example, aluminum or nickel or precious metals such as gold, silver, ruthenium, and platinum, as well as metal oxides such as tantalum oxide (Ta2O5) or titanium oxide (TiO2).

[0018] In a further embodiment, the barrier layer can comprise a material that is impermeable or slightly permeable to reactive elements. In the case of radical hydrogen, a permeability of less than 0.1% is advantageous. In the case of an environment with 10 ppm ozone (O3), the barrier layer should prevent degradation of the core for at least one year. Reactive elements can, for example, be in the form of oxygen species and / or hydrogen plasma and are characterized by high reactivity with other elements. The reactive elements can also arise, particularly in EUV lithography, in the region of the optical elements due to a reaction of residual gases with the EUV radiation used for imaging. The barrier layer can, for example, comprise aluminum, nickel, precious metals such as gold, silver, ruthenium and platinum, as well as metal oxides.

[0019] In a further embodiment of the invention, the barrier layer may comprise a material having a permeability to water vapor of less than 10 -3 gm -2 d -1 The value refers to a relative water vapor content of 85% on one side of the element and 0% on the other side of the same element. This value can be scaled linearly accordingly if the water vapor content on the outside is lower than in industrial environments, which are typically maintained between 40% and 60% relative humidity and 22°C. The barrier layer can comprise, for example, aluminum, precious metals such as gold, silver, ruthenium, and platinum, as well as metal oxides such as silicon oxide and aluminum oxide, or metal nitrides.

[0020] In a further embodiment, the barrier layer may comprise a material having a permeability to oxygen of less than one cm 3 m -2*d -1 *bear -1 has.

[0021] The value is expressed in one standard cubic centimeter (cm 3 ) of the penetrating oxygen, i.e., to a standard pressure of 1 bar and a standard temperature of 20°C. For a bar air pressure difference with an oxygen partial pressure of 0.2 bar at 20°C, the values ​​would have to be adjusted accordingly by a factor of 1 / 5.

[0022] The inventive structure with a shell region and a core region thus makes it possible to distribute the requirements of the connecting element between the two regions, so that, for example, the shell region has low permeability for a substance for which the core region has high permeability, or vice versa. This allows connecting elements to be formed with properties that cannot be achieved by using only one region.

[0023] Furthermore, the cladding region can comprise multiple layers, particularly those made of different materials as described above. This advantageously allows for a combination of properties of individual layers.

[0024] In a further embodiment, the cladding region can have at least one layer formed as a coating. In this context, a coating is understood to be a layer that is produced on a substrate (e.g., the core region). Thus, a coating can be produced directly on the core region, for example, using a PVD process, a CVD process, or sputtering. The coating itself can be formed as a single layer or as a multi-layer system.

[0025] In a further embodiment, the coating can be applied to a pre-stretched carrier element. The carrier element can be designed either as a layer of the shell region or as the core region itself. If the carrier is designed as a core region, it is brought from a state that is usually unstretched during operation into a pre-stretched state by applying tensile forces and is coated in this state. The layer is pushed together during the transition to the original untensioned state, whereby non-critical compressive stresses arise for the layer. The extensibility of the layer, designed as a coating, for example, can thus be increased by a factor of at least two without tensile stresses occurring in the layer when the connecting element is deflected from the unstretched state, which could cause damage to the layer by tearing it open.

[0026] Furthermore, the sheath region can be corrugated. This can create a certain degree of elasticity, for example, when using a relatively stiff film in the sheath region. The corrugated sheath region can be coated with a layer, as explained above. The carrier film can be pre-stretched, similar to the core region, and coated in the pre-stretched state.

[0027] Furthermore, the jacket region can have at least one layer formed as a film, which comprises, for example, polyimide, PET, or ethylene-vinyl alcohol copolymer (EVOH). This has the advantage that the film can be coated relatively easily and serves as a carrier element for the coating.

[0028] In a further embodiment, the sheath region can be bonded to the core region via an adhesion promoter. This can be used, for example, in a multilayer sheath region with a film. The adhesion promoter ensures a stable connection between the core region and the sheath region, so that even in the event of significant deformation of the element, such as in the case of a damper, the connection between the core region and sheath region can be prevented from coming loose.

[0029] Furthermore, the sheath region can have at least one predetermined mechanical weak point. Due to the often comparatively lower elasticity of the sheath region compared to the core region, it is to be expected that the sheath region will tear in several places and thus may locally lose its function. In the case of a sheath region designed to reduce permeability, this increases the permeability of the element as a whole. If the core region is surrounded by the sheath region on two sides, it can happen that the damaged areas in the two sheath regions coincidentally lie one above the other perpendicular to the extension of the element, so that an undesirable medium can pass through the element relatively easily due to the resulting short path.

[0030] The predetermined mechanical weak points can be offset, especially in two opposing shell areas, creating a kind of labyrinth seal. The medium, such as water or oxygen, must therefore migrate through the material at least partially in the expansion plane of the element, thereby increasing the path for the medium and reducing the permeability of the element.

[0031] This also allows the permeability of the element relevant for the application to be predicted more accurately.

[0032] In a further embodiment, the element can be arranged in an assembly, which in particular includes a protective device. Protection against UV radiation can be achieved, for example, by an additional protective device designed as a screen. This advantageously eliminates the requirement for UV resistance for the element.

[0033] In particular, the protective device can at least partially comprise a region for neutralizing and / or recombination and / or binding ions and / or radicals and / or materials evaporating from the element. This region can be formed, for example, as a coating, but also in the form of a film. This additional protection can at least reduce the requirements for the element, or, depending on the effectiveness of the coating, certain requirements can be eliminated entirely.

[0034] In a further embodiment, the assembly can be designed as an optical module.

[0035] Furthermore, the assembly can be designed as an end stop, with the element being designed as a damper within the end stop. This can prevent high voltage peaks in the event of a module colliding with the end stop, further minimizing the risk of module damage.

[0036] The assembly can also be designed as a damping element. The damping element can, for example, be designed as a tuned mass damper.

[0037] Furthermore, the assembly can be designed as a seal for a connection between two fluid-carrying components or as a sheath for lines for transmitting energy and / or signals.

[0038] In the following, embodiments and variants of the invention are explained in more detail with reference to the drawings. Fig. 1 schematically shows in meridional section a projection exposure system for EUV projection lithography, Fig. 2 schematically shows in meridional section a projection exposure system for DUV projection lithography, Fig. 3 a connecting element known from the prior art, Fig. 4 a schematic representation of the invention, Fig. 5a,b a first embodiment of the invention, Fig. 6a-c show a further embodiment of the invention, Fig. 7a,b a further embodiment of the invention, and Fig. 8 a detail of the invention.

[0039] In the following, with reference to the Fig. 1 describes, by way of example, the essential components of a projection exposure system 1 for microlithography. The description of the basic structure of the projection exposure system 1 and its components is not intended to be limiting.

[0040] One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system. In this case, the illumination system does not include the light source 3.

[0041] A reticle 7 arranged in the object field 5 is illuminated. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced, in particular in a scanning direction, via a reticle displacement drive 9.

[0042] In the Fig. 1 shows a Cartesian xyz coordinate system for explanation. The x-direction is perpendicular to the plane of the drawing. The y-direction is horizontal and the z-direction is vertical. The scanning direction is in the Fig. 1 along the y-direction. The z-direction runs perpendicular to the object plane 6.

[0043] The projection exposure system 1 comprises a projection optics 10. The projection optics 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0044] A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the image plane 12 in the region of the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced, in particular along the y-direction, via a wafer displacement drive 15. The displacement of the reticle 7, on the one hand, via the reticle displacement drive 9, and the displacement of the wafer 13, on the other hand, via the wafer displacement drive 15, can be synchronized with each other.

[0045] The radiation source 3 is an EUV radiation source. The radiation source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation has, in particular, a wavelength in the range between 5 nm and 30 nm. The radiation source 3 can be a plasma source, for example, an LPP source (laser produced plasma) or a DPP source (gas discharged produced plasma). It can also be a synchrotron-based radiation source. The radiation source 3 can be a free-electron laser (FEL).

[0046] The illumination radiation 16 emanating from the radiation source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 at grazing incidence (GI), i.e., at angles of incidence greater than 45° relative to the normal direction of the mirror surface, or at normal incidence (NI), i.e., at angles of incidence less than 45°. The collector 17 can be structured and / or coated, on the one hand, to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.

[0047] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector 17, and the illumination optics 4.

[0048] The illumination optics 4 comprises a deflecting mirror 19 and, downstream of this in the beam path, a first facet mirror 20. The deflecting mirror 19 can be a flat deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first facet mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugated to the object plane 6 as the field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which are also referred to below as field facets. Of these facets 21, Fig. 1 only some examples are shown.

[0049] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour. The first facets 21 can be designed as flat facets or, alternatively, as convexly or concavely curved facets.

[0050] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 themselves can also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can, in particular, be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0051] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction.

[0052] In the beam path of the illumination optics 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US Pat. No. 6,573,978.

[0053] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0054] The second facets 23 can also be macroscopic facets, which can, for example, be round, rectangular, or hexagonal, or alternatively facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0055] The second facets 23 can have planar or alternatively convex or concave curved reflection surfaces.

[0056] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (fly's eye integrator).

[0057] It may be advantageous to arrange the second facet mirror 22 not exactly in a plane that is optically conjugated to a pupil plane of the projection optics 10. In particular, the pupil facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0058] With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path before the object field 5.

[0059] In a further embodiment of the illumination optics 4 (not shown), a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which transmission optics contributes in particular to the imaging of the first facets 21 into the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optics can in particular comprise one or two mirrors for normal incidence (NI mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors).

[0060] The illumination optics 4 has in the version shown in the Fig. 1, after the collector 17 there are exactly three mirrors, namely the deflection mirror 19, the field facet mirror 20 and the pupil facet mirror 22.

[0061] In a further embodiment of the illumination optics 4, the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

[0062] The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics into the object plane 6 is usually only an approximate imaging.

[0063] The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0064] In the Fig. In the example shown in Figure 1, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or a different number of mirrors M1 are also possible. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 is a doubly obscured optic. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0065] Reflection surfaces of the mirrors Mi can be designed as freeform surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0066] The projection optics 10 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0067] The projection optics 10 can, in particular, be anamorphic. It has, in particular, different magnifications βx, βy in the x- and y-directions. The two magnifications βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive magnification β means imaging without image inversion. A negative sign for the magnification β means imaging with image inversion.

[0068] The projection optics 10 thus leads to a reduction in the ratio 4:1 in the x-direction, i.e. in the direction perpendicular to the scanning direction.

[0069] The projection optics 10 results in a reduction of 8:1 in the y-direction, i.e. in the scanning direction.

[0070] Other magnifications are also possible. Magnifications with the same sign and absolutely identical in the x and y directions, for example, with absolute values ​​of 0.125 or 0.25, are also possible.

[0071] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 5 and the image field 11 can be the same or can vary depending on the design of the projection optics 10. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0072] Each of the pupil facets 23 is assigned to exactly one of the field facets 21 to form a respective illumination channel for illuminating the object field 5. This can, in particular, result in illumination according to the Köhler principle. The far field is divided into a plurality of object fields 5 using the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 assigned to them.

[0073] The field facets 21 are each imaged onto the reticle 7 by an associated pupil facet 23, superimposed on one another, to illuminate the object field 5. The illumination of the object field 5 is, in particular, as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0074] By arranging the pupil facets, the illumination of the entrance pupil of the projection optics 10 can be geometrically defined. By selecting the illumination channels, in particular the subset of the pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting.

[0075] A likewise preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels.

[0076] Further aspects and details of the illumination of the object field 5 and in particular of the entrance pupil of the projection optics 10 are described below.

[0077] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0078] The entrance pupil of the projection optics 10 cannot usually be precisely illuminated with the pupil facet mirror 22. When the projection optics 10 images the center of the pupil facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the pairwise determined distance of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in spatial space. In particular, this surface exhibits a finite curvature.

[0079] It is possible that the projection optics 10 have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.

[0080] In the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the pupil facet mirror 22 is arranged in a surface conjugated to the entrance pupil of the projection optics 10. The field facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the deflection mirror 19.

[0081] The first facet mirror 20 is arranged tilted to an arrangement plane which is defined by the second facet mirror 22.

[0082] Fig. 2 shows schematically in meridional section a further projection exposure system 101 for DUV projection lithography, in which the invention can also be used.

[0083] The structure of the projection exposure system 101 and the principle of imaging is comparable to that in Fig. 1 described structure and procedure. Identical components are provided with a 100 Fig. 1 raised reference numerals, the reference numerals in Fig. So 2 start with 101.

[0084] In contrast to a Fig. 1, due to the longer wavelength of the DUV radiation 116 used as useful light in the range from 100 nm to 300 nm, in particular from 193 nm, refractive, diffractive and / or reflective optical elements 117, such as lenses, mirrors, prisms, plane plates and the like, can be used in the DUV projection exposure system 101 for imaging or for illumination. The projection exposure system 101 essentially comprises an illumination system 102, a reticle holder 108 for receiving and precisely positioning a reticle 107 provided with a structure, by means of which the later structures on a wafer 113 are determined, a wafer holder 114 for holding, moving and precisely positioning this wafer 113 and a projection lens 110 with a plurality of optical elements 117, which are held via mounts 118 in a lens housing 119 of the projection lens 110.

[0085] The housing 119 is designed to be gas-tight, with its interior being flushed with a gas under a slight overpressure.

[0086] The illumination system 102 provides DUV radiation 116 required for imaging the reticle 107 on the wafer 113. A laser, a plasma source, or the like can be used as the source for this radiation 116. The radiation 116 is shaped in the illumination system 102 via optical elements such that the DUV radiation 116, upon impinging on the reticle 107, exhibits the desired properties with regard to diameter, polarization, wavefront shape, and the like.

[0087] The structure of the subsequent projection optics 101 with the lens housing 119 does not differ in principle from that in Fig. 1 and is therefore not described further.

[0088] Fig. Figure 3 shows a prior art element embodied as a connecting element 30, which connects two components 31, 32, which in the illustrated embodiment are embodied as a module frame 31 and a module receptacle 32. The arrangement shown can serve in particular to accommodate an optical element (not shown), such as a lens or a mirror. Alternatively, the connecting element 30 can also be connected directly to the optical element.

[0089] The connecting element 30 is made of an elastic material, such as an elastomer or thermoplastic, hereinafter referred to as elastomer, and is connected to the module frame 31 and the module holder 32 via connections 33.1, 33.2.

[0090] The connections 33.1, 33.2 can be designed as adhesive connections, for example, an elastic adhesive such as a silane-modified polymer (SMP) or a polyurethane adhesive can be used. Alternatively, the connections 33.1, 33.2 can also be designed as clamps or any other suitable type of connection.

[0091] The connecting element 30 serves to seal the area above the connecting element 30 and the area below the connecting element 30 against each other.

[0092] The area above can be found in the Fig. 3 shown embodiment in particular the area within a Fig. 1 and the Fig. 2 of a projection optics system 10, 110 of a projection exposure system 1, 101. The interior of a projection optics system 10, 110 is subject to increased cleanliness requirements and, in DUV systems, is purged with high-purity gas, usually extremely dry, clean air. In EUV systems, a high vacuum is usually formed inside the projection optics system 10. The embodiment of a connecting element 30 shown in the figure can, for example, be used on a first or last optical module of a projection optics system 110 to achieve a gas-tight projection optics system 110. The area below the connecting element 30 in this case corresponds to the area outside such a projection optics system 110, in which significantly lower requirements apply than inside the projection optics system 110.In the case of a projection optics system 10 used in an EUV projection exposure system 1, for example, two vacuum regions between the mirrors Mx can be separated from each other by the connecting element 30, which can, for example, direct the flow of a hydrogen gas present in the vacuum for process-related reasons. In this case, a high vacuum prevails in both regions above and below.

[0093] The connecting element 30 thus seals the interior of the projection optics 10, 110 from its environment, thus preventing, for example, by a low permeability, the penetration of water vapor 37, which is present in the environment in a range of 10,000 ppm, into the DUV projection optics 110, which is flushed with dry air with a water vapor content of less than 100 ppm, preferably in a range of 1 to 10 ppm. The penetration of the water vapor 37 through the connecting element 30 is in the Fig. 3 is illustrated by a dashed arrow.

[0094] Furthermore, the connecting element 30 is designed to be robust against the UV radiation (DUV, EUV) used for imaging, which is Fig. 3 symbolized by the arrow 35. In addition, the connecting element 30 is also resistant to reactive elements 36, such as reactive oxygen species and / or atomic hydrogen, which can be generated by a reaction of the UV radiation 35 with at least one component of the dry air or a residual gas in the high vacuum in the projection optics 10, 110.

[0095] The elasticity and / or rigidity of the connecting element 30 influences the forces and moments transmitted to the module holder 32 through the connection to the module frame 31. These forces and moments can cause deformation of an optical element, for example, a lens (not shown), which can negatively impact the imaging quality of the projection exposure system.

[0096] The connecting element 30 itself may not exceed a predetermined outgassing rate of outgassing, which is Fig. 3 symbolized by arrows 34 emanating from the surface of the connecting element 30. This requirement must be met in combination with the properties described above.

[0097] The increased demands on the connecting element resulting from the advent of new generations of projection exposure systems can increasingly no longer be adequately met by connecting elements of the type shown in the connecting element 30.

[0098] Fig. 4 shows a schematic representation of an element according to the invention designed as a connecting element 40, which, as in the Fig. 3, a first component designed as a module frame 41 and a second component designed as a module holder 42, whereby where appropriate identical corresponding elements are used with respect to the Fig. 3 are designated by reference numerals increased by 10. The connecting element 40 is connected to the components 41, 42 via the connections 43.1, 43.2.

[0099] In contrast to the Fig. 3, which only has one material, the connecting element 40 according to the invention has a further material.

[0100] The connecting element 40 has a core region 48 with a first material and a jacket region 49 with the second material, wherein the jacket region 49 surrounds the core region 48 at least at the Fig. 4 partially surrounds the upward and downward facing sides.

[0101] The core region 48 further comprises an elastomer or a thermoplastic, hereinafter referred to collectively as elastomer, which in particular fulfils the mechanical properties necessary to meet the requirements, such as stiffness and elasticity.

[0102] The cladding region 49 comprises a material which, in particular, fulfills the properties necessary to meet the further requirements, such as protection of the environment from outgassing of the first material of the core region 48 and protection of the first material from UV radiation 45 and / or reactive elements 46, such as oxygen species and / or hydrogen plasma.

[0103] The permeability of the cladding region 49 is designed such that, on the one hand, outgassing from the core region 48 into the environment can be reduced or even completely prevented. In particular, outgassing from the core region 48 into the region above the connecting element 40, i.e., into the interior of the projection optics 10, 110 ( Fig. 1, Fig. 2) can be advantageously prevented by a suitably selected material for the cladding region 49. On the other hand, the cladding region 49, in conjunction with the core region 48, reduces or prevents the penetration of substances from outside the projection optics 10, 110 into the interior thereof. The cladding region 49 and the core region 48 can thus complement each other, so that, for example, the cladding region 49 has a low permeability for a substance for which the core region 48 has a high permeability, which would not meet the predetermined requirements, or vice versa.

[0104] The properties of the two materials of the core region 48 and the sheath region 49 complement each other and can therefore advantageously meet the predetermined requirements for the connecting element 40 through a suitable selection and arrangement. The outgassing 44 caused by the elastomer of the core region 48 is reduced compared to the Fig. 3 shown outgassing 34 is released to the environment only in a reduced manner through the jacket area 49, which is Fig. 4 by compared to Fig. 3 shorter arrows are shown.

[0105] The jacket area 49 is in the Fig. 4, the core region 48 is formed above and below the core region 48, but depending on the requirements and installation direction of the connecting element 40, it can also be formed only on one side of the core region 48, for example, toward the interior of the projection optics 10, 110. This is the case, for example, if the core region 48 only needs to be protected from the UV radiation 45, but otherwise meets all other requirements.

[0106] Fig. Figure 5a shows an embodiment of a connecting element formed as a lens seal 50 in an optical module 60. Such a module can be used, for example, in one of the Fig. 1 or the Fig. 2. The connecting element 50 is arranged in the example shown between a first component designed as a lens 51 and a second component designed as an intermediate ring 52 and connects the components 51, 52 to one another in a gas-tight manner.

[0107] The intermediate ring 52 is connected to a module holder 61 via a connection formed as an adhesive connection 64, although a screw connection is also conceivable. In addition, the intermediate ring 52 is secured to the module holder 61, i.e., to the surroundings of the projection optics 10, 110 ( Fig. 1, Fig. 2) sealed.

[0108] The connecting element 50, which is in the Fig. 5a, is designed as an elastomer membrane, is connected to the lens 51 and the intermediate ring 52 via a vulcanized connection 53.1, 53.2. Alternatively, the connection 53.1, 53.2 can also be formed by clamping or gluing.

[0109] In a further embodiment, the intermediate ring 52 can also be omitted and the connection 53.1, 53.2 of the connecting element 50 can be realized directly between the lens 51 and the module holder 61.

[0110] The connecting element 50 thus ensures gas tightness with respect to the penetration of substances, such as oxygen or water vapor, from outside a projection optics into the projection optics 10, 110, which also reduces or even prevents the penetration of substances through permeation. Furthermore, the low rigidity of the connecting element 50 minimizes the forces and moments acting on the lens 51 via the connection 53.1.

[0111] The Fig. The embodiment shown in Figure 5a has, in addition to the core region 58, a wave-shaped cladding region 59. The cladding region 59 is connected to the core region 58 at its edges via an elastic adhesive bond 66. Elastic adhesives with low outgassing, such as silane-modified polymers (SMPs) or polyurethane adhesives, are conceivable as the adhesive. Alternatively, the cladding region 59 can overlap the joints 53.1, 53.2 and be connected to the lens 51 on one side and to the intermediate ring 52 on the other side.

[0112] The cladding region 59 reduces or prevents, as in the example shown, the penetration of outgassing from the core region 58 into the interior of the projection optics 10, as already explained above. The core region 58 is additionally protected from UV radiation 55, so that the material of the core region 58 can be selected independently of any potential undesired outgassing and its resistance to UV radiation 55. To improve the resistance of the cladding region 59 to UV radiation, a first carrier element 59.1 can be coated with a coating 59.2, which can in particular be designed as a metal coating. A preferably used material is aluminum, which has good resistance to UV radiation 55 and the plasmas generated by the UV radiation 55.

[0113] The wave-shaped design of the cladding region 59 has the advantage, on the one hand, of reducing the rigidity of the cladding region 59 and thus the forces and moments transmitted to the lens 51. This enables the use of films comprising stiffer plastics, such as polyimide, PET, or ethylene-vinyl alcohol copolymer (EVOH), as the carrier element 59.1. This has the advantage that the materials used for the films can be coated relatively easily.

[0114] On the other hand, the wave shape can contribute to the application of coating 59.2 in a prestressed state. In this case, the jacket region, which is wave-shaped during operation, is coated in a flat state, whereby the layer is pushed together during the transition to the wave shape, creating non-critical compressive stresses for the layer. The extensibility of coating 59.2 can thus be increased by at least a factor of two, without tensile stresses occurring in the layer when the jacket region deflects from its wave shape to a flat state, which could cause damage to the layer by tearing it open.

[0115] In the case of an outgassing core region 58 and / or a lack of resistance to UV radiation 55 and / or the presence of reactive elements 46, the coating 59.2 is advantageously arranged on the side of the core region 58 facing the interior of the projection optics 10, 110. If the permeability of the core region 58 to a substance undesirable inside the projection optics 10, 110 is too high, the coating 59.2 can also be applied only to the outside. Alternatively, the cladding region 59 can also be arranged on both sides of the core region 58.

[0116] As an alternative to a wave-shaped jacket region 59, it can also be flat. In this case, a flat bonding of the core region 58 to the jacket region 59 is also conceivable.

[0117] Fig. 5b shows a further embodiment of the connecting element 50 designed as a lens seal. The structure of the optical module 60 is largely identical to that shown in the Fig. 5a, where appropriate identical corresponding elements are indicated by the reference numerals of the Fig. 5a.

[0118] The connecting element 50 has a cladding region 59 applied directly to the core region 58 and formed as a coating, which reduces or even completely prevents outgassing of the material of the core region 58 into the interior of the projection optics 10, 110. Furthermore, the permeation of oxygen and water vapor 57 into the interior of the projection optics 10, 110 is also prevented.

[0119] In the embodiment shown, protection from UV radiation 55 is ensured by a protective device designed as a shield 67. This is connected to the module frame 61 via holders 68 and has a lateral shield 69 in the area of ​​the lens 51, with a gap 65 of a few mm, preferably a few tenths of a mm, remaining between this and the lens 51, so that penetration of the UV radiation 55 into the area of ​​the connecting element 50 is prevented. The construction of the connecting element 50 from at least two materials, wherein the properties of the materials advantageously complement one another, enables advantageous flexibility for meeting the most diverse requirements by assigning the requirements to the core region 58 and the cladding region 59 and by using additional shields 67, 69.

[0120] Fig. Figure 6a shows a first embodiment of a component according to the invention designed as a damper 70 of a one-dimensional end stop 74. The damper 70 is connected to a first component designed as a module holder 71 via a connection designed as an adhesive connection 73.

[0121] In addition to the damper 70, the end stop 74 has a corresponding stop surface 75 arranged on a second component designed as a mirror 72.

[0122] The end stop 74 is designed in such a way that in the event of a possible collision of the mirror 72 with the module holder 71 by a relative movement which is in the Fig. 6a is represented by a double arrow, damage to the components 71, 72, in particular to the mirror 72, is avoided. The collision can be caused, for example, by a sudden acceleration or deceleration of the projection optics 10, 110 during transport, whereby the mirror remains stationary due to its inertia compared to the projection optics 10, 110 and a relative movement occurs, which can cause the collision. During the collision, the damper 70, which comprises a core region 78 with an elastomer, is deformed at the stop surface 75, thus absorbing the kinetic energy and dissipating it into heat, thereby causing damping. A jacket region 79 of the damper 70 assumes the function, as already explained above, of minimizing or even completely preventing outgassing of the elastomer into the area of ​​the mirror 72.In addition to the simple coating shown in the example in the figure, the structure of the jacket region 79 can also be designed as a multi-layer system or a combination of a film with a coating, or a combination of the multi-layer system with a film with a coating. The coating can also be designed as a multi-layer system.

[0123] Fig. Figure 6b shows a further embodiment of a first component designed as a damper 70 of a three-dimensional end stop 74. The function of the end stop 74 is similar to that of the end stop 74 in the Fig. 6a, which is why new reference symbols have been omitted. The end stop 74 has, in contrast to the Fig. 6a, the embodiment shown has three stop surfaces 75.1, 75.2, 75.3 for the three spatial directions. The damper 70 is designed as a ball, which is connected to an arm 77 of the module frame 71 via a connection 73 designed as an adhesive connection. The possible relative movements of the module frame 71 to the mirror 72 are again shown as double arrows in the Fig. 6b, whereby a relative movement perpendicular to the plane of the drawing is also possible.

[0124] Fig. 6c shows a further embodiment of a first component designed as a damper 70 of a one-dimensional end stop 74, wherein, where appropriate, identical corresponding elements are designated by the same reference numerals.

[0125] The embodiment has a cladding region 79 with a thin film 82 designed as a carrier element, having a thickness of less than 100 micrometers. The film 82 has a coating 81 with a material with low gas permeability, in particular a metal, on the inner side facing the core region 78. A suitable metal is, for example, aluminum, since it can be easily applied in thin layers, in particular in a range of less than one micrometer, to plastics used for films, such as polyimide, PET, or ethylene-vinyl alcohol copolymer (EVOH), and does not react with the reactive elements that occur, in particular, in EUV projection exposure systems 1. Alternatively, precious metals can also be used as coating 81.

[0126] The film 82 is connected to the core region 78 via an adhesive 80, but can alternatively also be vulcanized directly onto the core region 78 with the aid of an adhesion promoter or connected to it via a clamp.

[0127] Fig. Figure 7a shows an embodiment of an element designed as a damping membrane 90 of a tuned mass damper, which is arranged between a first component designed as a module holder 91 and a second component designed as a ring 92. The damping membrane 90 is connected to the two components 91, 92 via connections 93.1, 93.2, with the damping membrane 90 being connected to the module holder 91 via an arm 97 of the module holder 91.

[0128] The tuned mass damper 94 serves to dampen vibrations of the module frame 91. The mass of the ring 92 is designed such that the natural frequency of the mass damper 94 at least nearly matches a natural frequency of the module frame 91, thereby damping the natural frequency. The damping is achieved by a relative movement of the ring 92 to the module frame 91 and the resulting deformation of the damping membrane 90. The deformation leads to heating of the damping membrane 90, thereby dissipating the kinetic energy of the ring 92. The illustrated embodiment can dampen movements in at least one spatial direction in the plane spanned by the damping membrane 90.

[0129] According to the invention, the damping membrane 90 has a core region 98 with a first material comprising an elastomer and a jacket region 99 with a second material. The jacket region 99 is in the example of Fig. 7a is formed on both sides of the core region 98 and protects the elastomer of the core region 98 from UV or EUV radiation and reactive elements, as already explained above. The cladding region 99 is designed such that the stiffness of the damping membrane 90, which is very well defined for damping over a frequency range, is not influenced by it or only within an acceptable range. The cladding region 99 also protects the area around the mass damper 94, which is arranged in the area of ​​the optical elements, from outgassing from the elastomer.

[0130] Fig. Figure 7b shows a further embodiment of an element designed as a damping membrane 120, which connects a first component designed as a module frame 121 to a second component designed as a ring 122. The damping membrane 120 is in turn connected to an arm 127 of the module frame 121 via a connection 123.1. The ring 122 is connected to the damping membrane 120 via a second connection 123.2 by vulcanization.

[0131] The damping membrane 120 is wave-shaped. As explained above, this has the effect that the jacket region 129, formed as a metal layer, in particular an aluminum or gold layer, is less easily damaged by deformation of the damping membrane 120. The metal layer 129 is preferably formed with a thickness of less than one micrometer.

[0132] The optional additional protection against EUV radiation or UV radiation and / or reactive elements is realized by a protective device designed as apertures 125.1, 125.2, 125.3, 125.4, wherein the apertures are arranged on the ring 122 and on the arm 127. The apertures 125.1, 125.2, 125.3, 125.4 are arranged relative to one another in such a way that a minimal gap 130 is formed between the apertures 125.1, 125.2, 125.3, 125.4 without them touching each other.

[0133] Optionally, the apertures 125.1, 125.2, 125.3, 125.4 can be coated with a coating 126 comprising a material that can well neutralize or recombine ions or radicals, for example a metal, in particular a semi-precious metal or noble metal, such as copper, silver, palladium, platinum, gold, ruthenium, rhodium.

[0134] Alternatively or additionally, the coating 126 may comprise a material that binds harmful gases that evaporate from the elastomer or arise from reactions with reactive elements. This may, for example, be a material such as nickel or a precious metal such as platinum, rhodium, or ruthenium.

[0135] Fig. Figure 8 shows a schematic representation of the structure of an element 140, wherein the element 140 can represent a lens seal, a damper of an end stop, or a vibration membrane. The structure has a core region 148 and a cladding region 149, wherein the cladding region 149 in the example shown comprises a coating 141, a polymer 142, and a further coating 143. The illustration serves to explain the mode of operation of a cladding region 149 formed in this way, particularly in the case where one or both coatings 141, 143 have small defects 144, such as holes or cracks, due to the manufacturing process or a deformation of the element 140.

[0136] Despite these defects 144, a substance must migrate through the element 140 from the side facing the core region 148 to the side facing the jacket region 149 within the polymer 142, at least in some areas, parallel to the extension of the polymer 142. This effect acts similarly to a labyrinth seal and reduces the permeability of the element 140, as shown in the Fig. 8 by the arrow 145, is also advantageous in the event of damage to the low permeability coatings.

[0137] The coatings 141, 143 can have predetermined weak points during manufacture, which often cause unavoidable damage to the coatings 141, 143 at predetermined locations. This allows the above-described effect to be specifically controlled and a better predictability of the permeability of the element 140 to be achieved.

[0138] Furthermore, the polymer 142 can be designed to have low permeability to a substance, thereby further enhancing the effect. The coatings 141, 143 protect the environment from possible outgassing of the polymer 142 and the polymer 142 from UV radiation and plasmas. List of reference symbols 1 projection exposure system 2 Lighting system 3 Radiation source 4 Lighting optics 5 Object field 6 Object level 7 reticles 8 reticle holders 9 Reticle displacement drive 10 Projection optics 11 Image field 12 Image plane 13 wafers 14 wafer holders 15 Wafer relocation drive 16 EUV radiation 17 Collector 18 Intermediate focal plane 19 Deflecting mirrors 20 facet mirrors 21 facets 22 facet mirrors 23 facets 30 connecting element 31 first component 32 second component 33.1,33.2 Connection 34 Outgassing 35 UV radiation 36 Reactive Elements 37 Water vapor 40 connecting element 41 first component 42 second component 43.1,43.2 Connection 44 Outgassing 45 UV radiation 46 Reactive Elements 47 Water vapor 48 Core area 49 Sheath area 50 lens seal 51 optical element 52 intermediate ring 53.1,53.2 Connection 55 UV radiation 57 Water vapor 58 Core area 59,59.1,59.2 Sheath area 60 optical module 61 module holder 62 recess 63.1,63.2 Connection 64 Adhesive bond 65 gap 66 Adhesive bond 67 Shielding 68 Bracket shielding 69 Side shielding 70 End stop 71 module frames 72 mirrors 73 Connection 74 End stop 75 contact surfaces end stop x-, y-, z- direction 76 recess 77 Arm end stop 78 Core area 79 Sheath area 80 foil 81 Coating 82 Adhesive 90 connecting element 91 first component 92 second component 93.1,93.2 connection 94 mass damper 97 Arm mass damper 98 Core area 99 Sheath area 101 Projection exposure system 102 Lighting system 107 reticles 108 reticle holders 110 Projection optics 113 wafers 114 wafer holders 116 DUV radiation 117 optical element 118 versions 119 lens housings 120 elements 121 first component 122 second component 123.1,123.2 connection 124 mass dampers 125 f-stops 126 Coating 127 Arm mass damper 128 core area 129 Sheath area 130 gap 140 elements 141 Coating 142 Polymer 143 Coating 144 Defects in coating 145 Path of the substance during permeation 146 layer stacks 148 Core area 149 Sheath area M1-M6 mirrors QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2008 009 600 A1 [0050, 0054] US 2006 / 0132747 A1

[0052] EP 1 614 008 B1

[0052] US 6,573,978

[0052] DE 10 2017 220 586 A1

[0057] US 2018 / 0074303 A1

[0071]

Claims

[1] Projection exposure apparatus (1,101) for semiconductor lithography with an element (40,50,70,90,120,140), wherein the element (40,50,70,90,120,140) comprises an elastic material, wherein the element (40,50,70,90,120,140) has a core region (48,58,78,98,128,148) comprising the elastic material and a cladding region (49,59,79,99,129,149) at least partially surrounding said core region, and wherein the cladding region (49,59,79,99,129,149) comprises at least one barrier layer (81,141,143), characterized by that the core region (48,58,78,98,128,148) comprises an elastomer and / or a thermoplastic. [2] Projection exposure system (1,101) according to claim 1, characterized by that the barrier layer (81,141,143) comprises a material which reduces or completely prevents outgassing of a material of the core region (48,58,78,98,128,148) into the environment. [3] Projection exposure system (1,101) according to one of the preceding claims 1 or 2, characterized by , that the barrier layer (81,141,143) has a transmittance of less than 1%, preferably less than 0.1%, for UV radiation (45,55), preferably for UV radiation (16,45,55,116) in the range from 1 nm to 300 nm has. [4] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the barrier layer (81,141,143) comprises a material which is impermeable or slightly permeable to reactive elements. [5] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the barrier layer (81,141,143) comprises a material which has a permeability to water vapor of less than 10 -3 gm -2 d -1 has. [6] Projection exposure system (1,101) according to one of the preceding claims, characterized bythat the barrier layer (81,141,143) comprises a material which has a permeability to oxygen of less than one cm 3 m -2 d -1 bear -1 has. [7] Projection exposure apparatus according to (1,101) one of the preceding claims, characterized by that the shell region (49,59,79,99,129,149) has several layers (59.1,59.2,81,82,141,142,143). [8] Projection exposure system (1,101) according to claim 7, characterized by that the plurality of layers (59.1,59.2,81,82,141,142,143) comprise different materials according to one of claims 3 to 7. [9] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the jacket region (49,59,79,99,129,149) has at least one layer designed as a coating. [10] Projection exposure system (1,101) according to claim 9, characterized bythat the coating (59.2) is applied to a pre-stretched carrier element (59.1). [11] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the casing region (59) is wave-shaped. [12] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the jacket region (49,59,79,99,129,149) has at least one layer designed as a foil (59.1,82142). [13] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the jacket region (49,59,79,99,129,149) is connected to the core region (48,58,78,98,128,148) via an adhesion promoter (80). [14] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the casing region (149) has at least one predetermined mechanical weak point. [15] Projection exposure system (1,101) according to one of the preceding claims, characterized by that the element (50,120) is arranged in an assembly (60,74,124). [16] Projection exposure apparatus according to claim 15, characterized by that the assembly (60,124) comprises a protective device (67,125.1,125.2,125.3,125.4). [17] Projection exposure system (1,101) according to claim 16, characterized by that the protective device (125.1,125.2,125.3,125.4) at least partially has a region (126) for neutralizing and / or recombination and / or binding of ions and / or radicals and / or materials outgassing from the element (40,50,70,90,120). [18] Projection exposure apparatus (1,101) according to one of claims 15 to 17, characterized by that the assembly is designed as an optical module (60). [19] Projection exposure apparatus (1,101) according to one of claims 15 to 17, characterized bythat the assembly is designed as an end stop (74). [20] Projection exposure system (1,101) according to one of claims 15 to 17, characterized by that the assembly is designed as a damping element (124). [21] Projection exposure system (1,101) according to one of claims 15 to 17, characterized by that the assembly is designed as a seal for a connection between two fluid-carrying components and / or as a sheath for lines for transmitting energy and / or signals.

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