Cooling device for cooling a position-sensitive component of a lithography system, lithography system and method for producing a cooling device

Abstract

Cooling device (100) for cooling a position-sensitive component (102) of a lithography system (1), comprising a liquid line (104) for transporting a cooling liquid (106) to the position-sensitive component (102), wherein the liquid line (104) has at least one multi-pipe section (118) in which a pipe (120) of the liquid line (104), viewed in cross section, is segmented by one or more partition walls (122) into a plurality of individual pipes (124), and the multi-pipe section (118) has an elastic material (126) for damping pressure fluctuations of the cooling liquid (106).

Description

The present invention relates to a cooling device for cooling a position-sensitive component of a lithography apparatus, to a corresponding lithography apparatus and to a method for producing a cooling device of a lithography apparatus.Microlithography is used for producing microstructured components, such as integrated circuits. The microlithography process is carried out with a lithography apparatus which has an illumination system and a projection system. The image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate, for example a silicon wafer, coated with a photosensitive layer (photoresist) and arranged in the image plane of the projection system, in order to transfer the mask structure to the photosensitive coating of the substrate.Driven by the desire for increasingly smaller structures in the production of integrated circuits, EUV lithography apparatuses are currently being developed which use light with a wavelength in the range from 0.1 nm to 30 nm, in particular 13.5 nm. Since most materials absorb light of this wavelength, reflective optics, i.e. mirrors, must be used in such EUV lithography apparatuses instead of refractive optics, i.e. lenses, as before.The requirements for the accuracy and precision of the imaging properties of lithography apparatuses are constantly increasing. From a dynamic point of view, it is important to minimize the influence of disturbance entries on the movement of various position-sensitive components of the lithography apparatus. For example, a very precise positioning of optical components, in particular mirrors, of the lithography apparatus is required. Dynamic interference excitations of optical components can be generated, for example, by the movement of other components of the lithography apparatus or by acoustic interference. Acoustic disturbances can be transmitted as pressure fluctuation of a cooling liquid in cooling lines of a cooling device of the lithography apparatus to cooled, position-sensitive components of the lithography apparatus. Pressure fluctuations of the cooling liquid are generated, for example, by flow-induced vibrations (FIV).With a further increase in the complexity of lithography apparatuses, further dynamic interference excitations inside and outside the system are to be expected, and so additional mechanisms for their suppression or compensation are desirable and required.Against this background, it is an object of the present invention to provide an improved cooling device for cooling a position-sensitive component of a lithography apparatus and an improved method for producing a cooling device.According to a first aspect, a cooling device for cooling a position-sensitive component of a lithography apparatus is proposed. The cooling device has a liquid line for transporting a cooling liquid to the position-sensitive component. The liquid line has at least one multitube section in which a tube of the liquid line, viewed in cross section, is segmented into a plurality of individual tubes by one or more separating walls. In addition, the multi-tube section has an elastic material for damping pressure fluctuations of the cooling liquid.The multi-tube section acts as a flow rectifier. In particular, by means of the multi-tube section, a turbulent flow can be converted into a laminar flow and a strongly laminar flow can be produced locally. Turbulent flow may be caused, for example, by a source of flow induced vibration (FIV source). By arranging the multi-pipe section, for example, after an FIV source, e.g. directly after an FIV source, turbulences caused by the FIV source can be smoothed.Moreover, the elastic material of the multitube section can additionally dampen pressure fluctuations of the cooling liquid. Pressure fluctuations of the cooling liquid can be caused, for example, by vibrations of a supporting structure of the liquid line. Furthermore, turbulence caused by FIV sources can produce pressure fluctuations of the cooling liquid. Pressure fluctuations of the cooling liquid (i.e., liquid sound) cause the elastic material to elastically deform (e.g., compress and / or expand), thereby attenuating the pressure fluctuations.For example, pressure fluctuations of the cooling liquid can be attenuated with the aid of the elastic material in such a way that transmission of acoustic disturbances in the event of resonance elevations (e.g. standing waves or structural resonances) is greatly attenuated. For example, a high, narrowband peak in the frequency spectrum of the pressure fluctuations can be attenuated by the elastic material into a lower, broadband plateau.The elastic material is in particular (reversibly) deformable. The elastic material comprises, for example, a polymer, e.g. a highly damped polymer, polytetrafluoroethylene (PTFE), polyurethane (PUR), fluororubber (FKM) and / or perfluoro rubber (FFKM).The multitube section has in particular a plurality of individual tubes arranged parallel to one another. The plurality of individual tubes may all have the same cross-sectional shape and / or cross-sectional size. However, the plurality of individual tubes can also have mutually different cross-sectional shapes and / or cross-sectional sizes. A cross-sectional shape of one, more or all of the single tubes has, for example, a round, circular, oval, triangular, quadrangular, pentagonal, hexagonal, octagonal and / or polygonal shape.The multitube section is, for example, an insert which-viewed in the cross section of the tube-is inserted into the tube of the liquid line. However, the multi-pipe section can also be a pipe section which replaces a pipe section of the liquid line with respect to a flow direction of the cooling liquid and / or with respect to a longitudinal direction of the liquid line.The liquid line is configured, for example, for transporting the cooling liquid to the position-sensitive component and away from the position-sensitive component.The position-sensitive component of the lithography apparatus can be an optical or a mechanical component of the lithography apparatus, e.g. of a projection optical unit of the lithography apparatus. The position-sensitive component is in particular a component which has to be held at an exact position with only small tolerances during operation of the lithography apparatus.The position-sensitive component of the lithography apparatus is, for example, a mirror of the lithography apparatus, e.g. a mirror of the projection optics of the lithography apparatus. The mirrors of a projection optical unit of an EUV lithography apparatus are usually movably fastened to a supporting frame by means of actuators in order to be able to exactly adapt a position of the respective mirror.The position-sensitive component of the lithography apparatus can also be a frame structure which serves as a (e.g. optical) reference. The position-sensitive component can be, for example, a sensor frame of the lithography apparatus, e.g. of the projection optics of the lithography apparatus. A sensor frame usually has a sensor device for measuring a current position of one or more optical components of the lithography apparatus relative to the sensor frame. The sensor frame is mounted in a vibration-decoupled manner, for example, with respect to a supporting frame of the optical component(s). The sensor device comprises e.g. one or more sensors, such as interferometers and / or other measuring devices for detecting a position of the optical component(s). The optical component(s) can / can have, for example, reflector elements for reflecting a light (e.g. laser light) emitted by the sensors. For example, the one or more sensors serve to detect a position of the optical component(s) in six degrees of freedom. The six degrees of freedom comprise in particular three degrees of freedom of translation (e.g. in three spatial directions perpendicular to one another) and three degrees of freedom of rotation (e.g. with respect to a rotation about the three spatial directions perpendicular to one another).The proposed cooling device with the multitube section with the elastic material can reduce the generation of pressure fluctuations of the cooling liquid (individual tubes, flow rectifiers) and damp the generated pressure fluctuations (elastic material). Thus, a transmission of pressure fluctuations to the position-sensitive component via the cooling liquid can be reduced or avoided. Consequently, a greater precession of the position and thus of the optical properties or of the reference properties of the position-sensitive component can be achieved. Consequently, an imaging characteristic of the lithography apparatus can be improved. In addition, interference excitations can be better compensated for even in the case of lithography apparatuses which become increasingly complex with an increasing number of interference sources.The lithography apparatus is, for example, an EUV lithography apparatus or a DUV lithography apparatus. In this case, EUV stands for "extreme ultraviolet" (EUV) and denotes a wavelength of the working light in the range from 0.1 nm to 30 nm, in particular 13.5 nm. Furthermore, DUV stands for deep ultraviolet (DUV) and denotes a wavelength of the working light between 30 nm and 250 nm.The EUV or DUV lithography apparatus comprises an illumination system and a projection system. In particular, the image of a mask (reticle), illuminated by means of the illumination system, is projected by means of the projection system by means of the EUV or DUV lithography apparatus onto a substrate, for example a silicon wafer, coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, in order to transfer the mask structure to the light-sensitive coating of the substrate.The liquid line (e.g. cooling line) is, for example, a pipe line for passing the cooling liquid. The liquid line has, for example, a metal tube and / or a stainless steel tube. The liquid line can have, for example, a circular cross section or else a differently shaped cross section. The cooling liquid is or comprises water, for example. The liquid line serves, for example, for transporting the cooling liquid to and / or from the position-sensitive component. The liquid line serves, for example, for transporting the cooling liquid from a cooling unit of the cooling device to the position-sensitive component and / or from the position-sensitive component (back) to the cooling unit. The cooling device can also have more than one liquid line.The cooling device serves in particular to avoid high temperatures and temperature fluctuations of the position-sensitive component.In particular, mirrors of an EUV lithography apparatus (as an example of position-sensitive components) heat up as a result of absorption of the high-energy EUV radiation. High temperatures and temperature fluctuations in the mirror caused as a result and associated thermal deformations of the mirror can lead to wavefront aberrations and thus impair the imaging properties of the mirrors. In order to avoid thermally induced deformations, mirrors of the lithography apparatus can be actively cooled by the cooling device.The cooling device may also (additionally or instead) serve for cooling, for example, a sensor frame (as an example of a position-sensitive component). This makes it possible to prevent the sensor frame from being heated by thermal radiation. Thermal radiation is caused in particular by working light of the lithography apparatus absorbed by mirror surfaces or structural elements. Further heat sources can be actuators and heating heads, for example. By means of the cooling device, a stable temperature environment for the sensor frame can be created. As a result, position measurement of the mirror or the plurality of mirrors can be performed with higher accuracy by means of the sensor device held by the sensor frame.The cooling device further comprises, for example, a cooling unit for cooling the cooling liquid, one or more pumps for generating a required coolant flow rate of the cooling liquid, and one or more valves for controlling the cooling flow.For cooling, a specific coolant flow rate is required, which is realized via a pump system. This results in dynamic disturbance excitation, because each pump generates turbulences and thus local pressure fluctuations. These are transmitted through the entire cooling circuit via a coolant sound (e.g. water sound, longitudinal water sound wave). Furthermore, each change in cross section and each deflection of the liquid line and each built-in valve of the cooling circuit can represent a source of disturbance which causes turbulences and thus local pressure fluctuations of the liquid. This type of dynamic disturbance excitation is also referred to as flow-induced vibrations (FIV) or flow-induced vibrations. The disturbance excitation is transmitted to the cooled position-sensitive component by means of water sound. This causes the position of the position-sensitive component to deviate from a desired position. In particular, a pressure surge of the cooling liquid acts on surfaces of the cooled position-sensitive component. The pressure shock is converted into a force at the surfaces on which it acts. Due to this force, the position of the position-sensitive component deviates from the desired position.According to an embodiment of the first aspect, the one or more partition walls of the multi-tube section comprise the elastic material, an outer wall of the multi-tube section comprises the elastic material and / or the multi-tube section is made of the elastic material.For example, the partition walls of the multi-pipe section, the outer wall of the multi-pipe section and / or the entire multi-pipe section are made of and / or consist of the elastic material.According to a further embodiment of the first aspect, at least a first of the plurality of individual tubes is configured to supply cooling liquid to the position-sensitive component, at least a second of the plurality of individual tubes is configured to discharge cooling liquid from the position-sensitive component, and the one or more separating walls, which separate the at least a first and the at least a second individual tube from one another, comprise the elastic material.Consequently, a combined forward and return line is provided, in which the forward line / s (supply line / s) and return line / s (discharge line / s) are coupled to one another via the elastic material. By combined guiding of the feed line and discharge line for the cooling liquid in the multi-tube section with the elastic material, pressure fluctuations between the feed line and discharge line can at least partially compensate each other.For example, the multitube section with the combined supply and return lines can be arranged directly in front of the position-sensitive component. As a result, it is possible to significantly reduce a pressure gradient across the position-sensitive component (i.e. a location-dependent pressure which changes across the position-sensitive component).In embodiments of the first aspect, the individual tubes of the multi-tube section have very small cross-sectional areas. This can increase an unstusted, viscous damping. In particular, a size of the non-steep, viscous damping scales with the fourth power of the cross-sectional areas (e.g. the diameters in the case of circular cross-sections) of the individual tubes.For example, a diameter of the multi-tube portion (i.e., total diameter of the multi-tube portion) is 3 / 4 inch (1.91 cm) or less, 1 / 2 inch (1.27 cm) or less, 3 / 8 inch (0.95 cm) or less, and / or 1 / 4 inch (0.64 cm) or less. In another example, a diameter of the multi-tube portion is 5 cm or less, 3 cm or less, 2 cm or less, 1 cm or less, and / or 0.5 cm or less.In addition, a diameter of each of the single tubes of the multi-tube section is, for example, 5 mm or less, 3 mm or less, 2 mm or less, 1 mm or less, 0.5 mm or less, 0.3 mm or less, 0.2 mm or less, and / or 0.1 mm or less. Due to these small individual tube diameters and the associated small cross-sectional areas of the individual tubes, an unstusted, viscous damping is advantageously increased. A lower limit for the individual tube diameters or the cross-sectional areas of the individual tubes is obtained by the undesirably high flow resistance occurring with very small tube diameters / cross-sectional areas.According to a second aspect, a cooling device for cooling a position-sensitive component of a lithography apparatus is proposed. The cooling device has a liquid line having a plurality of line sections which are fluidically connected to one another for transporting a cooling liquid to the position-sensitive component, wherein a longitudinal direction of a respective line section is arranged parallel to an x-, y- or z-direction, the x-, y- and z-directions are spatial directions which are perpendicular to one another, and a total length of all x-line sections arranged parallel to the x-direction, a total length of all y-line sections arranged parallel to the y-direction and / or a total length of all z-line sections arranged parallel to the z-direction is / are arranged on the basis of predetermined mechanical vibration excitations of the liquid line accordingly in the x-direction, the y-direction and / or the z-direction.As a result, the total length of all x-line sections, for example, during the production of the cooling device can be adapted to a predetermined mechanical excitation of vibration of the cooling device or of the liquid line of the cooling device in the x-direction. The same applies to the y-line sections and the predetermined mechanical vibration excitation in the y-direction, as well as to the z-line sections and the predetermined mechanical vibration excitation in the z-direction.If, for example, a predetermined vibrational excitation of the cooling device or of the liquid line of the cooling device is large in the x-direction (e.g. greater than in the y- and / or z-direction), then the total length of the x-line sections is selected to be small during the production of the cooling device (e.g. smaller than in the y- and / or z-direction).The predetermined mechanical vibrational excitation of the cooling device or the liquid line of the cooling device in the x-direction, the y-direction and / or the z-direction is, for example, a predetermined acceleration of the cooling device or the liquid line in the x-direction, the y-direction and / or the z-direction, respectively.The plurality of line sections which are fluidically connected to one another comprise in particular one or more x line sections, one or more y line sections and / or one or more z line sections.A time-dependent pressure surge p(t) introduced into the cooling liquid (e.g. by means of vibrating supporting structures of the liquid line) is linearly dependent on the density ρ of the cooling liquid, the accelerated line length 1 of the liquid line and the time-dependent acceleration a(t) of the liquid line:The pressure surge p(t) is a linear combination of the pressures which result from the active total line lengths L i and the associated accelerations a i( t) in the three spatial directions x, y, z with i ∈{x, y, z}:In this case, it is important to minimize the sum of the individual contributions, that is to say to realize as little line length L x, L y, L z as possible in directions x, y, z, which are subject to a high acceleration a x( t), a y( t), a z( t).In embodiments of the second aspect, the total length of all x-line sections arranged parallel to the x-direction, the total length of all y-line sections arranged parallel to the y-direction and / or the total length of all z-line sections arranged parallel to the z-direction is / are set on the basis of the predetermined mechanical vibration excitations of the liquid line correspondingly in the x-direction, the y-direction and / or the z-direction and additionally with respect to a rotation or angular acceleration about the x-direction, a rotation or angular acceleration about the y-direction and / or a rotation or angular acceleration about the z-direction.According to an embodiment of the second aspect, the total length of all x-line sections, the total length of all y-line sections and / or the total length of all z-line sections based on the predetermined mechanical vibrational excitations of the liquid line in the x-direction, the y-direction and / or the z-direction, respectively, is / are configured such that a large predetermined acceleration of the liquid line due to the vibrational excitation of the liquid line in a corresponding direction corresponds to a small total length of the line sections arranged parallel to the corresponding direction.According to a further embodiment of the second aspect, the plurality of line sections which are fluidically connected to one another comprise a first group of line sections which are fluidically connected to one another for supplying the cooling liquid to the position-sensitive component and a second group of line sections which are fluidically connected to one another for discharging the cooling liquid from the position-sensitive component, wherein at least one line section of the first group and at least one line section of the second group are in mechanical contact with an outer surface of the position-sensitive component. Furthermore, for a total pressure p G1( t) of the first group on the position-sensitive component, the following applies:In addition, for a total pressure p G2( t) of the second group on the position-sensitive component, the following applies:Here, ρ denotes a density of the cooling liquid, L x1, L y1 and L z1 denote a respective total length corresponding to the x, y and z line portions of the first group, L x2, L y2 and L z2 denote a respective total length corresponding to the x, y and z line portions of the second group, and a x( t) denotes the acceleration in the x direction, a y( t) denotes the acceleration in the y direction, and a z( t) denotes the acceleration in the z direction. In addition, the total lengths L x1, L y1, L z1, L x2, L y2 and L z2 are set up as a function of the predetermined accelerations a x( t), a y( t) and a z( t) such that the total pressure p G1( t) of the first group at least partially compensates the total pressure pG2(t) of the second group.As a result, a mechanical force effect on the position-sensitive component due to a pressure wave of a cooling liquid in the first group of the feed sections is at least partially compensated for by a mechanical force effect on the position-sensitive component due to a pressure wave of a cooling liquid in the second group of the discharge sections.If, for example, the predetermined vibrational excitation of the liquid line is a symmetrical vibrational excitation with respect to the first and second groups of line sections, then a symmetrical routing of the lines of the first and second groups is advantageous in order to minimize interference inputs into the position-sensitive component.However, if the predetermined vibrational excitation of the liquid line is, for example, a non-symmetrical vibrational excitation with respect to the first and second groups of line sections, then a corresponding non-symmetrical routing of the lines of the first and second groups is advantageous in order to minimize interference inputs into the position-sensitive component.According to a third aspect, a cooling device for cooling a position-sensitive component of a lithography apparatus is proposed. The cooling device has a liquid line for transporting a cooling liquid to the position-sensitive component, wherein the liquid line has a first line section having a first line diameter which is configured to extend into an interior of the position-sensitive component, and a second line section, which is fluidically connected to the first line section and has a second line diameter which is configured to be arranged further away from the position-sensitive component than the first line section with respect to a flow direction of the cooling liquid, and the first line diameter is greater than the second line diameter.By applying a larger line diameter directly adjacent to the position-sensitive component, dynamic interference inputs into the position-sensitive component can be reduced.For example, the first line diameter is 3 / 4 inch (1.91 cm) or less, 1 / 2 inch (1.27 cm) or less, 3 / 8 inch (0.95 cm) or less, and / or 1 / 4 inch (0.64 cm) or less. In another example, the first line diameter is 5 cm or less, 3 cm or less, 2 cm or less, 1 cm or less, and / or 0.5 cm or less.For example, the second line diameter is 1 / 2 inch (1.27 cm) or less, 3 / 8 inch (0.95 cm) or less, and / or 1 / 4 inch (0.64 cm) or less. In another example, the second line diameter is 3 cm or less, 2 cm or less, 1 cm or less, 0.5 cm or less, and / or 0.3 cm or less.According to an embodiment of the third aspect, a damping component for damping a pressure fluctuation of the cooling liquid is arranged between the first and second line sections.The damping component is, for example, one or more multi-pipe sections as described above and / or one or more of the muffler devices described below.According to a fourth aspect, a cooling device for cooling a position-sensitive component of a lithography apparatus is proposed. The cooling device comprises:a liquid line for transporting a cooling liquid to the position-sensitive component, andfirst and second muffler means for attenuating a pressure fluctuation of the cooling liquid, whereineach of the first and second silencer means comprises a liquid chamber fluidly connected to the liquid conduit, a gas chamber for receiving a gas, and an elastic separation membrane separating the gas chamber from the liquid chamber,the liquid line has at least one first line section having a first line diameter, which is arranged before and / or after the first and second muffler devices in the flow direction of the cooling liquid, and a second line section, which is fluidically connected to the at least one first line section and has a second line diameter, which is arranged between the first and second muffler devices, andthe first conduit diameter is greater than the second conduit diameter.For example, the first line diameter is 3 / 4 inch (1.91 cm) or less, 1 / 2 inch (1.27 cm) or less, 3 / 8 inch (0.95 cm) or less, and / or 1 / 4 inch (0.64 cm) or less. In another example, the first line diameter is 5 cm or less, 3 cm or less, 2 cm or less, 1 cm or less, and / or 0.5 cm or less.For example, the second line diameter is 1 / 2 inch (1.27 cm) or less, 3 / 8 inch (0.95 cm) or less, and / or 1 / 4 inch (0.64 cm) or less. In another example, the second line diameter is 3 cm or less, 2 cm or less, 1 cm or less, 0.5 cm or less, and / or 0.3 cm or less.The second line section provides in particular a fluid connection between the first and second silencer devices (in particular between the two liquid chambers of the first and second silencer devices).Each of the muffler devices enables the damping of pressure fluctuations of the cooling liquid by changing the volume available for the cooling liquid. In particular, the elastic separating membrane of the respective silencer device is configured to deform and thereby change a volume of the respective liquid chamber at the expense of a volume of the respective gas chamber. Thus, by each of the silencer devices, a propagation of pressure fluctuations over the cooling liquid can be significantly reduced. By connecting at least two muffler devices in series, the damping effect can be increased even further.Furthermore, because the second line diameter of the second line section arranged between the at least two muffler devices and fluidly connecting these is smaller than the first line diameter, a hydraulic mass between the at least two muffler devices can be increased. In particular, the hydraulic mass between the at least two muffler devices is inversely proportional to the diameter of the second line section connecting the at least two muffler devices.Each of the sound absorber devices has, for example, a resonance absorber, a Helmholtz resonator, and / or a neck section which fluidly connects the liquid line to the respective liquid chamber of the sound absorber device. This achieves the acoustic attenuation, i.e. the attenuation of a pressure fluctuation of the cooling liquid, based on a resonance effect.A Helmholtz resonator is in particular an example of a resonance absorber. A Helmholtz resonator has a resonator volume which is provided in the present case by the volume of the liquid chamber. Furthermore, a Helmholtz resonator has a resonator neck (neck section) which is fluidically connected to the resonator volume. A pressure wave of the cooling liquid in the line excites the cooling liquid in the resonator neck to oscillate, wherein the proportion of the cooling liquid in the resonator neck oscillates against the proportion of the cooling liquid in the liquid chamber. The sound attenuation is effected analogously to a mass-spring system.According to a fifth aspect, a lithography apparatus, in particular an EUV lithography apparatus, is proposed. The lithography apparatus has a cooling device as described above.The cooling device and / or the position-sensitive component is preferably part of the projection system of the lithography apparatus. The cooling device and / or the position-sensitive component can, however, also be part of an illumination system of the lithography apparatus. The lithography apparatus (projection exposure apparatus) can be an EUV lithography apparatus. EUV stands for "extreme ultraviolet" and denotes a wavelength of the working light between 0.1 nm and 30 nm. The projection exposure apparatus can also be a DUV lithography apparatus. DUV stands for deep ultraviolet and denotes a wavelength of the working light between 30 nm and 250 nm.According to one embodiment of the fifth aspect, the lithography apparatus has a position-sensitive component.According to a further embodiment of the fifth aspect, the cooling device comprises at least one source of flow-induced vibrations. In addition, the cooling device has at least one multitube section as described above and / or at least two silencer devices as described above, which is / are arranged downstream, in particular directly downstream, of the at least one source for flow-induced vibrations, as viewed in the flow direction of the cooling liquid.The at least one source for flow-induced vibrations (FIV), or FIV source for short, has, for example, one or more pumps, one or more valves, one or more changes in geometry of the liquid line, such as, for example, (e.g., abrupt) line cross-sectional changes, line deflections, line bends and / or line branches.For example, the cooling device has a plurality of FIV sources and is / are arranged after one, a plurality of or all of the FIV sources either at least one multi-pipe section as described above and / or at least two silencer devices as described above.According to a further embodiment of the fifth aspect, the at least one multitube section and / or the at least two silencer devices are / are arranged upstream, in particular directly upstream, of the position-sensitive component, as viewed in the flow direction of the cooling liquid.As a result, an acoustic disturbance input to the position-sensitive component can be reduced even more."Arranged directly in front of the position-sensitive component" means in particular arranged directly in front of the position-sensitive component. "Arranged directly in front of the position-sensitive component" means, for example, that a section of the liquid line between the multitube section or the two silencer devices and the position-sensitive component is free of FIV sources.According to a sixth aspect, a method for producing a cooling device as described above according to the second aspect for cooling a position-sensitive component of a lithography apparatus is proposed. The cooling device has a liquid line having a plurality of line sections which are fluidically connected to one another for transporting a cooling liquid to the position-sensitive component, wherein a longitudinal direction of a respective line section is arranged parallel to an x-, y- or z-direction, and the x-, y- and z-directions are spatial directions which are perpendicular to one another. Furthermore, the method comprises the steps: a) determining one or more mechanical vibration excitations of the liquid line in the x-direction, the y-direction and / or the z-direction, respectively, and b) producing the liquid line, such that a total length of all x-line sections arranged parallel to the x-direction, a total length of all y-line sections arranged parallel to the y-direction and / or a total length of all z-line sections arranged parallel to the z-direction is / are set on the basis of the determined mechanical vibration excitations of the liquid line in the x-direction, the y-direction and / or the z-direction, respectively.Insofar as the present application mentions cooling device, cooling, cooling liquid, cooling line, method for producing a cooling device, etc., a temperature control device, temperature control, temperature control liquid, temperature control line, method for producing a temperature control device, etc., and / or a heating device, heating, heating liquid, heating line, method for producing a heating device, etc., can equally well be meant accordingly."An" is not necessarily to be understood as limiting to exactly one element. Rather, a plurality of elements, such as two, three or more, can also be provided. Any other counting word used here is also not to be understood as being limited to exactly the number of elements mentioned. Instead, numerical deviations upwards and downwards are possible, unless indicated to the contrary.The embodiments and features described for the cooling device according to the first aspect apply to the cooling device according to the second, third and fourth aspect and also to the proposed method accordingly and vice versa.Further possible implementations of the invention also include combinations, not explicitly mentioned, of features or embodiments described above or below with respect to the exemplary embodiments. In this case, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.Further advantageous embodiments and aspects of the invention are the subject matter of the dependent claims and of the exemplary embodiments of the invention described below. The invention is explained in more detail below on the basis of preferred embodiments with reference to the enclosed figures. FIG. 1 shows a schematic meridional section of a projection exposure apparatus for EUV projection lithography; FIG. 2 shows a cooling device of the projection exposure apparatus from FIG. 1 according to one embodiment; FIG. 3 shows a cross-section of several embodiments of a multi-tube section of a liquid line of the cooling device from FIG. 2 ; FIG. 4 shows a perspective view of a multi-pipe section according to a further embodiment; FIG. 5 shows a cooling device of the projection exposure apparatus from FIG. 1 according to a further embodiment; FIG. 6 shows a variant of the cooling device from FIG. 5 ; FIG. 7 shows a cooling device of the projection exposure apparatus from FIG. 1 according to a further embodiment; FIG. 8 shows a cooling device of the projection exposure apparatus from FIG. 1 according to a further embodiment; FIG. 9 shows a cooling device of the projection exposure apparatus from FIG. 1 according to a further embodiment; FIG. 10 shows a cooling device of the projection exposure apparatus from FIG. 1 according to a further embodiment; and FIG. 11 is a flow chart of a method for manufacturing a cooling device according to an embodiment.In the figures, identical or functionally identical elements have been provided with the same reference symbols, unless indicated to the contrary. It should also be noted that the representations in the figures are not necessarily to scale.FIG. 1 shows an embodiment of a projection exposure apparatus 1 (lithography apparatus), in particular an EUV lithography apparatus. An embodiment of an illumination system 2 of the projection exposure apparatus 1 has, in addition to a light or radiation source 3, an illumination optical unit 4 for illuminating an object field 5 in an object plane 6. In this case, the illumination system 2 does not include the light source 3.A reticle 7 arranged in the object field 5 is exposed, and the reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.For the purpose of explanation, FIG. 1 shows a Cartesian coordinate system with an x-direction x, a y-direction y and a z-direction z. The x-direction x extends perpendicularly into the plane of the drawing. The y-direction y runs horizontally and the z-direction z runs vertically. In FIG. 1, the scanning direction extends along the y-direction y. The z-direction z extends perpendicular to the object plane 6.The projection exposure apparatus 1 comprises a projection optical unit 10. the projection optical unit 10 serves for imaging the object field 5 into an image field 11 in an image plane 12. the image plane 12 runs parallel to the object plane 6.A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the region of the image field 11 in the image plane 12, the wafer 13 being held by a wafer holder 14. The wafer holder 14 is displaceable via a wafer displacement drive 15, in particular along the y-direction y. The displacement of the reticle 7 via the reticle displacement drive 9 on the one hand and of the wafer 13 via the wafer displacement drive 15 on the other hand can take place in synchronization with one another.The light source 3 is an EUV radiation source. The light source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light. The useful radiation 16 has in particular a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example a LPP (laser produced plasma) source or a DPP (gas discharged produced plasma) source. It can also be a synchrotron-based radiation source. The light source 3 can be a free-electron laser (FEL).The illumination radiation 16 emanating from the light source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperbolic reflection surfaces. The illumination radiation 16 can be applied to the at least one reflection surface of the collector 17 in the case of a scattering incidence (GI), that is to say with angles of incidence greater than 45°, or in the case of a normal incidence (NI), that is to say with angles of incidence less than 45°. The collector 17 can be structured and / or coated on the one hand for optimizing its reflectivity for the useful radiation and on the other hand for suppressing false light.After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focus plane 18. the intermediate focus plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optical unit 4.The illumination optical unit 4 comprises a deflection mirror 19 and, downstream thereof, a first facet mirror 20 in the beam path. The deflection mirror 19 can be a planar deflection mirror or alternatively a mirror having an effect influencing the beam beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter which separates a used light wavelength of the illumination radiation 16 from false light of a wavelength deviating therefrom. If the first facet mirror 20 is arranged in a plane of the illumination optical unit 4 which is optically conjugate to the object plane 6 as a field plane, this is also referred to as a field facet mirror. The first facet mirror 20 comprises a multiplicity of individual first facets 21, which can also be referred to as field facets. Of these first facets 21, only some are illustrated by way of example in FIG. 1.The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or part-circular edge contour. The first facets 21 can be embodied as planar facets or alternatively as convexly or concavely curved facets.As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 themselves can also each be composed of a multiplicity of individual mirrors, in particular a multiplicity of micromirrors. The first facet mirror 20 can be designed, in particular, as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 extends horizontally, that is to say along the y-direction y.Arranged downstream of the first facet mirror 20 in the beam path of the illumination optical unit 4 is a second facet mirror 22. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optical unit 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1 and U.S. Pat. No. 6,573,978.The second facet mirror 22 comprises a plurality of second facets 23. the second facets 23 are also referred to as pupil facets in the case of a pupil facet mirror.The second facets 23 can likewise be macroscopic facets, which can be round, rectangular or else hexagonally bordered, for example, or alternatively facets composed of micromirrors. In this respect, reference is likewise made to DE 10 2008 009 600 A1.The second facets 23 can have planar or alternatively convexly or concavely curved reflection surfaces.The illumination optics 4 thus form a double faceted system. This basic principle is also referred to as a honeycomb capacitor (Fly's Eye Integrator).It may be advantageous not to arrange the second facet mirror 22 exactly in a plane which is optically conjugate to a pupil plane of the projection optical unit 10. In particular, the second facet mirror 22 can be arranged tilted with respect to a pupil plane of the projection optical unit 10, as is described, for example, in DE 10 2017 220 586 A1.With the aid of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last beam-forming mirror or indeed the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.In a further embodiment of the illumination optics 4, not shown, a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which in particular contributes to the imaging of the first facets 21 into the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optics can comprise in particular one or two mirrors for perpendicular incidence (NI mirror, Normal Incidence mirror) and / or one or two mirrors for fringe incidence (GI mirror, Growing Incidence mirror).In the embodiment shown in FIG. 1, the illumination optical unit 4 has exactly three mirrors downstream of the collector 17, namely the deflecting mirror 19, the first facet mirror 20 and the second facet mirror 22.In a further embodiment of the illumination optical unit 4, the deflecting mirror 19 can also be omitted, so that the illumination optical unit 4 can then have exactly two mirrors downstream of the collector 17, namely the first facet mirror 20 and the second facet mirror 22.The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optical unit into the object plane 6 is regularly only an approximate imaging.The projection optical unit 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure apparatus 1.In the example illustrated in FIG. 1, the projection optical unit 10 includes six mirrors M 1 to M 6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible. The projection optical unit 10 is a double-obscured optical unit. The next-to-last mirror M 5 and the last mirror M 6 each have a passage opening for the illumination radiation 16. The projection optical unit 10 has an image-side numerical aperture which is greater than 0.5 and which can also be greater than 0.6 and which can be, for example, 0.7 or 0.75.Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. The mirrors Mi, like the mirrors of the illumination optical unit 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.The projection optical unit 10 has a large object image offset in the y direction y between a y coordinate of a center of the object field 5 and a y coordinate of the center of the image field 11.The projection optical unit 10 can be designed in particular anamorphically. It has in particular different imaging scales βx, βyin the x- and y-directions x, y. The two imaging scales βx, βyof the projection optical unit 10 are preferably (βx, βy)=(+ / - 0.25, + / - 0.125). A positive imaging scale β means imaging without image reversal. A negative sign for the imaging scale β means image reversal imaging.The projection optical unit 10 thus leads in the x-direction x, i.e. in the direction perpendicular to the scanning direction, to a reduction in the ratio 4:1.The projection optical unit 10 leads to a reduction of 8:1 in the y-direction y, i.e. in the scanning direction.Other imaging scales are also possible. Identical-sign and absolutely identical imaging scales in the x- and y-directions x, y, for example with absolute values of 0.125 or of 0.25, are also possible.The number of intermediate image planes in the x- and y-directions x, y in the beam path between the object field 5 and the image field 11 can be the same or can be different depending on the embodiment of the projection optical unit 10. Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018 / 0074303 A1.In each case one of the second facets 23 is assigned exactly to one of the first facets 21 for forming in each case an illumination channel for illuminating the object field 5. This can result in particular in illumination according to the Kohler principle. The far field is broken down into a plurality of object fields 5 with the aid of the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them in each case.The first facets 21 are imaged onto the reticle 7 in each case by an associated second facet 23 in a manner overlapping one another in order to illuminate the object field 5. The illumination of the object field 5 is in particular as homogeneous as possible. It preferably has a uniformity error of less than 2%. The field uniformity can be achieved by superimposing different illumination channels.By arranging the second facets 23, the illumination of the entry pupil of the projection optical unit 10 can be geometrically defined. By selecting the illumination channels, in particular the subset of the second facets 23, which guide light, the intensity distribution in the entrance pupil of the projection optical unit 10 can be adjusted. This intensity distribution is also referred to as illumination setting or illumination pupil filling.A likewise preferred pupil uniformity in the region of sections of an illumination pupil of the illumination optical unit 4 that are illuminated in a defined manner can be achieved by redistribution of the illumination channels.Further aspects and details of the illumination of the object field 5 and in particular of the entry pupil of the projection optical unit 10 are described below.The projection optical unit 10 can have, in particular, a homocentric entry pupil. This can be accessible. It may also be inaccessible.The entrance pupil of the projection optical unit 10 cannot be illuminated exactly with the second facet mirror 22 as a rule. In an imaging of the projection optical unit 10, which images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture beams often do not intersect at a single point. However, an area can be found in which the paired distance of the aperture beams becomes minimum. This surface represents the entry pupil or a surface in the spatial domain which is conjugated to it. In particular, this surface exhibits a finite curvature.It can be that the projection optical unit 10 has different positions of the entry pupil for the tangential and for the sagittal beam path. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the aid of this optical element, the different position of the tangential entry pupil and of the sagittal entry pupil can be taken into account.In the arrangement of the components of the illumination optical unit 4 illustrated in FIG. 1, the second facet mirror 22 is arranged in a surface conjugate to the entry pupil of the projection optical unit 10. The first facet mirror 20 is arranged tilted with respect to the object plane 6. The first facet mirror 20 is arranged tilted with respect to an arrangement plane which is defined by the deflecting mirror 19. The first facet mirror 20 is arranged tilted with respect to an arrangement plane which is defined by the second facet mirror 22.FIG. 2 shows a cooling device 100 for the projection exposure apparatus 1 from FIG. 1 according to one embodiment.The cooling device 100 is configured to cool an optical or mechanical component 102 of the projection exposure apparatus 1. An example of an optical component 102 is a mirror of the projection exposure apparatus 1 (lithography apparatus), in particular of the projection optical unit 10, from FIG. 1. An example of a mechanical component 102 is a sensor frame (not shown) of the projection exposure apparatus 1.A sensor frame comprises, for example, a sensor device for measuring a current position of an optical component of the lithography apparatus 1 relative to the sensor frame. The sensor frame is mounted in a vibration-decoupled manner, for example, with respect to a supporting frame of the optical component. The sensor device comprises e.g. one or more sensors, such as interferometers and / or other measuring devices for detecting a position of the optical component. The optical component can have, for example, reflector elements for reflecting a light (e.g. laser light) emitted by the sensors.As shown in FIG. 2, the cooling device 100 includes a liquid line (e.g., cooling line) 104 for transporting a cooling liquid 106.The cooling device 100 furthermore comprises, for example, a cooling unit 108 for cooling the cooling liquid 102. The cooling device 100 also includes one or more pumps 110 for generating a required coolant flow rate of the cooling liquid 106. The cooling device 100 may also include one or more valves 112 for controlling the cooling flow.Pumps 110 of the cooling device 100 may cause turbulent flows of the cooling liquid 106. This can generate local pressure fluctuations in the liquid 106, which are transmitted via longitudinal water sound waves through the entire cooling circuit 114 as far as the component 102 to be cooled. This results in a dynamic disturbance excitation of the component 102 to be cooled (flow-induced vibrations, FIV). In addition to pumps 110, changes in cross section and deflections 116 of the liquid line 104 and valves 112 of the cooling device 100 can also represent a source of disturbance (FIV source) that causes local pressure fluctuations of the liquid 106. Such acoustic interference excitation is forwarded to the component 102 to be cooled by water sound. This can lead to an undesired change in position of the component 102 to be cooled, which deteriorates the imaging properties of the projection exposure apparatus 1.In order to suppress pressure fluctuations of the cooling liquid 106, the cooling device 100, in particular the liquid line 104, has one or more multi-pipe sections 118. In FIG. 2, a multitube section 118 is shown by way of example. In the multi-tube section 118, a tube 120 of the liquid line 104, as seen in cross section (FIG. 3 ), is segmented into a plurality of individual tubes 124 by one or more partitions 122. The multi-tube section 118 has an elastic material 126 for damping pressure fluctuations of the cooling liquid 106. For example, the partitions 122 of the multi-tube portion 118 are made of the elastic material 126.In FIG. 3, a cross section of the multi-tube section 118 along line III-III in FIG. 2 is shown for four different embodiments of the individual tubes 124. In particular, FIG. 3 illustrates different cross-sectional shapes of the individual tubes.FIG. 3 ashows a tube 120 aof the liquid line 104, which has a circular cross section and into which a multi-tube section 118 ais inserted. An outer wall 128 aof the multi-tube portion 118 aalso has a circular cross section. The multi-tube portion 118 ais clamped between inner walls of the tube 120 a, for example. The multitube section 118 aincludes a plurality of individual tubes 124 a, of which five are labeled with a reference sign in FIG. 3. The individual tubes 124a each have a circular cross section and are delimited from one another by separating walls 122a. The multi-tube section 118 ais, for example, made entirely of the elastic material 126.In the examples of FIGS. 3 band 3 c, tubes 120 b, 120 cof the liquid line 104 also have a circular cross section. Furthermore, a multitube section 118 b, 118 chaving a circular outer wall 128 b, 128 cis inserted into the respective tube 120 b, 120 c. In FIG. 3 b, the individual tubes 124 b, three of which are identified by a reference sign, have an oval cross section. Partitions 122 bfill the space between the individual tubes 124 b. In Fig. 3c, the individual tubes 124c, three of which are identified by a reference numeral, have a triangular cross-section. Partitions 122c form a grid defining the single tubes 124c having the triangular cross-section.In FIG. 3 d, a tube 120 dof the liquid line 104 is shown with a square cross section. Furthermore, a multitube section 118d having a square outer wall 128d corresponding in cross section is inserted into the tube 120d. In FIG. 3 d, the individual tubes 124 d, three of which are identified by a reference sign, have a quadrangular cross section. Partitions 122 dform a grid defining the single tubes 124 dhaving the quadrangular cross section.The multitube sections 118 b, 118 c, 118 din FIGS. 3 b, 3 c, 3 dare also manufactured, for example, completely from elastic material 126 and inserted as an insert into the respective tube 120 b, 120 c, 120 d.In FIG. 4, a further embodiment of a multitube section 218 with an elastic material 226 is shown. The multi-tube section 218 in FIG. 4 has a plurality of individual tubes 224. Ten individual tubes 224 are shown merely by way of example in FIG. 4. The individual tubes 224 shown each have a hexagonal cross section. However, in other examples, the single tubes 224 of the embodiment of FIG. 4 may have a different cross-sectional shape (e.g., a circular, oval, triangular, square, or other shape).FIG. 4 shows a multitube section 218 with a combined inflow and outflow. In particular, at least one first individual pipe 230 of the plurality of individual pipes 224 is configured to supply cooling liquid 106 to the position-sensitive component 102 (supply pipe / s 230). Furthermore, at least one second 232 of the plurality of individual pipes 224 is configured to discharge cooling liquid 106 from the position-sensitive component 102 (discharge pipe / e 232). As an example, the multi-tube portion 218 in FIG. 4 has five feed tubes 230 and five drain tubes 232. Partitions 222 separating the supply pipes 230 and the discharge pipes 232 from each other include the elastic material 226. In FIG. 4, for reasons of clarity, only three of the partitions 222 are provided with a reference sign. However, in particular, all the partitions 222 may be made of the elastic material 226.FIG. 5 shows a cooling device 300 for cooling an optical or mechanical component 302 of the projection exposure apparatus 1 (FIG. 1 ) according to a further embodiment. The cooling device 300 includes a liquid conduit (e.g., cooling conduit) 304 for transporting a cooling liquid 106. For example, although not shown in FIG. 5, the cooling device 300 includes a cooling unit (similar to the cooling unit 108 in FIG. 2 ), one or more pumps (similar to the pump 110 in FIG. 2 ), and one or more valves (similar to the valve 112 in FIG. 2 ).The liquid line 304 comprises a plurality of line sections 334, 336, 338, 340, 342, 344 which are fluidically connected to one another for transporting a cooling liquid to the position-sensitive component 302. Furthermore, a longitudinal direction A 1 to A 6 of a respective line section 334 to 344 is arranged parallel to an x-, y- or z-direction x, y, z, wherein the x-, y- and z-directions x, y, z are spatial directions perpendicular to one another. In the example of FIG. 5, the line portions 334, 338, 340, and 344 are arranged parallel to the x-direction x (i.e., the longitudinal directions A 1, A 3, A 4, A 6 are arranged parallel to the x-direction x). In addition, the line portions 336 and 342 are arranged parallel to the y direction y (i.e., the longitudinal directions A 2 and A 5 are arranged parallel to the y direction y). In FIG. 5, no line sections are shown which are arranged parallel to the z-direction z. The x and y line portions 334, 336, 338, 340, 342 and 344 shown have respective lengths l 1, l 2, l 3, l 4, l 5 and l 6, as indicated in FIG. 5.Furthermore, the total lengths of the line sections 334, 336, 338, 340, 342 and 344 in a respective direction x, y, z are selected depending on a predetermined mechanical vibration excitations V x, V y, V z of the cooling device 300, in particular the liquid line 304. In particular, an overall length L x of all x-line sections 334, 338, 340 and 344 arranged parallel to the x-direction x is set on the basis of a predetermined mechanical vibration excitation V x of the liquid line 304 in the x-direction x. For example, the total length L x is selected based on a predetermined time-dependent acceleration a x( t) of the liquid conduit 304 due to a mechanical vibration excitation V x in the x-direction x. In particular, in the case of a large predetermined acceleration a x( t) of the liquid line 304 due to the vibrational excitation V x in the x-direction x, a small total length L x of the line sections 334, 338, 340 and 344 arranged parallel to the x-direction x is selected.Similarly, an overall length L y of all y-conduit portions 336 and 342 arranged parallel to the y-direction y is set based on a predetermined mechanical vibration excitation V y of the liquid conduit 304 in the y-direction y. An overall length L z of all z-line sections arranged parallel to the z-direction z can also be set up on the basis of a predetermined mechanical vibration excitation V z of the liquid line 304 in the z-direction z.In the example of FIG. 5, for example, a predetermined time-dependent acceleration a z( t) of the liquid line 304 due to a mechanical vibration excitation V z in the z direction is very large, so that line sections in the z direction were completely dispensed with during the design of the cooling device 300 and in particular the routing of the liquid line 304 (L z= 0).FIG. 6 shows a variant of the cooling device 300 from FIG. 5. As shown in FIG. 6, the cooling device 300', in particular the cooling line 304', can be designed such that pressure gradients along the position-sensitive component 302 are minimized.In particular, as seen in FIG. 6, the plurality of fluidly connected conduit portions 334- 344 may include a first group G 1 of fluidly connected supply portions 334, 336, and 338 for supplying the cooling liquid 106 to the position sensitive component 302. Furthermore, the plurality of mutually fluidly connected line sections 334 to 344 may comprise a second group G 2 of mutually fluidly connected discharge sections 340, 342, and 344 for discharging the cooling liquid 106 from the position-sensitive component 302. In this case, at least one lead section 338 of the first group G 1 and at least one lead section 340 of the second group G 2 are in direct mechanical contact with an outer surface 346 of the position-sensitive component 302. A total pressure p G1( t) of the first group G 1 on the position-sensitive component 302 is obtained by the following equation:In addition, a total pressure p G2( t) of the second group G2 on the position-sensitive component 302 is obtained on the basis of the following equation:In the above equations, L x1, L y1 and L z1 denote the respective total lengths corresponding to the x, y and z line portions 334, 336, 338 of the first group G1. Further, L x2, L y2 and L z2 denote the respective total lengths corresponding to the x, y and z line portions 340, 342, 344 of the second group G2. In the example of FIG. 6, L is x1= L is 1+ L is 3, L is y1= L is 2 and L is z1= 0. Further, in the example of FIG. 6, L is x2= L is 4+ L is 6, L is y2= L is 5 and L is z2= 0. Moreover, a x( t) denotes the acceleration in the x direction, a y( t) denotes the acceleration in the y direction, and a z( t) denotes the acceleration in the y direction.In order to keep pressure gradients along the position-sensitive component 302 as low as possible, it is advantageous if the total pressure p G1( t) of the first group G 1 at least partially compensates the total pressure p G2( t) of the second group G 2. Ideally, the total pressure p G1( t) of the first group G1 is equal to the total pressure p G2( t) of the second group G2:As a result, a mechanical force effect on the position-sensitive component 302 due to a pressure wave of a cooling liquid 106 in the first group G 1 of the feed sections 334, 336, 338 is (at least partially) compensated for by a mechanical force effect on the position-sensitive component 302 due to a pressure wave of a cooling liquid 106 in the second group G 2 of the discharge sections 340, 342, 344.If, for example, the predetermined vibrational excitation V x, V y, V z of the liquid line 304 is a symmetrical vibrational excitation with respect to the first and second groups G 1, G 2 of the line sections 334 to 344, then a symmetrical routing of the line sections 334 to 344 of the first and second groups G 1, G 2 is advantageous in order to minimize dynamic interference entries into the position-sensitive component 302.However, if the predetermined vibrational excitation V x, V y, V z of the liquid line 304 is, for example, a vibrational excitation that is unsymmetrical with respect to the first and second groups G 1, G 2 of the line sections 334 to 344, then a corresponding unsymmetrical routing of the line sections 334 to 344 of the first and second groups G 1, G 2 is advantageous in order to minimize interference entries into the position-sensitive component 302.FIG. 7 shows a cooling device 400 for cooling an optical or mechanical component 402 of the projection exposure apparatus 1 (FIG. 1 ) according to a further embodiment. The cooling device 400 includes a liquid conduit (e.g., cooling conduit) 404 for transporting a cooling liquid 106. For example, although not shown in FIG. 7, the cooling device 400 includes a cooling unit (similar to the cooling unit 108 in FIG. 2 ), one or more pumps (similar to the pump 110 in FIG. 2 ), and one or more valves (similar to the valve 112 in FIG. 2 ).The liquid conduit 404 comprises a first conduit portion 450 having a first conduit diameter D 1. The first line section 450 is configured to extend into an interior 454 of a body 456 of the position-sensitive component 402. In addition, the liquid line 404 comprises a second line section 452, which is fluidically connected to the first line section 450, with a second line diameter D 2. The second line section 452 is configured to be arranged further away from the position-sensitive component 402 than the first line section 450 with respect to a flow direction S of the cooling liquid. Moreover, the first line diameter D 1 is larger than the second line diameter D 2.By applying a larger line diameter D 1 (directly) adjacent to the position-sensitive component 402, interference inputs into the position-sensitive component 402 can be reduced.Optionally, a damping component 458 for damping a pressure fluctuation of the cooling liquid 106 can be arranged between the first and second line sections 450, 452. The damping component 458 may be, for example, one or more multi-tube portions 218 (FIGS. 2-4 ) as described above. Additionally or instead, the damping component 458 may also be one or more silencer devices (FIG. 8 ) as described below.FIG. 8 shows a cooling device 500 for cooling an optical or mechanical component 102 of the projection exposure apparatus 1 (FIG. 1 ) according to a further embodiment. The cooling device 500 includes a liquid line (e.g., cooling line) 504 for transporting a cooling liquid 106. For example, although not shown in FIG. 8, the cooling device 500 includes a cooling unit (similar to the cooling unit 108 in FIG. 2 ), one or more pumps (similar to the pump 110 in FIG. 2 ), and one or more valves (similar to the valve 112 in FIG. 2 ).For damping pressure fluctuations of the cooling liquid 506, the cooling device 500 comprises a first and a second silencer device 560, 562. Each of the first and second silencer devices 560, 562 has a liquid chamber 564 fluidly connected to the liquid line 504, such that cooling liquid 506 can enter from the liquid line 504 into the liquid chamber 564 of the respective silencer device 560, 562. Furthermore, each of the first and second silencer devices 560, 562 has a gas chamber 566 for receiving a gas 570. The gas chamber 566 is separated from the respective liquid chamber 564 by an elastic separation membrane 568.In the state shown in FIG. 8, the respective separation membrane 568 is in a quiescent state. The quiescent state is a relaxed, undeformed state of separation membrane 568. By deforming the separation membrane 568, a volume of the liquid chamber 564 may be changed at the expense of a volume of the gas chamber 566. For example, an increase in pressure of the cooling liquid 506 can be attenuated by expanding the cooling liquid 506 and compressing the gas 570 in the respective gas chamber 566. Correspondingly, periodic pressure fluctuations of the cooling liquid 506 can also be attenuated with the aid of the respective compressible gas chamber 566.As shown in FIG. 8, each of the silencer devices 560, 562 may have a neck portion 572 that fluidly connects a liquid space of the liquid conduit 504 to the respective liquid chamber 564 of the silencer device 560, 562. The sound absorber devices 560, 562 correspond, for example, in each case to a resonance absorber and / or a Helmholtz resonator, in which the sound attenuation or the sound absorption is achieved by a resonance effect. In particular, a portion of the cooling liquid 506 received in the neck portion 572 may oscillate against a portion of the cooling liquid 506 received in the liquid chamber 564, such that the damping is effected based on a mass spring damping.In addition, in the cooling device 500 shown in FIG. 8, it is provided that the liquid line 504 has at least one first line section 574, 576 with a first line diameter D 1, which is arranged before and / or after the two muffler devices 560, 562 in the flow direction S of the cooling liquid 506. Furthermore, the liquid line 504 comprises at least one second line section 578 which is fluidically connected to the at least one first line section 574, 576. The second line section 578 is arranged between the first and the second silencer device 560, 562. In particular, the second line section 578 fluidically connects the two liquid chambers 564 of the two sound damping devices 560, 562 to one another. The second conduit portion 578 has a second conduit diameter D2 which is smaller than the first conduit diameter D1. As a result, a hydraulic mass between the two silencer devices 560, 562 is increased. In particular, the hydraulic mass between the two silencer devices 560, 562 is inversely proportional to the diameter D 2 of the line section 578 connecting the two silencer devices 560, 562.FIG. 9 shows a cooling device 600 for cooling one or more optical or mechanical components 602 (similar to the position-sensitive component 102) of the projection exposure apparatus 1 from FIG. 1 according to a further embodiment. The cooling device 600 includes a liquid conduit (e.g., cooling conduit) 604 for transporting a cooling liquid 106. The cooling device 600 also includes a cooling unit 608 (similar to the cooling unit 108 in FIG. 2 ), one or more pumps 610 (similar to the pump 110 in FIG. 2 ), and one or more valves 612 (similar to the valve 112 in FIG. 2 ). Downstream of (e.g. immediately downstream of) the pump 610, which represents a significant FIV source, in the flow direction S, a multi-tube section 618 is arranged for increasing the fluid damping. In addition, a multitube section 618 for reducing a flow-induced vibration is arranged upstream (e.g. immediately upstream) of each of the position-sensitive components 602 in the flow direction S. The multi-tube section 618 corresponds, for example, to one of the multi-tube sections 118, 118 a, 118 b, 118 c, 118 dshown in FIGS. 2 and 3.FIG. 10 shows a cooling device 700 for cooling an optical or mechanical component 702 (similar to the position-sensitive component 102) of the projection exposure apparatus 1 from FIG. 1 according to a further embodiment. The cooling device 700 includes a liquid line (e.g., cooling line) 704 for transporting a cooling liquid 106. The cooling device 700 also includes a cooling unit 708 (similar to the cooling unit 108 in FIG. 2 ), one or more pumps 710 (similar to the pump 110 in FIG. 2 ), and one or more valves 712 (similar to the valve 112 in FIG. 2 ).Downstream (e.g. immediately downstream) of the pump 710 in the flow direction S, a multi-tube section 718 is arranged for increasing the fluid damping. The multi-tube section 718 corresponds, for example, to one of the multi-tube sections 118, 118 a, 118 b, 118 c, 118 dshown in FIGS. 2 and 3. In addition, a multi-pipe section 718' is arranged in the flow direction S before (e.g. immediately before) the position-sensitive components 702, similar to the multi-pipe section 218 shown in FIG. 4. The multitube section 718', like the multitube section 218 shown in FIG. 4, has a combined inlet and outlet line 230, 232. By means of the multitube section 718', on the one hand, a flow-induced vibration in front of the position-sensitive component 702 can be reduced. In addition, a pressure gradient across the position-sensitive component 702 may be reduced.Although the present invention has been described on the basis of exemplary embodiments, it can be modified in various ways.LIST OF REFERENCE CHARACTERS1 Projection exposure apparatus 2 Illumination system 3 Light source 4 Illumination optical unit 5 Object field 6 Object plane 7 Reticle 8 Reticle holder 9 Reticle displacement drive 10 Projection optical unit 11 Image field 12 Image plane 13 Wafer 14 Wafer holder 15 Wafer displacement drive 16 Illumination radiation 17 Collector 18 Intermediate focal plane 19 Deflection mirror 20 First facet mirror 21 First facet 22 Second facet mirror 23 Second facet 100 Cooling device 102 Component 104 Liquid line 106 Liquid 108 Cooling unit 110 Pump 112 Valve 114 Circuit 116 Deflection 118 Multitube section 118 a, 118 b Multi tube section 118 c, 118 d Multi tube section 120 Tube 120 a, 120 bTube 120 c, 120 dTube 122 a, 122 b Trennwand wall 122 c, 122 d Wall 124 Single tube 124 a, 124 b Einzel tube 124 c, 124d Single tube 126 Elastic material 128a, 128b Wall 128c, 128d Wall 218 Multi-tube portion 222 Partition 224 Single tube 226 Elastic material 230 Feed tube 232 Discharge tube 300, 300' Cooling device 302 Component 304, 304' liquid line 334 line portion 336 line portion 338 line portion 340 line portion 342 line portion 344 line portion 346 surface 400 cooling device 402 component 404 liquid line 450 line portion 452 line portion 454 interior 456 body 458 damping component 500 cooling device 504 liquid line 506 cooling liquid 560 silencer device 562 silencer device 564 liquid chamber 566 gas chamber 568 separation membrane 570 gas 572 neck portion 574 line portion 576 line portion 578 line portion 600 cooling device 602 component 604 liquid line 608 cooling unit 610 pump 612 valve 618 multitube portion 700 cooling device 702 component 704 liquid line 708 cooling unit 710 pump 712 valve 718, 718' multitube portion a x, a y, a z acceleration A1-A6 direction D1, D2 diameter G1, G2 group l 1- l 6 length L x, L y, L z length M1-M6 mirror S direction S1, S2 method steps t time V x, V y, V z vibrational excitation x direction y direction z directionReferences included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 10 2008 009 600 A1 [0091, 0095]US 2006 / 0132747 A1

[0093] EP 1 614 008 B1

[0093] U.S. Pat. No. 6,573,978

[0093] DE 10 2017 220 586 A1

[0098] US 2018 / 0074303 A1

[0112]

Claims

Cooling device (100) for cooling a position-sensitive component (102) of a lithography apparatus (1), comprising a liquid line (104) for transporting a cooling liquid (106) to the position-sensitive component (102), wherein the liquid line (104) comprises at least one multi-tube section (118), in which a tube (120) of the liquid line (104), viewed in cross section, is segmented into a plurality of individual tubes (124) by one or more separating walls (122), and the multi-tube section (118) comprises an elastic material (126) for damping pressure fluctuations of the cooling liquid (106).The cooling device of claim 1, wherein the one or more partitions (122) of the multi-tube portion (118) comprise the elastic material (126), an outer wall (128) of the multi-tube portion (118) comprises the elastic material (126), and / or the multi-tube portion (118) is made of the elastic material (126).The cooling device of claim 1 or 2, wherein at least a first (230) of the plurality of single tubes (224) is configured to supply cooling liquid (106) to the position sensitive component (102), at least a second (232) of the plurality of single tubes (224) is configured to discharge cooling liquid (106) from the position sensitive component (102), and the one or more partitions (222) separating the at least a first and the at least a second single tube (230, 232) from each other comprise the elastic material (226).Cooling device (300) for cooling a position-sensitive component (302) of a lithography apparatus (1), comprising a liquid line (304) having a plurality of line sections (334-344) which are fluidically connected to one another for transporting a cooling liquid (106) to the position-sensitive component (302), wherein a longitudinal direction (A1-A6) of a respective line section (334-344) is arranged parallel to an x-, y- or z-direction (x, y, z), the x-, y- and z-directions (x, y, z) are spatial directions which are perpendicular to one another, and a total length (L x) of all x-line sections (334, 338, 340, 344) arranged parallel to the x-direction (x), a total length (L y) of all y-line sections ( 336, 342) arranged parallel to the y-direction (y) and / or a total length (L y) of all z-line sections arranged parallel to the z-direction (z) is / are set based on predetermined mechanical vibration excitations (V x, V y, V z) of the liquid line ( 304) accordingly in the x-direction (x), the y-direction (y) and / or the z-direction (z).The cooling device according to claim 4, wherein the total length (L x) of all x-line sections (334, 338, 340, 344), the total length (L y) of all y-line sections (336, 342) and / or the total length (L z) of all z-line sections based on the predetermined mechanical vibration excitations (V x, V y, V z) of the liquid line (304) respectively in the x-direction (x), the y-direction (y) and / or the z-direction (z) is / are configured such that a large predetermined acceleration (a x, a y, a z) of the liquid conduit (304) due to the vibrational excitation (V x, V y, V z) of the liquid conduit (304) in a corresponding direction (x, y, z) corresponds to a small total length (L x, L y, L z) of the conduit portions (334-344) arranged parallel to the corresponding direction (x, y, z).The cooling device of claim 4 or 5, wherein the plurality of fluidly connected conduit portions (334-344) comprise a first group (G1) of fluidly connected feed portions (334, 336, 338) for feeding the cooling liquid (106) to the position sensitive component (302) and a second group (G2) of fluidly connected drain portions (340, 342, 344) for draining the cooling liquid (106) from the position sensitive component (302), at least one feed portion (338) of the first group (G1) and at least one drain portion (340) of the second group (G2) is in mechanical contact with an outer surface (346) of the position sensitive component (302), for a total pressure p G1( t) of the first group (G1) on the position-sensitive component (302): p G1 ( t ) = 1 2 ⋅ ρ ⋅ [ L x1 ⋅ a x ( t ) + L y1 ⋅ a y ( t ) + L z1 ⋅ a z ( t ) ], for a total pressure p G2( t) of the second group (G2) on the position-sensitive component (302): p G2 ( t ) = 1 2 ⋅ ρ ⋅ [ L x2 ⋅ a x ( t ) + L y2 ⋅ a y ( t ) + L z2 ⋅ a z ( t ) ], ρ denotes a density of the cooling liquid (106), L x1, L y1 and L z1 denote a respective total length corresponding to the x, y and z line portions (334, 336, 338) of the first group (G1), L x2, L y2 and L z2 denote a respective total length corresponding to the x, y and z line portions (340, 342, 344) of the second group (G2), a x( t) denotes the acceleration in the x direction (x), a y( t) denotes the acceleration in the y direction (y) and a z( t) denotes the acceleration in the z direction (z), and the total lengths L x1, L y1, L z1, L x2, L y2 and L z2 are set as a function of the predetermined accelerations a x( t), a y( t) and az(t), wherein the total pressure p G1( t) of the first group (G1) at least partially compensates the total pressure p G2( t) of the second group (G2).Cooling device (400) for cooling a position-sensitive component (402) of a lithography apparatus (1), comprising a liquid line (404) for transporting a cooling liquid (106) to the position-sensitive component (402), wherein the liquid line (404) comprises a first line section (450) with a first line diameter (D1), which is configured to extend into an interior (454) of the position-sensitive component (402), and a second line section (452), which is fluidically connected to the first line section (450), with a second line diameter (D2) and is configured to be arranged further away from the position-sensitive component (402) than the first line section (450) with respect to a flow direction (S) of the cooling liquid (106), and the first line diameter (D1) is greater than the second line diameter (D2).Cooling device according to claim 7, wherein between the first and second line sections (450, 452) a damping component (458) for damping a pressure fluctuation of the cooling liquid (106) is arranged.Cooling device (500) for cooling a position-sensitive component (102) of a lithography apparatus (1), comprising: a liquid line (504) for transporting a cooling liquid (506) to the position-sensitive component (102), and first and second sound damping devices (560, 562) for damping a pressure fluctuation of the cooling liquid (506), wherein each of the first and second sound damping devices (560, 562) comprises a liquid chamber (564) fluidly connected to the liquid line (504), a gas chamber (566) for receiving a gas (570) and an elastic separating membrane (568) separating the gas chamber (566) from the liquid chamber (564), the liquid line (504) comprising at least one first line section (574, 576) having a first line diameter (D1), which is arranged before and / or after the first and second muffler devices (560, 562) in the flow direction (S) of the cooling liquid (506), and a second line section (578), which is fluidically connected to the at least one first line section (574, 576), with a second line diameter (D2) which is arranged between the first and second muffler devices (560, 562), and the first line diameter (D1) is greater than the second line diameter (D2).Lithography apparatus (1), in particular EUV lithography apparatus, having a cooling device (100, 300, 400, 500) according to one of Claims 1 to 9.Lithography apparatus (1) according to claim 10, comprising a position-sensitive component (102).Lithography apparatus (1) according to claim 11, wherein the cooling device (600) comprises: at least one source (610) for flow-induced vibrations, and at least one multi-pipe section (618) according to one of claims 1 to 3, and / or at least two sound absorber devices (560, 562) according to claim 9, and wherein the at least one multi-pipe section (618) and / or the at least two sound absorber devices (560, 562) is / are arranged after, in particular directly after, the at least one source (610) for flow-induced vibrations, as seen in the flow direction (S) of the cooling liquid (106).Lithography apparatus (1) according to claim 11 or 12, wherein at least one multitube section (118, 618, 718') according to one of claims 1 to 3 and / or at least two sound absorber devices (560, 562) according to claim 9 is / are arranged in front of, in particular directly in front of, the position-sensitive component (102, 602, 702), as seen in the flow direction (S) of the cooling liquid (106).Method for producing a cooling device (300) according to one of Claims 4 to 6 for cooling a position-sensitive component (302) of a lithography apparatus (1), wherein the cooling device (300) has a liquid line (304) having a plurality of line sections (334-344) which are fluidically connected to one another for transporting a cooling liquid (106) to the position-sensitive component (302), a longitudinal direction (A1-A6) of a respective line section (334-344) is arranged parallel to an x -, y - or z direction (x, y, z), and the x -, y - and z directions (x, y, z) are spatial directions which are perpendicular to one another, comprising the steps: a) determining (S1) one or more mechanical vibrational excitations (V x, V y, V z) of the liquid line (304) in the x-direction (x), the y-direction (y) and / or the z-direction (z), respectively, and b) producing (S2) the liquid line (304) such that a total length (L x) of all x-line sections (334, 338, 340, 344) arranged parallel to the x-direction (x), a total length (L y) of all y-line sections (336) arranged parallel to the y-direction (y), 342) and / or an overall length (L z) of all z-line sections arranged parallel to the z-direction (z) based on the determined mechanical vibrational excitations (V x, V y, V z) of the liquid line (304) is / are correspondingly configured in the x-direction (x), the y-direction (y) and / or the z-direction (z).

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