Device for loading and unloading plasma coating and etching chambers

Abstract

The invention relates to a telescopic device for transporting substrates, which enables efficient loading and unloading of substrates into and out of processing chambers and processing of substrates without damaging the substrate surface.

Description

[0001] The object of the invention is to solve the problems arising from the transport of substrates using transport trays and to provide a device and a processing method that enables efficient loading and unloading of substrates into and out of processing chambers and the processing of substrates without damaging the substrate surface. The object of the present invention is the implementation of a compact transport system in a coating system, particularly, but not exclusively, for thin substrates, wherein the substrates are moved safely and with high dynamics between vacuum chambers. The transport system, which is connected to a transfer chamber, can bridge a distance of several meters in two directions for loading and unloading processing chambers.

[0002] The present invention relates to a processing device for processing flat substrates. More precisely, it relates to a PECVD process. First, a transfer chamber and a processing chamber for the PECVD process for processing flat substrates are provided.

[0003] The transfer chamber is configured to receive flat substrates and transfer them from one environmental condition to another. The transfer chamber contains a linear transport mechanism consisting of a linear axis mechanism and a substrate gripper. Valves are installed at the inlet / outlet opening.

[0004] The processing chamber contains an upper electrode and a lower electrode. The lower electrode supports the flat substrates and is designed as a planar substrate holder. The lower electrode consists of at least two independently movable components. One component can be described as a substrate holder frame, and the second component as a movable punch. Each of these components can be moved independently in the vertical direction.

[0005] To enable a detailed understanding of the functionality and the aforementioned features of the present invention, a more precise description of the invention, which has been briefly summarized above, can be provided by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings show only selected embodiments of this invention and are not to be considered as limiting its scope. The invention can also be applied to other equally effective embodiments. Fig. 1: Explanatory drawing of the top view showing the overall structure of a coating system according to the invention. Fig. 2a: A top view showing an embodiment of a device according to the invention. Fig. 2b: A side section showing an embodiment of a device according to the invention. Fig. 3a: A top view showing an embodiment of a device according to the invention. Fig. 3b: A side section showing an embodiment of a device according to the invention.

[0006] In Fig. Figure 1 shows an embodiment of the PECVD according to the invention. This PECVD has at least one processing chamber (101) with at least one feed / discharge opening, which is designed as a valve (102), and at least one transfer chamber (103) with at least one feed / discharge opening, which is designed as a valve (102). In the transfer chamber (103) there is a transport mechanism (104) with a substrate gripper (105) to carry out a process for loading the processing chamber (101) with substrates (106).

[0007] The processing chamber (101) comprises a grounded chamber body (101.1) connected to a gas source (101.2) and a power source (101.3). The chamber body consists of side walls, a bottom, and a top assembly, defining a coating area. The side walls and bottom of the chamber body are made of aluminum, steel, or another material compatible with the process conditions. The chamber bottoms have one or more exhaust vents (101.4) connected to the pump components. A substrate receptacle, which also serves as the lower electrode (107), is positioned within the chamber body. This lower electrode / substrate receptacle (107) consists of two components: a frame structure (107.1) and a punch (107.2), forming a closed electrode surface coupled to the chamber via a low-resistance contact at ground.The lower electrode / substrate holder (107) is preferably made of aluminum, but can also be made of another highly conductive material compatible with the coating conditions. These two components of the lower electrode / substrate holder (107) can each be moved independently in the vertical direction. The lifting units for vertically positioning the lower electrode / substrate holder (107) are arranged so that it can also be tilted and aligned not only parallel to, but also at an angle to, the gas distribution plate (108).

[0008] The processing chamber (101) contains at least one electrode / substrate holder (107) and a gas distribution plate (108) for supplying process gases. The gas distribution plate (108) (shown here as a section) also serves as a counter electrode for the substrate (106) or the lower electrode / substrate holder (107). The lower electrode / substrate holder (107) can accommodate a single substrate (106) or a plurality of substrates (106). The processing chamber (101) is configured to accommodate substrates (106) of a matrix arrangement and to enable plasma-enhanced chemical vapor deposition on the substrates (106).

[0009] The aforementioned supply / discharge openings are designed as valves (102) to separate the transfer chamber (103) and the processing chamber (101) from each other in a gas-tight manner or to seal them gas-tight to the environment, so that pressure adjustment and gas separation between different gas and pressure conditions can take place in the transfer chamber (103) towards the processing chamber (101).

[0010] The substrates (106) are transported into the processing chamber (101) via a substrate gripper (105). When the substrate gripper (105) is in the processing chamber (101), a movable plunger (107.2) is raised to transfer the substrates (106) to the substrate receptacle (107) and picks them up. The substrate gripper (104) is then moved out of the processing chamber (101) and the valve (106) is closed. The plunger (107.2) is lowered so that it forms a closed substrate receptacle (107) and thus a closed electrode with the frame structure (107.1), which is moved into the desired processing position relative to the gas distribution plate (108) (upper electrode). After processing, the processing chamber (101) is unloaded in reverse order.

[0011] The gas distribution plate (108) is connected to an inner surface of the lid assembly or to the side walls, but is electrically insulated from the chamber body (101.1) and electrically connected to the power source. The gas distribution plate (108) is typically made of aluminum and includes a perforated area through which process and other gases supplied by the gas source (101.2) are directed into the processing area. Depending on different process requirements, the perforated area of ​​the gas distribution plate (108) can be designed to achieve a homogeneous gas distribution. The power source is connected to the gas distribution plate (108), which serves as the counter electrode to the substrate. An electric field is applied between the substrate (106) to be coated and the counter electrode / gas distribution plate (108), thereby igniting a plasma.

[0012] Exemplary embodiment of the transfer chamber (103) ( Fig. 2 a (top view) and Fig. 2b (side view): The transfer chamber (103) contains at least one telescopic ash system consisting of at least one transport arm (201) which is attached to a movable carriage (202).

[0013] At least one movable carriage (203) is attached to the transport arm (201). A substrate gripper (204) is attached to this movable carriage (203).

[0014] The movable carriage (202) is preferably driven by a motor (207) via a drive roller (206) by a metal band (205) and guided by a deflection roller (215). The metal band (205) is attached to the carriage (202) at a fastening point (211).

[0015] Another metal band (208) connects both transport carriages (202 and 203) at at least one connection point (209 and 210) and is guided over two deflection rollers (216).

[0016] The transport arm (201) is moved via a rack and pinion mechanism consisting of a gear (212) and two racks (213 and 214).

[0017] Another embodiment of the transfer chamber (103) is shown in Fig. 3a (top view) and Fig. 3b (side view) is shown.

[0018] The transfer chamber (103) contains at least one telescopic axis system consisting of at least one transport arm (301) which is attached to a movable carriage (302).

[0019] At least one movable carriage (303) is attached to the transport arm (301). A substrate gripper (304) is attached to this movable carriage (303).

[0020] The movable carriage (302) is driven by a linear motor (305). The linear motor (305) is attached to the carriage (302) by the rotor (305.1). The stator (305.2) is rigidly connected to a frame (306). The frame (306) can be a separate insert in the transfer chamber or the basic structure of the transfer chamber (102). (102)

[0021] A metal band (307) connects both transport carriages (302 and 303) at at least one connection point (308 and 309) and is guided over two deflection rollers (310).

[0022] The transport arm (301) is moved via a rack and pinion mechanism consisting of a gear (311) and two racks (312 and 313).

[0023] Another embodiment of the transfer chamber (103) is shown in Fig. 4a and Fig. 4b shown.

[0024] The transfer chamber (103) contains at least one telescopic axis system consisting of at least one transport arm (501) which is attached to a movable carriage (402).

[0025] At least one movable carriage (503) is attached to the transport arm (501). A substrate gripper (504) is attached to this movable carriage (503).

[0026] The movable carriage (502) is driven by a linear actuator (507). The linear actuator's runner is connected to the carriage (502). The linear actuator is rigidly connected to a frame (505). The frame can be a separate insert in the transfer chamber or the basic structure of the transfer chamber. The runner can be advanced, for example, by a spindle drive or a belt drive. A metal belt (508) connects both transport carriages (502 and 503) at at least one connection point (509 and 510) each. The transport arm (501) is moved via a rack and pinion mechanism consisting of a gear (512) and two racks (513 and 514).

Claims

A transport device for a vacuum system for plasma-enhanced chemical vapor deposition (PECVD) in a linear arrangement, comprising at least one transfer chamber and a coating chamber, wherein the transfer chamber has at least two opposing openings that can each be opened and closed via a valve, and at least one opening in the coating chamber is connected to one of the valves, and wherein a transport system is located in the transfer chamber with which one or more substrate carriers are moved to carry substrates to be treated, and the substrate holder attached to the transport arm is not located in the coating chamber during the coating of the substrates, is characterized in that the transport device consists of a linear telescopic axis system and the telescopic axis system has a mechanism installed in the transfer chamber.with a first movable carriage to which a movable transport arm to which a further movable carriage is connected to the first movable carriage via a metal band, and the feed movement of the first movable carriage is transmitted to the at least one transport arm via a rack and pinion drive. Transport device according to claim 1, characterized in that at least one carriage is moved by means of a linear motor, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 1, characterized in that at least one carriage is moved via a belt drive, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 1, characterized in that at least one carriage is moved via a belt drive, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 1, characterized in that at least one carriage is moved via a spindle drive, to which at least one movable transport arm is attached via sliding rails. A transport device for a vacuum system for plasma-enhanced chemical vapor deposition (PECVD) in a linear arrangement, comprising at least one transfer chamber and a coating chamber, wherein the transfer chamber has at least two opposing openings that can each be opened and closed via a valve, and at least one opening in the coating chamber is connected to one of the valves, and wherein a transport system is located in the transfer chamber with which one or more substrate carriers are moved to carry substrates to be treated, and the substrate holder attached to the transport arm is not located in the coating chamber during the coating of the substrates, is characterized in that the transport device consists of a linear telescopic axis system and the telescopic axis system has a mechanism installed in the transfer chamber.with at least one movable carriage to which at least one movable transport arm is connected, to which at least one further movable carriage is connected, which is moved via a spindle drive. Transport device according to claim 6, characterized in that at least one carriage is moved by means of a linear motor, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 6, characterized in that at least one carriage is moved via a belt drive, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 6, characterized in that at least one carriage is moved via a spindle drive, to which at least one movable transport arm is attached via sliding rails. A transport device for a vacuum system for plasma-enhanced chemical vapor deposition (PECVD) in a linear arrangement, comprising at least one transfer chamber and a coating chamber, wherein the transfer chamber has at least two opposing openings that can each be opened and closed via a valve, and at least one opening in the coating chamber is connected to one of the valves, and wherein a transport system is located in the transfer chamber with which one or more substrate carriers are moved to carry substrates to be treated, and the substrate holder attached to the transport arm is not located in the coating chamber during the coating of the substrates, is characterized in that the transport device consists of a linear telescopic axis system and the telescopic axis system has a mechanism installed in the transfer chamber.with a movable first carriage to which at least one movable transport arm is attached, to which a further movable carriage is connected via a metal band to the movable first carriage, and the feed movement of the transport arm is carried out by a linear motor. Transport device according to claim 10, characterized in that at least one carriage is moved via a spindle drive, to which at least one movable transport arm is attached via sliding rails. Transport device according to claim 10, characterized in that at least one carriage is moved by means of a linear motor, to which at least one movable transport arm is attached via sliding rails.

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