soldering iron device

Abstract

The invention relates to a soldering iron device 100 comprising a contact element 10, a holding element 20, and a connecting screw 30, wherein the contact element 10 has a contact tip 11 and is designed to emit heat for a soldering process by means of the contact tip 11, wherein the holding element 20 has a receptacle 21 for the contact element 10 and the contact element 10 has a counter surface 12 corresponding to the receptacle 21, wherein the receptacle 21 has a toothing 22, wherein at least the toothing 22 of the receptacle 21 of the holding element 20 has a greater strength than the contact element 10, and wherein the contact element 10 and the holding element 20 are pressed together by means of the connecting screw 30, wherein the toothing 22 of the receptacle 21 is pressed into the counter surface 12.

Description

[0001] The invention relates to a soldering iron device.

[0002] Soldering irons have a contact element that is suitable for heating a solder or the soldering point. The contact element can be heated in a variety of ways. One way to heat the contact element is to direct a gas jet created by combustion onto the contact element. The gas transfers the heat it acquires from the combustion to the contact element when it hits it. To heat the solder or the soldering point using the contact element, precise positioning of the contact element relative to the solder and, at the same time, relative to the gas source is important. To ensure this precise positioning of the contact element, the contact element is connected to a holder. The contact element and the holder are held together by a retaining pin.Due to the expansion of the contact element during heating and the contraction of the contact element after use, play occurs between the contact element and the holder despite the pinning. As a result of this play, relative movement between the contact element and the holder is possible. Such play between the contact element and the holder reduces the precision of the soldering iron device, diminishes the quality of the work that can be performed with the soldering iron device, and increases the maintenance effort of the soldering iron device.

[0003] The object of the invention is to ensure the precision of a soldering iron device over the lifetime of the soldering iron device.

[0004] This object is achieved by a soldering iron device according to claim 1. By means of the soldering iron device according to the invention, the risk of the connection between a contact element and a holding element becoming loose over the number of heating cycles of the contact element is minimized. Thus, the play between the contact element and the holding element, which increases over the number of heating cycles of the contact element, is reduced. This ensures that the precision of the soldering iron device is maintained over the lifetime of the soldering iron device and reduces the maintenance effort for the soldering iron device.

[0005] The soldering iron device comprises a contact element, a holding element, and a connecting screw. The contact element has a contact tip. The contact element is configured to emit heat for a soldering process via the contact tip. In order to be heated, the contact element can be connected to a torch or another heat source via the holding element, wherein the holding element preferably has a rod-shaped section. The rod-shaped section serves to fasten and hold the contact element to the torch or the heat source. In particular, an open design is provided in which a heat transfer path between the heat source and the contact element is not encapsulated.

[0006] The mounting element has a receptacle for the contact element. The contact element has a mating surface corresponding to the receptacle. The receptacle has a toothing. At least the toothing of the mounting element's receptacle is stronger than the contact element. The contact element and the mounting element are pressed together by means of the connecting screw. The toothing of the receptacle is pressed into the mating surface.

[0007] The contact surface is not exclusively understood as a two-dimensional, flat surface, but also has a depth into the material of the contact element. At a minimum, the counter surface of the contact element extends into the contact element to the depth at which the teeth are pressed into the contact element when screwed to the contact element. The teeth of the holder element's receptacle can have both tapered teeth and teeth with round heads that resemble the shape of a sine wave.

[0008] When the contact element and the mounting element are screwed together, the teeth of the holder are pressed into the mating surface. The teeth displace part of the contact element's material in the mating surface. This creates a mating toothing on the mating surface that precisely matches the teeth of the holder. This precise interlocking of the mating toothing and the toothing prevents any relative movement between the contact element and the mounting element.

[0009] Subclaims show preferred embodiments of the invention.

[0010] The toothing of the receptacle is preferably rotationally symmetrical and / or rotationally symmetrical. The toothing has a first axis of symmetry. The toothing of the receptacle is particularly preferably frustoconical. An advantage of this embodiment can be that, with a rotationally symmetrical and / or rotationally symmetrical design of the toothing, a symmetrical engagement of the toothing of the receptacle with the counter surface and thus a uniform distribution of the force transmission between the holding element and the contact element is achieved. Furthermore, with a frustoconical design of the toothing, positioning of the contact element relative to the holding element is facilitated.An object is considered to be rotationally symmetric if the object is imaged onto itself at any angle of rotation and is considered to be rotationally symmetric if the object is imaged onto itself again when the object is rotated by a fixed angle of rotation less than 360°.

[0011] Preferably, the toothing of the receptacle is arranged on the inside of a recess in the mounting element. Thus, a root of the toothing is located farther from the first axis of symmetry than a head of the toothing. An advantage of this embodiment may be that the toothing is better protected from environmental influences, such as dirt, than if the toothing were arranged on the outside of the mounting element.

[0012] Preferably, a second axis of symmetry of the connecting screw corresponds to the first axis of symmetry of the toothing of the receptacle. The connecting screw extends through the receptacle. The diameter of the tip circle of the toothing is larger than the outer diameter of the bolt of the screw. An advantage of this embodiment can be that the soldering iron device can be designed as compactly as possible. Another advantage of this embodiment can be that the toothing is subjected to symmetrical force by screwing the contact element to the holding element. This reduces asymmetric distortion of the contact element and the holding element.

[0013] Preferably, the counter surface is rotationally symmetrical and / or rotationally symmetrical. An advantage of this embodiment may be the low manufacturing effort of a rotationally symmetrical and / or rotationally symmetrical counter surface.

[0014] Preferably, the contact element has a guide pin, and the mounting element has a corresponding guide bore. The guide bore is configured to guide the guide pin along a joining direction. An advantage of this embodiment can be that, by means of the guide pin and the guide bore, a relative movement of the contact element to the mounting element is restricted or completely prevented even before initial contact between the toothing and the mating surface. This simplifies the joining of the contact element and the mounting element.

[0015] Preferably, the guide bore adjoins the receptacle along the joining direction. The guide pin adjoins the mating surface along the joining direction. One advantage of this embodiment may be that the soldering iron device is designed to be as compact as possible.

[0016] The guide pin is preferably configured to be rotationally symmetrical and / or rotationally symmetrical, in particular cylindrical. The guide pin has a first diameter. The counter surface is configured to be rotationally symmetrical and / or rotationally symmetrical, in particular cylindrical. The counter surface has a second diameter. The first diameter is equal to or smaller than a third diameter, which corresponds to the smallest diameter of the toothing of the receptacle. This allows for simple production of the guide pin and the counter surface.

[0017] Particularly preferably, a first partial surface of the mating surface is aligned perpendicular to the joining direction. A second partial surface of the mating surface is aligned parallel to the joining direction. One advantage of this embodiment can be that this arrangement of the first partial surface and the second partial surface of the mating surface allows the pressing in of different toothings, since a section of the first partial surface or the second partial surface is always aligned with the toothing. Because the first diameter is smaller than the second diameter, the toothing can be brought closer to the mating surface without damaging the guide pin.

[0018] Particularly preferably, the guide pin and / or the counter surface are configured as cylindrical base bodies with flattened portions, in particular rotationally symmetrically arranged flattened portions of the base body. The first diameter always represents the greatest distance between two points on the surface of the guide pin in a plane oriented normal to the third axis of symmetry. The second diameter always represents the greatest distance between two points on the counter surface in a plane oriented normal to the fourth axis of symmetry. An advantage of this embodiment may be that the flattened portions of the cylindrical base bodies of the guide pin and the counter surface enable particularly easy insertion of the guide pin into the mounting element.

[0019] Preferably, the contact element has better thermal conductivity than the support element. In particular, the contact element is made of copper or a copper alloy. An advantage of this embodiment may be that rapid heating and cooling of the contact element can be achieved without increasing the clearance between the support and the contact element. Furthermore, the support element can be selected from a material with properties that are better suited to the function of the support element, such as a material with higher strength or lower material costs.

[0020] The contact element preferably has a recess. The recess is configured to absorb heat from a gas stream. The recess is preferably designed as a blind hole and is configured to absorb the gas stream. An advantage of this embodiment can be that the recess increases the surface area for contact and thus for heat transfer between the gas stream and the contact element. This allows for particularly efficient heat transfer between the heating gas and the contact element.

[0021] Preferably, the toothing of the receptacle has a plurality of equally pronounced teeth. An advantage of this embodiment can be that pressing the toothing of the receptacle into the mating surface leads to a uniform distribution of force in the holding element and the contact element during the pressing-in process. As a result, distortion of both the contact element and the holding element is prevented.

[0022] Preferably, the toothing is arranged on an outer side of the mounting element. One advantage of this embodiment may be the ease of manufacturing the toothing.

[0023] Preferably, the first diameter of the guide pin is smaller than the diameter of the tip circle of the toothing when the toothing is arranged on the inside of the recess of the holding element.

[0024] Further details, advantages, and features of the present invention will become apparent from the following description of exemplary embodiments with reference to the drawings. It shows: Fig. 1 is a schematic cross-sectional view of an unassembled soldering iron device according to an embodiment of the invention, and Fig. 2 a schematic representation of the assembled soldering iron device according to the embodiment of the invention.

[0025] Fig. 1 shows a schematic representation of a cross section of an unassembled soldering iron device 100 according to an embodiment of the invention.

[0026] The soldering iron device 100 has a contact element 10, a holding element 20, and a connecting screw 30. The contact element 10 has a contact tip 11. The contact element 10 is configured to emit heat for a soldering process by means of the contact tip 11. The holding element 20 has a receptacle 21 for the contact element 10. The contact element 10 has a counter surface 12 corresponding to the receptacle 21. The receptacle 21 has a toothing 22. At least the toothing 22 of the receptacle 21 of the holding element 20 has greater strength than the contact element 10. The contact element 10 and the holding element 20 are pressed together by means of the connecting screw 30. The toothing 22 of the receptacle 21 is pressed into the counter surface 12.

[0027] The toothing 22 of the receptacle 21 is arranged on an inner side 23a of a recess 23 in the mounting element 20. The toothing 22 of the receptacle 21 is frustoconical. The toothing 22 has a first axis of symmetry 22a. A second axis of symmetry 30a of the connecting screw 30 corresponds to the first axis of symmetry of the toothing 22 of the receptacle 21. The connecting screw 30 extends through the receptacle 21. For this purpose, a through-opening 25 is provided in the mounting element 20, which is wider than the bolt of the connecting screw 30 and narrower than the head of the connecting screw 30. This prevents the screw from slipping through the through-opening 25.

[0028] The contact element 10 has a guide pin 13, and the holding element 20 has a corresponding guide bore 24. The guide bore 24 is configured to guide the guide pin 13 along a joining direction 40. The guide bore 24 adjoins the receptacle 21 along the joining direction 40. The guide pin 13 adjoins the mating surface 12 along the joining direction 40. The through-opening 25 adjoins the guide bore 24 in the joining direction 40.

[0029] The guide pin 13 is rotationally symmetrical, designed as a cylindrical base body with flattened portions. The guide pin 13 has a first diameter 13a. The guide pin 13 has an internal thread 15 for receiving the connecting screw 30. The counter surface 12 is rotationally symmetrical, designed as a cylindrical base body with flattened portions. The counter surface 12 has a second diameter 12c. The first diameter corresponds to a third diameter (22b), which corresponds to the smallest diameter of the toothing 22 of the receptacle 21. A first partial surface 12a of the counter surface 12 is aligned normal to the joining direction 40. A second partial surface 12b of the counter surface 12 is aligned parallel to the joining direction 40. The first diameter 13a always represents the greatest distance between two points on the surface of the guide pin 13 in a plane that is aligned normal to the third axis of symmetry 13b.The second diameter 12c always represents the greatest distance between two points on the opposing surface 13d in a plane which is aligned normal to the fourth axis of symmetry 12d.

[0030] A support surface 14 adjoins the mating surface 12 and is aligned perpendicularly to the joining direction 40. The holding element 20 can be guided onto the contact element 10 until an end face 26 of the holding element 20, on which the recess 23 is located, rests on the support surface 14.

[0031] The contact element 10 has better thermal conductivity than the support element 20. The contact element 10 has a recess 16. The recess 16 is configured to absorb heat. The recess 16 is configured as three bores. The support element 20 has a fastening rod 27, which can be attached to a gas soldering iron or burner (not shown) for generating heat.

[0032] If the contact element 10 and the holding element 20 are not yet screwed together, the counter surface 12 has a smooth shape. For proper assembly of the soldering iron device 100, the contact element 10 is first guided in the joining direction 40 towards the holding element 20 until the guide pin 13 tapers at the guide bore 24. This process is supported by the truncated cone shape of the teeth 22 of the receptacle 21. The connecting screw 30 is then inserted through the through-hole 25 of the contact element 10, through the guide bore 24 into the internal thread 15. By screwing the connecting screw 30 into the internal thread 15, the contact element 10 and the holding element 20 are brought together. In this case, the toothing 22 is pressed into the counter surface 12 and deforms the contact element 10 on the counter surface 12, so that a counter toothing corresponding to the toothing 22 is formed on the counter surface 12.This results in a precisely fitting shape of the counter-toothing of the contact element 10 and the counter surface, which prevents rotation of the contact element 10 relative to the holding element 20 about the first axis of symmetry 22a in an unheated state of the contact element 10. When the contact element 10 is heated, the material of the contact element 10 expands more than the material of the holding element 20. In conjunction with the screw connection of the contact element 10 to the holding element 20 by means of the connecting screw 30, the counter-toothing further prevents rotation of the contact element 10 relative to the holding element 20 about the first axis of symmetry 22a.

[0033] Fig.2 shows a schematic representation of the assembled soldering iron device 100 according to the exemplary embodiment of the invention. The recesses 16 of the contact element 10 are designed as blind holes and are configured to absorb a heat flow from a gas stream. The recesses increase the surface area that absorbs the thermal energy of the gas stream. This improves heat transfer from the gas to the contact element 10. The mounting element 20 is firmly screwed onto the contact element 10 so that the end face 26 of the mounting element 20 rests on the support surface 14. The contact element 10 has a handle structure 17 for better handling of the contact element.

[0034] In addition to the above written description of the invention, reference is hereby explicitly made to the graphic representation of the invention in the figures for its supplementary disclosure. List of reference symbols 10 Contact element 11 Contact tip 12 Counter surface 12a first partial area 12b second partial area 12c second diameter 12d fourth axis of symmetry 13 guide pins 13a first diameter 13b third axis of symmetry 14 Support surface 15 internal threads 16 Recess 16a Receiving borehole 17 Handle structure 20 mounting element 21 recording 22 Gearing 22a first axis of symmetry 22b third diameter 23 Recess 23a Inside 24 guide hole 25 passage opening 26 Front side of the mounting element 27 Mounting rod 30 connecting screw 30a second axis of symmetry 40 joining direction 100 soldering iron device

Claims

[1] Soldering iron device (100) comprising • a contact element (10), • a support element (20), and • a connecting screw (30), • wherein the contact element (10) has a contact tip (11) and is designed to emit heat for a soldering process by means of the contact tip (11), • wherein the holding element (20) has a receptacle (21) for the contact element (10) and the contact element (10) has a counter surface (12) corresponding to the receptacle (21), • wherein the receptacle (21) has a toothing (22), • wherein at least the toothing (22) of the receptacle (21) of the holding element (20) has a greater strength than the contact element (10), and • wherein the contact element (10) and the holding element (20) are pressed together by means of the connecting screw (30), wherein the toothing (22) of the receptacle (21) is pressed into the counter surface (12). [2] Soldering iron device (100) according to claim 1, characterized by that the toothing (22) of the receptacle (21) is rotationally symmetrical and / or rotationally symmetrical, in particular frustoconical, and the toothing (22) has a first axis of symmetry (22a). [3] Soldering iron device (100) according to one of the preceding claims, characterized by that the toothing (22) of the receptacle (21) is arranged on an inner side (23a) of a recess (23) of the holding element (20). [4] Soldering iron device (100) according to one of the preceding claims 2 or 3, characterized by that a second axis of symmetry (30a) of the connecting screw (30) corresponds to the first axis of symmetry (22a) of the toothing (22) of the receptacle (21) and the connecting screw (30) runs through the receptacle (21). [5] Soldering iron device (100) according to one of the preceding claims, characterized bythat the counter surface (12) is rotationally symmetrical and / or rotationally symmetrical. [6] Soldering iron device (100) according to one of the preceding claims, characterized by that the contact element (10) has a guide pin (13) and the holding element (20) has a corresponding guide bore (24), wherein the guide bore (24) is designed to guide the guide pin (13) along a joining direction (40). [7] Soldering iron device (100) according to claim 6, characterized by that the guide bore (24) adjoins the receptacle (21) along the joining direction (40) and that the guide pin (13) adjoins the counter surface (12) along the joining direction (40). [8] Soldering iron device (100) according to claim 7, characterized by , that • the guide pin (13) is rotationally symmetrical and / or rotationally symmetrical, in particular cylindrical, and has a first diameter (13a), and • the counter surface (12) is rotationally symmetrical and / or rotationally symmetrical, in particular cylindrical, and has a second diameter (12c), [9] Soldering iron device (100) according to one of the preceding claims, characterized by that the contact element (10) has a better thermal conductivity than the holding element (20). [10] Soldering iron device (100) according to one of the preceding claims, characterized by that the contact element (10) has a recess (16), wherein the recess (16) is designed to absorb heat.

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