Vehicle camera with a specifically designed heat-conducting material chain on a circuit board, and method for mounting a vehicle camera

Abstract

One aspect of the invention relates to a vehicle camera (1) with a housing (2) and with a circuit board (6) which is arranged in the housing (2), wherein the circuit board (6) has a carrier (11) made of a base material (12) and has a material layer (13) which is applied to the base material (12), wherein the material layer (13) has a higher thermal conductivity than the base material (12), wherein the circuit board (6) has a main zone (14) and at least one secondary zone (15, 16, 17, 18) and a hole (19, 20, 21, 22) for a mounting pin (9) is formed in the secondary zone (15 to 18), wherein the material layer (13) is interrupted between the main zone (14) and the secondary zone (15 to 18) in a separating region (23), so that a first material layer region (14b) and a second material layer region separated therefrom (15b, 16b, 17b, 18b) is formed,and in the finished final state of the board (6), this separation area (23) is at least partially filled with a connecting material (24), so that the material layer areas (14b, 15b, 16b, 17b, 18b) are connected by the connecting material (24).

Description

[0001] One aspect of the invention relates to a vehicle camera with a housing and a circuit board arranged in the housing. The circuit board has a carrier or carrier plate made of a base material and at least one material layer applied to the base material. The material layer has a higher thermal conductivity than the base material. The circuit board has a main zone and at least one secondary zone. A hole for attaching a mounting pin of the vehicle camera is formed in the secondary zone. Another aspect of the invention relates to a method for mounting a vehicle camera.

[0002] Vehicle cameras come in a wide variety of designs. They are typically very compact in design to allow for space-saving installation on a vehicle. Furthermore, such a vehicle camera must be able to withstand a wide range of environmental conditions while also being highly functional for capturing information, such as the vehicle's surroundings. Therefore, a wide variety of robust components are required for such a vehicle camera. Due to these requirements, however, waste heat can be generated during operation of the vehicle camera, particularly an image sensor in the vehicle camera, which must be dissipated. This is to ensure the long-term functionality of the camera and to avoid corresponding functional impairments, for example due to excessive temperatures.

[0003] Therefore, appropriate thermal management of the vehicle camera during operation is required, and sufficient heat dissipation must be provided. Furthermore, due to the compact size and the required components, assembly conditions must also be observed during production. In this context, it is also necessary to prevent unwanted impairment of camera components during production, so that unwanted functional impairments can be avoided right from the start.

[0004] It is an object of the present invention to provide a vehicle camera and a method for mounting such a vehicle camera, in which or with which the thermal management is improved and the functionality of the vehicle camera in the finished state is made possible without restriction.

[0005] This object is achieved by a vehicle camera and a method according to the independent claims.

[0006] One aspect of the invention relates to a vehicle camera with a housing and a circuit board arranged in the housing. The circuit board has a carrier or carrier plate made of a base material and at least one material layer applied to the base material. The material layer has a higher thermal conductivity than the base material. The circuit board has a main zone and at least one secondary zone. A hole for attaching a mounting pin of the vehicle camera is formed in the secondary zone.

[0007] This material layer is interrupted between the main zone and the at least one secondary zone in a separation region. This forms a first material layer region of this material layer and a second material layer region of this material layer, separated from it. These material layer regions are therefore designed to be contact-free with one another in their basic configuration and attachment to the base material. In the final manufactured state of the circuit board, this separation region between the two material layer regions is at least partially filled with a connecting material. This filling of the separation region is such that the material layer regions are connected to one another by this connecting material, in particular they are directly connected in a thermally conductive manner.This connecting material thus forms a separate material region, both materially and / or geometrically, which in the manufactured state acts as a material connecting bridge between the material layer regions. This connecting material creates a thermally conductive connection between the material layer regions. This enables these two material layer regions and the connecting material to form an overall layer as a material chain with high thermal conductivity. This enables heat, such as waste heat generated by a component of the vehicle camera, such as an image sensor, during operation of the vehicle camera, to be dissipated from the main zone to the secondary zone via this connecting material.This waste heat is then conducted from the first material layer region, which is formed in the main zone, via this connecting material to the second material layer region, which is formed in the secondary zone. This then also makes it possible for this waste heat to be dissipated from the circuit board, because from this secondary zone this waste heat can be dissipated from the circuit board via the mounting pin, which is thermally coupled to the second material layer region, in particular directly connected. This achieves highly effective thermal management for dissipating waste heat away from the circuit board in the final manufactured state of the vehicle camera. On the other hand, however, this concept also makes it possible to avoid undesirably high heat impairment, in particular in the main zone, during assembly of the vehicle camera.In particular, it is provided that thermal energy is introduced when the mounting pin is inserted into the hole in the secondary zone. In particular, when the mounting pin is fastened in the hole in the secondary zone, for example using solder, this results in at least a brief exposure to thermal energy on the circuit board and in particular on the material layer with higher thermal conductivity. This is done, for example, using a laser. If such a separation area between the material layer regions were not formed, this thermal exposure would essentially transfer to the entire material layer during production. This would result in a heat-sensitive component, in particular one already mounted on the circuit board, such as an image sensor arranged in the main zone, being thermally impaired and thus possibly impairing the functionality of this component.In order to counteract such undesirable potential influences during production of the vehicle camera, in particular of the circuit board, the separation zone in the material layer is particularly advantageous, as these two material layer regions are then completely separated from one another and are formed in specific areas of the base material, namely the main zone on the one hand and the secondary zone on the other. This means that during production of the vehicle camera, the mounting pin can be easily installed even when exposed to thermal energy in the secondary zone, as such a transfer of the thermal energy required here due to production does not reach the main zone and thus the first material layer region of this material layer. This also particularly advantageously achieves improved thermal management during production, particularly in the area of the circuit board.

[0008] Thus, this concept, particularly regarding the circuit board and the material layer with the connecting material, achieves improvements both during the production of the vehicle camera and in the final finished state. This nevertheless does justice to both important aspects, which in a sense are counteracting and come into focus at different stages of the vehicle camera's lifespan, and can be very advantageously supported by this new vehicle camera concept.

[0009] In one embodiment, the connecting material is a meltable material. This allows for the targeted introduction of thermal energy into the connecting material to melt it very easily, so that this separating region is then also filled by the melting connecting material and a corresponding material connection occurs between the connecting material and both material layer regions. This also creates a suitable connecting bridge between the material layer regions in a particularly advantageous manner. In particular, the thermal conductivity of this overall system comprising the two material layer regions and the connecting material is very high. The connecting bridge in particular therefore represents a material region in this overall construct or structure that has high thermal conductivity.In particular, the bonding material has a thermal conductivity that ranges between 80% and 120% of the thermal conductivity of the material layer. The bonding material can be a solder material.

[0010] Therefore, the joining material is preferably a material that exhibits a high thermal conductivity compared to the base material. Therefore, the thermal conductivity of the joining material is also higher than the thermal conductivity of the base material.

[0011] The connecting material can also be a material that disperses, in particular flows, but is not a soldering material.

[0012] In one embodiment, the base material can be an epoxy material. This has a significantly lower thermal conductivity compared to a material layer that at least partially contains metal. Therefore, the proposed concept does not require this base material to be separated into specific base material layer regions. This is because during the manufacture of the vehicle camera, in particular during assembly of the mounting pin in the hole of the secondary zone, high thermal energy is generated only briefly. Due to the lower thermal conductivity of this base material, no situation arises during production in which thermal energy would reach the main zone via this base material at an undesirable level and thermally influence an assembled component, such as an image sensor.For this reason, the concept of this separation into areas is intended and necessary only for this material situation and is also advantageous in this respect.

[0013] In one embodiment, the connecting material is electrically conductive. In particular, it is metal or a metal-containing material. This also ensures that the material layer, which can be made of metal or a metal-containing material, exhibits not only high thermal conductivity but also electrical conductivity.

[0014] In one embodiment, the connecting material is formed as a connecting strip in the final manufactured state. This creates a relatively narrow structure. On the one hand, relatively little connecting material is required to create this connection between the material layer regions. On the other hand, such a strip-like shape nevertheless enables a specific planar connection of the material layer regions over a specific length. This length is oriented perpendicular to the direction in which these material layer regions are oriented, in particular, facing one another.

[0015] This separation area and thus in particular by this finished connecting material, in particular as a connecting strip, a structure is created which is narrower in a direction in which the first material layer area, then the connecting material and then the second material layer area are arranged in series, than in the other spatial direction perpendicular to this, which also extends in the plane in which the circuit board is spanned.

[0016] In one exemplary embodiment, the connecting material is provided as a material depot in the separation region before the final manufactured state, and in particular before the action to create the connection geometry for connecting the two material layer regions. However, this material depot is arranged without contact with the material layer regions. This means that during the manufacture of the vehicle camera, this connecting material is already arranged on the circuit board, in particular on the base material in the separation region, before the mounting pin is fastened in the hole in the secondary zone. This particularly advantageously enables the circuit board to be prefabricated with regard to its essential material components before the mounting pin is attached. Due to this material depot in the specific arrangement in the separation region, a thermal separation is also provided between the material layer regions and this material depot.Nevertheless, this required bonding material is already present locally and specifically on the board. In particular, this also ensures that after the mounting pin has been secured in the hole of the secondary zone, the bonding material does not need to be applied to the board. Instead, it is already present and only needs to be deformed, in particular melted, by specific local thermal action in order to then create a bond between the two material layer areas.

[0017] In one embodiment, the material layer is made of a metal, in particular it comprises at least a portion of copper. Copper is particularly advantageous in that it has very high thermal conductivity. This achieves particularly advantageous thermal management in the vehicle camera. On the other hand, copper also achieves a corresponding electrical conductivity. In particular, copper is also relatively robust in terms of processing and also very resistant to corresponding influences on the vehicle camera. This enables particular robustness and permanently high functionality, especially in this exposed layer, namely this specific material layer.

[0018] In one embodiment, the main zone is in particular in contact with an image sensor of the vehicle camera. In particular, this is also in contact with the material layer, in particular the first material layer region. In particular, the contact is a thermal contact. It can also be an electrical contact. In one embodiment, the image sensor is arranged on a first upper side of the circuit board, and the main zone is arranged on a second upper side of the circuit board. The first upper side is opposite the second upper side.

[0019] In one embodiment, the material layer is a heat dissipation layer. It is therefore designed and arranged on the circuit board to enable thermal management. In particular, this heat dissipation layer is intended to conduct waste heat from an image sensor of the vehicle camera arranged on the circuit board to the mounting pin and from there away from the circuit board. This also generates a specifically defined thermal path in the vehicle camera that specifically dissipates the waste heat of the image sensor from the circuit board, particularly through the aforementioned material chain.

[0020] In one embodiment, the material layer is a heat dissipation layer, with which waste heat from an image sensor of the vehicle camera arranged on the circuit board can be conducted to the mounting pin and from there away from the circuit board. Thus, by arranging the two separate material layer regions on the base material and the connecting material connecting the material layer regions in the finished state, a defined thermal heat dissipation path is generated, extending from the main zone to the hole in the secondary zone.

[0021] In one embodiment, the secondary zones are formed as exposed corner regions of the main zone. In particular, the main zone can be quadrangular. In this case, four such secondary zones are formed as corner regions. In one embodiment, the second material layer regions in the secondary zones can be arrowhead-shaped.

[0022] In one embodiment, the connecting material may be metallic solder material.

[0023] The application of thermal energy then enables particularly simple deformation, in particular melting. This achieves a particularly uniform distribution of this bonding material in the separation zone. This also results in a particularly uniform bonding material layer in the finished vehicle camera, so that a homogeneous layer is formed in terms of material and layer thickness. This also supports a particularly advantageous direct connection between the two material layer regions. This also enables thermal management of this chain of material layer regions and the bonding material. This achieves particularly efficient dissipation of waste heat, particularly from a component in the main zone.

[0024] In one embodiment, at least one intermediate material layer is formed internally within the base material. This intermediate material layer has a higher thermal conductivity than the base material. In particular, this intermediate material layer is connected to the material layer by a contact structure. This achieves even more efficient thermal management. This is because it also enables greater and more effective heat dissipation from the main zone, in particular the first material layer region and this intermediate material layer region, to the connecting material and from there to the second material layer region. The dissipation of waste heat in the main zone is thus enabled even more comprehensively and efficiently.

[0025] A contact structure can, for example, be at least one thermal via.

[0026] Another aspect of the invention relates to a method for mounting a vehicle camera. The method comprises, in particular, the following steps: - Providing a circuit board of the vehicle camera with a carrier made of a base material, on which a material layer is applied which has a higher thermal conductivity than the base material; - Creating at least one separation region of the material layer, so that the material layer is interrupted between a main zone of the board and a secondary zone of the board, so that a first material layer region and a second material layer region separated therefrom are formed, - Providing a deformable connecting material as at least one local material depot in the separation area separated from the material layer areas; - connecting at least one mounting pin to at least one hole in the secondary zone; - After fastening the mounting pin in the hole, melt the material deposit so that the connecting material is distributed in the separation area and connects the material layer areas.

[0027] Such a method enables improved installation of the vehicle camera, particularly with regard to thermal management. In particular, the installation of the mounting pin by applying thermal energy in the hole of the secondary zone is thereby very advantageously enabled. On the other hand, the main zone, in particular the first material layer region, is not affected by this thermal energy during installation of the mounting pin. In particular, if the image sensor of the vehicle camera is already arranged on the main zone and is in contact with the first material layer region before the mounting pin is installed, undesirable thermal influences on this image sensor can be avoided.

[0028] In particular, one embodiment provides for the bonding material to be provided as a local material deposit in the separation region before the mounting pin is secured in the hole of the secondary zone, in particular by thermal energy. In particular, this material deposit is created and provided in the separation region in such a way that the material deposit is still arranged separately or apart from the material layer regions.

[0029] In one embodiment, the melted connecting material creates a thermally conductive connecting bridge between the material layer regions, forming a coherent, thermally conductive material chain with which waste heat from an image sensor of the vehicle camera arranged on the circuit board can be conducted from the first material layer region to the finished connecting material and from there to the second material layer region and from there to the mounting pin, in order to then be conducted away from the circuit board via the mounting pin. A particularly specific multi-material and multi-zone thermal energy dissipation path is therefore created on this circuit board. This structure both improves the production of the vehicle camera and particularly advantageously provides for the dissipation of waste heat from the main zone of the circuit board in the finished state of the vehicle camera.

[0030] Vehicle cameras such as satellite cameras, i.e. cameras that are almost exactly the same regardless of where they are mounted on the vehicle, are now manufactured in quantities of several million per year. It is therefore important to continually improve the production process for such cameras and, in particular, to shorten it. Every second by which the production of such a camera can be reduced is important. For this reason, the practice of gluing the lens module to the housing has been abandoned during production. Instead, the lens module is preferably screwed firmly to the housing. The positioning of the image sensor relative to the lens module is achieved by first arranging the circuit board with the image sensor relative to the lens module, in particular relative to the lenses of the lens module, and once this has been achieved, the circuit board is firmly connected to the housing via the mounting pins using a soldering process.

[0031] It is important to note that even with such high production volumes, each lens module is never perfectly identical. This means that the positioning of the image sensor relative to the lens module is always specific to each individual camera and can only be achieved in the best possible way by electronically connecting the circuit board with the image sensor during the manufacturing process and using specific target objects to find the optimal position relative to the lenses of the lens module. This is achieved in particular by moving the circuit board in all degrees of freedom. The circuit board is already positioned in its final position, and the mounting pins, which are firmly attached to the housing, already protrude through the holes in the circuit board. The movement of the circuit board can be generated by a robot in the production line.

[0032] Therefore, the holes in the circuit board are preferably large enough to allow such movement of the circuit board, even though the mounting pins already protrude through the holes. And only when the optimal optical arrangement has been measured, for example when the image is clear enough for different colors and patterns, is the end of the pins quickly soldered using a laser. This soldering takes place on the side of the circuit board where the image sensor is not located. To minimize the time required for this process, high temperatures must be used, which in turn can lead to damage to the image sensor and / or other electronic components, even if they are located on the other side of the circuit board. The invention is intended in particular to avoid this impairment.

[0033] Embodiments of the invention are explained in more detail below with reference to schematic drawings. They show: Fig. 1 a schematic sectional view through an embodiment of a vehicle camera according to the invention; Fig. 2 a plan view of an embodiment of a circuit board of the vehicle camera according to Fig. 1; and Fig. 3 a simplified sectional view through an embodiment of a circuit board of the vehicle camera 1.

[0034] In the figures, identical or functionally identical elements are provided with the same reference symbols.

[0035] In Fig. 1 shows a schematic representation of a vehicle camera 1. The vehicle camera 1 has a housing 2. This is an outer housing. The housing 2 has a rear housing part or a rear housing part 3 and a separate housing front part 4. The housing 2 forms an interior area 5. Electronic and optical components of the vehicle camera 1 are arranged in the interior area 5. The Fig. 1 shows only a schematic representation, which should not be considered exhaustive with regard to the location and / or completeness of the components. In this regard, the vehicle camera 1 has a lens module L. This lens module L has one or more lenses. The lens module L is arranged in the housing front part 4. The lens module L is screwed into the housing front part 4. It has an external thread that is screwed to an internal thread of the housing front part 4. It extends partially into the interior region 5 and partially out of the interior region 5. In addition, the vehicle camera 1 has a circuit board 6. This is arranged entirely in the interior region 5. At least one electronic component, here an image sensor 7, is arranged on the circuit board 6. In this regard, it is arranged on an upper side 8a of the circuit board 6.

[0036] In the final assembled state of the vehicle camera 1, the upper side 8a faces the lens module L.

[0037] Furthermore, the position, number, and orientation of two mounting pins 9 are shown only as examples and are to be understood schematically. The mounting pins 9 are connected to the circuit board 6. In particular, they can also be connected to other components 10 of the vehicle camera 1. The component 10 is, in particular, a portion of the front housing part 4.

[0038] In Fig. 2 shows an embodiment of the circuit board 6. A plan view of the top side 8a is shown here. The circuit board 6 has a carrier 11, which is a plate. This carrier 11 has a base material 12. This can be made of epoxy, for example. A material layer 13 is applied to this base material 12. The material layer 13 is applied here to a top side 8b. It is an outer layer here. The material layer 13 has a higher thermal conductivity than the base material 12. In particular, the material layer 13 is at least partially made of the material, in particular at least partially made of copper. The top side 8b is opposite the top side 8a.

[0039] The circuit board 6 has a main zone 14. In addition, the circuit board 6 has at least one secondary zone, here several secondary zones 15, 16, 17, and 18. These zones 14 to 18 are formed on the upper side 8b. The secondary zones 15 to 18 are formed here as corner regions of the circuit board 6. The image sensor 7 is arranged opposite the central or middle main zone 14. In this context, it is arranged on the opposite upper side 8a and is in contact with a main zone 14a of the material layer 13, which is arranged on the upper side 8b. The secondary zone 15 also has a secondary zone 15a of the material layer 13.

[0040] Accordingly, further secondary zones 16a, 17a and 18a of the material layer 13 are formed here.

[0041] As can be seen, these secondary regions 15a to 18a of this material layer 13 are exposed areas toward the edge or corner areas. They are particularly arrowhead-shaped.

[0042] Furthermore, it can be seen that a hole 19, 20, 21, and 22 is formed in each of these secondary zones 15 to 18 of the circuit board 6. These holes 19 to 22 extend through the entire circuit board 6. These holes 19 to 22 are intended for the insertion and securing of mounting pins 9.

[0043] For assembly or production of the vehicle camera 1, the circuit board 6 is also initially prepared. For this purpose, the material layer 13 is formed into the first material layer region 14b and the second material layer regions 15b, 16b, 17b, and 18b, which are separated and separated therefrom. The first material layer region 14b thus represents the main zone 14a of the material layer 13. The second material layer regions 15b, 16b, 17b, and 18b represent the secondary zones 15a to 18a of the material layer 13.

[0044] As in Fig. As shown in Figure 2, a separating region 23 is formed between the first material layer region 14b of the material layer 13 and a second material layer region 15b of the material layer 13. The corresponding edges 23a and 23b of the separating region 23 are shown. Such a separating region 23 specifically separates the material layer 13, and the material layer regions 14b and 15b are arranged in a contactless or non-contact manner with respect to one another.

[0045] In addition, Fig. 2 shows that connecting material 24 is arranged in this separation area 23. The connecting material 24 is symbolized here by a material deposit 24a. These are, for example, two deposit strips. This material deposit 24a of the connecting material 24 is arranged and provided in the separation area 23 such that it is also arranged without contact with these material layer areas 14b and 15b. In this context, a situation is shown here in this corner area 15 in which a mounting pin 9 is not yet secured in the hole 19.

[0046] In the original state during production, identical separation areas 23 with edges 23a and 23b are also formed between the first material layer area 14b and the further second material layer areas 16b, 17b, and 18b. In this context, these separation areas 23 are shown only by the dashed edges 23a and 23b.

[0047] This is because in the areas between the first material layer region 14b and the second material layer regions 16b, 17b, and 18b, the respective mounting pin 9 is already mounted or secured in the holes 20, 21, and 22, and, furthermore, the material deposit 24a provided there is also already deformed, in particular melted, during the subsequent manufacturing process. As a result, the connecting material 24 is formed in such a way that a continuous, in particular homogeneous connecting material strip 25, 26, 27 is formed. As a result, the material layer regions 14b and 16b, 17b, and 18b are then thermally conductively connected to one another or directly contacted.

[0048] Thus, starting from the illustration in the lower left corner area of the secondary zone 15, if a mounting pin 9 is subsequently fastened in the hole 19, in particular by the action of thermal energy, in particular by melting a soldering material, no thermal energy transfer takes place from the second material layer area 15b to the first material layer area 14b during this process. Once this mounting pin 9 has been correspondingly mounted in the hole 19, the material deposit 24a can then also be deformed, in particular melted, in a further subsequent step, so that a structure is then formed there too, in particular in the form of a strip-shaped connecting material bridge, as shown by the connecting material bridges 25, 26, and 27.By this melting, it can also be provided that the molten connecting material also flows slightly over the edges 23a and 23b into the respective material layer areas 14b and 15b, 16b, 17b, 18b.

[0049] In particular, this connecting material 24 can be a material that has the same or similar thermal conductivity as the material of the material layer 13. It is also possible for the connecting material 24 to have a lower thermal conductivity than copper.

[0050] Furthermore, in an embodiment as shown in Fig. 2 also includes contact structures 28. For the sake of clarity, these are shown here only in the area between the main zone 14 and the secondary zone 17 with the reference symbol.

[0051] This coupling structure 28 is also formed at the other transitions between the main zone 14 and the secondary zones 15, 16, and 18. This contact structure 28 can be thermal vias. This creates a thermal contact between the material layer 13 formed on the top side 8b and thus on the outside and at least one further intermediate material layer 29, 30 formed inside the base material 12 ( Fig. 3). This intermediate material layer 29 and / or 30 can also be formed from the same material as the material layer 13 applied on the outside. In particular, the intermediate material layer 29 and / or 30 has a thickness between 20 micrometers and 50 micrometers, in particular between 30 micrometers and 40 micrometers, in particular 35 micrometers. The outer material layer 13 preferably also has a similar thickness.

[0052] In Fig. 3 shows a schematic sectional view of the circuit board 6 in a partial area, in particular in the area between the main zone 14 and the secondary zone 15.

[0053] By way of example, it is shown here that the material deposit 24, with the two deposit strips of the material deposit 24a, which are to be understood here as examples and not as exhaustive, can have a height between 100 micrometers and 300 micrometers. The distance between two such deposit strips of the material deposit 24a can be between 200 micrometers and 1000 micrometers. This can also be, for example, the distance between the material deposit 24a and the first material layer region 14b and / or the second material layer region 15b.

[0054] In one embodiment, the circuit board 6, in particular the base material 12 and the material layer 13, can have a thickness of between one millimeter and 1.6 millimeters, as is also shown in Fig. 3 is shown as an example.

[0055] The structure, position and geometry of a separation area 23 and / or a material depot 24a are merely exemplary and not to be understood as exhaustive.

[0056] In particular, the heating of a material, in particular a soldering material, in the region of a hole 19 to 22 for fastening a mounting pin 9 takes place by means of a laser.

[0057] In particular, these contact structures 28 also enable electrical conductivity. In one embodiment, this can also be the primary function of such contact structures 28. Thermal conductivity is then a secondary function.

[0058] In particular, these mounting pins 9 also make it possible for the circuit board 6 to be electrically connected to a ground potential.

Claims

[1] Vehicle camera (1) with a housing (2) and with a circuit board (6) which is arranged in the housing (2), wherein the circuit board (6) has a carrier (11) made of a base material (12) and has a material layer (13) which is applied to the base material (12), wherein the material layer (13) has a higher thermal conductivity than the base material (12), wherein the circuit board (6) has a main zone (14) and at least one secondary zone (15, 16, 17, 18) and in the secondary zone (15 to 18) a hole (19, 20, 21, 22) for a mounting pin (9) is formed, characterized bythat the material layer (13) between the main zone (14) and the secondary zone (15 to 18) is interrupted in a separating region (23), so that a first material layer region (14b) and a second material layer region (15b, 16b, 17b, 18b) separated therefrom are formed, and in the finished final state of the circuit board (6) this separating region (23) is at least partially filled with a connecting material (24), so that the material layer regions (14b, 15b, 16b, 17b, 18b) are connected by the connecting material (24). [2] Vehicle camera (1) according to claim 1, characterized by that the connecting material (24) is a meltable material. [3] Vehicle camera (1) according to claim 1 or 2, characterized by that the connecting material (24) has a higher thermal conductivity than the base material (12). [4] Vehicle camera (1) according to one of the preceding claims, characterized bythat the connecting material (24) is designed as a connecting strip in the finished state. [5] Vehicle camera (1) according to one of the preceding claims, characterized by that the connecting material (24) is provided as a material depot (24a) in the separating region (23) before the finished final state, and the material depot (24a) is arranged without contact with the material layer regions (14b, 15b, 16b, 17b, 18b). [6] Vehicle camera (1) according to one of the preceding claims, characterized by that the material layer (13) is made of a metal, in particular at least partially contains copper. [7] Vehicle camera (1) according to one of the preceding claims, characterized by that the main zone (14) is in contact with an image sensor (7) of the vehicle camera (1). [8] Vehicle camera (1) according to one of the preceding claims, characterized bythat the material layer (13) is a heat dissipation layer with which waste heat from an image sensor (7) of the vehicle camera (1) arranged on the circuit board (6) can be conducted to the mounting pin (9) and from there away from the circuit board (6). [9] Vehicle camera (1) according to one of the preceding claims, characterized by that the secondary zones (15 to 18) are designed as exposed corner areas to the main zone (14). [10] Vehicle camera (1) according to one of the preceding claims, characterized by that the connecting material (24) is metallic soldering material. [11] Vehicle camera (1) according to one of the preceding claims, characterized by in that at least one intermediate material layer (29, 30) is formed internally in the base material (12), which intermediate material layer has a higher thermal conductivity than the base material (12), wherein the intermediate material layer (29, 30) is connected to the material layer (13) by means of a contact structure (28), in particular thermal vias. [12] Method for mounting a vehicle camera (1), comprising the following steps: - Providing a circuit board (6) of the vehicle camera (1) with a carrier (11) made of a base material (12), on which a material layer (13) is applied which has a higher thermal conductivity than the base material (12); - producing at least one separation region (23) of the material layer (13) such that the material layer (13) is interrupted between a main zone (14) of the circuit board (6) and a secondary zone (15 to 18) of the circuit board (6), so that a first material layer region (14b) and a second material layer region (15b, 16b, 17b, 18b) separated therefrom are formed, - Providing a deformable connecting material (24) as at least one local material depot (24a) in the separation region (23) separated from the material layer regions (14b, 15b to 18b); - connecting at least one mounting pin (9) to at least one hole (19 to 22) in the secondary zone (15 to 18); - After fastening the mounting pin (9) in the hole (19 to 22), melting the material deposit (24a) so that the connecting material (24) is distributed in the separation area (23) and connects the material layer areas (14b, 15b to 18b). [13] Method according to claim 12, wherein the melted connecting material (24) creates a thermally conductive connecting material bridge between the material layer regions (14b, 15b to 18b), so that a coherent heat dissipation layer is formed, with which waste heat of an image sensor (7) of the vehicle camera (1) arranged on the circuit board (6) is conducted to the at least one mounting pin (9) and from there away from the circuit board (6).

Images