HEAT DISPENSING DEVICE AND ELECTRONIC DEVICE

Abstract

A heat dissipation device comprising: a first branch pipe capable of receiving a heat dissipation medium and configured to carry heat away from a first heat-generating element; a second branch pipe capable of receiving a heat dissipation medium and configured to carry heat away from a second heat-generating element; a connecting pipe, with two ends of the connecting pipe being connected to the first branch pipe and the second branch pipe respectively; and an outlet pipe connected to the connecting pipe.and a movable link that is movably arranged in the connecting pipe and is able to move in the connecting pipe towards the first branch pipe side or the second branch pipe side in order to adapt a communication surface between the first branch pipe and the outlet pipe and a communication surface between the second branch pipe and the outlet pipe, wherein the movable link can move within the connecting pipe due to the pressure of the heat dissipation medium in the first branch pipe and the pressure of the heat dissipation medium in the second branch pipe.

Description

REFERENCE TO RELATED REGISTRATION This application claims priority from Chinese patent application No. 2023101840000, filed on February 24, 2023, the entire contents of which are hereby incorporated by reference. TECHNICAL AREA OF REVELATION The present disclosure relates generally to the field of cooling technology, in particular to a heat dissipation device and an electronic device. TECHNICAL BACKGROUND Heat dissipation devices are frequently used in electronic equipment. However, current heat dissipation devices exhibit a uniform form and limited adaptability. CN 1 10 265 370 A describes a heat dissipation device comprising a first main line, several branch lines, a second main line, and a control component. Each of the several branch lines is connected to the first main line so that a coolant can flow from the first main line into the several branch lines. The second main line is connected to each branch line, and the coolant flows through the branch lines to the second main line and then exits the second main line from the heat dissipation device. BRIEF SUMMARY OF THE REVELATION One aspect of the present disclosure provides a heat dissipation device. The heat dissipation device comprises: a first branch pipe capable of receiving a heat dissipation medium and configured to carry away heat for a first heat-generating element; a second branch pipe capable of receiving a heat dissipation medium and configured to carry away heat for a second heat-generating element; a connecting pipe, with two ends of the connecting pipe being connected to the first branch pipe and the second branch pipe, respectively; and an outlet pipe connected to the connecting pipe.and a movable link movably arranged in the connecting pipe and able to move in the connecting pipe towards the first branch pipe side or the second branch pipe side in order to adapt a communication surface between the first branch pipe and the outlet pipe and a communication surface between the second branch pipe and the outlet pipe, wherein the movable link can move within the connecting pipe due to the pressure of the heat dissipation medium in the first branch pipe and the pressure of the heat dissipation medium in the second branch pipe. Another aspect of the present disclosure provides an electronic device. The electronic device comprises a first heat-generating element, a second heat-generating element, and a heat dissipation device. The heat dissipation device comprises: a first branch pipe capable of receiving a heat-dissipation medium and configured to carry heat away from the first heat-generating element; a second branch pipe capable of receiving a heat-dissipation medium and configured to carry heat away from the second heat-generating element; a connecting pipe, with two ends of the connecting pipe being connected to the first branch pipe and the second branch pipe, respectively; and an outlet pipe connected to the connecting pipe.and a movable link movably arranged in the connecting pipe and capable of moving within the connecting pipe towards the first branch pipe side or the second branch pipe side to provide a communication surface between the first branch pipe and the outlet pipe and a communication surface between the second branch pipe and the outlet pipe. The first branch pipe is configured to dissipate heat for the first heat-generating element. The second branch pipe is configured to dissipate heat for the second heat-generating element, the movable link being able to move within the connecting pipe due to the pressure of the heat-dissipating medium in the first branch pipe and the pressure of the heat-dissipating medium in the second branch pipe. Other aspects of the present disclosure can be understood by a person skilled in the art from the background of the description, claims and drawings of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure; Fig. 2 shows another optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure; Fig. 3 shows another optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure; Fig. 4 shows another optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure; Fig. 5 shows another optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure; and Fig. 6 shows another optional partial diagram of a heat dissipation device according to various embodiments of the present disclosure. List of reference symbols: 110: first branch pipe; 120: second branch pipe; 130: connecting pipe; 131: first pipe section; 132: second pipe section; 133: first limiting chamber; 134: first connection; 135: second connection; 140: movable link; 150: outlet pipe; 160: inlet pipe; 170: first heat dissipation block; 171: first heat dissipation chamber; 172: first inlet; 173: first outlet; 174: first capillary structure; 180: second heat dissipation block; 181: second heat dissipation chamber; 182: second inlet; 183: second outlet; 191: first heat-generating element. DETAILED DESCRIPTION Technical solutions of the present disclosure are further described in detail below with reference to the attached drawings and specific embodiments of the present description. In the embodiments of the present disclosure, the term "connection," unless expressly stated otherwise, is to be understood in a broad sense. For example, the "connection" may be a fixed connection, a detachable connection, or an integral connection; and it may be a direct connection or an indirect connection using an intermediate medium. The person skilled in the art may understand specific meanings of the term depending on the specific circumstances. In the embodiments of the present disclosure, the terms "first", "second", and "third" are used only to distinguish similar objects and do not represent a specific sequence of objects. It is evident that, where permitted, "first", "second", and "third" may be interchanged to obtain specific sequences or orders in order to implement the embodiments of the disclosure described herein into sequences that are not those depicted or described. A heat dissipation device described in the embodiments of the present disclosure is described in detail below with reference to Figs. 1-6. The heat dissipation device comprises a first branch pipe 110, a second branch pipe 120, a connecting pipe 130, an outlet pipe 150, and a movable element 140. The first branch pipe 110 is configured to receive a heat dissipation medium and to carry heat away to a first heat-generating element 191. The second branch pipe 120 is configured to receive the heat dissipation medium and to carry heat away to a second heat-generating element. Two ends of the connecting pipe 130 are connected to the first branch pipe 110 and the second branch pipe 120, respectively. The outlet pipe 150 is connected to the connecting pipe 130. The movable element 140 is movably arranged within the connecting pipe 130.The movable link 140 can, by moving within the connecting pipe 130 either towards the first branch pipe or towards the second branch pipe, adjust a communication surface between the first branch pipe 110 and the outlet 150 and a communication surface between the second branch pipe 120 and the outlet pipe 150. The heat dissipation medium exists in both a gaseous and a liquid state.By adjusting the communication area between the first branch pipe 110 and the outlet pipe 150 and the communication area between the second branch pipe 120 and the outlet pipe 150 by the movable link 140, the respective flow rate of the heat dissipation medium distributed in the first branch pipe 110 and in the second branch pipe 120 can be adjusted, and the heat dissipation performance of the first branch pipe 110 and the second branch pipe 120 can be adjusted in such a way that the design of the heat dissipation device can be adapted, which significantly improves the adaptability of the heat dissipation device. The type of heat transfer medium is not limited here, as long as the heat transfer medium exists in both a gaseous and a liquid state in order to absorb heat through a change of state. For example, the heat transfer medium can be water. The method by which the first branch pipe 110 transfers heat to the first heat-generating element 191 is not limited here. For example, the first branch pipe 110 can directly contact the first heat-generating element 191. Alternatively, the first branch pipe 110 can contact the first heat-generating element 191 via other structures. The structure of the first heat-generating element 191 is not restricted here. For example, the first heat-generating element 191 can be a heat-generating chip, a processor, or a memory. The method for using the second branch pipe 120 to dissipate heat for the second heat-generating element is not limited here. For example, the second branch pipe 120 can directly contact the second heat-generating element. Alternatively, the second branch pipe 120 can contact the second heat-generating element via other structures. The structure of the second heat-generating element is not restricted. For example, the second heat-generating element could be a heat-generating chip, a processor, or a memory component. In one embodiment, two ends of the connecting pipe 130 are connected to the first branch pipe 110 and the second branch pipe 120, respectively. The outlet pipe 150 is connected to the connecting pipe 130 in such a way that the heat dissipation medium from the first branch pipe 110 and the second branch pipe 120 flows through the connecting pipe 130 into the outlet pipe 150. In one embodiment, the movable element 140 can move within the connecting pipe 130 due to the pressure of the heat dissipation medium of the first branch pipe 110 and the pressure of the heat dissipation medium of the second branch pipe 120. As shown in Fig. 1, since two ends of the connecting pipe 130 are connected to the first branch pipe 110 and the second branch pipe 120 respectively, a pressure difference between the heat dissipation medium in the first branch pipe 110 and the second branch pipe 120 can induce movement of the movable element 140 within the connecting pipe 130. After absorbing heat, at least a portion of the heat dissipation medium in the first branch pipe 110 and the second branch pipe 120 undergoes a phase change, transitioning from a liquid to a gaseous state. The more heat the heat dissipation medium absorbs in the first branch pipe 110 and the second branch pipe 120, the more of the heat dissipation medium changes from liquid to gas.The higher the proportion of the heat dissipation medium in the gaseous state, the greater the pressure in the first branch pipeline 110 and in the second branch pipeline 120. When the first heat-generating element 191 produces more heat, the first branch pipe 110 absorbs more heat, and consequently, more of the heat dissipation medium in the first branch pipe 110 is converted from a liquid to a gaseous state. Since the pressure of the heat dissipation medium in the first branch pipe 110 is greater than the pressure of the heat dissipation medium in the second branch pipe 120, the movable component 140 can move towards the second branch pipe 120. Therefore, the communication area between the first branch pipe 110 and the outlet pipe 150 increases, and the flow rate of the heat dissipation medium in the first branch pipe 110 increases, thereby improving the heat dissipation capacity of the first branch pipe 110.When the pressure of the heat dissipation medium in the first branch pipe 110 is essentially equal to the pressure of the heat dissipation medium in the second branch pipe, the movable element 140 no longer moves, and the heat dissipation device is in a generally stable state. As the heat generated by the first heat-generating element 191 decreases, the movable element 140 moves towards the first branch pipe 110. The heat dissipation device can automatically adjust the respective flow rates of the heat dissipation medium in the first branch pipe 110 and the second branch pipe 120 based on the respective calorific values ​​of the first and second heat-generating elements 191 and 120, respectively. This automatically adjusts the heat dissipation capacity of the first and second branch pipes 110 and significantly improves the adaptability of the heat dissipation device. If no moving component is arranged in the heat dissipation device, when the heat generated by the first heat-generating element is greater, the increased pressure of the heat dissipation medium in the first branch pipe drives more flow to the second branch pipe, thereby further reducing the heat dissipation capacity of the first branch pipe, which further increases the pressure of the heat dissipation medium in the first branch pipe and may lead to a blockage of the first heat-generating element and its inability to dissipate heat. In the present disclosure, the movable link 140 can also move within the connecting pipe 130 by means of other energy sources. In one example, the movable link 140 is made of iron, and a first electromagnetic structure and a second electromagnetic structure can be arranged at opposite ends of the connecting pipe 130. The first electromagnetic structure and / or the second electromagnetic structure can exhibit magnetism when energized, causing the movable link 140 to move by magnetic force. The structure of the movable link 140 is not restricted here. For example, the movable link 140 can be either a columnar structure or a spherical structure. In another example, the connecting pipe 130 has a circular cross-section and the movable link 140 has a columnar structure, so that the movable link 140 moves easily within the connecting pipe 130. To prevent contaminants from entering the connecting pipe 130 and causing wear on the movable link 140 or the connecting pipe 130, filter structures can be arranged at both ends of the connecting pipe 130. The filter structures can be metal filters or textile filters. In an optional embodiment, as shown in Fig. 2, the connecting pipeline 130 can have a first pipeline section 131 and a second pipeline section 132, wherein two connections of the first pipeline section 131 are connected to a first end of the second branch pipeline 120 and a first end of the first branch pipeline 110, respectively. A first end of the second pipeline section 132 is connected to a side wall of the first pipeline section 131. A second end of the second pipeline section 132 is connected to a first end of the outlet pipeline 150. The movable link 140 can be movably arranged in the first pipeline section 131. In this implementation, the cross-sectional shape of the first pipe section 131 can be circular or elliptical. The cross-sectional shape of the second pipe section 132 can also be circular or elliptical. For example, the cross-sectional shape of the first pipe section 131 can be circular and the cross-section of the second pipe section 132 can be elliptical. To prevent the movable link 140 from falling into the second pipe section 132, a chamber of the second pipe section 132 can have a shallow design, with the height of the second pipe section 132 being less than the height of the movable link 140 in a second direction. To allow the heat dissipation medium in the first pipe section 131 to flow smoothly into the second pipe section 132, the length of a first connection 134 of the second pipe section 132 is greater in a first direction than the length of a second connection 135 of the second pipe section 132 in a first direction. The first direction, for example direction A shown in Fig. 3, is not restricted here. The second direction, for example direction B shown in Fig. 4, is not restricted here. For example, the second direction may satisfy a vertical condition with respect to the first direction, where the vertical condition refers to being vertical or substantially vertical. In one configuration, the first pipeline section 131 can have a first bounding chamber 133, a first connection 134, and a second connection 135. The first bounding chamber 133 is located in the middle of the first pipeline section 131 and is connected to the first end of the second pipeline section 132. The cross-sectional area of ​​the first connection 134 is smaller than the cross-sectional area of ​​the first bounding chamber 133. The first connection 134 is connected to the first bounding chamber 133 and the first end of the first branch pipeline 110. The cross-sectional area of ​​the first connection 135 is smaller than the cross-sectional area of ​​the first bounding chamber 133. The second connection 135 is connected to the first bounding chamber 133 and the first end of the second branch pipeline 120. The movable link 140 is movably arranged in the first limiting chamber 133.By arranging the movable link 140 in the first pipe section 131, which has smaller cross-sectional areas at two ends and a larger cross-sectional area in the middle, it is possible to prevent the movable link 140 from falling out of the first pipe section 131. Extreme movement positions of the movable link 140 can be limited by the first connection 134 and the second connection 135. If the first heat-generating element 191 is not operating, that is, if the first heat-generating element 191 is not generating heat, the movable link 140 moves to a first limiting position in the first limiting chamber 133. When the movable link 140 reaches the first limiting position of the first limiting chamber 133, it blocks the first connection 134 and prevents the heat dissipation medium from flowing in the first branch pipe 110. Meanwhile, the heat dissipation medium is allowed to flow in the second branch pipe 120, which improves the heat dissipation capacity of the heat dissipation device for the second heat-generating element. If the second heat-generating element is not operating, that is, if the second heat-generating element is not generating heat, the movable link 140 moves to a second limiting position in the first limiting chamber 133. When the movable link 140 reaches the second limiting position of the first limiting chamber 133, it blocks the second connection 135 and prevents the heat dissipation medium from flowing in the second branch pipe 120. Meanwhile, the heat dissipation medium is allowed to flow in the first branch pipe 110, which improves the heat dissipation capacity of the heat dissipation device for the first heat-generating element 191. When both the second heat-generating element and the first heat-generating element 191 are operating, that is, when both the second heat-generating element and the first heat-generating element 191 are generating heat, the movable link 140 moves between the first limiting position and the second limiting position in the first limiting chamber 133. When the movable link 140 is positioned between the first limiting position and the second limiting position in the first limiting chamber 133, the outlet pipe 150 establishes communication with the first branch pipe 110 and the second branch pipe 120. The heat dissipation medium is then allowed to flow in both the first branch pipe 110 and the second branch pipe 120.Based on the respective calorific value of the first heat-generating element 191 and the second heat-generating element, the heat dissipation device can automatically adjust the respective flow rate of the heat dissipation medium in the two branch pipes, thereby improving the heat dissipation capacity of the heat dissipation device. As shown in Fig. 5, in an optional embodiment, the heat dissipation device can also include an inlet pipe 160, a first heat dissipation block 170, a second heat dissipation block 180, a first filter element, and a second filter element. A first end of the inlet pipe 160 is connected to a second end of the second branch pipe 120 and a second end of the first branch pipe 110. The first heat dissipation block 170 is configured to dissipate heat for the first heat-generating element 191. The first heat dissipation block 170 has a first heat dissipation chamber 171, a first inlet 172, and a first outlet 173. Two sections of the first branch pipe 110 are connected to the first inlet 172 and the first outlet 173, respectively. The second heat dissipation block 180 is configured to dissipate heat for the second heat-generating element.The second heat dissipation block 180 has a second heat dissipation chamber 181, a second inlet 182, and a second outlet 183. Two sections of the second branch pipeline 120 are connected to the second inlet 182 and the second outlet 183, respectively. The first filter element is located at the first outlet 173, and the second filter element is located at the second outlet 183. In the implementation, the use of the first heat dissipation block 170 with a larger area for the first heat-generating element 191 and the second heat dissipation block 180 with a larger area for the second heat-generating element improves the heat dissipation capability of the heat dissipation device. As shown in Fig. 6, a first capillary structure 174 can also be arranged in the first heat dissipation chamber 171 such that more heat dissipation medium can be converted from the liquid state to the gaseous state by the first capillary structure 174. A second capillary structure can also be arranged in the second heat dissipation chamber 181. It should be noted that if the first heat dissipation block 170 and the second heat dissipation block 180 are not arranged in the heat dissipation device, the first capillary structure 174 may be arranged in the first branch pipe 110 and the second capillary structure may be arranged in the second branch pipe 120. In this implementation, arranging the first filter element at the first outlet 173 and the second filter element at the second outlet 183 enables the filtering of impurities in the heat dissipation medium and prevents impurities from entering the connecting pipe 130 and from wearing down the movable link 140 and the connecting pipe 130 during the movement of the movable link 140 within the connecting pipe 130, thereby improving the service life of both the moving component 140 and the connecting pipe 130. If the first heat dissipation block 170 and the second heat dissipation block 180 are not arranged in the heat dissipation device, the first filter element can be arranged in the first branch pipeline 110 and the second filter element can be arranged in the second branch pipeline 120. One embodiment also provides an electronic device comprising the heat dissipation device provided by the embodiments mentioned above, a first heat-generating element 191, and a second heat-generating element. The first branch pipe 110 is configured to dissipate heat for the first heat-generating element 191, and the second branch pipe 120 is configured to dissipate heat for the second heat-generating element.By adjusting a communication surface between the first branch pipe 110 and the outlet pipe 150 and a communication surface between the second branch pipe 120 and the outlet pipe 150 by the movable link 140, the respective flow rate of the heat dissipation medium distributed in the first branch pipe 110 and in the second branch pipe 120 can be adjusted, and the heat dissipation performance of the first branch pipe 110 and the second branch pipe 120 can be adjusted in such a way that the heat dissipation design of the electronic device can be adapted, which significantly improves the adaptability of the electronic device. The structures of the first heat-generating element 191 and the second heat-generating element are not restricted here. For example, the first heat-generating element 191 can be a memory and the second heat-generating element 191 can be a processor. In another example, the first heat-generating element 191 can be a first processor and the second heat-generating element can be a second processor. As disclosed, the heat dissipation device and the electronic device provided by the present disclosure achieve at least the following advantageous effects. The heat dissipation device comprises: a first branch pipe capable of receiving a heat dissipation medium and configured to carry away heat for a first heat-generating element; a second branch pipe capable of receiving a heat dissipation medium and configured to carry away heat for a second heat-generating element; a connecting pipe, with two ends of the connecting pipe being connected to the first branch pipe and the second branch pipe respectively; an outlet pipe connected to the connecting pipe; and a movable element movably arranged in the connecting pipe and capable of moving in the connecting pipe towards the first branch pipe or the second branch pipe.to adapt a communication area between the first branch pipe and the outlet pipe and a communication area between the second branch pipe and the outlet pipe. By adapting the communication area between the first branch pipe and the second branch pipe and the outlet pipe, and a communication area between the second branch pipe and the outlet pipe via the movable link, the respective flow rate of the heat dissipation medium distributed in the first and second branch pipes can be adjusted, and the heat dissipation capacity of the first and second branch pipes can be adjusted such that the heat dissipation design of the heat dissipation device can be adapted, which significantly improves the adaptability of the heat dissipation device. The above are merely specific implementations of the present revelation and are not used to limit the scope of the present revelation. All modifications, equivalent substitutions, and improvements that do not depart from the spirit and principles of the present revelation shall be within the scope of protection of the present revelation. Therefore, the scope of protection of the present revelation is subject to the scope of protection of the claims.

Claims

A heat dissipation device comprising: a first branch pipe capable of receiving a heat dissipation medium and configured to carry heat away from a first heat-generating element; a second branch pipe capable of receiving a heat dissipation medium and configured to carry heat away from a second heat-generating element; a connecting pipe, with two ends of the connecting pipe being connected to the first branch pipe and the second branch pipe respectively; and an outlet pipe connected to the connecting pipe.and a movable link that is movably arranged in the connecting pipe and is able to move in the connecting pipe towards the first branch pipe side or the second branch pipe side in order to adapt a communication surface between the first branch pipe and the outlet pipe and a communication surface between the second branch pipe and the outlet pipe, wherein the movable link can move within the connecting pipe due to the pressure of the heat dissipation medium in the first branch pipe and the pressure of the heat dissipation medium in the second branch pipe. Heat dissipation device according to claim 1, wherein the connecting pipeline comprises: a first pipeline section, wherein two connections of the first pipeline section are connected to a first end of the second branch pipeline and a first end of the first branch pipeline, respectively; and a second pipeline section, wherein a first end of the second pipeline section is connected to a side wall of the first pipeline section and a second end of the second pipeline section is connected to the outlet pipeline; wherein the movable element is able to be movably arranged in the first pipeline section. Heat dissipation device according to claim 2, wherein the first pipe section comprises: a first limiting chamber in the middle of the first pipe section, which communicates with the first end of the second pipe section; a first connection, which is connected to the first limiting chamber and the first end of the first branch pipe, wherein the cross-sectional area of ​​the first connection is smaller than the cross-sectional area of ​​the first limiting chamber; and a second connection, which is connected to the first limiting chamber and the first end of the second branch pipe, wherein the cross-sectional area of ​​the second connection is smaller than the cross-sectional area of ​​the first limiting chamber; wherein the movable element is able to be movably arranged in the first limiting chamber. Heat dissipation device according to claim 3, wherein: when the movable element moves to and reaches a first limiting position of the first limiting chamber, the movable element blocks the first port; when the movable element moves to and reaches a second limiting position of the first limiting chamber, the movable element blocks the second port; and when the movable element moves between and is positioned between the first limiting position and the second limiting position of the first limiting chamber, the outlet pipeline establishes communication with the first branch pipeline and the second branch pipeline. Heat dissipation device according to claim 2, wherein: the length of a first connection of the second pipe section in a first direction is greater than the length of a second connection of the second pipe section in the first direction; and a chamber of the second pipe section is flat and the height of the second pipe section in a second direction is less than the height of the movable element. Heat dissipation device according to claim 1, further comprising: an inlet pipe, wherein a first end of the inlet pipe is connected to a second end of the second branch pipe and a second end of the first branch pipe; a first heat dissipation block for dissipating heat for the first heat-generating element, comprising a first heat dissipation chamber, a first inlet and a first outlet, wherein two sections of the first branch pipe are connected to the first inlet and the first outlet, respectively; a second heat dissipation block for dissipating heat for the second heat-generating element, comprising a second heat dissipation chamber, a second inlet and a second outlet, wherein two sections of the first branch pipe are connected to the first inlet and the first outlet, respectively; a first filter element at the first outlet;and a second filter element at the second outlet.; Heat dissipation device according to claim 1, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 2, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 3, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 4, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 5, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 6, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Heat dissipation device according to claim 1, wherein: the movable member is a column structure or a spherical structure; and filter structures are arranged at two ends of the connecting pipeline. Electronic device comprising: a first heat-generating element, a second heat-generating element, and a heat dissipation device comprising: a first branch pipe capable of receiving a heat-dissipation medium and configured to dissipate heat for the first heat-generating element; a second branch pipe capable of receiving a heat-dissipation medium and configured to dissipate heat for the second heat-generating element; a connecting pipe, wherein two ends of the connecting pipe are connected to the first branch pipe and the second branch pipe respectively; an outlet pipe connected to the connecting pipe; and a movable element movably arranged in the connecting pipe and capable of moving in the connecting pipe towards the first branch pipe side or the second branch pipe side.to adapt a communication surface between the first branch pipe and the outlet pipe and a communication surface between the second branch pipe and the outlet pipe, wherein the movable element can move within the connecting pipe due to the pressure of the heat dissipation medium in the first branch pipe and the pressure of the heat dissipation medium in the second branch pipe; and wherein the first branch pipe is configured to dissipate heat for the first heat-generating element; and the second branch pipe is configured to dissipate heat for the second heat-generating element. Electronic device according to claim 14, wherein the connecting pipeline comprises: a first pipeline section, wherein two connections of the first pipeline section are connected to a first end of the second branch pipeline and a first end of the first branch pipeline, respectively; and a second pipeline section, wherein a first end of the second pipeline section is connected to a side wall of the first pipeline section and a second end of the second pipeline section is connected to the output pipeline; wherein the movable element is able to be movably arranged in the first pipeline section. Electronic device according to claim 15, wherein the first pipeline section comprises: a first limiting chamber in the middle of the first pipeline section, which communicates with the first end of the second pipeline section; a first connection, which is connected to the first limiting chamber and the first end of the first branch pipeline, wherein the cross-sectional area of ​​the first connection is smaller than the cross-sectional area of ​​the first limiting chamber; and a second connection, which is connected to the first limiting chamber and the first end of the second branch pipeline, wherein the cross-sectional area of ​​the second connection is smaller than the cross-sectional area of ​​the first limiting chamber; wherein the movable element is movably arranged in the first limiting chamber. Electronic device according to claim 16, wherein: when the movable element moves to and reaches a first limiting position of the first limiting chamber, the movable element blocks the first port; when the movable element moves to and reaches a second limiting position of the first limiting chamber, the movable element blocks the second port; and when the movable element moves between and is positioned between the first limiting position and the second limiting position of the first limiting chamber, the output pipeline establishes communication with the first branch pipeline and the second branch pipeline. Electronic device according to claim 15, wherein: the length of a first connection of the second pipe section in a first direction is greater than the length of a second connection of the second pipe section in the first direction; and a chamber of the second pipe section is flat and the height of the second pipe section in a second direction is less than the height of the movable element. Electronic device according to claim 15, wherein the first heat-generating element is a first processor and the second heat-generating element is a second processor.

Images