Thermal management system for high load conditions
The thermal management system with a bypassed coolant and air paths, and an ejector-based refrigerant circuit, addresses the cooling capacity challenges of R744 systems, enhancing performance under high-load conditions by reducing suction pressure and maintaining flow rates, thus achieving efficient and cost-effective cooling.
Patent Information
- Application Number
- DE102024134546
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2026-05-28
AI Technical Summary
Existing thermal management systems using carbon dioxide (R744) as a refrigerant face challenges in achieving high cooling capacity during fast charging and high ambient temperatures due to its lower cooling performance compared to conventional refrigerants, and existing solutions like hardware modifications and additional sensors increase cost and space requirements.
A thermal management system with a refrigerant circuit that includes a second coolant branch bypassing the first heat exchanger and a secondary air path bypassing the second heat exchanger, controlled by proportional valves and air dampers, along with an ejector-based refrigerant circuit, to manage refrigerant and airflow distribution, reducing suction pressure and maintaining minimum flow rates.
Enhances cooling capacity by reducing suction pressure and maintaining efficient operation under high-load conditions, particularly during vehicle startup, while being compact and cost-effective.
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Abstract
Citation Information
Patent Citations
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