Cooling device for a control cabinet, method for cooling electrical components in a control cabinet, and control cabinet with such a cooling device

Abstract

Cooling device (1; 100; 200; 300) for a control cabinet (2) with the following features: a housing (5; 302a, 302b), at least one fan (70), wherein the fan (70) is arranged at least partially inside the housing (2), wherein at least one channel (25) is provided, wherein the channel (25) is designed to be at least partially flexible and dimensionally stable, wherein the channel (25) is arranged at least partially outside the housing (5; 302a, 302b) of the cooling device (1; 100; 200; 300), and the channel (25) guides the airflow of the fan (70).

Description

[0001] The invention relates to a cooling device for a control cabinet according to the features of claim 1 and a method for cooling electrical components in a control cabinet according to the features of claim 15.

[0002] Control cabinets are used in a wide variety of applications. For example, they are used in industry for controlling and monitoring production plants, as well as in energy supply and building technology. The primary goal is the control, monitoring, and distribution of energy. Cooling control cabinets, especially the cooling of the electronic components installed within them and their heat hotspots, is becoming increasingly important due to the ever-increasing performance of these electronic components. In addition to the high performance of the electronic components within the cabinet, the requirements for such a control cabinet include high compactness and high power dissipation combined with durability and reliability.

[0003] For example, German utility model application DE 20 2017 101 528 U1 discloses a control cabinet which uses a fan to ventilate the interior of a housing.

[0004] A problem with such cooling systems is that, due to the varying user requirements for a control cabinet and the enormous number of degrees of freedom with which such a cabinet can be designed, the construction of a control cabinet is generally very individualized, unlike, for example, network cabinets. Predetermining how the supply channels should be routed within a control cabinet is difficult and time-consuming. At the same time, a supply channel and its outlet must be positioned as close as possible to a heat hotspot.

[0005] This problem is solved by a cooling device for a control cabinet with the features of claim 1 and by a method for cooling electrical components in a control cabinet according to the features of claim 15.

[0006] Advantageous features and further training opportunities are specified in the dependent requirements.

[0007] According to the invention, a cooling device for a control cabinet comprises a housing and at least one fan, wherein the fan is arranged at least partially inside the housing. Furthermore, at least one channel is formed, wherein the channel is at least partially flexible and dimensionally stable, wherein the channel is arranged at least partially outside the housing of the cooling device, and the channel guides the airflow of the fan.

[0008] The invention is based on the idea of ​​selectively cooling individual electrical components within a control cabinet, in particular their electronic components and heat hotspots. The channel, directed precisely at the heat hotspot, is formed from a flexible, multi-sectioned channel, preferably a segmented hose, and thus, once positioned within the control cabinet, remains there without any further support. This makes the cooling device quick and easy to use in a wide variety of control cabinet configurations, as the channel can be positioned anywhere within the cabinet.

[0009] A flexible and dimensionally stable channel (or pipe or hose) within the meaning of the invention means that the channel can be flexibly aligned, preferably by hand, and that once aligned, the channel remains in the aligned position due to its dimensional stability. This applies particularly even when, for example, an airflow passes through the channel. Examples of such a channel are articulated hoses or wire-reinforced hoses. Dimensionally stable hoses or conduits also include, for example, so-called TKB pipes. These are metal-plastic conduits. Such TKB pipes consist of a PE(HD)-aluminum composite material with a PE inner lining.

[0010] Preferably, the channel is designed with multiple segments, particularly as a segmented hose. Segmented hoses have interconnected segments. This allows them to be easily adapted to complex or narrow structures without kinking or deforming. Segmented hoses are flexible when force is applied to the individual segments. Once aligned, segmented hoses retain their shape and are mechanically stable. Due to their multi-segment design, segmented hoses can be easily lengthened, shortened, or branched. The segmented hose can be made of plastic or metal.

[0011] Advantageously, the fan is designed as a radial fan. It can also be designed as an axial fan. Radial fans have the advantage of a low profile, which is particularly beneficial for applications with limited space. Furthermore, radial fans generate high static pressure, which is especially advantageous for cooling devices.

[0012] According to a preferred embodiment of the invention, a temperature sensor is arranged near a free end of the channel. Since the free end of the channel is usually located near a thermal hotspot, the temperature sensor is also positioned close to the thermal hotspot. This has the advantage that the temperature of the electronic components, especially their thermal hotspots, can be determined more accurately.

[0013] Preferably, the temperature sensor is designed as an infrared sensor or a thermocouple, in particular as a K-type thermocouple. Infrared sensors have the advantage that they measure the temperature without contact, i.e., without physical contact with the electronic component being cooled, whose temperature is to be determined. Furthermore, infrared sensors are characterized by their high accuracy and fast response time. Thermocouples, and in particular K-type thermocouples, which are also referred to as type K thermocouples, have a wide temperature range, preferably between -50°C and 500°C. Moreover, thermocouples are insensitive to ambient conditions.

[0014] Preferably, the cooling device includes a control unit that regulates the airflow. Depending on the measured temperature, a stronger or weaker airflow is required, directed at the electronic components. The control unit processes the temperature, preferably measured by a temperature sensor, and adjusts the airflow accordingly. Preferably, the control unit is preset with a target temperature for the different electronic components. Preferably, the control unit is a PID controller.

[0015] According to a particularly advantageous embodiment of the invention, a first and at least one second channel are formed, wherein the first and second channels are flexible and multi-segmented and at least partially guide the airflow of the at least one fan. The first and second channels are preferably designed as segmented hoses. The second channel can also branch off from the first channel. More than two channels can also be formed; for example, three, four, or five channels can be formed, provided that the static air pressure of the fan is sufficiently high to provide the required airflow.

[0016] Advantageously, an air duct is at least partially located inside the housing, and the first and, if applicable, a second or third channel are connected to the air duct, with the fan positioned at one free end of the air duct. This has the advantage that the airflow within the cooling device can be designed simply.

[0017] According to a particularly advantageous embodiment of the invention, the channel has a nozzle head at its free end, wherein at least two of the channels form different nozzle heads, so that the airflow exiting the nozzle head is wider or more targeted. Electronic components within a control cabinet have heat hotspots of varying sizes, which can be addressed accordingly by the different nozzle heads.

[0018] In a preferred embodiment of the invention, each channel is connected to a separate fan. This has the advantage that each electronic component within a control cabinet always receives the full static air pressure of a fan. Two, three, or more fans can also be arranged within a cooling device, with one, two, three, or more channels connected to each fan.

[0019] According to a preferred embodiment of the invention, the at least one channel is detachably connected to the air duct, in particular by screwing or clipping it to the air duct. This has the advantage that the channels can be easily assembled and disassembled from the air duct, thus providing a high degree of modularity. A channel can also be detachably connected to another channel. Preferably, a channel can also be screwed or clipped to another channel.

[0020] Preferably, the housing can be attached to the control cabinet by means of a positive and / or non-positive connection, in particular magnetically. Preferably, the cooling device has magnets on one side surface. This allows the cooling device to be easily and quickly mechanically connected to the control cabinet, which is usually made of a magnetic material. Furthermore, no separate device is required inside the control cabinet. Consequently, the control cabinet is not damaged by drilling or similar processes, which can be particularly advantageous in harsh environments with high humidity.

[0021] Preferably, a display device is electrically connected to the cooling device, which shows the temperature of the components to be cooled. Furthermore, a target temperature can be set via the display device, which must not be exceeded by the electronic components. The display device thus serves as an indicator of the temperatures prevailing at the electronic components and as an input device for specifying target temperatures.

[0022] Preferably, the cooling device is arranged inside the control cabinet, while the display device is arranged outside the control cabinet. This has the advantage that the control cabinet does not need to be opened to specify any changes to the cooling behavior. This also allows laypersons to make changes to the cooling behavior, as they do not require any electrical engineering expertise.

[0023] Following a particularly advantageous further development, the cooling device features a Wi-Fi or WLAN interface. The Ethernet interface can communicate with a network, an app, a computer, or a mobile phone via a cable or a Wi-Fi adapter. This has the advantage that a control cabinet, preferably multiple control cabinets, can be controlled and monitored from a central location. The Wi-Fi or WLAN interface is preferably integrated on a circuit board, which also preferably houses the control unit and / or a monitoring unit. The cooling device may also have an Ethernet interface.

[0024] According to a particularly advantageous embodiment of the invention, the cooling device comprises at least two housings, each housing containing a fan with a duct at its outlet, and the housings communicating with each other via a communication link. Preferably, only one housing has a control unit, with both fans being controlled by this single control unit. Preferably, only one housing also has interfaces for the temperature sensors. It is understood that more than two housings can be provided, with preferably only one housing having interfaces for both the temperature sensors and the control unit.

[0025] According to a particularly preferred embodiment of the invention, fluid cooling of electronic components within the control cabinet can be controlled via the control unit of the cooling device. Fluid cooling can also be at least partially routed through the cooling device.

[0026] According to the invention, a method for cooling electrical components in a control cabinet using a cooling device according to the invention comprises the following process steps: Detecting heat hotspots within a control cabinet. Aligning a free end of a duct such that it is located near the heat hotspot. Measuring the temperature using a temperature sensor, which is preferably located at a free end of the duct or attached to the component to be cooled using a thermal sensor. Transmitting the temperature to the control unit. Adjusting the output air volume based on the measured temperature of the electrical component to be cooled. In particular, adjusting the air volume allows for energy savings, since full power is only available when needed.

[0027] Preferably, the detection of heat hotspots is carried out using a thermal imaging camera. This allows the ducts to be aligned precisely or almost precisely with the heat hotspots in advance, which has a positive effect on the required airflow and thus on energy consumption.

[0028] Following a preferred process step, the temperature of the components is controlled using a PID controller. The proportional (P) component of the controller ensures that the cooling device reacts quickly to temperature deviations. The integral (I) component and the derivative (D) component minimize overshoot, resulting in a smooth and stable approach to the target temperature.

[0029] Preferably, the target temperature of each component is adjustable via the display device and / or Wi-Fi / WLAN. Different electronic components require different target temperatures, which can be specified by a setting function of the display device.

[0030] According to the invention, a control cabinet is equipped with at least one cooling device according to the invention. Preferably, two or more cooling devices according to the invention are arranged within one control cabinet.

[0031] Three embodiments of the invention are explained below with reference to the figures. The figures show: Fig. 1 a perspective schematic view of a first embodiment of a cooling device inside a control cabinet, Fig. 2 a perspective view of an exploded view of the cooling device Fig. 1, Fig. 3 a side view of the cooling device Fig. 2, and Fig. 4 a perspective schematic view of a second embodiment of a cooling device inside a control cabinet, Fig. 5 a perspective schematic view of a third embodiment of a cooling device inside a control cabinet, and Fig. 6 a perspective schematic view of a fourth embodiment of a cooling device inside a control cabinet, wherein the cooling device has two housings.

[0032] In the following figures, identical reference symbols denote identical parts with the same meaning.

[0033] Fig. Figure 1 shows a control cabinet 2 with a wall 7 and a door 6. The door 6 is in an open position, so that the interior 8 of the control cabinet 2 is visible.

[0034] Inside the control cabinet 2, an electronic component 50, for example a frequency converter, is attached to a side surface 9 of the enclosure 7.

[0035] A cooling device 1 with a housing 5 is arranged inside the control cabinet 2. The cooling device 1 is attached to the same side surface 9 of the enclosure 7 as the electronic component 50. The cooling device 1 can also be arranged at any other location within the control cabinet 2. The cooling device 1 is attached to the metallic enclosure 7 of the control cabinet 2 preferably by four magnets (not visible). The cooling device 1 can also be attached to the enclosure 7 or the door 6 of the control cabinet 2 by a screw connection or by a snap-fit ​​connection.

[0036] The cooling device 1 has a channel 25. The channel 25 is flexible and multi-sectioned. Preferably, the channel 25 is designed as a segmented hose. Segmented hoses have the advantage that they can be arranged as desired within the interior 8 of the control cabinet 2, and once positioned, the segmented hose remains in that position. The channel 25 can also be designed as a rubber hose reinforced by bendable wire elements that stabilize the channel 25 in its aligned position.

[0037] At a free end 26 of the channel 25, the channel 25 has a nozzle head. A temperature sensor 20 is arranged near the free end 26 of the channel 25, preferably at the nozzle head 35, wherein the temperature sensor 20 is preferably designed as an infrared sensor. The temperature sensor 20 can also be designed as a thermocouple, in particular as a K-type thermocouple. The free end 26 of the channel 25, in particular of the nozzle head 35, is oriented such that it is directed towards a thermal hotspot of the operating electronic component 50.

[0038] The temperature sensor 20 is connected to the cooling device 1, in particular the control unit 15, by means of a cable connection 21 (see figure). Fig. 2) connected to the cooling device 1. The temperature sensor 20 can also communicate with the cooling device 1, in particular with a control unit 15 of the cooling device 1, via a radio device.

[0039] The free end 26 of the channel 25, in particular the nozzle head 35, is arranged at a distance from the electrical component 50. The free end 26 of the channel 25, in particular the nozzle head 35, can also be in direct contact with the electronic component 50.

[0040] A display device 40 is connected to the cooling device 1 via a connecting cable 41. During operation of the control cabinet 2, the display device 40 is preferably located outside the control cabinet 2. The display device 40 preferably has magnets (not visible) which allow it to be mechanically fixed to the control cabinet 2. The display device 40 can also communicate with the cooling device 1 via a wireless connection. The display device 40 has a display 42, in particular a touch display, which can be used for both display and input purposes. For example, the current temperature of the electronic component 50 and the current fan speed can be displayed via the display device 40.The display device 40 can also have a memory (not shown) in which temperature profiles, fan performance over time and information about the electronic component 50 to be cooled are stored.

[0041] For example, the physical condition of an electronic component 50 can be inferred from a changing temperature behavior. A measured temperature profile can be compared with a stored data set or with previous temperature profiles by an AI, allowing conclusions to be drawn about the physical condition of the electronic component 50. The display device 40 can show the physical condition of the electronic component 50 on its display 42 or transmit it, for example, via radio or network transmission to a computer or directly call a service technician.

[0042] The storage of the data, the temperature profiles, the statistics, the evaluation are stored on the memory, in particular on the SSD memory, the circuit board 80 inside the housing 5.

[0043] Fig. Figure 2 shows the cooling device 1. Fig. 1 and the display device 40, which is also in Fig. 1 was already shown.

[0044] The cooling device 1 comprises the housing 5, wherein the housing 5 is preferably made of a metallic material. The housing 5 of the cooling device 1 can also be made of plastic or a similar material.

[0045] The housing 5 is cuboid in shape and has a base part 11 and a top part 12. The base part 11 and the top part 12 are mechanically connected to each other by screw connections in the edge areas.

[0046] Magnets (not shown) are preferably arranged within the base section 11, establishing a mechanical connection between the cooling device 1 and the control cabinet 2. The upper section 12 has ventilation slots 13 to provide the air volume required for a fan 70. At the same time, the arrangement of the ventilation slots ensures sufficient cooling of the control board itself.

[0047] The connections 55, 56, 57 are located on a side surface 10 of the housing 5, in particular on an end face 14 of the housing 5 (see figure). Fig. 3) arranged for the peripheral devices of the cooling device 1.

[0048] The fan 70 is arranged completely within the housing 5 of the cooling device 1. The fan 70 can also be arranged at least partially within the housing 5 of the cooling device 1. The fan 70 is preferably designed as a radial fan.

[0049] The air duct 30 is directly connected to the outlet 71 of the fan 70. The air duct 30 is funnel-shaped in the area of ​​the fan 70, tapering from the outlet 71 of the fan 70. At the end of the funnel-shaped section of the air duct 30, the air duct 30 opens into a circular cross-section, this section being angled and exiting at a side surface 10 of the housing 5 of the cooling device 1. A channel 25 is connected to the outlet 31 of the air duct 30 (see figure). Fig. 1) connected.

[0050] The outlet 31 of the air duct 30 can also be configured such that several channels 25 can be connected to a single outlet 31 of the air duct 30. The air duct 30 can also have multiple outlets 31, each of which can be connected to a channel 25. The channels 25 can be configured such that one channel 25 has a branch from which a new channel 25 branches off. Multiple outlets 31 of an air duct 30 can also lead out of the housing 5 (see Figure 3). Fig. 5).

[0051] Inside the housing 5 is a circuit board 80. The circuit board 80 contains the electronic components required for controlling and regulating the cooling device 1. The circuit board 80 includes the control unit 15 and a memory. The temperature controller is preferably designed as a PID controller.

[0052] The display device 40 has a back panel 43 and a cover. A display 42 is arranged between the back panel 43 and a cover part 44.

[0053] Fig. Figure 3 shows a side view, in particular the view of an end face 14 of the housing 5 of the cooling device 1. Fig. 2.

[0054] The front face 14 has three terminals 55 for temperature sensors 20, allowing up to three channels to be equipped with temperature sensors 20. These three terminals 55 for the temperature sensors 20 are equidistantly spaced across the front face 14 of the housing 5. The front face 14 may also have more or fewer terminals 55 for temperature sensors 20. Furthermore, the front face 14 has a terminal 56, in particular an RJ45 terminal, for the display device 40. The front face 14 has a terminal 57 for a fuse and a power supply line. The front face 14 may also have an Ethernet port or Ethernet interface (not shown) into which a network cable or Wi-Fi plug can be inserted to connect the cooling device 1 to an app, a network, a mobile phone, or a computer.The terminals 55, 56, 57 located on the front face 14 can also be positioned at any other location on the housing 5. Preferably, a WLAN / WIFI module is integrated on the circuit board 80, enabling communication with an app, a network, a mobile phone, or a computer. This arrangement allows multiple control cabinets to be monitored from a central location.

[0055] Fig. Figure 4 shows a second embodiment of the cooling device 100 according to the invention, which is arranged inside the control cabinet 2.

[0056] The cooling device 100 and the control cabinet 2 are designed and arranged in the same way as the cooling device 1 and the control cabinet 2 from embodiment one.

[0057] Cooling device 100 differs from cooling device 1 in that Fig. 1, in that two channels 25, namely a first channel 105 and a second channel 110, are arranged at the outlet 31 of the air duct 30, wherein the first channel 105 and the second channel 110 are directed towards different electronic components 50, in particular their thermal hotspots. It is understood that two or three channels 25 can also be directed towards one thermal hotspot.

[0058] Fig. Figure 5 shows a third embodiment of the cooling device 200 according to the invention, which is arranged inside the control cabinet 2.

[0059] The cooling device 200 and the control cabinet 2 are designed and arranged in the same way as the cooling device 1 and the control cabinet 2 from embodiment one.

[0060] Cooling device 200 differs from cooling device 1 in terms of Fig. 1 such that the channels 25, namely the first channel 205 and the second channel 210, are led out of the housing 5 at different locations, the first channel 205 and the second channel 210 being connected to the air duct 30. The first channel 205 and the second channel 210 can each be connected to their own air duct 30, with a fan 70 being arranged at the end of the air duct 30 opposite the outlet 31. More than two channels 205, 210 can also be formed and led out of the housing 5 at different side surfaces 10.

[0061] Fig. Figure 6 shows a fourth embodiment of a cooling device 300 according to the invention, which is arranged inside the control cabinet 2.

[0062] The cooling device 300 in embodiment four differs from the previous embodiments in that the cooling device 300 has two housings 302a, 302b.

[0063] A communication link 305 is arranged between the housings 302a and 302b. The communication link 305 enables data transfer between the components of the housings 302a and 302b. The communication link 305 can be a cable or a radio device.

[0064] A fan 70 is provided within both housings 302a, 302b of the cooling device 300. A circuit board 80, comprising the control unit 15 and preferably the WLAN module, is arranged in one of the housings 302a. The control unit 15 controls the fan 70, which is arranged in each housing 302a, 302b, respectively. The control of the fan 70 that is not located in the housing 302a containing the circuit board 80 is at least partially effected via the communication link 305.

[0065] Each housing 302a, 302b has one channel 25. Each housing 302a, 302b can also have more than one channel 25. For example, two, three, or four channels 25 can be formed on each of the housings 302a, 302b.

[0066] Preferably, only the housing 302a, in which the circuit board 80 is arranged, has connections 55 for temperature sensors 20, a connection 56 for the display device 40 and a connection 57 for the power supply.

[0067] Advantageously, each housing 302a, 302b cools an electronic component 50.

[0068] The cooling device 300 can also have more than two housings 302a, 302b. For example, the cooling device can have three, four, or five housings 302a, 302b, wherein one housing 302a, in which the circuit board 80 is located, performs the control function, and the other housings 302b or their components communicate with it via the communication link 305. The power supply to the housings 302b without the circuit board 80 can be provided via the communication link 305, for example, via Power over Ethernet (PoE). Reference symbol list 1 cooling device 2 Control cabinet 5 cases 6 doors 7 Conversion 8 Interior 9 side surface 10 side surface 11 Base section 12 Top 13 ventilation slots 14 Front 15 Control unit 20 Temperature sensor 21 Cable connection 25 Channel 26 Free end (channel) 30 air pipe 31 Outlet 35 nozzle head 40 Display device 41 connection cables 42" Display 43 Back 50 Electronic component 55 Connection (temperature sensor) 56 Connection (display device) 57 Connection (fuse and supply line) 70 fans 71 Output (fan) 80 circuit boards 100 Cooling device 105 First Channel 110 Second Channel 200 cooling device 205 First Channel 210 Second Channel 302a Housing 302b case 305 Communication link QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 20 2017 101 528 U1

[0003]

Claims

Cooling device (1; 100; 200; 300) for a control cabinet (2) with the following features: - a housing (5; 302a, 302b), - at least one fan (70), wherein the fan (70) is arranged at least partially inside the housing (2), characterized in that - at least one channel (25) is provided, wherein the channel (25) is designed to be at least partially flexible and dimensionally stable, - wherein the channel (25) is arranged at least partially outside the housing (5; 302a, 302b) of the cooling device (1; 100; 200; 300), and - the channel (25) guides the airflow of the fan (70). Cooling device (1; 100; 200; 300) according to claim 1 , characterized in that the channel (25) is designed in multiple sections, in particular as a segmented hose. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the fan is designed as a radial fan. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the cooling device has a control unit which controls the airflow. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that a temperature sensor (20) is arranged near a free end of the channel (25). Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the temperature sensor (20) is designed as an infrared sensor or thermocouple, in particular as a K thermocouple. Cooling device (1; 100; 200; 300) according to claim 1, characterized in that a first and at least one second channel (27, 28) are formed, wherein the first and second channels (27, 28) are flexible and multi-sectioned and at least partially guide the airflow of the at least one fan (70). Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that an air pipe (30) is arranged at least partially inside the housing (5; 302a, 302b) and the first channel and optionally the second channel or a third channel (27, 28, 29) is connected to the air pipe (30), wherein the fan (70) is arranged in the area of ​​the outlet (31) of the air pipe (30). Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the at least one channel (25) is detachably connected to the air tube (30), in particular the channel (25) is screwed or clipped to the air tube (30). Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that each channel (25) is connected to a separate fan (70). Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the housing (5; 302a, 302b) can be attached to the control cabinet (2) in a form-fit and / or force-fit manner, in particular magnetically. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that a display device (40) is electrically connected to the cooling device (1; 100; 200; 300), which displays the temperature states of the components to be cooled. Cooling device (1; 100; 200; 300) according to claim 12, characterized in that the cooling device is arranged inside the control cabinet, wherein the display device is arranged outside the control cabinet. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the cooling device has a WIFI interface or WLAN interface. Cooling device (1; 100; 200; 300) according to one of the preceding claims, characterized in that the cooling device (1; 100; 200; 300) has at least two housings (5; 302a, 302b), wherein a fan (70) is arranged in each housing (5; 302a, 302b), at the outlet of which a channel (25) is arranged, wherein the housings (5; 302a, 302b) communicate with each other via a communication link. Method for cooling electrical components in a control cabinet (2) by means of a cooling device (1; 100; 200; 300) according to claims 1 to 15, comprising the following method steps: - Detecting heat hotspots within a control cabinet (2), - Aligning a free end (26) of the channel (25) such that it is arranged near the heat hotspot, - Measuring the temperature by means of a temperature sensor, - Transferring the temperature to the control unit (15), - Adjusting the output air volume based on the measured temperature of the electrical component to be cooled. Method according to claim 12, characterized in that the detection of the heat hotspots is carried out using a thermal imaging camera. Method according to one of the preceding claims, characterized in that the temperature of the components is controlled with a PID controller. Method according to one of the preceding claims, characterized in that the temperature setpoint of the respective component is adjustable via the display device (40) and / or WIFI / WLAN. Control cabinet with at least one cooling device (1; 100; 200; 300) according to claims 1 to 15 .

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