Device and method for manufacturing a component

Abstract

Device (100) for manufacturing a component (101), wherein the device (100) has the following features: a receiving device (110) configured to receive a composite (108) of a first component (102) and a reactive multilayer system (106), as well as a second component (104); a preparation device (112) configured to remove the composite (108) and the second component (104) from the receiving device (110) and to form a stack using the composite (108) and the second component (104), wherein the components (102, 104) are arranged externally; and an activation device (114) configured to trigger a reaction of the reactive multilayer system (106) to connect the components (102, 104) to the component (101) by means of a material-bonded connection.

Description

[0001] The present invention relates to a device and a method for manufacturing a component using a reactive multilayer system.

[0002] A reactive multilayer system, for example a reactive multilayer film (RMS), can be used to bond elements. Multilayer systems are known, for example, from DE 10 2017 201 679 A1 and DE 10 2020 125 707 A1.

[0003] Against this background, the present invention provides an improved device and an improved method for manufacturing a component according to the main claims. Advantageous embodiments are described in the dependent claims and the following description.

[0004] Advantageously, the process steps required to manufacture the component can be automated.

[0005] A device for manufacturing a component has the following features: a receiving device designed to receive a composite of a first component and a reactive multilayer system, as well as a second component; a preparation device configured to remove the composite and the second component from the receiving device and to form a stack using the composite and the second component, the components being arranged externally; and an activation device designed to trigger a reaction of the reactive multilayer system to connect the components to the component by means of a material bond.

[0006] Using the device, the component can be manufactured automatically. The device components can form a single unit, for example, a manufacturing apparatus or a production line. The receiving unit can serve as a magazine in which the individual parts required for manufacturing the component can be stored or temporarily held. The preparation unit can, for example, include a pick-and-place robot to assemble the stack from the individual parts. The preparation unit can be designed to use the assembly and the second component directly for stack formation without further preprocessing. The assembly can be a prefabricated part consisting of the first component and the reactive multilayer system. The reactive multilayer system can be a layer arranged on a surface of the first component.The activation device can be configured to introduce activation energy into the stack that is required to trigger the reaction of the reactive multilayer system.

[0007] The component can be an assembly of components. One of the components can be an electronic component or a sensor. For example, one of the components can be a semiconductor component or a power semiconductor component, a chip, or a wafer. For example, one of the components can be a transistor, a diode, or a force sensor. The other component can be a substrate for the aforementioned component. For example, the other component can be a substrate for electronic components, such as a printed circuit board or a substrate, such as a copper or ceramic substrate. The other component can also be a machine element, such as a connecting element or an element for transmitting forces or movements, such as a shaft. Depending on the embodiment, the assembly can comprise one or the other of the components.

[0008] The reactive multilayer system can be configured to provide instant heat for a wide variety of applications across many industries. It can be fabricated by vapor deposition of thousands of alternating nanoscale layers, for example, of aluminum and nickel. These layers can be deposited onto the surface of the first device to create the composite. Alternatively, the reactive multilayer system can be a film of nanoscale layers, which can be attached to the first device. The reactive multilayer system can be used to create a mechanically and electrically conductive connection between the first and second devices in response to activation triggered by a reaction within the system itself.Sufficient thermal energy can be generated within the reactive multilayer system to trigger the reaction and reach the temperature required for initiation. The resulting bond can also be described as a multilayer bond and is responsive to the initiation of the reaction through multilayer bonding.

[0009] The device can be designed as a machine. The device's components—in this case, the receiving unit, the preparation unit, and the activation unit—as well as any other components, can be integral parts of the machine. This allows for optimal coordination of the interfaces between the components and enables a compact device design.

[0010] The holding device can be configured to accommodate at least one further assembly consisting of another first component and another reactive multilayer system, as well as at least one further second component, and to store them together with the assembly and the reactive multilayer system. In this way, multiple components can be bonded in an assembly line manner.

[0011] The receiving device can be designed to accommodate the assembly consisting of the first component, configured as an electronic component or a sensor, and the second component, configured as a carrier for electronic components or as a machine element. In this way, components that can be manufactured efficiently using the reactive multilayer system can be produced automatically.

[0012] The receiving device can be configured to receive the composite as the first component, with the reactive multilayer system grown onto it. This growth process allows for the high-quality production of the reactive multilayer system.

[0013] The device can include an application unit configured to deposit the reactive multilayer system onto the first component to create the composite. For example, the application unit can be configured to sequentially deposit layers of the reactive multilayer system onto the first component. This allows the reactive multilayer system to grow directly onto a surface of the first component.

[0014] The preparation unit can be designed to clean the first component and, additionally or alternatively, the second component and, additionally or alternatively, the reactive multilayer system or the shape-conforming reactive multilayer system. This allows for a less complex receiving unit, as any contamination of one of the components within the receiving unit can be removed by the preparation unit. If the reactive multilayer system is shaped using the preparation unit, cleaning can also be beneficial to remove any residues from the shaping process.

[0015] The activation device can be configured to trigger the reaction by an electrical pulse and additionally or alternatively by an optical pulse and additionally or alternatively by a thermal pulse. This allows different configurations of the stack to be activated in suitable ways. An optical pulse is suitable, for example, if the point where the pulse is applied is not obscured by any of the components. Electrical or thermal activation also enables the activation of a reactive multilayer system that is difficult or impossible to access from outside the stack.

[0016] The activation device can be designed to apply pressure to the stack. This pressure allows the components to be pressed against each other during the reaction of the reactive multilayer system. This optimizes the formation of the metallurgical bond.

[0017] The device may include a cleaning unit. The cleaning unit may be designed to clean the component. This allows, for example, the removal of contaminants caused by the reaction.

[0018] The device may include a testing unit. This testing unit may be designed to check the quality of the component and provide a test signal indicating low or high quality. In this way, final inspection can be automated.

[0019] The testing equipment can be configured to check quality using optical and, additionally or alternatively, electrical and, additionally or alternatively, tactile testing methods. This allows for the reliable verification of various properties.

[0020] For example, the testing equipment can be designed to reject the component if the test signal indicates low quality. This ensures that only defect-free components are processed further.

[0021] A process for manufacturing a component includes the following steps: Picking up a composite of a first component and a reactive multilayer system, as well as a second component, using a picking device of a device for manufacturing the component; Removing the composite and the second component from the receiving device and forming a stack using the composite and the second component, wherein the components are arranged externally, using a preparation device of the device for manufacturing the component; and Triggering a reaction of the reactive multilayer system using an activation device of the device for manufacturing the component, in order to connect the components to the component by means of a metallurgical bond. By utilizing the features of a previously mentioned device, the component can be manufactured automatically.

[0022] The invention is explained in more detail by way of example with reference to the accompanying drawings. These show: Fig. 1 a schematic representation of an embodiment of a device for manufacturing a component; Fig. 2 a schematic representation of a function of an embodiment of a recording device; Fig. 3 a schematic representation of a function of an exemplary embodiment of a preparation device; Fig. 4 a schematic representation of a function of an embodiment of an activation device; Fig. 5 a schematic representation of a function of an embodiment of a cleaning device; Fig. 6 a schematic representation of a function of an embodiment of a test device; Fig. 7 a schematic representation of a reaction of an embodiment of a reactive multi-layer system; and Fig. 8 a flowchart of an exemplary embodiment of a method for manufacturing a component.

[0023] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, without repeating these elements.

[0024] Fig. Figure 1 shows a schematic representation of an embodiment of a device 100 for manufacturing a component 101.

[0025] According to one embodiment, a first component 102, a second component 104, and a reactive multilayer system 106 are fed into the device 100, wherein the first component 102 and the reactive multilayer system 106 are fed in as a composite 108. The composite 108 can be understood as a single, integral part. The device 100 is designed to automatically join the components 102 and 104 to form the component 101 using the reactive multilayer system 106.

[0026] According to one embodiment, the first component 102 is an electronic component, for example a semiconductor component, and the second component 104 is a support for the first component 102. For example, the second component 104 is a printed circuit board or a substrate, for example a copper substrate. For example, the first component 102 is a chip, or, by way of example, a transistor or a diode. According to one embodiment, after ignition of the reactive multilayer system 106 and complete assembly of the first component 102, the reactive multilayer system 106, and the second component into a stack, at least one electrical connection of the first component 102 is permanently electrically and mechanically connected to an electrical contact of the second component 104.

[0027] According to an alternative embodiment, the first component 102 is a sensor and the second component 104 is a machine element, for example, a shaft for an electric drive or a gearbox. For example, the first component 102 is a force sensor which, after ignition of the reactive multilayer system 106 and complete assembly of the first component 102, the reactive multilayer system 106, and the second component into a stack, is firmly connected to the second component 104 in order to detect a deformation of the second component 104.

[0028] According to an alternative embodiment, the first component 102 represents one of the elements mentioned in connection with the second component 104, and the second component 104 represents one of the elements mentioned in connection with the first component 102.

[0029] According to one embodiment, the reactive multilayer system 106 comprises a plurality of alternating nanoscale layers and is designed to react exothermically upon ignition, thereby establishing a metallurgical bond between the components 102 and 104. For example, the layers of the reactive multilayer system 106 are grown onto a surface of the first component 102. Alternatively, the reactive multilayer system 106 is configured as a reactive multilayer film attached to the surface of the first component 102.

[0030] The device 100 comprises a receiving device 110, a preparation device 112 and an activation device 114.

[0031] The holding device 110 is designed to accommodate the assembly 108 consisting of the first component 102 and the reactive multilayer system 106, as well as the second component 104. Optionally, the holding device 110 is designed to accommodate multiple assemblies 108 and multiple second components 104. Different assemblies 108 and, additionally or alternatively, different second components 104 can also be accommodated, enabling the production of different components 101. For example, different first components 102 can be used for different assemblies 108.

[0032] The preparation device 112 is designed to remove the assembly 108, consisting of the first component 102 and the reactive multilayer system 106, as well as the second component 104, from the receiving device and to form a stack using the assembly 108 and the second component 104. In the stack, the components 102 and 104 are arranged externally so that they can be connected using the reactive multilayer system 106. According to one embodiment, the preparation device 112 includes a stacking device, for example, in the form of a placement robot.

[0033] If the composite 108 and the second component 104 are already in a directly processable form in the receiving device 110, the preparation device 112 is designed to stack the composite 108 and the second component 104 directly on top of each other after optional cleaning, in order to create a stack of the first component 102, the second component 104 and the reactive multilayer system 106 arranged between the components 102, 104.

[0034] According to one embodiment, the reactive multilayer system 106 in the composite 108 is composed of several separate subsystems. This allows the components 102, 104 to be connected to each other via several separate material-bonded connections.

[0035] Optionally, the preparation device 112 includes a cleaning device that allows the parts taken from the receiving device 110 to be cleaned before the stack is created.

[0036] The activation device 114 is configured to trigger a reaction of the reactive multilayer system located within the stack. For example, the activation device 114 includes a voltage source and electrical contacts through which a voltage generated by the voltage source can be applied to the stack to cause an ignition spark in the region of the reactive multilayer system 106. Additionally or alternatively, the activation device 114 includes, for example, a laser source to direct a laser beam onto the reactive multilayer system 106. Additionally or alternatively, the activation device 114 includes, for example, a heating device to heat the reactive multilayer system 106 sufficiently to initiate the reaction.

[0037] According to one embodiment, the activation device 114 is configured to apply pressure to the stack during the reaction of the reactive multilayer system 106 in order to press the components 102, 104 against each other. For example, the activation device 114 comprises a suitable applying pressure device, such as a plunger, which presses against one of the components 102, 104.

[0038] According to one embodiment, the device 100 comprises a cleaning device 116 which is designed to clean the component 101 after the components 102, 104 have been joined by material bonding.

[0039] According to one embodiment, the device 100 comprises a test device 118 configured to check the quality of the component 101. For example, the test device 118 is configured to provide a test signal indicating low or high quality of the component 101 that has just been manufactured. To test the component 101, the test device 118 is configured, for example, to perform an optical, electrical, or tactile test procedure. If the component 101 fails the test, the test device 118 is configured, according to one embodiment, to reject the corresponding component 101.

[0040] According to one embodiment, the devices 110, 112, 114 together with the optional devices 116, 118 form a unit and are, for example, combined to create a machine. Such a machine is characterized, for example, by a housing in which the devices 110, 112, 114, 116, 118 are received, or by a support frame in which the devices 110, 112, 114, 116, 118 are held.

[0041] According to one embodiment, the device 100 is designed to use reactive multilayer systems for joining two parts, here components 102 and 104, with solderable surfaces. The reactive multilayer system 106 is already directly grown on one of the parts, here the first component 102. Such a bonding process, for example in power electronics or in the application of pressure or force sensors, consists of many individual manufacturing steps. The device 100, for example in the form of a machine for the optimized production of RMS bonds with RMS grown directly on one part, here exemplified on the first component 102, enables a combination of these steps required for the RMS bond manufacturing process.

[0042] In order to produce an electrically and thermally conductive RMS connection between the components 102, 104, the device 100 is designed to perform all or at least some of the following steps automatically, according to different embodiments.

[0043] The reactive multilayer system 106 is grown onto one of the parts, here onto the first component 102. This process can be carried out separately. Optionally, however, the device 100 includes an application unit 120 configured to produce the composite 108 by applying the reactive multilayer system 106 to the first component 102, for example by growing it.

[0044] Joining the parts to be connected, here the composite 108 and the second component 104, by, for example, connecting a bare chip in the electronics, on which the reactive multilayer system 106 has grown, to a substrate.

[0045] Applying a bond print.

[0046] Activation of the reactive multilayer system 106, for example in the form of a reactive multilayer film or grown layers, by a small local energy pulse.

[0047] Optional, cleaning and inspection of the manufactured component 101.

[0048] Using the device 100 advantageously avoids the need to perform the individual processes manually and separately. By automating these processes, the time required can be minimized. This automation also allows even labor-intensive processes to be carried out cost-effectively, accurately, and reliably. Furthermore, the automation prevents variations in the individual processes from beginning to end, ensuring reproducible bond quality. Overall, producing the RMS bond using a machine that performs an optimized RMS bond manufacturing process with directly grown RMS on one of the parts is very cost-effective.

[0049] Based on the following Fig. Figures 2 to 6 illustrate exemplary embodiments of individual components of the device 100 for an embodiment in which the assembly 108, for example, a bare chip with a grown reactive multilayer system 106, is connected to the second component 104, for example, a substrate. The components of the device 100, which is designed as a machine according to one embodiment, fulfill the requirements specified in the Fig. Sections 2 to 6 describe the sub-functions for producing an RMS bond. In this embodiment, the reactive multilayer system 106 has already grown onto one of the parts, here the first component 102.

[0050] Fig. Figure 2 shows a schematic representation of a function of an embodiment of a receiving device 110, which is, for example, part of an embodiment of the based on Fig. The device described in section 1 is.

[0051] According to one embodiment, the receiving device 110 comprises a first magazine 222, from which at least one assembly 108 is received, and a second magazine 224, from which at least one second component 104 is received. By way of example, the second magazine 224 is configured to receive a plurality of second components 104, 204, 205, and the first magazine 222 is configured to receive a plurality of assemblies 108, 208, 209. As indicated by the arrows, the corresponding parts can be dispensed to the downstream preparation device as needed.

[0052] According to one embodiment, the receiving device 110 handles the individual parts required for manufacturing the component. The receiving device 110 comprises, as part of the assembly based on… Fig. The machine mentioned in section 1 has an input for the individual components of the RMS bonding process, namely the first component 102, for example a solderable part, e.g. a bare die with a grown reactive multilayer system 106, and the second component 104, for example a solderable substrate. These components can be stored in a defined manner in a magazine or magazines 222 and 224.

[0053] Fig. Figure 3 shows a schematic representation of a function of an embodiment of a preparation device 112, which is, for example, part of an embodiment of the based on Fig. The device described in section 1 is.

[0054] The preparation device 112 is designed to form a stack from a component 108 removed from the receiving device and a second component 104 removed from the receiving device. The reactive multilayer system 106 is arranged between the components 102 and 104. According to one embodiment, the preparation device 112 for creating the stack comprises a stacking device 330, for example in the form of a placement robot.

[0055] Optionally, the preparation unit 112 includes a cleaning unit designed to clean parts removed from the receiving unit before they are stacked.

[0056] According to one embodiment, the stacking device 330 is designed to select and place the individual parts suitable for the stack.

[0057] According to one embodiment, a preparation process is carried out using the preparation unit 112. The preparation unit 112, as part of the machine, handles the preparation for the RMS bond manufacturing process. This preparation can consist of the following steps: surface cleaning and inspection of the first component 102, for example, the solderable part, with the reactive multilayer system 106 and / or the second component 104, for example, in the form of a solderable target substrate. An automated placement process is then performed to assemble the parts, here the first component 102 with the reactive multilayer system 106 and the second component 104, e.g., by the placement robot.

[0058] Fig. Figure 4 shows a schematic representation of a function of an embodiment of an activation device 114, which is, for example, part of an embodiment of the based on Fig. The device described in section 1 is.

[0059] The activation device 114 is designed to form component 101 from the stack of components 108, specifically the first component 102 with reactive multilayer system 106, and the second component 104. In component 101, components 102 and 104 are bonded together using an activated reactive multilayer system 406. This activated reactive multilayer system 406 is formed by a reaction of the reactive multilayer system 106 located between components 102 and 104.

[0060] To trigger the reaction, the activation device 114 has an ignition device 440 configured to generate, for example, an electrical, optical or thermal pulse 442, which provides sufficient heat to activate the reactive multilayer system 106.

[0061] According to one embodiment, the preparation device 112 comprises an actuation device 444, with which a pressure 446 is exerted on the stack before or at least during the reaction of the reactive multilayer system 106, by which the components 102, 104 are pressed against each other.

[0062] According to one embodiment, an adhesive bonding and activation process is carried out by means of the activation device 114. The activation device 114, as part of the machine, can perform the activation process of the RMS bond manufacturing process. This activation process can consist of the following steps: Defined and controlled application of a bond pressure, here pressure 446. RMS activation by the activation pulse 442 of local energy from electrical, optical, or thermal sources, here the ignition device 440.

[0063] According to one embodiment, the machine or, more specifically, the activation device 114 comprises a suitable device or sub-function for preventing splashing during the reactive multilayer bonding process.

[0064] Fig. Figure 5 shows a schematic representation of a function of an embodiment of a cleaning device 116, which is, for example, part of an embodiment of the based on Fig. The device described in section 1 is.

[0065] According to one embodiment, the cleaning device 116 is designed to clean the component manufactured using the activation device using a cleaning agent 550 and additionally or alternatively using an airflow 552.

[0066] According to one embodiment, a cleaning process is carried out using the cleaning device 116: The cleaning device 116, as part of the machine, can perform post-processing, e.g., cleaning the RMS bond. This cleaning can be carried out, for example, with the airflow 552, such as compressed air, and / or with the cleaning agent 550.

[0067] Fig. Figure 6 shows a schematic representation of a function of an embodiment of a test device 118, which is, for example, part of an embodiment of the based on Fig. The device described in section 1 is.

[0068] The testing device 118 is configured to test the component manufactured using the activation device and optionally cleaned using the cleaning device. For example, the testing device 118 is configured to provide, depending on the test result, either a test signal indicating high quality 660 or low quality 662 of the component. For example, the testing device 118 is configured to test the component using an optical, electrical, or tactile testing method.

[0069] According to one embodiment, a quality control process is carried out using the testing device 118: The testing device 118, as part of the machine, can perform the quality control process. This process can include testing methods such as optical inspection, electrical functional testing, tactile testing, SAT (Scanning Acoustic Tomography), and / or X-ray inspection. The measured quality characteristics can be assigned to the product, in this case, the component, and defective parts can be automatically sorted out.

[0070] Advantageously, the machine can optimize the RMS bond manufacturing process by taking into account all the factors identified by the Fig. The 2 to 6 described sub-functions are combined, thus offering high efficiency, automated production, high process reliability, good reproducibility, good scalability and high cost efficiency in mass production.

[0071] Fig. Figure 7 shows a schematic representation of the reaction of an embodiment of a reactive multi-layer system 106 to an activated reactive multi-layer system 406, as used, for example, to manufacture a component, as described in Fig. Figure 1 shows. The reactive multilayer system 106, for example, is composed of a plurality of first layers 770 and a plurality of second layers 772, which are arranged alternately, with optionally mixed regions 774 located between adjacent layers 770, 772.

[0072] A schematic representation of the activation position, exemplified by a spark pulse 442, is shown. Starting from the activation position, the material of the reactive multi-layer system 106 reacts to form reacted material of the activated reactive multi-layer system 406. A corresponding direction of propagation 776 is indicated by an arrow.

[0073] According to one embodiment, the reactive multilayer system 106 is a grown multilayer that provides instant heat for a variety of applications in many industries. This reactive multilayer can be grown directly onto a part, for example, by depositing thousands of alternating nanoscale layers, which are then... Fig. 7 are schematically represented by layers 770 and 772 and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical, optical, or thermal source, as described in Fig. Figure 7 is schematically represented by pulse 442. The reactive multi-layer system 106 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second.

[0074] In this way, a connection that is both electrically and thermally conductive can be established, e.g., between a bare chip in electronics and a leadframe, a packaged chip and a printed circuit board, etc. - i.e., generally a connection between two parts, which are referred to here by way of example as components.

[0075] Fig. Figure 8 shows a flowchart of an exemplary embodiment of a method for manufacturing a component. The method can be implemented, for example, using the apparatus described with reference to the preceding figures, such as a machine, to manufacture a component as is found, for example, in Fig. 1 is shown.

[0076] In step 801, a composite consisting of a first component and a reactive multilayer system, as well as a second component, are mounted using a mounting device, such as that shown in Fig. 2 is described.

[0077] In step 803, the assembly and the second component are removed from the receiving device, and a stack is formed using these parts and a preparation device, as can be seen, for example, in Fig. As described in section 3. Optionally, cleaning is also performed.

[0078] In step 805, a reaction of the material in the stack of the reactive multilayer system is triggered using an activation device, such as that provided by Fig. As described in section 4. This creates a material-bonded connection between the components.

[0079] Optionally, the component is then cleaned in step 807 and also optionally subjected to quality control in step 809. Reference sign 100 Device 101 Component 102 first component 104 second component 106 reactive multilayer system 108 network 110 Reception facility 112 Preparatory facility 114 Activation device 116 Cleaning equipment 118 Testing equipment 120 Application device 204, 205 further second building elements 208, 209 other alliances 222 first magazine 224 second magazine 330 Stacking device 406 activated reactive multilayer system 440 Ignition device 442 Impuls 444 Pressurization device 446 Print 550 cleaning agents 552 compressed air 660 high quality 662 low quality 770 first layer 772 second layer 774 mixed regions 776 Direction of propagation Step 801 of recording 803 Step of removal 805th step of triggering 807 Cleaning Step 809 Step of checking

Claims

[1] Device (100) for manufacturing a component (101), wherein the device (100) has the following features: a receiving device (110) configured to receive a composite (108) of a first component (102) and a reactive multilayer system (106), as well as a second component (104); a preparation device (112) configured to remove the composite (108) and the second component (104) from the receiving device (110) and to form a stack using the composite (108) and the second component (104), wherein the components (102, 104) are arranged externally; and an activation device (114) configured to trigger a reaction of the reactive multilayer system (106) to connect the components (102, 104) to the component (101) by means of a material-bonded connection. [2] Device (100) according to claim 1, wherein the device (100) is designed as a machine and the receiving device (110), the preparation device (112) and the activation device (114) are components of the machine. [3] Device (100) according to one of the preceding claims, wherein the receiving device (110) is configured to receive at least one further assembly (208) of a further first component and a further reactive multilayer system, as well as a further second component (204), and to store together with the assembly (108) and the second component (104). [4] Device (100) according to one of the preceding claims, wherein the receiving device (110) is designed to receive the assembly (108) comprising the first component (102) designed as an electronic component or as a sensor and the second component (104) as a carrier for electronic components or as a machine element. [5] Device (100) according to one of the preceding claims, comprising an application device (120) configured to apply the reactive multilayer system (106) to the first component (102) to produce the composite (108). [6] Device (100) according to one of the preceding claims, wherein the activation device (114) is configured to trigger the reaction by an electrical, optical or thermal pulse (442). [7] Device (100) according to one of the preceding claims, wherein the activation device (114) is configured to apply pressure (446) to the stack. [8] Device (100) according to one of the preceding claims, comprising a cleaning device (116) designed to clean the component (101). [9] Device (100) according to one of the preceding claims, comprising a test device (118) configured to check the quality of the component (101) and to provide a test signal indicating low quality (662) or high quality (660). [10] Method for manufacturing a component (101) wherein the method comprises the following steps: Picking up (801) a composite (108) of a first component (102) and a reactive multilayer system (106) and a second component (104) using a receiving device (110) of a device (100) for producing the component (102); Removing (803) the composite and the second component (104) from the receiving device (110) and forming a stack using the composite (108) and the second component (104), wherein the components (102, 104) are arranged externally, using a preparation device (112); and Triggering (805) a reaction of the reactive multilayer system (106) using an activation device (114) to connect the components (102, 104) to the component (101) by means of a metallurgical bond.

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