Semiconductor package

Abstract

In a semiconductor package (1), wherein the semiconductor package (1) is suitable for receiving a semiconductor circuit, wherein the semiconductor package (1) is suitable for being inserted into a receiving location of a busbar system, wherein the semiconductor package (1) comprises a contact region, the contact region is suitable for mediating a plurality of electrical connections between the busbar system and the semiconductor circuit when the semiconductor package (1) is inserted into the receiving location.

Claims

[1] Semiconductor package (1), wherein the semiconductor package (1) is suitable for receiving a semiconductor circuit, wherein the semiconductor package (1) is suitable for being inserted into a receiving location of a busbar system, wherein the semiconductor package (1) comprises a contact area, characterized by that the contact area is suitable for mediating a plurality of electrical connections between the busbar system and the semiconductor circuit when the semiconductor package (1) is inserted into the receiving space. [2] Semiconductor package (1) according to claim 1, characterized by that the semiconductor package (1) comprises a housing (2), wherein the housing comprises the contact region, wherein the contact region is preferably a contact wall. [3] Semiconductor package (1) according to claim 2, characterized bythat the housing (2) is substantially cuboid-shaped, wherein the housing (2) preferably comprises an upper side and a lower side opposite the upper side and four side walls, wherein the upper side preferably comprises the contact wall. [4] Semiconductor package (1) according to one of the preceding claims, characterized by that the semiconductor package (1) comprises a heat dissipation wall, - wherein the underside preferably comprises the heat dissipation wall, and / or - wherein the heat dissipation wall is suitable for dissipating heat generated during operation of the semiconductor circuit and / or during operation of the busbar system from the semiconductor package (1). [5] Semiconductor package (1) according to one of the preceding claims, characterized bythat the contact area, preferably the contact wall, comprises a plurality of individual contact surfaces (3.1, 3.2, 4.1, 4.2), wherein the contact area, preferably the contact wall, preferably comprises four individual contact surfaces (3.1, 3.2, 4.1, 4.2). [6] Semiconductor package (1) according to claim 5, characterized by in that the plurality of individual contact surfaces (3.1, 3.2, 4.1, 4.2) comprises two chip contacts (4.1, 4.2) and / or two rail contacts (3.1, 3.2), wherein the semiconductor package (1) is preferably designed such that the chip contacts (4.1, 4.2) are suitable for being electrically connected to individual semiconductor elements of the semiconductor circuit and / or wherein the semiconductor package (1) is preferably designed such that the rail contacts (3.1, 3.2) are suitable for being connected to a planar rail region of the semiconductor circuit, wherein the semiconductor elements are preferably arranged on the planar rail region. [7] Semiconductor package (1) according to one of the preceding claims, characterized by , that - the semiconductor package (1) comprises a source contact pin (5) and / or a gate contact pin (6), - wherein the source contact pin (5) and / or the gate contact pin (6) are preferably connected to control contacts of the semiconductor circuit, and / or - wherein the source contact pin (5) and / or the gate contact pin (6) preferably protrude through the contact wall. [8] Switch element comprising at least one, preferably at least two semiconductor packages (1) according to one of the preceding claims. [9] Power electronics system (8) comprising at least one switch element according to claim 8 and / or at least one semiconductor package (1) according to one of claims 1 to 7. [10] Vehicle comprising a plurality of semiconductor packages (1) according to one of claims 1 to 7 and / or a plurality of switch elements according to claim 8 and / or a power electronics system (8) according to claim 9.

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