Busbar system

Abstract

Busbar system (1), wherein the busbar system (1) comprises a first direct current busbar (3), a second direct current busbar (4) and an alternating current busbar (2), wherein two of the three busbars (2, 3, 4) are arranged at least partially overlapping, wherein the busbar system (1) comprises a plurality of receiving locations for semiconductor components (10.1... 10.4), characterized in that that the busbar system (1) comprises a plurality of contact clips, wherein the contact clips are suitable for contacting semiconductor components (10.1... 10.4) inserted into the receiving locations from above when such semiconductor components (10.1... 10.4) are inserted into the receiving locations.

Description

Technical area

[0001] The invention relates to a busbar system according to the preamble of claim 1. The invention further relates to a power electronics system and a vehicle according to the independent claims. State of the art

[0002] Electric vehicles often use batteries, which provide direct current, as energy storage. However, the electric motors that power such electric vehicles are typically AC motors, such as three-phase motors. For this reason, electric vehicles typically use power electronic components to convert the direct current provided by the batteries into the alternating current required by the motors.

[0003] This presents various challenges. Firstly, this conversion from direct current to alternating current should be as energy-efficient as possible, for example, by minimizing losses caused by stray inductances. Furthermore, high power densities are desirable, for example, to minimize the space required for the power electronic components in the vehicle. Furthermore, such power electronic systems should be as simple as possible to enable easy assembly and, ideally, to keep system complexity as low as possible.

[0004] When connecting different power electronic components in electric vehicles, so-called busbars are often used. These interconnect the power electronic components in such a way that, for example, bridge circuits are realized. However, the known busbar systems each have different disadvantages, for example, with regard to their insufficient power density, their complex structure, or their energy efficiency. Instead of the English term "busbar," the purely German term "busbar" is used below. In other words, the terms "busbar" and "busbar" are used analogously and interchangeably in this patent application.

[0005] Exemplary busbar systems are known from US 5579217 A, DE 10 2019 203 399 A1, DE 10 2013 102 707 A1, DE 198 51 161 A1 and EP 3 544 167 B1. General description of the invention

[0006] The object of the invention is to eliminate or at least reduce the disadvantages of the prior art.

[0007] The object is achieved by a busbar system, wherein the busbar system comprises a first direct current busbar, a second direct current busbar and an alternating current busbar, wherein two of the three busbars are arranged at least partially overlapping.

[0008] A "busbar system" is understood in particular to be a system of electrical conductors, which are typically plate-shaped or flat, at least in sections. Such a busbar system typically has different components, whereby the individual components can, for example, be busbars themselves or parts of busbars. A "DC busbar" is understood to be a busbar element suitable for conducting direct current. An "AC busbar" is understood to be a busbar element suitable for conducting alternating current.By at least partially overlapping at least two of the three busbars, it is possible to reduce a stray inductance of the busbar system and increase a power density, whereby assembly of the busbar system can also be simplified because placing busbar elements on top of one another can, at least in some cases, enable a simpler connection to power electronic elements than if busbar elements are arranged next to one another.

[0009] The busbar system comprises a plurality of receiving locations for semiconductor components, wherein the busbar system preferably comprises an even number of receiving locations for semiconductor components, particularly preferably at least two such receiving locations or at least four such receiving locations or at least six such receiving locations, wherein the receiving locations preferably all have an identical shape and / or wherein the receiving locations preferably have at least a substantially rectangular shape. The term "semiconductor components" is understood to mean, for example, electrical components which comprise at least one semiconductor element. The semiconductor components can be semiconductor packages, each of which comprises a plurality of individual semiconductor components.

[0010] Furthermore, the busbar system comprises a plurality of contact clips, wherein the contact clips are suitable for contacting semiconductor components inserted into the receiving locations from above when such semiconductor components are inserted into the receiving locations, and / or wherein the AC busbar preferably comprises three or six or nine contact clips, or wherein the first DC busbar preferably comprises two or four or six contact clips and / or wherein the second DC busbar preferably comprises no contact clips. The term "contact clip" is typically understood to mean a typically metallic component that is suitable for establishing an electrical connection between a busbar, on the one hand, and a semiconductor component, on the other.

[0011] In advantageous embodiments, the first DC busbar, the second DC busbar, and the AC busbar are arranged to at least partially overlap. Such at least partial overlapping of all three busbars of the busbar system has the advantage that it can achieve a particularly good reduction in stray inductance and a particularly high power density, at least in some embodiments. However, it is of course also possible for only two of the busbars to at least partially overlap, rather than all three busbars.

[0012] In advantageous embodiments, the busbar system comprises a first insulation film, wherein the first insulation film preferably electrically insulates the first DC busbar and / or the second DC busbar and / or the AC busbar from one another. Such an insulation film is typically an electrically insulating plastic film, which is ideally electrically insulating but, on the other hand, is thermally conductive. Such an insulation film has the advantage that it can be easily arranged between two busbars and, for example, enables a compact design of the busbar system. The first insulation film can, for example, be arranged between the first DC busbar and the second DC busbar.Furthermore, it is possible for the first insulation film to be arranged between the AC busbar and one of the two DC busbars. The first insulation film electrically insulates the busbars between which it is arranged. Instead of an insulation film, however, it is also possible to use insulating varnishes or overmolding, for example.

[0013] In advantageous embodiments, the busbar system comprises a second insulation film, wherein the second insulation film preferably electrically insulates the first direct current busbar and / or the second direct current busbar and / or the alternating current busbar from one another. Such an insulation film is typically an electrically insulating plastic film, which is ideally electrically insulating but, on the other hand, is thermally conductive. In advantageous embodiments, the busbar system thus comprises a first insulation film and a second insulation film, wherein two of the busbars are electrically insulated from one another by the first insulation film, and wherein the second insulation film electrically insulates the busbar already in contact with the first electrical insulation film from the busbar which has not previously been in contact with the first insulation film.In typical embodiments, the first insulation foil is in contact with both the AC busbar and the first DC busbar, as well as with the second DC busbar. In typical embodiments, the second insulation foil is in contact with the AC busbar and the first DC busbar. In typical embodiments, the first insulation foil and the second insulation foil are arranged parallel to each other.

[0014] In advantageous embodiments, the busbar system is constructed in a sandwich design. The term "sandwich design" refers to the fact that all busbars each comprise flat areas that are arranged at least partially or at least largely overlapping, with the first insulation film and / or the second insulation film preferably being arranged at least in places between the busbars.

[0015] In advantageous embodiments, all of the contact clips of the first DC busbar are arranged parallel to one another. In advantageous embodiments, the contact clips of the AC busbar are arranged one-third parallel to the contact clips of the first DC busbar and / or two-thirds orthogonal to the contact clips of the first DC busbar. The term “arranged parallel to one another” is to be understood that the contact clips each comprise longitudinal axes which run parallel to one another. Analogously, the term “orthogonal” is to be understood that these longitudinal axes run orthogonal to one another. In advantageous embodiments, each contact clip comprises an electrically conductive metal sheet which, for example, comprises two flat regions and a bent region.In advantageous embodiments, the AC busbar is constructed such that each semiconductor component inserted into a receiving location is contacted by exactly one or exactly two contact clips of the AC busbar when the semiconductor components are inserted into the receiving locations. In advantageous embodiments, the first DC busbar is constructed such that exactly two contact clips of the first DC busbar are assigned to exactly half of the receiving locations, wherein these two contact clips are typically arranged on opposite sides of the respective receiving locations. The fact that the contact clips are suitable for contacting the semiconductor components from above also means that the contact clips typically do not contact the semiconductor components laterally.This saves space and keeps the power loop of the busbar system small, which also keeps the stray inductance small.

[0016] The object is further achieved by a power electronics system comprising a busbar system according to at least one of the previously described embodiments, wherein the power electronics system preferably comprises at least one DBC, wherein the DBC preferably comprises a top side, a bottom side and an insulation layer, wherein the bottom side preferably comprises a copper layer, wherein the top side preferably comprises a conductive layer, wherein the top side is preferably divided into a plurality of mutually insulated conductive surfaces, wherein a first region of the conductive surfaces is preferably conductively connected to the AC busbar and wherein a second region of the conductive surfaces is preferably conductively connected to the second DC busbar.The term “DBC” is short for “Direct Bonded Copper,” although German experts also typically use the term “DBC” or “DBC substrate.” In advantageous embodiments, the copper layer is a copper ceramic layer. In advantageous embodiments, the top side comprises a first region which is conductively connected to the second DC busbar. In advantageous embodiments, the top side comprises a second region which is conductively connected to the AC busbar. In advantageous embodiments, the first region of the top side is part of the second DC busbar. In advantageous embodiments, the second region of the top side is part of the AC busbar. In advantageous embodiments, the top side is in contact with the first insulation film.In advantageous embodiments, the first insulation film partially insulates the first region of the upper side from the first DC busbar. In advantageous embodiments, the first insulation film electrically insulates the second region of the upper side from the first DC busbar. In advantageous embodiments, the first DC busbar is a negative DC busbar. In advantageous embodiments, the second DC busbar is a positive DC busbar. In advantageous embodiments, the power electronics system is constructed such that at least some, preferably all of the contact clips are suitable for contacting at least one semiconductor component from a side of the semiconductor component facing away from the DBC when such a semiconductor component is inserted into a receiving location.In principle, another type of substrate can be used to accommodate semiconductor components instead of a DBC.

[0017] In advantageous embodiments, the busbar system is mounted on the top side of the DBC, wherein the first insulation foil preferably electrically insulates the top side of the DBC from the first DC busbar and / or from the second DC busbar and / or from the AC busbar.

[0018] A “power electronics system” is to be understood in particular as a technical system which is suitable for participating in a power electronics process and / or for incorporating at least one power electronics component.

[0019] The object is further achieved by a vehicle comprising a busbar system according to the invention and / or a power electronics system according to the invention. Short description of the drawings

[0020] The invention is briefly explained below with reference to drawings, in which: Fig. 1: a schematic perspective view of a busbar system according to the invention in a first embodiment; Fig. 2: a side view of the already in Fig. 1 shown busbar system; Fig. 3a: a schematic representation of a cross-sectional view through the Fig. 1 busbar system shown; Fig. 3b: a schematic sectional view of the Fig. 3a shown cross section through the Fig. 1 busbar system shown; Fig. 4a: a schematic representation of a section of the Fig. 3b shown cross-section; and Fig. 4b: an enlarged view of the Fig. 4a shown section. Description of preferred embodiments

[0021] Fig. Figure 1 shows a schematic perspective view of a busbar system 1 according to the invention in a first embodiment. The busbar system 1 comprises an AC busbar 2, which in the Fig. 1 comprises a plurality of components. This is one reason why in Fig. 1 two reference numerals point to different parts of the AC busbar 2. The busbar system 1 further comprises a first DC busbar 3. This first DC busbar 3 also comprises Fig. 1, a plurality of components, which is one reason why the first DC busbar 3 is provided with two reference numerals. The busbar system 1 further comprises a second DC busbar 4. In the embodiment shown in Fig. In the embodiment shown in Figure 1, the first DC busbar 3 is a negative DC busbar, i.e. a busbar that is suitable for being connected to a negative potential. The second DC busbar 4 is in the Fig. 1, a positive busbar, which is therefore typically suitable for being connected to a positive potential. The busbar system 1 further comprises a first insulation film 5 and a second insulation film 6. In Fig. 1 also shows a DBC 7, i.e., a direct bonded copper. The busbar system 1, together with the DBC 7, forms a power electronics system according to the invention. Alternatively, it is also possible to consider the DBC 7 as part of the busbar system 1. If such an approach is taken, the busbar system 1 would therefore comprise the DBC 7. The first insulating film 5 is arranged on an underside of the busbar system 1 and insulates the busbar system 1 from the DBC 7. In particular, the first insulating film 5 is arranged below the first DC busbar 3. The second insulating film 6 is arranged between a part of the first DC busbar 3 and a part of the AC busbar 2. An area of ​​the first insulating film 5 is more than twice as large as an area of ​​the second insulating film 6. The AC busbar 2 comprises a total of six contact clips 8.1...8.6.The first DC busbar 3 comprises a total of four contact clips 9.1... 9.4. In addition, . Fig. 1 shows four semiconductor components 10.1...10.4. Each of these semiconductor components 10.1...10.4 is inserted into a receiving location of the busbar system 1. Semiconductor components 10.1...10.4 are schematically illustrated as cuboid-shaped elements. For the sake of clarity, the receiving locations of the busbar system 1 are not provided with reference numerals. It is clear that each semiconductor component 10.1...10.4 is contacted by a plurality of contact clips 8.1...8.6, 9.1...9.4, specifically from above. In other words, the busbar system 1 is preferably constructed such that at least some of the contact clips 8.1...8.6, 9.1...9.4 press the semiconductor components 10.1...10.4 into the respective receiving locations.

[0022] Fig. 2 shows a side view of the already in Fig. 1 shown busbar system 1. In particular, in Fig. 2, the AC busbar 2, the first DC busbar 3 and the second DC busbar 4 can be seen. Furthermore, it can be seen that the AC busbar 2 and the first DC busbar 3 comprise different components, which is also shown in Fig. 2 is indicated by several reference numerals. In Fig. 2, the first insulation film 5 and the second insulation film 6 are also visible. Fig. 2 the DBC 7 is shown. In Fig. The detailed structure of the DBC 7 can also be seen in Figure 2. The DBC 7 comprises, in particular, a bottom side 11 and a top side, wherein the top side comprises a first region 12 and a second region 13. A planar insulation layer 14 is arranged between the bottom side 11 and the top side 12, 13. This insulation layer 14 is typically electrically insulating but thermally conductive. Fig. 2 the contact clip 8.3 of the AC busbar 2 and the contact clip 9.4 of the first DC busbar 3 can be seen. In addition, Fig. 2 that the second DC busbar 4 is attached to the first area 12. Furthermore, in Fig. 2 that the AC busbar 2 is attached to the second area 13. In Fig. 2 also shows the contact clip 8.2 of the AC busbar 2. This contact clip 8.2 connects the second area 13 of the top side of the DBC 7 with a part of the AC busbar 2. In Fig. 2 also shows that the first insulation film 5 insulates the top side of the DBC 7 from a bottom side of the busbar system 1. Furthermore, it can be seen that the second insulation film 6 is arranged between the AC busbar 2 and the first DC busbar 3 and electrically insulates the AC busbar 2 and the first DC busbar 3 from each other.

[0023] Fig. 3a shows a schematic representation of a cross-sectional profile through the Fig. 1 shown busbar system 1.

[0024] Fig. 3b shows a schematic view of the Fig. 3a indicated cross section through the Fig. 1 shown busbar system 1. In Fig. 3b again shows the AC busbar 2 and the first DC busbar 3. The second insulation film 6 is arranged between the AC busbar 2 and the first DC busbar 3. This second insulation film 6 thus electrically insulates the AC busbar 2 from the first DC busbar 3. In addition, Fig. 3b shows a section of the DBC with a part of the first region 12 of the top side of the DBC and a part of the bottom side 11 of the DBC. The insulation layer 14 is arranged between the bottom side 11 and the first region 12. The first region 12 is electrically connected to the second DC busbar 4, which is shown in Fig. 3b, however, is not visible due to the cross-sectional view. The first insulation film 5 is arranged between the first region 12 and the first DC busbar 3. The first insulation film 5 thus electrically insulates the first region 12 of the DBC from the first DC busbar 3. Fig. 3b also shows the contact clips 8.3, 8.4, 8.5 and 8.6 of the AC busbar 2. Furthermore, Fig. 3b shows semiconductor components 10.3 and 10.4. Contact clips 8.3 and 8.4 contact a top side of semiconductor component 10.3. Contact clips 8.5 and 8.6 contact a top side of semiconductor component 10.4.

[0025] Fig. 4a shows a schematic representation of a section of the Fig. 3b. The cutout area is in Fig. 4a represented by a dashed square.

[0026] Fig. 4b shows an enlarged view of the Fig. 4a. In Fig. 4b thus again shows a part of the busbar system 1. The AC busbar 2 and the first DC busbar 3 are shown. The second insulation foil 6 is arranged between the AC busbar 2 and the first DC busbar 3. The contact clips 8.5, 8.6 of the AC busbar 2 are also shown in Fig. 4b. The already mentioned Fig. 3b shows a section of the DBC with the first region 12, the underside 11, and the insulation layer 14. It can again be seen that the contact clips 8.5, 8.6 contact the semiconductor component 10.4 from above and thus press the semiconductor component 10.4 into its receiving location in the busbar system 1 (or in other words: fix it in its receiving location), with one end of the contact clips 8.5, 8.6 being connected to the AC busbar 2, and the other end of the contact clips 8.5, 8.6 contacting the semiconductor component 10.4 from above. Fig. 4b also shows the first insulation film 5, which is arranged between the first region 12 of the upper side of the DBC on the one hand and the first DC busbar 3. Reference symbol 1 busbar system 2 AC busbar 3 first DC busbar 4 second DC busbar 5 first insulation foil 6 second insulation foil 7 DBC substrate 8.1... 8.6 AC busbar contact clips 9.1 ... 9.4 Contact clips of the first DC busbar 10.1... 10.4 Semiconductor components 11 Bottom side (of the DBC substrate) 12 first area (top) 13 second area (the top) 14 Insulation layer

Claims

[1] Busbar system (1) wherein the busbar system (1) comprises a first DC busbar (3), a second DC busbar (4) and an AC busbar (2) wherein two of the three busbars (2, 3, 4) are arranged at least partially overlapping, wherein the busbar system (1) comprises a plurality of mounting positions for semiconductor components (10.1... 10.4), characterized by , that the busbar system (1) comprises a plurality of contact clips, wherein the contact clips are suitable for contacting semiconductor devices (10.1... 10.4) inserted into the mounting locations from above when such semiconductor devices (10.1... 10.4) are inserted into the mounting locations. [2] Busbar system (1) according to claim 1, characterized by, that the first DC busbar (3) and the second DC busbar (4) and the AC busbar (2) are arranged at least partially overlapping. [3] Busbar system (1) according to any one of the preceding claims, characterized by , that the busbar system (1) comprises a first insulating foil (5), wherein the first insulating foil (5) preferably electrically isolates the first DC busbar (3) and / or the second DC busbar (4) and / or the AC busbar (2) from each other. [4] Busbar system (1) according to claim 3, characterized by , that the busbar system (1) comprises a second insulating foil (6), wherein the second insulating foil (6) preferably electrically isolates the first DC busbar (3) and / or the second DC busbar (4) and / or the AC busbar (2) from each other. [5] Busbar system (1) according to any one of the preceding claims, characterized by , that the busbar system (1) is constructed in sandwich form. [6] Busbar system (1) according to any one of the preceding claims, characterized by , that the busbar system (1) preferably comprises an even number of mounting positions for semiconductor devices (10.1... 10.4), in particular preferably at least two such mounting positions or at least four such mounting positions or at least six such mounting positions, wherein the mounting positions preferably all have an identical shape and / or wherein the mounting positions preferably have at least substantially a rectangular shape. [7] Busbar system (1) according to any one of the preceding claims, characterized by, that the AC busbar (2) comprises three or six or nine contact clips (8.1… 8.6) and / or wherein the first DC busbar (3) preferably comprises two or four or six contact clips (9.1… 9.4) and / or wherein the second DC busbar (4) preferably does not comprise any contact clips. [8] Power electronics system comprising a busbar system (1) according to any one of the preceding claims, characterized by, that the power electronics system comprises at least one DBC substrate (7), wherein the DBC substrate (7) preferably comprises a top surface, a bottom surface (11) and an insulating layer (14), wherein the bottom surface (11) preferably comprises a copper layer, wherein the top surface preferably comprises a conductive layer, wherein the top surface is preferably divided into a plurality of mutually insulated conductive areas (12, 13), wherein a first area (12) of the conductive areas (12, 13) is preferably conductively connected to the AC busbar (2) and wherein a second area (13) of the conductive areas (12, 13) is preferably conductively connected to the second DC busbar (4). [9] Power electronics system according to claim 8, characterized by, that the busbar system (1) is mounted on the top of the DBC substrate (7), wherein the first insulating film (5) preferably electrically insulates the top of the DBC substrate (7) from the first DC busbar (3) and / or from the second DC busbar (4) and / or from the AC busbar (2). [10] Vehicle comprising a busbar system (1) according to any one of claims 1 to 7 and / or a power electronics system according to any one of claims 8 to 9.

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