Power electronics system

Abstract

A power electronics system (1, 1.1) comprising a plurality of busbars and a plurality of semiconductor circuits (2), comprises a first insulation film (18) which electrically insulates at least two of the busbars from one another.

Claims

[1] Power electronics system (1, 1.1) comprising a plurality of busbars and a plurality of semiconductor circuits (2), characterized by that the power electronics system (1, 1.1) comprises a first insulation film (18) which electrically insulates at least two of the busbars from one another. [2] Power electronics system (1, 1.1) according to claim 1, characterized by in that the plurality of busbars comprises an AC busbar, a first DC busbar and a second DC busbar (24, 24.1), wherein the busbars are arranged at least partially overlapping. [3] Power electronics system (1, 1.1) according to one of the preceding claims, characterized by that the power electronics system (1, 1.1) comprises a second insulation film (20) which electrically insulates the semiconductor circuits (4) from the first DC busbar. [4] Power electronics system (1, 1.1) according to one of the preceding claims, characterized by that the AC busbar and / or the first DC busbar are constructed in several parts and / or wherein the second DC busbar (24, 24.1) is constructed in one part, - wherein the AC busbar preferably comprises a plurality of AC contact clips (12) and a connecting bridge (10, 10.1) and an AC connection element (9, 9.1) and an AC rail element (11, 11.1), and / or - wherein the first DC busbar preferably comprises a DC connection element (15, 15.1) and a plurality of DC contact clips (16) and a DC rail element (14, 14.1). [5] Power electronics system (1, 1.1) according to claim 4, characterized bythat the AC contact clips (12) are attached to the AC rail element (11, 11.1) and that the DC contact clips (16) are attached to the DC rail element (14, 14.1). [6] Power electronics system (1, 1.1) according to one of the preceding claims, characterized by that each semiconductor circuit (2) comprises a substrate (3) and a plurality of semiconductor elements (4) and a first contact tab (5) and a second contact tab (6), wherein the semiconductor elements (4) are fastened to the substrate (3) and wherein the first contact tab (5) is fastened to a first half of the semiconductor elements (4) and wherein the second contact tab (6) is fastened to a second half of the semiconductor elements (4). [7] Power electronics system (1, 1.1) according to claim 6, characterized bythat each contact tab (5, 6) is fastened to a plurality of contact clips (12, 16), wherein all semiconductor elements (4) of each semiconductor circuit (2) are advantageously fastened either exclusively to AC contact clips (12) or exclusively to DC contact clips (16). [8] Power electronics system (1, 1.1) according to one of claims 4 to 7, characterized by , that - the DC rail element (14, 14.1) comprises a plurality of DC recesses (17) and the second insulation film (20) comprises a plurality of second insulation film recesses (21), wherein each of the DC contact clips (16) extends through one of the DC recesses (17) and through one of the second insulation film recesses (21), and - the AC rail element (11, 11.1) comprises a plurality of AC recesses (13) and the first insulation film (18) comprises a plurality of first insulation film recesses (19), wherein each of the AC contact clips (12) extends through one of the DC recesses (17) and through one of the second insulation film recesses (21) and through one of the AC recesses (13) and through one of the first insulation film recesses (19), - wherein the direct current rail element (14, 14.1) preferably comprises twice as many direct current recesses (17) as the alternating current rail element (11, 11.1) comprises alternating current recesses (13), - wherein the first insulation film (18) preferably comprises half as many first insulation film recesses (19) as the second insulation film (20) comprises second insulation film recesses (21). [9] Power electronics system (1, 1.1) according to one of the preceding claims, characterized bythat each semiconductor circuit (2) comprises a source contact pin (7) and a gate contact pin (8), wherein the contact pins (7, 8) preferably protrude perpendicularly from the semiconductor circuits (2), wherein a first half of the source contact pins (7) protrudes through one of the direct current recesses (17) and through one of the second insulating film recesses (21), wherein a first half of the gate contact pins (8) protrudes through one of the direct current recesses (17) and through one of the second insulating film recesses (21),wherein a second half of the source contact pins (7) protrudes through one of the DC recesses (17) and through one of the second insulating film recesses (21) and through one of the first insulating film recesses (19) and through one of the AC recesses (13), and wherein a second half of the gate contact pins (8) protrudes through one of the DC recesses (17) and through one of the second insulating film recesses (21) and through one of the first insulating film recesses (19) and through one of the AC recesses (13). [10] Power electronics assembly (22) comprising at least one power electronics system (1, 1.1) according to one of the preceding claims, preferably a plurality of power electronics systems (1, 1.1) according to one of the preceding claims. [11] Vehicle comprising a power electronics system (1, 1.1) according to one of claims 1 to 9 and / or a power electronics assembly (22) according to claim 10.

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