Method for manufacturing a strain gauge device, strain gauge device and method for manufacturing a component

Abstract

A method for manufacturing a strain gauge device (100) comprises providing a strain gauge (102) and applying layers to the strain gauge (102) to form a reactive multilayer system (104) on the strain gauge (102).

Description

[0001] The present invention relates to a method for manufacturing a strain gauge device, a strain gauge device and to a method for manufacturing a component.

[0002] A reactive multilayer system (RMS) can be used to connect elements.

[0003] Against this background, the present invention provides an improved method for manufacturing a strain gauge device, an improved strain gauge device, and an improved method for manufacturing a component according to the main claims. Advantageous embodiments are described in the dependent claims and the following description.

[0004] When RMS layers are applied directly to a strain gauge to form a reactive multilayer system, the reactive multilayer system can be manufactured with high quality and tailored to the specific application of the strain gauge. This allows, for example, a very stable connection of the strain gauge to a component and good transmission of strain from the component to the strain gauge.

[0005] A method for manufacturing a strain gauge device comprises the following steps: Providing a strain gauge; and Applying layers to the strain gauge to form a reactive multilayer system on the strain gauge.

[0006] A strain gauge is a well-known measuring device for detecting deformation. For example, the strain gauge may have a measuring grid structure whose electrical resistance changes when deformed. By measuring this electrical resistance, the deformation can be inferred. Such a strain gauge can be attached to a component to detect its deformation. This attachment can be achieved by activating the reactive multilayer system and the resulting reaction of the system. Upon activation, the reactive multilayer system can generate heat immediately. The reactive multilayer system is also referred to as a reactive multilayer system (RMS). During the application process, the layers can be applied sequentially.For example, thousands of alternating nanoscale layers, such as aluminum and nickel, can be applied directly to the strain gauge, for example, by vapor deposition. A layer of one material and a layer of a second material are applied alternately to the strain gauge until the reactive multilayer system is complete. Advantageously, the number of layers and, additionally or alternatively, the thickness of the layers can be adapted to the specific application of the strain gauge. The layers can be applied to a surface of the strain gauge that will be used to attach the strain gauge to a component.

[0007] Depending on the embodiment, one or more strain gauges can be provided. If multiple strain gauges are provided, the layers applied during the deposition step can extend across all of them. Optionally, the layers can be applied with gaps between adjacent strain gauges. This allows for the formation of a reactive multilayer system spanning multiple strain gauges, or multiple reactive multilayer systems. For example, a separate reactive multilayer system can be formed on each strain gauge.

[0008] In the preparation step, the strain gauge can be provided with at least one measuring structure and with a carrier film that supports the at least one measuring structure. Thus, the strain gauge can be designed as a film strain gauge. In the application step, the layers can be applied to a surface of the carrier film.

[0009] For example, the layers can be applied using a vacuum-based deposition process. The layers can be applied individually and sequentially. This can be done in a known way using a sputtering system.

[0010] In one step of the application process, a finishing layer, particularly of tin, can be applied to the reactive multilayer system. This can be done, for example, by sputtering or electroplating. This can, for instance, achieve good wettability.

[0011] During the setup step, the strain gauge can be provided with at least one hole through the strain gauge to activate the reactive multilayer system. The hole can be a through hole or a blind hole, such as a material thinning. A laser beam can be directed through the hole onto the reactive multilayer system, or an electrical voltage can be applied to the system. This allows for easy activation of the reactive multilayer system.

[0012] Alternatively, at least one corresponding hole can be formed into the strain gauge during the forming process. This allows the hole to be positioned appropriately, depending on the intended application. The number of holes can also be selected according to the specific application. The forming process can be performed before, during, or after the layers are applied to the strain gauge.

[0013] In a single forming step, the strain gauge can be deformed to adapt the shape of its surface to the shape of the surface of the component to which it will be applied. Advantageously, the strain gauge can be deformed before the coatings are applied. This prevents damage to the coatings from subsequent deformation.

[0014] In the provisioning step, a panel containing multiple strain gauges can be prepared. In the application step, the layers can be applied to the panel. In a singulation step, the multiple strain gauges can be separated to obtain multiple strain gauge fixtures. In this way, a large number of strain gauge fixtures can be manufactured simultaneously. The strain gauges can be spaced apart within the panel. In the application step, the layers can be applied continuously over all strain gauges or at least over a group of strain gauges, or applied in a structured manner, so that, for example, a separate reactive multilayer system can be formed on each strain gauge. Singulation can be performed, for example, using a laser beam for laser cutting.

[0015] In the pre-coating step, the substrate can be coated with a primer. In the application step, the layers can be applied to the primer. Such a primer could, for example, be a metallization.

[0016] A corresponding strain gauge device therefore comprises a strain gauge and a reactive multilayer system formed on the strain gauge by successive layer application. Advantageously, such a strain gauge device can be attached directly to a component without any further intermediate layer by activating the reactive multilayer system.

[0017] A corresponding procedure for manufacturing a component includes the following steps: Arranging a strain gauge device on a component, in particular a machine element, wherein the strain gauge device comprises a strain gauge and a reactive multilayer system formed on the strain gauge by successive application of layers; and Activating the reactive multilayer system of the strain gauge device to attach the strain gauge of the strain gauge device to the component.

[0018] The component can be a machine element, for example a connecting element or an element for transmitting forces or movements, for example a shaft. Alternatively, the component can be, for example, a printed circuit board or a substrate.

[0019] The reactive multilayer system can react in response to activation, such as ignition. This can be achieved, for example, by exposing the reactive multilayer system to a laser beam, passing an ignition current through it, or igniting it using ultrasonic energy. This generates sufficient thermal energy to reach the temperature required to ignite the system. Ignition can occur at one or more predefined locations, at a random location, or across the entire contact area between the reactive multilayer system and the device. Following the reaction, the reacted reactive multilayer system can form a metallurgical bond between the strain gauge and the device.The connection can be mechanically stable and electrically conductive, and is also referred to as multilayer bonding. This allows for the measurement of component deformation, for example during operation, using a strain gauge.

[0020] The invention is explained in more detail by way of example with reference to the accompanying drawings. These show: Fig. 1 a schematic cross-sectional representation of an embodiment of a strain gauge device; Fig. 2 a schematic cross-sectional representation of an embodiment of a component with a strain gauge device; Fig. 3 a schematic top view of an embodiment of a component with a strain gauge device; Fig. 4 a schematic top view of an embodiment of a component with a strain gauge device; Fig. 5 a schematic cross-sectional representation of an exemplary embodiment of a component; Fig. 6 a schematic cross-sectional representation of an embodiment of a component and a strain gauge device; Fig. 7 a representation of an embodiment of a utility with a plurality of strain gauges; Fig. 8 a schematic representation of the sequence of an exemplary embodiment of a reaction of a reactive multilayer system; Fig. 9 a flowchart of an exemplary embodiment for manufacturing a strain gauge device; and Fig. 10 a representation of a flowchart of an exemplary embodiment for the manufacture of a component.

[0021] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, without repeating these elements.

[0022] Fig. Figure 1 shows a schematic cross-sectional view of an embodiment of a strain gauge device 100 with a strain gauge 102 and a reactive multilayer system 104. The reactive multilayer system 104 is not a prefabricated system that was attached to the strain gauge 102 as a finished product. Instead, the reactive multilayer system 104 is a system that was produced directly on the strain gauge 102 by applying layers.

[0023] The strain gauge 102 is a known measuring strip that can be applied to a component to measure deformation of the component. Depending on the embodiment, the strain gauge 102 can have a suitable structure, for example, made of electrical conductors, which is optionally arranged on a carrier material or embedded in a carrier material. Such a carrier material can be a carrier film.

[0024] The layers of the reactive multilayer system 104 were applied to a surface of the strain gauge 102 during the manufacture of the strain gauge device 100. The layers were applied to the side of the strain gauge 102 intended for attachment to a component. Thus, the strain gauge 102 can be attached to the component using the reactive multilayer system 104.

[0025] The strain gauge 102 is shown as a flat element as an example. Alternatively, the strain gauge 102 can be curved, for example, having a bent shape that corresponds to the shape of a surface of the component to which the strain gauge 102 is to be attached. In this case, the layers of the reactive multilayer system 104 can be applied to the already curved strain gauge 102 and thus adopt the curved shape.

[0026] According to the approach described here, the strain gauge device 100 comprises the strain gauge 102 with the directly integrated reactive multilayer system (RMS) 104. Compared to the use of an MRS film, the strain gauge 102 with the directly integrated reactive multilayer system 104 enables a simplified bonding process and improved bond quality. Furthermore, the direct integration allows for optimization of the layer structure and thicknesses of the layers forming the reactive multilayer system 104 for strain transmission, which in turn improves the quality of the strain measurement and the associated force calculation.

[0027] By applying the layers of the reactive multilayer system 104 directly onto the strain gauge, it is possible to do without an RMS film, which could alternatively be applied to the strain gauge as a prefabricated MRS system.

[0028] The direct fabrication of the reactive multilayer system 104 onto the strain gauge 102, as described here, allows the strain of the target resulting from the applied force to be optimally transferred to the strain gauge 102, since the strain is not dampened by the use of a separate strain gauge film and the associated required layer structure, layer thicknesses, and elasticity. This, in turn, affects the accuracy of the strain gauge measurement and the forces calculated from it.

[0029] Furthermore, the layer structure and layer thicknesses are not limited as with a separate RMS film. For example, such a film cannot be arbitrarily thin, as this would compromise its stability. Moreover, according to one embodiment, no additional layers (e.g., a tin layer) are required, which are necessary with an RMS film to bond the RMS film and the strain gauge 102, and which could negatively affect the measurement accuracy.

[0030] Furthermore, additional process steps for the separate RMS film and the strain gauge 102 can be omitted. For example, it is not necessary to cut an RMS film, clean the contact surfaces, and place the RMS film and the strain gauge 102 separately.

[0031] Fig. Figure 2 shows a schematic cross-sectional view of an embodiment of a component 206 with a strain gauge device 100, as shown, for example, in Fig. As described in Figure 1, the strain gauge device 100 is arranged on a surface of the component 206, with the reactive multilayer system 104 of the strain gauge device 100 being located between the strain gauge 102 and the component 206. By activating the reactive multilayer system 104, the strain gauge 102 and the component 206 can be joined to form a single component.

[0032] The approach described here consists of applying the reactive multilayer system 104 to the strain gauge 102, thus enabling the strain gauge 102 with integrated reactive multilayer system 104 to be bonded to a part, here the component 206. Fig. 2 shows the component 206 as a part that is connected to the strain gauge 102 with the directly integrated reactive multilayer system 104.

[0033] This results in a number of advantages. For example, the strain of the component 206 resulting from the applied force is transmitted very effectively to the strain gauge 102, since the direct integration of the reactive multilayer system 104 optimizes the layer structure, layer thicknesses, and their elasticity for strain transmission, according to one embodiment. This, in turn, influences the accuracy of the strain gauge measurement and the forces calculated from it. Furthermore, the layer structure and layer thicknesses of the reactive multilayer system 104 integrated onto the strain gauge 102 can be implemented flexibly. For instance, the reactive multilayer system 104 can be very thin, as its stability is ensured by the strain gauge 102. In addition, fewer extra layers are required compared to an MRS film, since the reactive multilayer system 104 is already bonded to the strain gauge 102 on its upper surface.The bond quality is very high because one side of the RMS system is already firmly bonded to the strain gauge 102, for example, by vacuum-based deposition processes (e.g., sputtering). No further process steps are required, as only the composite of the strain gauge 102 and the reactive multilayer system 104 needs to be placed on the target. Cutting and placing an otherwise necessary RMS film, or cleaning the contact surfaces between the RMS film and the strain gauge 102, is not required.

[0034] Fig. Figure 3 shows a schematic top view of an embodiment of a component 206 with a strain gauge device 100, as shown, for example, in Fig. 2 are described.

[0035] Fig. Figure 4 shows a schematic top view of an embodiment of a component 206 with a strain gauge device 100. In contrast to the one in Fig. In the embodiment shown in Figure 3, the strain gauge has at least one hole, here by way of example a first hole 411 and a second hole 412. The holes 411, 412 enable activation of the reactive multilayer system of the strain gauge device 100 from a side of the strain gauge facing away from the component 206. Depending on the embodiment, the at least one hole 411, 412 can be configured as a through hole through the strain gauge or as a blind hole. A through hole, for example, allows direct contact of the reactive multilayer system with a contact tip for applying an electrical voltage to the reactive multilayer system.A blind hole can form a base that protects the reactive multilayer system, but it can be thin enough to be pierced by a contact tip or penetrated by a laser beam to activate the reactive multilayer system.

[0036] The strain gauge can therefore be designed to include one or more activation positions for the reactive multilayer system. These activation positions are designed, for example, as holes 411 and 412, as a thinning of the strain gauge carrier film, or as a gap between strain gauge conductor tracks. At these positions, a small pulse of local energy from electrical, optical, or thermal sources can be introduced to activate the reactive multilayer system. For example, a laser can be used to trigger the system from above through the strain gauge. Alternatively, an electric current can be applied from above. In both cases, either at least one hole 411 or 412, or a corresponding thinning or recess, can be pre-defined, or the strain gauge carrier film can be perforated. The activation position influences the RMS reaction and the associated bond quality.

[0037] Fig. Figure 5 shows a schematic cross-sectional view of an embodiment of a component 500 with a strain gauge 102 and a component 206. The strain gauge 102 is fixed to the component 206 using a reacted reactive multilayer system 504.

[0038] For example, component 500 was manufactured using the reactive multilayer system of the in Fig. 2 shown stack consisting of the component 206, the strain gauge 102 and the reactive multilayer system arranged between them was activated and to which in Fig. The reacted multilayer system 504 shown in Figure 5 is activated. Activation can be achieved in a suitable manner, for example, through holes in the strain gauge 102, as shown in Figure 5. Fig. 4 are shown.

[0039] The reactive multilayer system 504 creates a stable connection between the strain gauge 102 and the component 206, through which a deformation of the component 206 is transmitted to the strain gauge 102, thereby causing a deformation of the strain gauge 102. This deformation of the strain gauge 102, for example, causes a change in the resistance of an electrically conductive structure of the strain gauge 102. This change in resistance can be evaluated using methods similar to those of known strain gauges to infer the deformation of the component 206.

[0040] Component 206, for example, is a machine part, such as a shaft in a drive or an actuator in a vehicle. Alternatively, component 206 can be another part, such as for a vehicle's drive or steering system, or a carrier for an electrical circuit.

[0041] In order to enable a permanently stable connection between the strain gauge 102 and the component 206, a surface of the component 206 supporting the strain gauge 102 can be solderable or coated with a solderable material.

[0042] Fig. Figure 6 shows a schematic cross-sectional view of an embodiment of a component 206 and an embodiment of a strain gauge device 100. The component 206 and the strain gauge device 100 are shown spaced apart from each other.

[0043] The strain gauge device 100 comprises a strain gauge 102 and a reactive multilayer system 104, as described by way of example with reference to the preceding figures.

[0044] According to one embodiment, the strain gauge device 100 comprises a carrier film 620 which carries at least one measuring structure 621, 622, 623, 624, 625, 626. A first measuring structure 621, a second measuring structure 622, a third measuring structure 623, a fourth measuring structure 624, a fifth measuring structure 625, and a sixth measuring structure 626 are shown by way of example. The measuring structures 621, 622, 623, 624, 625, 626 can be shaped according to known strain gauges, wherein the electrical resistance of the measuring structures 621, 622, 623, 624, 625, 626 changes upon deformation.

[0045] For example, the measuring structures 621, 622, 623, 624, 625, 626, which are also referred to as strain gauge structures, comprise a measuring grid made of electrically conductive elements. The carrier film 620 for the measuring structures 621, 622, 623, 624, 625, 626 is, for example, a polyamide film.

[0046] Optionally, a metal layer 630 is arranged between the strain gauge 102 and the reactive multilayer system 104, for example in the form of a metallization of the carrier film 620. The metal layer 630 is made, for example, of silver (Ag), nickel (Ni), zinc (Sn) or gold (Au).

[0047] The reactive multilayer system 104 is, for example, formed with a thickness between 30 µm and 120 µm, with an example thickness of 60 µm. For example, the reactive multilayer system 104 is formed as a Ni / Al RMS, i.e., it consists of alternating layers of nickel and aluminum.

[0048] Optionally, a surface of the reactive multilayer system 104 facing away from the strain gauge 102 is coated with a tin layer 632 made of tin.

[0049] According to one embodiment, the component 206 is realized as a so-called target with a bondable surface.

[0050] According to one embodiment, the illustrated components, which can be assembled to form a single component, have different material strengths. The strain gauge 102 has a low strength 640, the reactive multilayer system 104, as well as the metal layer 630 and the tin layer 632, have a medium strength 642, and the component 206 has a high strength 644.

[0051] Due to the layer structure shown, a separate RMS film, which could otherwise be used to connect the strain gauge 102 to a part to be measured, here the component 206, for example a shaft, can be omitted. Thus, it is not necessary to place such a separate RMS film between the strain gauge 102 and the component 206.

[0052] Instead, the in Fig. The layer structure shown in Figure 6, as well as the manufacturing methods described in more detail below, can be implemented, which are particularly advantageous for strain gauges with a directly integrated reactive multilayer system. The RMS layers of the reactive multilayer system 104 are applied directly to the strain gauge 102. An exemplary layer structure, including relative material strengths, e.g., low to high strength Rp 0.2, is shown in Figure 6. Fig. Figure 6 shows that the optional tin layer 632 can be advantageous for wettability, for example, and can be applied to the reactive multilayer system 104 in a sputtering system or in an electroplating process.

[0053] Fig. Figure 7 shows an embodiment of a utility 700 with a plurality of strain gauges 102, as described, for example, with reference to the preceding figures. The strain gauges 102 are arranged in a plurality of rows, of which in Fig. Figure 7 shows five rows, and each row contains four strain gauges 102, which are identical in this example. The strain gauges 102 of the unit 700 are not yet separated.

[0054] The panel 700 can be larger than shown, for example, having more than five rows or being manufactured as a continuous panel. The panel 700 can be held and guided by a suitable manufacturing device for further processing. According to one embodiment, the layers of the reactive multilayer system are applied to the entire panel 700. The layers can extend over the entire surface of the panel 700 or, for example, be applied only in the area of ​​the respective strain gauges 102.

[0055] According to one embodiment, the layers of the reactive multilayer system are applied to a surface of the 700 panel in a sputtering system using a mask.

[0056] According to one embodiment, the RMS layers of the reactive multilayer system 104 are applied directly to the still uncut panel 700 of strain gauges 102. This panel 700 can optionally be pre-coated, and then the individual RMS layers (Ni and Al) are grown. This growth of the RMS layers can be carried out, for example, in a sputtering system using a mask. Further layers, such as an optional topcoat of tin, can be applied in the sputtering system or in an electroplating process. Subsequently, the individual strain gauges 102 with the already grown layers can be separated, for example, by laser cutting.

[0057] According to one embodiment, the array 700 of strain gauges 102, or a single strain gauge or individual strain gauges, is pre-shaped before the layers are applied. For example, the strain gauges 102, including the carrier film and any metallization, can be slightly bent beforehand so that they already have the curvature of the target, e.g., a shaft, when used later. Since the RMS layer structure is relatively brittle, the pre-defined curvature prevents the reactive multilayer system from breaking.

[0058] Fig. Figure 8 shows a schematic representation of a process of an embodiment of a reaction of a reactive multilayer system 104, as used, for example, to manufacture a component 500, as exemplified by the Fig. 5 described. The reactive multilayer system 108, for example, is composed of a plurality of first layers 801 and a plurality of second layers 802, which are arranged alternately, with optionally mixed regions 803 located between adjacent layers 801, 802.

[0059] A schematic representation of an activation position, exemplified by a spark 805, is shown. Starting from the activation position, the material of the reactive multi-layer system 104 reacts to form reacted material of a reacted multi-layer system 504. A corresponding direction of propagation 807 is indicated by an arrow.

[0060] The reactive multilayer system 104 is configured according to one embodiment to provide instant heat for a variety of applications in many industries. For the application described here, the reactive multilayer system 104 is, for example, fabricated by vapor deposition of thousands of alternating nanoscale layers onto a strain gauge, wherein the layers are in Fig. The layers 801 and 802 are schematically represented and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small pulse of local energy from electrical, optical, or thermal sources. The reactive multi-layer system 104 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second, for example, within milliseconds.

[0061] The small local energy pulse that triggers the activation of the reactive multi-layer system 104 can be generated in a known way, for example by applying an electrical voltage directly to the reactive multi-layer system 104, with a laser that is directed directly at the reactive multi-layer system 104, or by applying a direct heat source to the reactive multi-layer system 104.

[0062] In this way, a connection that is both electrically and thermally conductive can be established, e.g. to connect the strain gauge to a part to be measured, also called a target, for example a shaft.

[0063] Fig. Figure 9 shows a flowchart of an exemplary embodiment for manufacturing a strain gauge device, such as that based on… Fig. 1 is described.

[0064] In step 901, a strain gauge is provided, and in step 903, layers are applied to the strain gauge. Layers are applied, for example, alternating layers of a first material and a second material, until a reactive multilayer system is formed on the strain gauge. For example, in step 903, the layers are applied sequentially using a vacuum-based deposition process. For example, the layers are applied to a back surface of the strain gauge.

[0065] In step 901, the strain gauge is provided with at least one measuring structure and optionally with a carrier film supporting the at least one measuring structure. Optionally, in step 901, the strain gauge is provided with at least one hole through the strain gauge for activating the reactive multilayer system. Alternatively, the method includes a step 905 for forming the at least one hole in the strain gauge. Step 905 can be performed at a suitable time, for example, before, during, or after step 903 of layer application.

[0066] Optionally, the strain gauge is deformed in step 907 before the layers are applied. This adapts the shape of a surface of the strain gauge, onto which the layers are subsequently applied, for example to the shape of a surface of a component to be fitted with the strain gauge.

[0067] Optionally, the process includes step 909, in which a finishing layer is applied to the reactive multilayer system. The finishing layer is formed, for example, from tin.

[0068] If, in step 901, a plurality of strain gauges are provided together as a panel, the layers are applied to the panel in step 903. In step 911, the panel is separated to obtain a plurality of strain gauge assemblies.

[0069] Fig. Figure 10 shows a flowchart of an exemplary embodiment for manufacturing a component, as illustrated, for example, by Fig. 5 is described.

[0070] In step 1020, a strain gauge device, such as that designed by implementing the based on Fig. The strain gauge device, manufactured according to the method described in section 9, is arranged on a component. The strain gauge device is thus a device in which the reactive multilayer system is manufactured directly on the strain gauge. For example, the strain gauge device is arranged on a machine element. The strain gauge device is positioned on the component such that the reactive multilayer system is located between the strain gauge and the component.

[0071] In step 1023, the reactive multilayer system of the strain gauge device is activated, for example, using a laser beam. This causes the material of the reactive multilayer system to react, as demonstrated, for example, by… Fig. 8 is described, and the strain gauge of the strain gauge device is attached to the component. Reference sign 100 strain gauge devices 102 strain gauges 104 reactive multilayer systems 206 Component 411 first hole 412 second hole 500 components 504 reacted reactive multilayer system 620 carrier film 621 first measurement structure 622 second measurement structure 623 third measurement structure 624 fourth measurement structure 625 fifth measurement structure 626 sixth measurement structure 630 metal layer 632 Tin layer 640 low strength 642 medium strength 644 high strength 801 first layer 802 second layer 803 mixed regions 805 spark plugs 807 Direction of spread 901 Step of Provisioning 903rd step of the application 905th step of shaping 907th step of deformation 909th step of application 911 Step of singulation 1021 Step of arranging 1023 Activation Step

Claims

[1] Method for manufacturing a strain gauge device (100), the method comprising the following steps: Providing (901) a strain gauge (102); and Applying (903) layers (801, 802) to the strain gauge (102) to form a reactive multilayer system (104) on the strain gauge (102). [2] Method according to claim 1, wherein in step (901) the strain gauges (102) are provided with at least one measuring structure (621) and with a carrier film (620) carrying the at least one measuring structure (621). [3] Method according to one of the preceding claims, wherein in step (903) of the application the layers (801, 802) are applied successively in time, in particular using a vacuum-based deposition process. [4] Method according to one of the preceding claims, comprising a step (909) of applying a finishing layer (632), in particular of tin, to the reactive multilayer system (104). [5] Method according to one of the preceding claims, wherein in step (901) the strain gauges (102) are provided with at least one hole (411) for activating the reactive multilayer system (104) through the strain gauge (102), or wherein the method comprises a step (905) of forming the at least one hole (411) in the strain gauge (102). [6] Method according to one of the preceding claims, comprising a step (907) of deforming the strain gauge (102) to adapt a shape of a surface of the strain gauge (102) to a shape of a surface of a component (206) to be fitted with the strain gauge. [7] Method according to one of the preceding claims, wherein in step (901) of providing a utility (700) with a plurality of strain gauges (102) is provided, in step (903) of applying the layers (801, 802) are applied to the utility (700), and in step (911) of singulating the plurality of strain gauges (102) are singulated to obtain a plurality of strain gauge devices (100). [8] Strain gauge device (100) having the following features: a strain gauge (102); and a reactive multilayer system (104) formed on the strain gauge (102) by successive application of layers (801, 802). [9] Method for manufacturing a component (500) wherein the method comprises the following steps: Arranging (1021) a strain gauge device (100) on a component (206), in particular a machine element, wherein the strain gauge device (100) comprises a strain gauge (102) and a reactive multilayer system (104) formed on the strain gauge (102) by successive application of layers (801, 802); and Activating (1023) the reactive multilayer system (104) of the strain gauge device (100) to attach the strain gauge (102) of the strain gauge device (100) to the component (206).

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