Method and apparatus for manufacturing a composite component

DE102025103019B3Active Publication Date: 2025-11-13KARLSRUHER INST FUR TECH
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Patent Information

Application Number
DE102025103019
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-01-28
Publication Date
2025-11-13
Estimated Expiration
2045-01-28

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Abstract

Manufacturing method of a composite component (1) comprising a provision of a thermoplastic carrier plate (2) with openings (3) with outlets (4) and a support surface (5), a thermoplastic film (6) wherein its temperature intervals of the plastic range overlap, a mold mask (7) with openings (8), a pressure source or pressure sink with a pressure distributor (9) with connections (10) to all openings and a temperature control device (11).This is followed by pressing the film onto the support surface and the mold onto the film, heating at least the mold (7) to a temperature in the overlapping temperature intervals, whereby the film and carrier plate permanently bond together to form the composite component (1), applying an overpressure or underpressure to the connections (10) while maintaining the temperature, whereby the film is plastically deformed at the openings of the mold, forming a microstructure in each case, lowering the temperature of the film (6) and carrier plate (2) below the glass transition temperatures, and separating the composite component (1) from the mold (7).
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Description

[0001] The invention relates to a method and a device for manufacturing a composite component made of thermoplastic materials according to claim 1 and 9, respectively.

[0002] The composite components mentioned above consist of at least two thermoplastic components. They are permanently bonded together. Suitable bonding methods include adhesive bonding (solvent-based or adhesive) with additional adhesives, bonding with volatile solvents, or thermally achievable welding of the components. Such composite components can be considered widespread and common in engineering, without the need for an explicit citation.

[0003] A welded joint for the aforementioned composite component, consisting of at least two components, can be achieved by thermally treating the thermoplastic components to be joined, whose plastic temperature ranges overlap. The components to be joined are in contact. By heating at least one of the components to be joined to a temperature within the plastic temperature range, a permanent, metallurgical bond is formed between the contacting components. This is also generally known.

[0004] 3D cell culture platforms offer a concrete application for such composite components and their manufacturing processes in both basic and applied research in the field of biotechnology. Relevant research projects repeatedly demonstrate that the transferability of results to humans using human cells cultured three-dimensionally on these platforms is not only possible, but also superior to those obtained from corresponding animal experiments. For example, it is known that rat livers lack many enzymes that are crucial for the human liver in metabolizing certain classes of substances. This is further supported by EU regulations that already prohibit animal testing, particularly in cases where alternatives are established.

[0005] Not only composite components are known from the prior art, but also thermally formed recesses in a single thermoplastic film for receiving chemical and / or biochemical and / or microbiological substances, disclosed by way of example in DE 40 22 792 A1.

[0006] A single foil of this type is also known from DE 10 2007 050 976 A1, which is structured in a mold via a thermal forming process operated with differential pressure.

[0007] Furthermore, WO 96 / 01692 A1 describes a technology for producing a blister-like sample carrier with numerous wells for holding samples. The wells are formed in a first film using negative molds under vacuum, and these are then covered, for example, by a second film after the sample is inserted. The two films are then bonded together.

[0008] The most common design of a 3D cell culture platform is the 96-well microtiter plate, which is used particularly for serial analyses, including absorption, fluorescence, luminescence, and other measurement techniques. Variants for cultivating organotypic cell cultures also require domed or microstructured and, if necessary, fluid-permeable substrates. These substrates serve to retain the cell cultures within the wells and also allow them to be nutrient-fed using nutrient solutions. Manufacturing this design, especially the substrates, is complex and expensive using conventional methods such as laser and ultrasonic welding or adhesive bonding. Furthermore, adhesive-based methods are unsuitable for biological or medical applications because they are generally not biocompatible.

[0009] Another approach to manufacturing 3D cell culture platforms involves bonding a plate with through-holes to a permeable microstructured film, membrane, or grid on one side. Common methods for such a bond include laser welding, ultrasonic welding, or adhesive bonding using interlayers. All of these methods share the common feature that the plate and the film, membrane, or grid are first manufactured separately and only then joined together. Furthermore, high positioning accuracy of the components to be joined is required, which adds to the manufacturing effort.

[0010] Starting from this, one object of the invention is to propose a method and a device for producing a composite component which not only enables a permanent welded connection of at least two thermoplastic components, but also simultaneously creates a microstructure in at least one component and is more fault-tolerant compared to conventional methods.

[0011] Another object of the invention is to propose a method and a device for manufacturing a 3D cell culture platform as a composite component.

[0012] The problem is solved by a method and a device having the features of the first and ninth claims, respectively. Dependent claims relating thereto describe advantageous embodiments.

[0013] The problem is solved by a method for manufacturing a composite component, comprising the following process steps, preferably in the chronology shown: • Provision of a carrier plate with at least one through-hole, preferably a microtiter plate with a number of wells as through-holes, preferably 96 wells, each with outlets on both sides and a support surface around the outlets on one side, and a film, wherein the carrier plate and the film each consist of a thermoplastic material whose temperature intervals of the plastic range overlap. • Provision of a mold mask with openings, a pressure source or pressure sink with a pressure distributor with connections to all openings of the mold mask, and a temperature control device for at least the mold mask. • The film is placed on the support surface and the mold is pressed together over its entire surface, with the openings in the mold being arranged above the at least one passage opening. Preferably, means are proposed that are suitable for pressing the film onto the support surface of the carrier plate and the mold onto the film as a single component stack over its entire surface. "Overall surface" here means that the means do not act at specific points on the components, but rather the pressure is applied over the entire surface of the carrier plate and / or the mold, for example, by means of flat-acting pistons or other intermediate elements. This advantageously achieves constant pressure over the entire length of the film positioned between the carrier plate and the mold. The means mentioned preferably include mechanical, pneumatic, and / or hydraulic means. • Heating at least the mold to a temperature within the temperature range of the plasticity of the film and the carrier plate, whereby the film and carrier plate permanently bond together to form the composite component. Preferably, the carrier plate and the film are made of the same thermoplastic material or they are made of materials whose glass transition temperatures differ by a maximum of 20°C, preferably 5°C. These thermoplastic materials are, in turn, preferably polystyrene, which is both cost-effective and easy to thermally process. • Applying overpressure or underpressure to the connections of the mold mask while maintaining the temperature, whereby the film is locally drawn plastically out or in at the openings of the mold mask, forming a three-dimensional microstructure in each case. • Cooling of the mold and the associated reduction of the temperature of the film and substrate below the glass transition temperatures. Preferably, this cooling takes place in the region above and around the glass transition temperatures at a lower cooling rate than below the glass transition temperatures. This is because forming and thermal joining involve increased material redistribution, predominantly above the glass transition temperatures. Lower cooling rates allow for longer time intervals, which in turn ensures the complete termination of these redistributions. • Separating the composite component from the mold.

[0014] In a preferred method, it is proposed to provide a mold into which the mold, the film, and the carrier plate are placed sequentially, one above the other, and at least the carrier plate, the film, and the mold are aligned with each other. The alignment of the carrier plate and the mold is particularly important, as the orientation of the through-holes in the carrier plate and the openings in the mold must be aligned, preferably congruently. For this purpose, in a preferred embodiment, guide means for at least the aforementioned carrier plate and the mold are proposed in the device for manufacturing the composite component. If the film is preferably unstructured before insertion, precise alignment of it between the mold and the carrier plate is not necessary.However, it is important that the film extends at least over all the openings in the carrier plate, and preferably also over the lateral extension of the carrier plate.

[0015] The mold set preferably includes, in particular when using the aforementioned mold set, the pressure distributor with the connections to all openings of the mold mask.

[0016] One embodiment provides a mold as part of a housing with an internal volume into which the mold mask, the film, and the carrier plate are inserted. The internal volume is created by covering the preferably trough-shaped mold with a lid, wherein the internal volume between the lid and the mold is sealed to the outside, preferably by a circumferential sealing surface and / or an additional sealing element.

[0017] If the mold, film, and carrier plate are placed in the aforementioned internal volume in sequence as a component stack, it is proposed to insert a first circumferential seal between the inner wall of the internal volume and the mold or the carrier plate, thereby dividing the internal volume around the component stack into two sub-volumes, a first and a second sub-volume. A fluidic connection to the pressure distributor is provided for the first sub-volume, and a fluidic connection to the outlets of the through-holes in the carrier plate, located away from the film, is provided for the second sub-volume.The proposed design allows the two partial volumes to be subjected to different fluidic pressures, which, when at least the mold mask is heated to a temperature within the temperature ranges of the plastic areas of the film and the carrier plate, not only causes the mold mask, the film and the carrier plate to be pressed together, but also results in a welding or other material bond between at least the film and the carrier plate.

[0018] The task is also solved by a device for manufacturing a composite component consisting of a carrier plate with through-holes and a film with a microstructure covering one side of the through-hole. The device comprises the following components: • A mold with cutouts and a surface for the foil. • A first source or sink of pressure. • A pressure distributor as a fluidic connection between the pressure source or pressure sink and all openings of the mold mask. • A temperature control device for at least the mold mask. • Means for pressing the film onto the support surface and the mold onto the film, and the film onto the carrier plate. Since alignment of the mold and the carrier plate as described above must be ensured, a preferred embodiment provides guide means for at least the carrier plate and the mold relative to each other.

[0019] A preferred embodiment of the device provides a molding tray with a recess for inserting the molding mask, the film and the carrier plate in sequence one above the other, which preferably also performs and accordingly includes the function of the aforementioned guiding means of at least the carrier plate and molding mask to each other.

[0020] Furthermore, in a preferred embodiment, it is proposed to cover the aforementioned mold with a lid. The mold and lid thus form a housing with an internal volume for receiving the mold mask, film, and carrier plate. More preferably, the device includes a circumferential seal within the internal volume at the level of the mold mask or carrier plate that can be inserted therein, thereby dividing the internal volume around the composite component into a first and second sub-volume. Furthermore, at least one fluidic connection is provided between the second sub-volume and all through-openings in the carrier plate, as well as a connection of the second sub-volume to a second pressure source or pressure sink, preferably as the only openings from the internal volume out of the housing.

[0021] A preferred embodiment of the aforementioned housing of the device provides means for pressing the film onto the support surface and the mold mask onto the film and the film onto the carrier plate, comprising a hydraulic or pneumatic piston element which, arranged in the inner volume above the carrier plate, encloses a piston stroke volume as a third partial volume with a pressure connection for a pressure source by means of a circumferential fluid-tight piston seal towards the inner wall of the inner volume at the cover or in the mold.

[0022] Preferably, the device incorporates guide elements, for example, to ensure that the openings in the carrier plate and the openings in the mold mask arranged above or below the carrier plate are aligned and congruent. It is also preferably proposed to chamfer the openings in the mold mask, i.e., to provide them with a chamfer, preferably a smooth, rounded edge, at the contact point with the film. The chamfer serves to shape the film areas near the edges of a film drawn into the opening of the mold mask by vacuum pressure, thus advantageously preventing creases.

[0023] Another advantageous embodiment provides a bottomless microtiter plate with a large number of identical and parallel through-holes as a support plate.

[0024] For use as a cell culture container, the film preferably has a thickness of 5 to 500 µm, more preferably of 10 to 100 µm.

[0025] The solution to the problem is therefore based on the idea of ​​applying an unstructured and unshaped film blank to one side of the wells of a microtiter plate in a single process step, pressing it down fluidically, bonding it thermally, and simultaneously microthermoforming it with the required heat. Because a film is thermoformed without prior structuring, the requirement for positioning a shaped film and subsequent separate bonding to the substrate is particularly advantageously eliminated. Furthermore, the use of intermediary layers for bonding or welding the plastics is avoided. The proposed method is also characterized by its easy adaptability to different film types and thicknesses, as well as film composites or coated films.

[0026] The method using the proposed device is particularly suitable for the microthermoforming of films used for 3D cell culture in proprietary microbioreactors and organ-on-a-chip systems (microcavity arrays). It has been shown that three-dimensionally cultured cells exhibit significantly more similar functionality to the in vivo situation than 2D cultures in Petri dishes or multiwell plates with a planar bottom. In vitro screening series in the pharmaceutical industry are typically performed in planar microtiter plates. However, results with organotypic 3D cultures demonstrate an expanded application potential for high-throughput screening in the pharmaceutical industry, creating a significant demand for microstructured cell culture plates, preferably in the 96-well format or its derivatives (384-well, 1536-well).The proposed method and apparatus enable the production of cell culture containers from a carrier plate and a film, whereby bonding and microthermoforming are advantageously performed in a single manufacturing step, making the process particularly economical. This eliminates the manufacturing costs typically associated with conventional composite components, such as the complex bonding step using laser or ultrasonic welding or adhesive bonding, and drastically reduces overall production costs.

[0027] The invention is explained in more detail with reference to exemplary embodiments, the following figures, and descriptions. All features shown and their combinations are not limited to these exemplary embodiments and their configurations. Rather, they are intended to be considered representative of further possible configurations that are not explicitly shown as exemplary embodiments. The figures show... Fig. 1 A schematic sectional view of a first embodiment of a device with a component stack consisting of a carrier plate, film, and mold. Fig. 2 a schematic sectional view of a second embodiment of a device with a housing, Fig. 3 a schematic sectional view of a third embodiment of a device with a housing, Fig. 4 a schematic sectional view of an embodiment of the first embodiment of a device with a component stack consisting of a carrier plate, film, mold mask, in which the openings in the mold mask have a chamfer, as well as Fig. 5 A schematic cross-sectional view through a cell culture carrier as a composite component, manufactured according to the aforementioned manufacturing process.

[0028] A first embodiment of a device for manufacturing a composite component 1 shows Fig. 1. The composite component to be produced by this device, preferably using one of the aforementioned methods, comprises a carrier plate 2 with through-openings 3 and a film 6 covering one side of the through-opening. In the course of the aforementioned method, not only is a bond formed between the film and the carrier plate, but also a shaping or formation of a microstructure 26 takes place in the area of ​​the through-openings.

[0029] The in Fig. The embodiment shown in Figure 1 has a mold 7 with openings 8 and a support 12 for the film 6 and thus for the composite component. The device includes, in particular, a pressure distributor 9 in a distributor block 27 as a connection 10, i.e., a fluidic connection between a pressure source or pressure sink (not shown) as part of the device and all of the aforementioned openings 8 of the mold 7. Furthermore, the device includes in Fig. 1 Means (not shown) for pressing the film 6 onto the support surface 5 and the mold 7 onto the film 6 and the film onto the carrier plate 2. The illustrated embodiment represents an open design without a housing of the aforementioned type with mold and lid.

[0030] At least the mold mask is heatable, optionally as in Fig. 1 represented by at least one external heating element without direct solid contact to the mold mask 7 (e.g., radiant heater or convective heating or convective via the fluidic connection between the pressure source or pressure sink and all openings of the mold mask) as a temperature control device 11. An alternative preferred embodiment provides for solid contact (not shown) between heating elements and the mold mask, preferably directly by direct contact (e.g., via embedded or attached heating elements) or indirectly via additional thermal bridges and / or via other components of the device, such as a mold backing (see item 13 in Fig. 2 and Fig. 3).

[0031] A particularly advantageous design of the device is such that the lateral extent of the openings in the mold mask corresponds to that of the through-openings in the carrier plate. The through-openings 3 in the carrier plate 2 and the openings 8 of the mold mask 7 are thus preferably arranged one above the other and are congruent. To ensure this, it is preferably proposed to provide guide means for at least the carrier plate and the mold mask relative to each other.

[0032] Fig. 2 and Fig. Figures 3 show a second and third embodiment, in which a mold 13 (with integral distributor block) has a recess 14 for inserting the mold mask 7, the film 6 and the carrier plate 2 in the same order as in Fig. The mold is provided one above the other. The mold preferably comprises the aforementioned guide means. As shown, the recess is preferably covered by a lid 15, whereby the recess 14 in the mold is closed by the lid to form a sealed inner volume 16. The mold mask, the film, and the carrier plate are then completely enclosed in the inner volume 16, as shown.

[0033] To create a pressure differential across the film, it is proposed to provide the internal volume 16 surrounding the component stack consisting of the carrier plate, film, and mold with a circumferential seal 17, preferably at the level of the mold 7 or the carrier plate 2. This seal divides the internal volume around the composite component into a first and second sub-volume 18 and 19, respectively. A pressure differential between the first and second sub-volumes then also exists directly across the film, away from the support 12 and contact surface 5, between the through-openings 3 and the openings 8. A fluidic connection 20 between the second sub-volume 19 and all through-openings 3 in the carrier plate 2 is required for this purpose. The first sub-volume 18 is preferably connected to a first pressure source via the pressure distributor 9 and a connection 10 (integrated into the mold in the exemplary embodiments), while the second sub-volume 19 is connected to its own second pressure source (e.g., a pressure relief valve).as shown, it is connected via a channel leading laterally out of the mold. Both pressure sources are preferably arranged outside the housing and are not shown in detail in the figures.

[0034] Fig. 2 and Fig. Figure 3 also shows optional embodiments of the hydraulic or pneumatic piston element 21 for compressing the carrier plate, film, and mold mask (component stack) over a surface area. The piston element is arranged above the carrier plate 2 in the inner volume 16, preferably mounted directly on it, and is provided with a circumferential fluid-tight piston seal 22 against the inner wall of the inner volume 16 in the region of the second sub-volume 19 at the cover 15 or in the mold cavity 13, forming a separate piston stroke volume 23. The piston stroke volume is a third sub-volume and, as such, is connected to a pressure source (not shown) via a separate pressure connection 24, preferably through the cover 15.

[0035] It is optionally suggested to integrate the temperature control devices, e.g. as heating elements, into the mold backdrop 13 or, e.g., to attach them to the mold backdrop as radiant heaters (alternatively according to Fig. 1 also in or on the distributor block). The mold (or the distributor block) has direct solid contact and thus a thermal bridge to the mold mask 7, which can be heated. Alternatively, a temperature control fluid can also be routed directly to the mold mask 7 and the film 6 to be structured via connection 10, pressure distributor 9 and openings 8.

[0036] Fig. Figure 2 shows the second embodiment with a piston seal 22 mounted on the piston element 21, which is radially supported outwards by a circumferential step 28 on the piston element and whose expansion is limited. This design is particularly suitable for high pressures applied to the piston element via the pressure port 24. Since the piston seal must ensure a tight seal between the piston stroke volume 23 and the second partial volume 19 over the entire piston stroke, this design is particularly suitable for small piston strokes. Advantageously, the piston seal is inserted when the cover 15 is placed on the mold 13 and can be pre-tensioned. This pre-tensioning, in turn, enables the aforementioned component stack and the piston element to be fixed and thus guided when the cover is placed on the mold without the need for any further elements.

[0037] Fig. Figure 3 shows the third embodiment with a circumferential piston seal 22 arranged around the circumferential surface of the piston element 21, its axial movement downwards limited by a circumferential step 28. Due to the position of the piston seal on the circumferential surface, the latter can also be used as a guide for the aforementioned component stack and the piston element, albeit without preload. It also allows for larger piston strokes.

[0038] Fig. Figure 4 shows an embodiment of the first embodiment with a preferred optional configuration, wherein the openings are provided with a chamfer 25 on the support 12 towards the film 7. Preferably, the passage openings 3 in the carrier plate 2 and the openings 8 of the mold mask 7 are arranged one above the other and are congruent.

[0039] Fig. Figure 5 shows a schematic cross-sectional view through a cell culture carrier as a composite component 1, manufactured according to the aforementioned manufacturing process. The film 6 is not only attached to the carrier plate 2, but is also provided with microstructures 26 in the form of a bulge below the through-holes.

[0040] It is proposed that the aforementioned designs, configurations, and embodiments of the device and method be used, in particular, for the production of cell culture containers. The support plate 2 is preferably a bottomless microtiter plate with a plurality of identical and parallel through-holes 3, and the film 6 has a thickness between 1, 2, 5, or 10 µm and 20, 50, 100, or 500 µm.

[0041] As a method for manufacturing a composite component, such as a cell culture carrier according to Fig. 5, two preferred method variants, preferably using one of the aforementioned devices, are proposed and explained in more detail: In the first method variant, a mold 13 with a recess 14, suitable for inserting a microtiter plate as a carrier plate 2, a film 6, a mold mask 7 (as in Fig. (1 to 4 shown as examples) as well as means for pressing the film onto the microtiter plate and the mold onto the film (e.g., comprising the piston element 21) across the entire surface. The contact pressure is precisely adjusted hydraulically, or alternatively pneumatically, or mechanically, e.g., via a screw device using a torque tool.

[0042] The piston element 21, or another pressure plate resting on the carrier plate as part of the pressure means, has a channel structure as a fluidic connection 20 between the second partial volume 19 and the through-holes 3 in the carrier plate 2, in order to enable the build-up of the forming pressure over the film for its micro thermoforming in the area of ​​the through-holes. Likewise, in the distributor block 27 (see Fig. 1 and Fig. 4) or in the form backdrop 13 (cf. Fig. 2 and Fig. 3) a pressure distributor 9 with connections 10 to the openings 8 in the mold mask 7 is provided, through which a counter-pressure or a vacuum can be built up from below the film to the aforementioned mold pressure.

[0043] In the second variant of the process, not explicitly shown in the figures, means for pressing the film onto the microtiter plate (support plate) and the mold onto the film are achieved by clamping these components in the recess between the mold and the lid. In this variant, the contact pressure is applied via screws that press the lid onto the mold through the recess. An optional elastic ring seal, additionally clamped over the support plate, preferably made of a flexible, heat-resistant material such as Viton, transmits the contact pressure of the plate to the film via the support plate.As in the first method variant, it must be ensured that a fluidic connection and / or another pressure distributor with connections to the through-holes of the carrier plate and / or to the openings in the mold mask is provided on both sides of the film, preferably for imprinting individually adjustable pressures on both sides of the film.

[0044] By applying a temperature above the typical glass transition temperature for the material and a required forming pressure and / or counter-pressure, the film can be formed in one step in both process variants and simultaneously bonded to the substrate.

[0045] Polystyrene, with a glass transition temperature of approximately 100 to 110°C, is typically used for the production of microtiter plates. Bonding the polystyrene film involves softening both the microtiter plate and the film material above their glass transition temperatures, thus creating the aforementioned metallurgical bond through welding. A subsequent cooling step to below 100°C solidifies the bond and stabilizes the film in its shape. After final cooling to approximately 50°C, the microtiter plate with its bonded and (micro)thermoformed base can be removed from the mold.

[0046] The proposed solution significantly simplifies the manufacturing process of polymer composite parts, at least one of which contains (micro)structures. Separate process steps for microstructuring and bonding are combined, thus eliminating the need for retooling and readjusting the substrate and film. Furthermore, both structuring and bonding are thermal processes: the use of toxic adhesives and / or process parameters that could damage the films / membranes is unnecessary. Reference symbol list: 1 composite component 2 Carrier plate 3 Passage opening 4 Exit 5 Support surface Slide 6 7. Shape mask 8 Breakthrough 9 pressure distributors 10 connection 11 Temperature control device 12th edition 13 Form backdrop 14 recess 15 lids 16 internal volumes 17 Seal 18 First sub-volume 19 Second sub-volume 20 Fluidic Connection 21 Piston element 22 Piston seal 23 piston stroke volume 24 Pressure connection 25 Phase 26 Microstructure 27 Distribution block 28th level

Claims

[1] Method for manufacturing a composite component (1) comprising the following steps: a) Provision of a carrier plate (2) with at least one through-opening (3) each with outlets (4) on both sides and a support surface (5) around the outlets on one side, and a film (6), wherein the carrier plate and the film each consist of a thermoplastic material whose temperature intervals of the plastic range overlap, b) Provision of a mold mask (7) with openings (8), a pressure source or pressure sink with a pressure distributor (9) with connections (10) to all openings of the mold mask and a temperature control device (11) for at least the mold mask, c) Placing and pressing the film onto the support surface and the mold onto the film, with the openings of the mold being arranged above the at least one passage opening, d) Heating at least the mold mask (7) to a temperature that lies within the temperature intervals of the plastic range of the film (6) and the carrier plate (2), whereby the film and carrier plate permanently bond together to form the composite component (1), e) Applying an overpressure or underpressure to the connections (10) of the molding mask (7) while maintaining the temperature, whereby the film is locally drawn plastically out or in at the openings of the molding mask, forming a three-dimensional microstructure (26) in each case, f) Cooling of the mold mask (7) and the associated reduction of the temperature of the film (6) and the carrier plate (2) below the glass transition temperatures as well as g) Separating the composite component (1) from the mold mask (7). [2] Method according to claim 1, characterized bythat the carrier plate (2) and the film (6) are made of the same thermoplastic material or of materials whose glass transition temperatures differ from each other by a maximum of 5°C within their limits. [3] Method according to claim 1 or 2, characterized by , that the thermoplastic material of the carrier plate (2) and film (6) is polystyrene. [4] Method according to any of the aforementioned claims, characterized by , that the cooling according to step f) in the area above and around the glass transition temperatures occurs at a lower cooling rate than below the glass transition temperatures. [5] Method according to any of the aforementioned claims, characterized by , that the film (6) is pressed together over a flat surface on the support surface (5) of the carrier plate (2) and the mold mask (7) on the film (6) by mechanical, pneumatic or hydraulic means provided for this purpose. [6] Method according to any of the aforementioned claims, characterized by , that a forming template (13) is provided into which the forming mask (7), the film (6) and the carrier plate (2) are placed one above the other in sequence and at least the carrier plate, the film and the forming mask are aligned to each other, wherein the forming template (13) preferably includes the pressure distributor (9) with the connections (10) to all openings (8) of the forming mask (7). [7] Method according to claim 6, characterized by , that the formwork (13) is part of a housing with an internal volume (16). [8] Method according to claim 7, characterized by, that a first circumferential seal (17) is inserted between the inner wall of the inner volume (16) and the mold mask (7) or the carrier plate (2), whereby the inner volume is divided into two partial volumes, wherein a first partial volume (18) has a fluidic connection with the pressure distributor (9) and a second partial volume (19) has a fluidic connection with the outlets (4) of the through-openings (3) in the carrier plate (2) arranged away from the film (6). [9] Device for producing a composite component (1) from a carrier plate (2) with through-holes (3) and a film (6) covering the through-hole on one side with a microstructure (26), comprising a) a shape mask (7) with openings (8) with a support (12) for the film (6), b) a first pressure source or pressure sink, c) a pressure distributor (9) as a fluidic connection between the pressure source or pressure sink and all openings (8) of the mold mask (7), d) a temperature control device (11) for at least the mold mask (7) and e) Means for pressing the film (6) together over a flat surface onto the support surface (5) and the mold mask (7) onto the film (6) and the film onto the carrier plate (2). [10] Device according to claim 9, comprising a guide means at least of the carrier plate and mold mask relative to each other. [11] Device according to claim 9 or 10, comprising a molding template (13) with a recess (14) for inserting the molding mask (7), the film (6) and the carrier plate (2) in sequence one above the other. [12] Device according to claim 11, comprising a lid (15) for the molding tray (13), wherein the molding tray and lid form an internal volume (16) for receiving the molding mask, film and carrier plate. [13] Device according to claim 12, comprising f) a circumferential seal (17) in the inner volume (16) at the level of the mold mask (7) or the support plate (2), which divides the inner volume around the composite component into a first and second partial volume (18 and 19 respectively), g) a fluidic connection (20) between the second partial volume (19) and all the through-holes (3) in the support plate (2) as well as h) a connection of the second partial volume (19) to a second pressure source or pressure sink. [14] Device according to claim 12 or 13, characterized by, that the means for surface pressing together comprises a hydraulic or pneumatic piston element (21) which is arranged in the inner volume (16) above the carrier plate (2) by means of a circumferential fluid-tight piston seal (22) to the inner wall of the inner volume (16) at the cover (15) or in the mold (13) encloses a piston stroke volume (23) as a third partial volume with a pressure connection (24) for a pressure source. [15] Device according to any one of claims 9 to 14, characterized by , that the passage openings (3) in the carrier plate (2) and the openings (8) of the mold mask (7) are arranged one above the other and are congruent, wherein the openings are provided with a chamfer (25) on the support (12) towards the film (7). [16] Device according to any one of claims 9 to 14, characterized by, that the carrier plate (2) is a bottomless microtiter plate with a plurality of identical and parallel through-holes (3) and the film (6) has a thickness of 5 to 500 µm.

Citation Information

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