wiring harness

Abstract

A cable harness (1) comprises: a flexible printed circuit board (3); a chip fuse (6) mounted on the flexible printed circuit board; a plate element (4) with a flat, plate-shaped plate body (40) having a frame shape and a cylindrical circumferential wall (41) projecting from the plate body in a thickness direction of the plate body; and a potting compound (5), wherein the plate body is attached to the flexible printed circuit board such that it surrounds the chip fuse by means of the circumferential wall, and the potting compound is filled into a space section (4s) surrounded by the circumferential wall and covering the chip fuse.

Description

BACKGROUND OF THE INVENTION 1. Field of the invention

[0001] The present invention relates to a cable harness. 2. Description of the state of the art

[0002] Conventionally, there is a technique for covering an electronic component with a potting compound. JP 2023 - 173 467 A discloses a conductive module comprising a flexible circuit board, an electronic component mounted on the flexible wiring component, a metal plate with a frame section surrounding the electronic component, and a potting compound that is charged in an area surrounded by the frame section and covers the electronic component.

[0003] In JP 2023 - 173 467 A, the weight of the metal plate tends to increase when a metal plate with a thickness corresponding to the required depth of a potting layer is used. It is desirable to reduce the weight of the plate element while simultaneously achieving the required depth of the potting layer. SUMMARY OF THE INVENTION

[0004] The object of the present invention is to provide a cable harness that is able to reduce the weight of the plate element while simultaneously achieving the required depth of the potting layer.

[0005] To achieve the above-mentioned objective, a cable harness according to one aspect of the present invention comprises a flexible printed circuit board; a chip fuse mounted on the flexible printed circuit board; a plate element with a flat, plate-shaped plate body having a frame shape and a cylindrical circumferential wall projecting from the plate body in a thickness direction of the plate body; and a potting compound, wherein the plate body is attached to the flexible printed circuit board such that it surrounds the chip fuse by means of the circumferential wall, and the potting compound is filled into a section surrounded by the circumferential wall and covers the chip fuse.

[0006] The above and other problems, features, advantages and technical and industrial significance of this invention will be better understood if one reads the following detailed description of the currently preferred embodiments of the invention when viewed in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a wiring harness according to one embodiment; Fig. Figure 2 is a perspective exploded view of the cable harness according to this embodiment; Fig. Figure 3 is a top view of a flexible printed circuit board according to the embodiment; Fig. 4 is a top view of a plate element according to this embodiment; Fig. Figure 5 is a cross-sectional view of the plate element according to the embodiment; Fig. 6 is a top view of the wiring harness according to the embodiment; Fig. 7 is a cross-sectional view of the cable harness according to the embodiment; Fig. 8 is a top view of another cable harness according to the embodiment; and Fig. Figure 9 is a cross-sectional view of another cable harness according to the embodiment. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0007] A wiring harness according to embodiments of the present invention is described in detail below with reference to the drawings. It should be noted that the present invention is not limited by the exemplary embodiments. Furthermore, the components in the following embodiments include those that can be readily assumed by those skilled in the art or that are essentially the same. embodiment

[0008] One embodiment is described with reference to the Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 to Fig. 9 described. The present embodiment relates to a cable harness. Fig. 1 is a diagram showing a wiring harness according to the embodiment, Fig. Figure 2 is a perspective exploded view of the wiring harness according to the embodiment, Fig. Figure 3 is a top view of a flexible printed circuit board according to the embodiment, Fig. 4 is a top view of a plate element according to the embodiment, Fig. Figure 5 is a cross-sectional view of the plate element according to the embodiment, Fig. 6 is a top view of the wiring harness according to the embodiment, Fig. Figure 7 is a cross-sectional view of the wiring harness according to the embodiment, Fig. Figure 8 is a top view of another cable harness according to the embodiment, and Fig. Figure 9 is a cross-sectional view of another cable harness according to the embodiment. Fig. Figure 5 shows a cross-section along line VV of Fig. 4. Fig. Figure 7 shows a cross-section along line VII-VII of Fig. 6.

[0009] As in Fig. As shown in Figure 1, a cable harness 1 of the present embodiment has a flexible printed circuit board 3, a chip fuse 6, a plate element 4, and a potting compound 5. In the illustrated cable harness 1, a plurality of chip fuses 6 are mounted on the flexible printed circuit board 3. Furthermore, a plurality of plate elements 4 are arranged on the flexible printed circuit board 3 in accordance with the plurality of chip fuses 6. The cable harness 1 can be combined with a housing 2 and a plurality of busbars 10 to form a busbar module 200.

[0010] The wiring harness 1 and the busbar module 200 are used, for example, on a battery module 110 of a battery pack 100. The battery module 110 has a plurality of battery cells 120 arranged in an AR orientation. The battery pack 100 is installed, for example, as a power source in a vehicle, such as an electric vehicle or a hybrid electric vehicle.

[0011] The busbar 10 is a conductor formed from a conductive metal plate, which is attached to an electrode of the battery cell 120. The busbar 10 connects, for example, two adjacent battery cells 120 in series. The flexible printed circuit board 3 connects the plurality of busbars 10 to a monitoring device 130 of the battery pack 100. The flexible printed circuit board 3 can connect a thermistor located in the battery cell 120 to the monitoring device 130. The monitoring device 130 is a device that monitors a condition such as a voltage or a temperature of the battery cell 120.

[0012] The flexible printed circuit board 3 is connected to the monitoring device 130, for example, via a connector. The flexible printed circuit board 3 has a plurality of sensing lines 9. Each sensing line 9 is a circuit pattern formed from a conductive metal. The sensing line 9 is connected to a circuit of the monitoring device 130.

[0013] The detection line 9 is connected to the busbar 10 via the chip fuse 6, which is mounted on the flexible printed circuit board 3. The chip fuse 6 is a protective component that protects the circuit. The chip fuse 6 has two electrodes and a fusible section. The fusible section melts when an overcurrent flows between the two electrodes.

[0014] In the wiring harness 1 of the present embodiment, the plate element 4 is inserted between the chip fuse 6 and the busbar 10. The plate element 4 is connected to the busbar 10 by welding or a similar process and electrically connects the chip fuse 6 and the busbar 10. The plate element 4 of the present embodiment is arranged on the flexible printed circuit board 3 as a voltage sensing connection for sensing the voltage of the battery cell 120. The plate element 4 also functions as a reinforcing plate to strengthen the flexible printed circuit board 3. Furthermore, the plate element 4 has a section 4s that accommodates the chip fuse 6. As described below, the potting compound 5 is filled into the section 4s formed by the plate element 4 and covers the chip fuse 6.

[0015] The housing 2 accommodates and holds the flexible printed circuit board 3 and the busbar 10. The housing 2 is, for example, molded from an insulating resin. The housing 2 has a routing path in which the flexible printed circuit board 3 is laid and a multitude of retaining sections arranged along the routing path. Each busbar 10 is held by a corresponding retaining section. The cable harness 1 may have a cover that protects the flexible printed circuit board 3 and the busbar 10. In this case, the cover may be integrated into the housing 2.

[0016] As in Fig. As shown in Figure 2, the flexible printed circuit board 3 has a main conductor 30 and a plurality of branch sections 31. The flexible printed circuit board 3 has a base film, a cover layer, and a conductive layer. The base film and the cover layer are flexible, insulating resin layers. The conductive layer is protected by being embedded between the base film and the cover layer. The conductive layer is, for example, a conductive metal foil and has a plurality of circuit patterns, including the sensing line 9.

[0017] The main line 30 has a longitudinal direction X and a lateral direction Y. The lateral direction Y is orthogonal to the longitudinal direction X. The plurality of detection lines 9 extend within the main line 30. The branch section 31 branches off from an edge of the main line 30 in the lateral direction Y. The branch section 31 of the present embodiment extends from the main line 30 in the lateral direction Y.

[0018] The chip fuse 6 is attached to a mounting area 32 located at the tip of the branch section 31. The mounting area 32 is a region widened in the longitudinal direction X and has a substantially rectangular shape. The plate element 4 is attached to the flexible printed circuit board 3 such that it surrounds the chip fuse 6 with a circumferential wall 41.

[0019] As in Fig. As shown in Figure 3, the conductive layer of the flexible printed circuit board 3 has the sensing line 9, a first pad 11, a second pad 12, a third pad 13, and a connecting line 14. The first pad 11, the second pad 12, the third pad 13, and the connecting line 14 are arranged in the mounting area 32 of the branch section 31. The pads 11, 12, and 13 are open to the outside. In other words, the cover has an opening that exposes the pads 11, 12, and 13.

[0020] The first pad 11 and the second pad 12 shown are arranged along the longitudinal direction X. The first pad 11 and the second pad 12 are connection sections to which the electrodes of the chip fuse 6 are connected. The electrodes of the chip fuse 6 are connected to pads 11 and 12, for example, by soldering. The two electrodes are connected to pads 11 and 12, so that the chip fuse 6 is mounted on the flexible printed circuit board 3. One of the two electrodes of the chip fuse 6 is connected to the first pad 11, and the other electrode is connected to the second pad 12. That is, the chip fuse 6 is mounted on the branch section 31 such that it extends in the longitudinal direction X. The detection line 9 is connected from the main line 30 to the first pad 11 via the branch section 31.

[0021] The third pad 13 is a common section to which the plate element 4 is connected. The plate element 4 is connected to the third pad 13, for example, by soldering, and mounted on the flexible printed circuit board 3. In the present embodiment, two third pads 13 are provided in the mounting area 32. The two third pads 13 are arranged on both sides of pads 11 and 12 in the width direction Y. The connecting line 14 connects the second pad 12 and the two third pads 13. Therefore, the third pad 13 is connected to the detection line 9 via the connecting line 14 and the chip fuse 6.

[0022] As in the Fig. 2, Fig. 4 and Fig. As shown in Figure 5, the plate element 4 has a plate body 40 and a cylindrical circumferential wall 41. The plate element 4 is an element that forms the spatial section 4s to be filled with the potting compound 5 and has a rigidity. The plate element 4 is made, for example, of a conductive metal. The plate element 4 has an opening 44 and is attached to the flexible printed circuit board 3 such that the opening 44 faces the chip fuse 6. The opening 44 shown has a rectangular shape.

[0023] The plate body 40 is formed in a flat plate shape and has the form of a frame. The shape of the plate body 40 shown is a rectangular frame shape. The plate body 40 has a first surface 40a and a second surface 40b. The first surface 40a and the second surface 40b are two main surfaces of the plate body 40. The first surface 40a is a flat surface and is connected to the third pad 13 of the flexible printed circuit board 3. That is, the first surface 40a is the surface facing the flexible printed circuit board 3 among the two main surfaces of the plate body 40. The second surface 40b is a flat surface and lies opposite the first surface 40a.

[0024] The circumferential wall 41 projects from the plate body 40 in a direction T corresponding to the thickness of the plate body 40. The depicted circumferential wall 41 projects from the second surface 40b in a direction perpendicular to the second surface 40b. A cross-sectional shape of the circumferential wall 41 in a cross-section orthogonal to the thickness direction T is rectangular. That is, the depicted circumferential wall 41 has a rectangular, tubular shape. The circumferential wall 41 is formed, for example, by a deburring process on a metal plate. In this case, the circumferential wall 41 is formed by a deburring process onto a flat, plate-shaped metal plate, which is a base material of the plate element 4. The circumferential wall 41 is formed by deformation of an edge section surrounding the opening 44.

[0025] As in Fig. As shown in Figure 5, the perimeter wall 41 is connected to an inner edge 40c of the plate body 40. In a cross-section along the thickness direction T, the perimeter wall 41 is essentially arcuate. The perimeter wall 41 has an inner wall surface 42 and an outer wall surface 43. The inner wall surface 42 is a surface facing the spatial section 4s enclosed by the perimeter wall 41. The inner wall surface 42 is connected to the first surface 40a of the plate body 40. The outer wall surface 43 is a surface of the perimeter wall 41 that is opposite the inner wall surface 42. The outer wall surface 43 adjoins the second surface 40b of the plate body 40.

[0026] The perimeter wall 41 has a conical shape, in which a distance L1 decreases with increasing distance from the plate body 40 along the thickness direction T. The distance L1 is a distance between the opposing inner wall surfaces 42. In cross-section of Fig. 5 the inner wall surface 42 and the outer wall surface 43 have a curved shape, which is curved in the direction of section 4s.

[0027] The circumferential wall 41 has a tip surface 41a. A distance Z1 in the thickness direction T from the first surface 40a to the tip surface 41a is greater than the height of the chip fuse 6. That is, the circumferential wall 41 can form the spatial section 4s which has a depth that can accommodate the entire chip fuse 6.

[0028] The metal plate from which the plate element 4 is made has a thickness t. The thickness t of the plate body 40 is less than the distance Z1 from the first surface 40a to the tip surface 41a. That is, the depth (distance Z1) of the spatial section 4s formed by the plate element 4 of the present embodiment is greater than the thickness t of the plate body 40.

[0029] Fig. Figure 6 shows the chip fuse 6 and the plate element 4, which is mounted on the flexible printed circuit board 3. The plate body 40 of the plate element 4 is attached to the flexible printed circuit board 3 such that it surrounds the chip fuse 6 with its circumferential wall 41. In other words, the plate body 40 is attached to the flexible printed circuit board 3 such that it receives the chip fuse 6 in the section 4s surrounded by the circumferential wall 41. A gap is provided between the circumferential wall 41 and the chip fuse 6 for filling with the potting compound 5.

[0030] In the cable harness 1 of the present embodiment, the plate body 40 is connected to the third pad 13 of the flexible printed circuit board 3 and attached to the flexible printed circuit board 3. The plate body 4 is connected to the detection line 9 via the chip fuse 6. The spatial section 4s surrounded by the circumferential wall 41 is filled with the potting compound 5.

[0031] The busbar 10 is arranged side by side with the branch section 31, for example, in the longitudinal direction X. The plate body 40 of the plate element 4 is connected to the busbar 10 by welding or the like. The plate body 40 is connected to the busbar 10 such that, for example, an end section of the plate body 40 overlaps the busbar 10.

[0032] As in Fig. As shown in Figure 7, the potting compound 5 is filled into the section 4s surrounded by the circumferential wall 41 and covers the chip fuse 6. The depth H1 of the potting layer is greater than the height H2 of the chip fuse 6. The potting compound 5 covers an upper surface 6t of the chip fuse 6 and seals the chip fuse 6.

[0033] The thickness t of the plate body 40 of the present embodiment is less than the height H2 of the chip fuse 6. This means that, in the cable harness 1 of the present embodiment, it is possible to achieve weight reduction by decreasing the thickness t, while the potting layer with depth H1 is designed to accommodate the entire chip fuse 6. For example, the weight of the plate element 4 can be reduced compared to a case where the plate element is formed from a metal plate with the same thickness as the depth H1.

[0034] It should be noted that the direction in which the plate element 4 extends and the relative position of the busbar 10 with respect to the branch section 31 can be adjusted as required. The extension direction of the plate element 4 and the relative position of the busbar 10 with respect to the branch section 31 are determined, for example, according to the battery module 110. Fig. Figure 8 shows the plate element 4, which extends from the branch section 31 in the width direction Y. The busbar 10 of Fig. 8 is arranged in the lateral direction Y next to the branch section 31. The plate body 40 of the plate element 4 extends from the branch section 31 in the lateral direction Y and is connected to the busbar 10. The plate body 40 is attached to the branch section 31 of the flexible printed circuit board 3 such that it surrounds the chip fuse 6 with the circumferential wall 41. In the flexible printed circuit board 3 of Fig. 8 Two third pads 13 are arranged longitudinally on both sides of the chip fuse 6 in the direction X. The disk body 40 is connected to the third pad 13 by solder or the like.

[0035] It should be noted that the method for forming the circumferential wall 41 on the plate element 4 is not limited to the deburring process. For example, the plate body 40 and the circumferential wall 41 can be formed by a process such as cutting a metal plate. The plate body 40 and the circumferential wall 41 can, for example, be formed by cutting an outer section of a metal plate to reduce its thickness. Fig. Figure 9 shows an example of a plate element 4, which consists of a single metal plate. In the plate element 4 of Fig. 9 is the perimeter wall 41 orthogonal to the plate body 40. The plate element 4 with the plate body 40 and the perimeter wall 41 can be manufactured by casting or forging.

[0036] The plate element 4 can be formed by joining a multitude of elements. For example, the plate element 4 can be formed by joining a flat, plate-shaped first element with a frame and a cylindrical second element. In this case, the flat, plate-shaped first element forms the plate body 40, and the cylindrical second element forms the circumferential wall 41. The multitude of elements that make up the plate element 4 are joined, for example, by welding or gluing.

[0037] As described above, the cable harness 1 of the present embodiment comprises the flexible printed circuit board 3, the chip fuse 6, the plate element 4, and the potting compound 5. The chip fuse 6 is mounted on the flexible printed circuit board 3. The plate element 4 has a flat, plate-shaped plate body 40 with a frame and a cylindrical circumferential wall 41. The circumferential wall 41 projects from the plate body 40 in the direction of the thickness T of the plate body 40.

[0038] The plate body 40 is attached to the flexible printed circuit board 3 such that it surrounds the chip fuse 6 with its circumferential wall 41. The potting compound 5 is filled into the section 4s surrounded by the circumferential wall 41 and covers the chip fuse 6. In the cable harness 1 of the present embodiment, it is possible to reduce the weight of the plate element 4 by reducing the thickness of the plate body 40.

[0039] The plate element 4 of the present embodiment is formed from a metal plate. The circumferential wall 41 is formed into a metal plate by the deburring process. Such a structure makes it possible to reduce the wall thickness of the entire plate element 4.

[0040] The flexible printed circuit board 3 of the present embodiment has the main conductor 30 and the branch section 31. The branch section 31 is branched off from the main conductor 30 and is connected to the busbar 10. The chip fuse 6 is attached to the branch section 31. The board body 40 is attached to the branch section 31 such that the chip fuse 6 is surrounded by the circumferential wall 41. The weight reduction of the board element 4 reduces the load on the branch section 31.

[0041] The plate element 4 of the present embodiment consists of a conductive metal and electrically connects the chip fuse 6 and the busbar 10. The number of components can be reduced by forming the space section 4s for the potting compound 5 with connecting elements.

[0042] It should be noted that the position where the chip fuse 6 is mounted is not limited to the branch section 31. The chip fuse 6 can also be mounted on the main line 30. The number of chip fuses 6 housed in the spatial section 4s is not limited to one. The plate body 40 of the plate element 4 can be attached to the flexible printed circuit board 3 such that the multiple chip fuses 6 are surrounded by the perimeter wall 41. In this case, the potting compound 5 can be filled into the section 4s surrounded by the perimeter wall 41, thus covering the multiple chip fuses 6.

[0043] The contents disclosed in the above embodiments can optionally be implemented in combination.

[0044] In a cable harness according to the present embodiment, a plate element has a flat, plate-shaped body with a frame and a cylindrical circumferential wall that projects from the body in one of its thickness directions. The plate body is attached to a flexible printed circuit board to enclose a chip fuse through the circumferential wall. A potting compound is filled into a section enclosed by the circumferential wall and covers the chip fuse. The cable harness according to the present embodiment has the effect of reducing the weight of the plate element while achieving the required potting depth. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2023 - 173 467 A [0002, 0003]

Claims

[1] A wiring harness (1) comprising: a flexible printed circuit board (3); a chip fuse (6) which is mounted on the flexible printed circuit board (3); a plate element (4) with a flat, plate-shaped plate body (40) having a frame shape, and a cylindrical circumferential wall (41) projecting from the plate body (40) in a thickness direction of the plate body (40); and a potting compound (5) wherein the plate body (40) is attached to the flexible printed circuit board (3) in such a way that it surrounds the chip fuse (6) through the circumferential wall (41), and the potting compound (5) is filled into a space section (4s) surrounded by the circumferential wall (41) and covers the chip protection (6). [2] The wiring harness (1) according to claim 1, wherein the plate element (4) is formed from a metal plate, and the circumferential wall (41) is formed onto the metal plate by a deburring process. [3] The wiring harness (1) according to claim 1, wherein the flexible printed circuit board (3) has a main line (30) and a branch section (31) that branches off from the main line (30) and is connected to a busbar (10), the chip fuse (6) is attached to the branch section (31), and the plate body (40) is attached to the branch section (31) in such a way that it surrounds the chip fuse (6) through the circumferential wall (41). [4] The cable harness (1) according to claim 1, wherein the plate element (4) is an element formed from a conductive metal and electrically connects the chip fuse (6) and the busbar (10).

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