Method for attaching a contact pad to a heating film, method for manufacturing an end plate with an integrated heating structure, and end plate with integrated heating structure

By softening the carrier film with heat and pressing the contact pad into it, the method addresses the unreliable attachment issue, providing a robust and visually appealing integration of contact pads on heating films.

DE102025124223B3Active Publication Date: 2026-06-03HELLA GMBH & CO KGAA

Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
HELLA GMBH & CO KGAA
Filing Date
2025-06-24
Publication Date
2026-06-03

AI Technical Summary

Technical Problem

The challenge in existing technologies is the unreliable attachment of contact pads to heating films in motor vehicle end caps, leading to slippage and aesthetic issues due to adhesive failure during injection molding.

Method used

A method involving heat application to soften the carrier film, allowing the contact pad to be pressed into the film, forming a form-fit connection, eliminating the need for adhesives and ensuring a mechanically stable and visually appealing integration.

Benefits of technology

Ensures robust and reliable attachment of contact pads to heating films, preventing slippage during injection molding and maintaining aesthetic integrity.

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Patent Text Reader

Abstract

The present invention relates to a method for attaching a contact pad (1) to a heating film (2), comprising at least the following steps in an unspecified order: - Providing the heating film (2) which has an electrically insulating carrier film (21) with a heating structure (22) integrated therein, in particular an arrangement of heating wires, - Providing the contact pad (1) made of a metallic conductive material, wherein the contact pad (1) is intended to form an electrical interface of the heating film (2) for contacting the heating structure (22), - Arranging the contact pad (1) on the carrier film (21) in the area of ​​a contact zone of the heating film (2), - Softening of the carrier film (21) in the area of ​​the contact zone by means of heat application, and - Pressing the contact pad (1) into the softened carrier film (21) to form a positive connection between the contact pad (1) and the carrier film (21).
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