DISPLAY DEVICE

Abstract

A display device (1000) according to the exemplary configuration of the present disclosure may comprise: a substrate (110) with a display area (AA) and a non-display area (NA); a first stopper layer (111) arranged on the substrate (110) and having a first stopper area in the non-display area (NA); a pixel driver circuit (PD) arranged on the first stopper layer (111); and a first insulating layer (113a, 113b) arranged on the first stopper layer (111); a second stopper layer (114) arranged on the first insulating layer (113a, 113b) and having a second stopper area in the non-display area (NA); and a second insulating layer (115a, 115b, 115c, 115d) arranged on the second stopper layer (114).a third stopper layer (116) arranged on the second insulating layer (115a, 115b, 115c, 115d) and having a third stopper area in the non-display area (NA); a plurality of light-emitting devices (ED) arranged on the third stopper layer (116) and electrically connected to the pixel driver circuit (PD); an optical layer (117a) arranged on the third stopper layer (116); and a fourth stopper layer (118) arranged on the optical layer (117a) having a fourth stopper area in the non-display area (NA).

Description

1. Technical field

[0001] The present disclosure relates to a display device. 2. Related technology

[0002] Display devices include an organic light-emitting diode (OLED) display, which emits light itself; a liquid crystal display (LCD), which requires a separate light source; and the like.

[0003] Recently, displays using light-emitting diodes (LEDs) have gained attention as next-generation displays. These LEDs are made from inorganic materials rather than organic ones, allowing them to offer faster illumination speeds, better emission efficiency, and higher brightness compared to LCD or OLED displays.

[0004] The description in the "Background" section should not be considered prior art solely because it is mentioned or related to the "Background" section. The "Background" section may contain information describing one or more aspects of the technology in question. SUMMARY OF THE INVENTION

[0005] At least one exemplary embodiment of the present disclosure aims to provide a display device whose reliability and yield can be improved.

[0006] Several exemplary embodiments of the present disclosure provide display devices according to the independent claims. Further exemplary embodiments are described in the dependent claims.

[0007] A display device according to an exemplary embodiment of the present disclosure may comprise: a substrate with a display area and a non-display area; a pixel driver circuit arranged on the substrate; a plurality of light-emitting elements arranged on the substrate and electrically connected to the pixel driver circuit; an optical layer arranged on the substrate and on the side faces of the plurality of light-emitting elements; and a plurality of stopper layers arranged: under the pixel driver circuit, between the pixel driver circuit and the plurality of light-emitting elements, and in at least one of the display area and the non-display area, which are arranged under and on the light-emitting elements, wherein at least one of the plurality of stopper layers has a stopper area that is arranged in the non-display area.

[0008] A display device according to a further exemplary embodiment of the present disclosure may comprise: a substrate with a display area and a non-display area; a first stopper layer arranged on the substrate and having a first stopper area in the non-display area; a pixel driver circuit arranged on the first stopper layer and a first insulating layer arranged on the first stopper layer; a second stopper layer arranged on the first insulating layer and having a second stopper area in the non-display area; a second insulating layer arranged on the second stopper layer; a third stopper layer arranged on the second insulating layer and having a third stopper area in the non-display area;a plurality of light-emitting elements arranged on the third stopper layer and electrically connected to the pixel driver circuit; an optical layer arranged on the third stopper layer; and a fourth stopper layer arranged on the optical layer and having a fourth stopper area in the non-display area.

[0009] The tasks according to exemplary embodiments of the present disclosure are not limited to the tasks described above, and further, unmentioned tasks will be clearly understandable to the person skilled in the art from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The following drawings, which are attached to this disclosure, illustrate preferred embodiments of the present disclosure and, together with the detailed description of the invention which is described below, serve to provide a better understanding of the technical idea of ​​the present disclosure, which is why the present disclosure is not to be interpreted as being limited to the matters described in these drawings. Fig. Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure; Fig. Figure 2 is a top view of a display device according to an exemplary embodiment of the present disclosure; Fig. Figure 3 is an enlarged view of a display device according to an exemplary embodiment of the present disclosure; Fig. 4 an enlarged top view of a connection structure of a display device according to an exemplary embodiment of the present disclosure; Fig. Figure 5 is a representation showing a circuit structure according to an exemplary embodiment of the present disclosure. Fig. Figure 6 is an enlarged view of a display device according to an exemplary embodiment of the present disclosure; Fig. Figure 7 is a top view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 8 is a top view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 9 is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 10 is an enlarged cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 11 is an enlarged top view of section A of Fig. 3 according to an exemplary embodiment of the present disclosure; Fig. Figure 12 is a cross-sectional view of the display device according to an exemplary embodiment of the present disclosure; Fig. Figure 13 is an enlarged cross-sectional view of section B in Fig. 12; Fig. Figure 14 is a top view of a display device according to a further exemplary embodiment of the present disclosure; Fig. Figure 15 is a cross-sectional view of the display device according to a further exemplary embodiment of the present disclosure; Fig. Figure 16 is an enlarged cross-sectional view of section C in Fig. 15; Fig. Figure 17 is an enlarged cross-sectional view of a display device according to a further exemplary embodiment of the present disclosure; Fig. Figure 18 is an enlarged cross-sectional view of a display device according to a further exemplary embodiment of the present disclosure; and Fig. 19, Fig. 20, Fig. 21 to Fig. Figure 22 are views showing devices to which the display devices are applied according to exemplary embodiments of the present disclosure.

[0011] Unless otherwise specified, identical reference symbols in the drawings and detailed description refer to the same elements, features, and structures. The relative size and representation of these elements may be exaggerated for clarity, illustration, and comprehensibility. DETAILED DESCRIPTION OF EXAMPLE EXECUTION FORMS

[0012] Detailed reference will now be made to embodiments of the present disclosure, examples of which may be shown in the accompanying drawings. The following description omits a detailed description of known functions or configurations related to this document where such a description would unnecessarily obscure the core of the inventive idea. The sequence of processing steps and / or operations described is merely exemplary; the order of the steps and / or operations is not limited to those presented here and may be modified as is known in the art, with the exception of steps and / or operations that must necessarily be carried out in a specific sequence.The names of the respective elements used in the following explanations may have been chosen for the sake of simplicity of description and may therefore differ from those used in actual products.

[0013] The advantages and features of the present disclosure, as well as the methods for its implementation, will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed herein, but can be implemented in various forms; rather, the present embodiments are provided to complete the disclosure and to enable the person skilled in the art to fully understand the scope of the present disclosure.

[0014] The shapes (e.g., sizes, lengths, widths, heights, thicknesses, positions, radii, diameters, and areas), proportions, angles, numbers, and the like of the elements shown in the drawings to illustrate embodiments of the present disclosure are for illustrative purposes only and are not to be understood as limiting. Identical reference numerals may denote identical components throughout the description. Furthermore, detailed descriptions of related known technologies may be omitted from the description of the present disclosure in order not to obscure the core of the present disclosure. Terms such as "including," "with," or "featuring," as used herein, are generally intended to permit the addition of other components unless the terms are used together with the term "only."References to components of a singular noun also include the plural of that noun, unless explicitly stated otherwise.

[0015] In the design of components, they are designed to include fault areas, even if this is not explicitly stated. Any implementation described herein as an "example" is not necessarily to be interpreted as preferred or advantageous over other implementations.

[0016] When describing a positional relationship, e.g., "on", "above", "below", "next to" or "adjacent to", which describes a positional relationship between two parts, one or more other parts may be located between the two parts unless the terms "immediately", "directly" or "near" are used.

[0017] When describing a temporal relationship, “after”, “following”, “next to” or “before” describe a temporal pre- or post-relationship which may not be continuous, unless the terms “immediately” or “directly” are used.

[0018] Terms such as "under," "below," "above," "above," and similar terms can be used here to describe a relationship between elements, as shown in the drawings. It is understood that these terms are spatially relative and based on the orientation depicted in the drawings.

[0019] The terms “the first,” “the second,” etc., are used to describe different components, but these components are not limited to these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may, in the context of this disclosure, be a second component.

[0020] Terms such as “first”, “second”, “A”, “B”, “(a)” or “(b)” may be used to describe elements of the present disclosure. Such terms serve only to distinguish one component from another and are not intended to define the nature, sequence, arrangement or number of such components.

[0021] When a component is described as "connected" or "coupled" together with another component, or as "attached to" or "controlled by" it, it is understood that the component may be directly connected or coupled to, attached to, or controlled by the other component, but that other components may also be arranged between the respective components, so that one component is indirectly connected or coupled to, attached to, or controlled by the other component, unless expressly stated otherwise.

[0022] When a component is described as "in contact" or "overlapping" with another component, it is understood that the component may be in direct contact with or overlapping the other component, but also that other components may be positioned between the respective components, which are in direct or indirect contact with or overlapping the other component, unless expressly stated otherwise.

[0023] It is understood that the term "at least one" encompasses all possible combinations of one or more related components. For example, the meaning of "at least one of the first, second, and third components" can be understood to include not only the first, second, or third component, but also any combination of two or more of the first, second, and third components.

[0024] The terms “first direction”, “second direction”, “third direction”, “X-axis direction”, Y-axis direction and Z-axis direction are not to be understood exclusively as geometric relationships in which the relationships to each other are perpendicular, but may refer to a wider range of orientations in which the configurations of the present disclosure function.

[0025] The features of various exemplary embodiments of the present disclosure can be coupled or combined wholly or partially and can be technologically linked and operated in various ways, and each of the embodiments can be carried out independently or in combination with the others.

[0026] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by a person skilled in the art in the field to which the embodiments belong. It is further understood that terms as defined in commonly used dictionaries should be interpreted, for example, to have a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense, unless expressly defined herein.For example, the term "part" or "unit" may refer to a separate circuit or structure, an integrated circuit, a computing block of a circuit device, or any structure configured to perform a described function as should be understandable to a person skilled in the art in this field.

[0027] In the following, various exemplary embodiments of the present disclosure are described in detail with reference to the accompanying drawings.

[0028] Fig. Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 2 is a top view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 3 is an enlarged view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 4 is an enlarged top view of a connection structure of a display device according to an exemplary embodiment of the present disclosure.

[0029] With reference to the Fig. 1, Fig. 2 to Fig. 3. According to an exemplary embodiment of the present disclosure, a display device 1000 can comprise a display panel 100, a polarization layer 293, an adhesive layer 295, a cover element 120, a support substrate 110, a flexible printed circuit board CB, and a printed circuit board 160. The embodiments are not limited thereto. For example, at least one of the above-mentioned components can be omitted, or at least one additional component can be provided.

[0030] For example, the display device 1000 can have a substrate 110. The substrate 110 can be an element that supports other components of the display device 1000. The substrate 110 can be made of an insulating material. For example, the substrate 110 can be made of glass, resin, or the like. Furthermore, the substrate 110 can be made of a flexible material. For example, the substrate 110 can be made of a flexible plastic material such as polyimide (PL) or the like. However, the embodiments of the present disclosure are not limited thereto. For example, the substrate 110 can be made of a rigid material or a flexible material. For example, the substrate 110 can have a single layer or two or more layers. For example, the substrate 110 can be an organic material or an inorganic material.For example, substrate 110 can be a transparent material or an opaque material.

[0031] The display panel 100 can display information, videos, and / or images provided to a user. For example, the display panel 100 can have a display area AA and a non-display area NA. Similarly, the substrate 110 can have a display area AA and a non-display area NA. The display area AA and the non-display area NA are not limited to being described only in relation to the substrate 110, but can be described in relation to the entire display device 1000.

[0032] The display area AA can be an area in which an image is displayed. The display area AA can have a plurality of pixels PX. Each of the plurality of pixels PX can be composed of a plurality of subpixels. Multiple micro-LEDs can each be arranged within the plurality of subpixels. The micro-LEDs can be configured in up to 1000 different ways, depending on the type of display device.

[0033] The non-display area NA can be an area in which no image is displayed. Various lines and circuits for driving the plurality of pixels PX of the display area AA can be positioned in the non-display area NA. For example, various lines and driver circuits can be mounted in the non-display area NA, and a pad section PAD can be provided to which an integrated circuit, a printed circuit, and the like are connected, but the embodiments of the present disclosure are not limited thereto. For example, the non-display area NA can extend from the display area AA. For example, the non-display area NA can completely or partially surround the display area AA without being limited to it.For example, the non-display area NA may be at least partially or completely invisible from the front of the display panel 100, for example by being curved towards the back of the display panel 100, without being limited to that.

[0034] For example, the driver circuit can be a data driver circuit and / or a gate driver circuit, but the embodiments of this disclosure are not limited thereto. Lines can be configured through which a control signal is supplied to control the driver circuits. For example, the control signal can include various timing signals, including a clock signal, an input data enable signal, and synchronization signals, but the embodiments of this disclosure are not limited thereto. The control signal can be received via the pad section PAD.

[0035] For example, connecting lines LL can be positioned in the non-display area NA to transmit signals. For example, the pad section PAD can be connected to driver components such as the flexible printed circuit board CB and the printed circuit board 160.

[0036] The non-display area NA can comprise a first non-display area NA1, a bending area BA, and a second non-display area NA2. For example, the first non-display area NA1 can be an area surrounding at least part of the display area AA. The bending area BA can be an area extending from at least one or more sides of the first non-display area NA1 and can be a bendable area. The second non-display area NA2 can be an area extending from the bending area BA, and the pad portion PAD can be positioned within the second non-display area NA2. For example, the bending area BA can be in a bent state, and the remaining area of ​​the substrate 110, except for the bending area BA, can be in a flat state.In this case, the second non-display area NA2 can be positioned on the back side of the display area AA, since the bending area BA is in a bent state. However, the embodiments of the present disclosure are not limited to this. For example, the entire non-display area NA can be in a flat state, without being limited to this.

[0037] The display area AA of the substrate 110 or the display device 1000 can be configured in various shapes, depending on the design of the display device 1000. For example, the display area AA can be configured in a rectangular shape with four rounded corners, but the embodiments of the present disclosure are not limited to this. In another example, the display area AA can be configured in a rectangular shape with four right-angled corners, a circular shape, or the like, but the embodiments of the present disclosure are not limited to this.

[0038] According to the exemplary embodiments of this disclosure, the width of the second non-display area NA2, in which a plurality of contact surface electrodes PE are arranged, can be greater than the width of the bending area BA, in which only the plurality of connecting lines LL are arranged. Additionally, the width of the display area AA, in which the plurality of subpixels are arranged, can be greater than the width of the bending area BA, in which only the plurality of connecting lines LL are arranged. In the drawings, the width of the bending area BA is shown to be smaller than the width of other areas of the substrate 110. However, the shape of the substrate 110, including the bending area BA, is merely exemplary, and the embodiments of this disclosure are not limited to it.For example, the width of the second non-display area NA2, in which a plurality of contact surface electrodes PE are arranged, the width of the bending area BA, in which only the plurality of connecting leads LL are arranged, and the width of other areas of the substrate 110 may be the same or different from each other, without being restricted thereto.

[0039] With reference to Fig. 3. In the display device according to an exemplary embodiment of the present disclosure, a display area AA, in which a plurality of pixels PX are arranged, and a first non-display area NA1, which surrounds the display area AA, can be arranged. A crack stopper ST can be arranged in the first non-display area NA1 to surround the display area AA.

[0040] The crack stopper ST can be used to prevent a crack generated in the first non-display area NA from propagating to the display area AA during laser cutting. In a top view, the crack stopper ST can have a closed-loop shape that surrounds the display area AA in the first non-display area NA1. The crack stopper ST can be configured with the first through fourth stopper openings 111c, 114a, 116a, and 118a according to [reference missing]. Fig. 12. However, the present disclosure is not limited to this.

[0041] Furthermore, the first non-indication area NA1 can be separated from the indication area AA independently by the separation boundary line TML, with the crack stopper ST as the boundary. That is, the inorganic layer on which the crack stopper ST is formed, for example the first to fourth stopper layers 111, 114, 116 and 118 in Fig. 12, can be separated independently by the first to fourth stopper opening 111c, 114a, 116a and 118a, which form the crack stopper ST.

[0042] Even if a crack occurs in the parting line (TRL) during laser cutting Fig. 12) If a crack occurs outside the separation boundary line TML of the first non-display area NA1, the path along which the crack propagates is narrowed or blocked by the crack stop ST, so that it can propagate less or not at all to the display area AA. If the crack stop ST is not integrally formed in the first non-display area NA1, but only in a partial area, cracks created during laser cutting can propagate to the display area AA through the part of the inorganic layer where the stop ST is not formed.

[0043] With reference to Fig. 4. A plurality of pixel driver circuits PD can be arranged in the display area AA. The plurality of pixel driver circuits PD can include circuits for driving the micro-LEDs of the plurality of subpixels. Each of the plurality of pixel driver circuits PD can include a plurality of transistors, including a driver transistor, a storage capacitor, and the like, and can supply a control signal, current, and a driver current to the micro-LEDs of the plurality of subpixels to control the light-emitting operation of the plurality of micro-LEDs. For example, the pixel driver circuit PD can include a power line and a signal line for controlling the on / off state and / or the light-emitting time of the micro-LED.For example, the majority of pixel driver circuits PD can be a drive driver formed using a metal oxide silicon field-effect transistor (MOSFET) fabrication process on a semiconductor substrate, but the embodiments of the present disclosure are not limited thereto. The drive driver can comprise the majority of pixel driver circuits PD and drive the majority of subpixels.

[0044] With reference also to Fig. 1. The flexible circuit board CB and the printed circuit board 160 can be positioned below the display panel 100. The flexible circuit board CB and the printed circuit board 160 can be positioned at at least one edge of the display panel 100, but the embodiments of the present disclosure are not limited thereto.

[0045] One side of the flexible circuit board CB can be attached to the display panel 100, and the other side can be attached to the printed circuit board 160, but the embodiments of the present disclosure are not limited thereto. The flexible circuit board CB can be a flexible film, but the embodiments of the present disclosure are not limited thereto.

[0046] The pad section PAD, containing the majority of pad electrodes PE, can be positioned in the second non-display area NA2. Driver components, including one or more flexible printed circuit boards (or flexible films) CB and the printed circuit board 160, can be attached to or connected to the pad section PAD. The majority of pad electrodes PE of the pad section PAD can be electrically connected to the one or more flexible printed circuit boards (or flexible films) CB and transmit various signals (or current) from the printed circuit board 160 and the flexible printed circuit board (or flexible film) CB to the majority of pixel driver circuits PD of the display area AA.

[0047] The flexible printed circuit board (or flexible film) CB can be a film in which various components are arranged on a flexible base film. For example, a driver IC, such as a gate driver IC or a data driver IC, can be positioned on the flexible printed circuit board (or flexible film) CB, but the embodiments of the present disclosure are not limited thereto.

[0048] The driver IC can be a component that processes data and a driver signal to display an image. Depending on the assembly method, the driver IC can be arranged by a method such as a chip-on-glass (COG) process, a chip-on-film (COF) process, a gate-in-panel (GIP) process, or a tape-carrier-package (TCP) process, but the embodiments of the present disclosure are not limited to these. The flexible printed circuit board (or flexible film) CB can be attached to or connected to the plurality of pad electrodes PE via a conductive adhesive layer, but the embodiments of the present disclosure are not limited to these.

[0049] The printed circuit board 160 can be a component that is electrically connected to one or more flexible printed circuit boards (or flexible films) CB and provides signals to the driver IC. The printed circuit board 160 can be located on one side of the flexible printed circuit board (or flexible film) CB and electrically connected to it. Various components for providing different signals to the driver IC can be arranged on the printed circuit board 160. For example, various components such as a timing controller, a power supply unit, a memory, a processor, etc., can be arranged on the printed circuit board 160. For example, the printed circuit board 160 can include a power management integrated circuit (PMIC), but embodiments of the present disclosure are not limited to this.

[0050] The printed circuit board 160 may have at least one hole 180, but the embodiments of this disclosure are not limited thereto. An internal component for sensing ambient light, temperature, or the like, which may be configured for a plurality of sensors, may be positioned in an area corresponding to the at least one hole 180. The internal component may, for example, comprise an ambient light sensor (ALS), a temperature sensor, or the like, but the embodiments of this disclosure are not limited thereto. The hole 180 may, for example, be a through-hole or the like, but the embodiments of this disclosure are not limited thereto.

[0051] With reference to Fig. 1. The polarization layer 293 can be positioned on the display panel 100. The polarization layer 293 can prevent or reduce the entry of light generated by an external light source into the interior of the display panel 100 and thereby prevent damage to micro-LEDs or the like.

[0052] The cover element 120 can be positioned on the polarization layer 293. The cover element 120 can serve as a protective element for the display panel 100. The adhesive layer 295 can be positioned between the polarization layer 293 and the cover element 120. The cover element 120 can be attached to the display panel 100 using the adhesive layer 295. The adhesive layer 295 can comprise an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), or the like, but the embodiments described in this disclosure are not limited thereto.

[0053] The support substrate 110 can be positioned between the display panel 100 and the printed circuit board 160. The support substrate 110 can increase the rigidity of the display panel 100. The support substrate 110 can be a backplate, but the embodiments of the present disclosure are not limited to this.

[0054] With reference to the Fig. 1, Fig. 2, Fig. 3 to Fig. 4. The majority of connecting lines LL can be arranged in the first non-display area NA1 and the second non-display area NA2. The majority of connecting lines LL can include lines for transmitting various signals from the one or more flexible printed circuit boards (or flexible films) CB and the printed circuit board 160 to the display area AA. The majority of connecting lines LL can extend from the majority of contact surface electrodes PE of the second non-display area NA2 towards the bending area BA and the first non-display area NA1 and be electrically connected to the majority of driver lines VL of the display area AA.

[0055] The majority of pixel driver circuits PD can be controlled by receiving signals from one or more flexible printed circuit boards (or flexible films) CB and the printed circuit board 160 via the driver lines VL in the display area AA and the connecting lines LL in the non-display area NA.

[0056] For example, a plurality of driver lines VL can have lines that transmit a signal output from the flexible circuit board (or flexible film) CB and the printed circuit board 160, together with a plurality of interconnect lines LL, to a plurality of pixel driver circuits PD. A plurality of driver lines VL can be located in the display area AA and electrically connected to each of a plurality of pixel driver circuits PD. A plurality of driver lines VL can extend from the display area AA to the non-display area NA and be electrically connected to a plurality of interconnect lines LL.

[0057] Therefore, the signal output by the flexible circuit board (or flexible film) CB and the printed circuit board 160 can be transmitted via the plurality of connecting lines LL and the plurality of driver lines VL to each of the plurality of pixel driver circuits PD.

[0058] When the bending region BA is bent, a portion of the plurality of connecting lines LL may also be bent. The stress may concentrate on a portion of the bent connecting lines LL, thereby causing cracks in the connecting lines LL. Accordingly, the plurality of connecting lines LL may be formed from a highly flexible conductive material to reduce cracking when the bending region BA is bent. For example, the plurality of connecting lines LL may be formed from a highly flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al), but the embodiments of the present disclosure are not limited thereto.

[0059] Additionally, the majority of connecting leads LL can be formed, for example, from one of the various conductive materials used in the display area AA. For example, the majority of connecting leads LL can be formed from molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg), or other alloys thereof, but the embodiments of the present disclosure are not limited thereto. The majority of connecting leads LL can have a multilayer structure of various conductive materials. For example, the majority of connecting leads LL can have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments of the present disclosure are not limited thereto.

[0060] For example, a plurality of connecting lines LL can be configured in various shapes to reduce stress. At least some of the plurality of connecting lines LL arranged on the bending area BA can extend in the same direction as the extension direction of the bending area BA or extend in a direction different from the extension direction of the bending area BA to reduce stress. For example, if the bending area BA extends in one direction from the first non-display area NA1 to the second non-display area NA2, at least some of the connecting lines LL arranged on the bending area BA can extend in a direction inclined to that direction.

[0061] In another example, at least a portion of the plurality of connecting lines LL can be configured in different shapes. For example, at least a portion of the plurality of connecting lines LL arranged on the bending region BA can have a shape in which a conductive pattern with at least one of the following shapes is repeatedly arranged: diamond shape, rhombus shape, trapezoidal shape, triangular waveform, sawtooth waveform, sinusoidal shape, circular shape, and omega shape (Ω), although the embodiments of the present disclosure are not limited thereto.

[0062] In order to reduce or minimize the stress concentrated on the plurality of connecting lines LL and the corresponding crack, the shape of the plurality of connecting lines LL can therefore be formed in various shapes, including the shape described above, but the embodiments of the present disclosure are not limited thereto.

[0063] Fig. Figure 5 is a diagram illustrating a circuit structure according to an exemplary embodiment of the present disclosure.

[0064] Although in Fig. Figure 5 shows that a light-emitting device ED is connected to the microdriver; however, the present disclosure is not limited to this. For example, two or more light-emitting devices ED can be connected to one microdriver, or one light-emitting device ED can be connected to two or more microdrivers, without being limited thereto.

[0065] For example, eight light-emitting devices ED can be connected to a microdriver. In another example, 16 light-emitting devices ED can be connected to a microdriver, or 32 or 64 light-emitting devices ED can be connected to a microdriver simultaneously. The light-emitting device ED can be a light-emitting micro-device µLED. Although the present disclosure is mainly based on the fact that the light-emitting device ED is a light-emitting micro-device, the embodiments are not limited thereto. For example, the light-emitting device ED can be a light-emitting diode, an organic light-emitting diode, etc., without being limited thereto.

[0066] For example, a microdriver (µDriver) can have a driver transistor T DR and a light-emitting transistor T EMThe embodiments described in this disclosure include, but are not limited to, the embodiments described therein. For example, one or more additional transistors or one or more capacitors may be further provided. For example, the circuit configuration of the microdriver µDriver may be modified in various ways.

[0067] For example, in the driver transistor T DR A high-potential supply voltage VDD is applied to the first electrode, a first electrode of the light-emitting transistor T. EM can be connected to the second electrode, and a sampling signal SC can be applied to the gate electrode. This is connected to the gate electrode of the driver transistor T. DRThe applied sampling signal SC is a DC current source, and a fixed reference voltage Vref can be applied in each frame, but the embodiments of the present disclosure are not limited thereto. For example, the signal applied to the gate electrode of the driver transistor T DR The applied sampling signal SC can be an alternating current source, and a varying voltage with a different period can be applied without being limited to that.

[0068] In the light-emitting transistor T EM is the second electrode of the driver transistor T DR The first electrode is connected to the light-emitting device ED, the second electrode is connected to the light-emitting device ED, and the light-emitting signal EM can be applied to the gate electrode. The signal is then applied to the gate electrode of the light-emitting transistor T. EMThe applied light-emitting signal EM can be a pulse-width modulation signal that changes with each frame, but the embodiments of the present disclosure are not limited to this.

[0069] In the light-emitting device ED, for example, the first electrode can be connected to the second electrode of the light-emitting transistor T. EM The first electrode can be connected, and the second electrode can be connected to ground or a base voltage. For example, the first electrode can be an anode electrode and the second electrode a cathode electrode, but the configurations of the present disclosure are not limited thereto.

[0070] In the microdriver µDR, the driver transistor T DR The light-emitting transistor T is switched on by the sampling signal SC applied by the timing controller T-CON. EMIt can be switched on by the light-emitting signal EM. Consequently, the driver current is passed through the driver transistor T. DR and the light-emitting transistor T EM through the connection to the first electrode of the driver transistor T DR A high-potential supply voltage VDD is applied to the light-emitting device ED, enabling the light-emitting device ED to emit light.

[0071] Fig. 6, Fig. 7 to Fig. Figure 8 are top views of a display device according to an exemplary embodiment of the present disclosure. For example, Fig. 6. An enlarged top view of a display area that has a plurality of pixels. For example, Fig. 6. An enlarged top view of a display area containing one pixel. For example, Fig. 7 An enlarged top view of a display area that has multiple pixels.

[0072] In the Fig. 6 and Fig. Figure 7 shows only a plurality of signal lines TL, a plurality of communication lines NL, a plurality of first electrodes CE1, a plurality of dams BNK and a plurality of light-emitting devices ED, but embodiments of the present disclosure are not limited thereto. Fig. Figure 8 is an enlarged top view, in which, in addition to Fig. 6 a plurality of second electrodes CE2 is arranged.

[0073] With reference to the Fig. 6 and Fig. 7. A plurality of pixels PX, each comprising a plurality of subpixels, can be arranged in the display area AA. Each of the plurality of subpixels includes a light-emitting device ED and can emit light independently. The plurality of subpixels can form multiple rows and multiple columns and be arranged in matrix form, but the configurations of the present disclosure are not limited thereto.

[0074] A plurality of subpixels can comprise a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 can be a red subpixel, another can be a green subpixel, and the remainder can be blue subpixels. The types of a plurality of subpixels are examples, and the embodiments of the present disclosure are not limited thereto. For example, each pixel PX can comprise two or more, or four or more subpixels. For example, the subpixels contained in each pixel PX can emit light of different colors, or at least two of the subpixels contained in each pixel PX can emit light of the same color. For example, the plurality of subpixels contained in each pixel PX can comprise a red subpixel, a green subpixel, and a blue subpixel.For example, one or more subpixels that emit light of other colors such as white, cyan, magenta or yellow may be included, or alternatively, without being limited to this.

[0075] Each of the plurality of pixels PX can have one or more first subpixels SP1, one or more second subpixels SP2, and one or more third subpixels SP3. For example, a pixel PX can have a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3. The pair of first subpixels SP1 can have a 1-1 subpixel SP1a and a 1-2 subpixel SP1b. The pair of second subpixels SP2 can have a 2-1 subpixel SP2a and a 2-2 subpixel SP2b.

[0076] The pair of third subpixels SP3 can comprise a 3-1 subpixel SP3a and a 3-2 subpixel SP3b. For example, a pixel PX can comprise a 1-1 subpixel SP1a, a 1-2 subpixel SP1b, a 2-1 subpixel SP2b, a 3-1 subpixel SP3a, and a 3-2 subpixel SP3b, but the embodiments of the present disclosure are not limited thereto.

[0077] A plurality of subpixels forming a pixel PX can be arranged in various ways. For example, in a pixel PX, a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3 can be arranged in the same column. The first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 can be arranged in the same row. The number and arrangement of a plurality of subpixels forming a pixel PX are exemplary, and the configurations of this disclosure are not limited thereto.

[0078] A plurality of signal lines TL can be arranged in a region between a plurality of subpixels. The plurality of signal lines TL can extend in a column direction between the plurality of subpixels. The plurality of signal lines TL can be lines that transmit an anode voltage from the pixel driver circuit PD to the plurality of subpixels. For example, the plurality of signal lines TL can be electrically connected to the plurality of pixel driver circuits PD and the first electrode CE1 of the plurality of subpixels.

[0079] The anode voltage output by the pixel driver circuit PD can be transmitted via a plurality of signal lines TL to the first electrodes CE1 of a plurality of subpixels. For example, the first electrode CE1 can be an electrode electrically connected to the anode electrode 134 of the light-emitting device ED. Accordingly, the anode voltage can be transmitted from the signal line TL via the first electrode CE1 to the anode electrode 134 of the light-emitting device ED.

[0080] Instead of using multiple transistors and storage capacitors in each of the multiple subpixels, the structure of the display device 1000 can be simplified by using the pixel driver circuit PD, in which the multiple pixel circuits are integrated. Furthermore, since the circuits located in each of the multiple subpixels are integrated into a single pixel driver circuit PD, highly efficient and low-power control is possible.

[0081] A plurality of signal lines TL can have a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. The first signal line TL1 and the second signal line TL2 can each be electrically connected to each of a pair of first subpixels SP1. The third signal line TL3 and the fourth signal line TL4 can each be electrically connected to each of a pair of second subpixels SP2. The fifth signal line TL5 and the sixth signal line TL6 can each be electrically connected to each of a pair of third subpixels SP3.

[0082] For example, the first signal line TL1 can be positioned on one side of the pair of first subpixels SP1, and the second signal line TL2 can be positioned on the other side of the pair of first subpixels SP1. The first signal line TL1 can be electrically connected to the first electrode CE1 of one of the pair of first subpixels SP1, for example, to the 1-1 subpixel SP1a. The second signal line TL2 can be electrically connected to the first electrode CE1 of the other of the pair of first subpixels SP1, for example, to the 1-2 subpixel SP1b. The embodiments are not limited thereto. For example, the first signal line TL1 and the second signal line TL2 can be positioned on the same side of the pair of first subpixels SP1.For example, one of the first signal lines TL1 and the second signal line TL2 can be omitted, and the other of the first signal lines TL1 and the second signal line TL2 can be electrically connected to the first electrode CE1 of both pairs of first subpixels SP1 without being restricted to it.

[0083] The third signal line TL3 can be positioned on one side of the pair of second subpixels SP2, and the fourth signal line TL4 can be positioned on the other side of the pair of second subpixels SP2. For example, the third signal line TL3 can be positioned adjacent to the second signal line TL2. The third signal line TL3 can be electrically connected to the first electrode CE1 of one of the pair of second subpixels SP2, for example, to the 2-1 subpixel SP2a. The fourth signal line TL4 can be electrically connected to the first electrode CE1 of the other of the pair of second subpixels SP2, for example, to the 2-2 subpixel SP2b.

[0084] The fifth signal line, TL5, can be positioned on one side of the pair of third subpixels SP3, and the sixth signal line, TL6, can be positioned on the other side of the pair of third subpixels SP3. For example, the fifth signal line, TL5, can be positioned adjacent to the fourth signal line, TL4. The sixth signal line, TL6, can be positioned next to the first signal line, TL1, which is connected to an adjacent pixel PX. The fifth signal line, TL5, can be electrically connected to the first electrode, CE1, of one of the pair of third subpixels SP3, for example, to the 3-1 subpixel SP3a. The sixth signal line, TL6, can be electrically connected to the first electrode, CE1, of the other of the pair of third subpixels SP3, for example, to the 3-2 subpixel SP3b.

[0085] The majority of signal lines TL can be formed from a conductive material. For example, the majority of signal lines TL can be formed from a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present disclosure are not limited thereto. In another example, the majority of signal lines TL can have a multilayer structure made of a conductive material. For example, the majority of signal lines TL can have a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but the embodiments of the present disclosure are not limited thereto.

[0086] The majority of communication lines NL can be arranged in a region between the majority of pixels PX. The majority of communication lines NL can extend in a series direction, in the region between the majority of pixels PX. The majority of communication lines NL can be located in a region between the majority of second electrodes (CE2 in Fig. 8) be arranged and the majority of second electrodes CE2 must not overlap. For example, the majority of communication lines NL may include lines used for short-range communication, such as near-field communication (NFC). The majority of communication lines NL may function as an antenna. For example, the majority of communication lines NL may include multiple connecting lines or the like, but the embodiments of the present disclosure are not limited thereto. For example, the communication lines NL may be omitted depending on the design.

[0087] According to the exemplary embodiments of the present disclosure, the bank BNK can be positioned in each of the plurality of subpixels. The plurality of banks can be a structure on which the plurality of micro-LEDs are mounted. The plurality of banks can control the positions of the plurality of micro-LEDs ED in a transfer process for transferring the plurality of micro-LEDs ED to the display device 1000. During the transfer process of the plurality of micro-LEDs ED, the plurality of micro-LEDs ED can be transferred to the plurality of banks BNK. The plurality of banks BNK can have bank patterns or bank structures, but the embodiments of the present disclosure are not limited thereto.

[0088] The dam BNK of the first subpixel SP1, the dam BNK of the second subpixel SP2, and the dam BNK of the third subpixel SP3 can be spaced apart from each other. The dam BNK of the first subpixel SP1, the dam BNK of the second subpixel SP2, and the dam BNK of the third subpixel SP3 can be configured to be separated from each other. Accordingly, the dam BNK of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3, onto which different types of ED micro-LEDs are applied, can be easily distinguished.

[0089] The dam BNK of the 1-1 subpixel SP1a and the dam BNK of the 1-2 subpixel SP1b can be connected or spaced apart. For example, a dam BNK of the 1-1 subpixel SP1a, in which the same type of light-emitting device ED is arranged, and a dam BNK of the 1-2 subpixel SP1b can be connected, spaced apart, or separated, taking into account a design requirement such as a transfer process requirement, etc. Furthermore, the dam BNK of the 3-1 subpixel SP3a and the dam BNK of the 3-2 subpixel SP3b can be connected or spaced apart.

[0090] Accordingly, the dam BNK of the pair of first subpixels SP1, the dam BNK of the pair of second subpixels SP2 and the dam BNK of the pair of third subpixels SP3 can be configured in various ways, and the embodiments of the present disclosure are not limited thereto.

[0091] For example, the majority of BNK dams can be formed from an organic insulating material. The majority of BNK dams can be configured as a single layer or as a multilayer structure of the organic insulating material. For example, the majority of BNK dams can be formed from a photoresist, polyimide (PL), or an acrylic-based material, but the embodiments of the present disclosure are not limited thereto.

[0092] The first electrode CE1 can be positioned in any of the plurality of subpixels. The first electrode CE1 can be positioned on the dam BNK. For example, the first electrodes CE1 can be positioned on the top and side surfaces of the plurality of dams BNK, without being restricted thereto. For example, the first electrodes CE1 can be positioned on the top surface of the plurality of dams BNK and not on the side surfaces of the plurality of dams BNK, without being restricted thereto.

[0093] For example, at least part of the first electrode CE1 can extend outside the dam BNK and be electrically connected to the signal line TL nearest to the first electrode CE1. For example, part of the first electrode CE1 of the 1-1 subpixel SP1a can extend to one side region of the 1-1 subpixel SP1a and be electrically connected to the first signal line TL1, and part of the first electrode CE1 of the 1-2 subpixel SP1b can extend to the other side region of the 1-2 subpixel SP1b and be electrically connected to the second signal line TL2. The embodiments are not limited thereto.

[0094] For example, the first electrode CE1 cannot extend outside the dam BNK, while the signal line TL nearest to the first electrode CE1 can extend onto the dam BNK to be electrically connected to the first electrode CE1 without being restricted to it. For example, a separate electrode can be configured to extend outside the dam BNK to electrically connect the signal line TL and the first electrode CE1 without being restricted to it.

[0095] A portion of the first electrode CE1 of the 2-1 subpixel SP2a can extend to one side region of the 2-1 subpixel SP2a to be electrically connected to the third signal line TL3, and a portion of the first electrode CE1 of the 2-2 subpixel SP2b can extend to the other side region of the 2-2 subpixel SP2b to be electrically connected to the fourth signal line TL4. A portion of the first electrode CE1 of the 3-1 subpixel SP3a can extend to one side region of the 3-1 subpixel SP3a to be electrically connected to the fifth signal line TL5, and a portion of the first electrode CE1 of the 3-2 subpixel SP3b can extend to the other side region of the 3-2 subpixel SP3b to be electrically connected to the sixth signal line TL6.

[0096] The first electrode CE1 can be electrically connected to the anode electrode 134 of the micro-LED ED and can transmit the anode voltage from the pixel driver circuit PD via the signal line TL to the micro-LED ED of each of the plurality of subpixels. Different voltages can be applied to the respective first electrodes CE1 of the plurality of subpixels according to an image to be displayed. For example, different voltages can be applied to the respective first electrodes CE1 of the plurality of subpixels. Accordingly, the first electrode CE1 can be a pixel electrode, and the embodiments of the present disclosure are not limited to this.

[0097] The first electrode CE1 can be formed from a conductive material. For example, the first electrode CE1 can be formed integrally with a plurality of signal lines TL or separately from the signal lines TL. For example, the first electrode CE1 can be formed from the same conductive material as a plurality of signal lines TL or from a different material, but the embodiments of the present disclosure are not limited thereto. For example, the first electrode CE1 can be formed from a multilayer structure of titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but the embodiments of the present disclosure are not limited thereto. Another example: The first electrode CE1 can be formed from a multilayer structure of a conductive material.For example, a plurality of first electrodes CE1 can be formed from a multilayer structure of titanium (Ti) / aluminium (Al) / titanium (Ti) / indium tin oxide (ITO), but the embodiments of the present disclosure are not limited thereto.

[0098] A light-emitting device ED can be arranged in each of a plurality of subpixels. A plurality of light-emitting devices ED can be a light-emitting diode (LED) or a micro-light-emitting diode (micro-LED), but the embodiments of the present disclosure are not limited thereto. A plurality of light-emitting devices ED can be arranged on the dam BNK and the first electrode CE1. A plurality of light-emitting devices ED can be arranged on the first electrode CE1 and be electrically connected to the first electrode CE1. Accordingly, the light-emitting device ED can emit light by receiving the anode voltage from the pixel driver circuit PD via the signal line TL and the first electrode CE1.

[0099] The plurality of micro-LEDs ED can comprise a first micro-LED 130, a second micro-LED 140, and a third micro-LED 150. The first micro-LED 130 can be positioned in the first subpixel SP1. The second micro-LED 140 can be positioned in the second subpixel SP2. The third micro-LED 150 can be positioned in the third subpixel SP3. For example, one of the first micro-LED 130, the second micro-LED 140, and the third micro-LED 150 can be a red micro-LED, another a green micro-LED, and the remaining one a blue micro-LED, but the embodiments of the present disclosure are not limited thereto. By combining red, green, and blue light emitted by the plurality of micro-LEDs ED, various light colors, including white, can be realized.The types of the majority of micro-LEDs ED are merely examples, and the embodiments of the present disclosure are not limited thereto.

[0100] The first light-emitting device 130 can comprise a 1-1 light-emitting device 130a arranged in the 1-1 subpixel SP1a and a 1-2 light-emitting device 130b arranged in the 1-2 subpixel SP1b. The second light-emitting device 140 can comprise a 2-1 light-emitting device 140a arranged in the 2-1 subpixel SP2a and a 2-2 light-emitting device 140b arranged in the 2-2 subpixel SP2b. The third light-emitting device 150 can comprise a 3-1 light-emitting device 150a arranged in the 3-1 subpixel SP3a and a 3-2 light-emitting device 150b arranged in the 3-2 subpixel SP3b.

[0101] With reference to the Fig. 6, Fig. 7 to Fig. 8. The second electrode CE2 can be positioned in any of the plurality of subpixels. The second electrode CE2 can be positioned on the micro-LED ED. For example, the second electrode CE2 can be electrically connected to the pixel driver circuit PD via the plurality of contact electrodes CCE, without being limited to this.

[0102] For example, the second electrode CE2 can be electrically connected to a cathode electrode 135 of the micro-LED ED and transmit a cathode voltage from the pixel driver circuit PD to the micro-LED ED. The same cathode voltage can be applied to the second electrode CE2 of each of the plurality of subpixels. For example, the same voltage can be applied to the second electrode CE2 of each of the plurality of subpixels and to the cathode electrode 135 of the micro-LED ED. Accordingly, the second electrode CE2 can be a common electrode, but the embodiments of the present disclosure are not limited to this.

[0103] At least some of the majority of subpixels can share the second electrode CE2. At least some of the second electrodes CE2 of the majority of subpixels can be electrically connected to each other. Since the same voltage is applied to the second electrodes CE2, at least some subpixels can share the second electrodes CE2. For example, the second electrodes CE2 of at least some of the majority of pixels PX that are arranged in the same row can be connected to each other. For example, a single second electrode CE2 can be configured for the majority of pixels PX. A second electrode CE2 can be configured for each n subpixel.

[0104] For example, some of the second electrodes CE2 of the majority of subpixels can be spaced apart or separated from each other. For example, the second electrode CE2 connected to the pixels PX in an nth row and the second electrode CE2 connected to the pixels PX in an (n+1)th row can be spaced apart or separated from each other. For example, the majority of second electrodes CE2 can be spaced apart, with the majority of communication lines NL extending in the row direction between them.

[0105] The plurality of second electrodes CE2 can be formed from a transparent conductive material, but the embodiments of the present disclosure are not limited thereto. The plurality of second electrodes CE2 can be formed from a transparent conductive material, allowing the light emitted by the micro-LED ED to be guided upwards through the second electrode CE2. For example, the second electrode CE2 can be formed from a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present disclosure are not limited thereto.

[0106] The plurality of contact electrodes CCE can be arranged on the substrate 110. For example, the plurality of contact electrodes CCE can be spaced apart from the plurality of dams BNK and the plurality of signal lines TL. Each of the plurality of second electrodes CE2 can overlap at least one contact electrode CCE. For example, one second electrode CE2 can overlap the plurality of contact electrodes CCE.

[0107] For example, the majority of contact electrodes CCE can be electrically connected to the majority of second electrodes CE2. The majority of contact electrodes CCE can, for example, be positioned between the substrate 110 and the majority of second electrodes CE2 and transmit the cathode voltage from the pixel driver circuit PD to the second electrodes CE2.

[0108] For example, if a micro-LED is used as a light-emitting device (LED), a plurality of micro-LEDs can be formed on a wafer and transferred to the substrate 110 of the display device 1000 to fabricate the display device 1000. Various defects can occur during the transfer of the plurality of micro-LEDs (LEDs) from a small wafer to the substrate 110. For example, a transfer error may occur in some subpixels where the micro-LED (LED) is not transferred, and a defect may occur in some other subpixels where the micro-LED (LED) is transferred to an incorrect position due to an alignment error. Furthermore, the transferred micro-LED (LED) itself may be defective, even if the transfer process is carried out normally.Therefore, during the transfer process of multiple ED micro-LEDs, taking defects into account, several ED micro-LEDs emitting light of the same color can be transferred to a subpixel. An illumination test can be performed on the multiple ED micro-LEDs, and only one ED micro-LED can be used, which is ultimately found to be normal. The embodiments are not limited to this. For example, at least some or all of the multiple ED micro-LEDs transferred to a subpixel can be used simultaneously or sequentially, without limitation. For example, at least some or all of the multiple ED micro-LEDs transferred to a subpixel can be used simultaneously with the same or different brightness, without limitation.

[0109] For example, a 1-1 micro-LED 130a and a 1-2 micro-LED 130b can be combined onto a pixel PX and their defective states can be checked.

[0110] If both the 1-1 micro-LED 130a and the 1-2 micro-LED 130b are found to be normal, only the 1-1 micro-LED 130a can be used, while the 1-2 micro-LED 130b remains unused. In another example, if, among the 1-1 micro-LED 130a and the 1-2 micro-LED 130b, only the 1-2 micro-LED 130b is found to be normal, the 1-1 micro-LED 130a can remain unused and only the 1-2 micro-LED 130b can be used. Accordingly, even if a plurality of micro-LEDs ED, which emit light of the same color, are applied to a pixel PX, ultimately only one of the micro-LEDs ED can be used.

[0111] Thus, in a pair of micro-LEDs ED, one can be the main (or primary) micro-LED ED, while the other can be a redundant micro-LED ED. The redundant micro-LED ED can be an additional micro-LED ED, provided as a backup in case the main micro-LED ED fails. The redundant micro-LED can be used as a replacement if the main micro-LED ED fails. By transmitting both the main micro-LED ED and the redundant micro-LED ED to a single pixel PX, any degradation in display quality due to defects in either the main micro-LED ED or the redundant micro-LED ED can be minimized.

[0112] For example, the 1-1 light-emitting device 130a, 2-1 light-emitting device 140a and 3-1 light-emitting device 150a transferred to a pixel PX can be used as the main light-emitting device ED, and the 1-2 light-emitting device 130b, the 2-2 light-emitting device 140b and the 3-2 light-emitting device 150b can be used as the redundant light-emitting device ED.

[0113] Fig. Figure 9 is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 10 is an enlarged cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. For example, Fig. 9 a cross-sectional view of the display area AA, the first and second non-display areas NA1 and NA2 and the bending area BA.

[0114] With reference to Fig. 9. A buffer layer 111 can be arranged in the remaining area of ​​the substrate 110, excluding the bending area BA. The buffer layer 111 can comprise a first buffer layer 111a and a second buffer layer 111b. The embodiments are not limited thereto. For example, the buffer layer 111 can comprise a single buffer layer or three or more buffer layers. For example, the buffer layer 111 can be omitted, depending on the design.

[0115] The first buffer layer 111a and the second buffer layer 111b can be positioned in the display area AA, in the first non-display area NA1, and in the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b can reduce the permeation of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b can be formed from an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b can be formed from a single or multiple layers of silicon dioxide (SiOx) or silicon nitride (SiNx), but the embodiments of the present disclosure are not limited thereto.

[0116] With reference to the following described Fig. 12. For example, the first buffer layer 111a and the second buffer layer 111b can be provided as the first stopper layer 111. For example, the first and second buffer layers 111a and 111b, which are provided as the first stopper layer 111, can be arranged in the entire display area AA and in the non-display area NA. The non-display area NA can have a first non-display area NA1, a bending area BA, and a second non-display area NA2. The first and second buffer layers 111a and 111b can be arranged in the first and second non-display areas NA1 and NA2 and not be provided in the bending area BA. And as with respect to Fig. As described in section 12, a first stopper opening can be 111c (see Fig. 12) shall be formed in the first buffer layer and the second buffer layer 111a and 111b, which are arranged in the first non-display area NA1.

[0117] For example, the first stopper layer 111 can be formed from a single layer or from multiple layers of silicon dioxide (SiOx) or silicon nitride (SiNx), which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto. For example, portions of the first buffer layer 111a and the second buffer layer 111b can be removed from the bending region BA. The top surface of the substrate 110, which is located in the bending region BA, can be exposed from the first buffer layer 111a and the second buffer layer 111b. By removing the first buffer layer 111a and the second buffer layer 111b from the bending region BA, cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending can be minimized, the first buffer layer 111a and the second buffer layer 111b being formed from the inorganic insulating material.

[0118] For example, a plurality of alignment keys MK can be arranged between the first buffer layer 111a and the second buffer layer 111b, without being restricted thereto. The plurality of alignment keys MK can be configured to identify the position of the pixel driver circuit PD during the manufacturing process of the display device 1000. For example, the plurality of alignment keys MK can be configured to align the position of the pixel driver circuit PD as it has been transferred to an adhesive layer 112. In another example, the plurality of alignment keys MK can be omitted.

[0119] The adhesive layer 112 can be positioned on the second buffer layer 111b. The adhesive layer 112 can be positioned in the display area AA, in the first non-display area NA1, in the bending area BA, and in the second non-display area NA2. In another example, at least a portion of the adhesive layer 112 can be removed from the non-display area NA, which comprises the bending area BA. For example, the adhesive layer 112 can be formed from any adhesive polymer, epoxy resin, UV-curable resin, a polyimide-based material, an acrylate-based material, a urethane-based material, or polydimethylsiloxane (PDMS), but the embodiments of the present disclosure are not limited thereto.

[0120] In the display area AA, the pixel driver circuit PD can be positioned on the adhesive layer 112. If the pixel driver circuit PD is implemented as a control driver, the control driver can be mounted on the adhesive layer 112 by a transfer process, but the embodiments of the present disclosure are not limited to this.

[0121] A first protective layer 113a and a second protective layer 113b can be positioned on the top or side surfaces of the adhesive layer 112 and the pixel driver circuit PD. The first protective layer 113a and the second protective layer 113b can be positioned to surround the side surface of the pixel driver circuit PD, but the embodiments of the present disclosure are not limited thereto. For example, the second protective layer 113b can be positioned to cover at least a portion of the top surface of the pixel driver circuit PD. For example, at least one of the first protective layer 113a and the second protective layer 113b, which are positioned in the bending region BA, can be omitted, without limitation.

[0122] For example, the first protective layer 113a can be positioned completely over the display area AA and the non-display area NA, and the second protective layer 113b can be positioned partially over the display area AA, the first non-display area NA1, and the second non-display area NA2. For example, part of the second protective layer 113b can be removed in the bending area BA. However, the embodiments of the present disclosure are not limited thereto.

[0123] The first protective layer 113a and the second protective layer 113b can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b can be formed from photoresist, polyimide (Pl), or a photoacrylic-based material, but the embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b can be a coating layer or an insulating layer, but the embodiments of the present disclosure are not limited thereto.

[0124] According to the exemplary embodiments of the present disclosure, a plurality of first connecting lines 121 can be arranged on the second protective layer 113b in the display area AA. The plurality of first connecting lines 121 can be lines for electrically connecting the pixel driver circuit PD to other components. For example, the pixel driver circuit PD can be electrically connected via the plurality of first connecting lines 121 to the plurality of signal lines TL, the plurality of contact electrodes CCE, and the like.

[0125] For example, the plurality of first connecting lines 121 can comprise a 1-1 connecting line 121a, a 1-2 connecting line 121b, a 1-3 connecting line 121c, and a 1-4 connecting line 121d, and the 1-1 connecting line 121a, the 1-2 connecting line 121b, the 1-3 connecting line 121c, and the 1-4 connecting line 121d can be electrically connected to one another via contact holes formed in insulating layers between the connecting lines, but the embodiments of the present disclosure are not limited thereto. For example, the plurality of first connecting lines 121 can comprise two or more connecting lines that are electrically connected to one another via contact holes formed in insulating layers between the connecting lines, without being limited thereto.

[0126] For example, a plurality of 1-1 interconnect lines 121a can be arranged on the second protective layer 113b. A plurality of 1-1 interconnect lines 121a can be electrically connected to the pixel driver circuit PD. A plurality of 1-1 interconnect lines 121a can transmit voltages output by the pixel driver circuit PD to the first electrode CE1 or the second electrode CE2.

[0127] For example, the first and second protective layers 113a and 113b can be formed from an organic insulating material. For example, the first and second protective layers 113a and 113b can be formed from a photoresist, polyimide (Pl), a photoacrylic-based material, or the like, but the embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b can be formed from the same material. Embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b can be insulating layers, but embodiments of the present disclosure are not limited thereto.

[0128] Furthermore, as can be seen from reference to Fig. As described in Figure 12, the second stopper layer 114 can be arranged on the second protective layer 113b. For example, the second stopper layer 114 can be arranged in the entire display area AA and in the non-display area NA. Furthermore, as described in Figure 12, the second stopper layer 114 can be arranged on the second protective layer 113b. For example, the second stopper layer 114 can be arranged in the entire display area AA and in the non-display area NA. In addition, as described in Figure 12, the second stopper layer 114 can be arranged on the second protective layer 113b. Fig. 12 described, a second stopper opening 114a of Fig. 12 in the second stopper layer 114, which is arranged in the first non-display area NA1. For example, the second stopper layer 114 can be formed from a single layer or from multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto.

[0129] A first organic insulating layer 115a can be arranged on the second stopper layer 114. The first organic insulating layer 115a can be formed from an organic insulating material, but embodiments of the present disclosure are not limited thereto. For example, the first organic insulating layer 115a can be formed from a photoresist, polyimide (Pl), a photoacrylic-based material, or the like, but embodiments of the present disclosure are not limited thereto.

[0130] Additionally, a plurality of 1-2 interconnection lines 121b can be arranged on the first organic insulating layer 115a. A plurality of 1-2 interconnection lines 121b can be connected to the pixel driver circuit PD or directly connected to it. For example, some of the 1-2 interconnection lines 121b can be directly connected to the pixel driver circuit PD via a contact hole in the second stopper layer 114. Another portion of the 1-2 interconnection lines 121b can be electrically connected to the 1-1 interconnection line 121a via a contact hole in the first stopper layer 114. However, the embodiments of the present disclosure are not limited thereto. The voltage output by the pixel driver circuit PD can be transmitted to the first electrode CE1 or the second electrode CE2 via interconnection lines other than the plurality of 1-2 interconnection lines 121b.

[0131] The second organic insulating layer 115b can be positioned on the plurality of 1-2 connecting lines 121b. The second organic insulating layer 115b can be positioned completely over the display area AA and the non-display area NA, but the embodiments of the present disclosure are not limited thereto. The second organic insulating layer 115b can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto. For example, the first organic insulating layer 115a can be formed from photoresist, polyimide (Pl), or a photoacrylic-based material, but the embodiments of the present disclosure are not limited thereto.

[0132] The majority of 1-3 connecting lines 121c can be positioned on the second organic insulating layer 115b. The majority of 1-3 connecting lines 121c can be electrically connected to the majority of 1-2 connecting lines 121b. For example, the 1-3 connecting line 121c can be electrically connected to the 1-2 connecting line 121b via a contact hole in the second organic insulating layer 115b.

[0133] A third organic insulating layer 115c can be positioned on the plurality of 1-3 connecting leads 121c. The third organic insulating layer 115c can be positioned in an area that excludes the bending region BA, but the embodiments of the present disclosure are not limited thereto. The third organic insulating layer 115c can be arranged in the display region AA, in the first non-display region NA1, and in the second non-display region NA2, but the embodiments of the present disclosure are not limited thereto. For example, a portion of the third organic insulating layer 115c that is arranged in the bending region BA can be removed. The third organic insulating layer 115c can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto.For example, the third organic insulating layer 115b can be formed from photoresist, polyimide (Pl) or a photoacrylic-based material, but the embodiments of the present disclosure are not limited thereto.

[0134] The majority of the first to fourth connecting lines 121d can be positioned on the third organic insulating layer 115c. The majority of the first to fourth connecting lines 121d can be electrically connected to the majority of the first to third connecting lines 121c. For example, the first to fourth connecting lines 121d can be electrically connected to the first to third connecting line 121c via a contact hole in the third insulating layer 115c.

[0135] A fourth organic insulating layer 115d can be arranged on a plurality of first to fourth connecting lines 121d. The fourth organic insulating layer 115d can be arranged in the remaining area, excluding the bending area BA, but embodiments of the present disclosure are not limited thereto. The fourth organic insulating layer 115d can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2, but embodiments of the present disclosure are not limited thereto.

[0136] According to the exemplary embodiments of the present disclosure, a plurality of second connecting lines 122 can be positioned on the second protective layer 113b in the non-display area NA. The plurality of second connecting lines 122 can have conductors for transmitting a signal which is received from the flexible circuit board (or flexible film) CB and the printed circuit board 160 (see Fig. 1) was transmitted to the pad part PAD, to the pixel driver circuit PD of the display area AA. For example, the majority of second connecting lines 122 can be electrically connected to the majority of pad electrodes PE to receive a signal from the flexible circuit board (or flexible film) CB and the printed circuit board 160.

[0137] For example, the plurality of second connecting lines 122 can extend from the pad part PAD to the display area AA to transmit a signal to the display area AA line. In this case, the plurality of second connecting lines 122 can function as connecting lines LL. The plurality of second connecting lines 122 can comprise a 2-1 connecting line 122a, a 2-2 connecting line 122b, a 2-3 connecting line 122c, and a 2-4 connecting line 122d. The embodiments are not limited thereto. For example, the plurality of second connecting lines 122 can comprise two or more connecting lines. For example, the number of the plurality of second connecting lines 122 can be the same as or different from the number of the plurality of first connecting lines 121.For example, the majority of second connecting lines 122 can be arranged on the same level as the majority of first connecting lines 121, without being limited to doing so.

[0138] A plurality of 2-in-1 interconnects 122a can be arranged on the second protective layer 113b. A plurality of 2-in-1 interconnects 122a can extend from the second non-display area NA2 to the bending area BA and to the first non-display area NA1. A plurality of 2-in-1 interconnects 122a can transmit signals from the flexible circuit board (or flexible film) CB and the printed circuit board to the pad part PAD to the pixel driver circuit PD of the display area AA.

[0139] A plurality of 2-2 interconnects 122b can be arranged on the second stopper layer 114 and the first organic insulating layer 115a. A plurality of 2-2 interconnects 122b can be arranged in the second non-display area NA2. The 2-2 interconnect 122b can be electrically connected to the 2-1 interconnect 122a via a contact hole in the first stopper layer 114. Accordingly, the signal from the flexible printed circuit board (or flexible film) CB and the printed circuit board can be transmitted to the 2-1 interconnect 122a via the 2-2 interconnect 122b.

[0140] A 2-3 interconnect 122c can be arranged on the second organic insulating layer 115b. The 2-3 interconnect 122c can be arranged in the second non-display area NA2. The 2-3 interconnect 122c can be electrically connected to the 2-2 interconnect 122b via a contact hole in the second organic insulating layer 115b. Accordingly, the signal from the flexible circuit board (or flexible film) CB and the printed circuit board can be transmitted to the 2-1 interconnect 122a via the 2-3 interconnect 122c and the 2-2 interconnect 122b.

[0141] A third organic insulating layer 115c can be arranged on the second organic insulating layer 115b and the 2-3 interconnect 122c. A 2-4 interconnect 122d can also be arranged on the third organic insulating layer 115c. The 2-4 interconnect 122d can be located in the second non-display area NA2. The 2-4 interconnect 122d can be electrically connected to the 2-3 interconnect 122c via a contact hole in the third organic insulating layer 115c. Therefore, the signal from the flexible film FF and the printed circuit board can be transmitted to the 2-1 interconnect 122a via the 2-4 interconnect 122d, the 2-3 interconnect 122c, and the 2-2 interconnect 122b.

[0142] The majority of first connecting lines 121 and the majority of second connecting lines 122 can be formed from a highly flexible conductive material or any conductive material used in the display area AA.

[0143] For example, the second connecting line 122, part of which is arranged in the bending region BA, can be made of a conductive material with excellent ductility, such as gold (Au), silver (Ag), or aluminum (Al), but embodiments of the present disclosure are not limited thereto. For example, the plurality of first connecting lines 121 and the plurality of second connecting lines 122 can be made of the same material or of different materials. For example, the plurality of 2-1 connecting lines 122a can be made of a material that is identical to or different from that of the 1-1 connecting lines 121a. For example, the plurality of 2-1 connecting lines 122a can be made of a material that is identical to or different from that of the other plurality of second connecting lines 122, without being limited thereto.

[0144] As another example, the majority of first connecting lines 121 and the majority of second connecting lines 122 can be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg) or other alloys thereof, but the embodiments of the present disclosure are not limited thereto.

[0145] The fourth organic insulating layer 115d can be positioned on the majority of first connecting lines 121 and the majority of second connecting lines 122. The fourth organic insulating layer 115d can be positioned in an area that excludes the bending region BA, but the embodiments of the present disclosure are not limited thereto. The fourth organic insulating layer 115d can be positioned in the display region AA, in the first non-display region NA1, and in the second non-display region NA2. A portion of the fourth organic insulating layer 115d in the bending region BA can be removed. The fourth organic insulating layer 115d can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto.For example, the fourth organic insulating layer 115d can be formed from photoresist, polyimide (Pl) or a photoacrylic-based material, but the embodiments of the present disclosure are not limited thereto.

[0146] In the AA display area, the majority of BNK dams can be positioned on the fourth organic insulating layer 115d. Each majority of BNK dams can overlap the majority of subpixels. One or more ED micro-LEDs emitting light of the same color can be positioned above each of the majority of BNK dams.

[0147] A plurality of signal lines TL can be arranged on the fourth organic insulating layer 115d in the display area AA. A plurality of signal lines TL can be arranged in an area between a plurality of dams BNK. For example, a plurality of signal lines TL can be arranged adjacent to any plurality of dams BNK.

[0148] The majority of contact electrodes CCE can be positioned on the third insulating layer 115c or the fourth organic insulating layer 115d in the display area AA. The majority of contact electrodes CCE can transmit the cathode voltage from the pixel driver circuit PD to the second electrode CE2.

[0149] The first electrode CE1 can be positioned on the dam BNK. For example, the first electrode CE1 can extend from an adjacent signal line TL to the top of the dam BNK. The first electrode CE1 can be positioned on the top and sides of the dam BNK. For example, the first electrode CE1 can extend from the signal line TL on the top of the fourth organic insulating layer 115d to the side of the dam BNK and to the top of the dam BNK.

[0150] With reference to the Fig. 9 and Fig. 10. The first electrode CE1 can be formed from a plurality of conductive layers, without being limited to this.

[0151] For example, the first electrode CE1 may have a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d, but the embodiments of the present disclosure are not limited thereto. For example, the first electrode CE1 may be formed from one conductive layer or from two or more conductive layers.

[0152] The first conductive layer CE1a can be positioned on the dam BNK. The second conductive layer CE1b can be positioned on the first conductive layer CE1a. The third conductive layer CE1c can be positioned on the second conductive layer CE1b. The fourth conductive layer CE1d can be positioned on the third conductive layer CE1c. For example, each of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d can be formed from titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide (ITO), but the embodiments of the present disclosure are not limited thereto. For example, the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d can be formed from the same material or from different materials.

[0153] According to the exemplary embodiments of the present disclosure, among the plurality of conductive layers forming the first electrode CE1, some conductive layers with high reflection efficiency can be configured as an alignment key and / or reflective plate for aligning the micro-LED ED.

[0154] For example, to configure the second conductive layer CE1b as a reflective plate, the third conductive layer CE1c and the fourth conductive layer CE1d, which cover the second conductive layer CE1b, can be partially removed or etched. For example, portions of the third conductive layer CE1c and the fourth conductive layer CE1d, which are positioned on the dam BNK, can be removed or etched to expose the top surface of the second conductive layer CE1b. For example, a central section containing the solder pattern SDP and a boundary (or edge) region can be left in the third conductive layer CE1c and the fourth conductive layer CE1d, while the remaining sections can be removed. For example, the boundary (or edge) region of the third conductive layer CE1c made of titanium (Ti) and the fourth conductive layer CE1d made of indium tin oxide (ITO) can be left unetched.Accordingly, it is possible to prevent another conductive layer of the first electrode CE1 from being corroded by a tetramethylammonium hydroxide (TMAH) solution used in the masking process of the first electrode CE1. The embodiments are not limited to this. For example, one or more of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d can be configured as a reflective plate. For example, the conductive layer configured as a reflective plate can be exposed by the upper conductive layers, but is not limited to this.

[0155] According to the exemplary embodiments of this disclosure, the first conductive layer CE1a and the third conductive layer CE1c can be formed from titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b can be formed from aluminum (Al). The fourth conductive layer CE1d can contain a transparent conductive oxide layer, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which exhibits good adhesion to the solder pattern SDP and demonstrates corrosion and acid resistance. However, the embodiments of this disclosure are not limited thereto.

[0156] The first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c and the fourth conductive layer CE1d can be applied successively and then structured by a photolithography process and an etching process, but the embodiments of the present disclosure are not limited thereto.

[0157] According to the exemplary embodiments of the present disclosure, the signal line TL, the contact electrode CCE, and the pad electrode PE, which are arranged in the same layer as the first electrode CE1, can be formed from multiple layers of a conductive material, but the embodiments of the present disclosure are not limited thereto. For example, the signal line TL, the contact electrode CCE, and the pad electrode PE can be formed from a multiple layer of indium tin oxide (ITO) / titanium (Ti) / aluminium (Al) / titanium (Ti), but the embodiments of the present disclosure are not limited thereto.

[0158] According to the exemplary embodiments of the present disclosure, the solder pattern SDP can be positioned on the first electrode CE1 in any of the plurality of subpixels. The solder pattern SDP can connect the micro-LED ED to the first electrode CE1 to electrically connect the first electrode CE1 to the micro-LED ED. For example, the first electrode CE1 and the anode electrode 134 of the micro-LED ED can be electrically connected by eutectic bonding using the solder pattern SDP, but the embodiments of the present disclosure are not limited thereto. For example, if the solder pattern SDP is formed from indium (In) and the anode electrode 134 of the micro-LED ED is formed from gold (Au), the solder pattern SDP and the anode electrode 134 can be joined by applying heat and pressure during the transfer process of the micro-LED ED.Eutectic bonding allows the micro-LED ED to be connected to the solder pattern SDP and the first electrode CE1 without a separate adhesive. For example, the solder pattern SDP can be made of indium (In), tin (Sn), or an alloy thereof, but the embodiments described in this disclosure are not limited to these. For example, the solder pattern SDP can be a bonding pad or a connection pad, but the embodiments described in this disclosure are not limited to these.

[0159] Additionally, with reference to Fig. 9 a third stopper layer 116 is arranged on the fourth organic insulating layer 115d, which has the first electrode CE1 and a dam BNK. For example, the third stopper layer 116 can be arranged in the entire display area AA and in the non-display area NA. As with reference to Fig. As described in section 12, a first stopper opening 116a (see Fig. 12) be formed in the third stopper layer 116, which is located in the first non-display area NA1. For example, the third stopper layer 116 can consist of a single or multiple layers of silicon oxide (SiO₂). x ) or silicon nitride (SiN x ), which are inorganic film materials, but the embodiments of the present disclosure are not limited to them.

[0160] According to the exemplary embodiments of the present disclosure, the third stopper layer 116, which serves as a passivation layer, can be arranged on a plurality of signal lines TL, a plurality of first electrodes CE1, a plurality of contact electrodes CCE and a third organic insulating layer 115c.

[0161] For example, the third stopper layer 116 can be positioned in the display area AA, in the first non-display area NA1, and in the second non-display area NA2. A portion of the third stopper layer 116, which is positioned in the bending area BA, can be removed. In the second non-display area NA2, a portion of the passivation layer 116, which covers the majority of pad electrodes PE, can be removed. Since the third stopper layer 116 is positioned to cover the remaining areas except for the bending area BA and the areas where the majority of pad electrodes PE and the solder pattern SDP are located, the ingress of moisture or contaminants into the micro-LED ED can be reduced. For example, the third stopper layer 116 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN x) may be formed, but the embodiments of the present disclosure are not limited thereto.

[0162] In each of the multiple subpixels, the micro-LED ED can be positioned on the solder pattern SDP. The first micro-LED 130 can be positioned in the first subpixel SP1. The second micro-LED 140 can be positioned in the second subpixel SP2. The third micro-LED 150 can be positioned in the third subpixel SP3.

[0163] The micro-LED-ED can be formed on a silicon wafer using processes such as metal-organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor epitaxy (HVPE) or sputtering, but the embodiments of the present disclosure are not limited thereto.

[0164] With reference to the Fig. 9 and Fig. 10 The first micro-LED 130 may comprise: the anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, the cathode electrode 135, and an encapsulation film 136, but the embodiments of the present disclosure are not limited thereto. For example, the first micro-LED 130 may not include the encapsulation film 136.

[0165] A first semiconductor layer 131 can be arranged on the solder pattern SDP. The second semiconductor layer 133 can be arranged on the first semiconductor layer 131.

[0166] For example, the first semiconductor layer 131 and the second semiconductor layer 133 can be designed as compound semiconductors of group III-V or group II-VI and can be doped with an impurity (or dopant), without being limited thereto. For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 can be a semiconductor layer doped with an n-type impurity, while the other can be a semiconductor layer doped with a p-type impurity, but the embodiments of the present disclosure are not limited thereto.For example, at least one of the first semiconductor layer 131 and the second semiconductor layer 133 can be a layer in which an n-type or p-type impurity is doped into a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGalnP), indium aluminum phosphide (InAIP), aluminum gallium nitride (AIGaN), aluminum inide nitride (AllnN), aluminum indium gallium nitride (AIInGaN), aluminum gallium arsenide (AIGaAs) or gallium arsenide (GaAs), but the embodiments of the present disclosure are not limited thereto.

[0167] The active layer 132 can be positioned between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 can emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 can be configured as a single-pot structure, multiple-pot structure, single quantum-pot structure, multiple quantum-pot (MQW) structure, quantum dot structure, or quantum line structure, although the embodiments described in this disclosure are not limited to these. For example, the active layer 132 can be made of indium gallium nitride (InGaN) or gallium nitride (GaN), but the embodiments described in this disclosure are not limited to these.

[0168] In another example, the active layer 132 can have a pot layer and a multiple quantum well (MQW) structure with a barrier layer whose band gap is higher than that of the pot layer. For example, the active layer 132 can have InGaN as the pot layer and an AlGaN layer as the barrier layer, but the embodiments of the present disclosure are not limited thereto.

[0169] The anode electrode 134 can be arranged between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 can electrically connect the first semiconductor layer 131 to the first electrode CE1. The anode voltage output by the pixel driver circuit PD can be applied to the first semiconductor layer 131 via the signal line TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 can be made of a conductive material that can form a eutectic connection with the solder pattern SDP. For example, the anode electrode 134 can be made of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu), or an alloy thereof, but the embodiments of the present disclosure are not limited thereto.

[0170] The cathode electrode 135 can be positioned on the second semiconductor layer 133. For example, the cathode electrode 135 can electrically connect the second semiconductor layer 133 to the second electrode CE2. The cathode voltage output by the pixel driver circuit PD can be applied to the second semiconductor layer 133 via the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 can be formed from a transparent conductive material so that the light emitted by the micro-LED ED can be directed onto a top surface of the micro-LED ED, but the embodiments of the present disclosure are not limited thereto. For example, the cathode electrode 135 can be formed from a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present disclosure are not limited thereto.

[0171] The encapsulation film 136 can be positioned on at least parts of each of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 can surround at least parts of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0172] For example, the encapsulation film 136 can be arranged on at least one section of each of the anode electrode 134 and the cathode electrode 135, for example, on the edge region (or peripheral region or side) of the anode electrode 134 and the edge region (or peripheral region or side) of the cathode electrode 135. At least a portion of the anode electrode 134 can protrude from the encapsulation film 136 to connect the anode electrode 134 and the solder pattern SDP. For example, at least a portion of the cathode electrode 135 can protrude from the encapsulation film 136 to connect the cathode electrode 135 and the second electrode CE2. For example, the encapsulation film 136 can be made of an insulating material such as silicon nitride (SiN₂). x ) or silicon dioxide (SiO₂) x ) may be formed, but the embodiments of the present disclosure are not limited thereto.

[0173] As another example, the encapsulation film 136 can have a structure in which a reflective material is dispersed in a resin layer, but the embodiments of the present disclosure are not limited thereto. For example, the encapsulation film 136 can be manufactured as a reflector with various structures, but the embodiments of the present disclosure are not limited thereto. The light emitted by the active layer 132 through the encapsulation film 136 can be reflected upwards to improve the light yield. For example, the encapsulation film 136 can be a reflective layer, but embodiments of the present disclosure are not limited thereto.

[0174] Although the light-emitting device ED has been described as a vertical-type structure according to the exemplary embodiments of this disclosure, embodiments of this disclosure are not limited thereto. For example, the light-emitting device ED may have a lateral STA structure or a flip-chip STA structure.

[0175] Although the first light-emitting device 130 with reference to Fig. As described in section 10, the second light-emitting device 140 and the third light-emitting device 150 can have essentially the same structure as the first light-emitting device 130. For example, the second light-emitting device 140 and the third light-emitting device 150 can have essentially the same first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and encapsulation film 136.

[0176] According to the exemplary embodiments of the present disclosure, a first optical layer 117a can be positioned on the third stopper layer 116 to surround the plurality of micro-LEDs ED in the display area AA. For example, the first optical layer 117a can be positioned to cover the plurality of micro-LEDs ED and the dam BNK in regions of the plurality of subpixels. For example, the first optical layer 117a can cover the dam BNK, part of the passivation layer 116, and the spaces between the plurality of micro-LEDs ED. The first optical layer 117a can be positioned between, or cover, the plurality of dams BNK and between the plurality of micro-LEDs ED contained in a pixel PX. For example, the first optical layer 117a can extend in a first direction X and be separated in a second direction Y.For example, the first optical layer 117a can be positioned between the passivation layer 116 and the second electrode CE2 to surround the side regions of the micro-LED ED and the dam BNK, but the embodiments of the present disclosure are not limited thereto. For example, the first optical layer 117a can be a diffusion layer, a sidewall diffusion layer, or the like, but the embodiments of the present disclosure are not limited thereto.

[0177] The first optical layer 117a can be formed from an organic insulating material in which fine particles are dispersed, but the embodiments of the present disclosure are not limited thereto. For example, the first optical layer 117a can be formed from siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but the embodiments of the present disclosure are not limited thereto. The light from the plurality of micro-LEDs ED can be scattered by the fine particles dispersed in the first optical layer 117a and emitted outwards from the display device 1000. Accordingly, the first optical layer 117a can improve the light emission efficiency of the light emitted by the plurality of micro-LEDs ED.

[0178] For example, the first optical layer 117a can be positioned in each of the plurality of pixels PX or jointly positioned in some of the pixels PX arranged in the same row, but the embodiments of the present disclosure are not limited thereto. For example, the first optical layer 117a can be positioned in each of the plurality of pixels PX, or a single first optical layer 117a can be shared by the plurality of pixels PX. In another example, each of the plurality of subpixels can separately have the first optical layer 117a, but the embodiments of the present disclosure are not limited thereto.

[0179] According to the exemplary embodiments of the present disclosure, the second optical layer 117b can be arranged on the third stopper layer 116 in the display area AA. For example, the second optical layer 117b can be arranged to surround the first optical layer 117a. For example, the second optical layer 117b can be in contact with the side face of the first optical layer 117a. For example, the second optical layer 117b can be arranged in a region between a plurality of pixels PX. However, the embodiments of the present disclosure are not limited thereto; for example, the second optical layer 117b can be configured as a diffusion layer, a diffusion layer window, a window diffusion layer, or the like.

[0180] The second optical layer 117b can be formed from an organic insulating material, but embodiments of the present disclosure are not limited to this. The second optical layer 117b can be formed from the same material as the first optical layer 117a, but embodiments of the present disclosure are not limited to this. For example, the first optical layer 117a can contain fine particles, while the second optical layer 117b does not contain fine particles. For example, the second optical layer 117b can be formed from siloxane, but embodiments of the present disclosure are not limited to this.

[0181] For example, the thickness of the first optical layer 117a may be less than that of the second optical layer 117b, but embodiments of the present disclosure are not limited to this. Accordingly, the area in which the first optical layer 117a is arranged may, in a top view, have a concave section that is recessed inwards from the top surface of the second optical layer 117b.

[0182] According to the exemplary embodiments of the present disclosure, the second electrode CE2 can be arranged on the first optical layer 117a and the second optical layer 117b. For example, the second electrode CE2 can be electrically connected to a plurality of contact electrodes CCE via a contact hole of the second optical layer 117b. For example, the second electrode CE2 can be arranged on a plurality of light-emitting devices ED. For example, the second electrode CE2 can have a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto. For example, the second electrode CE2 can be arranged to be in contact with the cathode electrode 135. For example, the second electrode CE2 can overlap the first optical layer 117a.For example, the outer surface of the first optical layer 117a can be covered. The second electrode CE2 can extend continuously in the first direction X of the substrate 110.

[0183] Accordingly, the second electrode CE2 can be connected to a plurality of pixels PX arranged in the first direction X. For example, the second electrode CE2 can be connected to a plurality of pixels PX.

[0184] According to the exemplary embodiments of the present disclosure, the second electrode CE2 can extend continuously across the first optical layer 117a, the second optical layer 117b, and the light-emitting device ED. The area in which the first optical layer 117a is arranged can have a concave section that is recessed inwards from the top surface of the second optical layer 117b. Since the first section of the second electrode CE2, which is arranged on the first optical layer 117a, is positioned along the concave section, the first section can be located at a lower position than the second section of the second electrode CE2, which is arranged on the second optical layer 117b.

[0185] Furthermore, the fourth stopper layer 118 can be arranged on the second electrode CE2 and the first optical layer 117a. For example, the fourth stopper layer 118 can be arranged in the entire display area AA and in the non-display area NA. As referred to Fig. As described in section 12, the fourth stopper opening 118a can be used by Fig. 12 in the fourth stopper layer 118, which is arranged in the first non-display area NA1. For example, the fourth stopper layer 118 can be formed from a single layer or from multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto.

[0186] The third optical layer 117c can be arranged to overlap a plurality of light-emitting devices ED and the first optical layer 117a. Since the third optical layer 117c is arranged on the second electrode CE2 and a plurality of light-emitting devices ED, discoloration (mura) that may occur in some of the plurality of light-emitting devices ED can be improved. For example, when a plurality of light-emitting devices ED are transferred to the substrate 110 of the display device 1000, an area may occur where the spacing between the plurality of light-emitting devices ED is not uniform due to process variations or the like.If the distance between the majority of light-emitting devices ED is uneven, the light-emitting area of ​​each of the majority of light-emitting devices ED may be unevenly arranged, and thus a spot (mura) may be visually perceived by the user.

[0187] Since the third optical layer 117c is configured to scatter the light evenly onto the majority of light-emitting devices ED, the light emitted by some light-emitting devices ED can be reduced so that it is no longer visually perceived as a spot.

[0188] Since the light emitted by the majority of light-emitting devices ED is uniformly scattered by the third optical layer 117c and extracted outwards from the display device 1000, the brightness uniformity of the display device 1000 can be improved.

[0189] The third optical layer 117c can be formed from an organic insulating material in which fine particles are dispersed, but embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c can be formed from siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c can be formed from the same material as the first optical layer 117a, but embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c can be a diffusion layer, an upper diffusion layer, or the like, but embodiments of the present disclosure are not limited thereto.

[0190] According to the exemplary embodiments of the present disclosure, light from a plurality of light-emitting devices ED can be scattered by fine particles dispersed in the third optical layer 117c and emitted outwards from the display device 1000. The third optical layer 117c can uniformly mix the light emitted by the plurality of light-emitting devices ED to further improve the uniformity of the luminance of the display device 1000. In addition, the efficiency of the light extraction of the display device 1000 can be improved by the light scattered by the plurality of fine particles, so that the display device 1000 can be operated at low power.

[0191] In the display area AA, a black matrix BM can be positioned on the second electrode CE2, the first optical layer 117a, the second optical layer 117b, the third optical layer 117c, and the fourth stopper layer 118. For example, the black matrix BM can fill a contact hole of the second optical layer 117b. Because the black matrix BM is configured to completely cover the display area AA, color mixing and reflection of external light from multiple subpixels can be reduced. For example, because the black matrix BM is located within a contact hole where the second electrode CE2 is connected to the contact electrode CCE, light leakage between multiple adjacent subpixels can be prevented.

[0192] For example, the black matrix BM can be formed from an opaque material, but the embodiments of the present disclosure are not limited thereto. For example, the black matrix BM can be an organic insulating material to which a black pigment or a black dye has been added, but the embodiments of the present disclosure are not limited thereto.

[0193] In the AA display area, a top layer 119 can be applied according to Fig. 12 are arranged on the black matrix BM. The cover layer 119 can protect an element under the fourth stopper layer 118. For example, the cover layer 119 can be formed from an organic insulating material, but embodiments of the present disclosure are not limited thereto. For example, the cover layer 119 can be formed from a photoresist, polyimide (Pl), a photoacrylic-based material, or the like, but embodiments of the present disclosure are not limited thereto. For example, the cover layer 119 can be a coating layer, an insulating layer, or the like, but embodiments of the present disclosure are not limited thereto.

[0194] As in Fig. As shown in Figure 1, the polarizing layer 293 can be arranged over the first adhesive layer 291 on the cover layer 119. The covering element 120 can be arranged over the second adhesive layer 295 on the polarizing layer 293. For example, the first adhesive layer 291 and the second adhesive layer 295 can comprise an optically transparent adhesive (OCA), an optically transparent resin (OCR), a pressure-sensitive adhesive (PSA), or the like, but embodiments of the present disclosure are not limited thereto.

[0195] According to the exemplary embodiments of the present disclosure, a plurality of pad electrodes PE can be arranged on the fourth organic insulating layer 115d in the second non-indicating area NA2. For example, at least parts of a plurality of pad electrodes PE can protrude from the passivation layer 116. For example, a plurality of pad electrodes PE can be electrically connected to the 2-4th connecting line 122d via a contact hole in the fourth organic insulating layer 115d.

[0196] An adhesive layer ACF can be arranged on a plurality of pad electrodes PE. The adhesive layer ACF can be an adhesive layer in which conductive spheres are dispersed in an insulating material, but embodiments of the present disclosure are not limited to this. When heat or pressure is applied to the adhesive layer ACF, the conductive spheres can be electrically connected to an area on which heat or pressure is applied to achieve conductive properties. An adhesive layer ACF can be arranged between a plurality of pad electrodes PE and a flexible printed circuit board (or flexible film) CB to attach or connect the flexible printed circuit board (or flexible film) CB and the plurality of pad electrodes PE. For example, the adhesive layer ACF can be an anisotropic conductive film (ACF), but embodiments of the present disclosure are not limited to this.

[0197] A flexible printed circuit board (or flexible film) CB can be arranged on the adhesive layer ACF. The flexible printed circuit board (or flexible film) CB can be electrically connected to a plurality of pad electrodes PE via the adhesive layer ACF. Thus, the signals output by the flexible printed circuit board (or flexible film) CB and the printed circuit board can be transmitted to the pixel driver circuit PD of the display area AA via a plurality of contact pad electrodes PE, a 2-4 interconnect 122d, a 2-3 interconnect 122c, a 2-2 interconnect 122b, and a 2-1 interconnect 122a.

[0198] Fig. Figure 11 is an enlarged top view of section A of Fig. 3 of a display device according to an exemplary embodiment of the present disclosure. Fig. Figure 12 is a cross-sectional view of the display device according to an exemplary embodiment of the present disclosure. Fig. Figure 13 is an enlarged cross-sectional view of section B in Fig. 12.

[0199] With reference to the Fig. 11, Fig. 12 to Fig. 13. According to an exemplary embodiment of the present disclosure, the display device may have a display area AA and a non-display area NA surrounding or near the display area AA.

[0200] The non-display area NA can have a first non-display area NA1, a bending area BA, and a second non-display area NA2. For example, the display area AA can, depending on the design of a display device (1000 in Fig. 12) be configured in various shapes. For example, the display area AA may be configured in a rectangular shape, the four corners of which are rounded, but the embodiments of the present disclosure are not limited thereto. In another example, the display area AA may be configured in a rectangular shape, the four corners of which are right-angled, circular, or the like, but the embodiments of the present disclosure are not limited thereto.

[0201] The first non-display area NA1 can have a shape that surrounds the display area AA. The bending area BA can be configured within a non-display area NA that extends from the display area AA. Furthermore, the second non-display area NA2 can include a non-display area that extends from the bending area BA and surrounds the area where a pad part PAD is located. However, the present disclosure is not limited to this.

[0202] Furthermore, a separation line TRL can be configured in the first non-display area NA1, which surrounds the display area AA, and the second non-display area NA2, which surrounds the bending area BA and the pad section PAD. Additionally, a separation edge line TML can be configured inside and outside the separation line TRL to ensure a separation edge for the separation line TRL during laser cutting. A separation edge line defined outside the separation line TRL (TML2 in Fig. 14) can be removed during laser cutting. The cutting can be laser cutting, but the embodiments of the present disclosure are not limited to this.

[0203] With reference to Fig. 11. A closed-loop crack stop ST, which surrounds the display area AA in a top view, can be located in an area between the separation boundary line TML of the first non-display area NA1 and the dummy light-emitting elements. Furthermore, the crack stop ST can be configured in an area between the majority of dummy light-emitting elements located in the first non-display area NA1 and the separation boundary line TML.

[0204] The crack stopper ST1 can be formed on multiple inorganic layers located in the display area AA and the first non-display area NA1. The crack stopper ST can be configured on multiple inorganic layers in the first non-display area NA1 by forming a closed-loop shape in a top view. For example, an open-loop crack stopper ST can mean that the inorganic layers of the multiple inorganic layers are separated from each other by the crack stopper ST. The possibility of cracks that occur on one side, for example, in a section of the inorganic layer near the separation boundary line TML, propagating to the other side, for example, a section of the inorganic layer in the display area AA, can be prevented in advance by the open-loop crack stopper ST formed in each inorganic layer.

[0205] Accordingly, cracks occurring in the inorganic layer within the separation boundary line TML can be reduced in advance by the opening, i.e., the crack stopper ST, or prevented from propagating to the display area AA.

[0206] With reference to the Fig. 12 and Fig. 13. A plurality of stopper layers 111, 114, 116, and 118 can be arranged in the display area AA and in the first non-display area NA1. The first to fourth stopper openings 111c, 114a, 116a, and 118a, which serve as crack stoppers, can each be arranged in the plurality of stopper layers (111, 114, 116, and 118 in Fig. 12) be formed, which are located in the first non-display area NA1. Furthermore, the first to fourth stopper openings 111c, 114a, 116a and 118a may not be formed in the plurality of stopper layers 111, 114, 116 and 118, which are provided in the second non-display area NA2 with the bending area BA and the pad part PAD. However, the present disclosure is not limited thereto. The first stopper 111 may have a stacked structure of a first and a second buffer layer 111a and 111b. However, the present disclosure is not limited thereto.

[0207] The first to fourth stopper openings 111c, 114a, 116a, and 118a can prevent cracks occurring in the first non-display area NA1 from propagating to the display area AA during laser cutting. The first to fourth stopper openings 111c, 114a, 116a, and 118a, which are correspondingly formed in the first to fourth stopper layers 111, 114, 116, and 118, can be configured in an open shape in which layers below the stopper openings are exposed, but the present disclosure is not limited to this.

[0208] The first to fourth stopper openings 111c, 114a, 116a and 118a can be formed in a closed-loop shape that surrounds the display area AA in the first non-display area NA1, as in Fig. 3 shown in a top view.

[0209] The closed-loop shape can, however, be configured in various forms, such as a linear shape, a zigzag shape, and the like, when viewed from a top view. The present disclosure is not necessarily limited to this, however. For example, each of the first to fourth stopper layers 111, 114, 116, and 118 can have a shape that is independently spaced or separated from one another, based on each of the first to fourth stopper openings 111c, 114a, 116a, and 118a.

[0210] Since each of the first to fourth stopper layers 111, 114, 116, and 118 is independently spaced or separated by the first to fourth stopper openings 111c, 114a, 116a, and 118a, cracks, even if they occur in the first non-display area NA1 of the first to fourth stopper layers 111, 114, 116, and 118, may not propagate to the display area AA. If each of the first to fourth stopper openings 111c, 114a, 116a, and 118a is not integrally formed in the closed-loop shape in the first non-display area NA1, but only in a sub-region of the first non-display area NA1, cracks that occur during laser cutting can propagate to the display area AA through a portion of the stopper layer where the stopper opening is not formed.

[0211] The first to fourth stopper openings 111c, 114a, 116a and 118a can be formed within the separating edge line TML in the first non-display area NA1, for example in the first non-display area NA1 which faces the display area AA.

[0212] For example, the first buffer layer 111a and the second buffer layer 111b can be configured as the first stopper layer 111. For example, the first and second buffer layers 111a and 111b, which are designated as the first stopper layer 111, can be located entirely in the display region AA and the non-display region NA. For example, the first stopper layer 111 can consist of one or more layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN xThe first stopper opening 111c may be formed from inorganic film materials, but the embodiments described in this disclosure are not limited to these. The first stopper opening 111c may be formed in a section located within the separating edge line TML in the first stopper layer 111, which is located in the first non-display area NA1. The first stopper opening 111c may be formed as a section in which the first stopper layer 111 is open. Furthermore, the first stopper opening 111c may be formed in a closed-loop shape that surrounds the display area AA in the first non-display area NA1 when viewed from above, but the present disclosure is not limited to these.

[0213] Additionally, a first organic insulating layer 112 and a first and second protective layer 113a and 113b can be arranged on the first stopper layer 111. The second stopper layer 114 can be arranged on the first protective layer 113b. For example, the second stopper layer 114 can be located entirely within the display area AA and the non-display area NA. The second stopper layer 114 can be arranged on a pixel driver circuit PD. For example, the second stopper layer 114 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN xThe second stopper opening 114a may be formed from inorganic film materials, but the embodiments described in this disclosure are not limited to these. For example, the second stopper opening 114a may be formed in a section located within the separating edge line TML in the second stopper layer 114, which is located in the first non-display area NA1. The second stopper opening 114a may be formed as a section in which the second stopper layer 114 is open. For example, the second stopper opening 114a may be formed in a closed-loop shape that surrounds the display area AA in the first non-display area NA1 when viewed from above, but the embodiments described in this disclosure are not limited to these.

[0214] A first organic insulating layer 115a can be arranged on the second stopper layer 114. The first organic insulating layer 115a can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto. For example, the first organic insulating layer 115a can be formed from a photoresist, a polyimide-based (Pl) material, a photoacrylic-based material, or the like, but the embodiments of the present disclosure are not limited thereto.

[0215] A plurality of 1-2 interconnection lines 121b can be arranged on the first organic insulating layer 115a. The plurality of 1-2 interconnection lines 121b can be connected to the pixel driver circuit PD or directly connected to it. For example, some of the 1-2 interconnection lines 121b can be directly connected to the pixel driver circuit PD via contact holes in the second stopper layer 114. Other 1-2 interconnection lines 121b can be electrically connected to 1-1 interconnection lines 121a via contact holes in the second stopper layer 114.

[0216] A second organic insulating layer 115b can be arranged on the plurality of 1-2 connecting lines 121b. The second organic insulating layer 115b can be arranged entirely in the display area AA and in the non-display area NA, but the embodiments of the present disclosure are not limited thereto.

[0217] A plurality of 1-3 connecting lines 121c can be arranged on the second organic insulating layer 115b. The plurality of 1-3 connecting lines 121c can be electrically connected to the plurality of 1-2 connecting lines 121b. For example, the 1-3 connecting lines 121c can be electrically connected to the 1-2 connecting lines 121b via contact holes in the second organic insulating layer 115b.

[0218] A third organic insulating layer 115c can be arranged on the majority of 1-3 connecting lines 121c. The third organic insulating layer 115c can be arranged in the remaining areas with the exception of the bending area BA, but the embodiments of the present disclosure are not limited thereto.

[0219] A plurality of 1-4 connecting lines 121d can be arranged on the third organic insulating layer 115c. The plurality of 1-4 connecting lines 121d can be electrically connected to the plurality of 1-3 connecting lines 121c. For example, the 1-4 connecting lines 121d can be electrically connected to the 1-3 connecting lines 121c via contact holes in the third organic insulating layer 115c.

[0220] A fourth organic insulating layer 115d can be arranged on the plurality of 1-4 connecting lines 121d. The fourth organic insulating layer 115d can be arranged in the remaining areas except for the bending area BA, but the embodiments of the present disclosure are not limited thereto. The fourth organic insulating layer 115d can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2, but the embodiments of the present disclosure are not limited thereto.

[0221] The third stopper layer 116 can be arranged on the fourth organic insulating layer 115d, which has a first electrode CE1 and a dam BNK. For example, the third stopper layer 116 can be located entirely within the display area AA and the non-display area NA. For example, the third stopper layer 116 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN xThe third stopper opening 116a may be formed from inorganic film materials, but the embodiments described in this disclosure are not limited to these. For example, the third stopper opening 116a may be formed in a section located within the separating edge line TML in the third stopper layer 116, which is located in the first non-display area NA1. The third stopper opening 116a may be formed as a section in which the third stopper layer 116 is open. The third stopper opening 116a may be formed in a closed-loop shape that surrounds the display area AA when viewed from above, but the present disclosure is not limited to these.

[0222] According to the exemplary embodiments of the present disclosure, the third stopper layer 116 can be arranged on a plurality of signal lines TL, a plurality of first electrodes CE1, a plurality of contact electrodes CCE, and the third insulating layer 115c. For example, the third stopper layer 116 can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2. The third stopper layer 116 can be a passivation layer, but the embodiments of the present disclosure are not limited to this.

[0223] The third stopper layer 116 can be arranged to cover the remaining areas except for those containing the bending area BA, a plurality of pad electrodes PE, and a solder pattern SDP. Accordingly, the penetration of moisture or contaminants into the light-emitting element ED can be reduced. For example, the third stopper layer 116 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN x ) may be formed, which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto. For example, the third stopper layer 116 may be a protective layer or an insulating layer, but the embodiments of the present disclosure are not limited thereto. For example, the third stopper layer 116 may have a hole that exposes the solder pattern SDP.

[0224] The fourth stopper layer 11 can be arranged on a second electrode CE2 and a first optical layer 117a. For example, the fourth stopper layer 11 can be located entirely in the display area AA and in the non-display area NA. For example, the fourth stopper layer 11 can consist of a single or multiple layers of silicon oxide (SiO₂). x ) or silicon nitride (SiN xThe embodiments described in this disclosure are formed from inorganic film materials, but the embodiments described therein are not limited to these. For example, the fourth stopper opening 118a may be formed in a section located within the separating edge line TML in the fourth stopper layer 11, which is arranged in the first non-display area NA1. The fourth stopper opening 118a may be formed as a section in which the fourth stopper layer 11 is open. The fourth stopper opening 118a may be formed in a closed-loop shape that surrounds the display area AA in a top view, but the present disclosure is not limited to these. Furthermore, a third optical layer 117c may be arranged on the fourth stopper layer 11 on the second electrode CE2.

[0225] According to an exemplary embodiment of the present disclosure, as described in the Fig. 11, Fig. 12 to Fig. As shown in Figure 13, the first to fourth stopper layers 111, 114, 116, and 118 can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2. Furthermore, the closed-loop-shaped first to fourth stopper openings 111c, 114a, 116a, and 118a can be formed in a top view accordingly in sections of the first to fourth stopper layers 111, 114, 116, and 118, which are arranged in the first non-display area NA1.

[0226] Furthermore, the first to fourth stopper openings 111c, 114a, 116a, and 118a can be formed in the first to fourth stopper layers 111, 114, 116, and 118 in the first non-display region NA1, which is located between the separation boundary line TML in the first non-display region NA1 and the display region AA. Additionally, the first to fourth stopper openings 111c, 114a, 116a, and 118a can be collinear in the vertical direction with respect to the substrate. For example, the first to fourth stopper openings 111c, 114a, 116a, and 118a can overlap at least partially in the vertical direction with respect to the substrate, or they can be non-overlapping in the vertical direction. For example, at least one of the first to fourth stopper openings 111c, 114a, 116a and 118a can be omitted depending on the design, without being limited to that.For example, the edges of at least some or all of the first to fourth stopper openings 111c, 114a, 116a, and 118a can overlap vertically with respect to the substrate, without being restricted to doing so. For example, the first to fourth stopper openings 111c, 114a, 116a, and 118a can be the same size or different sizes.

[0227] According to an exemplary embodiment of the present disclosure, the reliability and yield of the display device can be improved even if the cracks in the first to fourth stopper layer 111, 114, 116 and 118, which are located in the first non-display area NA1, occur during laser cutting on the parting line TRL, since the cracks do not propagate through the first to fourth stopper opening 111c, 114a, 116a and 118a to the display area AA.

[0228] Fig. Figure 14 is a top view of a display device according to a further exemplary embodiment of the present disclosure. Fig. Figure 15 is a cross-sectional view of the display device according to a further exemplary embodiment of the present disclosure. Fig. Figure 16 is an enlarged cross-sectional view of section C in Fig. 15.

[0229] The Fig. 14, Fig. 15 to Fig. Figure 16 shows the display device according to a further exemplary embodiment of the present disclosure, and a first to fourth auxiliary stopper opening 111d, 114b, 116b and 118b can additionally be formed together with the first to fourth stopper opening 111d, 114a, 116a and 118a. Since the display device according to a further exemplary embodiment of the present disclosure is formed essentially from the same components as the display device according to an exemplary embodiment of the present disclosure, the description is limited to a case in which the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b are additionally formed.

[0230] According to a further exemplary embodiment of the present disclosure, a separating line TRL and a separating edge line TML can be arranged in a first non-display area NA1. The separating line TRL and the separating edge line TML can be configured to surround a display area AA in the first non-display area NA1.

[0231] Furthermore, the separation edge line TML can have a first separation edge line TML1 and a second separation edge line TML2, which are arranged at a specific distance inside and outside the separation line TRL. Here, the first separation edge line TML1 can be configured in the first non-display area NA1, which is located inside the separation line TRL opposite the display area AA. Furthermore, the second separation edge line TML2 can be configured in the first non-display area NA1 outside the separation line TRL. The second separation edge line TML2 can be removed during laser cutting.

[0232] With reference to Fig. 14. A first crack stopper ST1 and a second crack stopper ST2 can each be arranged in a region between the first separation boundary line TML1 of the first non-display area NA1, which surrounds the display area AA, and dummy light-emitting elements, and in a region between the separation line TRL and the second separation boundary line TML2. The first crack stopper ST1 and the second crack stopper ST2 can be configured as a closed-loop shape in a plan view, but this disclosure is not limited to this. For example, at least one of the first crack stopper ST1 and second crack stopper ST2 can be configured as a closed-loop shape. For example, the section in which the first crack stopper ST1 is not configured and the section in which the second crack stopper ST2 is not configured can be disoriented relative to each other, without being limited to this.For example, the second crack stop ST2 can also be located in an area between the separation line TRL and the first separation edge line TML1. For example, the second crack stop ST2 can overlap the separation line TRL without being restricted to it.

[0233] The first crack stopper ST1 and the second crack stopper ST2 can be formed on a plurality of inorganic films located in the display area AA and the first non-display area NA1. The first crack stopper ST1 and the second crack stopper ST2 can be configured to form an opening in a closed-loop shape in a top view of the plurality of inorganic films located in the first non-display area NA1. For example, the plurality of inorganic layers can be separated from each other by opening-shaped first and second crack stops ST1 and ST2.The possibility that cracks, which occur, for example, on one side of the inorganic layer, for example in an area of ​​the inorganic layer near the first and second separation boundary lines TML1 and TML2, may propagate to the other side, for example to an area of ​​the inorganic layer in the display area AA, can be prevented in advance by the opening-shaped first and second crack stoppers ST1 and ST2, which are formed in each inorganic layer.

[0234] With reference to the Fig. 15 and Fig. 16. A plurality of stopper layers 111, 114, 116, and 118 can be arranged in the display area AA and in the first non-display area NA1. The first to fourth stopper openings 111c, 114a, 116a, and 118a, and the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b, can each be arranged in a plurality of stopper layers (111, 114, 116, and 118 in Fig. 15) be formed, which are located in the first non-indication area NA1. Furthermore, the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b may not be formed in the majority of stopper layers 111, 114, 116 and 118, which are located in the second non-indication area NA2, which is provided with the bending area BA and the pad part PAD. However, the present disclosure is not limited thereto. The first to fourth stopper openings 111c, 114a, 116a and 118a may function as the first crack stopper ST1. The first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can function as a second crack stopper ST2.

[0235] The first stopper 111 can have a stacked structure consisting of a first and a second buffer layer 111a and 111b. However, the present disclosure is not limited to this.

[0236] The first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can prevent cracks in the first to fourth stopper layer 111, 114, 116 and 118 in the first non-display area NA1 from occurring and from propagating to the display area AA during laser cutting. The first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b, which are formed in each of the first to fourth stopper layers 111, 114, 116 and 118, can be configured open-shaped so that the layers under the stopper openings are exposed, but the present disclosure is not limited thereto.For example, parts of the top surfaces of a substrate 110, a second protective layer 113b, a fourth organic insulating layer 115d and a first optical layer 117a, located in the first non-display area NA1, can be exposed through the first to fourth stopper openings 111c, 114a, 116a and 118a, as well as through the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b.

[0237] The first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can be configured in a closed-loop shape that surrounds the display area AA in the first non-display area NA1, as shown in Fig. 16 is shown in a top view, but the present disclosure is not limited thereto. For example, the closed-loop shape in a top view can be formed in various shapes such as a line shape, a zigzag shape, and the like. However, the present disclosure is not necessarily limited thereto. For example, the first to fourth stopper layers 111, 114, 116, and 118 can have a shape that is independently spaced or separated from one another, based on each of the first to fourth stopper openings 111c, 114a, 116a, and 118a, and each of the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b.

[0238] Since each of the first to fourth stopper layers 111, 114, 116 and 118 is independently spaced or separated from each other by the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b, cracks, even if they occur in the first non-indication area NA1 in the first to fourth stopper layers 111, 114, 116 and 118, cannot propagate to the indication area AA.

[0239] If each of the first to fourth stopper openings 111c, 114a, 116a and 118a or each of the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b is not integrally formed in the closed-loop shape in the first non-display area NA1, but only in a partial area of ​​the first non-display area NA1, cracks that occur during laser cutting can propagate through a part of the stopper layer where the stopper opening is not formed to the display area AA.

[0240] The first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can be formed within the separating edge line TML in the first non-display area NA1, for example in the first non-display area NA1 opposite the display area AA, and in an area between the separating line TRL and the second separating edge line TML2 outside the separating line TRL.

[0241] For example, the first buffer layer 111a and the second buffer layer 111b can be configured as the first stopper layer 111. For example, the first buffer layer 111a and the second buffer layer 111b configured as the first stopper layer 111 can be located entirely in the display area AA and the non-display area NA. For example, the first stopper layer 111 can consist of a single layer or multiple layers of silicon oxide (SiO₂). x ) or silicon nitride (SiNx ) may be formed, which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto.

[0242] For example, the first stopper opening 111c can be formed in a section located within the first separating edge line TML1 in the first stopper layer 111, which is located in the first non-display area NA1, and the first auxiliary stopper opening 111d can be formed in a section located between the second separating edge line TML2 and the separating line TRL. The first stopper opening 111c and the first auxiliary stopper opening 111d can be formed as an open portion of the first stopper layer 111. Furthermore, the first stopper opening 111c and the first auxiliary stopper opening 111d can be formed in a closed-loop shape that, in a top view, surrounds the display area AA in the first non-display area NA1, but the present disclosure is not limited to this.For example, the first auxiliary stopper opening 111d can be formed in a section between the second dividing edge line TML2 and the first dividing edge line TML1, without being restricted to it. For example, the first auxiliary stopper opening 111d can overlap the dividing line TRL, without being restricted to it. For example, the first stopper opening 111c and the first auxiliary stopper opening 111d can be formed simultaneously or separately from each other, without being restricted to it.

[0243] A first organic insulating layer 112 and first and second protective layers 113a and 113b can be arranged on the first stopper layer 111. The second stopper layer 114 can be arranged on the first protective layer 113b. For example, the second stopper layer 114 can be located entirely within the display area AA and the non-display area NA. The second stopper layer 114 can also be located on a pixel driver circuit PD. For example, the second stopper layer 114 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN x) may be formed, which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto. For example, the second stopper opening 114a may be formed in a region within the separating edge line TML in the second stopper layer 114, which is located in the first non-display region NA1. Furthermore, the second auxiliary stopper opening 114b may be formed in a region between the separating line TRL and the second separating edge line TML2.

[0244] The second stopper opening 114a and the second auxiliary stopper opening 114b can be configured as an open part of the second stopper layer 114. For example, the second stopper opening 114a and the second auxiliary stopper opening 114b can be configured in a closed-loop shape that, in a top view, surrounds the display area AA in the first non-display area NA1, but the present disclosure is not limited thereto.

[0245] Furthermore, a first organic insulating layer 115a can be arranged on the second stopper layer 114. The first organic insulating layer 115a can be formed from an organic insulating material, but the embodiments of the present disclosure are not limited thereto.

[0246] A plurality of 1-2 interconnection lines 121b can be arranged on the first organic insulating layer 115a. The plurality of 1-2 interconnection lines 121b can be connected to or directly connected to the pixel driver circuit PD. For example, some of the 1-2 interconnection lines 121b can be directly connected to the pixel driver circuit PD via contact holes in the second stopper layer 114. Other 1-2 interconnection lines 121b can be electrically connected to 1-1 interconnection lines 121a via contact holes in the second stopper layer 114.

[0247] A second organic insulating layer 115b can be arranged on the plurality of 1-2 connecting lines 121b. The second organic insulating layer 115b can be arranged entirely in the display area AA and in the non-display area NA, but the embodiments of the present disclosure are not limited thereto.

[0248] A plurality of 1-3 connecting lines 121c can be arranged on the second organic insulating layer 115b. The plurality of 1-3 connecting lines 121c can be electrically connected to the plurality of 1-2 connecting lines 121b. For example, the 1-3 connecting lines 121c can be electrically connected to the 1-2 connecting lines 121b via contact holes in the second organic insulating layer 115b.

[0249] A third organic insulating layer 115c can be arranged on the majority of 1-3 connecting lines 121c. The third organic insulating layer 115c can be arranged in the remaining areas with the exception of the bending area BA, but the embodiments of the present disclosure are not limited thereto.

[0250] A plurality of 1-4 connecting lines 121d can be arranged on the third organic insulating layer 115c. The plurality of 1-4 connecting lines 121d can be electrically connected to the plurality of 1-3 connecting lines 121c. For example, the 1-4 connecting lines 121d can be electrically connected to the 1-3 connecting lines 121c via contact holes in the third organic insulating layer 115c.

[0251] The fourth organic insulating layer 115d can be arranged on the majority of 1-4 connecting lines 121d. The fourth organic insulating layer 115d can be arranged in the remaining areas except for the bending area BA, but the embodiments of the present disclosure are not limited thereto. The fourth organic insulating layer 115d can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2, but the embodiments of the present disclosure are not limited thereto.

[0252] The third stopper layer 116 can be arranged on the fourth organic insulating layer 115d, which has a first electrode CE1 and a dam BNK. For example, the third stopper layer 116 can be located entirely within the display area AA and the non-display area NA. For example, the third stopper layer 116 can consist of a single or multiple layers of silicon dioxide (SiO₂). x ) or silicon nitride (SiN x) may be formed from inorganic film materials, but the embodiments of the present disclosure are not limited thereto. For example, the third stopper opening 116a may be formed in a section located within the first separating edge line TML1 in the third stopper layer 116, which is located in the first non-display area NA1. Furthermore, the third auxiliary stopper opening 116b may be formed in a section between the second separating edge line TML2 and the separating line TRL.

[0253] The third stopper opening 116a and the third auxiliary stopper opening 116b can be configured as part of the third stopper layer 116, which is open. For example, the third stopper opening 116a and the third auxiliary stopper opening 116b can be configured in a closed-loop shape that surrounds the display area AA in a top view, but the present disclosure is not limited thereto.

[0254] According to the exemplary embodiments of the present disclosure, the third stopper layer 116 can be arranged on a plurality of signal lines TL, a plurality of first electrodes CE1, a plurality of contact electrodes CCE, and the third insulating layer 115c. For example, the third stopper layer 116 can be arranged in the display area AA, in the first non-display area NA1, and in the second non-display area NA2. The third stopper layer 116 can be a passivation layer, but the present disclosure is not limited to this.

[0255] The third stopper layer 116 can be arranged to cover the remaining areas except for those containing the bending area BA, a plurality of pad electrodes PE, and a soldering pattern SDP. Accordingly, the ingress of moisture or contaminants into the light-emitting element ED can be prevented.

[0256] The fourth stopper layer 11 can be arranged on a second electrode CE2 and the first optical layer 117a. For example, the fourth stopper layer 11 can be located entirely in the display area AA and in the non-display area NA. For example, the fourth stopper layer 11 can consist of a single or multiple layers of silicon oxide (SiO₂). x ) or silicon nitride (SiN x ) may be formed, which are inorganic film materials, but the embodiments of the present disclosure are not limited thereto. For example, the fourth stopper opening 118a may be formed in a section within the separating edge line TML in the fourth stopper layer 11, which is located in the first non-display area NA1. Furthermore, the fourth auxiliary stopper opening 118b may be formed in a section between the second separating edge line TML2 and the separating line TRL.

[0257] The fourth stopper opening 118a and the fourth auxiliary stopper opening 118b can be configured as an open portion of the fourth stopper layer 118. The fourth stopper opening 118a and the fourth auxiliary stopper opening 118b can be configured in a closed-loop shape surrounding the display area AA in a top view, but the present disclosure is not limited to this. Furthermore, a third optical layer 117c can be arranged on the fourth stopper layer 11 on the second electrode CE2.

[0258] According to a further exemplary embodiment of the present disclosure, as described in the Fig. 14, Fig. 15 to Fig. Figure 16 shows that the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b are arranged in a top view in closed-loop-shaped sections of the first to fourth stopper layer 111, 114, 116 and 118, which are arranged in the first non-display area NA1.

[0259] Each of the first to fourth stopper openings 111c, 114a, 116a, and 118a, and each of the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b, can be arranged in a collinear line in the vertical direction with respect to the substrate. However, the present disclosure is not necessarily limited to this. For example, the first to fourth stopper openings 111c, 114a, 116a, and 118a can overlap at least partially or not at all, without being limited to this. Similarly, the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b can overlap at least partially or not at all, without being limited to this. For example, at least one of the first to fourth stopper openings 111c, 114a, 116a and 118a can be omitted, or at least one of the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can be omitted.For example, at least one of the first to fourth stopper openings 111c, 114a, 116a and 118a and at least one of the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b may overlap, without being restricted thereto. For example, the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b may all be the same size or may be of different sizes, without being restricted thereto.

[0260] According to the embodiment of the present disclosure, even if cracks occur during laser cutting on the parting line TRL in the first to fourth stopper layers 111, 114, 116 and 118, which are located in the first non-display area NA1, they cannot propagate across the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b to the display area AA, thus improving the reliability and yield of the display device. Although it is shown that each of the first to fourth stopper layers 111, 114, 116 and 118 has one or two stopper openings, the embodiments are not limited thereto. For example, each of the first to fourth stopper layers 111, 114, 116 and 118 can have three or more openings.For example, the first to fourth stopper layers 111, 114, 116 and 118 can have the same number of openings or a different number of openings, without being restricted thereto.

[0261] Fig. Figure 17 is an enlarged cross-sectional view of a display device according to a further exemplary embodiment of the present disclosure. Fig. Figure 18 is an enlarged cross-sectional view of a display device according to a further exemplary embodiment of the present disclosure.

[0262] Fig. 17 is a further embodiment of an exemplary embodiment of the present disclosure in Fig. 11, Fig. 12 to Fig. Figure 13 shows an example in which the first to fourth stopper openings 111c, 114a, 116a and 118a are arranged in a non-collinear line in the vertical direction, for example offset from the substrate. However, the present disclosure is not limited to this.

[0263] Fig. 18 is a further embodiment of a further exemplary embodiment of the present disclosure in Fig. 14, Fig. 15 to Fig. 16 and shows an example in which the first to fourth stopper openings 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b are arranged in a non-collinear line in the vertical direction, for example offset in the vertical direction with respect to the substrate. However, the present disclosure is not limited thereto.

[0264] According to another in Fig. In the exemplary embodiment shown in Figure 17 of the present disclosure, the closed-loop shaped first to fourth stopper openings 111c, 114a, 116a and 118a can be formed in a top view accordingly in sections of the first to fourth stopper layer 111, 114, 116 and 118, which are arranged in a first non-display area NA1.

[0265] The first to fourth stopper openings 111c, 114a, 116a, and 118a can each be formed in the first to fourth stopper layers 111, 114, 116, and 118 in the first non-display area NA1, which is located between a separating boundary line TML in the first non-display area NA1 and a display area AA. Furthermore, the first to fourth stopper openings 111c, 114a, 116a, and 118a can be formed in a non-collinear line in the vertical direction with respect to the substrate. For example, at least one or more of the first to fourth stopper openings 111c, 114a, 116a, and 118a can be formed in a non-collinear line with the remaining stopper openings, which are arranged vertically. However, the present disclosure is not necessarily limited to this.

[0266] According to a further embodiment of the present disclosure, even cracks that occur during laser cutting in the first to fourth stopper layer 111, 114, 116 and 118, which are located in the first non-display area NA1, on a separation line TRL, cannot propagate across the first to fourth stopper opening 111c, 114a, 116a and 118a to the display area AA and thus improve the reliability and yield of the display device.

[0267] As in Fig. As shown in Figure 18, according to a further exemplary embodiment of the present disclosure, closed-loop shaped first to fourth stopper openings 111c, 114a, 116a and 118a and first to fourth auxiliary stopper openings 111d, 114b, 116b and 118b can be provided in a top view in sections of the first to fourth stopper layer 111, 114, 116 and 118, which are arranged in a first non-display area NA1.

[0268] Each of the first to fourth stopper openings 111c, 114a, 116a, and 118a and each of the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b can be formed in the non-collinear line in the vertical direction with respect to the substrate. For example, at least one or more of the first to fourth stopper openings 111c, 114a, 116a, and 118a and each of the first to fourth auxiliary stopper openings 111d, 114b, 116b, and 118b can be formed in the non-collinear line, with the remaining stopper openings being vertical. However, the present disclosure is not necessarily limited to this.

[0269] According to a further embodiment of the present disclosure, even cracks that occur during laser cutting in the first to fourth stopper layer 111, 114, 116 and 118, which are located in the first non-display area NA1, on a separation line TRL, cannot propagate via the first to fourth stopper opening 111c, 114a, 116a and 118a and the first to fourth auxiliary stopper opening 111d, 114b, 116b and 118b to the display area AA, thus improving the reliability and yield of the display device.

[0270] The Fig. 19, Fig. 20, Fig. 21 to Fig. Figure 22 are views showing devices to which the display devices are applied according to the exemplary embodiments of the present disclosure.

[0271] With reference to the Fig. 19, Fig. 20, Fig. 21 to Fig. 22. The display devices 1000 can be contained in various devices or electronic devices according to the exemplary embodiments of the present disclosure. For example, with reference to the Fig. 19, Fig. 20, Fig. 21 to Fig. 22 different electronic devices include a portable device 1100, a mobile device 1200, a notebook 1300 and a monitor or television (TV) 1400, but the embodiments of the present disclosure are not limited thereto.

[0272] The portable device 1100, the mobile device 1200, the notebook 1300 and the monitor or television 1400 may each include housing parts 1005, 1010, 1015 and 1020, as well as the display panels 100 and display devices 1000 described above, in accordance with the specifications in the Fig. 11, Fig. 12, Fig. 13, Fig. 14, Fig. 15, Fig. 16, Fig. 17 to Fig.The 18 exemplary embodiments described in the present disclosure comprise.

[0273] The display device according to the exemplary embodiment of the present disclosure can be applied to a mobile device, a video phone, a smartwatch, a watch phone, a portable device, a foldable device, a rollable device, a bendable device, a flexible device, a curved device, a sliding device, a variable device, an electronic notebook, an e-book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, a vehicle display device, a theater display device, a television, a wallpaper device, a signage device, a gaming device, a laptop computer, a monitor, a camera, a camcorder, a household appliance, etc.Furthermore, the display device can be applied to an organic or inorganic light source according to one or more embodiments of the present specification.

[0274] According to the exemplary embodiments of the present disclosure, since a stopper area is formed in an inorganic film in a non-display area between a separation edge line and a display area and / or in a non-display area between a separation line and the separation edge line, the propagation of cracks that occur during cutting in the film to the display area can be effectively prevented.

[0275] According to the exemplary embodiments of the present disclosure, the reliability and yield of the display device can be improved by configuring a stopper area to separate the inorganic films within the separation edge line and the display area, thereby preventing cracks occurring in the inorganic film during cutting from propagating across the stopper area to the display area.

[0276] The display device according to various exemplary embodiments of the present disclosure can be described as follows.

[0277] A display device according to various exemplary embodiments of the present disclosure can comprise: a substrate with a display area and a non-display area; a pixel driver circuit arranged on the substrate; a plurality of light-emitting elements arranged on the substrate and electrically connected to the pixel driver circuit; an optical layer arranged on the substrate and located on the side faces of the plurality of light-emitting elements; and a plurality of stopper layers arranged under the pixel driver circuit, between the pixel driver circuit and the plurality of light-emitting elements, and in at least one of the display areas and non-display areas under and on the light-emitting elements, wherein at least one of the plurality of stopper layers has a stopper area arranged in the non-display area.

[0278] According to an exemplary embodiment of the present disclosure, the plurality of stopper layers may comprise: a first stopper layer arranged on the substrate under the pixel driver circuit; a second stopper layer arranged on a first insulating layer arranged on the first stopper layer; a third stopper layer arranged on a second insulating layer arranged on the second stopper layer; and a fourth stopper layer arranged on the plurality of light-emitting elements and the optical layer.

[0279] According to an exemplary embodiment of the present disclosure, the stopper area can be arranged in the first to fourth stopper layers in the non-display area.

[0280] According to an exemplary embodiment of the present disclosure, the stopper area can be formed in a closed-loop shape that surrounds the display area.

[0281] According to an exemplary embodiment of the present disclosure, the closed-loop shape can have a linear shape or a zigzag shape.

[0282] According to an exemplary embodiment of the present disclosure, the stopper area may further have an opening in at least one of the first to fourth stopper layers.

[0283] According to an exemplary embodiment of the present disclosure, one or more of the first to fourth stopper layers can be spaced apart from each other by the stopper area in the non-display area.

[0284] According to an exemplary embodiment of the present disclosure, the non-display area may comprise at least one area between a dividing line and a dividing edge line and an area between the dividing edge line and the display area.

[0285] According to an exemplary embodiment of the present disclosure, the stopper area in the non-display area of ​​at least one of the first to fourth stopper layers can be configured between the display area and the separating edge line.

[0286] According to an exemplary embodiment of the present disclosure, the stopper area can be configured in a non-display area on one side of the display area and the separating edge line and the non-display area between the separating edge line and the separating line.

[0287] According to an exemplary embodiment of the present disclosure, the stopper areas can be arranged in a collinear line or a non-collinear line on the substrate in a vertical direction with respect to the substrate.

[0288] According to an exemplary embodiment of the present disclosure, each of the first to fourth stopper layers can comprise an inorganic film.

[0289] According to an exemplary embodiment of the present disclosure, each of the first and second insulating layers can comprise at least one organic insulating layer.

[0290] According to an exemplary embodiment of the present disclosure, the display device may comprise: a plurality of dams which carry the plurality of light-emitting elements, a plurality of first electrodes which are arranged between the plurality of dams and the plurality of light-emitting elements, and a plurality of signal lines which electrically connect the plurality of first electrodes to the pixel driver circuit.

[0291] According to an exemplary embodiment of the present disclosure, the display device may further comprise a structured layer arranged on the plurality of first electrodes, wherein the plurality of first electrodes and the plurality of light-emitting elements are connected by eutectic bonding using the structured layer.

[0292] According to an exemplary embodiment of the present disclosure, the display device may further comprise a plurality of contact electrodes electrically connected to the pixel driver circuit and one or more second electrodes arranged on the optical layer and electrically connected to the plurality of contact electrodes.

[0293] According to an exemplary embodiment of the present disclosure, the display device may further comprise a black matrix arranged on the fourth stopper layer and having a plurality of through holes, as well as a cover layer arranged on the black matrix.

[0294] According to an exemplary embodiment of the present disclosure, the display device may further comprise an optical auxiliary layer arranged between the fourth stopper layer on the optical layer in the display area and the black matrix.

[0295] According to an exemplary embodiment of the present disclosure, the plurality of light-emitting elements can comprise light-emitting micro-elements, wherein the light-emitting micro-elements have a vertical structure.

[0296] A display device according to various exemplary embodiments of the present disclosure may comprise: a substrate with a display area and a non-display area; a first stopper layer arranged on the substrate and having a first stopper area in the non-display area; a pixel driver circuit arranged on the first stopper layer and a first insulating layer arranged on the first stopper layer; a second stopper layer arranged on the first insulating layer and having a second stopper area in the non-display area; a second insulating layer arranged on the second stopper layer; a third stopper layer arranged on the second insulating layer and having a third stopper area in the non-display area;a plurality of light-emitting elements arranged on the third stopper layer and electrically connected to the pixel driver circuitry; an optical layer arranged on the third stopper layer; and a fourth stopper layer arranged on the optical layer with a fourth stopper area in the non-display area.

[0297] According to an exemplary embodiment of the present disclosure, the first to fourth stopper regions may further have an opening formed in each of the first to fourth stopper layers.

[0298] According to an exemplary embodiment of the present disclosure, the first to fourth stopper layers can be spaced apart from each other by the first to fourth stopper area.

Claims

[1] Display device (1000), comprising: a substrate (110) with a display area (AA) and a non-display area (NA); a plurality of light-emitting devices (EDs) arranged on the substrate (110); a plurality of stopper layers (111, 114, 116, 118) arranged below or above the light-emitting devices (EDs), wherein at least one of the plurality of stopper layers (111, 114, 116, 118) has a stopper area which is located in the non-display area (NA). [2] Display device (1000) according to claim 1, further comprising a pixel driver circuit (PD) arranged on the substrate (110) and electrically connected to the light-emitting devices (ED), wherein the plurality of stopper layers (111, 114, 116, 118) are further arranged below or above the pixel driver circuit (PD). [3] Display device (1000) according to claim 2, wherein the plurality of stopper layers (111, 114, 116, 118) comprise: a first stopper layer (111) which is arranged on the substrate (110) under the pixel driver circuit (PD); a second stopper layer (114) which is arranged on a first insulating layer (113a, 113b) which is arranged on the first stopper layer (111); a third stopper layer (116) arranged on a second insulating layer (115a, 115b, 115c, 115d) arranged on the second stopper layer (114); and a fourth stopper layer (118) which is arranged on the majority of light-emitting devices (EDs), wherein each of the first to fourth stopper layers (111, 114, 116, 118) has an inorganic film, and each of the first and second insulating layers (113a, 113b, 115a, 115b, 115c, 115d) has at least one organic insulating layer, wherein the stopper area in the first to fourth stopper layer (111, 114, 116, 118) is located in the non-display area (NA). [4] Display device (1000) according to any one of claims 1 to 3, wherein the stopper area is formed in a closed-loop shape which surrounds the display area (AA) and the closed-loop shape has a line shape or a zigzag shape. [5] Display device (1000) according to claim 3, wherein the stopper area has an opening (111c, 114a, 116a, 118a) in at least one of the first to fourth stopper layers (111, 114, 116, 118), and the at least one of the first to fourth stopper layers (111, 114, 116, 118) is divided into separate parts by the stopper area in the non-display area (NA). [6] Display device (1000) according to any one of claims 1 to 5, wherein the non-display area (NA) has an area between a dividing line (TRL) and a dividing edge line (TML) which is arranged within the dividing line (TRL), and an area between the dividing edge line (TML) and the display area (AA), and wherein the stopper area is configured in the area between the dividing edge line (TML) and the display area (AA). [7] Display device (1000) according to claim 6, which further comprises dummy light-emitting devices in the non-display area (NA), wherein the stopper area is configured in an area between the separating boundary line (TML) and the dummy light-emitting devices. [8] Display device (1000) according to claim 6, wherein the stopper area is configured in one of the areas between a dividing line (TRL) and a dividing edge line (TML) which is arranged within the dividing line (TRL) and the area between the dividing edge line (TML) and the display area (AA). [9] Display device (1000) according to claim 8, wherein at least one of the plurality of stopper layers (111, 114, 116, 118) further comprises: a second stopper area, which is configured in the other area between a dividing line (TRL) and a dividing edge line (TML) located within the dividing line (TRL), and the area between the dividing edge line (TML) and the display area (AA). [10] Display device (1000) according to any one of claims 1 to 9, wherein the stopper areas contained in at least two of the plurality of stopper layers (111, 114, 116, 118) are arranged in a vertical direction with respect to the substrate (110) in a collinear line or a non-collinear line. [11] Display device (1000) according to claim 2 or any of claims 3 to 10, referring back to claim 2, further comprising: a plurality of dams (BNK) which carry the plurality of light-emitting devices (ED); a plurality of first electrodes (CE1) arranged between the plurality of dams (BNK) and the plurality of light-emitting devices (ED); and a plurality of signal lines (TL) which electrically connect the plurality of first electrodes (CE1) to the pixel driver circuit (PD). [12] Display device (1000) according to claim 11, which further comprises a structured layer which is arranged on the plurality of first electrodes (CE1), wherein the plurality of first electrodes (CE1) and the plurality of light-emitting devices (ED) are connected by eutectic bonding using the structured layer. [13] Display device (1000) according to claim 2 or any of claims 3 to 12, referring back to claim 2, further comprising: a plurality of contact electrodes (CCE) which are electrically connected to the pixel driver circuit (PD); and one or more second electrodes (CE2) arranged on the plurality of light-emitting devices (ED) and electrically connected to the plurality of contact electrodes (CCE). [14] Display device (1000) according to claim 3 or any of claims 4 to 13, referring back to claim 3, further comprising: a black matrix (BM) which is arranged on the fourth stopper layer (118) and has a plurality of through holes; a top layer (119) arranged on the black matrix (BM); an optical layer (117a) arranged on the substrate (110) and located on side faces of the plurality of light-emitting devices (EDs), wherein the fourth stopper layer (118) is arranged on the plurality of light-emitting devices (EDs) and the optical layer (117a); and an optical auxiliary layer (117c) which is arranged between the fourth stopper layer (118) on the optical layer (117a) in the display area (AA) and the black matrix (BM). [15] Display device (1000) according to claim 14, wherein the optical layer (117a) and the optical auxiliary layer (117c) are formed from an organic insulating material in which fine particles are dispersed. [16] Display device (1000) according to any one of claims 1 to 15, wherein the plurality of light-emitting devices (EDs) comprise light-emitting micro-devices and the light-emitting micro-devices have a vertical structure. [17] Display device (1000), comprising: a substrate (110) with a display area (AA) and a non-display area (NA); a first stopper layer (111) which is arranged on the substrate (110) and has a first stopper area in the non-display area (NA); a pixel driver circuit (PD) arranged on the first stopper layer (111) and a first insulating layer (113a, 113b) arranged on the first stopper layer (111); a second stopper layer (114) which is arranged on the first insulating layer (113a, 113b) and has a second stopper area in the non-display area (NA); a second insulating layer (115a, 115b, 115c, 115d) which is arranged on the second stopper layer (114); a third stopper layer (116) which is arranged on the second insulating layer (115a, 115b, 115c, 115d) and has a third stopper area in the non-display area (NA); a plurality of light-emitting devices (ED) arranged on the third stopper layer (116) and electrically connected to the pixel driver circuit (PD); an optical layer (117a) which is arranged on the third stopper layer (116); and a fourth stopper layer (118) which is arranged on the optical layer (117a) and has a fourth stopper area in the non-display area (NA). [18] Display device (1000) according to claim 17, wherein the first to fourth stopper area has an opening (111c, 114a, 116a, 118a) formed in each of the first to fourth stopper layer (111, 114, 116, 118), Each of the first to fourth stopper layers (111, 114, 116, 118) is divided into separate parts by the respective stopper area of ​​the first to fourth stopper area, and the first to fourth stopper area are configured in an area between the display area (AA) and a separating edge line (TML) in the non-display area (NA), or in the area between the display area (AA) and the separating edge line (TML) and an area between the separating edge line (TML) and a separating line (TRL) located outside the separating edge line (TML). [19] Display device (1000), comprising: a substrate (110) with a display area (AA) and a non-display area (NA); a plurality of light-emitting devices (EDs) arranged on the substrate (110); a stopper layer (111, 114, 116, 118) which is arranged below or above the light-emitting devices (ED), wherein the stopper layer (111, 114, 116, 118) has an opening (111c, 114a, 116a, 118a) which is located in the non-display area (NA). [20] Display device (1000) according to claim 19, wherein the opening (111c, 114a, 116a, 118a) is formed in a closed-loop shape which surrounds the display area (AA), and wherein the opening (111c, 114a, 116a, 118a) is formed in at least one of a region between a dividing line (TRL) and a dividing edge line (TML) which is arranged within the dividing line (TRL), and a region between the dividing edge line (TML) and the display area (AA).

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