ELECTRONIC DEVICE WITH MONOLITHIC ANTENNA INTEGRATION

Abstract

An electronic device can include a phased antenna array integrated into a monolithic module. The module can include a silicon bulk and a substrate grown on the silicon bulk. Radiators of the array can be arranged on a surface of the substrate. First and second optical paths can be embedded in photonic layers of the substrate. The array can include photodiodes embedded in the substrate and electrically coupled to the radiators. The first and second optical paths can illuminate the photodiodes using a first and a second optical signal, respectively. An electro-optic modulator (EOM) can be shared by the radiators and can modulate data onto the first optical signal. Optical phase shifters for each radiator can be arranged on the first optical path. The EOM can be non-overlapping with respect to the array.

Description

[0001] This application claims priority over US patent application no. 19 / 299,601 filed on August 14, 2025, and US preliminary patent application no. 63 / 693,072 filed on September 10, 2024, which are hereby incorporated in their entirety by reference herein. AREA

[0002] This disclosure relates generally to electronic devices, including electronic devices with switching logic for wireless communication. BACKGROUND

[0003] Electronic devices are often equipped with wireless switching logic such as antennas. The antennas can transmit signals at relatively high frequencies to maximize the data rate of the wireless switching logic.

[0004] In practice, providing satisfactory wireless performance to antennas can be challenging, especially as the frequencies they have to handle increase. For example, it can be difficult to provide antennas with sufficient efficiency and / or bandwidth while ensuring signal transmission without excessive losses. SUMMARY

[0005] An electronic device can include wireless switching logic for performing wireless communication. The wireless switching logic can include a phased antenna array. The phased antenna array can include antennas with radiators. The phased antenna array can be integrated into a monolithic antenna module.

[0006] The monolithic antenna module can comprise a silicon bulk and a backend-of-line substrate (BEOL substrate) grown on the silicon bulk. The emitters can be arranged on a surface of the substrate opposite the silicon bulk. The substrate can include one or more photonic layers and a stack of electrical layers. First and second optical paths can be embedded in the photonic layers. The first optical path can transmit a first optical signal with a first wavelength. The second optical path can transmit a second optical signal with a second wavelength.

[0007] The phased antenna array can include photodiodes embedded in one or more photonic layers or in the stack of electrical layers. The photodiodes can be electrically coupled to the emitters. The first and second optical paths can illuminate the photodiodes using the first and second optical signals, respectively. An electro-optic modulator (EOM) can be placed on the first optical path and can modulate wireless data onto the first optical signal (e.g., the EOM can be shared by the individual emitters in the array). Optical phase shifters can also be placed on the first optical path, which can impart optical phase shifts to the first optical signal. Optical couplers can couple the first and second optical paths to the photodiodes. The photodiodes can overlap the emitters.The EOM can be non-overlapping with respect to the phased antenna array. The optical couplers and optical phase shifters can overlap the radiators or be non-overlapping with respect to the radiators.

[0008] One aspect of the disclosure provides an integrated circuit. The integrated circuit may include a silicon bulk. The integrated circuit may include a dielectric substrate on the silicon bulk. The integrated circuit may include a photodiode. The integrated circuit may include a first optical path embedded in the dielectric substrate and configured to illuminate the photodiode using a first optical signal. The integrated circuit may include a second optical path embedded in the dielectric substrate and configured to illuminate the photodiode with a second optical signal. The integrated circuit may include an antenna with a radiator on a surface of the dielectric substrate opposite the silicon bulk, the photodiode having an electrical connection communicatively coupled to the radiator.

[0009] One aspect of the revelation provides an antenna module. The antenna module can include a silicon bulk. The antenna module can include a dielectric substrate layered on top of the silicon bulk. The antenna module can include a phased antenna array. The phased antenna array can include radiators formed from conductive traces on a surface of the dielectric substrate opposite the silicon bulk. The phased antenna array can include photodiodes electrically coupled to the radiators. The antenna module can include a first optical path embedded in the dielectric substrate and configured to transmit a first optical signal that illuminates the photodiodes in the phased antenna array.The antenna module can include a second optical path embedded in the dielectric substrate and configured to transmit a second optical signal that illuminates the photodiodes in the phased antenna array.

[0010] One aspect of the disclosure provides an electronic device. The electronic device may include a silicon bulk. The electronic device may include a dielectric substrate grown on the silicon bulk. The electronic device may include a first antenna radiator on a surface of the dielectric substrate opposite the silicon bulk. The electronic device may include a second antenna radiator on the surface of the dielectric substrate. The electronic device may include a first photodiode communicatively coupled to the first antenna radiator. The electronic device may include a second photodiode communicatively coupled to the second antenna radiator. The electronic device may include a first and a second optical combiner embedded in the dielectric substrate.The electronic device can include a first and a second optical phase shifter embedded in the dielectric substrate. The electronic device can include a first optical path that couples the first optical combiner to the first photodiode. The electronic device can include a second optical path that couples the second optical combiner to the second photodiode. The electronic device can include a first waveguide embedded in the dielectric substrate, coupled to the first and second optical combiners, and configured to transmit a first optical local oscillator signal (LO signal) to the first and second optical combiners.The electronic device can include a second waveguide embedded in the dielectric substrate, coupled to the first and second optical combiners, and configured to transmit a second optical LO signal to the first and second optical combiners. The electronic device can also include an electro-optical modulator embedded in the dielectric substrate, positioned on the first waveguide, and configured to modulate wireless data onto the first optical LO signal. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a schematic diagram of an illustrative electronic device with wireless switching logic according to some embodiments. Fig. Figure 2 is a diagram of an illustrative phased antenna array that can be adjusted to form signal beams oriented in different directions, according to some embodiments. Fig. Figure 3 is a schematic diagram of an illustrative wireless switching logic in an electronic device according to some embodiments. Fig. Figure 4 is a diagram of an illustrative dipole antenna according to some embodiments. Fig. Figure 5 is a diagram showing how, according to some embodiments, an illustrative dipole antenna can be fed using optical signals. Fig. Figure 6 is a diagram of an illustrative antenna with multiple dipole antenna resonant elements for covering different polarizations according to some embodiments. Fig. Figure 7 is a side cross-sectional view of an illustrative antenna integrated into a monolithic antenna module according to some embodiments. Fig. Figure 8 is a perspective view of three illustrative antennas in a monolithic antenna module according to some embodiments. Fig. Figure 9 is a top view of an illustrative photonic section of a monolithic antenna module with optical phase shifters overlapping corresponding antenna radiators, according to some embodiments. Fig. Figure 10 is a top view of an illustrative photonic section of a monolithic antenna module with optical phase shifters offset from corresponding antenna radiators, according to some embodiments. DETAILED DESCRIPTION

[0011] The electronic device 10 of Fig. 1. May be a computing device such as a laptop computer, a desktop computer, a computer monitor containing an embedded computer, a tablet computer, a mobile phone, a media playback device or any other handheld or portable electronic device, a smaller device such as a wristwatch device, a pendant device, a headphone or earphone device, a device contained in eyeglasses, goggles or other equipment worn on a user's head (e.g.a head-mounted device or head-mounted display such as a virtual, augmented or mixed reality device), or any other wearable or miniature device, a television, a computer display that does not contain an embedded computer, a gaming device, a navigation device, an embedded system such as a system in which electronic equipment is mounted with a display in a kiosk system or automobile, a wirelessly connected voice-controlled speaker, a home entertainment device, a remote control device, a gaming controller, a peripheral user input device, a wireless base station or access point, equipment that implements the functionality of two or more of these devices, or any other electronic equipment.

[0012] As shown in the schematic diagram of Fig. As shown in Figure 1, the device 10 can include components located on or within the housing of an electronic device, such as the housing 12. The housing 12, which may sometimes be referred to as an enclosure, can be made of plastic, glass, ceramic, fiber composites, metal (e.g., stainless steel, aluminum, metal alloys, etc.), other suitable materials, or a combination of these materials. In some situations, part or all of the housing 12 may be made of dielectric or other low-conductivity material (e.g., glass, ceramic, plastic, sapphire, etc.). In other situations, the housing 12, or at least some of the structures comprising the housing 12, may be made of metal elements.

[0013] Device 10 can include a control switching logic 14. The control switching logic 14 can include storage, such as a storage switching logic 16. The storage switching logic 16 can include hard disk drive storage, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random-access memory), etc. The storage switching logic 16 can include data storage integrated into Device 10 and / or removable storage media.

[0014] The control switching logic 14 can include a processing switching logic, such as a processing switching logic 18. A processing switching logic 18 can be used to control the operation of the device 10. The processing switching logic 18 can include one or more processors, such as microprocessors, microcontrollers, digital signal processors, host processors, integrated baseband processor circuits, application-specific integrated circuits, central processing units (CPUs), graphics processing units (GPUs), etc. The control switching logic 14 can be configured to perform operations in the device 10 using hardware (e.g., dedicated hardware or switching logic), firmware, and / or software. Software code for performing operations in the device 10 can be stored on the storage switching logic 16 (e.g.,The storage logic 16 can include non-transient (tangible) computer-readable storage media that store the software code. The software code can sometimes be referred to as program instructions, software, data, instructions, or code. Software code stored on the storage logic 16 can be executed by the processing logic 18.

[0015] The control switching logic 14 can be used to run software on the device 10, such as satellite navigation applications, internet browsing applications, voice-over-internet protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interactions with external devices, the control switching logic 14 can be used in implementing communication protocols.

[0016] Communication protocols that can be implemented using control switching logic 14 include Internet protocols, wireless local area network (WLAN) protocols (e.g., IEEE 802.11 protocols – sometimes referred to as Wi-Fi®), protocols for other short-range wireless communication links such as the Bluetooth® protocol or other wireless personal network (WPAN) protocols, IEEE 802.11ad protocols (e.g., ultra-wideband protocols), mobile phone protocols (e.g., 3G protocols, 4G protocols (LTE protocols), 3GPP Fifth Generation (5G)-New Radio (NR) protocols, Sixth Generation (6G) protocols, sub-THz protocols, THz protocols, etc.), antenna diversity protocols, satellite navigation system protocols (e.g., Global Positioning System protocols (GPS protocols), Global Navigation Satellite System protocols (GLONASS protocols), etc.).), antenna-based spatial distance measurement protocols, optical communication protocols, or any other desired communication protocols. Each communication protocol can be associated with a corresponding radio access technology (RAT), which specifies a physical connection method used in implementing the protocol.

[0017] The device 10 can include an input / output switching logic 20. The input / output switching logic 20 can include input / output devices 22. Input / output devices 22 can be used to supply data to the device 10 and to provide data from the device 10 to external devices. The input / output devices 22 can include user interface devices, data port devices, and other input / output components. For example, the input / output devices 22 can include touch sensors, displays, light-emitting components such as displays without touch sensor capabilities, and buttons (mechanical, capacitive, optical, etc.).), scroll wheels, touchpads, keypads, keyboards, microphones, cameras, buttons, speakers, status indicators, audio jacks and other audio port components, digital data port devices, motion sensors (accelerometers, gyroscopes and / or compasses that detect motion), capacitance sensors, proximity sensors, magnetometers, force sensors (e.g., force sensors coupled to a display to detect pressure applied to the display), etc. In some configurations, keyboards, headphones, displays, pointing devices such as trackpads, mice and joysticks, and other input / output devices may be coupled to the device 10 using wired or wireless connections (e.g., some of the input / output devices 22 may be peripherals coupled to a main processing unit or other section of the device 10 via a wired or wireless connection).

[0018] The input / output switching logic 20 may include a wireless switching logic 24 to support wireless communication. The wireless switching logic 24 (hereafter sometimes referred to as wireless communication switching logic 24 or high-frequency switching logic) may include a baseband switching logic such as the baseband switching logic 26 (e.g., one or more baseband processors and / or other switching logic operating in the baseband), a high-frequency transceiver switching logic (HF transceiver switching logic) such as the transceiver 28, a high-frequency front-end switching logic such as the front-end switching logic 30, and one or more antennas 34. Optionally, the wireless switching logic 24 can include several antennas 34 arranged in a phased antenna array (sometimes called a phased array antenna) which transmits radio frequency signals within a corresponding signal beam which can be directed in different directions.The baseband switching logic 26 can be coupled to the transceiver 28 via one or more baseband signal paths 31. The baseband switching logic 26 can, for example, include modulators (encoders) and demodulators (decoders) that operate on baseband signals. The transceiver 28 can be coupled to the antennas 34 via one or more transmission line paths 32. The front-end switching logic 30 can be arranged on the transmission line path(s) 32 between the transceiver 28 and the antennas 34.

[0019] In the example of Fig. For clarity, the wireless switching logic 24 is illustrated in Figure 1 as having only a single transceiver 28 and a single transmission line path 32. In general, the wireless switching logic 24 can have any desired number of transceivers 28, any desired number of transmission line paths 32, and any desired number of antennas 34. Each transceiver 28 can be coupled to one or more antennas 34 via its respective transmission line path 32. A front-end switching logic 30 can be arranged on each transmission line path 32. If desired, the front-end switching logic 30 can be shared by several transmission line paths 32.

[0020] The transmission line path(s) 32 can be coupled to antenna feeds on one or more antennas 34. The antenna feed can, for example, have a positive antenna feed terminal and a ground antenna feed terminal. Each transmission line path 32 can include a positive transmission line signal path (signal conductor) coupled to one or more positive antenna feed terminals and can have a ground transmission line signal path (ground conductor) coupled to the ground antenna feed terminal. This example is for illustrative purposes, and in general, the antennas 34 can be fed using any desired antenna feed scheme.

[0021] Each transmission path 32 can include one or more high-frequency transmission lines used to transmit high-frequency antenna signals within the device 10. The high-frequency transmission lines in the device 10 can include coaxial cables, microstrip transmission lines, stripline transmission lines, flank-locked microstrip transmission lines, flank-locked stripline transmission lines, transmission lines formed from combinations of these types, etc. The transmission path 32 can also include high-frequency connectors that couple multiple high-frequency transmission lines together. The high-frequency transmission lines in the transmission path 32 can be integrated into rigid and / or flexible printed circuit boards.In some embodiments, the high-frequency transmission lines may also include transmission line conductors integrated into multilayer laminated structures (e.g., layers of a conductive material such as copper and a dielectric material such as a resin laminated together without an intervening adhesive). The multilayer laminated structures may optionally be folded or bent in several dimensions (e.g., two or three dimensions) and may retain a bent or folded shape after bending (e.g., the multilayer laminated structures may be folded into a specific three-dimensional shape to guide them around other components of the device and may be rigid enough to retain their shape after folding without being held in position by stiffeners or other structures). All of the multiple layers of the laminated structures may be bonded without adhesive (e.g.,In contrast to performing multiple pressing processes to laminate multiple layers together with adhesive, they can be laminated stack by stack (e.g., in a single pressing process). If desired, one or more transmission line paths 32 can include one or more optical transmission lines (e.g., optical fibers or waveguides in implementations where the transceiver 28 includes electro-optical transceiver switching logic) instead of or in addition to radio frequency transmission lines.

[0022] When performing a wireless transmission, the baseband switching logic 26 can provide baseband signals to the transceiver 28 via the baseband path(s) 31. The transceiver 28 can sometimes also be referred to as the radio 28. The transceiver 28 (e.g., one or more transmitters within the transceiver 28) can include switching logic for converting the baseband signals received by the baseband switching logic 26 into corresponding high-frequency signals. For example, the transceiver 28 can include mixer switching logic that upconverts the baseband signals to high frequencies before transmission via the antennas 34. The transceiver 28 can also include digital-to-analog converter (DAC) and / or analog-to-digital converter (ADC) switching logic that converts signals between digital and analog domains. The transceiver 28 can transmit the high-frequency signals via the antennas 34 over the transmission line path 32 and the front-end switching logic 30.The antenna 34 can send the high-frequency signals to an external wireless equipment by radiating the high-frequency signals into free space.

[0023] During wireless reception, the antennas 34 can receive radio frequency signals from the external wireless equipment. The received radio frequency signals can be transmitted to the transceiver 28 via the transmission line path 32 and the front-end switching logic 30. The transceiver 28 can include switching logic for converting the received radio frequency signals into corresponding baseband signals. For example, the transceiver 28 can include one or more receivers with mixer switching logic that converts the received radio frequency signals into baseband frequencies before transmitting the baseband signals to the baseband switching logic 26.

[0024] The front-end switching logic 30 can include high-frequency front-end components that process the high-frequency signals transmitted via the high-frequency transmission lines in the transmission line path 32. If desired, the high-frequency front-end components can be implemented within one or more high-frequency front-end modules (FEMs). Each FEM can include a common substrate, such as a printed circuit board substrate, for each of the high-frequency front-end components within the FEM. The high-frequency front-end components in the front-end switching logic 30 can be switching logic (e.g., one or more high-frequency switches), high-frequency filter switching logic (e.g., low-pass filter, high-pass filter, notch filter, band-pass filter, multiplex switching logic, duplexer switching logic, diplexer switching logic, triplexer switching logic, etc.), impedance matching switching logic (e.g.,Switching logic that helps to match the impedance of the antennas 34 to the impedance of the transmission line path 32), antenna tuning switching logic (e.g., networks of capacitors, resistors, inductors and / or switches that match the frequency response of the antennas 34), high-frequency amplifier switching logic (e.g., power amplifier switching logic and / or low-noise amplifier switching logic), high-frequency coupler switching logic, charge pump switching logic, power management switching logic, digital control and interface switching logic and / or any other desired switching logic that processes the high-frequency signals transmitted and / or received by the antennas 34.

[0025] While the control switching logic 14 in the example consists of Fig. For clarity, the wireless switching logic 24 is shown separately from the wireless switching logic 24. The wireless switching logic 24 can include a processing switching logic, which forms part of the processing switching logic 18, and / or a storage switching logic, which forms part of the storage switching logic 16 of the control switching logic 14 (e.g., sections of the control switching logic 14 can be implemented on the wireless switching logic 24). For example, the baseband switching logic 26 and / or sections of the transceiver 28 (e.g., a host processor on transceiver 28) can form part of the control switching logic 14.

[0026] The wireless switching logic 24 can send and / or receive wireless signals within a corresponding frequency band of the electromagnetic spectrum (sometimes referred to here as communication bands or simply as "bands"). The frequency bands processed by the wireless switching logic 24 can be frequency bands of a wireless local area network (WLAN) (e.g., Wi-Fi® (IEEE 802.11) or other WLAN communication bands), such as a 2.4 GHz WLAN band (e.g., from 2400 to 2480 MHz), a 5 GHz WLAN band (e.g., from 5180 to 5825 MHz), a Wi-Fi® 6E band (e.g., from 5925 to 7125 MHz) and / or other Wi-Fi® bands (e.g., from 1875 to 5160 MHz), frequency bands of a wireless personal network (WPAN), such as the 2.4 GHz Bluetooth (k) band or other WPAN communication bands, mobile phone frequency bands (e.g.,Bands from approximately 600 MHz to approximately 5 GHz, 3G bands, 4G LTE bands, 5G (New Radio-Frequency Range 1) bands (5G FR1 bands) below 10 GHz, 5G (New Radio-Frequency Range 2) bands (5G FR2 bands) between 20 and 60 GHz, etc.), other centimeter or millimeter wave frequency bands between 10 and 100 GHz, near-field communication (NFC) frequency bands (e.g., at 13.56 MHz), satellite navigation frequency bands (e.g., a GPS band from 1565 to 1610 MHz, a Global Navigation Satellite System (GLONASS) band, a BeiDou Navigation Satellite System (BDS) band, etc.), ultra-wideband (UWB) frequency bands, which are under the IEEE operated using the 802.15.4 protocol and / or other ultra-wideband communication protocols, including communication bands under the 3GPP family of wireless communication standards, communication bands under the IEEE 802.XX family of standards and / or any other desired frequency bands of interest.

[0027] Software applications on electronic devices such as Device 10 have become increasingly data-intensive over time. The wireless switching logic on these electronic devices must therefore support data transmissions at ever higher data rates. Generally, the data rates supported by the wireless switching logic are proportional to the frequency of the wireless signals transmitted by the wireless switching logic (e.g., higher frequencies can support higher data rates than lower frequencies). The wireless switching logic 24 can transmit centimeter-wave and millimeter-wave signals to support relatively high data rates (e.g., because centimeter-wave and millimeter-wave signals have relatively high frequencies between approximately 10 GHz and 100 GHz). However, the data rates supported by centimeter-wave and millimeter-wave signals may still not be sufficient to meet all of Device 10's data transmission requirements.To support even higher data rates, such as data rates of up to 5 to 10 Gbit / s or higher, the wireless switching logic can transmit 24 wireless signals with frequencies of more than approximately 100 GHz.

[0028] For example, the transceiver 28 and the wireless switching logic 24 can transmit and / or receive high-frequency signals in one or more frequency bands above approximately 100 GHz (e.g., above 70 GHz, 80 GHz, 90 GHz, 110 GHz, 200 GHz, 300 GHz, etc.). High-frequency signals at these frequencies are sometimes also referred to as THF (tremendously high-frequency) signals, sub-THz signals, THz signals, or submillimeter wave signals. The THF signals can be at sub-THz or THz frequencies, such as frequencies between 100 GHz and 1 THz, between 100 GHz and 10 THz, between 100 GHz and 2 THz, between 200 GHz and 1 THz, between 300 GHz and 1 THz, between 300 GHz and 2 THz, between 70 GHz and 2 THz, between 300 GHz and 10 THz, between 100 GHz and 800 GHz, between 200 GHz and 1.5 THz, etc. (e.g., within a sub-THz, THz, THF, or submillimeter frequency band, such as a 6G frequency band).The high data rates supported by these frequencies can be used by the device 10 to perform voice and / or data communication via mobile phones (e.g., with simultaneous support for spatial multiplexing to provide additional data bandwidth), to perform spatial distance measurements such as radar operations for the purpose of detecting the presence, location, and / or speed of objects outside the device 10, to perform vehicle detection (e.g., with enhanced safety), to perform health / body monitoring of a user of the device 10 or another person, to perform gas or chemical detection, to establish a high-data-rate wireless connection between the device 10 and another device or peripheral device (e.g.,to establish a high data rate connection between a display driver on the device 10 and a display showing ultra-high resolution video, to form a remote radio head (e.g., a flexible high data rate link), to establish a high data rate THF chip-to-chip connection within the device 10 (e.g., where an antenna on a first chip in the device 10 transmits THF signals to another antenna on a second chip in the device 10), and / or to perform any other desired high data rate operations.

[0029] Antenna 34 can be formed using any desired antenna structure. For example, antennas 34 can include antennas with resonant elements formed from loop antenna structures, patch antenna structures, inverted F-antenna structures, slotted antenna structures, planar inverted F-antenna structures, helical antenna structures, monopole antenna structures, dipole antenna structures (e.g., bowtie antenna structures), hybrid forms of these designs, etc. Parasitic elements can be included in antennas 34 to match the antenna performance.

[0030] Filter switching logic, switching logic, impedance matching logic, and other switching logic may be interposed in the transmission line path 32, may be integrated into the front-end switching logic 30, and / or may be integrated into the antennas 34 (e.g., to assist antenna tuning, to support operation in desired frequency bands, etc.). These components, sometimes referred to herein as antenna tuning components, may be adjusted (e.g., using the control switching logic 14) to adapt the frequency response and wireless performance of the antennas 34 over time.

[0031] In general, the transceiver 28 can cover (process) any suitable communication (frequency) bands of interest. The transceiver can transmit radio frequency signals using the antennas 34 (e.g., the antennas 34 can transmit radio frequency signals for the transceiver switching logic). The term "transmit radio frequency signals," as used herein, means sending and / or receiving the radio frequency signals (e.g., to perform unidirectional and / or bidirectional wireless communications with external wireless communication equipment). The antennas 34 can transmit the radio frequency signals by radiating the radio frequency signals into free space (or into free space through intervening device structures, such as a dielectric covering layer). The antennas 34 can additionally or alternatively receive the radio frequency signals from free space (e.g.,through intermediate device structures, such as a dielectric covering layer). The transmission and reception of high-frequency signals by the antennas 34 each involve the excitation or resonance of antenna currents at an antenna resonator in the antenna by the high-frequency signals within the operating frequency band(s) of the antenna(s).

[0032] In examples where multiple antennas 34 are arranged in a phased antenna array, each antenna 34 can form a respective antenna element of the phased antenna array. Transmitting radio frequency signals using the phased antenna array can provide greater peak signal gain compared to scenarios where individual antennas 34 are used to transmit radio frequency signals. In satellite navigation links, cellular phone links, and other long-range links, radio frequency signals are typically used to transmit data over thousands of feet or miles. In WiFi® and Bluetooth® links at 2.4 and 5 GHz, and other short-range wireless links, radio frequency signals are typically used to transmit data over a few meters or hundreds of meters.In scenarios where millimeter wave, THz, or sub-THz frequencies are used to transmit radio frequency signals, the phased antenna array can transmit radio frequency signals over short to medium distances via a line-of-sight path. To improve signal reception for millimeter wave, THz, or sub-THz communications, the phased antenna array can transmit radio frequency signals using beam steering techniques (e.g., schemes where the antenna signal phase and / or magnitude are adjusted for each antenna in an array to perform beam steering).

[0033] Fig. Figure 2 shows how the antennas 34 can be formed in a corresponding phased antenna array 36. As shown in Fig. As shown in Figure 2, the phased antenna array 36 (hereafter sometimes referred to as array 36, antenna array 36 or array 36 of antennas 34) can be coupled with transmission line paths 32. For example, a first antenna 34-1 in the phased antenna array 36 can be coupled to a first transmission line path 32-1, a second antenna 34-2 in a phased antenna array 36 can be coupled to a second transmission line path 32-2, an Nth antenna 34-N in a phased antenna array 36 can be coupled to an Nth transmission line path 32-N, and so on. Although the antennas 34 are described herein as forming a phased antenna array, the antennas 34 in the phased antenna array 36 can sometimes also be described as together forming a single phased antenna array (e.g., where the antennas 34 are antenna elements of the phased (Array antennas are formed).

[0034] The antennas 34 in the phased antenna array 36 can be arranged in any desired number of rows and columns or in any other desired pattern (e.g., the antennas need not be arranged in a grid pattern with rows and columns). Each antenna 34 can be separated from one or more adjacent antennas 34 in the phased antenna array 36 by a predetermined distance, for example, about half the effective operating wavelength of the array. During signal transmission operations, the transmission line paths 32 can be used to supply signals (e.g., high-frequency signals such as millimeter-wave, sub-THz, and / or THz signals) for wireless transmission from the transceiver switching logic to the phased antenna array 36. During signal reception operations, the transmission line paths 32 can be used to receive signals received at the phased antenna array 36 (e.g.to deliver signals from external wireless equipment, or signals that were reflected by external objects, to the transceiver switching logic.

[0035] The use of multiple antennas 34 in the phased antenna array 36 makes it possible to implement beam shaping / steering arrangements by controlling the corresponding phases and magnitudes (amplitudes) of the radio frequency signals transmitted by the antennas. In the example of Fig. 2 Each of the antennas 34 has an associated phase and amplitude controller 38 (e.g., a first phase and amplitude controller 38-1, which is arranged on the transmission line path 32-1, can control the phase and amplitude for the high-frequency signals unwound by the antenna 34-1, a second phase and amplitude controller 38-2, which is arranged on the transmission line path 32-2, can control the phase and amplitude for the high-frequency signals unwound by the antenna 34-2, an Nth phase and amplitude controller 38-N, which is arranged on the transmission line path 32-N, can control the phase and amplitude for the high-frequency signals unwound by the antenna 34-N, etc.).

[0036] The phase and amplitude controllers 38 can each include switching logic for adjusting the phase of the radio frequency signals on radio frequency transmission line paths 32 (e.g., phase-shifting circuits) and / or switching logic for adjusting the amplitude of the radio frequency signals on transmission line paths 32 (e.g., power amplifiers and / or low-noise amplifier circuits). In situations where the wireless switching logic 24 is implemented using an electro-optic architecture, the phase and amplitude controllers 38 can include optical phase shifters arranged on corresponding optical signal paths. The phase and amplitude controllers 38 may sometimes be referred to collectively as beam steering switching logic or beam shaping switching logic (e.g., beam steering / shaping switching logic that steers / shapes the beams of radio frequency signals transmitted and / or received by the phased antenna array 36).

[0037] The phase and amplitude controllers 38 can adjust the corresponding phases and / or amplitudes of the transmitted signals provided to the individual antennas in the phased antenna array 36 and can adjust the corresponding phases and / or amplitudes of the received signals received by the phased antenna array 36. The phase and amplitude controllers 38 can, if desired, include phase detection logic for detecting the phases of the signals received by the phased antenna array 36. The term "beam" or "signal beam" here refers to the totality of wireless signals transmitted and received by a phased antenna array 36 in a particular direction. Each signal beam can have a peak gain that is directed in a corresponding beam direction with a corresponding beam direction angle (e.g.,based on constructive and destructive interference through the combination of the signals from each antenna in the phased antenna array). By using different sets of phase and magnitude settings for the phase and magnitude controllers 38, the phased antenna array 36 can be configured to form different beams in different beam directions.

[0038] For example, if the phase and amplitude controls 38 are set to generate a first set of phases and / or amplitudes, the signals form a beam such as that shown by beam B1 in Fig. 2 is shown, which is oriented towards point A. However, if the phase and amplitude controllers 38 are set to generate a second set of phases and / or amplitudes, the signals form a beam as shown by beam B2, which is oriented towards point B. Each phase and amplitude controller 38 can be controlled to produce a second set of phases and / or amplitudes based on a corresponding signal from the control switching logic 14. Fig. The control logic 38 generates a desired phase and / or magnitude from the received control signal S (e.g., the phase and / or magnitude provided by the phase and magnitude controller 38-1 can be controlled using the control signal S1, the phase and / or magnitude provided by the phase and magnitude controller 38-2 can be controlled using the control signal S2, the phase and / or magnitude provided by the phase and magnitude controller 38-N can be controlled using the control signal SN, etc.). If desired, the control logic can actively adjust the control signals S in real time to steer (shape) the beam in different desired directions over time. The phase and magnitude controllers 38 can, if desired, provide information that identifies the phase of the received signals at the control logic 14.

[0039] When conducting wireless communication using high-frequency signals with relatively high frequencies such as millimeter waves, sub-THz, or THz frequencies, high-frequency signals are transmitted via a line-of-sight path between the phased antenna array 36 and external communication equipment. If the external equipment is located at point A of Fig. If the external equipment is located at point 2, the phase and amplitude controls 38 can be adjusted to direct the signal beam towards point A (e.g., to adjust the direction of the signal beam towards point A). The phased antenna array 36 can transmit and receive radio frequency signals towards point A. Similarly, if the external equipment is located at point B, the phase and amplitude controls 38 can be adjusted to direct the signal beam towards point B (e.g., to adjust the direction of the signal beam towards point B). The phased antenna array 36 can transmit and receive radio frequency signals towards point B.

[0040] In the example of Fig. Figure 2 shows, for the sake of simplicity, that the beam guidance is performed using a single degree of freedom (e.g., in the direction to the left and to the right on the side of Fig. 2) However, in practice the beam can be directed over two or more degrees of freedom (e.g., in three dimensions, into and out of the side, and to the left and right on the side of Fig. 2) The phased antenna array 36 can have a corresponding field of view over which beam steering can be carried out (e.g. in a hemisphere or a segment of a hemisphere above the phased antenna array).

[0041] Fig. Figure 3 is a diagram showing how the transceiver switching logic 28 interacts with an antenna 34 (e.g., an antenna 34 in the phased antenna array 36 of Fig. 2) can be coupled. As in Fig. As shown in Figure 3, the antenna 34 can include one or more antenna conductors formed from conductive material such as metal. The antenna conductors can include one or more antenna conductors forming the antenna resonant element 42 (sometimes called the antenna resonator, antenna radiator, antenna radiating element, radiator arm, or resonant element arm), and one or more antenna conductors forming the antenna ground 44 (sometimes called the ground plane).

[0042] The antenna 34 can have an antenna feed coupled between the antenna resonant element 42 and the antenna ground 44. The antenna feed can have a first (positive or signal) antenna feed terminal 46 coupled to the antenna resonant element 42. The antenna feed can also have a second (ground or negative) antenna feed terminal 48 coupled to the antenna ground 44. The antenna resonant element 42 can be separated from the antenna ground 44 by a dielectric (non-conductive) gap. The antenna resonant element 42 and the antenna ground 44 can be formed from separate pieces of metal or other conductive materials, or, if desired, from separate sections of the same single piece of metal. If desired, the antenna can include 34 additional antenna conductors that are not coupled to the antenna feed terminals 46 and 48 (e.g.parasitic elements). In some antenna types (e.g., in implementations where the antenna 34 is a slot antenna), the antenna resonant element may be formed from a slot in a single antenna conductor coupled to both antenna feed terminals 46 and 48 (e.g., where the antenna feed terminals 46 and 48 are coupled to opposite sides of the slot).

[0043] The transmission line path 32 can couple the antenna 34 to the transceiver (TX / RX) 28. The transmission line 32 can include a high-frequency transmission line with a signal conductor, such as the signal conductor 40 (e.g., a positive signal conductor), and a ground conductor, such as the ground conductor 50. The ground conductor 50 can be coupled to the ground antenna feed terminal 48 of the antenna 34. The signal conductor 40 can be coupled to the positive antenna feed terminal 46 of the antenna 34. In some implementations, the signal conductor 40 can extend all the way from the positive antenna feed terminal 46 to the transceiver 28, and the ground conductor 50 can extend all the way from the ground antenna feed terminal 48 to the transceiver 28. In other implementations (e.g.,In electro-optical implementations, the signal conductor 40 and the ground conductor 50 can couple the antenna feed terminals 46 and 48 to an electro-optical device such as a photodiode, which is coupled to optical components in the transceiver 28 via optical signal paths. The photodiode can convert optical signals received via the optical signal paths into radio frequency signals, which are supplied to the antenna feed terminals 46 and 48 via the signal conductor 40 and the ground conductor 50.

[0044] In some implementations described herein by way of example, the antenna 34 may include a dipole antenna resonant element (e.g., the antenna resonant element 42 may be a dipole antenna resonant element, thereby configuring the antenna 34 to form a dipole antenna). Fig. Figure 4 is a top view showing an example of how antenna 34 can be implemented as a dipole antenna.

[0045] As in Fig. As shown in Figure 4, the antenna resonant element 42 of the antenna 34 can include two or more dipolar elements 52, such as a first dipolar element 52A and a second dipolar element 52B. The dipolar elements 52A and 52B can be planar (e.g., lying on a planar surface). The positive antenna feed terminal 46 can be coupled to a first end of the dipolar element 52A. The ground antenna feed terminal 48 can be coupled to a first end of the dipolar element 52B (facing the first end of the dipolar element 52A). The signal conductor 40 of the transmission line path 32 can be coupled to the positive antenna feed terminal 46. The ground conductor 50 of the transmission line path 32 can be coupled to the ground antenna feed terminal 48. By implementing the antenna 34 as a dipole antenna, the need for a separate ground plane (e.g. in the antenna ground 44) ​​can be eliminated. Fig. 3) under the antenna resonance element 42 are omitted, since the dipolar element 52A is referenced to the dipolar element 52B. This can serve to increase the flexibility with which the antenna 34 can be integrated into the device 10 without affecting the wireless performance.

[0046] If desired, the dipolar elements 52A and 52B can be bowtie arms (e.g., the antenna resonant element 42 can be a bowtie antenna resonant element, and the antenna 34 can be a bowtie antenna or a bowtie dipole antenna). When implemented as a bowtie arm (as in the example of Fig. As shown in Figure 4, the dipolar arm 52A has a first width at its first end (positive antenna feed terminal 46). The dipolar arm 52A extends laterally from this first end to an opposite second end (opposite the positive antenna feed terminal 46). The dipolar arm 52A has a second width at its second end that is greater than the first width. Similarly, when implemented as a bowtie arm, the dipolar arm 52B has a first width at its first end (ground antenna feed terminal 48). The dipolar arm 52B extends laterally from this first end to an opposite second end (opposite the ground antenna feed terminal 48). The dipolar arm 52B has a second width at its second end that is greater than the first width.

[0047] In the example of Fig. In Figure 4, dipolars 52A and 52B are triangular. This is exemplary and not limiting. In general, dipolars 52A and 52B can have any desired shape (e.g., follow any desired path that has any desired number of straight and / or curved segments, has any desired number of curved and / or straight edges, etc.). In practice, it can be challenging to integrate components into the wireless switching logic 24 that support wireless communication at relatively high frequencies such as millimeter, sub-THz, or THz frequencies.If desired, the wireless switching logic 24 can be implemented using an electro-optical architecture in which the wireless switching logic 24 includes optical components that transmit optical signals to support the transmission and / or reception of high-frequency signals through the antenna resonant element 42 at these frequencies in a space- and resource-efficient manner.

[0048] Fig. Figure 5 is a diagram showing an example of how the wireless switching logic 24 can be implemented using an electro-optical architecture (e.g., to power the antenna 34 using optical signals). As shown in Fig. As shown in Figure 5, the antenna 34 can include an electro-optical device such as the photodiode (PD) 53.

[0049] The photodiode 53 can have a first electrical connection that is coupled to the positive antenna feed connection 46 on the dipolar 52A (e.g. via the signal conductor 40 of Fig. 4, which is in Fig. 5 (omitted for clarity). The photodiode 53 can have a second electrical connection which is coupled to the ground antenna supply connection 46 on the dipolar 52B (e.g. via the ground conductor 50 of Fig. 4, which is in Fig. (5 has been omitted for clarity). The signal and ground conductors can, for example, include conductive vias and / or conductive traces on an underlying substrate.

[0050] The transceiver switching logic 28 can include optical components such as one or more light sources 66. The transmission line path 32 can include optical paths 54 and 56. The optical paths 54 and 56 can optically couple the light source(s) 66 to the photodiode 53. The light source(s) 66 can transmit a first optical signal, such as the optical local oscillator signal (LO signal) LO1, to the optical path 56. Simultaneously, the light source(s) 66 can transmit a second optical signal, such as the optical local oscillator signal LO2, to the optical path 54. The photodiode 53 can be illuminated by means of the optical local oscillator signals propagating along the optical paths 54 and 56.

[0051] Photodiode 53 can be a programmable photodiode. For illustrative purposes, an example is described herein in which photodiode 53 is a programmable uni-travelling carrier photodiode (UTC-PD). Therefore, photodiode 53 may sometimes be referred to herein as UTC-PD 53 or programmable UTC-PD 53. This is for illustrative purposes, and more generally, photodiode 53 can include any desired type of tunable / programmable photodiode or component that converts electromagnetic energy at optical frequencies into current at THF frequencies on dipolars 52A and 52B and / or vice versa (e.g., a PIN diode, a tunnel diode, a TW-UTC photodiode, other square-curve diodes, an LT-GaAs photodiode, an M-UTC photodiode, a Schottky diode, other types of heterodyne devices, etc.).

[0052] The UTC-PD 53 can have an electrical bias connection (input) that can receive one or more control signals V BIASfrom the control switching logic 14 ( Fig. 1) receives. Control signals V BIAS These may include bias voltages provided at one or more voltage levels, and / or other control signals for controlling the operation of the UTC-PD 53, such as impedance adjustment control signals for setting the output impedance of the UTC-PD 53. The control switching logic 14 ( Fig. 1) can the control signals V BIAS Provide (e.g., create, deliver, activate, etc.) different settings (e.g., values, magnitudes, etc.) to dynamically control (e.g., program or adjust) the operation of the UTC-PD 53 over time. For example, the control signals V BIAS They are used to control whether the antenna transmits or receives 34 high-frequency signals. When the control signals V BIASIncluding a bias voltage that is activated with a first level or magnitude, the antenna 34 can be configured to transmit high-frequency signals. The bias voltage provides the transmit power for the antenna that can be drawn from this supply. The diode modulates the DC current driven by the bias voltage, and the superimposed RF current component then excites the radiating element to radiate. The external optical field (e.g., from the optical local oscillator signals) exerts the influence that controls the generation of free charge carriers in the diode substrate (e.g., the ability to conduct current), but provides only a diminishing fraction of the actual transmit power (if any). In practice, due to limited conversion efficiency, some, but not all, of the bias voltage can be converted into an RF voltage. When the control signals V BIASIncluding a bias voltage that is activated with a second level or quantity, the antenna 34 can be configured to receive high-frequency signals. If desired, the control signals V BIAS They can also be set to control the waveform of the high-frequency signals (e.g., as a squaring function that preserves the modulation of incident optical signals, as a linear function, etc.) in order to perform gain control of the signals transmitted by the antenna 34 and / or to adjust the output impedance of the UTC-PD 53.

[0053] Optical paths 54 and 56 can include optical fibers and / or waveguides. The optical local oscillator signals LO1 and LO2 can have visible wavelengths (e.g., between 400 nm and 700 nm), ultraviolet wavelengths (e.g., wavelengths in the near-ultraviolet or extreme ultraviolet range), and / or infrared wavelengths (e.g., wavelengths in the near-infrared, mid-infrared, or far-infrared range). The optical local oscillator signal LO2 can be offset in wavelength by a wavelength X relative to the optical local oscillator signal LO1. The wavelength offset X can be equal to the wavelength of the high-frequency signals transmitted by antenna 34 (e.g., between 100 GHz and 1 THz (1000 GHz), between 100 GHz and 2 THz, between 300 GHz and 800 GHz, between 300 GHz and 1 THz, between 300 and 400 GHz, etc.).

[0054] During signal transmission, wireless data (e.g., wireless data packets, symbols, frames, etc.) can be modulated onto the optical local oscillator signal LO2 to generate the modulated optical local oscillator signal LO2'. For example, an electro-optic modulator 58 can be arranged on the optical path 54. The electro-optic modulator (EOM) 58 can receive wireless data DAT (e.g., as electrical signals) via the data path 64 from the digital-to-analog converter 62 (or other transmitter switching logic) in the transceiver 28.

[0055] The EOM 58 (sometimes referred to herein as optical modulator 58) can be, for example, a Mach-Zehnder modulator (MZM) or another type of electro-optic modulator. The EOM 58 can, for example, include a first optical arm (branch) and a second optical arm (branch) coupled in parallel along the optical path 54. By propagating the optical local oscillator signal LO2 along the arms of the EOM 58, different optical phase shifts can be applied to each arm when a voltage signal is applied to one or both arms before the signal is recombined at the output of the electro-optic modulator (e.g., optical phase modulations generated at the arms are converted into intensity modulations at the output of the EOM 58).If the voltage applied to the EOM 58 includes wireless data DAT, the EOM 58 can modulate the wireless data onto the optical local oscillator signal LO2, thereby generating the modulated optical local oscillator signal LO2'. If desired, the EOM 58 can receive one or more bias voltages (not shown) applied to one or both arms. The control switching logic 14 (. Fig. 1) can provide the bias voltage in different sizes to put the EOM 58 into different operating modes (e.g., operating modes that suppress optical carrier signals, operating modes that do not suppress optical carrier signals, etc.).

[0056] If desired, the optical local oscillator signal LO1 can be provided with an optical phase shift S. For example, an optical phase shifter (PS) 60 can be arranged on the optical path 56. The control switching logic 14 ( Fig. 1) can supply phase control signals CTRL to the optical phase shifter 60. The phase control signals CTRL can control the optical phase shifter 60 to apply an optical phase shift S to the optical local oscillator signal LO1 on the optical path 56. The phase shift S can be selected to direct a signal beam of radio frequency signals in a desired direction (e.g., by appropriately selecting the phase shift S via the phased antenna array 36 ( Fig. 2), which includes the antenna 34). Signal beam steering takes place in the optical range (e.g., using the optical phase shifter 60) and not in the high-frequency range, since there are generally no satisfactory phase-shift circuit components that operate at sub-THz or THz frequencies. The optical phase shifter 60 can be part of the phase and amplitude controller 38 ( Fig. 2) for antenna 34.

[0057] The optical phase shifter 60 can transmit the phase-shifted optical local oscillator signal LO1 (designated as LO1 + S or LO1 + φ) to the UTC-PD 53 via optical path 56. Simultaneously, the EOM 58 can transmit the modulated optical local oscillator signal LO2' to the UTC-PD 53 via optical path 54. If desired, an optical combiner (not shown) can combine optical signals on optical paths 54 and 56 before illuminating the UTC-PD 53 with the combined optical signals. Alternatively, the optical combiner can be omitted, and the optical paths can illuminate the UTC-PD 53 separately with their respective optical signals.

[0058] In this way, optical paths 54 and 56 can illuminate the UTC-PD 53 with the optical local oscillator signal LO1 (plus the optical phase shift S, if applied) and the modulated optical local oscillator signal LO2'. If desired, lenses or other optical components (not shown) can be inserted between optical paths 54 / 56 and the UTC-PD 53 to assist in focusing the optical local oscillator signals onto the UTC-PD 53.

[0059] The UTC-PD 53 can convert the optical local oscillator signal LO1 and the modulated local oscillator signal LO2' (e.g., beats between the two optical local oscillator signals) into antenna currents that run along the circumference of the dipolars 52A and 52B (e.g., via the antenna feed terminals 46 and 48 and the conductors 40 and 50 of Fig. 4) The frequency of the antenna current is equal to the frequency difference between the local oscillator signal LO1 and the modulated local oscillator signal LO2' (e.g., the frequency corresponding to the wavelength offset X). The antenna currents can radiate (transmit) high-frequency signals into free space. The control signal V BIAS The UTC-PD 53 can be controlled to convert the optical local oscillator signals into antenna currents on the dipolars 52A and 52B, while maintaining the modulation and thus the wireless data on the modulated local oscillator signal LO2' (e.g., by applying a squaring function to the signals). The transmitted radio frequency signals carry the modulated wireless data for reception and demodulation by external wireless communication equipment.

[0060] In the example of Fig. Figure 5 illustrates signal transmission for explanation. The antenna 34 can also receive high-frequency signals that are provided to the transceiver switching logic 28. For example, the control switching logic 14 ( Fig. 1) the preload V BIAS To set the UTC-PD 53 and thus the antenna 34 to a receive state, radio frequency signals can arrive at the dipolars 52A and 52B. These incoming radio frequency signals can generate antenna currents that flow around the circumference of the dipolars 52A and 52B. The antenna feed terminals 46 and 48 transfer the antenna currents to the UTC-PD 53. The UTC-PD 53 can receive the optical local oscillator signal LO1 (plus the optical phase shift S, if applied), the optical local oscillator signal LO2 (e.g., without modulation), and the control signals V. BIAS(e.g., a bias voltage activated at a second level) to convert the received high-frequency signals into intermediate frequency signals that are output on an intermediate frequency signal path (not shown).

[0061] The frequency of the intermediate frequency signals can be equal to the frequency of the high-frequency signals minus the difference between the frequency of the optical local oscillator signal LO1 and the frequency of the optical local oscillator signal LO2. For example, the intermediate frequency signals can have lower frequencies than the high-frequency signals received by antenna 34, such as centimeter or millimeter wave frequencies between 10 GHz and 100 GHz, between 30 GHz and 80 GHz, around 60 GHz, etc. If desired, the transceiver switching logic 28 ( Fig. 1) Change the frequency of the optical local oscillator signal LO1 and / or the optical local oscillator signal LO2 when switching from transmit to receive or vice versa. The UTC-PD 53 can maintain the data modulation of the THF signals 34 in the intermediate signals. A receiver in the transceiver switching logic 28 (not shown) can demodulate the intermediate frequency signals (e.g., after further down-conversion) to reconstruct the wireless data from the received radio frequency signals. In another example, the wireless switching logic 24 can convert the intermediate frequency signals to the optical range before the wireless data is reconstructed (e.g., by providing the intermediate frequency signals to an electro-optic modulator).In yet another example, the intermediate frequency signal path can be omitted and the UTC-PD 53 can directly convert received high-frequency signals into the optical range for subsequent demodulation and data recovery (e.g., in a sideband of the optical signal).

[0062] The example of Fig. Figure 5, in which the EOM 58 is arranged on optical path 54 and the optical phase shifter 60 is arranged on optical path 56, serves for illustration and is not restrictive. If desired, the optical phase shifter 60 can be arranged on optical path 54 (e.g., between the EOM 58 and the UTC-PD 53) or integrated into the EOM 58 (e.g., the EOM 58 can, in addition to modulating optical data onto the optical local oscillator signal LO2, apply a phase shift S to the optical local oscillator signal LO2). In these implementations, optical path 54 can supply a phase-shifted modulated local optical signal (here referred to as LO2' + S) to the UTC-PD 53. Optical path 56 can be free of optical phase shifters and can illuminate the UTC-PD 53 using the optical local oscillator signal LO1 (e.g., without a phase shift S). Alternatively, phase shifts can be applied to both optical local oscillator signals.

[0063] To achieve beamforming using a phased antenna array 36 ( Fig. 3) from N antennas 34 ( Fig. 5) To perform the operation, the individual RF phase of each antenna may need to be controllable within a range of ±180 degrees with respect to any reference phase. This is achieved in the optical domain using the optical phase shifter 60 by changing the phase of only one of the two optical local oscillator signals by ±180 degrees, which, after photomixing, causes a corresponding phase shift in the electrical (RF) signal generated by the UTC-PD 53. Performing optical phase shifts in this way is relatively robust against a slow phase drift of one of the two light sources 66 used to generate the optical local oscillator signals LO1 and LO2, since any phase change is distributed as a constant additive offset across all antennas in the phased antenna array 36.

[0064] Antenna 34 of the Fig. 4 and Fig. 5 can support the transmission and reception of high-frequency signals with a given polarization (e.g., a linear polarization such as a horizontal polarization). If desired, the antenna 34 can include additional dipolar elements 52 to cover an additional polarization. Fig. Figure 6 is a diagram showing an example of how the antenna 34 can enclose several pairs of dipolars 52 to cover multiple polarizations.

[0065] As in Fig. As shown in Figure 6, the antenna 34 can include a first pair of dipolars 52HA and 52HB, which are coupled to respective antenna feed terminals 46H and 48H. The antenna feed terminal 46H can be connected to a first signal conductor 40 ( Fig. 4) be coupled, the antenna feed connection 48H can be connected to a first ground conductor 50 ( Fig. 4) be coupled and, if desired, the antenna feed terminals 46H and 48H can be coupled to a first UTC-PD 53 (not shown). The dipolar elements 52HA and 52HB can be aligned in a first direction. The dipolar elements 52HA and 52HB can transmit radio frequency signals with a first linear polarization, for example, a horizontal polarization.

[0066] The antenna 34 can also include a second pair of dipoles 52VA and 52VB, which are coupled to respective antenna power supply connections 46V and 48V. The 46V antenna power supply connection can be connected to a second signal conductor 40 ( Fig. 4) be coupled, the 48V antenna power supply connection can be connected to a second 50V ground conductor ( Fig. 4) They can be coupled and, if desired, the 46V and 48V antenna feed connections can be coupled to a second UTC-PD 53 (not shown). The 52VA and 52VB dipolar elements can be oriented orthogonally to the first direction in a second direction (e.g., the 52VA and 52VB dipolar elements can be perpendicular to the 52HA and 52HB dipolar elements). The 52VA and 52VB dipolar elements can transmit high-frequency signals with a second linear polarization, for example, a vertical polarization.

[0067] The dipolar elements 52VA, 52VB, 52HA, and 52HB can all be arranged in the same plane, or, if desired, the dipolar elements 52VA and 52VB can be arranged in a different plane than the dipolar elements 52HA and 52HB. Overlapping the dipolar elements 52VA and 52VB with the dipolar elements 52HA and 52HB in this way can help to minimize the space required within the device 10.

[0068] In some implementations, the antennas are implemented in a phased antenna array as off-chip antennas or non-cooperatively controlled antennas on the surface of an integrated circuit (IC). The latter concept allows omnidirectional emission directly from the chip surface, while the bandwidth and efficiency of the antenna are severely limited by the chip's structure (e.g., the layer stacking dictated by the technology type) if no additional external components are used. In other implementations, the antennas are used as fully on-chip elements with coupled elements on the IC's top layer. On-chip antennas like these exhibit high resonance due to their proximity to the IC's internal mass metallizations and operate with relatively low bandwidth and efficiency.In other implementations, each antenna in the phased antenna array has patch elements distributed across multiple stacked substrates coupled together using intermediate connections such as solder balls (e.g., in an IC package). However, distributing the antenna across multiple stacked substrates coupled via intermediate connections can lead to excessive signal loss as signals propagate through these connections, especially at relatively high frequencies.

[0069] To mitigate these problems and reduce the volume occupied by the phased antenna array 36 in the device 10 ( Fig. 2) To minimize the routing complexity for each of the antennas 34 in the phased antenna array 36, to minimize the signal routing loss for the antennas 34, and to simplify the fabrication process for the phased antenna array 36 (and thereby minimize the cost of the device), each of the antennas 34 in the phased antenna array 36 can be arranged within a monolithic antenna module. The monolithic antenna module can also house any of the radio frequency and / or optical components for supporting the antennas (e.g., front-end switching logic, phase shifters, amplifiers, signal generators, some or all of the transceivers 28, optical paths, electro-optical modulators, etc.).) integrated within it, eliminating the need to couple an external circuit board or chip to support the antennas with the monolithic antenna module, thus minimizing signal loss.

[0070] In other words, the monolithic antenna module can reduce or even eliminate the number of intermediate connections between chips from an IC package to the antenna array. While fabricating antennas as printed circuit board devices or off-chip increases design flexibility, such solutions are still not as space-saving or energy-efficient as the monolithic antenna module (e.g., where the antennas are integrated directly into the chip), especially at frequencies above 100 GHz. Furthermore, the use of intermediate connections requires highly precise implementation of the entire interconnect chain in each individual device to achieve the system's full operating performance, which is a complex task at extremely high frequencies due to the resulting small dimensions and tight tolerances.In contrast, chip technology is already one of the most precise manufacturing technologies available. Manufacturing the antenna array on the chip requires no higher precision than that of an integrated circuit (IC) and reduces the limitations inherent in downstream integration into devices of all kinds.

[0071] The integration of antennas and antenna arrays into chips is also subject to limitations imposed by strict height restrictions of the resulting RF circuit. Antennas are three-dimensional components whose efficiency and bandwidth are partially achieved through the free space surrounding them. If not carefully considered, confining the antenna to a very flat plane with nearby metallic ground planes can negatively impact performance. Additionally, implementing the optical phase shifters 60 for the antennas 24 within the monolithic antenna module can be challenging. Some types of optical phase shifters, such as those based on specialized crystal materials or semiconductors, are implemented using fiber-linked discrete components, which can be excessively bulky.

[0072] Furthermore, technologies for integrating optical components into a semiconductor chip, such as a monolithic antenna module, are often unsuitable for reproducing high-frequency (RF) components due to the materials used. Additional devices like an interposer can assist with RF distribution and antenna guidance; however, these devices require a different manufacturing process than the one used to produce the monolithic antenna module, can be excessively bulky, and / or can introduce additional lossy interfaces into the system. To mitigate these problems, the monolithic antenna module can be manufactured as a chip-integrated signal transmission system with beam steering capability. Signal distribution within the monolithic antenna module is optical rather than electrical, with the signal only being processed at the antenna inputs (e.g., the antenna) in the final stage.at the UTC-PDs 53) is converted into an electrical signal. This can help minimize crosstalk between antennas, which is particularly high in implementations where signals are distributed in the electrical domain.

[0073] Fig. Figure 7 is a side cross-sectional view showing how a single antenna 34 in a phased antenna array 36 can be integrated into a monolithic antenna module, for example the monolithic antenna module 70. Although in Fig. 7 For the sake of clarity only a single antenna 34 is illustrated, the other antennas 34 in the phased antenna array 36 can be integrated into the monolithic antenna module 70 in a similar way.

[0074] The monolithic antenna module 70 can, for example, be a monolithic microwave integrated circuit (MMIC). The monolithic antenna module 70 is sometimes also referred to herein as integrated circuit (IC) 70, IC chip 70, or chip 70. The monolithic antenna module 70 can enclose a semiconductor bulk substrate, such as the bulk 80. The bulk 80 can include silicon (e.g., the bulk 80 can be a pure silicon wafer at the start of manufacturing). The bulk 80 can have a lower side surface 76 and an opposing upper side surface 94. The bulk 80 is sometimes also referred to herein as silicon bulk 80. The bulk 80 can have a thickness 84 (e.g., 200–500 micrometers).

[0075] The monolithic antenna module 70 can also enclose a backend substrate on the surface 94 of the bulk 80, such as substrate 78. Substrate 78 can have a lower side surface 92 on the surface 94 of the bulk 80 and an opposing upper side surface 74. Substrate 78 can, for example, form a backend-of-line (BEOL) for the monolithic antenna module 70. Therefore, substrate 78 may sometimes also be referred to here as BEOL 78, chip backend 78, or backend 78.

[0076] The substrate 78 can include stacked dielectric (insulator) layers 90. The dielectric layers 90 can include glass, quartz glass, printed circuit board materials, polyimide, ceramic, polymer, aluminum, and / or other materials. The substrate 78 can also include M metallization layers 88 that are nested, stacked, and / or embedded on or between the dielectric layers 90. The metallization layers 88 can include an M-th metallization layer 88-M (hereafter sometimes referred to as the upper metal 88-M) on the uppermost dielectric layer 90 of the substrate 78 (e.g., the upper surface 74). The metallization layers 88 can also include a metallization layer 88-1. The metallization layer 88-1 can separate the electrical section 106 of the substrate 78 from the photonic section 98 of the substrate 78.In some implementations, the metallization layer 88-1 can form a lower or first metallization layer of the electrical section 106 of the substrate 78. If desired, the metallization layer 88-1 can be held at a ground potential and can form part of the antenna ground 44 of the antenna 34. Fig. 3) The metallization layer 88-1 is sometimes also referred to herein as the mass layer 88-1.

[0077] The signals transmitted by the antenna 34 can be transmitted as electrical signals within the electrical section 106 of the substrate 78. The signals transmitted by the antenna 34 can be transmitted as optical signals within the photonic section 98 of the substrate 78. The photonic section 98 can include a single dielectric layer 90 or several stacked dielectric layers 90. The dielectric layer(s) 90 in the photonic section 98 can be made of the same material as the dielectric layer(s) 90 in the electrical section 106 or can be made of a different material. The photonic section 98 can be free of metallization layers 88 or can, if desired, include one or more metallization layers.For example, the substrate 78 may have a bottom metallization layer 88 on its side surface 92, separating the substrate 78 from the bulk 80.

[0078] If desired, an optional conductive layer, such as the reflector 72, can be applied to the side surface 76 of the bulk 80 facing the substrate 78. The reflector 72 can, for example, reflect some of the radio frequency signals transmitted by the antenna 34 back to the antenna 34, thereby improving the antenna efficiency, antenna gain, and / or the antenna's radiation pattern. If desired, the bulk 80 can enclose a cavity 82 filled with air or another material. The cavity 82 can overlap the antenna 34. The cavity 82 can help reduce the loss of radio frequency signals transmitted by the antenna 34 compared to implementations where the bulk 80 overlaps the antenna 34 and / or can help increase the bandwidth of the antenna 34.If desired, the section of the metallization layer 88-1 that overlaps the radiator of the antenna 34 can be omitted in implementations where the bulk 80 encloses the cavity 82.

[0079] The metallization layers 88 (herein sometimes also referred to as conductive traces) can include copper, gold, or other conductive materials. Different metallization layers 88 can be coupled to one another by means of conductive vias passing through one or more dielectric layers 90. If desired, the substrate 78 can be grown layer by layer onto the bulk 80 during the fabrication of the monolithic antenna module 70. For example, after the bulk 80 has been fabricated and any desired switching logic has been integrated into it, the layer(s) forming the photonic section 98 can be grown onto the surface 94 of the bulk 80, then metallization layer 88-1 can be grown onto the photonic section 98, then a first dielectric layer 90 of the electrical section 106 can be grown onto metallization layer 88-1, and so on.up to the metallization layer 88-M. In this way, the substrate 78 is monolithically integrated with the bulk 80 in the monolithic antenna module 70 and adheres to the bulk 80 without any intermediate connections such as solder or adhesive. The substrate 78 can have a thickness 96 that is less than the thickness 84 (e.g., 1-20 micrometers, 0.5-50 micrometers, 5-15 micrometers, 10 micrometers, etc.).

[0080] The antenna 34 can be integrated into the substrate 78 during its fabrication on the bulk 80. For example, the dipolar elements 52A and 52B can be formed from the metallization layer 88-M (e.g., the top metal layer of the substrate 78) or from another metallization layer 88 within the substrate 78. The dipolar elements 52A and 52B can, for example, be layered onto a top dielectric layer 90 in the substrate 78 to minimize losses. If desired, an optional passivation layer 75 can be placed over the metallization layer 88-M and the dipolar elements 52A and 52B. The example in Fig. Figure 7 serves for illustration purposes, and if desired, the dipolar elements 52A and 52B can be replaced by any desired radiation elements of the antenna 34.

[0081] In the example of Fig. The UTC-PD 53 is embedded in the photonic section 98 of the substrate 78 (e.g., at a location that overlaps the radiator of the antenna 34 in the Z direction). The photonic section 98 of the substrate 78 can include the optical path 56 and the optical path 54, which are used to feed the antenna 34. The optical path 56 can, for example, be formed by a first waveguide embedded in the photonic section 98 of the substrate 78. The optical path 54 can, for example, be formed by a second waveguide embedded in the photonic section 98 of the substrate 78. The waveguides forming the optical paths 54 and 56 can be made of a semiconductor material, silicon nitride, glass, plastic, and / or any other desired optically transparent materials.The optically transparent material used to form the optical paths 54 and 56 can have a refractive index that differs from the refractive index of the material used to form the dielectric layer(s) 90 in the photonic section 98 of the substrate 78 by at least a threshold amount. This can help to maintain the total internal reflection (TIR) ​​state of the waveguides in order to minimize the loss of optical signals transmitted in the waveguides.

[0082] The UTC-PD 53 can have an electrical connection that is communicatively coupled to the positive antenna feed terminal 46 on the dipolar element 52A via a conductive via 86A passing through the substrate 78. The antenna 34 can include an additional conductive via 86B that couples the ground antenna feed terminal 48 on the dipolar element 52B to the metallization layer 88-1. If desired, the UTC-PD 53 can have an additional electrical connection that is coupled to the metallization layer 88-1 via the conductive via 86C. Alternatively, the additional electrical connection can be coupled to the ground antenna supply connection 48 on the dipolar 52B via the conductive via 86B, the conductive via 86C and / or one or more conductive traces in the metallization layer 88-1, which couples the conductive via 86B to the conductive via 86C.This example serves for illustration purposes, and if desired, other feeding arrangements can also be used to feed the radiator for antenna 34.

[0083] The antenna 34 can include optical components such as the optic 104 in the photonic section 98 of the substrate 78. The optic 104 can, for example, be arranged at locations in the photonic section 98 that overlap the radiator of the antenna 34 (e.g., the dipolars 52A and 52B can overlap the optic 104). The optic 104 can be optically coupled to the optical path 56, the optical path 54, and / or the optically sensitive region of the UTC-PD 53. The optic 104 can, for example, couple one or more optical combiners, electro-optical components, sections of the optical paths 54 and 56, and / or other optical paths, the optical phase shifter 60 ( Fig. 5) for antenna 34 and / or the EOM 58 ( Fig. 5) for the antenna 34. In implementations where the UTC-PD 53 is located in the photonic section 98 of the substrate 78, the UTC-PD 53 can form part of the optics 104.

[0084] This example is for illustrative purposes only and is not limiting. If desired, the antenna 34 can include two pairs of dipolar antennas 52 to cover orthogonal polarizations ( Fig. 6) In general, the antenna 34 can include any desired type of antenna resonant element formed from one or more desired metallization layers on the substrate 78. If desired, the UTC-PD 53 can be located on or within the electrical section 106 of the substrate 78 instead of within the photonic section 98. For example, the UTC-PD 53 can be embedded in the electrical section 106 below the dipolars 52A and 52B, such as at location 108. If desired, the UTC-PD can be embedded in the electrical section 106 at the boundary with the photonic section 98. In this case, a portion of the UTC-PD can also extend into the photonic section.

[0085] In these implementations, the UTC-PD 53 can be coupled to the ground antenna feed terminal 48 via the conductive via 86B and to the positive antenna feed terminal 46 via the conductive via 86A (the conductive via 86C can be omitted). The substrate 78 can include an additional vertical optical path (not shown) that optically couples optical paths 56 and 54 to the UTC-PD 53 at location 108. If desired, the optics 104 can include one or more optical couplers that redirect the optical local oscillator signal LO1 from optical path 56 up the vertical optical path to the UTC-PD 53 and that redirect the optical local oscillator signal LO2 from optical path 54 up the vertical optical path to the UTC-PD 53.The optical coupler(s) may include mirrors, partial reflectors, coupling prisms, angled waveguide edges or surfaces, diffraction gratings (e.g. holograms, surface relief gratings, metagrids, etc.) and / or any other desired optical coupler(s).

[0086] The UTC-PD 53 can transmit electrical signals (antenna current) on the dipolars 52A and 52B via the conductive vias 86B and 86C based on the optical local oscillator signals LO1 and LO2. The antenna 34 can transmit high-frequency signals 100, which are related to the electrical signals (e.g., with relatively high frequencies such as millimeter waves, sub-THz, or THz frequencies).

[0087] If desired, the same EOM 58 ( Fig. 5) are shared by several antennas 34 in the monolithic antenna module 70. Fig. Figure 8 is a perspective view showing how at least three antennas 34-1, 34-2, and 34-3 in a phased antenna array 36 on a monolithic antenna module 70 can share the same EOM 58. In the example of Fig. For the sake of clarity, the dielectric layers 90 in the electrical section 106 of the substrate 78 have been omitted.

[0088] In the example of Fig. 8 are the UTC-PDs 53 of antennas 34-1, 34-2 and 34-3 in the electrical section 106 of substrate 78 (e.g. at position 108 of Fig. 7) and not located in the photonic section 98 of substrate 78. The example of Fig. Figure 8 illustrates antennas 34-1, 34-2, and 34-3 for clarity as single-polarization antennas, each with corresponding dipolar elements 52A and 52B. If desired, antennas 34-1, 34-2, and 34-3 can be configured as dual-polarization antennas (see, for example, Figure 8). Fig. 6), and the components for each antenna in the electrical section 106 and in the photonic section 98 can be duplicated to cover the orthogonal polarization.

[0089] As in Fig. As shown in Figure 8, antennas 34-1, 34-2, and 34-3 can each enclose a corresponding radiator in or on the side surface 74. Antennas 34-1, 34-2, and 34-3 can each enclose a corresponding optic 104 in the photonic section 98 of the substrate 78. The optic 104 in each of antennas 34-1, 34-2, and 34-3 can overlap the corresponding radiator of that antenna. Antennas 34-1, 34-2, and 34-3 can each enclose a UTC-PD 53, which is connected between the optic 104 and the radiator of the corresponding antenna (e.g., the UTC-PD 53 in each antenna is arranged vertically between the optic 104 and the radiator of that antenna). The antennas 34-1, 34-2 and 34-3 can each include a respective optical path 112 (e.g. a vertical optical path) that couples the optics 104 of this antenna with the UTC-PD 53 of this antenna.The radiator, the UTC-PD 53, the optical path 112 and the optics 104 of a given antenna 34 are herein sometimes collectively referred to as the antenna unit cell (e.g. where . Fig. 8 three antenna unit cells illustrated).

[0090] In the example of Fig. 8 The monolithic antenna module 70 modulates the optical local oscillator signal LO2 and applies phase shifts S ( Fig. 5) to the optical local oscillator signal LO2 instead of the optical local oscillator signal LO1. This is for illustrative purposes and is not a limitation. If desired, the monolithic antenna module 70 can alternatively apply phase shifts S to the optical local oscillator signal LO1 (e.g., as in the example of Fig. 5 shown).

[0091] As in Fig. As shown in Figure 8, the photonic section 98 of the substrate 78 can enclose the optical path 54 (e.g., one or more optical waveguides). The EOM 58 can be arranged on the optical path 54 within the photonic section 98 of the substrate 78. The EOM 58 can receive the optical local oscillator signal LO2 via the optical path 54 (e.g., from the light source(s) 66). Fig. 5) The EOM 58 can receive wireless DAT data as an electrical signal (e.g., from the DAC 62). Fig. 5) The EOM 58 can modulate wireless data (DAT) onto the optical local oscillator signal LO2 to generate the modulated optical local oscillator signal LO2'. The EOM 58 can also function as an electro-optic in-phase quadrature phase modulator (electro-optic I / Q modulator), if desired.

[0092] The EOM 58 can distribute the modulated optical local oscillator signal LO2' via the optical path 54 to the optical phase shifter 60 in the optics 104 for each of the antennas 34-1, 34-2, and 34-3. If desired, the optical path 54 can include one or more optical splitters 110 (e.g., optical couplers, partial reflectors, etc.) that help to fan out the optical path 54 to the optics 104 at each of the antennas 34-1, 34-2, and 34-3. In this way, the antennas 34-1, 34-2, and 34-3 can share the same EOM 58 and transmit the same wireless DAT data. This can be generalized to any desired number of antennas 34 in the phased antenna array 36 that use the same EOM 58. Although referred to herein as optical splitters, the optical splitters can equivalently form optical combiners in the reverse direction.

[0093] Each optical phase shifter 60 can impart a corresponding optical phase shift S to the modulated optical local oscillator signal LO2' received by the EOM 58, in order to generate a corresponding phase-shifted modulated optical local oscillator signal LO2' + S. Different phase shifts S can be applied to the antennas 34 of the monolithic antenna module 70 to perform suitable beam shaping. If desired, each optical phase shifter 60 can be formed from treated (doped) semiconductor material that responds to a DC electrical voltage (not shown) by changing its refractive index and thus its path length to impart a desired phase shift to the optical local oscillator signal.

[0094] The optics 104 in antennas 34-1, 34-2, and 34-3 can each include a corresponding optical combiner 118. Optical combiners 118 (hereafter sometimes also referred to as optical adders 118) can include optical couplers (e.g., adjacent optical paths that couple optical signals between the paths) and / or any other desired optical combining components. Although referred to herein as optical combiners, the optical combiners 118 can equivalently form optical splitters in the reverse direction. Optical combiners 118 are also sometimes referred to herein more generally as optical couplers 118.

[0095] The photonic section 98 of the substrate 78 can also include the optical path 56 (e.g., one or more optical waveguides). The optical path 56 bypasses the EOM 58 and is optically coupled to the optical combiner 118 in the optics 104 of each of the antennas 34-1, 34-2, and 34-3. If desired, the optical path 56 can include one or more optical splitters 114, which help to fan out the optical path 56 to the optics 104 at each of the antennas 34-1, 34-2, and 34-3. The optical path 56 can carry the optical local oscillator signal LO1 (e.g., from the light source(s) 66 in Fig. 5) to the optical combiner 118 for each antenna 34 in the phased antenna array 36. In this way, antennas 34-1, 34-2, and 34-3 can share the same optical local oscillator signal LO1. This can be generalized to any desired number of antennas 34 in the phased antenna array 36. Although referred to herein as optical splitters, the optical splitters 114 can equivalently form optical combiners in the reverse direction.

[0096] In the optics 104 of each of the antennas 34-1, 34-2, and 34-3, the optical combiner 104 can combine the phase-shifted modulated optical local oscillator signal LO2' + S received via optical path 54 with the optical local oscillator signal LO1 received via optical path 56 to generate a combined optical signal on optical path 112. Optical path 112 can illuminate the photoactive region of the corresponding UTC-PD with the combined optical signal, causing the UTC-PD to generate the corresponding antenna current on its radiator. In the example of Fig. Section 8 illustrates signal transmission for explanation. The in Fig. The 8 components shown can also be used to perform signal reception (e.g., each UTC-PD can generate an electrical signal such as an intermediate frequency signal on additional electrical paths (not shown) in response to wireless signals arriving at the phased antenna array 36; each UTC-PD can generate optical signals on optical paths 112 or other optical paths (not shown) in response to wireless signals arriving at the phased antenna array 36, etc.).

[0097] The EOM 58 can be offset from the antennas 34 in the phased antenna array 36 and may not overlap with them (e.g., the EOM 58 may be offset from and / or located outside of the optics 104). For example, the EOM 58 may be located in a first region of the monolithic antenna module 70 (e.g., an edge region of the antenna module), while the antennas 34 are located in a second region of the monolithic antenna module 70 (e.g., a central region of the antenna module). In such an implementation, each antenna 34 can have a compact lateral footprint, which helps to accommodate the optical signal guide within the module. Furthermore, the optical local oscillator signals within the photonic section 98 of the substrate 78 can be efficiently directed to each of the antennas 34 in the phased antenna array 36 (e.g.with significantly less loss than if electrical signals were distributed to each of the antennas in the array).

[0098] The example of Fig. 8, where the UTC-PDs 53 are located in the electrical section 106 of the substrate 78 (e.g. at position 108 of Fig. 7) are arranged for illustrative purposes and are not restrictive. Fig. Figure 9 is a top view showing an example of how the UTC-PD 53 can be integrated into the optics 104 of each antenna 34 of the phased antenna array 36 in the photonic section 98 of the substrate 78. The example of Fig. Figure 9 illustrates a phased antenna array 36, which includes at least six antennas 34. The optics 104 in the photonic section 98 of the substrate 78 for each of the six antennas 34 in the phased antenna array 36 are shown in Fig. Figure 9 illustrates this. In general, the phased antenna array 36 can include any desired number of antennas.

[0099] As in Fig. As shown in Figure 9, the optics 104 can include, for each antenna 34 in the phased antenna array 36, a corresponding optical phase shifter 60, an optical combiner 118, a UTC-PD 53, and an optical path 112 (e.g., a waveguide embedded in the photonic section 98 of the substrate 78). Each optical phase shifter 60 can be arranged on the optical path 56. Each optical phase shifter 60 receives the modulated optical local oscillator signal LO2' via the optical path 56 and generates a corresponding phase-shifted modulated optical local oscillator signal LO2' + S, which is provided to the corresponding optical combiner 118. Each optical combiner 118 also receives the optical local oscillator signal LO1 via the optical path 54.Each optical combiner 118 combines the optical local oscillator signal LO1 with its phase-shifted modulated optical local oscillator signal LO2' + S to produce on its optical path 112 a combined optical signal that illuminates the corresponding UTC-PD 53.

[0100] In the example of Fig. In Figure 9, the antennas 34 in the phased antenna array 36 are arranged in a pattern of repeating columns 120. If desired, the optical paths 56 and 54 can each include corresponding branches that supply the optical local oscillator signals to the antennas 34 in each column 120. This can, for example, help to minimize complexity and losses in the optical signal transmission. The example of Fig. Figure 9, in which optical phase shifters 60 and optical combiners 118 are enclosed in the optics 104 for each antenna 34 in the phased antenna array 36 (e.g., at points where the radiators in the antennas of the array overlap), serves for illustration and is not restrictive. Alternatively, the optical phase shifters 60 and / or optical combiners 118 can be arranged in a different region of the photonic section 98 of the substrate 78 than the optics 104 of the antennas 34.

[0101] Fig. Figure 10 is a top view showing an example of how the optical phase shifters 60 and optical combiners 118 can be arranged in a different region of the photonic section 98 of the substrate 78 than the optics 104 of the antennas 34. As shown in Fig. As shown in Figure 10, the optics 104 can be arranged in a first region 124 of the lateral surface spanned by the photonic section 98 of the substrate 78. The optics 104 can enclose the UTC-PDs 53 or, if desired, the UTC-PDs 53 can overlap the optics 104 (e.g., as shown in Figure 10). Fig. 8 shown). The optics 104 in region 124 can overlap the radiators of the antennas 34 in the phased antenna array 36.

[0102] On the other hand, the optical phase shifters 60 and the optical combiners 118 can be located in a second region 122 of the lateral surface spanned by the photonic section 98 of the substrate 78. Region 122 can be smaller than region 124 if required. For example, region 124 can form a central region of the monolithic antenna module, while region 122 forms a peripheral region of the monolithic antenna module (extending, for example, around part or all of the periphery of the central region). Each optical phase shifter 60 can receive the modulated optical local oscillator signal LO2' via the optical path 54. Each optical phase shifter 60 can apply a corresponding optical phase shift S to the modulated optical local oscillator signal LO2' and can provide its phase-shifted modulated optical local oscillator signal to another respective optical combiner 118.

[0103] Each optical combiner 118 can also receive the optical local oscillator signal LO1 via optical path 56 and can generate a corresponding combined optical signal by combining the received optical local oscillator signal LO1 with the phase-shifted and modulated optical local oscillator signal that it has received from its respective optical phase shifter 60. Each optical combiner 118 can output the combined signal to a respective optical path 112. Each optical path 112 can transmit a respective combined signal to a respective UTC-PD 53 in region 124. Such offsetting of the optical phase shifters 60 and the signal combiners 118 from the optics 104 can help minimize the complexity of optical signal routing when providing optical signals to the UTC-PDs 53 (e.g., by eliminating the need to route the signal path 56 to each unit cell in region 124).

[0104] The term "simultaneous" as used here means that there is at least partial temporal overlap. In other words, a first and a second event are described as "simultaneous" if at least part of the first event occurs at the same time as at least part of the second event (e.g., if at least part of the first event occurs at the same time as, during, or when at least part of the second event occurs). The first and second events can be simultaneous if they occur at the same time (e.g., if the entire duration of the first event overlaps with the entire duration of the second event), but they can also be simultaneous if they do not occur at the same time (e.g., if the first and second events do not occur simultaneously).(e.g., if the first event begins before or after the start of the second event, if the first event ends before or after the end of the second event, or if the first and second events do not partially overlap in time). The term "during" used here is synonymous with "simultaneous".

[0105] It is understood that the use of personally identifiable information should follow data protection regulations and practices that are generally recognized as meeting or exceeding industry or regulatory requirements for protecting user privacy. In particular, personally identifiable information should be managed and handled in a manner that minimizes the risks of accidental or unauthorized access or use, and the nature of any authorized use should be clearly communicated to users.

[0106] According to one embodiment, an integrated circuit includes a silicon bulk, a dielectric substrate on the silicon bulk, a photodiode, a first optical path embedded in the dielectric substrate and configured to illuminate the photodiode using a first optical signal, a second optical path embedded in the dielectric substrate and configured to illuminate the photodiode using a second optical signal, and an antenna with a radiator on a surface of the dielectric substrate opposite the silicon bulk, wherein the photodiode has an electrical connection that is communicatively coupled to the radiator.

[0107] According to another embodiment, the first optical signal optionally has a first frequency, the second optical signal optionally has a second frequency that differs from the first frequency, and the emitter is optionally configured to emit a wireless signal with a third frequency associated with a difference between the first and second frequencies.

[0108] According to another embodiment, the dielectric substrate optionally includes a stack of electrical layers, one or more photonic layers arranged between the stack of electrical layers and the silicon bulk, and a metallization layer separating the stack of electrical layers from the one or more photonic layers, wherein the first and second waveguides are embedded in the one or more photonic layers.

[0109] According to another embodiment, the photodiode is optionally embedded in at least one or more photonic layers, and the integrated circuit further optionally includes one or more conductive vias that couple the electrical connection of the photodiode through at least some of the one or more photonic layers and through the stack of electrical layers to an antenna feed connection on the radiator.

[0110] According to another embodiment, the photodiode is optionally embedded at least in the stack of electrical layers, and the integrated circuit further optionally includes a conductive via that couples the electrical connection of the photodiode through at least a part of the stack of electrical layers to an antenna feed connection on the radiator, as well as one or more vertical optical paths that optically couple the first and second optical paths through at least some of the one or more photonic layers and through at least a part of the stack of electrical layers to the photodiode.

[0111] According to another embodiment, the photodiode optionally overlaps the emitter and the integrated circuit further optionally includes an optical coupler that overlaps the emitter and is embedded in the dielectric substrate, and a third optical path that is optically coupled to the photodiode, wherein the optical coupler optically couples the first and second optical paths to the third optical path.

[0112] According to another embodiment, the photodiode is optionally arranged vertically between the optical coupler and the emitter, and the third optical path optionally runs vertically through at least a part of the dielectric substrate.

[0113] According to another embodiment, the integrated circuit optionally includes an optical phase shifter arranged on the first optical path, wherein the optical phase shifter is embedded in the dielectric substrate, the optical phase shifter overlaps the emitter, the optical phase shifter is configured to impart an optical phase shift to the first optical signal, and the optical coupler is optically coupled between the third optical path and the optical phase shifter.

[0114] According to another embodiment, the optical phase shifter, the optical coupler and the photodiode are optionally arranged on the same layer of the dielectric substrate.

[0115] According to another embodiment, the integrated circuit optionally includes an electro-optic modulator (EOM) arranged on the first optical path, wherein the EOM is embedded in the dielectric substrate, the optical phase shifter is optically coupled between the EOM and the optical coupler, the EOM is non-overlapping with respect to the emitter, and the EOM is configured to modulate wireless data onto the first optical signal.

[0116] According to another embodiment, the photodiode optionally overlaps the emitter, and the integrated circuit further optionally includes an optical phase shifter arranged on the first optical path and embedded in the dielectric substrate, and an optical coupler embedded in the dielectric substrate that optically couples the first and second optical paths to the photodiode via a third optical path, wherein the optical coupler is optically coupled between the optical phase shifter and the third optical path, and the optical phase shifter and the optical coupler are non-overlapping with respect to the emitter and the photodiode.

[0117] According to another embodiment, the photodiode optionally includes a uni-travelling-carrier photodiode, the first optical path optionally includes a first waveguide, and the second optical path optionally includes a second waveguide.

[0118] According to another embodiment, the first and second waveguides optionally include a semiconductor material embedded in the dielectric substrate.

[0119] According to one embodiment, an antenna module includes a silicon bulk, a dielectric substrate layered on the silicon bulk, a phased antenna array with radiators formed from conductive traces on a surface of the dielectric substrate opposite the silicon bulk, and photodiodes electrically coupled to the radiators, a first optical path embedded in the dielectric substrate and configured to transmit a first optical signal that illuminates the photodiodes in the phased antenna array, and a second optical path embedded in the dielectric substrate and configured to transmit a second optical signal that illuminates the photodiodes in the phased antenna array.

[0120] According to another embodiment, the antenna module optionally includes optical phase shifters arranged on the first optical path, embedded in the dielectric substrate and configured to apply optical phase shifts to the first optical signal, as well as optical couplers embedded in the dielectric substrate and configured to optically couple the first and second optical paths to the photodiodes in the phased antenna array.

[0121] According to another embodiment, the antenna module optionally includes an electro-optic modulator (EOM) which is arranged on the first optical path, embedded in the substrate and configured to modulate wireless data onto the first optical signal.

[0122] According to another embodiment, the EOM is optionally non-overlapping with respect to the radiators in the phased antenna array.

[0123] According to another embodiment, the optical phase shifters and the optical couplers optionally overlap the radiators in the phased antenna array.

[0124] According to another embodiment, the optical phase shifters and the optical couplers are optionally non-overlapping with respect to the radiators in the phased antenna array.

[0125] According to one embodiment, an electronic device includes a silicon bulk, a dielectric substrate grown on the silicon bulk, a first antenna radiator on a surface of the dielectric substrate opposite the silicon bulk, a second antenna radiator on the surface of the dielectric substrate, a first photodiode communicatively coupled to the first antenna radiator, a second photodiode communicatively coupled to the second antenna radiator, first and second optical combiners embedded in the dielectric substrate, first and second optical phase shifters embedded in the dielectric substrate, a first optical path coupling the first optical combiner to the first photodiode, a second optical path coupling the second optical combiner to the second photodiode, and a first waveguide embedded in the dielectric substrate.coupled and configured with the first and second optical combiners to transmit a first optical local oscillator signal (LO signal) to the first and second optical combiners, a second waveguide embedded in the dielectric substrate, coupled and configured with the first and second optical combiners to transmit a second optical LO signal to the first and second optical combiners, and an electro-optical modulator embedded in the dielectric substrate, arranged on the first waveguide and configured to modulate wireless data onto the first optical LO signal.

[0126] The foregoing is for illustrative purposes only, and various modifications can be made to the described embodiments. The foregoing embodiments can be implemented individually or in any combination. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 19 / 299,601

[0001] US 63 / 693,072

[0001] Cited non-patent literature

[0000] Bands from approximately 600 MHz to approximately 5 GHz, 3G bands, 4G LTE bands, 5G New Radio Frequency Range 1 bands (5G New Radio FR1 bands) below 10 GHz, 5G New Radio Frequency Range 2 bands (5G New Radio

[0026]

Claims

[1] Integrated circuit comprising: a silicon bulk; a dielectric substrate on the silicon bulk; a photodiode; a first optical path embedded in the dielectric substrate and configured to illuminate the photodiode using a first optical signal; a second optical path embedded in the dielectric substrate and configured to illuminate the photodiode using a second optical signal; and an antenna with a radiator on a surface of the dielectric substrate opposite the silicon bulk, wherein the photodiode has an electrical connection that is communicatively coupled to the radiator. [2] Integrated circuit according to claim 1, wherein the first optical signal has a first frequency, the second optical signal has a second frequency which differs from the first frequency, and the emitter is configured to emit a wireless signal with a third frequency which is associated with a difference between the first and the second frequency. [3] Integrated circuit according to claim 1, wherein the dielectric substrate comprises: a stack of electrical layers; one or more photonic layers positioned between the stack of electrical layers and the silicon bulk; and a metallization layer that separates the stack of electrical layers from the one or more photonic layers, wherein the first and second waveguides are embedded in the one or more photonic layers. [4] Integrated circuit according to claim 3, wherein the photodiode is embedded in at least one or more photonic layers and the integrated circuit further comprises one or more conductive vias coupling the electrical connection of the photodiode through at least some of the one or more photonic layers and through the stack of electrical layers to an antenna feed connection on the radiator. [5] Integrated circuit according to claim 3, wherein the photodiode is embedded at least in the stack of electrical layers and the integrated circuit further comprises: a conductive via that couples the electrical connection of the photodiode through at least a part of the stack of electrical layers to an antenna feed point on the radiator; and one or more vertical optical paths that optically couple the first and second optical paths to the photodiode through at least some of the one or more photonic layers and through at least a part of the stack of electrical layers. [6] Integrated circuit according to claim 1, wherein the photodiode overlaps the emitter and the integrated circuit further comprises: an optical coupler that overlaps the emitter and is embedded in the dielectric substrate; and a third optical path that is optically coupled to the photodiode, wherein the optical coupler optically couples the first and second optical paths to the third optical path. [7] Integrated circuit according to claim 6, wherein the photodiode is arranged vertically between the optical coupler and the emitter and wherein the third optical path runs vertically through at least a part of the dielectric substrate. [8] Integrated circuit according to claim 6, further comprising: an optical phase shifter arranged on the first optical path, wherein the optical phase shifter is embedded in the dielectric substrate, the optical phase shifter overlaps the emitter, the optical phase shifter is configured to impart an optical phase shift to the first optical signal, and The optical coupler is optically coupled between the third optical path and the optical phase shifter. [9] Integrated circuit according to claim 8, wherein the optical phase shifter, the optical coupler and the photodiode are arranged on the same layer of the dielectric substrate. [10] Integrated circuit according to claim 8, further comprising: an electro-optical modulator (EOM) arranged on the first optical path, wherein the EOM is embedded in the dielectric substrate, the optical phase shifter is optically coupled between the EOM and the optical coupler, the EOM is non-overlapping with respect to the emitter and The EOM is configured to modulate wireless data onto the first optical signal. [11] Integrated circuit according to claim 1, wherein the photodiode overlaps the emitter and the integrated circuit further comprises: an optical phase shifter arranged on the first optical path and embedded in the dielectric substrate; and an optical coupler embedded in the dielectric substrate which optically couples the first and second optical paths to the photodiode via a third optical path, wherein the optical coupler is optically coupled between the optical phase shifter and the third optical path and The optical phase shifter and the optical coupler are non-overlapping with respect to the radiator and the photodiode. [12] Integrated circuit according to claim 1, wherein the photodiode comprises a uni-travelling-carrier photodiode, the first optical path comprises a first waveguide and the second optical path comprises a second waveguide. [13] Integrated circuit according to claim 12, wherein the first and the second waveguide comprise a semiconductor material embedded in the dielectric substrate.

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