Package for an electronic component, electronic component and electronic arrangement

Abstract

Package (10) for an electronic component (20) comprising a housing (100) and a conductor frame (200) embedded in the housing (100), wherein the conductor frame (200) comprises a first section (210), a second section (220) and a third section (230) which are electrically insulated from each other, wherein the first section (210) and the second section (220) each have an L-shape, wherein the housing (100) comprises a cavity (110), wherein at least parts of the top surfaces (211, 221, 231) of the first section (210), the second section (220) and the third section (230) of the conductor frame (200) are exposed in the cavity (110), wherein a first part (213) and a second part (214) of the upper surface (211) of the first section (210) are exposed in the cavity (110), wherein a bridge (120) of the case (100) covers an area of ​​the top (211) of the first section (210) between the first part (213) and the second part (214).

Description

[0001] The present invention relates to a package for an electronic component according to claim 1, an electronic component according to claim 6 and an electronic arrangement according to claim 9.

[0002] Various packages for electronic components are known in the prior art.

[0003] EP 2 408 031 A2 describes an LED device with a conductor frame having isolated sections exposed in a cavity of a package. A similar device is also described in US 2008 / 0 298 063 A1. US 2008 / 0 179 618 A1 describes an LED device with a ceramic substrate having a cavity containing LED chips. US 2011 / 0 186 875 A1 describes an LED device with two conductor frame sections per LED chip. DE 21 2013 000 062 U1 describes a light-emitting diode (LED) unit comprising at least three LED chips, first conductors with at least three chip mounting sections on which the LEDs are mounted, second conductors separate from the first conductors and each connected to the LED chips via wires, and a substrate on which the first conductors and the second conductors are formed. The chip mounting sections are arranged around the center of the substrate.

[0004] It is an object of the present invention to provide a package for an electronic component. This object is achieved by a package having the features of claim 1. It is a further object of the present invention to provide an electronic component. This object is achieved by an electronic component having the features of claim 6. It is a further object of the present invention to provide an electronic arrangement. This object is achieved by an electronic arrangement having the features of claim 9. Further developments are disclosed in the dependent claims.

[0005] An electronic component package comprises a housing and a conductor frame embedded within the housing. The conductor frame includes a first section, a second section, and a third section, which are electrically isolated from each other. The first section and the second section each have an L-shape.

[0006] Advantageously, the L-shaped first and second sections of the conductor frame of this package can provide multiple wire bonding positions for connecting bond wires to electrically connect electronic semiconductor chips. This allows for the arrangement of various types of electronic semiconductor chips in different orientations within the package. This, in turn, makes the package suitable for various applications and configurations.

[0007] In one embodiment of the package, the first and second sections are mirror images of each other. Advantageously, this allows for a space-saving and mechanically robust package design.

[0008] In one embodiment of the package, the conductor frame is mirror-symmetrical. Advantageously, this allows for a compact and mechanically robust package design.

[0009] In one embodiment of the package, the third section comprises a first recess and a second recess. Both the first and second recesses are L-shaped. The first section is positioned within the first recess, and the second section is positioned within the second recess. In this embodiment, the first, second, and third sections of the conductor frame can be combined to form a rectangular shape. Advantageously, this allows for a compact package design and enables material-saving manufacturing of the package's conductor frame.

[0010] In one embodiment of the package, at least portions of the undersides of the first, second, and third sections of the conductor frame are exposed on the underside of the housing. Advantageously, the exposed undersides of the first, second, and third sections of the conductor frame of this package allow the package to be mounted on a surface. The package can be mounted, for example, by an SMT process, such as reflow soldering. The undersides of the first and second sections of the conductor frame of the package can, for example, be used to electrically connect the package. The underside of the third section of the conductor frame can be used to thermally connect the package.

[0011] The package comprises a cavity. At least portions of the top surfaces of the first, second, and third sections of the conductor frame are exposed within the cavity. Advantageously, the cavity of this package can accommodate one or more semiconductor chips. The semiconductor chips can be electrically and thermally connected to the exposed top surfaces of the conductor frame sections within the cavity. The cavity can also be used to hold a potting compound to protect the semiconductor chips.

[0012] A first and a second part of the top surface of the first section are exposed within the cavity. A ridge of the housing covers an area of ​​the top surface of the first section between the first and second parts. Advantageously, the first and second parts of the top surface of the first section can each serve as independent bond wire pads for connecting bond wires. This allows the package to be used in several configurations.

[0013] An electronic component comprises a package of the aforementioned type and an electronic semiconductor chip arranged in the cavity on the top of the third section. Advantageously, the third section of the conductor frame of the package of this electronic component can serve as a thermal pad for dissipating heat generated in the electronic semiconductor chip during operation of the electronic component. The third section can be electrically isolated from the electrical contact pads of the electronic semiconductor chip.

[0014] In one embodiment of the electronic component, the electronic component comprises at least two electronic semiconductor chips arranged on the top surface of the third section. At least two of the electronic semiconductor chips are electrically connected in series to the first and second sections. Advantageously, the series connection allows the two electronic semiconductor chips to be operated with identical electrical currents.

[0015] In one embodiment of the electronic component, the electronic component comprises at least two electronic semiconductor chips arranged on the top surface of the third section. At least two of the electronic semiconductor chips are electrically connected in parallel to the first and second sections. Advantageously, this configuration allows the two electronic semiconductor chips to be driven with identical drive voltages.

[0016] An electronic arrangement comprises at least two electronic components of the aforementioned type. These electronic components can, for example, be light-emitting components. The electronic arrangement with at least two electronic components can then be designed to emit a large amount of light.

[0017] In one embodiment of the electronic arrangement, at least two of the electronic components are electrically connected in series. This makes it possible to control the two electronic components with identical drive currents.

[0018] In one embodiment of the electronic arrangement, at least two of the electronic components are electrically connected in a parallel circuit. This makes it possible to control the two electronic components with identical drive voltages.

[0019] The properties, features and advantages of this invention described above, as well as the manner in which they are achieved, will become clearer and more comprehensively understandable in connection with the following description of exemplary embodiments, which are explained in more detail in conjunction with the drawings in which they are schematically represented: Fig. Figure 1 shows a partially transparent view of the top side of a package; Fig. Figure 2 shows another view of the top of the package; Fig. Figure 3 shows a view of a subpage of the package; Fig. 4 shows an electronic component according to a first embodiment; Fig. 5 shows an electronic component according to a second embodiment; Fig. 6 shows an electronic component according to a third embodiment; Fig. 7 shows an electronic component according to a fourth embodiment; Fig. Figure 8 shows an electronic arrangement according to a first embodiment; and Fig. Figure 9 shows an electronic arrangement according to a second embodiment.

[0020] Fig. Figure 1 shows a schematic transparent top view of a package 10 for an electronic component. Fig. Figure 2 shows a schematic, non-transparent top view of Package 10. Fig. Figure 3 shows a schematic bottom view of Package 10.

[0021] Package 10 comprises a housing 100. The housing 100 includes a top 101 and a bottom 102, which faces the top 101. The housing 100 has a cavity 110 on its top 101.

[0022] The housing 100 comprises an electrically insulating material, for example, a plastic material. The housing 100 can be manufactured by molds, for example, by heat pressing or injection molding.

[0023] Package 10 also includes a ladder frame 200. The ladder frame 200 comprises a flat shape with a top 201 and a bottom 202, which is opposite the top 201.

[0024] The conductor frame 200 comprises an electrically conductive material, for example, a metal. The conductor frame 200 can, for example, be made of a sheet of metal.

[0025] The conductor frame 200 is at least partially embedded in the housing 100. The embedding of the conductor frame 200 in the housing 100 may have occurred during the manufacturing of the housing 100 by forming the housing 100 material around the conductor frame 200.

[0026] The conductor frame 200 is laterally divided into a first section 210, a second section 220, and a third section 230. The first section 210, the second section 220, and the third section 230 are each physically separated from one another, spaced apart by a gap 203, and electrically insulated from each other. The first section 210, the second section 220, and the third section 230 of the conductor frame 200 are held in position by the housing 100.

[0027] The first section 210 comprises a top 211 and a bottom 212, which is opposite the top 211. The second section 220 comprises a top 221 and a bottom 222, which is opposite the top 221. The third section 230 comprises a top 231 and a bottom 232, which is opposite the top 231. The top 211 of the first section 210, the top 221 of the second section 220, and the top 231 of the third section 230 together form the top 201 of the ladder frame 200. The bottom 212 of the first section 210, the bottom 222 of the second section 220, and the bottom 232 of the third section 230 together form the bottom 202 of the ladder frame 200.

[0028] The first section 210 and the second section 220 of the ladder frame 200 each have the shape of the letter L. The first section 210 and the second section 220 are mirror images of each other. The third section 230 of the ladder frame 200 includes a first recess 233 and a second recess 234. The first recess 233 and the second recess 234 each have the shape of the letter L. The first section 210 of the ladder frame 200 is arranged in the first recess 233 of the third section 230. The second section 220 of the ladder frame 200 is arranged in the second recess 234 of the third section 230 of the ladder frame 200. The L-shaped first section 210 and the L-shaped second section 220 of the ladder frame 200 are each arranged at the corners of the ladder frame 200, so that each of the beams of the L-shape is aligned with outer edges of the ladder frame 200.The first section 210, the second section 220, and the third section 230 combine to form an approximately rectangular shape, in particular an approximately square shape. The entire ladder frame 200 is mirror-symmetrical with respect to a symmetry axis 204.

[0029] At least parts of the underside 212 of the first section 210, the underside 222 of the second section 220, and the underside 232 of the third section 230 of the conductor frame 200 are exposed on the underside 102 of the housing 100 of the package 10. In these exposed parts of the undersides 212, 222, 232, the undersides 212, 222, 232 of the first section 210, the second section 220, and the third section 230 are not covered by the material of the housing 100. It is advantageous that the entire undersides 212, 222, 232 of the first section 210, the second section 220, and the third section 230 are exposed on the underside 102 of the housing 100.

[0030] The exposed undersides 212, 222, 232 of sections 210, 220, 230 of the conductor frame 200 can be used to electrically and / or thermally connect the package 10. The package 10 can, for example, be designed as an SMD package for mounting on a surface using a surface mount technology process, such as reflow soldering.

[0031] Parts of the top surface 211 of the first section 210, the top surface 221 of the second section 220, and the top surface 231 of the third section 230 of the conductor frame 200 are exposed in the cavity 110 on the top surface 101 of the housing 100 of the package 10. The exposed parts of the top surfaces 211, 221, 231 of the first section 210, the second section 220, and the third section 230 are not covered by the material of the housing 100. Other parts of the top surfaces 211, 221, 231 of the sections 210, 220, 230 of the conductor frame 200 are covered by the material of the housing 100.

[0032] A first part 213 and a second part 214 of the top surface 211 of the first section 210 are exposed in the cavity 110 on the top surface 101 of the case 100. A bridge 120 formed from the material of the case 100 covers an area of ​​the top surface 211 of the first section 210 between the first part 213 and the second part 214 of the top surface 211 of the first section 210, thus separating the first part 213 from the second part 214 of the top surface 211 of the first section 210. Accordingly, a first part 223 and a second part 224 of the top surface 221 of the second section 220 are exposed in the cavity 110 on the top surface 101 of the case 100. The bridge 120 covers an area of ​​the upper surface 221 of the second section 210 between the first part 223 and the second part 224 and separates the first part 223 from the second part 224.

[0033] In the Fig. In the example shown in Figures 1 to 3, the third section 230 covers a larger area than the first section 210 and the second section 220 of the ladder frame 200. Specifically, the bottom surface 232 of the third section 230 is larger than the bottom surface 212 of the first section 210 and larger than the bottom surface 222 of the second section 220. The bottom surface 232 of the third section 230 is even larger than the sum of the areas of the bottom surface 212 of the first section 210 and the bottom surface 222 of the second section 220. However, it is possible to design the sections 210, 220, and 230 of the ladder frame 200 with different areas.

[0034] Fig. Figure 4 shows a schematic top view of an electronic component 20. The electronic component 20 can be an optoelectronic component. The electronic component 20 can be designed to emit electromagnetic radiation, for example, visible light.

[0035] The electronic component 20 includes the in Fig. Package 10 is shown in Figures 1 to 3. Additionally, the electronic component 20 comprises a plurality of electronic semiconductor chips 300, namely a first electronic semiconductor chip 300, 301, a second electronic semiconductor chip 300, 302, a third electronic semiconductor chip 300, 303, and a fourth electronic semiconductor chip 300, 304. The electronic semiconductor chips 300 can be optoelectronic semiconductor chips designed to emit electromagnetic radiation, for example, visible light. The electronic semiconductor chips 300 can, for example, be light-emitting diode chips (LED chips).

[0036] Each electronic semiconductor chip 300 comprises a first contact pad 310 and a second contact pad 320. In the Fig. In the example shown in Figure 4, the contact pads 310 and 320 are arranged near the corners of the rectangular top surfaces of the electronic semiconductor chips 300. However, the contact pads 310 and 320 can also be arranged at other positions on the electronic semiconductor chips 300.

[0037] The electronic semiconductor chips 300 are arranged in the cavity 110 of the housing 100 of the package 10 on the exposed part of the top surface 231 of the third section 230 of the conductor frame 200 of the package 10. The electronic semiconductor chips 300 are arranged such that their undersides face the top surface 231 of the third section 230 of the conductor frame 200 and are connected to it. The electronic semiconductor chips 300 can be connected, for example, with solder or adhesive.

[0038] The electronic semiconductor chips 300 of the electronic component 20 are electrically connected in series with bond wires 330 to the first section 210 and the second section 220 of the conductor frame 200 of the package 10. A first bond wire 330 extends from the first part 213 of the top 211 of the first section 210 of the conductor frame 200 to the first contact pad 310 of the first electronic semiconductor chip 300, 301, in order to electrically connect the first section 210 of the conductor frame 200 to the first contact pad 310 of the first electronic semiconductor chip 300, 301. A second bond wire 330 connects the second contact pad 320 of the first electronic semiconductor chip 300, 301 to the first contact pad 310 of the second electronic semiconductor chip 300, 302. A third bond wire 330 connects the second contact pad 320 of the second electronic semiconductor chip 300, 302 to the first contact pad 310 of the third electronic semiconductor chip 300, 303.A fourth bond wire 330 connects the second contact pad 320 of the third electronic semiconductor chip 300, 303 to the first contact pad 310 of the fourth electronic semiconductor chip 300, 304. A fifth bond wire 330 electrically connects the second contact pad 320 of the fourth electronic semiconductor chip 300, 304 to the first part 223 of the top 221 of the second section 220 of the conductor frame 200.

[0039] The electronic component 20 can be electrically contacted via the underside 212 of the first section 210 of the conductor frame 200 of the package 10 and the underside 222 of the second section 220 of the conductor frame 200 of the package 10. Additionally, the electronic component 20 can be thermally contacted via the underside 232 of the third section 230 of the conductor frame 200 of the package 10. Heat generated by the electronic semiconductor chips 300 of the electronic component 20 can be dissipated through the third section 230 of the conductor frame 200.

[0040] Fig. Figure 5 shows a schematic top view of the electronic component 20 according to a second embodiment. The second embodiment of the electronic component 20 is similar to the first embodiment of the electronic component 20, which is shown in Fig. Figure 4 is shown. The following describes only the differences between the second embodiment of the electronic component 20 and the first embodiment of the electronic component 20.

[0041] In the second embodiment of the electronic component 20, the electronic semiconductor chips 300 are divided into two groups. The first electronic semiconductor chip 300, 301 and the fourth electronic semiconductor chip 300, 304 are arranged in a first series connection. The second electronic semiconductor chip 300, 302 and the third electronic semiconductor chip 300, 303 are arranged in a second series connection, which is connected in parallel to the first series connection of the first electronic semiconductor chip 300, 301 and the fourth electronic semiconductor chip 300, 304.

[0042] The first contact pad 310 of the first electronic semiconductor chip 300, 301 is connected to the first part 213 of the top surface 211 of the first section 210 of the conductor frame 200. The second contact pad 320 of the first electronic semiconductor chip 300, 301 is connected to the first contact pad 310 of the fourth electronic semiconductor chip 300, 304. The second contact pad 320 of the fourth electronic semiconductor chip 300, 304 is connected to the first part 223 of the top surface 221 of the second section 220 of the conductor frame 200. The first contact pad 310 of the second electronic semiconductor chip 300, 302 is electrically connected to the second part 214 of the top surface 211 of the first section 210 of the conductor frame 200. The second contact pad 320 of the second electronic semiconductor chip 300, 302 is connected to the first contact pad 310 of the third electronic semiconductor chip 300, 303.The second contact pad 320 of the third electronic semiconductor chip 300, 303 is electrically connected to the second part 224 of the top 221 of the second section 220 of the conductor frame 200.

[0043] Fig. Figure 6 shows a schematic top view of the electronic component 20 according to a third embodiment. The third embodiment of the electronic component 20 is similar to the first embodiment of the electronic component 20, which is shown in Fig. Figure 4 is shown. The following describes only the differences between the third embodiment of the electronic component 20 and the first embodiment of the electronic component 20.

[0044] The third embodiment of the electronic component 20 comprises sixteen electronic semiconductor chips 300 arranged on the top surface 231 of the third section 230 of the conductor frame 200 in the cavity 110 of the housing 100 of the package 10. The sixteen electronic semiconductor chips 300 are electrically connected in series to the first section 210 and the second section 220 of the conductor frame 200.

[0045] Fig. Figure 7 shows a schematic top view of the electronic component 20 according to a fourth embodiment. The fourth embodiment of the electronic component 20 is similar to the second embodiment of the electronic component 20, which is described in Fig. Figure 5 is shown. The following describes only the differences between the fourth embodiment of the electronic component 20 and the second embodiment of the electronic component 20.

[0046] In the fourth embodiment, the electronic component 20 comprises sixteen electronic semiconductor chips 300, which are arranged on the top surface 231 of the third section 230 of the conductor frame 200 in the cavity 110 of the housing 100 of the package 10. The sixteen electronic semiconductor chips 300 are divided into two groups. In each group, the electronic semiconductor chips 300 are arranged in series. The two groups of electronic semiconductor chips 300 are connected in parallel to the first section 210 and the second section 220 of the conductor frame 200 of the package 10.

[0047] The first group is electrically connected to the first part 213 of the top surface 211 of the first section 210 and to the first part 223 of the top surface 221 of the second section 220. The second group is electrically connected to the second part 214 of the top surface 211 of the first section 210 and to the second part 224 of the top surface 221 of the second section 220.

[0048] In other embodiments, the electronic component 20 may comprise only one electronic semiconductor chip 300 or a different number of electronic semiconductor chips 300. The electronic semiconductor chips 300 may be arranged in any combination of series and parallel connections.

[0049] Fig. Figure 8 shows a schematic top view of an electronic arrangement 30. The electronic arrangement 30 comprises nine electronic components 20 according to one of the embodiments, which in conjunction with Fig. Sections 4 to 7 describe the electronic components 20. The electronic components 20 are arranged in a regular grid pattern of three rows and three columns. The electronic components 20 are electrically connected in series via conductive connections 340. The conductive connections 340 can, for example, be configured as conductive paths arranged on a carrier on which the electronic components 20 are mounted. In the series connection of the electronic components 20, the second contact pad 320 of each electronic component 20 is electrically connected to the first contact pad 310 of the subsequent electronic component 20 via one of the conductive connections 340. The first contact pad 310 of the first electronic component 20 and the second contact pad 320 of the last electronic component 20 in the series are electrically connected to external anode and cathode connections.

[0050] Fig. Figure 9 shows a schematic top view of the electronic arrangement 30 according to a second embodiment. The second embodiment of the electronic arrangement 30 is similar to the first embodiment of the electronic arrangement 30, which is shown in Fig. Figure 8 is shown. The following describes only the differences between the second embodiment of the electronic arrangement 30 and the first embodiment of the electronic arrangement 30.

[0051] In the second embodiment of the electronic arrangement 30, the nine electronic components 20 are divided into three groups of three electronic components 20 each. In each group, the three electronic components 20 are electrically connected in series. The three groups of series-connected electronic components 20 are electrically connected in parallel.

[0052] It is possible to construct electronic arrangements comprising a varying number of electronic components 20. For example, an electronic arrangement 30 can comprise only one electronic component 20, two electronic components 20, or any other number of electronic components 20. The electronic components 20 of an electronic arrangement 30 can be electrically connected in any combination of series and parallel connections.

Claims

[1] Package (10) for an electronic component (20) comprising a housing (100) and a conductor frame (200) embedded in the housing (100), wherein the conductor frame (200) comprises a first section (210), a second section (220) and a third section (230) which are electrically insulated from each other, wherein the first section (210) and the second section (220) each have an L-shape, wherein the housing (100) comprises a cavity (110), wherein at least parts of the top surfaces (211, 221, 231) of the first section (210), the second section (220) and the third section (230) of the conductor frame (200) are exposed in the cavity (110), wherein a first part (213) and a second part (214) of the upper surface (211) of the first section (210) are exposed in the cavity (110), wherein a bridge (120) of the case (100) covers an area of ​​the top (211) of the first section (210) between the first part (213) and the second part (214). [2] Package (10) according to claim 1, wherein the first section (210) and the second section (220) are mirror symmetric to each other. [3] Package (10) according to claim 2, wherein the conductor frame (200) is mirror-symmetric. [4] Package (10) according to one of the preceding claims, wherein the third section (230) comprises a first recess (233) and a second recess (234), wherein the first recess (233) and the second recess (234) each have an L-shape, wherein the first section (210) is arranged in the first recess (233) and the second section (220) is arranged in the second recess (234). [5] Package (10) according to one of the preceding claims, wherein at least parts of the undersides (212, 222, 232) of the first section (210), the second section (220) and the third section (230) of the conductor frame (200) are exposed on an underside (102) of the housing (100). [6] Electronic component (20) comprising a package (10) according to any one of the preceding claims, and an electronic semiconductor chip (300) arranged in the cavity (110) on the top (231) of the third section (230). [7] Electronic component (20) according to claim 6, wherein the electronic component (20) comprises at least two electronic semiconductor chips (300) arranged on the top surface (231) of the third section (230), wherein at least two of the electronic semiconductor chips (300) are electrically connected in a series circuit to the first section (210) and the second section (220). [8] Electronic component (20) according to one of claims 6 and 7, wherein the electronic component (20) comprises at least two electronic semiconductor chips (300) arranged on the top surface (231) of the third section (230), wherein at least two of the electronic semiconductor chips (300) are electrically connected in a parallel circuit to the first section (210) and the second section (220). [9] Electronic arrangement (30) comprising at least two electronic components (20) according to any one of claims 6 to 8. [10] Electronic arrangement (30) according to claim 9, wherein at least two of the electronic components (20) are electrically connected in a series circuit. [11] Electronic arrangement (30) according to one of claims 9 and 10, wherein at least two of the electronic components (20) are electrically connected in a parallel circuit.

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