Semiconductor device, inverter device and vehicle

Abstract

Semiconductor device, exhibiting: - a semiconductor element (14, 14a, 14b); - a heat transfer base plate (11) provided under the semiconductor element (14, 14a, 14b); - a lamellar part (16) having a plurality of projecting parts which are connected to a lower surface of the heat transfer base plate (11); - a cooling component (17) that covers the finned part (16) and is connected to an inlet (17a) through which a coolant flowing towards the finned part (16) flows in, and an outlet (17b) through which a coolant flowing from the finned part (16) flows out; - a distributor (18) which is a water storage chamber which is provided between the inlet (17a) and the finned part (16) and is separated from the finned part (16) so that it is suitable to allow the coolant to flow from the inlet (17a) to the finned part (16), - a water flow control component (19, 24) that is connected to the finned part (16) or the heat transfer base plate (11) and separates the distributor (18) and the finned part (16) so that it is suitable to allow the coolant to flow from the distributor (18) to the finned part (16), and - an outer circumferential frame (22) which is connected to a lower surface of the heat transfer base plate (11) and surrounds a periphery of the finned part (16), where: - the water flow control component (19, 24) has a water flow control plate (19) which has an upper surface connected to the outer perimeter frame (22) and the finned part (16) and a lower surface connected to the cooling component (17); - the distributor (18) is formed by the water flow control plate (19) and the cooling component (17); - the water flow control plate (19) has a slot (23a) suitable for allowing the coolant to flow from the distributor (18) to the finned part (16); and - an area of ​​the water flow control plate (19) is larger than any area of ​​a part that is surrounded in a plan view by the outer perimeter frame (22) and an area of ​​a part that is surrounded in a plan view by an outer perimeter part of the cooling component (17).

Description

Technical field

[0001] The present invention relates to a semiconductor device, an inverter device and a vehicle comprising the semiconductor device. State of the art

[0002] Semiconductor devices constantly require reductions in size and weight. To achieve this size reduction, an efficient cooling system for the semiconductor element is essential. In particular, the development of a direct cooling system has been advanced, in which a semiconductor element is directly connected to a cooling fin for direct cooling. Specifically, the development of a semiconductor device with an integrated fin (e.g., patent document 1) and a semiconductor device with an integrated fin and integrated cooler (e.g., patent documents 2 to 5) has been actively pursued. State-of-the-art documents, patent documents Patent document 1: Published Japanese patent application JP 1999-204700A Patent document 2: Japanese patent JP 4 600 199 B2 Patent document 3: Published Japanese patent application JP 2014-082311A Patent document 4: published Japanese patent application JP 1999-297906A Patent document 5: published Japanese patent application JP 2007-141872A

[0003] JP 2011-166 113 A discloses a cooling device designed to suppress spatial variations in cooling performance. The device comprises two or more heat sinks and circulates a refrigerant within an area where heat sinks are provided. A base unit includes two or more heat sinks whose sides contact a surface of the heat sink assembly and are aligned in a straight line along the thickness direction. A semiconductor element is connected to the heat sink assembly surface of a base unit board via an insulating layer on an opposing plate surface. A nozzle plate, covering an opening in the area enclosed by a base unit wall, is attached to the base unit. The nozzle plate has a refrigerant supply hole.The refrigerant supply hole is shaped to extend in the direction where two or more heat sinks are arranged in a line, so that the opening covers the area between two or more heat sinks. The refrigerant supply hole delivers refrigerant in the short lateral direction of the heat sinks. A refrigerant guide wall is provided to direct the refrigerant discharged from the area between the heat sinks to the nozzle plate.

[0004] JP S64-71156A relates to a cooling system configured to balance the flow of a coolant and maintain the entire surface area of ​​a chip at a constant temperature. This is achieved by arranging longitudinal slots that span the entire width of a row of trenches in a direction orthogonal to the row on one side of the bellows of both sections of the trench row, and by installing coolant-fluid diffusion chambers between the slots and bellows. A cooling structure is connected to each heating element chip, which is arranged in multiples on a substrate. The other ends of two flexible bellows are mounted to a coolant collector or distributor. Coolant flows into the structure from the bellows side and exits the structure on the bellows side.A trench-array circuit board is constructed in which eight parallel rows of trenches are formed on the surface of a heating element chip. Longitudinal slots, spanning the entire width of the eight trench rows, are arranged orthogonally to the eight rows on the side of the bellows at both ends of the eight trench rows. Refrigerant fluid diffusion chambers are installed between the slots and the bellows. This ensures a balanced flow of the coolant, thereby maintaining a constant temperature across the entire surface of the chip.

[0005] US 2015 / 0258645A1 describes heat transfer devices comprising a first housing with at least one inlet opening, a second housing with a base plate and one or more partitions for forming channels, wherein at least one inner surface of each channel has rib structures to generate turbulence in a fluid flow therein, and a jet plate connecting the first housing and the second housing, having impact jets that convey fluid from the first housing to the channels, wherein the impact jets are set at an angular deviation from the normal to cause local acceleration of the fluid and increase local heat transfer.

[0006] US Patent 2001 / 0020365A1 discloses a refrigeration system that allows the refrigerant to circulate through a closed channel. A dry evaporator is installed in the circulation channel. The dry evaporator is designed to maintain a refrigerant quality of less than 1.0 during evaporation. The amount of heat transferred per unit area, namely the heat transfer coefficient, depends on the refrigerant quality. The heat transfer coefficient drops significantly if the refrigerant quality exceeds a predetermined threshold before it actually reaches 1.0. Maintaining the refrigerant quality below the predetermined threshold during evaporation in the dry evaporator allows for the reliable setting of a higher cooling capacity.Conversely, if a refrigerant in a dry evaporator evaporates completely in the conventional manner, the refrigerant's heat transfer coefficient drops noticeably once its quality exceeds the predetermined threshold. Consequently, the conventional dry evaporator is forced to absorb heat with a lower heat transfer coefficient compared to the dry evaporator presented here. Summary Problem to be solved by the invention

[0007] As a state-of-the-art semiconductor device with an integrated fin and integrated cooler, many proposals have been made for a design in which cooling water comes into direct contact with a fin. However, in such a design, the cooling water encounters the fin and flows through it unevenly, which poses the problem that the semiconductor element cannot be cooled uniformly.

[0008] Accordingly, the present invention was made in view of such problems as described above, and has the objective of providing a technology suitable for improving the cooling capacity of a semiconductor device. Means to solve the problem

[0009] The problem underlying the invention is solved according to the invention in a semiconductor device by the features of claim 1 and alternatively by the features of claim 2, in an inverter device by the features of claim 8, and in a vehicle by the features of claim 9. Advantageous embodiments are the subject of the respective dependent claims.

[0010] A semiconductor device according to the present invention comprises a semiconductor element, a heat transfer base plate provided below the semiconductor element, a finned part having a plurality of projecting parts connected to a lower surface of the heat transfer base plate, a cooling element covering the finned part and connected to an inlet through which a coolant flowing to the finned part flows in, and an outlet through which the coolant flowing from the finned part flows out, and a distributor which is a water storage chamber provided between the inlet and the finned part and separated from the finned part so that it is suitable to allow a coolant to flow from the inlet to the finned part. Effects of the invention

[0011] According to the present invention, a distributor is provided which includes a water storage chamber located between the inlet and the finned section and separated from the finned section, thus enabling the coolant to flow from the inlet to the finned section. This ensures that the coolant flowing from the distributor to the finned section meets the finned section in a uniform flow state, thereby improving cooling performance.

[0012] The object, features, aspects and advantages of the present invention will become more apparent with the following detailed description and the attached drawings. Brief description of the drawings Fig. Figure 1 is a cross-sectional view showing an arrangement of a semiconductor device according to a first embodiment to illustrate the technical background of the present invention. Fig. Figure 2 is a top view showing a partial arrangement of the semiconductor device according to the first embodiment for the purpose of explaining the technical background of the present invention. Fig. Figure 3 is a cross-sectional view showing an arrangement of the semiconductor device according to a second embodiment according to the invention. Fig. Figure 4 is a top view showing a partial arrangement of the semiconductor device according to the second embodiment of the invention. Fig. Figure 5 is a cross-sectional view showing an arrangement of the semiconductor device according to a third embodiment to illustrate the technical background of the present invention. Fig. Figure 6 is a top view showing a partial arrangement of the semiconductor device according to the third embodiment for the purpose of explaining the technical background of the present invention. Fig. Figure 7 is a cross-sectional view showing an arrangement of the semiconductor device according to a fourth embodiment to illustrate the technical background of the present invention. Fig. Figure 8 is a top view showing a partial arrangement of the semiconductor device according to the fourth embodiment for the purpose of explaining the technical background of the present invention. Fig. Figure 9 is a cross-sectional view showing an arrangement of the semiconductor device according to a fifth embodiment of the invention. Fig. Figure 10 is a bottom view showing a partial arrangement of the semiconductor device according to the fifth embodiment of the invention. Fig. Figure 11 is a cross-sectional view showing an arrangement of the semiconductor device according to a sixth embodiment to explain the technical background of the present invention. Fig. Figure 12 is a top view showing a partial arrangement of the semiconductor device according to the sixth embodiment for the purpose of explaining the technical background of the present invention. Description of the embodiments

[0013] A description of embodiments of the invention and their technical background will now be given with reference to the attached drawings. It should be noted that the drawings are schematic, and the relationship between the size and position of components shown in each of the different drawings is not necessarily accurate and may have been modified accordingly. <Erste Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0014] Fig. Figure 1 is a cross-sectional view showing an arrangement of a semiconductor device (module with integrated cooler) according to a first embodiment to illustrate the technical background of the present invention. The semiconductor device of Fig. 1 comprises a heat transfer base plate 11, conductive patterns 12a and 12b, an insulating substrate 13, which is an insulating component, a semiconductor element 14, connecting components 15, a finned part 16, a cooling component 17, a distributor 18, which is a water storage chamber, and a water flow control plate 19, which is a water flow control component. Among the foregoing, the finned part 16, the cooling component 17, the distributor 18, and the water flow control plate 19 form a cooler, which cools the semiconductor element 14 using cooling water (coolant). It should be noted that in Fig. 1. The direction in which the cooling water flows within the radiator is shown by arrows.

[0015] Next, a detailed description of each component of the semiconductor device will be provided. Fig. 1 given.

[0016] The heat transfer base plate 11 is made of a metal plate (conductive plate), for example, made of Al (aluminum), Cu (copper), or the like. The size of the heat transfer base plate 11 is, for example, approximately 80 mm × 80 mm, and its thickness is, for example, approximately 2 mm to 4 mm. An upper surface of the heat transfer base plate 11 serves as a mounting surface to which the semiconductor element 14 and the like are to be attached, and a lower surface of the heat transfer base plate 11 serves as a heat dissipation surface, which is to be cooled by a heat sink.

[0017] The conductive patterns 12a and 12b are each attached to a lower and an upper surface of the insulating substrate 13, and a lower surface of the conductive pattern 12a and the upper surface of the heat transfer base plate 11 are connected by a connecting element (not shown). The conductive patterns 12a and 12b are made, for example, of Al, Cu, or the like; the insulating substrate 13 is made, for example, of Al₂ (aluminum nitride), Si₃N₄ (where Si is silicon and N is nitrogen), or the like; and the connecting element is made, for example, of Ag (silver) or the like. It should be noted that, according to this first embodiment, the thickness of the insulating substrate 13 is set to be approximately 0.32 mm to 1 mm for the purpose of explaining the technical background of the present invention.However, it is desirable that the thickness be as thin as possible, taking into account a reduction in the thermal resistance of the insulating substrate 13.

[0018] The semiconductor element 14 is connected to an upper surface of the conductive pattern 12b by means of the connecting components 15, for example made of silver or the like. The heat transfer base plate 11 described above is thus provided beneath the semiconductor element 14.

[0019] It should be noted that in this first embodiment, for the purpose of explaining the technical background of the present invention, a description is given assuming that the semiconductor element 14 is formed from a wide-bandgap semiconductor exhibiting high thermal resistance, which consists, for example, of SiC (silicon carbide), GaN (gallium nitride), or the like, but is not limited to these materials, and can also consist of Si (silicon). It should be noted that if a wide-bandgap semiconductor is used as the semiconductor element 14, the size of the semiconductor device can be reduced.

[0020] Furthermore, in this first embodiment, for the purpose of explaining the technical background of the present invention, the semiconductor element 14 comprises a first semiconductor element 14a and a second semiconductor element 14b, but the number of semiconductor elements 14 is not limited thereto. Additionally, to protect the semiconductor element 14, a housing or a casting resin for covering components located above the heat transfer base plate 11 (e.g., the semiconductor element 14) can be provided in the semiconductor device.

[0021] The finned section 16 is connected to a lower surface of the heat transfer base plate 11. The finned section 16 has a plurality of protruding parts for improving its cooling capacity, and at least one of these protruding parts consists of a pin fin, a plate fin (e.g., a straight fin and a corrugated fin), and a conical fin. It should be noted that in an arrangement using a pin fin as the protruding parts, the heat dissipation capacity of the finned section 16 can be improved. Furthermore, in an arrangement using a plate fin as the protruding parts, the heat dissipation capacity can be improved and the pressure drop can be further reduced compared to a pin fin.

[0022] The cooling element 17 covers the finned part 16, and an upper part of the cooling element 17 is connected to the lower surface of the heat transfer base plate 11. According to the cooling element 17, as described above, cooling water can be trapped in the periphery of the finned part 16.

[0023] The cooling element 17 is connected to an inlet 17a, through which cooling water flows into the finned part 16, and an outlet 17b, through which cooling water flows out of the finned part 16. In this first embodiment, for the purpose of explaining the technical background of the present invention, both the inlet 17a and the outlet 17b are located below the finned part 16.

[0024] The distributor 18 is a water storage chamber located between the inlet 17a and the finned section 16, and separated from the finned section 16, thus enabling cooling water to flow from the inlet 17a to the finned section 16. In this first embodiment, intended to illustrate the technical background of the present invention, a water storage chamber 20 similar to the distributor 18 is provided between the finned section 16 and the outlet 17b. The water storage chamber 20 is separated from the finned section 16, thus enabling cooling water to flow from the finned section 16 to the outlet 17b. It should be noted that the water storage chamber 20 is not necessarily required and, for example, is omitted in the fifth and sixth embodiments of the invention, which are described below to illustrate the technical background of the present invention.

[0025] An upper surface of the water flow control plate 19 is connected to a lower part of the finned section 16. The water flow control plate 19 separates the distributor 18 and the finned section 16, thus enabling cooling water to flow from the distributor 18 to the finned section 16. Similarly, the water flow control plate 19 separates the finned section 16 and the water storage chamber 20, thus enabling cooling water to flow from the finned section 16 to the water storage chamber 20.

[0026] Here, the area of ​​the water flow control plate 19 is smaller than the base area of ​​the cooling component 17, and the aforementioned cooling component 17 also covers the water flow control plate 19 in addition to the finned part 16. Thus, the distributor 18 and the water storage chamber 20 are formed by the water flow control plate 19 and the cooling component 17.

[0027] Fig. Figure 2 is a top view showing a partial arrangement of the semiconductor device (mainly the cooling element 17 and the water flow control plate 19) according to this first embodiment for the purpose of explaining the technical background of the present invention. It should be noted that in Fig. 2 the inlet 17a, the outlet 17b and part of the cooling component 17 are shown by dashed lines (the same applies in Fig. 4, Fig. 6, Fig. 8, Fig. 10 and Fig. 12). Further details are in Fig. 2 shows an x-axis and a y-axis.

[0028] As in Fig. As shown in Figure 2, a gap 21a, which allows cooling water to flow from the distributor 18 to the finned section 16, is formed between an -x-side end part of the water flow control plate 19 and an inner surface of the cooling element 17. According to this arrangement, the distributor 18 and the finned section 16 are separated only by the gap 21a. That is, the distributor 18 and the finned section 16 are essentially separated, and therefore it is essentially prevented that cooling water flowing in from the inlet 17a directly impacts the finned section 16.

[0029] Furthermore, as in Fig. As shown in Figure 2, the width of the distributor 18 in the y-direction is greater than the width of the inlet 17a in the y-direction. Therefore, with respect to the flow direction of the cooling water, the cross-sectional area of ​​the distributor 18 is larger than the cross-sectional area of ​​the inlet 17a. Thus, the flow of cooling water entering from the inlet 17a can be slowed down in the distributor 18. That is, the cooling water entering from the inlet 17a can essentially be stored in the distributor 18.

[0030] It should be noted that in this first embodiment, for the purpose of explaining the technical background of the present invention, a gap 21b, which is suitable to allow the cooling water to flow from the finned part 16 to the water storage chamber 20, is also formed between a +x-side end part of the water flow control plate 19 and an inner surface of the cooling component 17. <Kernaussage der ersten Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung >

[0031] According to the arrangement of this first embodiment, which serves to explain the technical background of the present invention as described above, the distributor 18 is provided between the inlet 17a and the finned section 16. According to such an arrangement, cooling water flowing in through the inlet 17a can be substantially prevented from directly impacting the finned section 16 and can be stored essentially temporarily in the distributor 18. Thus, cooling water flowing from the distributor 18 to the finned section 16 reaches the finned section 16 in a uniform flow state, and therefore the cooling capacity (e.g., the uniformity and stability of the cooling) can be improved.

[0032] It should be noted that in a top view of Fig. 2. If the gap 21a and the inlet 17a are arranged so that they do not overlap, cooling water from the inlet 17a can be prevented from directly impacting the finned part 16. Even if the gap 21a and the inlet 17a are arranged so that they partially overlap, cooling water from the inlet 17a can still be prevented to a certain extent from directly impacting the finned part.

[0033] Further, as in Fig. 2, if the gap 21a and the gap 21b are each arranged such that they are close to one end part and another end part of the finned part 16, cooling water is circulated through the finned part 16, and therefore cooling capacity can be further improved.

[0034] Furthermore, in this first embodiment, to illustrate the technical background of the present invention, both the inlet 17a and the outlet 17b are provided below the lamella portion 16. This allows the crosswise size of the entire semiconductor device (module), i.e., the footprint of the entire semiconductor device (module), to be reduced, and therefore a reduction in the size of the semiconductor device (module) can be expected. It should be noted that even in an arrangement in which both the inlet 17a and the outlet 17b are provided below the lamella portion 16, the footprint of the entire semiconductor device (module) can be reduced to a certain extent.

[0035] Furthermore, in this first embodiment, to explain the technical background of the present invention, the water flow control plate 19 is provided, which separates the distributor 18 and the finned section 16, thus enabling the cooling water to flow from the distributor 18 to the finned section 16. This allows for a simple design of the distributor 18. <Zweite und erfindungsgemäße Ausführungsform>

[0036] Fig. Figure 3 is a cross-sectional view showing an arrangement of the semiconductor device (module with integrated cooler) according to a second and inventive embodiment of the present invention, and Fig. Figure 4 is a top view showing a partial arrangement of the semiconductor device. In the following description, components of the semiconductor device according to this second embodiment of the invention, which are the same as or similar to those of the first embodiment for the purpose of explaining the technical background of the present invention, are identified by the same reference numerals, and different components are mainly described.

[0037] The semiconductor device according to this second embodiment of the invention, in addition to the components of the first embodiment, has an outer lamella circumferential frame 22, which is an outer circumferential frame, to explain the technical background of the present invention.

[0038] The outer fin perimeter frame 22 is connected to the lower surface of the heat transfer base plate 11 and surrounds a periphery of the fin section 16. The height of the outer fin perimeter frame 22 is equal to the height of the fin section 16, and a lower portion of the outer fin perimeter frame 22 and a lower portion of the fin section 16 are connected to the water flow control plate 19. According to the outer fin perimeter frame 22, as described above, cooling water can be trapped in the periphery of the fin section 16. It should be noted that the material grade of the outer fin perimeter frame 22 can be the same as the material grade of the fin section 16.

[0039] The upper surface of the water flow control plate 19 is connected to the outer fin perimeter frame 22 and the fin section 16, and a lower surface of the water flow control plate 19 is connected to an upper part of the cooling element 17. Thus, the distributor 18 and the water storage chamber 20 are formed by the water flow control plate 19 and the cooling element 17.

[0040] The water flow control plate 19 has a slot 23a, which allows cooling water to flow from the distributor 18 to the finned section 16, and a slot 23b, which allows cooling water to flow from the finned section 16 to the water storage chamber 20. It should be noted that the slots 23a and 23b are each positioned close to one end and the other end of the finned section 16.

[0041] Furthermore, the area of ​​the water flow control plate 19 is larger than any area of ​​a part that is surrounded in a plan view by the outer fin circumferential frame 22, and of an area of ​​a part that is surrounded in a plan view by an outer circumferential part (upper part) of the cooling component 17. <Kernaussage der zweiten erfindungsgemäßen Ausführungsform>

[0042] According to this second embodiment of the invention, as described above, the distributor 18 is provided similarly to the first embodiment, for the purposes of explaining the technical background of the present invention. For this reason, according to this second embodiment of the invention, cooling water flowing from the distributor 18 to the finned part 16 reaches the finned part 16 in a uniform flow state, and therefore the cooling capacity (e.g., uniformity and stability of the cooling) can be improved.

[0043] Furthermore, in this second embodiment of the invention, the area of ​​the water flow control plate 19 is larger than either the area of ​​the part surrounded in a top view by the outer fin circumferential frame 22 or the area of ​​the part surrounded in a top view by the outer circumferential part of the cooling element 17. This eliminates a gap between the water flow control plate 19 and the cooling element 17 in one surface direction. As a result, the fin part 16, and consequently the semiconductor element 14, can be cooled more efficiently, and therefore the cooling capacity can be further improved. <Dritte Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0044] Fig. Figure 5 is a cross-sectional view showing an arrangement of the semiconductor device (module with integrated cooler) according to a third embodiment to illustrate the technical background of the present invention, and Fig. Figure 6 is a top view showing a partial arrangement of the semiconductor device. In the following description, components of the semiconductor device according to this third embodiment, which are the same as or similar to those of the first embodiment for the purpose of explaining the technical background of the present invention, are identified by the same reference numerals, and different components are mainly described.

[0045] In the second embodiment according to the invention, the outer lamella perimeter frame 22 is provided. In this third embodiment, for the purpose of explaining the technical background of the present invention, however, an end part 19a of the water flow control plate 19 is used instead of the outer lamella perimeter frame 22.

[0046] In particular, in this third embodiment, to explain the technical background of the present invention, the upper surface of the water flow control plate 19 is connected to the finned part 16, and the lower surface of the water flow control plate 19 is connected to an upper part of the cooling element 17. Thus, the distributor 18 and the water storage chamber 20 are formed by the water flow control plate 19 and the cooling element 17.

[0047] The water flow control plate 19 has a slot 23a, which allows cooling water to flow from the distributor 18 to the finned section 16, and a slot 23b, which allows cooling water to flow from the finned section 16 to the water storage chamber 20. It should be noted that slots 23a and 23b are each positioned close to one end and another end of the finned section 16.

[0048] The area of ​​the water flow control plate 19 is larger than the area of ​​the part enclosed in a top view by the outer circumferential part (upper part) of the cooling element 17. Furthermore, the end part 19a of the water flow control plate 19 is bent towards the side of the heat transfer base plate 11, so that it is connected to the heat transfer base plate 11 and surrounds the periphery of the finned part 16. <Kernaussage der dritten Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0049] According to this third embodiment, which explains the technical background of the present invention as described above, the distributor 18 is provided similarly to the first embodiment, and therefore the cooling capacity (e.g., uniformity and stability of the cooling) can be improved similarly to the first embodiment. Furthermore, similar to the second embodiment according to the invention, a gap between the water flow control plate 19 and the cooling element 17 can be eliminated in one surface direction.

[0050] Additionally, in this third embodiment, to explain the technical background of the present invention, the end part 19a of the water flow control plate 19 is bent towards the side of the heat transfer base plate 11, so that it is connected to the heat transfer base plate 11 and surrounds the periphery of the fin part 16. This eliminates the need for the outer fin circumferential frame 22 described in the second embodiment of the invention, and therefore the number of components and the joining process can be reduced. <Vierte Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0051] Fig. Figure 7 is a cross-sectional view showing an arrangement of the semiconductor device (module with integrated cooler) according to a fourth embodiment for the purpose of explaining the technical background of the present invention, and Fig. Figure 8 is a top view showing a partial arrangement of the semiconductor device. In the following description, components of the semiconductor device according to this fourth embodiment, which are the same as or similar to those of the first embodiment for the purpose of explaining the technical background of the present invention, are identified by the same reference numerals, and different components are mainly described.

[0052] In the third embodiment, to explain the technical background of the present invention, the end part 19a ( Fig. 5) the water flow control plate 19 is used instead of the outer lamella perimeter frame 22. However, in this fourth embodiment, for the purpose of explaining the technical background of the present invention, an end part 11a ( Fig. 8) the heat transfer base plate 11 is used instead of the outer fin perimeter frame 22.

[0053] In particular, in this fourth embodiment, to explain the technical background of the present invention, the upper surface of the water flow control plate 19 is connected to the finned part 16, and the lower surface of the water flow control plate 19 is connected to an upper part of the cooling element 17. Thus, the distributor 18 and the water storage chamber 20 are formed by the water flow control plate 19 and the cooling element 17.

[0054] The water flow control plate 19 has a slot 23a, which allows cooling water to flow from the distributor 18 to the finned section 16, and a slot 23b, which allows cooling water to flow from the finned section 16 to the water storage chamber 20. It should be noted that slots 23a and 23b are each positioned close to one end and another end of the finned section 16.

[0055] The area of ​​the water flow control plate 19 is larger than the area of ​​the part that, in a top view, is surrounded by the outer circumferential part (upper part) of the cooling element 17. Furthermore, the end part 11a of the heat transfer base plate 11 is bent towards the side of the water flow control plate 19 so that it is connected to the water flow control plate 19 and surrounds the periphery of the finned part 16. <Kernaussage der vierten Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0056] According to this fourth embodiment, which explains the technical background of the present invention as described above, the distributor 18 is provided similarly to the first embodiment, and therefore the cooling capacity (e.g., uniformity and stability of the cooling) can be improved similarly to the first embodiment. Furthermore, similar to the second embodiment according to the invention, a gap between the water flow control plate 19 and the cooling element 17 can be eliminated in one surface direction.

[0057] Furthermore, in this fourth embodiment, to explain the technical background of the present invention, the end part 11a of the heat transfer base plate 11 is bent towards the side of the water flow control plate 19, so that it is connected to the water flow control plate 19 and surrounds the periphery of the lamella part 16. This eliminates the need for the outer lamella circumferential frame 22 described in the second embodiment, and therefore the number of components and the joining process can be reduced. <Fünfte und erfindungsgemäße Ausführungsform>

[0058] Fig. Figure 9 is a cross-sectional view showing an arrangement of the semiconductor device (module with integrated cooler) according to a fifth and inventive embodiment of the present invention, and Fig. Figure 10 is a bottom view showing a partial arrangement of the semiconductor device. In the following description, components of the semiconductor device according to this fifth embodiment of the invention, which are the same as or similar to those of the first embodiment for the purpose of explaining the technical background of the present invention, are identified by the same reference numerals, and different components are mainly described.

[0059] In this fifth embodiment of the invention, the inlet 17a is provided below the heat transfer base plate 11. Water flow control components 24 are orthogonally connected to the lower surface of the heat transfer base plate 11, so that they surround an upper part 11b, which is part of the heat transfer base plate 11 and is positioned above the inlet 17a. Furthermore, a lower part of the water flow control component 24 is connected to a lower surface of the cooling component 17. Thus, the distributor 18 is formed by the upper part 11b, the water flow control components 24, and the cooling component 17.

[0060] It should be noted that the water flow control components 24 are formed from four extending parts, which extend essentially in a Y-shape in one surface direction of the heat transfer base plate 11. Furthermore, the four extending parts not only have a part for surrounding the distributor 18 (part corresponding to four sides of an essentially rectangular shape in Fig. 10 is formed) but also a part for circulating cooling water from the distributor 18 through the finned part 16 (part that essentially corresponds to diagonal lines of the heat transfer base plate 11 in Fig. 10 trained) on.

[0061] The finned part 16 is provided on a different part of the heat transfer base plate 11 than the upper part 11b. Conversely, the finned part 16 is omitted on the upper part 11b of the heat transfer base plate 11 (the distributor 18), or a finned part with a height lower than the finned part 16 (not shown) is provided.

[0062] In this fifth embodiment, when the semiconductor device is used, the heat generation according to the invention of the second semiconductor element 14b is greater than the heat generation of the first semiconductor element 14a. Furthermore, the water flow control components 24 have a first slot 25a, which allows the cooling water to flow from the distributor 18 to the finned section 16 located below the first semiconductor element 14a. The water flow control components 24 also have a second slot 25b, which allows the cooling water to flow from the distributor 18 to the finned section 16 located below the second semiconductor element 14b. The width of the second slot 25b is greater than the width of the first slot 25a. <Kernaussage der fünften erfindungsgemäßen Ausführungsform>

[0063] According to this fifth embodiment of the invention, as described above, the distributor 18 is provided similarly to the first embodiment to illustrate the technical background of the present invention, and therefore a cooling capacity (e.g. uniformity and stability of cooling) can be improved similarly to the first embodiment to illustrate the technical background of the present invention.

[0064] Furthermore, in the first to fourth embodiments, the distributor 18 is provided on a lower side with respect to the lamella part 16. In contrast, in this fifth embodiment of the invention, the distributor 18 is provided on a lateral side of the lamella part 16. This allows the size of the entire semiconductor device (module) to be reduced in the thickness direction, and therefore a reduction in the size of the semiconductor device (module) can be expected.

[0065] Furthermore, according to this fifth embodiment of the invention, the width of the second slot 25b, which corresponds to the second semiconductor element 14b, which has a comparatively high heat generation, is greater than the width of the first slot 25a, which corresponds to the first semiconductor element 14a, which has a comparatively low heat generation. According to such an arrangement, the cooling capacity on the side of the second semiconductor element 14b can be further improved by adjusting the width of the first and second slots 25a and 25b than the cooling capacity on the side of the first semiconductor element 14a, and therefore the cooling capacity with respect to the first and second semiconductor elements 14a and 14b can be appropriately designed.

[0066] For example, in a case where the semiconductor device according to this fifth embodiment of the invention is a hybrid module formed from an insulated-gate bipolar transistor (Si-IGBT) and a Schottky blocking diode (SiC-SBD), the SiC-SBD, which has a comparatively small amount of heat generation, is used as the first semiconductor element 14a, and the Si-IGBT, which has a comparatively large amount of heat generation, is used as the second semiconductor element 14b. In this case, the width of the second slot 25b of the Si-IGBT is larger than the width of the first slot 25a of the SiC-SBD, and therefore the cooling of the entire module can be adequately designed. <Sechste Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung >

[0067] Fig. Figure 11 is a cross-sectional view showing an arrangement of the semiconductor device (module with integrated cooler) according to a sixth embodiment for the purpose of explaining the technical background of the present invention, and Fig. Figure 12 is a top view showing a partial arrangement of the semiconductor device. In the following description, components of the semiconductor device according to this sixth embodiment, which are the same as or similar to those of the first embodiment for the purpose of explaining the technical background of the present invention, are identified by the same reference numerals, and different components are mainly described.

[0068] The semiconductor device according to this sixth embodiment, for the purpose of explaining the technical background of the present invention, does not include either the water flow control plate 19 or the water flow control components 24. Furthermore, the distributor 18 is provided outside the cooling element 17. In particular, the distributor 18 is provided between the inlet 17a and a lower surface of the cooling element 17, which is connected to the inlet 17a. A plurality of water passage holes 17c, suitable for allowing the cooling water to flow from the distributor 18 to the finned part 16, are also formed in the lower surface of the cooling element 17. <Kernaussage der sechsten Ausführungsform zur Erläuterung des technischen Hintergrunds der vorliegenden Erfindung>

[0069] According to this sixth embodiment, which explains the technical background of the present invention as described above, the distributor 18 is provided similarly to the first embodiment, which explains the technical background of the present invention, and therefore a cooling capacity (e.g. uniformity and stability of cooling) can be improved similarly to the first embodiment, which explains the technical background of the present invention.

[0070] Furthermore, in this sixth embodiment, to explain the technical background of the present invention, a plurality of water passage holes 17c, which are suitable for allowing the cooling water to flow from the distributor 18 to the finned part 16, are formed in the lower surface of the cooling element 17, which defines the distributor 18. According to such an arrangement, a desired area can preferably be cooled by providing the distributor 18 and the water passage holes 17c in the desired area. For example, the entire semiconductor device (module) can be effectively cooled by providing the distributor 18 and the water passage holes 17c under an area where the semiconductor element 14 exhibits high heat generation. <Modifizierte Beispiele>

[0071] In the foregoing, a high-strength material (Cu or an Al alloy) can be used for at least one of the heat transfer base plate 11 (first to sixth embodiments), the water flow control plate 19 (first to fourth embodiments), the outer fin circumferential frame 22 (second embodiment according to the invention), and the water flow control components 24 (sixth embodiment, for the purpose of explaining the technical background of the present invention). According to such an arrangement, a component made of a high-strength material can function as a support, and therefore the strength of the entire semiconductor device (module) can be improved. For this reason, a resin-based material that has comparatively low strength but is suitable for weight reduction can be used as a material for the cooling component 17.As a consequence, the semiconductor device (module) can be easily reduced in cost, weight, and size. In particular, if a resin with high insulating properties is used as the material for the cooling component 17, the insulation distance can be designed to be short compared to a prior art metallic counterexample component, and therefore the semiconductor device can be further reduced in size.

[0072] Furthermore, the finned section 16 and the heat transfer base plate 11 can be connected by a connecting element (not shown), for example, made of silver or the like. According to such an arrangement, components other than the finned section 16 can be generalized, and an optimal fin can be used in the finned section 16 for any given application. Accordingly, a semiconductor device can be realized that is suitable for providing adequate cooling according to a heat generation situation of the semiconductor element 14. It should be noted that in a case where such cooling is unnecessary, for example, a portion of the heat transfer base plate 11 can be machined to form the finned section 16.

[0073] Furthermore, the semiconductor device described above can be incorporated into an inverter device or can be incorporated into a vehicle (e.g., an engine control circuit in a vehicle capable of being driven by an engine). Thus, a semiconductor device with improved cooling capacity can be used as a semiconductor device in both an inverter device and a vehicle. Explanation of reference symbols

[0074] 11 Heat transfer base plate, 11b upper part, 14 Semiconductor element, 14a first semiconductor element, 14b second semiconductor element, 16 finned part, 17 cooling component, 17a inlet, 17b outlet, 17c water passage hole, 18 distributor, 19 water flow control plate, 22 outer fin perimeter frame, 23a slot, 24 water flow control component, 25a first slot, 25b second slot.

Claims

[1] Semiconductor device, exhibiting: - a semiconductor element (14, 14a, 14b); - a heat transfer base plate (11) provided under the semiconductor element (14, 14a, 14b); - a lamellar part (16) having a plurality of projecting parts which are connected to a lower surface of the heat transfer base plate (11); - a cooling component (17) that covers the finned part (16) and is connected to an inlet (17a) through which a coolant flowing towards the finned part (16) flows in, and an outlet (17b) through which a coolant flowing from the finned part (16) flows out; - a distributor (18) which is a water storage chamber which is provided between the inlet (17a) and the finned part (16) and is separated from the finned part (16) so that it is suitable to allow the coolant to flow from the inlet (17a) to the finned part (16), - a water flow control component (19, 24) that is connected to the finned part (16) or the heat transfer base plate (11) and separates the distributor (18) and the finned part (16) so that it is suitable to allow the coolant to flow from the distributor (18) to the finned part (16), and - an outer circumferential frame (22) which is connected to a lower surface of the heat transfer base plate (11) and surrounds a periphery of the finned part (16), where: - the water flow control component (19, 24) has a water flow control plate (19) which has an upper surface connected to the outer perimeter frame (22) and the finned part (16) and a lower surface connected to the cooling component (17); - the distributor (18) is formed by the water flow control plate (19) and the cooling component (17); - the water flow control plate (19) has a slot (23a) suitable for allowing the coolant to flow from the distributor (18) to the finned part (16); and - an area of ​​the water flow control plate (19) is larger than any area of ​​a part that is surrounded in a plan view by the outer perimeter frame (22) and an area of ​​a part that is surrounded in a plan view by an outer perimeter part of the cooling component (17). [2] Semiconductor device, exhibiting: - a first semiconductor element (14, 14a, 14b); - a heat transfer base plate (11) provided under the semiconductor element (14, 14a, 14b); - a lamellar part (16) having a plurality of projecting parts which are connected to a lower surface of the heat transfer base plate (11); - a cooling component (17) that covers the finned part (16) and is connected to an inlet (17a) through which a coolant flowing towards the finned part (16) flows in, and an outlet (17b) through which a coolant flowing from the finned part (16) flows out; - a distributor (18) which is a water storage chamber which is provided between the inlet (17a) and the finned part (16) and is separated from the finned part (16) so that it is suitable to allow the coolant to flow from the inlet (17a) to the finned part (16), and - a water flow control component (24) that is connected to the finned part (16) or the heat transfer base plate (11) and separates the distributor (18) and the finned part (16) so that it is suitable to allow the coolant to flow from the distributor (18) to the finned part (16), where: - the inlet (17a) is provided under the heat transfer base plate (11); - the water flow control component (24) is connected perpendicularly to a lower surface of the heat transfer base plate (11) so that it surrounds an upper part (11b) which is positioned above the inlet (17a) and is part of the heat transfer base plate (11); - the distributor (18) is formed by the upper part (11b) of the heat transfer base plate (11) positioned above the inlet (17a), the water flow control component (24) and the cooling component (17); - the finned part (16) is provided on a different part of the heat transfer base plate (11) than the upper part (11b) of the heat transfer base plate (11) and laterally outside of it and above the inlet (17a); and - in the upper part (11b) of the heat transfer base plate (11) and above the inlet (17a) (i) the finned part (16) is omitted or (ii) a finned part (16) is provided which has a height which is less than the finned part (16) which is provided laterally outside the upper part (11b) of the heat transfer base plate (11) and above the inlet (17a). [3] Semiconductor device according to claim 2, wherein: - the semiconductor device comprises the first semiconductor element (14, 14a) and a second semiconductor element (14, 14b), - the water flow control component (24) has a first slot (25a) suitable for allowing the coolant to flow from the distributor (18) to the finned part (16) provided below the first semiconductor element (14, 14a), and a second slot (25b) suitable for allowing the coolant to flow from the distributor (18) to the finned part (16) provided below the second semiconductor element (14, 14b), which has a greater heat generation than the first semiconductor element (14, 14a); and - the width of the second slot (25b) is greater than the width of the first slot (25a). [4] Semiconductor device according to claim 1, wherein: - at least one of the outer perimeter frame (22) and the water flow control plate (19) is made of Cu or an Al alloy; and - the cooling component (17) has a resin-based material. [5] Semiconductor device according to any one of claims 1 to 4, wherein the plurality of protruding parts of the lamella part (16) comprises at least one pin lamella and one plate lamella. [6] Semiconductor device according to any one of claims 1 to 4, wherein the semiconductor element (14, 14a, 14b) comprises a wide bandgap semiconductor. [7] Semiconductor device according to any one of claims 1 to 4, wherein the fin part (16) and the heat transfer base plate (11) are connected by a connecting part. [8] Inverter device comprising the semiconductor device according to any one of claims 1 to 4. [9] Vehicle comprising the semiconductor device according to any one of claims 1 to 4.

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