WIRE FIXING DEVICE AND SOLDERING PROCESS

Abstract

Fixing device, comprising: a base, a wire fixing device mounted on the base and designed for positioning and fixing a wire to be soldered to a printed circuit board, the wire fixing device comprising: a fixing frame that is mounted at the base and is provided with a first positioning groove in a first side wall, and a motion unit which is received in a receiving chamber of the fixing frame, can be moved between a clamping position and a release position and is provided with a second positioning groove which is coupled to the first positioning groove, and a pressing device mounted at the base and designed to press the printed circuit board against the wire fixing device, wherein the wire can be inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the motion unit is moved to the release position, and wherein the wire inserted into the wire insertion hole is clamped and fixed between the first positioning groove and the second positioning groove when the movement unit is moved to the clamping position.

Description

CROSS-REFERENCE TO RELATED REGISTRATION

[0001] The present application claims the benefit of Chinese patent application No. CN201710449806.2, which was filed with the Chinese Patent Office on June 14, 2017 and is incorporated herein by reference. BACKGROUND OF THE INVENTION Field of invention

[0002] The present invention relates to a fixing device and a soldering method for soldering a wire to a printed circuit board. State of the art

[0003] In the manufacture of an electronic device, it is often necessary to solder a wire to a printed circuit board (PCB). To ensure solder quality, the wire is usually inserted into a wire hole in the PCB and then soldered to the board using a soldering iron. According to current best practices, all soldering operations are generally performed manually. The wire is first inserted into a corresponding hole in the PCB, and the worker then holds the wire in place with their hand. Afterward, the wire is soldered to the PCB using the soldering iron. However, manually inserting and holding the wire is very time-consuming. Furthermore, only one wire can be held at a time, which reduces soldering efficiency.Furthermore, the wire may not be held precisely in the center of the wire insertion hole in the printed circuit board, which can impair the soldering quality. JP H11-104820 A describes how a worker inserts a solder element and solder base material into a positioning recess. The worker then uses their hands to press down a handle to compress the solder element and base material with the crimping tool. Under these conditions, the solder element and base material can fully cure after soldering. WO 2012 / 072968 A1 relates to a wire holder used for arranging wires and helping to maintain the alignment of the wires with corresponding traces in a printed circuit board. CN 104259716 A relates to a clamping structure for welding wires with a base plate onto which a welding washer and core wire can be pressed. SUMMARY OF THE INVENTION

[0004] One of the aims of the invention is to eliminate at least some of the aforementioned disadvantages.

[0005] According to the invention, a fixing device is provided which can conveniently hold a wire in a wire insertion hole in a printed circuit board and can ensure that the center of the wire is aligned with that of the wire insertion hole.

[0006] According to one aspect of the invention, a fixing device is provided, comprising: a base; a wire fixing device mounted on the base and configured for positioning and fixing the wire; and a pressing device mounted on the base and configured for pressing the printed circuit board against the wire fixing device. The wire fixing device comprises: a fixing frame fixedly mounted on the base; and a movement unit received in a receiving chamber of the fixing frame and movable between a clamping position and a release position. The receiving chamber of the fixing frame is provided with a first positioning groove in a first side wall; and the movement unit is provided with a second positioning groove coupled to the first positioning groove.The wire can be inserted into a wire insertion hole in the circuit board between the first and second positioning slots when the motion unit is moved to the release position. Furthermore, the wire inserted into the wire insertion hole is clamped and secured between the first and second positioning slots when the motion unit is moved to the clamping position.

[0007] In an exemplary embodiment of the invention, when the printed circuit board is pressed against the wire fixing device, a central axis of the wire insertion hole in the printed circuit board is aligned with that of the first positioning groove, so that the wire inserted into the wire insertion hole is positioned centrally in the wire insertion hole of the printed circuit board. The first positioning groove has an insertion opening in which a blocking structure is formed to prevent the insertion of an outer insulating layer of the wire, in order to control the insertion depth of the wire into the wire insertion hole of the printed circuit board.

[0008] In a further exemplary embodiment of the invention, the motion unit comprises: a slider that is slidably mounted on the fixing frame and can slide between the clamping position and the release position; a first spring that is arranged between the slider and a second side wall of the receiving chamber opposite the first side wall and is configured to press the slider to the clamping position; a sliding plate that is slidably mounted in a receiving cavity of the slider and on which the second positioning groove is formed; and a second spring that is received in the receiving cavity of the slider and is configured to press the sliding plate against the wire. When the slider is pressed to the clamping position by the first spring, the sliding plate is pressed against the wire by the second spring, so that the wire is clamped and fixed between the first positioning groove and the second positioning groove.

[0009] In another exemplary embodiment of the invention, the slider has an actuating handle mounted on it, with which the slider is driven against the elastic force of the first spring for a movement from the clamping position to the release position.

[0010] In another exemplary embodiment of the invention, a slide rail is mounted on an inner wall of the receiving chamber of the fixing frame, wherein the slider is slidably mounted on the slide rail.

[0011] In a further exemplary embodiment of the invention, the wire fixing device comprises a plurality of fixing frames, each of which is provided with a plurality of receiving chambers designed to receive a movement unit.

[0012] In a further exemplary embodiment of the invention, each receiving chamber of the fixing frame of the wire fixing device has an open side from which the wire soldered into the wire insertion hole of the circuit board is removed.

[0013] In another exemplary embodiment of the invention, each of the fixing frames essentially has an E-shape and the first positioning groove is formed on the first side wall in the middle of the E-shaped fixing frame.

[0014] In a further exemplary embodiment of the invention, the side wall of each receiving chamber is provided with one or more first positioning grooves.

[0015] In another exemplary embodiment of the invention, the circuit board is pressed against an upper surface of the fixing frame of the wire fixing device.

[0016] In a further exemplary embodiment of the invention, the pressing device comprises: a printed circuit board carrier onto which the printed circuit board is loaded; a holding frame that is fixedly mounted to the base; and a lever mechanism that is pivotably mounted on the holding frame. One end of the lever mechanism is connected to the printed circuit board carrier, and the other end is provided with a drive handle. The printed circuit board is pressed against the upper surface of the fixing frame of the wire fixing device by exerting a downward pressing force on the printed circuit board carrier via the drive handle.

[0017] According to another aspect of the invention, a soldering process is provided which includes: S100: Provision of the fixing device according to one of the exemplary embodiments mentioned above; S200: Press the circuit board against the wire fixing device using the pressing device; S300: Moving the motion unit to the release position; S400: Insert the wire into the wire insertion hole in the circuit board between the first positioning groove and the second positioning groove of the wire fixing device; S500: Moving the motion unit to the clamping position to clamp and fix the wire inserted into the wire insertion hole between the first positioning groove and the second positioning groove; S600: Soldering the wire inserted into the wire insertion hole to the circuit board using a soldering head; and S700: Moving the motion unit to the release position and removing the soldered wire from the wire fixation device.

[0018] In the exemplary embodiments described above according to the invention, the wire can be conveniently held in the wire insertion hole of the circuit board by the wire fixing device, thereby improving welding efficiency.

[0019] Furthermore, in some of the embodiments of the invention described above, the wire fixing device can ensure that the center of the wire is aligned with that of the wire insertion hole, thereby improving the soldering quality.

[0020] Other tasks and advantages of the invention are explained by the following description of the invention with reference to the accompanying drawings to clarify the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above-mentioned and other features of the invention are clarified by the following detailed description of exemplary embodiments with reference to the accompanying drawings. Fig. Figure 1 is a schematic, perspective view of a fixing device according to an exemplary embodiment of the invention, wherein a wire and a circuit board are not shown. Fig. Figure 2 is a schematic, perspective view of the fixing device according to the exemplary embodiment of the invention, showing the wire and the circuit board. Fig. Figure 3 is a schematic, perspective view of a wire fixing device of the fixing apparatus of Fig. 1. Fig. Figure 4 is a schematic, perspective view of a fixing frame and of movement units of the wire fixing device recorded in a receiving chamber of the fixing frame. Fig. 3. Fig. Figure 5 is a perspective view of the movement unit of the wire fixation device of Fig. 3. DETAILED DESCRIPTION OF PREFERRED FORMATIONS OF THE INVENTION

[0022] The technical solution of the invention is described in greater detail below with reference to various embodiments and the accompanying drawings. In the description, identical or similar reference numerals indicate identical or similar parts. The following description of various embodiments with reference to the accompanying drawings serves to explain the general concept of the invention and does not limit the invention in any way.

[0023] Furthermore, numerous specific details are explained in the following detailed description to clarify the described embodiments. However, it should be clear that one or more embodiments can also be realized without these specific details. Moreover, well-known structures and devices are shown only schematically to simplify the drawings.

[0024] According to the general technical concept of the invention, a fixing device is provided, comprising: a base; a wire fixing device mounted on the base and configured for positioning and fixing a wire to be soldered to a printed circuit board; and a pressing device mounted on the base and configured for pressing the printed circuit board against the wire fixing device. The wire fixing device comprises: a fixing frame fixed to the base and provided with a first positioning groove in a first side wall; and a movement unit received in a receiving chamber of the fixing frame, which can be moved between a clamping position and a release position and is provided with a second positioning groove coupled to the first positioning groove.The wire can be inserted into a wire insertion hole in the circuit board between the first and second positioning slots when the motion unit is moved to the release position. Furthermore, the wire inserted into the wire insertion hole is clamped and secured between the first and second positioning slots when the motion unit is moved to the clamping position.

[0025] Fig. Figure 1 is a schematic, perspective view of a fixing device according to an exemplary embodiment of the invention, in which a wire 20 and a circuit board 10 are not shown. Fig. Figure 2 is a schematic, perspective view of the fixing device according to the exemplary embodiment of the invention, in which the wire 20 and the circuit board 10 are shown.

[0026] As in Fig. 1 and Fig. In the embodiment shown, the fixing device mainly comprises a base 1, a wire fixing device mounted on the base 1 and designed for positioning and fixing a wire 20 to be soldered onto a printed circuit board 10, and a pressing device 110, 120, 130 mounted on the base 1 and designed for pressing the printed circuit board 10 against the wire fixing device.

[0027] Fig. Figure 3 is a schematic, perspective view of the wire fixation device of the fixing apparatus. Fig. 1. And Fig. Figure 4 is a schematic, perspective view of a fixing frame 210 and a movement unit of the wire fixing device recorded in a receiving chamber 201 of the fixing frame 210. Fig. 3.

[0028] As in Fig. 3 and Fig. As shown in Figure 4, in the embodiment shown, the wire fixing device mainly comprises a fixing frame 210 which is fixedly mounted on the base 1, and a movement unit which is received in the receiving chamber 201 of the fixing frame 210 and can be moved between a clamping position and a release position.

[0029] Fig. Figure 5 is a schematic, perspective view of the movement unit of the wire fixation device of Fig. 3.

[0030] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the illustrated embodiment the receiving chamber 201 of the fixing frame 210 is provided with a first positioning groove 211a in a first side wall 211. The movement unit is provided with a second positioning groove 221a, which is coupled to the first positioning groove 211a.

[0031] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the illustrated embodiment, the wire 20 can be inserted into a wire insertion hole (not shown) in the circuit board 10, which is arranged between the first positioning groove 211a and the second positioning groove 221a, when the motion unit is moved to the release position. Furthermore, the wire 20 inserted into the wire insertion hole can be clamped and fixed between the first positioning groove 211a and the second positioning groove 221a when the motion unit is moved to the clamping position (as shown in Figure 5). Fig. 3 shown).

[0032] If, as in Fig. 2 shown in the illustrated embodiment, when the circuit board 10 is pressed against the wire fixing device, the central axis of the wire insertion hole in the circuit board 10 is aligned with that of the first positioning groove 211a, so that the wire 20 inserted into the wire insertion hole is positioned centrally in the wire insertion hole of the circuit board 10.

[0033] In an exemplary embodiment of the invention, the first positioning groove 211a is provided with an insertion opening in which a blocking structure (not shown) is formed for blocking the insertion of an outer insulating layer of the wire 20 in order to control the insertion depth of the wire 20 into the wire insertion hole of the printed circuit board 10. This allows the distance between an end face of an outer insulating layer of the wire 20 and a surface of the printed circuit board 10 to be precisely controlled.

[0034] As in Fig. 4 and Fig. As shown in Figure 5, in the illustrated embodiment, the motion unit mainly comprises a slider 220, a first spring 230, a sliding plate 221, and a second spring 222. The slider 220 is slidably mounted on the fixing frame 210 and can slide between the clamping position and the release position. The first spring 230 is arranged between the slider 220 and a second side wall 212 of the receiving chamber 201 opposite the first side wall 211. The first spring 230 is designed to press the slider 220 to the clamping position. The sliding plate 221 is slidably mounted in a receiving cavity 202 of the slider 220, and the second positioning groove 221 is formed on the sliding plate 221. The second spring 222 is received in the receiving cavity 202 of the slider 220 and is designed to press the sliding plate 221 against the wire 20. In an exemplary embodiment, as in Fig. Figure 5 shows a connecting passage formed in the first side wall 211 to connect the second positioning groove 221a to the receiving cavity 202, so that part of the sliding plate 221 protrudes into the second positioning groove 221 to hold the wire 20 in a space defined by the first positioning groove 211a and the second positioning groove 221a.

[0035] If, as in Fig. 3, Fig. 4 and Fig. 5 shown in the illustrated embodiment, when the slider 220 is pressed to the clamping position by the first spring 230, the sliding plate 221 can be pressed against the wire 20 by the second spring 222, so that the wire 20 can be clamped and fixed between the first positioning groove 211a and the second positioning groove 221a.

[0036] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the embodiment shown, the slider 220 is provided with an actuating handle 224, with which the slider 220 can be manually driven against the elastic force of the first spring 230 for a movement from the clamping position to the release position.

[0037] As in Fig. 3, Fig. 4 and Fig. Figure 5 shows that in the illustrated embodiment, a slide rail 214 is mounted on an inner wall of the receiving chamber 201 of the fixing frame 210. The slider 220 is slidably mounted on the slide rail 214.

[0038] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the illustrated embodiment the wire fixing device comprises a plurality of fixing frames 210, each of which is provided with a plurality of receiving chambers 201. Furthermore, a movement unit is received in each of the receiving chambers 201.

[0039] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the embodiment shown, each receiving chamber 201 of the fixing frame 210 of the wire fixing device has an open side from which the wire 20 soldered into the wire insertion hole of the circuit board 10 can be removed.

[0040] As in Fig. 3, Fig. 4 and Fig. In the embodiment shown in Figure 5, each of the fixing frames 210 essentially has an E-shape, wherein the first positioning groove 211a is formed on the first side wall 211 in the middle of the E-shaped fixing frame 210.

[0041] As in Fig. 3, Fig. 4 and Fig. As shown in Figure 5, in the embodiment shown, the first side wall 211 of each receiving chamber 201 can be provided with one or more first positioning grooves 211a.

[0042] As in Fig. As shown in Figure 2, in the illustrated embodiment the circuit board 10 is pressed against an upper surface of the fixing frame 210 of the wire fixing device.

[0043] As in Fig. 1 and Fig. As shown in Figure 2, in the illustrated embodiment, the pressing device 110, 120, 130 mainly comprises a printed circuit board carrier 110 onto which the printed circuit board 10 is mounted, a retaining frame 130 which is fixedly mounted on the base 1, and a lever mechanism 120 which is pivotably mounted on the retaining frame 130. Furthermore, one end 121 of the lever mechanism 120 is connected to the printed circuit board carrier 110 and the other end is provided with a drive handle 122. The printed circuit board 10 can be pressed against the upper surface of the fixing frame 210 of the wire fixing device by exerting a downward pressing force on the printed circuit board carrier 110 via the drive handle 122.

[0044] In another exemplary embodiment of the invention, a soldering process is provided which comprises: S100: Provision of the fixing device described above; S200: Pressing the circuit board 10 against the wire fixing device with the pressing device 110, 120, 130; S300: Moving the motion unit to the release position; S400: Inserting the wire 20 into the wire insertion hole in the circuit board 10 between the first positioning groove 211a and the second positioning groove 221a of the wire fixing device; S500: Moving the motion unit to the clamping position to clamp and fix the wire 20 inserted into the wire insertion hole between the first positioning groove 211a and the second positioning groove 221a; S600: Soldering the wire 20 inserted into the wire insertion hole to the circuit board 10 using a soldering head (for example, an iron or laser soldering head); and S700: Moving the motion unit to the release position, and removing the soldered wire 20 from the wire fixing device.

[0045] The person skilled in the art should note that the embodiments described above are exemplary and that numerous modifications can be made to the embodiments described here, and that the structures described in the various embodiments can be freely combined without causing conflicts with regard to the configuration or the principle.

[0046] The invention has been described in detail with reference to the accompanying drawings, whereby it should be noted that the embodiments shown in the accompanying drawings are preferred, exemplary embodiments of the invention and the invention is not limited to these embodiments.

[0047] Various exemplary embodiments of the invention have been described and shown, whereby the person skilled in the art can make various changes and modifications to the embodiments described and shown here without thereby departing from the scope of the invention as defined by the claims and their equivalents.

[0048] In formulations containing "comprise," further elements or steps not explicitly mentioned in this context may also be present. Similarly, singular formulations are to be understood as potentially referring to multiple units. Furthermore, reference numerals used in the claims do not, under any circumstances, limit the scope of the invention.

Claims

[1] Fixation device comprising: a base, a wire fixing device mounted on the base and configured to position and fix a wire to be soldered to a circuit board, the wire fixing device comprising: a fixing frame mounted on the base and provided with a first positioning groove in a first side wall, and a moving unit accommodated in a receiving chamber of the fixing frame, movable between a clamping position and a release position, and provided with a second positioning groove coupled to the first positioning groove, and a pressing device mounted on the base and configured to press the circuit board against the wire fixing device, wherein the wire can be inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the moving unit is moved to the release position, and wherein the wire inserted into the wire insertion hole is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position. [2] Fixing device according to claim 1, wherein: when the circuit board is pressed against the wire fixing device, the center axis of the wire insertion hole in the circuit board is aligned with that of the first positioning groove, so that the wire inserted into the wire insertion hole is positioned centrally in the wire insertion hole of the circuit board, and wherein the first positioning groove has an insertion opening on which a blocking structure for blocking the insertion of an outer insulation layer of the wire is formed to control the insertion depth of the wire inserted into the wire insertion hole of the circuit board. [3] Fixing device according to claim 1, wherein: the movement unit includes: a slider slidably mounted on the fixing frame and capable of sliding between the clamping position and the release position, a first spring arranged between the slider and a second side wall of the receiving chamber opposite the first side wall and configured to urge the slider to the clamping position, a sliding plate slidably mounted in a receiving cavity of the slider and on which the second positioning groove is formed, and a second spring received in the receiving cavity of the slider and configured to press the sliding plate against the wire, wherein, when the slider is pressed to the clamping position by the first spring, the slide plate is pressed against the wire by the second spring, so that the wire is clamped and fixed between the first positioning groove and the second positioning groove. [4] The fixing device according to claim 3, wherein the slider is provided with an operating handle for driving the slider against the elastic force of the first spring for movement from the clamping position to the release position. [5] The fixing device according to claim 3, wherein a slide rail is mounted on an inner wall of the receiving chamber of the fixing frame, the slider being slidably mounted on the slide rail. [6] A fixing device according to claim 3, wherein the wire fixing means comprises a plurality of fixing frames each provided with a plurality of receiving chambers each configured to receive a respective moving unit. [7] The fixing device according to claim 6, wherein each receiving chamber of the fixing frame of the wire fixing device has an open side from which the wire soldered into a wire insertion hole of the circuit board is removed. [8] The fixing device according to claim 7, wherein each of the fixing frames has a substantially E-shape and the first positioning groove is formed on the first side wall in the center of the E-shaped fixing frame. [9] A fixing device according to claim 7, wherein the side wall of each receiving chamber is provided with one or more first positioning grooves. [10] The fixing device according to claim 1, wherein the circuit board is pressed against an upper surface of the fixing frame of the wire fixing device. [11] The fixing device according to claim 1, wherein the pressing means comprises: a circuit board carrier onto which the circuit board is loaded, a support frame that is fixedly mounted on the base, and a lever mechanism pivotally mounted on the support frame, one end being connected to the circuit board carrier and the other end being provided with a drive handle, and the circuit board is pressed against the upper surface of the wire fixing device's fixing frame by exerting a downward force on the circuit board carrier via the drive handle. [12] Soldering process comprising: S100: Providing the fixing device according to claim 1, S200: Pressing the circuit board against the wire fixing device with the pressing device, S300: Moving the movement unit to the release position, S400: Inserting the wire into the wire insertion hole in the circuit board between the first positioning groove and the second positioning groove of the wire fixing device S500: Moving the moving unit to the clamping position to clamp and fix the wire inserted into the wire insertion hole between the first positioning groove and the second positioning groove, S600: Soldering the wire inserted into the wire insertion hole to the circuit board using a soldering head, and S700: Move the moving unit to the release position, and remove the soldered wire from the wire fixing device.

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