power converter

Abstract

Power converter (101) comprising: a diode module (4) with a diode bridge with rectifier function, which is arranged in a module housing (10), and a main housing (1) in which the diode module (4) is accommodated and which has an opening in a part of a first side, wherein the module housing (10) has outer wall sides which comprise a facing side facing the first side and a non-facing side which is an outer wall side different from the facing side, and wherein a break protection structure is arranged on the facing side and / or the non-facing side in order to prevent breakage of the module housing (10), the fracture protection structure is a first fracture protection structure (6C; 6D; 6C'; 6D') completely covering the facing side when the fracture protection structure is arranged on the facing side, and the fracture protection structure is a second fracture protection structure (6A; 6B) when the fracture protection structure is arranged on the non-facing side, wherein the non-facing side on which the fracture protection structure is arranged is a non-facing arrangement side which has a largest area among the outer wall sides of the module housing (10) and which is one of a plurality of non-facing sides, the non-facing arrangement side comprises at least a part of a surface which is further away from the first side than the center of the non-facing arrangement side as a non-arrangement surface (7A, 7B) on which no fracture protection structure is arranged, wherein apart from the at least a part on the non-facing arrangement side, no non-arrangement surface (7A, 7B) is arranged.

Description

Technical area

[0001] The present disclosure relates to a power converter with rectifying function. background

[0002] A power converter, such as a power converter, contains a diode module with a diode bridge integrated into a housing (module housing). If a short circuit occurs in one of the diode module's diodes, a current path forms within the diode module that short-circuits two phases of the three-phase alternating current (AC) via the short-circuited diode and another diode. This causes an excessively high current (short-circuit current) to flow within the diode module, causing a rapid rise in the internal temperature of the diode module and an increase in internal pressure, leading to the destruction of the diode module's module housing.

[0003] The diode module is generally filled with a potting material such as silicone gel. If the diode module housing is damaged, the heated potting material will explode. A common measure to prevent excessive current from flowing in the event of a short circuit in the diode module is to insert external protective devices (fast-blow fuses) in series with at least two phases of the three-phase AC power supplied to the power converter. However, this measure results in higher costs and a larger size of the power converter, such as a power converter.

[0004] In a semiconductor device described in Patent Document 1 (WO 2020 / 157 960 A1), in order to counteract a short circuit within a diode module, a fibrous reinforcing member is used, which is wound around an outer periphery of a frame surrounding a semiconductor chip at the outer periphery, to prevent fragments of a component of the semiconductor device from being ejected from the semiconductor device. List of citationsPatent literature Patent document 1: WO 2020 / 157 960 A1 Patent document 2: DE 198 39 422 A1 Patent document 3: DE 10 2009 037 948 A1 Patent document 4: EP 0 033 399 A1 Patent document 5: US 2014 / 0 354 042 A1

[0005] Patent Documents 2 to 5 are less relevant than Patent Document 1. Brief description of the inventionProblem to be solved by the invention

[0006] However, in the technology described in the above-mentioned Patent Document 1, there is a problem that when the destruction reaches such an extent that fragments of a component of the diode module are thrown out of the module case, the fragments are thrown out of the power converter such as a power converter, thereby affecting the reliability of devices outside the power converter.

[0007] The present disclosure has been made in view of the above, wherein an object of the present disclosure is to provide a power converter in which the reliability of devices arranged externally of the power converter is maintained even if the destruction occurs to such an extent that fragments of a component of the diode module are ejected from the module housing. Means of solving the problem

[0008] To solve the above-mentioned problem and to fulfill the object, a power converter according to the present disclosure comprises a diode module arranged within a module housing, which has a diode bridge with a rectification function, and a main housing in which the diode module is accommodated and which has an opening in a part of a first side. In a power converter according to the present disclosure, the module housing has outer wall sides including a facing side opposite the first side and a non-facing side, which is an outer wall side different from the facing side, wherein a fracture protection structure is provided on the facing side and / or the non-facing side to prevent fracture of the module housing.In a power converter according to the present disclosure, when the anti-fracture structure is located on the facing side, the anti-fracture structure is a first anti-fracture structure that completely covers the facing side. When the anti-fracture structure is located on a non-facing side, the anti-fracture structure is a second anti-fracture structure, wherein the non-facing side on which the anti-fracture structure is located is a non-facing arrangement side that has the largest area among the outer wall sides of the module housing. A non-facing arrangement side includes, as a non-arrangement surface on which no anti-fracture structure is arranged, at least a part of an area that is farther away from the first side than the center of the non-facing arrangement side. Effects of the invention

[0009] A power converter according to the present disclosure maintains the reliability of devices external to the power converter even when destruction occurs to such an extent that fragments of a component of the diode module are ejected from the module housing. Short description of the characters Fig. 1 is a diagram illustrating the configuration of a power converter according to the first embodiment. Fig. 2 is a diagram illustrating the configuration of a diode module included in a power converter according to the first embodiment. Fig. 3 is a diagram showing another example of the configuration of a diode module included in a power converter according to the first embodiment. Fig. 4 is a diagram showing the configuration of a diode module included in a power converter according to the second embodiment. Fig. 5 is a diagram showing the configuration of a diode module included in a power converter according to the third embodiment. Fig. 6 is a diagram showing another example of the configuration of a diode module included in a power converter according to the second embodiment. Fig. 7 is a diagram showing another example of the configuration of a diode module included in a power converter according to the third embodiment. Description of embodiments

[0010] Hereinafter, power converters according to embodiments of the present disclosure will be described in detail with reference to the figures. First embodiment

[0011] The representation of Fig. 1 illustrates the configuration of a power converter according to the first embodiment. In the following description, the two mutually orthogonal axes located in a plane parallel to the top of the power converter 101, which is a power converter, are referred to as the X-axis and the Y-axis. The axis orthogonal to the X- and Y-axes is the Z-axis. The main body 1 of the power converter 101 is formed, for example, as a rectangular parallelepiped with its top and bottom surfaces parallel to the XY plane. In the following description, the main body 1 is described as having two lateral sides parallel to the XZ plane and a front and rear side parallel to the YZ plane.The terms “top,” “bottom,” “side,” “front,” and “rear” of the main housing 1 are used as convenient designations for describing the respective sides of the main housing 1 and do not represent a specification of the actual orientation of the power converter 101.

[0012] One or more diode modules 4 are located inside the power converter 101. The power converter 101 has, for example, a rectifier function for converting a three-phase alternating current into direct current (DC). The power converter 101 can be arranged within an inverter.

[0013] The power converter 101 has a main housing 1 and cooling fins 3 on the outside. Main housing slots 2 are formed in a portion of the main housing 1. These slots serve to exchange the internal air of the power converter 101 with external air. The main housing slots 2 are openings in the main housing 1. The shape of the openings in the main housing 1 is not limited to a slot shape. The shape of the openings is arbitrary. The diode module(s) 4 is (are) housed in the main housing 1 of the power converter 101.

[0014] The diode module 4 arranged in the power converter 101 comprises a diode bridge arranged in a housing (hereinafter referred to as module housing 10). The module housing 10 is located on one side (bottom side) in direct contact with the cooling fins 3.

[0015] The module housing 10, for example, is a rectangular parallelepiped whose top and bottom surfaces are arranged parallel to the XY plane. The two lateral sides of the module housing 10 are arranged parallel to the XZ plane, and the front and back surfaces are arranged parallel to the YZ plane. The terms "top," "bottom," "side," "front," and "back" of the module housing 10 are used as convenient terms to describe the sides of the module housing 10 and do not specify the actual orientation of the module housing 10.

[0016] The diode module 4 is arranged in the power converter 101 such that the front side of the diode module 4 faces the arrangement side (first side) 15 for the main housing slots 2. In other words, the arrangement side 15 for the main housing slots 2 is arranged parallel to the YZ plane. When viewed from the front side of the diode module 4, the right side of the lateral sides of the diode module 4 is a right lateral side, while the left side is a left lateral side.

[0017] Of the outer wall sides serving to cover the module housing 10, the facing side facing the arrangement side 15 for the main housing slots 2 is a side arranged at an angle of less than 90 degrees relative to the arrangement side 15 for the main housing slots 2. Any side not facing the arrangement side 15 for the main housing slots 2 is a non-facing side arranged at an angle of 90 degrees or more to the arrangement side 15 for the main housing slots 2.

[0018] In the Fig. 1, the front side corresponds to the facing side facing the arrangement side 15 for the main housing slots 2, the other sides of the diode module corresponding to non-facing sides.

[0019] In the power converter 101, the orientation of the diode module 4 relative to the main housing slots 2 is of crucial importance. Fig. 1 and in the later mentioned Fig. 2 to 5, a reference point 5 is shown on the top side of the diode module 4 for ease of explanation. The reference point 5 is used to describe the orientation of the diode module 4 relative to the main housing slots 2. The reference point 5 is a point near a corner where the top, right side, and back of the diode module 4 meet.

[0020] The diode module 4 comprises at least one diode bridge with a rectifier function. The diode module 4 can be a so-called IGBT (Insulated Gate Bipolar Transistor) module, a module in which switching elements are connected in parallel to a diode bridge. Alternatively, the diode module 4 can be a so-called intelligent power module, a module in which switching elements are connected in parallel to a diode bridge, with a circuit for controlling the switching elements connected.

[0021] Fig. Figure 2 is a diagram illustrating the configuration of a diode module included in a power converter according to the first embodiment. Diode module 4A is an example of diode module 4.

[0022] The diode module 4A has a fracture protection structure 6A on an outer wall area. The fracture protection structure 6A is located, for example, on the side of the sides serving to cover the diode module 4A (outer wall sides) that has the largest area. Fig. In Figure 2, the module housing 10 of the diode module 4A is illustrated such that, of its outer wall sides surrounding the diode module 4A, the top side 11 and bottom side have the largest areas. The side with the largest area refers to any side that has the largest area when viewed parallel to the normal vector. In other words, if there are multiple sides with the same area when viewed in directions parallel to the normal vector, these multiple sides are the sides with the largest area.

[0023] The Fig. The break protection structure 6A shown in Figure 2 is located on the top side 11 of the module housing 10 of the diode module 4A. It is assumed that the diode module 4A is Fig. 2 like the diode module 4 of Fig. 1 is arranged inside the power converter 101. In other words, the diode module 4A is arranged inside the power converter 101 such that the front side 12 of the module housing 10 faces the arrangement side 15 for the main housing slots 2. The reference point 5 is a point near the corner 20 where the top side 11, the right lateral side 13, and the rear side meet, among the outer wall sides. In other words, the reference point 5 is located on the top side 11 of the module housing 10, away from the main housing slots 2. Of the outer wall sides of the module housing 10, the front side 12 forms the facing side, which is opposite to the arrangement side 15 for the main housing slots 2, while the other sides are non-facing sides. The top side 11 of the outer wall sides of the module housing 10 represents a non-facing arrangement side.If the module housing 10 has several non-facing sides that have the largest area, the fracture protection structure 6A can be arranged on at least one of these sides.

[0024] The fracture protection structure 6A has a shape such that a part of the top surface 11 of the diode module 4A is covered, but the remaining part (non-arrangement surface 7A) of the top surface 11 is not. The non-arrangement surface 7A is an area enclosing the reference point 5. In Fig. 2, the non-arrangement area 7A is shown as a triangular area encompassing the reference point 5. The non-arrangement area 7A is an area on the top side 11 of the module housing 10 that is further away from the arrangement side 15 than the center of the top side 11. Even if the non-arrangement area 7A in Fig. 2 is shown as a triangular surface that includes the reference point 5, in other words, the non-arrangement surface 7A can have, for example, a polygonal shape, a circular shape, or another shape, provided that the non-arrangement surface 7A is located further away from the arrangement side 15 than the center of the upper side 11 and forms the area of ​​the upper side 11 that is not occupied by the fracture protection structure 6A. Since the representation of the reference point 5 merely serves to simplify the explanations, it goes without saying that the reference point 5 does not have to be part of the non-arrangement surface 7A. The fracture protection structure 6A represents an example of a second fracture protection structure.

[0025] The fracture protection structure 6A is non-flammable. The fracture protection structure 6A contains, for example, a hard material or an adhesive. The fracture protection structure 6A is in close contact with the top side 11 of the module housing 10 and prevents or mitigates the fracture of the area of ​​the module housing 10 in close contact once the destruction (explosion) of the diode module 4A begins from the inside.

[0026] Examples of hard materials for the shatter-resistant structure 6A include polybutylene terephthalate (PBT) and epoxy glass. Examples of adhesives include polycarbonate.

[0027] The anti-breakage structure 6A has the function of absorbing the consequences of damage to the diode module 4A. Therefore, the anti-breakage structure 6A can be attached to the diode module 4A or to a fixed part that remains intact even if the diode module 4A breaks (for example, the cooling fins 3 of Fig. 1 or another part). The fracture protection structure 6A can be arranged in any manner that ensures that the fracture protection structure 6A can absorb the consequences of damage to the diode module 4A. For example, the fracture protection structure 6A can be mounted such that it is arranged and held between a component (not shown) of the power converter 101 and the diode module 4A inside the main housing 1 of the power converter 101.

[0028] As from Fig. 2, the anti-break structure 6A is arranged on the diode module 4A. Therefore, if the diode module 4A is destroyed, the area where the anti-break structure 6A is arranged will not be destroyed. In other words, if the diode module 4A is destroyed, the part where the anti-break structure 6A is not arranged will be destroyed. If the diode module 4A is destroyed, for example, the non-arrangement surface 7A and others will be destroyed. In the first embodiment, of the outer wall sides serving to cover the diode module 4A, the top side 11 is the side with the largest area and the side that is most susceptible to forces from the interior of the module housing 10 and is therefore most likely to be destroyed. By providing an area for the arrangement of the anti-break structure 6A and a non-arrangement surface 7A on which no anti-break structure 6A is located, the top side 11 of the module housing 10, i.e.the side with the largest surface, which is most susceptible to forces from the interior of the module housing 10, have different strengths and direct the destruction towards the non-arrangement surface 7A.

[0029] As described above, when the non-facing side of the module case 10 is the side where the anti-fracture structure 6A is arranged, in the diode module 4A, the non-facing side where the anti-fracture structure 6A is arranged is the top surface 11 (non-facing arrangement side), which is the non-facing side with the largest area among the outer wall sides of the module case 10. Furthermore, in the diode module 4A, the top surface 11 where the anti-fracture structure 6A is arranged has, as the non-arrangement surface 7A, the area of ​​a surface that is farther from the arrangement side 15 than the center of the top surface 11.

[0030] Since the module housing 10 of the diode module 4A according to the first embodiment has a region where the breakage prevention structure 6A is not disposed (non-disposition surface 7A) and a region where the breakage prevention structure 6A is disposed, the destruction during destruction of the diode module 4A can be directed to a region to be destroyed. In other words, in the diode module 4A, the destruction can be directed to the non-disposition surface 7A of the module housing 10 where the breakage prevention structure 6A is not located.

[0031] In the module case 10 of a diode module 4A of the first embodiment, the non-arrangement surface 7A on which the breakage prevention structure 6A is not located is the area defined by the main case slots 2 of the power converter 101 of Fig. 1. This can prevent fragments from escaping through the main housing slots 2 to the outside of the power converter 101 if the diode module 4A in the power converter 101 is destroyed. In other words, a non-arrangement surface 7A, which is the surface further away from the arrangement side 15 for the main housing slots 2, can prevent the potting material with which the diode module 4A was filled from being flung through the main housing slots 2, even if the diode module 4A is destroyed.

[0032] The shape of the non-arrangement surface 7A on which no breakage prevention structure 6A is mounted may be set differently depending on, among other things, the shape of the power converter 101, the position of the main case slots 2 in the main case 1 of the power converter 101, the shape of each of the main case slots 2, the position of the diode module 4A inside the power converter 101, and the shape of the diode module 4A.

[0033] The representation of Fig. Figure 3 illustrates another example of the configuration of a diode module included in a power converter according to the first embodiment. Diode module 4B represents an example of diode module 4. As with diode module 4A, diode module 4B is assumed to be similar to diode module 4 of Fig. 1 is arranged inside the power converter 101.

[0034] As in the case of the diode module 4A, of the outer wall sides of the module housing 10 of a diode module 4B serving to enclose the diode module 4B, the top side 11 and the bottom side form the sides with the largest surfaces.

[0035] As from Fig. As can be seen in Figure 3, the diode module 4B, which represents another example of the configuration of a diode module 4, has a fracture protection structure 6B instead of the fracture protection structure 6A, compared to the diode module 4A. The fracture protection structure 6B, like the fracture protection structure 6A, comprises a non-combustible, hard material or a non-combustible adhesive.

[0036] The fracture protection structure 6B is formed as a rectangular plate-shaped element. The fracture protection structure 6B is arranged on the top side 11 of the module housing 10 of the diode module 4B, closer to the arrangement side 15 for the main housing slots 2 than the center of the top side 11.

[0037] Compared to the diode module 4A, the diode module 4B has a non-arrangement area 7B instead of the non-arrangement area 7A. The non-arrangement area 7B is a rectangular area. As with the non-arrangement area 7A, the non-arrangement area 7B forms an area that includes the reference point 5. The non-arrangement area 7B corresponds to the area of ​​the top side 11 of the module housing 10 that is farther away from the arrangement side 15 than the center of the top side 11. As with the non-arrangement area 7A described above, the non-arrangement area 7B only needs to be a area of ​​the top side 11 on which no fracture protection structure 6B is arranged and which is farther away from the arrangement side 15 than the center of the top side 11. The non-arrangement area 7B can, for example, have a polygonal shape, a circular shape, or another shape.Since the representation of reference point 5 merely serves to simplify the explanations, it goes without saying that reference point 5 does not have to be part of the non-arrangement surface 7B. The fracture protection structure 6B represents an example of a second fracture protection structure.

[0038] The shape of each of the diode modules 4A and 4B is not limited to a rectangular parallelepiped, but may also be a prism other than a rectangular parallelepiped. In this case, too, the prism-shaped diode modules 4A and 4B are arranged such that at least one of the sides not having the largest area faces the arrangement side 15 for the main housing slots 2, the anti-fracture structure of each of the diode modules 4A and 4B is arranged on the top side 11, and each of the diode modules 4A and 4B has a non-arrangement surface. As with the non-arrangement surfaces 7A and 7B, the non-arrangement surfaces are located on a side surface opposite the arrangement side 15 for the main housing slots 2.

[0039] A comparison example of a diode module (hereinafter referred to as the "comparison diode module") will now be described. In a comparison diode module, the entire surface of the module housing is provided with a fracture protection structure. In this comparison diode module, destruction may occur that exceeds the design assumptions. For example, in such a comparison diode module, one of the sides with the largest area is most likely to be subjected to a significant force and destroyed. For example, if the top side of the comparison diode module is the side with the largest area and is destroyed near the main housing slots, then fragments of a component of the comparison diode module may be ejected from the comparison diode module and subsequently from the power converter through the main housing slots. In this case, the reliability of devices external to the power converter is compromised.Furthermore, equipping the comparison diode module with the special structure to prevent destruction results in a more complex design and a more complex manufacturing process, resulting in lower reliability of the comparison diode module and higher manufacturing costs.

[0040] On the other hand, in the diode modules 4A and 4B according to the first embodiment, the destruction of each diode module 4A or 4B is directed to an area (non-array areas 7A or 7B) that allows for less severe destruction, that is, an area farther away from the main body slots 2. This prevents fragments resulting from the destruction from being ejected from the power converter 101 during the destruction of each diode module 4A or 4B. For the diode modules 4A and 4B, it is assumed that each of the diode modules 4A and 4B will experience destruction beyond the design assumptions, and then, as described above, when the destruction occurs, each directs the destruction to the area where the fragments resulting from the destruction will not be ejected from the power converter 101.In addition, the diode modules 4A and 4B themselves do not require any special structures, thus preventing an increase in manufacturing costs for both because there is no complex design and manufacturing process.

[0041] As explained above, the module housing 10 of a respective diode module 4A or 4B according to the first embodiment has a region with a fracture protection structure 6A or 6B arranged thereon and a non-arrangement area 7A or 7B on which no fracture protection structure 6A or 6B is arranged, wherein the arrangement of the diode module 4A or 4B inside the power converter 101 is taken into account. During a destruction of a diode module 4A or 4B that goes beyond the design assumptions, the destruction in a power converter 101 can therefore be directed to the non-arrangement area 7A or 7B.

[0042] Thus, in a power converter 101, even if the destruction occurs to such an extent that fragments of a component of a diode module 4A or 4B are ejected from the diode module 4A or 4B, the fragments, which are broken pieces, can be reliably prevented from being ejected from the power converter 101. Consequently, a power converter 101 enables the reliability of devices located outside the power converter 101 to be maintained even if a diode module 4A or 4B is destroyed. Second embodiment

[0043] Next, a second embodiment will be described with reference to Fig. 4. In the second embodiment, the breakage protection structure is located on the front side 12 of the module housing 10 of a diode module. The front side 12 of the module housing 10 is Fig. 4 and the following figures are not shown.

[0044] The representation of Fig. Figure 4 illustrates the configuration of a diode module included in a power converter according to the second embodiment. Diode module 4C is an example of a diode module 4. As with diode module 4A, diode module 4C is assumed to be similar to diode module 4 of Fig. 1 is arranged inside the power converter 101.

[0045] Unlike the diode modules 4A and 4B, the front side 12 of the module housing 10 of the diode module 4C (which corresponds to the front side 12 of Fig. 2) is the side of the outer wall sides that serve to enclose the diode module 4C, with the largest area. The front side 12 of the diode module 4C is the side of the power converter 101 facing the arrangement side (first side) 15 for the main housing slots 2. In the diode module 4C, the anti-fracture structure 6C is arranged so that it completely covers the front side 12 (facing side) of the module housing 10. Like the anti-fracture structure 6A, the anti-fracture structure 6C comprises a non-combustible, hard material or a non-combustible adhesive.

[0046] The fracture protection structure 6C is arranged to cover the entire front side 12 of the module housing 10 of the diode module 4C. In other words, there is no non-arrangement area on the front side 12 of the module housing 10 of the diode module 4C. The fracture protection structure 6C represents an example of a first fracture protection structure.

[0047] As described above, the diode module 4C according to the second embodiment is arranged such that the front side 12 of the module housing 10 provided with the anti-break structure 6C faces the arrangement side 15 for the main housing slots 2. Since the facing side (front side) facing the arrangement side 15 from the outer wall sides of the module housing 10 has the largest area compared to non-facing sides, which are outer wall sides different from the facing side, the anti-break structure 6C is arranged on the facing side of a diode module 4C to prevent breakage of the module housing 10. No anti-break structures 6C are provided on the non-facing sides of the outer wall sides of the module housing 10. In the diode module 4C, no anti-break structure 6C should be arranged on some or all of the non-facing sides.In other words, there may be a configuration in which no fracture protection structure 6C is arranged on at least some of the non-facing sides.

[0048] As stated above, the anti-fracture structure 6C in the diode module 4C is designed to cover the entire front side 12 of the module housing 10. Therefore, if the diode module 4C is destroyed, the area where the anti-fracture structure 6C is arranged will not be destroyed. However, the sides without anti-fracture structures 6C, i.e., the sides of the outer wall sides other than the front side that serve to enclose the diode module 4C, can be destroyed. This means that by disposing the anti-fracture structure 6C on the entire facing side, the diode module 4C can have a difference in strength between the facing side and the non-facing sides where no anti-fracture structures 6C are located, thereby directing the destruction to the non-facing sides that are not opposite the main housing slots 2.

[0049] The diode module 4C can be arranged such that two sides of the module housing 10 of the diode module 4C, namely the front side and one of the two lateral sides (e.g., the right lateral side 13), face the arrangement side 15 for the main housing slots 2. In this case, the entire front side and the right lateral side 13 of the module housing 10 of the diode module 4C are facing sides, with the fracture protection structures 6C being arranged on the entire front side and the entire right lateral side 13. For example, the break protection structures 6C are arranged on the front side 12 and the right side 13 of the module housing 10 when the arrangement side 15 for the main housing slots 2 encloses an angle of less than 90 degrees with both the front side 12 of the module housing 10 of the diode module 4C and encloses an angle of less than 90 degrees with the right side 13 of the module housing 10 of the diode module 4C.

[0050] The shape of the diode module 4C is not limited to a rectangular parallelepiped, but can also be a prism other than a rectangular parallelepiped. In this case, too, the prism-shaped diode module 4C is arranged so that at least one of its sides faces the arrangement side 15 for the main housing slots 2, with a fracture protection structure arranged on the facing side, which faces the arrangement side 15 from the sides of the diode module 4C.

[0051] As described above, the module housing 10 of a diode module 4C according to the second embodiment includes the side (front side) where the breakage protection structure 6C is arranged and sides where no breakage protection structure 6C is arranged, taking into account the arrangement of the diode module 4C inside the power converter 101. Therefore, during destruction of the diode module 4C, the destruction of the power converter 101 can be directed to sides different from the facing side of the module housing 10.

[0052] Therefore, in a power converter 101, even if the destruction occurs to such an extent that fragments of a component of the diode module 4C are ejected from the diode module 4C, the fragments, which are broken pieces, can be reliably prevented from being ejected from the power converter 101. Consequently, a power converter 101 enables the reliability of devices located outside the power converter 101 to be maintained even if a diode module 4C is destroyed. Third embodiment

[0053] Next, a third embodiment will be described with reference to Fig. 5. In the third embodiment, a fracture protection structure is arranged on the front side 12 of the module housing 10 of a diode module, which structure is larger than the front side 12.

[0054] The representation of Fig. Figure 5 illustrates the configuration of a diode module included in a power converter according to the third embodiment. The diode module 4D is an example of a diode module 4. As with the diode module 4A, the diode module 4D is assumed to be similar to the diode module 4 of Fig. 1 is arranged inside the power converter 101.

[0055] As with the diode module 4C, the front side 12 of the module housing 10 (which corresponds to the front side 12 of Fig. 2) is the side that has the largest area of ​​the outer wall sides serving to surround the diode module 4D. The front side of the diode module 4D is a facing side that faces the arrangement side (first side) 15 for the main housing slots 2 of the power converter 101. The diode module 4D is configured such that the applied anti-fracture structure 6D completely covers the front side 12 (facing side) of the module housing 10. Like the anti-fracture structure 6A, the anti-fracture structure 6D comprises a non-combustible, hard material or a non-combustible adhesive. The area of ​​the anti-fracture structure 6D is larger than the area of ​​the front side 12 of the module housing 10 of the diode module 4D. This means that the side (rear side) of the anti-fracture structure 6D facing the front side 12 of the module housing 10 has a larger area than the front side 12 of the module housing 10. In other words, the side of the anti-fracture structure 6D includes an area in contact with the facing side (front side 12 of the module housing 10) of the diode module 4D, and has a larger area than the front side 12 of the module housing 10. The anti-fracture structure 6D is arranged to completely cover the front side 12 of the module housing 10 of the diode module 4D. In other words, the front side 12 of the diode module 4D has no non-arrangement area. The anti-fracture structure 6D represents an example of a first anti-fracture structure.

[0056] The part of the anti-fracture structure 6D that is not in contact with the front side 12 of the module housing 10 extends along the main housing slots 2. In other words, the anti-fracture structure 6D is arranged opposite the main housing slots 2. For example, the anti-fracture structure 6D protrudes beyond the top side 11 of the module housing 10 of the diode module 4D, which is a non-facing side, extending in a direction that intersects the front side 12, which is the facing side. When looking from outside the power converter 101 through the main housing slots 2 into the interior of the power converter 101, the anti-fracture structure 6D obscures the view of the diode module 4D. There are no anti-fracture structures 6D on the non-facing sides of the outer wall sides of the module housing 10. For a diode module 4D, no fracture protection structures 6D should be arranged on some or all non-facing sides.In other words, there may be a configuration in which there are no fracture protection structures 6D on at least some of the non-facing sides.

[0057] As stated above, the module housing 10 of a diode module 4D according to the third embodiment has a side (front side) on which a breakage protection structure 6D is arranged, and sides on which no breakage protection structures 6D are arranged, taking into account the arrangement of the diode module 4D inside the power converter 101. Therefore, during destruction of the diode module 4D, the destruction of the power converter 101 can be directed to a side other than the front side.

[0058] The fracture protection structure 6D further has a region that projects beyond the top side 11 of the module housing 10, thereby preventing fragments flying off the top side 11 of the module housing 10 from being ejected from the power converter 101 during destruction of the diode module 4D.

[0059] Therefore, in a power converter 101, even if the destruction occurs to such an extent that fragments of a component of the diode module 4D are ejected from the diode module 4D, the fragments, which are broken pieces, can be reliably prevented from being ejected from the power converter 101. Consequently, a power converter 101 enables the reliability of devices located outside the power converter 101 to be maintained even if a diode module 4D is destroyed.

[0060] In the first to third embodiments, the fracture protection structures 6C and 6D are first fracture protection structures and the fracture protection structures 6A and 6B are second fracture protection structures.

[0061] Variants of the second and third embodiments are described below. The representation of Fig. Figure 6 illustrates another example of the configuration of a diode module included in a power converter according to the second embodiment. The illustration of Fig. Fig. 7 illustrates another example of the configuration of a diode module included in a power converter according to the third embodiment. Fig. Diode module 4C' shown in Figure 6 is a variant of the Fig. 4 shown diode module 4C, and the one in Fig. The diode module 4D' shown in Figure 7 is a variant of the Fig. 5 shows the diode module 4D.

[0062] In the second and third embodiments described above, the front sides of the diode modules 4C and 4D, i.e., the facing sides, were each described as having the largest area among the outer wall sides, and the breakage protection structures 6C and 6D are arranged thereon. However, each of the breakage protection structures 6C and 6D need only be arranged to cover the entire facing side facing the side (first side) of the main housing 1 of the power converter 101 with the main housing slots 2. For example, as shown in FIGS. Fig. 6 and Fig. 7, the diode modules 4C' and 4D' can be configured to each have, as the front side, a facing side facing the arrangement side (first side) 15 for the main housing slots 2 of the power converter 101, and as the top side 11, a non-facing side having the largest area extending in a direction (X direction) intersecting the facing side. The anti-break structures 6C' and 6D' are arranged on the front side, whose area is smaller than that of the top side 11, and completely cover it, and no anti-break structures 6C' and 6D' are arranged on the non-facing sides, including the top side 11. In these cases, the destruction can be easily directed toward the top side 11, which has the largest area among the outer wall sides of the module housing, thereby achieving an effect similar to the second and third embodiments described above.

[0063] As in Fig. As shown in Figure 7, for example, the diode module 4D' further comprises a fracture protection structure 6D' covering the entire front side, the area of ​​which is smaller than that of the top side 11. The fracture protection structure 6D' protrudes beyond the top side 11 of the module housing 10 of the diode module 4', like the fracture protection structure 6D of the third embodiment described above. There are no fracture protection structures 6D' on the non-facing sides, including the top side 11. In this case, the destruction can simply be directed toward the top side 11, which has the largest area among the outer wall sides of the module housing 10, and it can further be prevented that fragments ejected from the top side 11 of the module housing 10 are ejected from the power converter 101 in the event of a diode module 4D' being destroyed.

[0064] In the first embodiment described above, it was explained that the non-facing arrangement side (top side 11), which is the non-facing side having the largest area among the outer wall sides of the module case 10 of the two diode modules 4A and 4D, is located at a position where the breakage prevention structure 6A or 6B is arranged, and has, as the non-arrangement surface 7A or 7B, at least a part of the area that is farther from the arrangement side (first side) 15 than the center of the non-facing arrangement side.As long as the fracture protection structures 6A and 6B are each arranged such that the non-facing arrangement side, which has the largest area among the non-facing sides of the outer wall sides of the module housing 10, comprises as the non-arrangement surface 7A or 7B at least a part of the area which is further away from the first side than the center of the non-facing arrangement side, all sides of the outer wall sides of the module housing 10 which are different from the non-facing arrangement side can, however, also be located at a location at which fracture protection structures 6A or 6B are arranged.In a diode module 4A or 4B in which the breakage prevention structure 6A or 6B is arranged on the non-facing arrangement side, which is the non-facing side with the largest area among the outer wall sides of the module case 10, in addition to having, as the non-arrangement surface 7A or 7B, a part of the area that is farther from the first side than the center of the non-facing arrangement surface, the above-described breakage prevention structures 6C' or 6D' may be arranged so as to completely cover the front side (facing side) whose area is smaller than that of the top side and which faces the arrangement side (first side) 15 for the main case slots 2 of the power converter 101. In this case, the diode module 4A or 4B can, as described in the first embodiment, prevent destruction to the non-arrangement surface 7A or 7B, respectively.7B and make it more difficult to destroy the facing side opposite the arrangement side 15 for the main housing slots 2 of the power converter 101. Furthermore, with the power converter 101, the reliability of devices arranged outside the power converter 101 can be better maintained even if a diode module 4A or 4B is destroyed.

[0065] In the third embodiment described above, the applied fracture protection structure 6D of a diode module 4D was described as covering the entire front side 12 of the module housing 10 and protruding beyond the top side 11 of the module housing 10. However, the fracture protection structure 6D' applied to the front side 12 of the module housing 10 must cover only the entire front side, which is the facing side, on a side that includes a surface in contact with the facing side and whose surface area is larger than that of the facing side. The diode module 4D' can, for example, be designed such that the fracture protection structure 6D' covers the entire front side 12 of the module housing 10 and protrudes beyond the top side 11 and the two lateral sides of the module housing 10.In this case, even if the destruction is directed towards any non-facing side to which no fracture protection structure 6D' is attached, it can be prevented that fragments ejected from the diode module 4D' during destruction of a diode module 4D' are subsequently ejected from the power converter 101.

[0066] The configurations presented in the above embodiments are illustrative in nature and can be combined with other well-known technologies, and parts thereof can be omitted or modified without deviating from the essence. The embodiments can be combined with each other. List of reference symbols 1 main body, 2 main housing slot, 3 cooling fins, 4, 4A-4D, 4C', 4D' diode module, 5 Reference point, 6A-6D, 6C', 6D' anti-fracture structure, 7A, 7B non-arrangement area, 10 module housings, 11 top, 12 front, 13 right side, 15 layout page (first page), 20 corner, 101 power converters.

Claims

[1] Power converter (101) comprising: a diode module (4) with a diode bridge with rectifier function, which is arranged in a module housing (10), and a main housing (1) in which the diode module (4) is accommodated and which has an opening in a part of a first side, wherein the module housing (10) has outer wall sides which comprise a facing side facing the first side and a non-facing side which is an outer wall side different from the facing side, and wherein a break protection structure is arranged on the facing side and / or the non-facing side in order to prevent breakage of the module housing (10), the fracture protection structure is a first fracture protection structure (6C; 6D; 6C'; 6D') completely covering the facing side when the fracture protection structure is arranged on the facing side, and the fracture protection structure is a second fracture protection structure (6A; 6B) when the fracture protection structure is arranged on the non-facing side, wherein the non-facing side on which the fracture protection structure is arranged is a non-facing arrangement side which has a largest area among the outer wall sides of the module housing (10) and which is one of a plurality of non-facing sides, the non-facing arrangement side comprises at least a part of a surface which is further away from the first side than the center of the non-facing arrangement side as a non-arrangement surface (7A, 7B) on which no fracture protection structure is arranged, wherein apart from the at least a part on the non-facing arrangement side, no non-arrangement surface (7A, 7B) is arranged. [2] The power converter (101) according to claim 1, wherein, when the breakage prevention structure is arranged on both the facing side and the non-facing side and the second breakage prevention structure is arranged on the non-facing arrangement side, the first breakage prevention structure is arranged on the facing side whose area is smaller than that of the non-facing arrangement side. [3] The power converter (101) according to claim 1, wherein, when the first breakage prevention structure (6D; 6D') is arranged on the facing side, the first breakage prevention structure (6D; 6D') completely covers the facing side with a side including a surface in contact with the facing side and having a larger area than the facing side. [4] Power converter (101) according to claim 1, wherein the module housing (10) has, of the outer wall sides, the facing side as the front side and the non-facing side as the top side (11), which extends in a direction intersecting the facing side, and the first break protection structure (6D; 6D') projects beyond the upper side (11) of the outer wall sides of the module housing (10) when the first break protection structure (6D; 6D') is arranged on the facing side. [5] The power converter (101) according to any one of claims 1 to 4, wherein the first anti-fracture structure (6C; 6D; 6C'; 6D') comprises a non-combustible hard material or a non-combustible adhesive when the first anti-fracture structure (6C; 6D; 6C'; 6D') is arranged on the facing side. [6] The power converter (101) according to claim 1, wherein the second breakage prevention structure (6A; 6B) comprises a non-combustible hard material or a non-combustible adhesive when the second breakage prevention structure (6A; 6B) is arranged on the non-facing arrangement side.

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