ANTENNA DEVICE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A method for manufacturing an antenna device (100) is provided, which method comprises melting a solder material and removing a portion of an insulating sheath. The antenna device (100) comprises an antenna section (20) formed by winding a coil wire (40) whose coil core (47) is covered with the insulating sheath (46), and a base (30) having a pad section (331) to which a portion of the coil wire (40) is soldered with the solder material (50). During melting of the solder material, the solder material (50) applied to the pad section (331) is irradiated with a laser beam, so that the solder material (50) melts.When removing a part of the insulating sheath, the coil wire (40) is immersed in the molten solder material (50) so that a part of the insulating sheath (46) is removed from the coil wire (40), and the coil wire (40) and the pad portion (331) are connected with the solder material (50).

Description

TECHNICAL FIELD

[0001] The present invention relates to an antenna device and a method for producing the same. TECHNICAL BACKGROUND

[0002] Among known antenna devices, there is an antenna device comprising an antenna formed by winding a coil wire and a circuit portion to which the coil wire is electrically connected by, for example, soldering.

[0003] Regarding such a technology, the below-mentioned Patent Document 1 discloses a method for manufacturing an RFID transponder comprising an antenna (4) made of a winding wire (2), and in which the winding wire (2) is soldered to a solderable contact area (12). In particular, as shown in Fig. As shown in Figure 1 of Patent Document 1, the solderable contact region (12) is provided on top of a semiconductor chip (6). The contact region (12) is a metal plating made of, for example, a nickel-based alloy. An end portion of the winding wire (2) is soldered to the contact region (12). Specifically, a region to be soldered is irradiated with a laser beam, so that the solder is melted by the laser beam, and the winding wire (2) and the contact region (12) are thus connected. CITATION LISTPATENT DOCUMENTS

[0004] Patent document 1: JP 2014 - 505309 A SUMMARY OF THE INVENTION TASK TO BE SOLVED BY THE INVENTION

[0005] Typically, a coil wire wound around an antenna is covered with an insulating sheath. To solder the winding wire (2) to the contact portion (12) as in Patent Document 1, the insulating sheath must be removed in advance on at least a portion of the winding wire (2) to be soldered. According to Patent Document 1, a step of removing the insulating sheath is performed before the soldering process using the same laser device as a laser device used to solder the winding wire (2) to the contact portion (12). That is, the step of removing the insulating sheath must be performed before the soldering step. This results in additional manufacturing steps for manufacturing an antenna device, which is problematic.

[0006] Such a problem occurs in all types of soldering, not only soldering with solder, but also with other metallic soldering materials.

[0007] The present invention has been made in view of the above problem and provides an antenna device and a method for manufacturing the same which involve a fewer number of manufacturing steps. MEANS TO SOLVE THE PROBLEM

[0008] In a method for manufacturing an antenna device of the present invention, the antenna device includes an antenna portion formed by winding a coil wire whose coil core is covered with an insulating sheath, and a base having a pad portion to which a part of the coil wire is soldered with a solder material, the method comprising a melting step of melting the solder material by irradiating the solder material applied to the pad portion with a laser beam; and a removing step of removing a part of the insulating sheath from the coil wire by immersing the coil wire in the molten solder material, thereby joining the coil wire and the pad portion with the solder material.

[0009] In an antenna device of the present invention, the antenna device includes an antenna portion formed by winding a coil wire having a coil core and an insulating sheath covering the coil core, and a base having a pad portion in which the coil wire has an exposed portion of the coil core that is not covered with the insulating sheath and is thus exposed. The coil wire and the pad portion are connected to each other by a solder material, a part of the coil wire is embedded in the solder material, and a first boundary line, which is a boundary between an inner region in which a peripheral surface of the coil wire is embedded in the solder material, and an outer region of the coil wire outside the solder material, is arranged along a second boundary line, which is a boundary between the exposed portion and a covered portion of the coil wire.which is covered with the insulating sheath., EFFECTS OF THE INVENTION

[0010] According to the manufacturing method of the present invention, the insulating sheath immersed in a molten solder is removed from the coil wire by the heat of the molten solder. Accordingly, it is possible to perform a soldering step and a step of removing the insulating sheath from the coil wire simultaneously, thus reducing the manufacturing steps for the antenna device. SHORT DESCRIPTION OF THE CHARACTERS

[0011] The above-described subject matter and other objects, features and advantages will become more apparent from the preferred embodiment described below and the accompanying drawings. Fig. 1 is a perspective view showing an example of an antenna device according to a first embodiment of the present invention. Fig. 2 is a plan view of a circuit portion of the antenna device according to the first embodiment. Fig. Fig. 3 is a longitudinal sectional view of a cross section of the antenna device according to the first embodiment taken along a chain line in Fig. 2, viewed in the direction of arrows III-III. Fig. Fig. 4 is an enlarged view of a portion of the antenna device according to the first embodiment shown in Fig. 2 is marked with X. Fig. Fig. 5 is a longitudinal sectional view of the antenna device according to the first embodiment taken along a chain line in Fig. 4, viewed in the direction of the arrows VV. Fig. 6 is a perspective view of an antenna device for illustrating an example of a method for manufacturing the antenna device according to the first embodiment. Fig. 7 is a plan view of the antenna device for illustrating an example of the method for manufacturing the antenna device according to the first embodiment. Fig. Fig. 8 is a longitudinal sectional view of a cross section of the antenna device according to the first embodiment taken along a chain line in Fig. 7, viewed in the direction of arrows VIII-VIII. Fig. Fig. 9 is a longitudinal sectional view of a cross section of the antenna device according to the first embodiment taken along a chain line in Fig. 7, viewed in the direction of arrows IX-IX. Fig. 10 is a perspective view showing an example of a pressing tool used in the method of manufacturing the antenna device according to the first embodiment. Fig. 11 is a perspective view showing an example of placement of the pressing tool in the method of manufacturing the antenna device according to the first embodiment. DESCRIPTION OF THE EMBODIMENTS

[0012] The various components of the antenna device of the present invention do not need to be provided independently of one another. For example, arrangements are also possible in which multiple components are formed as a single, unified element, arrangements in which a single component is formed from multiple elements, arrangements in which a given component is part of another component, or even arrangements in which a part of a given component partially overlaps a part of another component.

[0013] Although the method for manufacturing the antenna device of the present invention may be described by several steps in the order in which they occur, this order is not intended to limit the order or timing for performing the multiple steps. Therefore, when performing the method for manufacturing the antenna device of the present invention, the order of the steps may be changed as long as this does not pose a problem for the implementation of the present invention. Furthermore, the timing for performing the multiple steps may partially or completely overlap.

[0014] An embodiment of the present invention will be described below with reference to the drawings. In the drawings, corresponding components are designated by common reference numerals, and the description of these components will not be repeated.

[0015] The present embodiment will be described with reference to directions including front, rear, left, right, top, and bottom, which are defined as shown in the drawings. Moreover, a front end portion and a rear end portion of a base 30, an antenna portion 20, or a coil wire 40 may be referred to as a front end or a rear end, respectively. Further, the left-right direction may be referred to as a width direction, and the top-to-bottom direction may be referred to as a height direction or a vertical direction. A direction from the center line of the base to the left or right in the left-right direction shall be referred to as an outside or outward, while a direction from the left or right to the center line of the base shall be referred to as an inside or inward.Furthermore, a direction orthogonal to the top-down direction, i.e., the left-right direction and the longitudinal direction, may be referred to as the transverse direction. However, all of these directions are defined only for convenience in describing the relative relationships between the components and are not intended to define the directions when manufacturing or using a product implementing the present invention.

[0016] Furthermore, a plane as referred to in the present invention means a shape that is physically formed to obtain a plane as a target and obviously does not require a complete geometric plane. <Erste Ausführungsform> Overview of the antenna device

[0017] Fig. 1 is a perspective view showing an example of an antenna device 100 according to a first embodiment of the present invention.

[0018] First, an overview of the antenna device 100 of the present embodiment will be described.

[0019] The antenna device 100 includes an antenna portion 20 and a base (a circuit portion 33) with pad portions 331. A coil wire 40 is wound on the antenna portion 20, which includes a coil core 47 and an insulating sheath 46 covering the coil core 47. The coil wire 40 and the pad portions 331 are connected with a solder 50.

[0020] Next, the antenna device 100 of the present embodiment will be described in detail with reference to FIG. Fig. 1 to 5 described.

[0021] The antenna device 100 can be used for a compact, portable communication system, such as a receiving / transmitting device used for a keyless entry system, or can be used as an RFID transponder used to identify goods, such as commercial products. The antenna section 20 in the antenna device 100 functions, for example, as an antenna that transmits and receives radio waves. In the present embodiment, the antenna section 20 includes a winding core 21, and the coil wire 40 is wound around the winding core 21. As shown in Fig. 1, the opposite ends of the coil wire 40 are arranged at the base 30 (rear end) of the winding core 21. Furthermore, the coil wire 40 (coil portion 49) is wound around an axially central portion of the winding core 21. That is, the coil wire 40 is not wound around the front end portion of the winding core 21.

[0022] Individual turns of the coil wire 40 wound around the winding core 21 are for the Fig. 1 is not shown in the drawings. The same applies to the Fig. 3, Fig. 6, Fig. 7, Fig. 9 and Fig. 11.

[0023] The shape of the antenna section 20 is not limited to that of the present embodiment, and various shapes can be used to enable the antenna section 20 to function as an antenna. For example, it is possible to use an air-core coil in which the coil section 49 has a hollow interior without the winding core 21. It is also possible to wind the coil wire 40 so that it is arranged in a ring shape on a plane. The opposite ends of the coil wire 40 are guided toward the base 30.

[0024] The coil wire 40 is a conductive wire. The coil wire 40 of the present embodiment includes the coil core 47 (see Fig. 4) formed of a conductive metal such as copper, which is covered with the insulating sheath 46 (see Fig. 4). Examples of the material of the insulating sheath 46 are plastics such as polyurethane and polyimide.

[0025] In the present embodiment, the winding core 21 is inserted into a winding core insertion hole 316 (see Fig. 3) which is provided at the front end of the base 30 described below and is thus fixed to the base 30. As shown in Fig. 3, an opening of the winding core insertion hole 316 is provided with a chamfered portion 316a to facilitate smooth insertion of the winding core 21 into the winding core insertion hole 316. An end surface (a surface opposite the rear end) of the winding core 21 is in contact with the bottom surface (a surface opposite the rear end) of the winding core insertion hole 316.

[0026] The base 30 (the circuit section 33) is a member for disposing a circuit unit 333 thereon, to which coil wires 40a and 40b led from the coil section 49 are connected. The base 30 may include, in addition to the circuit section 33, a wire arrangement section 31 used in the method for manufacturing the antenna device 100 described below. Hereinafter, the circuit section 33 is referred to as the base 30, or the circuit section 33 and the wire arrangement section 31 are also collectively referred to as the base 30.

[0027] In the present embodiment, the circuit portion 33 has the shape of a half cylinder with a substantially semicircular bottom surface, as shown in Fig. 1. The circuit portion 33 is arranged such that semicircular surfaces corresponding to the bottom surface of the half cylinder are arranged at the front and rear, a flat portion (a top surface 33a) of the side surfaces of the half cylinder faces upward, and a curved peripheral surface of the side surfaces of the half cylinder faces downward. The shape of the circuit portion 33 is not limited to a half cylinder with semicircular bottom surfaces, and it can also have other shapes, such as a flat plate, a prism, or a cylinder.

[0028] In the present embodiment, the upper surface 33a of the circuit portion 33 is provided with a placement hole 334 recessed downward (see Fig. 3 and Fig. 8). In the present embodiment, as shown in Fig. 3, the placement hole 334 is open upwards and to the rear. The placement hole 334 can also be shaped so that it is only open upwards.

[0029] The bottom surface of the placement hole 334 is sufficiently large and has a suitable shape to accommodate the circuit unit 333 described below. Specifically, in the present embodiment, to accommodate the rectangular circuit unit 333 whose long side runs from front to back, the placement hole 334 is also rectangular in shape with its long side running from front to back. The widthwise and front-to-back dimensions of the placement hole 334 are each equal to or larger than the widthwise and longitudinal dimensions of the circuit unit 333.

[0030] In the present embodiment, the dimensions of the placement hole 334 in the width direction and in the length direction from front to back are respectively larger than the dimensions of the circuit unit 333 in the width direction and in the length direction. As shown in Fig. 2, there is a gap between the circuit portion 33 and the circuit unit 333 on each of the front end side, the left side, and the right side of the circuit unit 333.

[0031] The circuit unit 333 is accommodated within the placement hole 334. The term "accommodated therein" means that the circuit unit 333 is partially or completely arranged within the placement hole 334. In the present embodiment, an upper surface 333a of the circuit unit 333 is lower than the upper surface 33a of the circuit section 33, as will be described in more detail below. That is, as in Fig. 3, the circuit unit 333 is entirely accommodated within the placement hole 334, but the present invention is not limited to this. The upper portion of the circuit unit 333 may also be higher than the upper surface 33a of the circuit section 33. Furthermore, it is also possible to provide a configuration in which the circuit section 33 does not have the placement hole 334 and the circuit unit 333 is disposed on the upper surface 33a of the circuit section 33.

[0032] The circuit unit 333 is an element that connects the pad portions 331 (see Fig. 2 and Fig. 3), which will be described in more detail below, and are connected to the coil wire 40, and also serves as a circuit board for mounting semiconductor components and the like thereon. The circuit board may be coated with plastic or the like and may, for example, be housed inside a hollow member. In the present embodiment, the circuit unit 333 and the circuit section 33 for disposing the circuit unit 333 thereon are separate elements, but the present invention is not limited to this. Thus, the circuit unit 333 and the circuit section 33 may also be integrally formed as a single element.

[0033] Pad portions 331 are arranged on the upper surface 333a of the circuit unit 333. Pad portions 331 are elements to which the solder material 50 is applied for soldering the coil wire 40 to the respective pad portion 331. More specifically, pad portions 331 are portions coated with a conductive metal such as copper or nickel in the form of a thin film. Pad portions 331 are connected, for example, to a circuit portion of a semiconductor substrate. Thus, the coil wire 40 and the circuit portion are electrically connected to each other via pad portions 331.

[0034] The thickness (the dimension in the height direction) of the pad portions 331 is preferably smaller than a base height h2 (the height of the upper surface 33a of the circuit portion 33 with reference to the upper surface 333a of the circuit unit 333) which will be described below.

[0035] As in Fig. 2 and Fig. As shown in FIG. 4, in the present embodiment, two pad portions 331 are provided at two locations on the upper surface 333a of the circuit unit 333. Thus, the opposite ends of the coil wire 40 can be connected to the respective pad portions 331. More specifically, the respective pad portions 331 of the present embodiment are arranged on the left side and the right side at the rear end of the upper surface 333a of the circuit unit 333. The left and right pad portions 331 are arranged at mirror-symmetrical positions with respect to the center line of the circuit unit 333 in the left-right direction and thus have a mirror-symmetrical shape.

[0036] In the present embodiment, the opposite ends of the coil wire 40 are connected to the pair of pad portions 331 provided on the base 30 via the solder 50. Each of the pair of pad portions 331 is formed in a substantially rectangular shape with its long side extending from front to back. Furthermore, the rectangular shape has a respective slanted side 331a (see Fig. 4) formed by chamfering a corner on the inner side of each of the pair of pad portions 331. Specifically, each rectangle is shaped such that a corner located on the inner side and the front end of the rectangle is chamfered. That is, the pad portions 331 each have a pentagonal shape. Furthermore, the chamfered side 331a extends along the direction in which the coil wire 40 extends. Here, the direction in which the coil wire 40 extends is the axial direction of the coil wire 40. The expression “the oblique side 331a extends along the direction in which the coil wire 40 extends” means that the direction in which the coil wire 40 extends and the oblique side 331a are preferably substantially parallel, and means that an acute angle of the angles formed by the direction in which the coil wire 40 extends and the oblique side 331a is 45 degrees or less.

[0037] The coil wire 40, which is led out from the antenna section 20, is arranged on the base 30 and connected to the pad sections 331.

[0038] As in Fig. As shown in Figure 1, a corner at the boundary between a side surface at the front end of the base 30 and the upper surface 33a is chamfered to provide an inclined surface 33c. Furthermore, the front end of the base 30 is provided with a pair of guide members 335 that protrude from the upper surface 33a of the circuit section 33 and are spaced apart from each other in the left-to-right direction. As shown in Fig. 2, the guide elements 335 are each arranged further outward than a pair of pad portions 331. The guide elements 335 each have a substantially rectangular shape with its long side extending along the longitudinal direction and have a rounded corner at the boundary between a side surface at the rear end and a side surface on the outer side. That is, a part of an outer side surface 335a (see Fig. 2), which is located on the outside of the respective guide element 335, is a curved outer surface.

[0039] As in Fig. 1 and Fig. 2, the coil wire 40, which is guided toward the base 30, is arranged along the inclined surface 33c and the outer side surface 335a of the respective guide element 335. Furthermore, the coil wire 40 is arranged along the upper surface 33a of the circuit section 33 and the outer side surface 335a of the respective guide element 335. That is, the coil wire 40 bends along the curved outer surface that forms part of the outer side surface 335a. The end portions of the coil wire 40 are soldered to the respective pad portions 331, which are arranged further inward than the guide elements 335. Furthermore, as shown in Fig. 2 and Fig. 4, in the present embodiment, one end of the coil wire 40 extends far back beyond the solder material 50.

[0040] Examples of the solder material 50 for soldering the coil wire 40 to the pad portions 331 include metallic solder materials such as solder and gold solder. The solder material 50 melts in a melting step described below, and the resulting molten solder material 50 comes into contact with the coil core 47 of the coil wire 40 and the pad portion 331, thereby forming an alloy layer between the coil core 47 and the pad portion 331.

[0041] The following description is based on the assumption that the solder material is 50 solder.

[0042] The coil wire 40 is partially embedded in the solder 50 (or the solder 50). Herein, the expression “the coil wire 40 is partially embedded in the solder 50” is not limited to an arrangement in which, like the solder 50a, which is embedded in the Fig. 4 and Fig. 5, the solder 50 completely covers the coil wire 40 in the radial direction and the coil wire 40 is completely surrounded by the solder 50 in a partial section of the coil wire 40. For example, it is possible to provide an arrangement in which, like the solder 50b shown in the Fig. 4 and Fig. 5, there is no portion where the coil wire 40 in the radial direction is completely covered with the solder 50, but instead, a part of the coil wire 40 in the radial direction is covered with the solder 50, while another part of the coil wire 40 in the radial direction is not covered with the solder 50. That is, it is possible that only a part in the radial direction is an outer region described below, whereas another part in the radial direction may be an inner region described below. Preferably, with respect to a given point of the coil wire 40, at least half of the circumference of the coil wire 40, or more preferably at least 3 / 4 of the circumference of the coil wire 40, is covered with the solder 50.The “radial direction” here is a direction that starts from the axial center of the coil wire 40 and is orthogonal to the axial direction, that is, a direction that extends radially from the axis of the coil wire 40 to its peripheral surface. Method for manufacturing an antenna device

[0043] Next, a method of manufacturing the antenna device 100 of the present embodiment (hereinafter also referred to as the present method) will be described.

[0044] First, an overview of the present procedure is described.

[0045] The antenna device 100 manufactured by the present method includes, as described above, the antenna portion 20 formed by winding the coil wire 40 whose coil core 47 is covered with the insulating sheath 46, and the base 30 having the pad portions 331 to which a part of the coil wire 40 is soldered with the solder material 50.

[0046] The present method includes a melting step and a removal step. In the melting step, the solder material 50 supplied to each pad portion 331 is irradiated with a laser beam to melt the solder material 50. In the removal step, the coil wire 40 is immersed in the molten solder material 50, so that a part of the insulating coating 46 is removed from the coil wire 40. Thus, the coil wire 40 and the pad portion 331 are connected with the solder material 50. The present method of the present embodiment also includes a wire arranging step, which is performed before the melting step and the removal step, as described below, and a cutting step, which is performed after the melting step and the removal step.

[0047] In the following, the base 30 in the present method is first described.

[0048] In the present method, the base 30 comprises a circuit portion 33 and a wire arrangement portion 31, as shown in Fig. 6. The wire arranging portion 31 is a portion for fixing an end portion of the coil wire 40 to the base 30. In the present embodiment, the wire arranging portion 31 is a plate-like member elongated in the longitudinal direction. That is, the wire arranging portion 31 extends in the longitudinal direction. The main surfaces of a plate-like portion (flat plate portion 315) of the wire arranging portion 31 face upward and downward. The shape of the wire arranging portion 31 is not limited to a flat plate and may also have other shapes, such as a half cylinder.

[0049] The wire arrangement section 31 is arranged on a side of the circuit section 33 facing away from the antenna section 20, that is, on the rear side of the circuit section 33. In the present embodiment, the wire arrangement section 31 is formed integrally with the circuit section 33. In addition, as shown in Fig. 9, an upper surface 315a of the flat plate portion 315 is at a lower level than the upper surface 33a of the circuit portion 33.

[0050] The base 30 (the wire arrangement portion 31) includes a wire fixing portion 312 for fixing the coil wire 40 thereto. The wire fixing portion 312 is a portion to which end portions of the coil wire 40 are fixed. In the present embodiment, the wire fixing portion 312 is a quadrangular prism projecting upward from the upper surface 315a of the flat plate portion 315 at the rear end. As described below, the coil wire 40 can be fixed by binding the coil wire 40 to the projecting quadrangular prism.

[0051] The shape of the wire fixing portion 312 is not limited to an upwardly projecting shape, and any shapes are possible as long as the wire fixing portion 312 has a shape or function for fixing one end of the coil wire 40 thereto, such as a portion projecting in the left-right direction, toward the rear end, or in the downward direction, or a hook shape.

[0052] In addition, between a support portion 311 and the wire fixing portion 312 of the flat plate portion 315, a cutout hole 314 (see Fig. 7) with a rectangular shape, the long side of which runs along the longitudinal direction.

[0053] Next, the present procedure will be described in detail by kingdom with reference to the Fig. 6 to 11.

[0054] In the present embodiment, the solder 50 is first applied to the surface of the respective pad portions 331 before the wire arrangement step described below. More specifically, as shown in Fig. As shown in Figure 8, the solder 50 is formed in the shape of a hill with a sloped surface 51 that slopes downward from the center of the pad portion 331 to the periphery of the pad portion 331. The solder 50 contacts substantially the entire surface area of ​​the pad portion 331. The sloped surface 51 of the solder 50 has the shape of an arc that curves upward, and the solder 50 as a whole has the shape of a dome. The solder 50 is cooled to solidify.

[0055] At this time, it is preferable that the distance from the surface of the pad portion 331 to the highest position (i.e., a vertex 52) of the solder 50 (i.e., the thickness of the solder 50) is greater than the base height h2 described below (see Fig. 9) and is equal to or larger than the wire diameter of the coil wire 40.

[0056] Next, the wire arranging step of arranging the end portions of the coil wire 40 over the base 30 is performed.

[0057] In the wire arranging step, one end (a fixed portion 43) of the coil wire 40 is fixed to the wire fixing portion 312, and a part (a portion 42 to be arranged over the pad portion) of the coil wire 40 is arranged over the solder material 50 provided on the surface of the pad portion 331.

[0058] More precisely, as in Fig. 6 and Fig. As shown in Figure 7, one end of the coil wire 40, which is led out from the antenna portion 20 on which the coil wire 40 is wound, is led toward the circuit portion 33. The thus led out coil wire 40 is arranged along the inclined surface 33c, the upper surface 33a of the circuit portion 33, and the outer side surface 335a of the respective guide member 335, as described above. Since the coil wire 40 is arranged along the round surface of the outer side surface 335a of the respective guide member 335, the direction in which the coil wire 40 is led changes inward. Accordingly, the coil wire 40 is led toward the pad portions 331.

[0059] As in Fig. As shown in Figure 7, a partial longitudinal portion (the portion 42 to be arranged over the pad portion) of the coil wire 40 is arranged over the pad portions 331. Herein, the expression "a partial longitudinal portion of the coil wire 40 is arranged over the pad portions 331" means that a part of the coil wire 40 overlaps a part of the pad portion 331 when viewed from above. It is preferable that a part of the portion 42 to be arranged over the pad portion is arranged further outward than the apex 52 (see Fig. 8).

[0060] In the present embodiment, as shown in Fig. 8, a portion of the portion 42 disposed over the pad portion is disposed over the pad portion 331 and is not in contact with the surface of the pad portion 331. The solder 50 and the portion 42 disposed over the pad portion may or may not be in contact with each other.

[0061] As in Fig. As shown in Figure 6, after the portion 42 to be disposed over the pad portion is disposed over the pad portion 331, an end portion of the coil wire 40 is bound to the wire fixing portion 312 and thus fixed thereto. At this time, sufficient tension is applied to the coil wire 40 disposed over the base 30 so that the coil wire 40 does not come loose.

[0062] In the present embodiment, the base 30 includes the support portion 311, which changes the direction in which the coil wire 40 is guided when the coil wire 40 is pressed against the support portion 311. In the wire arrangement step, as shown in Fig. 7, a bent portion 45 located between a portion of the coil wire 40 (the portion 42 disposed above the pad portion) and an end portion (the fixed portion 43) of the coil wire 40 is pressed against the support portion 311 of the base 30 and thus bends. The bent portion 45 is a portion of a length of the coil wire 40 between the portion 42 disposed above the pad portion and the fixed portion 43. More specifically, the bent portion 45 includes a length of the coil wire 40 that contacts the support portion 311 and thus bends, and a length adjacent thereto.

[0063] The support portion 311 is a member for holding the coil wire 40 so as to maintain the direction in which the coil wire 40 is guided. Examples of the support portion 311 include a cylindrical protruding portion projecting upward from the upper surface 315a of the flat plate portion 315, as shown in Fig. 6. As described below, the direction in which the coil wire 40 guided by the respective guide members 335 is guided is maintained at a predetermined angle while bringing the inner side of the coil wire 40 into pressure contact with the support portion 311. The support portion 311 may also be a prism or a semi-cylindrical protruding portion having a semicircular bottom surface. Alternatively, the support portion 311 may also be a wall portion having a curved or straight wall with which the coil wire 40 can come into contact and protruding from the base 30. The shape of the support portion 311 is not limited to the above shapes, as long as the support portion 311 has a structure for maintaining the direction in which the coil wire 40 is guided.

[0064] In the present embodiment, the support portion 311 is arranged between the pad portions 331 and the wire fixing portion 312. That is, the support portion 311 is arranged between the portion 42 located above the pad portion and the fixed portion 43 when viewed from above. Such an arrangement allows the bent portion 45 located between the portion 42 located above the pad portion and the fixed portion 43 to be pressed against a side surface of the support portion 311 and thus bend. More specifically, a part of the bent portion 45 is arranged along the outer surface of the support portion 311 and thus bends. At this time, the coil wire 40 is pressed against the side surface of the support portion 311.More specifically, the coil wire 40 is pressed against the side surface of the support portion 311 in the left-right direction on the side opposite to the side on which the coil wire 40 is led out from the coil portion 49. For example, as shown in FIG. Fig. 7, a coil wire 40b (see Fig. 1), which is led out from the coil portion 49 to the base 30 on the right side, is pressed against the outer surface on the left side of the support portion 311.

[0065] An end portion (the fixed portion 43) of the coil wire 40 bent at the bent portion 45 is bonded to the wire fixing portion 312 of the base 30 as described above.

[0066] In the present embodiment, the opposite end portions of the coil wire 40 are arranged above the base 30 as described above. Furthermore, the two end portions of the coil wire 40 cross above the base 30 when viewed from above. More specifically, pressurized portions 44 cross above a pressing tool placement hole 313 when viewed from above. The pressurized portions 44 may or may not be in contact with each other. That is, the pressurized portions 44 may also be twisted together. When parts of the coil wire 40 cross at a single point when viewed from above, a jumper wire portion 220 can be easily placed at the opposite end portions of the coil wire 40 when a pressing tool 200 is placed as described below.

[0067] The pressurized portions 44 of the two coil wires 40a and 40b overlap in the vertical direction at the above-mentioned intersection point. The coil wire 40a can be located either above or below the coil wire 40b at the intersection point. Fig. 8 and Fig. 9 does not show how the pressurized portions 44 of the coil wires 40a and 40b overlap each other.

[0068] When a part of the coil wire 40 is pressed against the support portion 311 as described above, the coil wire 40 led out from the antenna portion 20 can be led out in any direction and thus can be arranged above the pad portion 331. Specifically, by changing the position of the support portion 311 in the longitudinal direction or by changing the width (the dimension in the left-right direction) of the support portion 311, the position of the coil wire 40 can be adjusted to pass through a specific position. For example, if the support portion 311 is arranged closer to the front end side or if the width of the support portion 311 is increased, the coil wire 40 is led out at a larger angle with respect to the longitudinal direction and is thus arranged further inward above the circuit unit 333.

[0069] In the present embodiment, the distance between the pad portion 331 and the support portion 311 is not greater than half the distance between the pad portion 331 and the wire fixing portion 312. Moreover, the width of the support portion 311 (or the diameter of the bottom surface of the support portion 311 if it is a cylinder) is greater than the width of the wire fixing portion 312.

[0070] In the wire arranging step, when the coil wire 40 is arranged on the base 30, the pressurized portion 44 is pressed against the base 30 so that the coil wire 40 is brought into pressure contact with the soldering material 50 (the solder 50). The pressurized portion 44 is a longitudinal portion of the coil wire 40 between an end portion (the fixed portion 43) of the coil wire 40 and a part (the portion 42 located above the pad portion) of the coil wire 40. More specifically, the pressurized portion 44 is a longitudinal portion between the length portion of the coil wire 40 in contact with the support portion 311 (part or all of the bent portion 45) and the portion 42 located above the pad portion, and is a longitudinal portion located above the pressing tool placement hole 313 described below.

[0071] When the base 30 is provided with a hollow portion such as the pressing tool placement hole 313, the direction in which the pressing portion 44 is pressed against the base 30 is toward the pressing tool placement hole 313. In the present embodiment, the pressing portion 44 is pressed downward. Accordingly, the coil wire 40 comes into contact with the solder 50 while being pressed against the solder 50. As described below, the coil wire 40 exerts a force on the inclined surface 51 of the solder 50, acting downward, inward, and toward the front end.

[0072] In order to apply pressure to the pressurized portion 44, the pressure tool 200 is used in the present embodiment.

[0073] As in Fig. As shown in Figure 10, the pressing tool 200 has an overall inverted U-shape. The pressing tool 200 includes a support portion 230. Each of the two end portions of the support portion 230 has an arm 210 projecting therefrom, and the lower end of each arm 210 is provided with a weight portion 211. The support portion 230 and the arms 210 of the present embodiment are each shaped like a flat plate, and the weight portions 211 have a substantially cubic shape. The middle portion of the support portion 230 with respect to its extending direction is provided with the wire bridge portion 220. The wire bridge portion 220 is a portion that directly pressurizes a part (the pressurized portion 44) of the coil wire 40, and includes a pair of claws 221 spaced apart from each other with respect to the direction in which the support portion 230 extends.The claws 221 project to the side opposite the support section 230 (i.e. downwards).

[0074] The shape of the pressing tool 200 is not limited to the above shapes, and the pressing tool 200 may have any shape that can apply pressure to the coil wire 40.

[0075] As in Fig. As shown in Fig. 11, the pressing tool 200 is placed so as to extend over or bridge the wire arranging portion 31. The pressurized portion 44 is disposed between the pair of claws 221, and thus the wire bridge portion 220 comes into contact with the pressurized portion 44 while extending over the pressurized portion 44. More specifically, the wire bridge portion 220 extends over a portion of the pressurized portion 44 where the opposite ends of the coil wire 40 are close to each other or cross when viewed from above. The pressing tool 200 placed over the pressurized portion 44 sinks downward under its own weight.At this time, the depressed jumper wire portion 220 may be positioned in the pressing tool placement hole 313, and further, the lower surface of the support portion 230 may or may not come into contact with the upper surface of the flat plate portion 315.

[0076] As the weight of the pressing tool 200 is transferred to the pressurized portion 44 in contact with the wire bridge portion 220, the pressurized portion 44 is pressed downward. At this time, the pressing tool 200 is stably placed on the coil wire 40 while the pressurized portion 44 is held between the pair of claws 221.

[0077] The distance between a pair of inner end surfaces 212 (see Fig. 10) of the pressing tool 200 is at least as large as the width of the flat plate portion 315. Preferably, the distance between the inner end surfaces 212 of the pressing tool 200 is equal to the width of the flat plate portion 315. Thus, when the pressing tool 200 is placed so as to extend over the coil wire 40, outer end surfaces 315b of the flat plate portion 315 come into contact with the respective inner end surfaces 212 of the pressing tool 200. This enables easy positioning of the pressing tool 200 when it is placed so as to extend over the wire arrangement portion 31 and can prevent the pressing tool 200, which extends over the wire arrangement portion 31, from shifting.

[0078] When the pressurized portion 44 is pressed against the base 30, the coil wire 40 deforms toward the base 30, i.e., downward. Accordingly, the portion 42 to be arranged above the pad portion comes closer to the pad portion 331 and thus comes into contact with the solder 50 previously applied to the pad portion 331 while being pressed against the solder 50. More specifically, as shown in Fig. 8, the coil wire 40 presses against the inclined surface 51 of the soldering material 50 (or the solder 50). In doing so, the coil wire 40 presses against the inclined surface 51 on the outside of the apex 52 of the hill-shaped solder 50. More specifically, the coil wire 40, which includes the portion 42 to be arranged above the pad portion, is clamped at a portion as shown in Fig. 7, viewed from above, presses against the solder 50, is pressed outwards and thus bends slightly. Furthermore, the part of the coil wire 40 that includes the section 42 to be arranged above the pad section is, as shown in Fig. 7 is arranged obliquely with respect to the longitudinal direction when viewed from above. Therefore, the coil wire 40, which includes the portion 42 to be arranged above the pad portion, is also pressed outward at the portion that presses against the solder 50. That is, the portion 42 to be arranged above the pad portion deforms as shown in Fig. 7 seen from above along the inclined surface of the plumb line 50 outwards and also towards the rear end.

[0079] Overall, the coil wire 40 exerts on the solder 50 not only a downward force, but also a force that acts inward and toward the front end. That is, the coil wire 40 presses against the inclined surface 51 of the solder 50 toward the center of the pad portion 331 while exerting a force on the inclined surface 51 of the solder 50 (force T (see Fig. 8)), which acts towards the center of the pad section 331.

[0080] In this way, while the coil wire 40 is pressed against the inclined surface 51 of the solder 50, the direction of pressure exerted by the coil wire 40 on the solder 50 can be kept constant. Furthermore, since the coil wire 40 presses against the inclined surface 51 of the solder 50 rather than the apex 52 of the solder 50, unexpected displacement of the coil wire 40 from left to right or in the longitudinal direction of the solder 50 can be prevented.

[0081] As in Fig. 9, the upper surface 333a of the circuit unit 333 is located at a lower level than the upper surface 33a of the circuit section 33. That is, the upper surface 333a of the circuit unit 333 is located at a lower level than the upper surface 33a of the circuit section 33, which is located closer to the rear end than the circuit unit 333.

[0082] The height (the base height h2) of the upper surface 33a of the circuit section 33 relative to the upper surface 333a of the circuit unit 333 is greater than the thickness of the pad sections 331, as described above. Since the upper surface 333a of the circuit unit 333 is located at a lower level than the upper surface 33a of the circuit section 33, the coil wire 40 comes into contact with the upper surface 33a at the rear end of the circuit section 33 and does not come into contact with the surface of the pad sections 331 or the circuit section 33 when the coil wire 40 is pressed down. Accordingly, damage to the surface of the pad sections 331 or the circuit section 33 by the coil wire 40 can be prevented.

[0083] In addition, the base height h2 is smaller than the height (solder height h1) of the highest point of the solder 50 relative to the upper surface 333a of the circuit unit 333. Preferably, the base height h2 is equal to or less than half of the solder height h1. Accordingly, the height of the portion 42 to be arranged above the pad portion can be set to any position relative to the solder 50. That is, pressing the coil wire 40 against the center of the sloped surface 51 of the solder 50 can allow the coil wire 40 to sufficiently penetrate the solder 50 when the solder 50 melts, as described below.

[0084] After the wire arrangement step, the melting step is performed.

[0085] In the melting step, the solder 50 applied to the pad portion 331 is irradiated with a laser beam (not shown in the drawings) from above, as described above. In the present embodiment, the solder 50 is irradiated with a carbon dioxide gas laser beam. Herein, the term "on the pad portion 331" includes the space on the surface of the pad portion 331 and above the pad portion 331. That is, the term "the solder material 50 applied to the pad portion 331 is irradiated with a laser beam" is not limited to a case where the solder 50 that has been formed and solidified on the surface of the pad portion 331 is irradiated with a laser beam. As described below, it also includes the case where solder 50, such as wire solder, arranged above the pad portion 331 is irradiated with a laser beam. The solder 50 melts due to the heat supplied to it by the laser beam.

[0086] Any embodiments are possible as long as the solder 50 is irradiated with a laser beam, and it does not matter whether the coil wire 40 is irradiated with the laser beam or not.

[0087] In the present embodiment, in the melting step, the solder 50 is applied to the surface of the pad portion 331 so that the thickness of the applied solder 50 is at least equal to the wire diameter of the coil wire 40. In the present embodiment, the solder 50 is formed to have a thickness equal to or greater than the wire diameter of the coil wire 40, and the thickness of the solder 50 remains at least equal to the wire diameter of the coil wire 40 even after the solder 50 is melted by the laser beam.

[0088] As described below, when the solder 50 is applied using wire solder in the melting step, for example, the thickness of the solder 50 melted and applied to the surface of the pad portion 331 is at least equal to the wire diameter of the coil wire 40.

[0089] In this way, while the solder 50 is applied to the surface of the pad portion 331 to achieve a sufficient thickness, the coil wire 40 is sufficiently immersed in the solder 50 in the removal step described below.

[0090] In the present embodiment, in the melting step, the temperature of at least one of the coil wire 40 and the solder 50 (the solder 50) is measured, and an irradiation amount of the laser beam is controlled so that the temperature is within a predetermined range higher than the melting point of the solder 50. Alternatively, an irradiation amount of the laser beam may be controlled so that the temperature is within a predetermined range higher than the decomposition temperature of the insulating sheath 46.

[0091] The temperature can be measured only for the coil wire 40, only for the solder material 50, or both the coil wire 40 and the solder material 50. More specifically, the temperature of the solder material 50 irradiated with a laser beam, or of a portion of the coil wire 40 immersed in the solder material 50, as well as a lengthwise region adjacent thereto, is measured. The temperature is preferably measured without contact with the solder 50. Examples of measuring instruments that can be used to measure the temperature include an infrared radiation thermometer.

[0092] Here, the lower limit of the predetermined range is the melting point of the solder 50 and is preferably higher than the melting point of the insulating sheath 46 and is further preferably higher than the decomposition temperature of the insulating sheath 46. On the other hand, the upper limit of the predetermined range may be the lower limit of temperatures at which the insulating sheath 46 of the coil wire 40 is burned or decomposed at a portion (an outer region described below) not immersed in the solder 50 and thus undergoes a change.

[0093] If the temperature of the measured portion is outside the predetermined range, the irradiation amount of the laser beam is immediately changed. Controlling the irradiation amount of the laser beam includes increasing the irradiation amount of the laser beam when the temperature of the measured portion is below the predetermined range, and also includes decreasing the irradiation amount of the laser beam or stopping the laser beam irradiation when the temperature of the measured portion is above the predetermined range.

[0094] Controlling the laser beam irradiation in the above manner can sufficiently melt the solder 50 and heat the insulating coating 46 to a temperature sufficiently high to remove the insulating coating 46 in the removal step described below. Furthermore, it is also possible to prevent deformation of the insulating coating 46 covering the outer region of the coil wire 40 described below.

[0095] After the melting step, the removal step is carried out.

[0096] When the solder 50 melts and changes into a liquid state, the coil wire 40, which is in pressure contact with the solder 50, is partially immersed in the molten solder 50.

[0097] The coil wire 40, which is in pressure contact with the solder 50 against the center of the pad portion 331 as described above, then penetrates into the interior of the solder 50 to the center of the pad portion 331. More specifically, the coil wire 40 (particularly the portion 42 to be arranged above the pad portion) presses against the inclined surface 51 of the solder 50, as shown in Fig. 8, the solder 50 enters the interior of the solder 50 while moving inward and downward (the coil wire 40a moves downward to the right and the coil wire 40b moves downward to the left). Meanwhile, the coil wire 40, as shown in Fig. 7, as seen from above, into the interior of the solder 50 while moving inward and toward the front end (the coil wire 40a moves downward right in the image plane and the coil wire 40b moves downward left in the image plane).

[0098] In other words, the molten solder 50 surrounds the coil wire 40 from the center of the pad portion 331. More specifically, the solder 50a surrounds Fig. 8 the coil wire 40a from the bottom right and the solder 50b surrounds the coil wire 40b from the bottom left. Accordingly, a part (the upper right section on the image plane) of a lateral peripheral surface 40e (see Fig. 5) of the coil wire 40b may be arranged outside the solder 50b, as described below. Alternatively, a portion of the coil wire 40 may be completely immersed in the solder 50, like the coil wire 40a.

[0099] The liquid solder 50 applied to the surface of the pad portion 331 tends to spread in the transverse direction (the left-right direction and the longitudinal direction) when the coil wire 40 is immersed in the molten solder 50. In the present embodiment, the solder 50 spreads only on the surface of the highly wettable pad portion 331 and does not spread outside the pad portion 331.

[0100] As described above, the coil wire 40 penetrates into the interior of the solder 50 while moving inward and toward the front end as viewed from above. Accordingly, the solder 50 is particularly pushed inward and toward the front end.

[0101] The pad portion 331, as described above, has the shape of a rectangle with a missing corner on the inner side and on the front end side when viewed from above. Accordingly, when the coil wire 40 is immersed in the solder 50, the solder 50, which tries to spread inward and toward the front end, can be prevented from spreading more flatly than necessary. Furthermore, the solder 50, which is prevented from spreading, bulges upward and thus tries to cover the coil wire 40. Thus, an upper peripheral surface 40c (see Fig. 5) of the coil wire 40 is covered with the solder 50. This allows the coil wire 40 to be sufficiently immersed in the solder 50.

[0102] As described above, the solder 50 is unlikely to wet and spread over the upper surface 333a of the circuit unit 333, which is not coated with a metal. Thus, the solder 50 bulges upward on the pad portion 331. The thus bulging solder 50 has a rounded shape due to surface tension, and when viewed from above, it may also appear as if it is also located outside the pad portion 331, as shown in FIG. Fig. 4 shown.

[0103] When the coil wire 40 is immersed in the solder 50 heated to a high temperature by laser beam irradiation, the insulating coating 46 on the surface of the coil wire 40 immersed in the solder 50 is heated by the heat of the molten solder 50. The heating removes the insulating coating 46 in contact with the solder 50.

[0104] Specifically, for example, the insulating sheath 46 is decomposed and thus removed from the coil wire 40. When the temperature of the insulating sheath 46 reaches the decomposition temperature of the insulating sheath 46, the insulating sheath 46 is decomposed. The affinity between the coil core 47, which is made of a metallic material or the like, and the solder 50 is higher than the affinity between the decomposition product of the insulating sheath 46, which is formed of plastic or the like, and the coil core 47. Accordingly, the solder 50 wets the surface of the coil core 47, and the decomposition product of the insulating sheath 46 is removed from the surface of the coil core 47 to outside the solder 50. The decomposition product of the insulating sheath 46 is deposited on the surface of the solder 50.Alternatively, the decomposition product of the insulating sheath 46 sublimates due to the heat of the molten solder 50. In this way, the insulating sheath 46 is decomposed and is thus removed from the surface of the coil wire 40, thereby exposing the coil core 47.

[0105] Alternatively, the insulating sheath 46 may melt instead of decomposing and thus be removed from the coil wire 40. When the temperature of the insulating sheath 46 reaches the melting point of the plastic forming the insulating sheath 46, the insulating sheath 46 melts and thus exhibits increased fluidity, entering a liquid state. When the solder 50 wets the surface of the coil core 47, the insulating sheath 46 in the liquid state is forced outward from the surface of the coil core 47 and thus removed. In the liquid state, the insulating sheath 46 rises to the surface of the solder 50.

[0106] Furthermore, a part of the insulating sheath 46 may melt while another part thereof is decomposed and thus removed from the coil wire 40.

[0107] To sufficiently remove the insulating sheath 46, it is possible to use the coil wire 40 with an insulating sheath 46 with low heat resistance and a low heat-resistant temperature. Examples of insulating materials include those with a heat-resistant temperature of 120 degrees Celsius or less, such as polyurethane. Furthermore, it is also preferable to use a coil wire 40 with an insulating sheath 46 that is thin enough to be easily removed.

[0108] The insulating sheath 46 is preferably transparent or white colored and not colored. This can suppress the laser absorption rate of the insulating sheath 46, thus preventing the direct removal of the insulating sheath 46 by laser beam irradiation and preventing the alteration of the insulating sheath 46 not covered with the solder 50 by laser beam irradiation.

[0109] In this way, the insulating sheath 46 covered with the solder 50 is substantially completely removed from the coil wire 40, but the present invention is not limited thereto.

[0110] A small amount of the insulating coating 46 may also remain on a portion of the coil wire 40 that is immersed in the solder 50. For example, as in Fig. 4, a part of an inner region described below covered with the solder 50b (a region on the inner side of a first boundary line 48) may also be a covered portion 473 described below, on which the insulating coating 46 remains. This may be because the heat of the solder 50b is not sufficiently transferred to the peripheral portion of the inner region (the portion near the first boundary line 48). In addition, as described below, a very small amount of the insulating coating 46 that has not been completely decomposed or melted may remain in the central portion of the inner region.

[0111] It is also possible that a part of the coil wire 40 outside the solder 50 is not covered with the insulating sheath 46. For example, a part of the insulating sheath 46 may be covered at a location near the solder 50a in the outer region of the Fig. 4, resulting in an exposed portion 471 described below. This is because the heat of the molten solder 50 is also transferred to the insulating sheath 46, which is located outside the solder 50 but close to the solder 50.

[0112] After the insulating sheath 46 has been removed from the coil wire 40, the coil core 47 comes into contact with the solder 50.

[0113] Because the metal forming the coil core 47 and the metal forming the solder 50 form an alloy, the coil wire 40 and the pad sections 331 are connected to each other.

[0114] The molten solder 50 is cooled and solidifies.

[0115] In the present embodiment, part of the melting step and part of the removal step are performed in a temporally overlapping manner. The term "performed in a temporally overlapping manner" includes the case where the steps are performed completely simultaneously and the case where parts of the steps are performed simultaneously. Specifically, when the solder 50 starts to melt in the melting step, the removal step begins, so that the coil wire 40 starts to be immersed in the solder 50. That is, the coil wire 40 is immersed in the solder 50 while the solder 50 is melted by a laser beam. The melting step ends when the removal step ends.

[0116] In the present embodiment, the coil wire 40 is continuously pressed against the base side before and during laser beam irradiation. That is, the pressurization in the wire arranging step and part of the melting step are performed in a temporally overlapping manner. Accordingly, the immersion of the coil wire 40 into the solder 50 occurs simultaneously with the melting of the solder 50.

[0117] In the present embodiment, in the melting step, an inert gas (not shown in the drawings) is supplied to the solder 50 along the direction in which the coil wire 40 is pressurized. The inert gas is preferably also supplied in the removal step after the melting step. The direction in which the inert gas is supplied is preferably substantially parallel to the direction in which the coil wire 40 is pressurized. That is, in the melting step, the inert gas is supplied to the solder 50 from above. As the inert gas, a gas having low reactivity with the solder 50 is used. Examples of such an inert gas include nitrogen and rare gases such as argon.

[0118] Supplying the inert gas to the solder 50 can remove the oxygen-containing air around the solder 50. This can prevent the oxidation of the solder 50 and thus improve the wettability of the solder 50 on the peripheral surface of the coil wire 40 and the wettability of the solder 50 on the surface of the pad portion 331.

[0119] Furthermore, supplying the inert gas along the direction in which the coil wire 40 is pressurized can sufficiently remove oxygen in a wide area around the solder 50. That is, since the solder 50 is applied in the shape of a hill so that it protrudes upward, the inert gas is supplied to the entire area of ​​the inclined surface 51 of the solder 50 when supplied from above.

[0120] Instead of supplying the inert gas along the direction in which the coil wire 40 is pressurized, it is also possible to supply the inert gas along the directions of the force acting from the coil wire 40 to the solder 50. That is, the inert gas can be supplied in two directions, namely, a direction toward the upper right of the solder 50 and a direction from the upper left of the solder 50. This specifically allows sufficient inert gas to be supplied to a region around the coil wire 40 that is embedded in the solder 50. Thus, the wettability of the solder 50 on the peripheral surface of the coil wire 40 is advantageously maintained, and the coil wire 40 is thus sufficiently immersed in the solder 50.

[0121] The present method further includes a cutting step, which is performed after the pad portion 331 and the coil wire 40 are joined to the solder 50 in the removal step. In the cutting step, the coil wire 40 and the base 30 are cut so that a part of the coil wire 40, including its one end portion (the fixed portion 43), and a part of the base 30, including the wire fixing portion 312, are removed.

[0122] In the present embodiment, the coil wire 40 and the base 30 are cut along a plane substantially perpendicular to the longitudinal direction. Preferably, the coil wire 40 and the base 30 are cut along the same plane.

[0123] More specifically, the coil wire 40 and the base 30 are cut along a cutting plane defined by the dot-dash line Y in Fig. 9. That is, in the present embodiment, the cutting plane along which the coil wire 40 and the base 30 are cut is a plane located closer to the rear end than a lateral end surface 333b at the rear end of the circuit unit 333 and parallel to the lateral end surface 333b. More specifically, the cutting plane includes the placement hole 334.

[0124] Instead, the cutting plane may be flush with the lateral end surface 333b of the circuit unit 333. Furthermore, the removing step may include cutting the flat plate portion 315 of the wire arrangement portion 31 and the coil wire 40 without cutting the circuit portion 33. In such a case, the cutting plane may be flush with a rear lateral end surface 33d located at the rear end of the circuit portion 33 (the boundary plane between the wire arrangement portion 31 and the circuit portion 33).

[0125] The opposite end portions of the coil wire 40 that are closer to the front end than the cutting plane are removed. Specifically, the end portions of the coil wire 40 that include the pressurized portion 44, the bent portion 45, and the fixed portion 43 are removed. Furthermore, a portion of the base 30 that is closer to the front end than the cutting plane is also removed. Specifically, an end portion of the base 30 that includes the wire arranging portion 31 is removed.

[0126] The antenna device 100 is manufactured through the above steps.

[0127] To manufacture the antenna device 100, the melting step of melting the solder 50 by laser beam irradiation and the step of removing a portion of the insulating sheath 46 from the coil wire 40 by immersing the coil wire 40 in the molten solder 50 are the essential steps. Other steps or other components may be optionally included.

[0128] According to the present method, when the coil wire 40 is immersed in the solder 50 for soldering, the insulating sheath 46 is removed from the coil wire 40. That is, according to the present method, it is possible to remove the insulating sheath 46 during the soldering step, and thus, the need to perform a step of removing the insulating sheath 46 from the coil wire 40 before the soldering step can be avoided. This can reduce the manufacturing steps for the antenna device 100. Details of the antenna device

[0129] Next, the features of the antenna device 100 manufactured in the present embodiment will be described in detail.

[0130] The coil wire 40 includes an exposed portion 471 in which the coil core 47 is not covered with the insulating sheath 46 and is thus exposed. On the peripheral surface of the coil wire 40, a first boundary line 48, which is the boundary between the inner region buried in the solder 50 and the outer region outside the solder 50, and a second boundary line 472, which is the boundary between the exposed portion 471 and the covered portion 473 of the coil wire 40 covered with the insulating sheath 46, are arranged along each other.

[0131] The fact that a part of the circumferential surface of the coil wire 40 is embedded in the solder 50 means that (only) a part of the circumferential surface of the coil wire 40 is covered with the solder 50.

[0132] The inner region is a partial region of the circumferential surface of the coil wire 40 embedded in the solder 50, which is a region on the inside of the first boundary line 48 (see Fig. 4). The outer region is a portion of the peripheral surface of the coil wire 40 not covered by the solder 50, which is an area on the outside of the first boundary line 48.

[0133] As in Fig. 4, two first boundary lines 48 are arranged spaced apart from each other in the longitudinal direction on the circumferential surface of the coil wire 40a. The first boundary lines 48 on the coil wire 40a surround the coil wire 40a in the circumferential direction. The inner region (the region on the inner side of the first boundary line 48) is a partial region on the circumferential surface of the coil wire 40a that is located between the pair of first boundary lines 48. That is, the inner region of the coil wire 40a extends radially over the entire coil wire 40a.

[0134] A single first boundary line 48, which has a substantially elliptical shape, is formed on the circumferential surface shown in Fig. 4 coil wire 40b. The inner region of the coil wire 40b is a substantially elliptical region within the first boundary line 48. More specifically, the inner region of the coil wire 40b partially covers the circumferential surface on the lower side (a lower circumferential surface 40d described below) of the coil wire 40b, and extends in the radial direction only over a part of the coil wire 40b.

[0135] The exposed portion 471 is a partial area of ​​the peripheral surface of the coil wire 40 and is the area not covered with the insulating sheath 46 and where the coil core 47 is exposed. As described above, there may be cases where the insulating sheath 46 is not sufficiently removed in the removal step, and thus a small amount of the insulating sheath 46 remains in a central portion of the inner region. That is, the insulating sheath 46 may also be disposed in a small part of the central portion of the exposed portion 471. In such a case, the area where the insulating sheath 46 is disposed on the inner side, excluding the circumferential edge, of the inner region is also regarded as the exposed portion 471. Preferably, the insulating sheath 46 is completely removed over the entire area of ​​the exposed portion 471.

[0136] On the other hand, except for the exposed portion 471, a portion of the peripheral surface of the coil wire 40 is covered with the insulating sheath 46. A portion of the peripheral surface of the coil wire 40 covered with the insulating sheath 46 is considered a covered portion 473.

[0137] In the coil wire 40a, the exposed portion 471 of the coil wire 40a extends over the entire circumferential surface. An exposed portion 471a is a region located between a pair of second boundary lines 472a spaced apart from each other in the longitudinal direction. The second boundary lines 472a completely surround the circumferential surface of the coil wire 40a in the circumferential direction. On the other hand, an exposed portion 471b of the coil wire 40b has a substantially elliptical shape, including a part of the lower circumferential surface 40d described below, and extends in the radial direction only over a part of the coil wire 40b. That is, the exposed portion 471b is a region within the second boundary line 472, which has a substantially elliptical shape.

[0138] As in Fig. 4, the exposed portion 471 and the inner region substantially coincide, but do not have to coincide completely. For example, the exposed portion 471 may also include the outer region, and the inner region may also include the covered portion 473. The larger part of the exposed portion 471 of the coil wire 40a is covered with the solder 50 and thus coincides with the inner region, but a part of the exposed portion 471 is located outside the solder 50 and thus corresponds to the outer region. The larger part of the inner region of the coil wire 40b is the exposed portion 471 in which the coil core 47 is exposed, but the remainder of the inner region is the covered portion 473, which is covered with the insulating sheath 46.

[0139] Herein, the first boundary line 48 and the second boundary line 472 are arranged along each other, meaning that the projections and recesses of the first boundary line 48 and the second boundary line 472 correspond to each other. That is, the shapes of the first boundary line 48 and the second boundary line 472 are substantially identical. Preferably, the acute angles among the angles formed by the tangent at a part of the first boundary line 48 and the tangent at the part of the second boundary line 472 closest to the first boundary line 48 are smaller than the acute angles among the angles formed by a plane orthogonal to the direction in which the coil wire 40 extends and the first boundary line 48.

[0140] It is preferred that the first boundary line 48 and the second boundary line 472 be sufficiently close to one another. More specifically, the distance between a portion of the first boundary line 48 and the portion of the second boundary line 472 closest thereto is preferably at most as large as the wire diameter of the coil. More preferably, the distance between a portion of the first boundary line 48 and the portion of the second boundary line 472 closest thereto is zero. In such a case, the first boundary line 48 and the second boundary line 472 substantially coincide.

[0141] The first boundary line 48 may be located inside or outside the exposed portion 471. For example, a first boundary line 48a of the solder 50a is present on the exposed portion 471a. That is, the first boundary line 48a is located on the inside of the second boundary line 472a in the exposed portion 471a. On the other hand, a portion in the longitudinal direction of the first boundary line 48 of the solder 50b (a first boundary line 48b) is located outside the exposed portion 471b. That is, a portion in the longitudinal direction of the first boundary line 48 (the first boundary line 48b) is located more toward the outside of the exposed portion 471b than the second boundary line 472b. In addition, another portion in the longitudinal direction of the first boundary line 48 of the lot 50b (a first boundary line 48c) substantially coincides with a portion of the second boundary line 472 (a second boundary line 472c).

[0142] Furthermore, the second boundary line 472 and the first boundary line 48 may also intersect. That is, a partial region in the longitudinal direction of the first boundary line 48 may be arranged on the outside of the exposed portion 471, while another partial region in the longitudinal direction of the first boundary line 48 may be arranged on the inside of the exposed portion 471, so that the second boundary line 472 and the first boundary line 48 intersect.

[0143] When the solder 50 is formed in a shape that surrounds the coil wire 40 so that the first boundary line 48 and the second boundary line 472 are arranged along each other, the antenna device 100 can be manufactured using the above manufacturing method. That is, the antenna device 100 of the present embodiment has a configuration that can be manufactured through a small number of manufacturing steps.

[0144] In addition, since the first boundary line 48 and the second boundary line 472 are arranged along each other, substantially the entire area of ​​the exposed portion 471 is covered with the solder 50, so that an area of ​​the exposed portion 471 not covered with the solder 50 (an area where the coil core is exposed) can be minimized. This can prevent the coil core 47 from being exposed more than necessary and thus can improve the insulating property of the coil wire 40. Further, by reducing the exposure of the coil core 47, deterioration of the coil core 47 due to wear or oxidation can be prevented.

[0145] It is also possible to manufacture an antenna device 100 having the above-described arrangement, in which the coil wire 40 is surrounded by solder 50 such that the first boundary line 48 and the second boundary line 472 are arranged along each other, independently of the above manufacturing method. For example, the insulating coating may be removed in a state where portions of the peripheral surface of the coil wire 40 that are not to be covered with the solder 50 are previously masked.

[0146] In the present embodiment, the thickness (the dimension in the height direction) of the solder material 50 (or the solder 50) is greater than the wire diameter of the coil wire 40. The thickness of the solder 50 refers to the maximum height of the solder 50 relative to the surface of the pad portion 331 in the area where the solder 50 is arranged, as viewed from above, and at the locations where the coil wire 40 and the solder 50 do not overlap. That is, the thickness of the solder 50 does not include the thickness of the coil wire 40 and means the thickness of only the solder 50. For example, as shown in Fig. 5, the solder 50 is substantially formed in the shape of a hill with an apex located above the coil wire 40. In such a case, the highest position of the solder 50 is present above the coil wire 40, but the thickness of the solder 50 is smaller than the height of the solder 50 (the distance from the surface of the pad portion 331 to the highest position of the solder 50). In such a case, the thickness of the solder 50 corresponds to the height of the solder 50 at a point directly to the side of the coil wire 40.

[0147] Since the solder 50 is formed to have a sufficient thickness equal to or greater than the wire diameter of the coil wire 40, the coil wire 40 can be sufficiently immersed in the solder 50 in the method for manufacturing the antenna device 100 described below.

[0148] Furthermore, by applying the solder 50 to a thickness at least equal to the wire diameter of the coil wire 40, substantially all of the coil wire 40 can be embedded in the solder 50 in the radial direction. This allows the solder 50 and the coil wire 40 to be more firmly physically bonded to each other, and also allows the solder 50 and the coil wire 40 to be better electrically bonded to each other.

[0149] In the present embodiment, when viewed over a partial length of the coil wire 40b (in an embedded portion 42a, which is the partial length having the exposed portion 471 as viewed in the radial direction of the coil wire 40), a part of the coil wire 40b in the radial direction corresponds to the exposed portion 471, whereas another part of the coil wire 40b in the radial direction corresponds to the covered portion 473. That "a part of the coil wire 40b in the radial direction corresponds to the exposed portion 471, whereas another part of the coil wire 40b in the radial direction corresponds to the covered portion 473 corresponds to" means that, with respect to a cross section, at a given point of the embedded portion 42a, a part of the circumference (arc) of the circle of the cross section is not covered with the insulating sheath 46 and thus the coil core 47 is exposed, whereas another part of the circumference is covered with the insulating sheath 46.

[0150] In the present embodiment, the Fig. 4 and Fig. 5, over the entire area of ​​the embedded portion 42a, a part of the coil wire 40b in the radial direction corresponds to the exposed portion 471, whereas another part of the coil wire 40b in the radial direction corresponds to the covered portion 473. That is, the insulating sheath 46 is not interrupted by the exposed portion 471.

[0151] In other words, a first insulating sheath 46a and a second insulating sheath 46b of the coil wire 40, each covering a first length portion and a second length portion of the coil wire 40, between which the embedded portion 42a (the partial length portion embedded in the solder material) of the coil wire is arranged, are connected to each other in the radial direction by a bridge portion 461 having a width smaller than the wire diameter of the coil wire 40 and extending along the extending direction of the coil wire 40.

[0152] Here, the first length region and the second length region are regions outside the solder material 50 and are partial regions in the longitudinal direction of the coil wire 40 that are located closer to the front end or the rear end than the pad portion 331 when viewed from above. As shown in Fig. As shown in Figure 4, the first insulating sheath 46a covers the entire circumference of the coil wire 40 (the first length range) located closer to the front end than the embedded portion 42a. In contrast, the second insulating sheath 46b covers the entire circumference of the coil wire 40 (the second length range) located closer to the rear end than the embedded portion 42a.

[0153] The bridge portion 461, which connects the first insulating sheath 46a and the second insulating sheath 46b, is arranged on the peripheral surface of the embedded portion 42a. The bridge portion 461 is a part of the insulating sheath 46, has a narrow width, and extends along the axial direction of the coil wire 40. The longitudinal direction of the bridge portion 461 and the extension direction of the coil wire 40 are adjacent to each other. Here, the width of the bridge portion 461 refers to the minimum circumferential length of the bridge portion 461. Furthermore, the expression "the longitudinal direction of the bridge portion 461 and the extension direction of the coil wire 40 are adjacent to each other" means that the acute angles obtained by projecting an imaginary center line through the center of the bridge portion 461 in the width direction onto the axis of the coil wire 40 are 30 degrees or less.Preferably, the center line of the bridge portion 461 and the axis of the coil wire 40 are substantially parallel to each other.

[0154] Furthermore, in the present embodiment, in the longitudinal direction portion of the coil wire 40 (the embedded portion 42a), a part of the upper surface (the upper peripheral surface 40c) of the coil wire 40 on the side facing away from the pad portion 331 and a part of the lower surface (the lower peripheral surface 40d) of the coil wire 40 on the side facing the pad portion 331 correspond to the exposed portion 471 from which the insulating sheath 46 has been removed, and thus is in contact with the solder material 50. On the other hand, a part of the lateral side of the coil wire 40 in a longitudinal direction portion corresponds to the covered portion 473 covered with the insulating sheath 46 and thus is not in contact with the solder material 50.

[0155] Here, as in Fig. 5, the upper peripheral surface 40c is a region of the peripheral surface of the embedded portion 42a that has a predetermined width including the upper end of the coil wire 40. That is, the upper peripheral surface 40c may be a substantially linear region including only the upper end of the coil wire 40, or it may be a long, thin region including the upper end of the coil wire 40 and the region in the immediate vicinity thereof. On the other hand, the lower peripheral surface 40d is a region of the peripheral surface of the embedded portion 42a that has a predetermined width including the lower end of the coil wire 40. Like the upper peripheral surface 40c, the lower peripheral surface 40d may be either a substantially linear region including only the lower end, or it may be a long, thin region having a certain width.The width of the upper peripheral surface 40c or the lower peripheral surface 40d may be equal to or less than half the wire diameter of the coil wire 40 or equal to or greater than half the wire diameter of the coil wire 40.

[0156] Herein, the phrase "a part of the side surface of the coil wire 40 corresponds to the covered portion 473" means that at least a part of the side surface corresponds to the covered portion 473. The side surface 40e is a portion of the peripheral surface of the coil wire 40 excluding the upper peripheral surface 40c and the lower peripheral surface 40d.

[0157] Furthermore, in the present embodiment, a part of the upper surface of the lateral side of the coil wire 40 in the partial length region (in the embedded portion 42a) corresponds to the covered portion 473 covered with the insulating sheath 46 and thus is not in contact with the solder material 50, whereas the entire lower surface of the lateral side of the coil wire 40 in the partial length region (in the embedded portion 42a) corresponds to the exposed portion 471 from which the insulating sheath 46 has been removed and thus is in contact with the solder material 50. That is, a region on the outer side and upper side of the side surface 40e corresponds to the covered portion 473, whereas a region on the lower side of the side surface 40e corresponds to the exposed portion 471.Herein, the top surface of the side surface 40e is a region of the side surface 40e located above the center of the cross section of the coil wire 40, whereas the bottom surface of the side surface 40e is a region located below the center of the cross section and facing the pad portion 331.

[0158] The present invention is not limited to an arrangement in which both the upper peripheral surface 40c and the lower peripheral surface 40d correspond to the exposed portion 471 over the entire length range of the embedded portion 42a. It is also possible for the upper peripheral surface 40c or the lower peripheral surface 40d to correspond to the exposed portion 471 over part of the length range of the embedded portion 42a, whereas the upper peripheral surface 40c or the lower peripheral surface 40d corresponds to the covered portion 473 over the remainder of the length range.

[0159] By embedding a part of the coil wire 40 in the radial direction in the solder 50, whereas another part is arranged outside the solder 50, the coil wire 40 and the pad portion 331 can be connected to each other by a smaller amount of the solder 50.

[0160] Furthermore, by covering the part of the coil wire 40 in the radial direction not covered with the solder 50 with the insulating sheath 46, the entire circumference of the coil core 47 of the embedded portion 42a is covered with the insulating sheath 46 or the solder 50. Accordingly, the coil core 47 is not exposed to the outside, which can prevent, for example, deterioration of the coil core 47 due to oxidation or wear, which might otherwise lead to breakage of the coil core 47.

[0161] Furthermore, since a portion of the coil wire 40 in the radial direction is not covered with the solder 50 over the entire length of the embedded portion 42a, the heat resistance and fatigue properties of the connection of the pad portion 331 to the coil wire 40 are improved. For example, when the coil wire 40 enters the molten solder 50, air adhering to the coil wire 40 may enter the interior of the solder 50. In contrast, according to the present embodiment, since a portion of the coil wire 40 in the radial direction is not covered with the solder 50 over the entire length of the embedded portion 42a, air that has entered any portion in the solder 50 can more easily move upward along the surface of the coil wire 40 and thus be removed from the solder 50.This can prevent the generation of voids in the solder 50 and thus can prevent deterioration of the joint over time due to shrinkage or expansion of air in the solder 50 due to temperature changes around the joint.

[0162] Furthermore, when the upper peripheral surface 40c of the peripheral surface of the coil wire 40 is covered with the soldering material 50, the upper peripheral surface 40c, which easily comes into contact with other members and thus is prone to wear, can be protected by the soldering material 50.

[0163] It should be noted that, as in Fig. 4, the entire embedded portion 42a of the coil wire 40a embedded in the solder 50a corresponds in the radial direction to the exposed portion 471 from which the insulating sheath 46 has been removed over substantially the entire length. In the present embodiment, both ends of the embedded portion 42a protrude obliquely from the solder 50a with respect to the circumferential direction of the coil wire 40a. The first insulating sheath 46a, which covers the first length region closer to the front end than the embedded portion 42a of the coil wire 40a, and the second insulating sheath 46b, which covers the second length region closer to the rear end than the embedded portion 42a, are interrupted by the exposed portion 471 and thus spaced from each other.

[0164] In addition, at the two opposite ends of the embedded portion 42a, only a part of the coil wire 40 in the radial direction corresponds to the inner region covered with the solder 50, whereas another part thereof in the radial direction corresponds to the outer region not covered with the solder 50.

[0165] In the present embodiment, at the two opposite ends of the embedded portion 42a, a portion of the outer peripheral surface of the coil wire 40a located near the solder 50a corresponds to the exposed portion 471a from which the insulating sheath 46 has been removed. Alternatively, the portion of the outer peripheral surface of the coil wire 40a located near the solder 50a may correspond to the covered portion 473 covered with the insulating sheath 46. That is, the second boundary line 472 and the first boundary line 48 may also substantially coincide, or the second boundary line 472 may be located on the inner side of the exposed portion 471.In such a case, at each of the two opposite ends of the embedded portion 42a, a portion of the coil wire 40a is covered in the radial direction with the solder 50, while another portion thereof is covered in the radial direction with the insulating sheath 46. This can prevent, for example, deterioration of the coil core 47 due to wear or oxidation, which could otherwise lead to breakage of the coil core 47 at the opposite ends of the embedded portion 42a, as described above.

[0166] Although the present embodiment shows a configuration in which only one of the left and right coil wires 40a and 40b, over the entire length range of the embedded portion 42a, has a portion in the radial direction corresponding to the exposed portion 471, while the other portion of the coil wire 40b in the radial direction corresponds to the covered portion 473, the present invention is not limited to this. That is, it is also possible that in both the left and right coil wires 40a and 40b, over the entire length range of the embedded portion 42a, a portion in the radial direction corresponds to the exposed portion 471, while the other portion of the coil wire 40b in the radial direction corresponds to the covered portion 473. Alternatively, the entire portion of both the left and right coil wires 40a and 40b over the entire length range in the radial direction may also correspond to the exposed portion 471.

[0167] In the present embodiment, as shown in Fig. 2 and Fig. 3, the end surfaces 41 of both ends of the coil wire 40 and a lateral end surface 33b of the base 30 (the circuit portion 33) are arranged flush with each other. Here, the end surface 41 of the coil wire 40 is a cross-section formed when the coil wire 40 is cut in the above cutting step. In the present embodiment, the coil wire 40 is arranged obliquely with respect to the cutting plane. Thus, the end surfaces 41 of the coil wire 40 are elliptical. In contrast, the lateral end surface 33b of the circuit portion 33 is a surface opposite the rear end of the circuit portion 33 and has a cross-section formed when the base 30 is cut in the above cutting step. That is, the lateral end surface 33b of the circuit portion 33 lies on the plane defined by the dot-dash line Y in Fig. 9 is displayed.

[0168] Instead of the present embodiment, it is also possible to cut the coil wire 40 and the circuit portion 33 in the cutting step in a plane along the lateral end surface 333b of the circuit unit 333. In such a case, the end surface 41 of the coil wire 40, the lateral end surface 33b of the circuit portion 33, and the lateral end surface 333b of the circuit unit 333 are all arranged flush with each other. Alternatively, it is also possible to cut the base 30 in the cutting step along the boundary plane between the circuit portion 33 and the wire arrangement portion 31 (the same plane as the rear lateral end surface 33d in Fig. 9) to cut.

[0169] In this way, deterioration of the coil wire 40 and the circuit unit 333 due to wear can be prevented because the coil wire 40 and the circuit unit 333 do not protrude toward the rear end beyond the lateral end surface 33b of the circuit portion 33. <Abgewandelte Beispiele>

[0170] It should be noted that the present invention is not limited to the above embodiment and also includes various modifications, improvements and the like within such a scope in which the object of the present invention is achieved.

[0171] The following modified examples can be combined as needed.

[0172] Although, in the above-described embodiment, the solder 50 is previously formed in the shape of a mound on the surface of the pad portion 331 and then solidified, the present invention is not limited to this. The solder 50 does not need to be formed in advance on the surface of the pad portion 331. As described above, for example, solder 50 provided to a region above the pad portion 331 may also be melted with a laser beam in the melting step so that the molten solder 50 falls onto the surface of the pad portion 331. If the solder 50 is not previously formed on the surface of the pad portion 331, but the solder 50 melted in the melting step is applied to the surface of the pad portion 331, the wire arranging step may also be performed after the melting step.That is, it is possible to apply the solder 50 in a liquid state to the surface of the pad portion 331, and then place the coil wire 40 over the pad portion 331 and further pressurize the coil wire 40 downward so that the coil wire 40 can be immersed in the solder 50. That is, the melting step and the removal step can be performed at different times.

[0173] Although in the above-described embodiment, the plumb line 50 was formed in advance on the surface of the pad portion so that the resulting sloped surface 51 had the shape of an arcuate hill, the present invention is not limited to this. For example, the sloped surface 51 of the plumb line 50 may also be a straight line or have downward-facing recesses. Furthermore, the apex 52 of the plumb line 50 does not need to be a point. The highest point of the plumb line 50 may also be a continuous line or a plane. For example, the plumb line 50 may also be trapezoidal in shape when viewed in the longitudinal direction.

[0174] In the present embodiment, to bring the coil wire 40 into pressure contact with the solder 50, one end of the coil wire 40 is fixed to the rear end side of the base 30, and the pressure tool 200 is placed on the coil wire 40 to press the coil wire 40 downward, but the present invention is not limited to this. For example, it is also possible to bring the coil wire 40 into pressure contact with the solder 50 by placing the coil wire 40 close to the solder 50 using a mechanism for pulling or pushing the coil wire 40 downward but without using a pressure tool. In addition, when the coil wire 40 is arranged over the pad portion 331 and then guided toward the rear end in the wire arrangement step, it is also possible to pull the coil wire 40 downward and fix it in place so that it can be in pressure contact with the solder 50.

[0175] As described above, in the present embodiment, the depth (the dimension in the height direction) of the placement hole 334 is greater than the thickness (the dimension in the height direction) of the circuit unit 333, so that the entire upper surface 33a of the circuit section 33 is located at a position higher than the upper surface 333a of the circuit unit 333. However, instead of such an embodiment, it is also possible to dispose only a portion of the upper surface 33a of the circuit section 33, which is located at the rear end of the circuit unit 333, at a position higher than the upper surface 333a of the circuit unit 333.For example, a protruding portion protruding upward from the upper surface 33a of the circuit portion 33 may be provided at a position closer to the rear end than the circuit unit 333, so that the upper side of the protruding portion is higher than the upper surface 333a of the circuit unit 333. Accordingly, the coil wire 40, which moves closer to the pad portion 331 due to pressure, can be prevented from coming into contact with the pad portion 331, which might otherwise damage the pad portion 331. In such a case, substantially the entire area of ​​the upper surface 33a of the circuit portion 33 except for the protruding portion may be arranged at a position lower than the upper surface 333a of the circuit unit 333.

[0176] In the present embodiment, the pressing tool placement hole 313 is arranged between the circuit portion 33 and the support portion 311, but the present invention is not limited to this. The pressing tool placement hole 313 may also be provided between the support portion 311 and the wire fixing portion 312. In such a case, the pressing portion 44 corresponds to a partial area in the longitudinal direction between the bent portion 45 and the fixed portion 43.

[0177] The above embodiments include the following technical ideas: (1) A method of manufacturing an antenna device, the antenna device comprising an antenna portion formed by winding a coil wire whose coil core is covered with an insulating sheath, and a base having a pad portion to which a part of the coil wire is soldered with a solder material, the method comprising: a melting step for melting the solder material by irradiating the solder material applied on the pad portion with a laser beam; and a removing step of removing a part of the insulating covering from the coil wire by immersing the coil wire in the molten solder material, thereby joining the coil wire and the pad portion together by the solder material. (2) A method for manufacturing the antenna device according to (1), wherein the melting step of melting the solder material and the removing step of removing the part of the insulating sheath are performed in an overlapping manner. (3) A method for manufacturing the antenna device according to (1) or (2), wherein in the melting step, the solder material is applied to a surface of the pad portion in a thickness corresponding to at least one wire diameter of the coil wire. (4) A method for manufacturing the antenna device according to any one of (1) to (3), wherein in the removing step, the insulating sheath is decomposed and removed from the coil wire. (5) A method for manufacturing the antenna device according to any one of (1) to (4), wherein the melting step comprises: Measuring a temperature of the coil wire and / or the solder material, and Controlling an irradiation amount of the laser beam so that the temperature is within a predetermined range above a melting point of the solder material. (6) A method for manufacturing the antenna device according to (5), wherein an irradiation amount of the laser beam is controlled so that the temperature is in a predetermined range higher than a decomposition temperature of the insulating sheath. (7) A method for manufacturing the antenna device according to any one of (1) to (6), the method further comprising a wire arranging step for arranging the coil wire, which is performed before the melting step, wherein the base comprises a wire fixing portion with which the coil wire can be fixed to the wire fixing portion, in the wire arranging step, one end of the coil wire is fixed to the wire fixing portion, and a part of the coil wire is arranged over the solder material provided on a surface of the pad portion, and in the wire arranging step, a pressurized portion, which is a partial area in the longitudinal direction between the one end portion and the part of the coil wire, is pressed against the base so that the coil wire is brought into press contact with the solder material. (8) A method for manufacturing the antenna device according to (7), wherein in the wire arranging step, the solder material is formed on the surface of the pad portion such that the solder material has a hill shape having an inclined surface inclined downward from a center of the pad portion to a circumferential edge of the pad portion, and the coil wire is brought into pressure contact with the inclined surface of the solder material. (9) A method of manufacturing the antenna device according to (8), wherein the coil wire is brought into pressure contact with the slant surface toward the center of the pad portion. (10) A method of manufacturing the antenna device according to any one of (7) to (9), the method further comprising: a cutting step of cutting the coil wire and the base to remove a part of the coil wire including the one end portion and a part of the base including the wire fixing portion after the pad portion and the coil wire are connected with the solder material. (11) A method for manufacturing the antenna device according to any one of (7) to (10), wherein the base comprises a support portion that changes a direction in which the coil wire is guided when the coil wire is pressed against the support portion, when arranging the coil wire, a bent portion located between the part and one end portion of the coil wire is pressed against the support portion of the base and thus bends, and the one end portion of the coil wire bent at the bent portion is tied to the wire fixing portion of the base. (12) A method for manufacturing the antenna device according to any one of (7) to (11), wherein in the melting step, an inert gas is supplied to the solder material along a direction in which the coil wire is pressurized. (13) Antenna device comprising: an antenna portion formed by winding a coil wire, the coil wire having a coil core and an insulating sheath covering the coil core; and a base comprising a pad portion, wherein the coil wire has an exposed portion of the coil core which is not covered with the insulating sheath and is thus exposed, the coil wire and the pad section are connected to each other by a solder material, a part of the coil wire is embedded in the solder material, and a first boundary line, which is a boundary between an inner region in which a peripheral surface of the coil wire is embedded in the solder material, and an outer region of the coil wire outside the solder material, is arranged along a second boundary line, which is a boundary between the exposed portion and a covered portion of the coil wire covered with the insulating sheath. (14) The antenna device according to (13), wherein a thickness of the solder material is larger than a wire diameter of the coil wire. (15) The antenna device according to (13) or (14), wherein in a partial length range of the coil wire, a part of the coil wire in the radial direction corresponds to the exposed portion, whereas another part of the coil wire in the radial direction corresponds to the covered portion. (16) The antenna device according to (15), wherein in the partial length region of the coil wire, a part of an upper side of the coil wire facing away from the pad portion and a part of a lower side of the coil wire facing the pad portion correspond to the exposed portion and thus are in contact with the soldering material, whereas a part of a lateral side in the partial length region of the coil wire corresponds to the covered portion and thus is not in contact with the soldering material. (17) The antenna device according to (16), wherein in the partial length region of the coil wire, a part of an upper side of the coil wire facing away from the pad portion and a part of a lower side of the coil wire facing the pad portion corresponds to the covered portion and thus is not in contact with the soldering material, whereas an entire lower side of the lateral side of the partial length region corresponds to the exposed portion and thus is in contact with the soldering material. (18) The antenna device according to any one of (15) to (17), wherein a first insulating sheath and a second insulating sheath are connected by a bridge portion having a width smaller than a wire diameter of the coil wire and extending along an extension direction of the coil wire, wherein the first insulating sheath and the second insulating sheath each cover entire portions in the radial direction of a first length region and a second length region of the coil wire, between which the partial length region of the coil wire embedded in the solder material is arranged, wherein a first insulating sheath and a second insulating sheath are connected by a bridge portion having a width smaller than a wire diameter of the coil wire and extending along an extension direction of the coil wire,wherein the first insulating sheath and the second insulating sheath each cover entire sections in the radial direction of a first length range and a second length range of the coil wire, between which the partial length range of the coil wire embedded in the solder material is arranged., (19) The antenna device according to any one of (13) to (18), wherein the two end surfaces of the coil wire and a side end surface of the base are arranged flush with each other. (20) Antenna device according to one of (13) to (19), wherein the two ends of the coil wire are connected by the solder material to a pair of pad portions provided on the base, each of the pair of pad portions is formed in a rectangular shape, the rectangular shape each having a slanted side formed by chamfering a corner on the inside of each of the pair of pad portions, and the slanted side runs along a direction in which the coil wire extends. (21) Antenna device in which the insulating sheath is transparent or white. LIST OF REFERENCE SYMBOLS 100 antenna device 20 antenna section 21 Winding core 30 Base 31 Wire arrangement section 311 support section 312 Wire fastening section 313 Pressure tool placement hole 314 cutout hole 315 flat plate section 315a upper surface 315b outer end face 316 winding core insertion hole 316a bevelled section 33 Circuit section 33a upper surface 33b lateral end face 33c inclined surface 33d rear lateral end face 331 pad sections 331a sloping side 333 circuit unit 333a upper surface 333b Side end surface 334 placement hole 335 guide element 335a outer side surface 40, 40a, 40b coil wire 40c upper peripheral surface 40d lower circumferential surface 40e lateral circumferential surface 41 End face 42 section to be arranged over pad section 42a buried section 43 fixed section 44 pressurized section 45 curved section 46 insulating sheath 46a first insulating sheath 46b second insulating sheath 461 bridge section 47 coil core 471, 471a, 471b exposed section 472, 472a, 472b, 472c second boundary line 473 covered section 48, 48a, 48b, 48c first boundary line 49 coil section 50 soldering material 50, 50a, 50b Lot 51 Inclined surface 52 vertex 200 printing tools 210 Arm 211 weight section 212 inner end face 220 wire bridge section 221 Claw 230 support section QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2014 - 505309 A

[0004]

Claims

[1] A method of manufacturing an antenna device, the antenna device comprising an antenna portion formed by winding a coil wire whose coil core is covered with an insulating sheath, and a base having a pad portion to which a part of the coil wire is soldered with a solder material, the method comprising: a melting step for melting the solder material by irradiating the solder material applied on the pad portion with a laser beam; and a removing step of removing a part of the insulating covering from the coil wire by immersing the coil wire in the molten solder material, thereby joining the coil wire and the pad portion together by the solder material. [2] A method of manufacturing the antenna device according to claim 1, wherein a part of the melting step and a part of the removing step are performed in an overlapping manner. [3] A method for manufacturing the antenna device according to claim 1 or 2, wherein in the melting step, the solder material is applied to a surface of the pad portion in a thickness corresponding to at least one wire diameter of the coil wire. [4] A method of manufacturing the antenna device according to any one of claims 1 to 3, wherein in the removing step, the insulating sheath is decomposed and removed from the coil wire. [5] A method of manufacturing the antenna device according to any one of claims 1 to 4, wherein the melting step comprises: Measuring a temperature of the coil wire and / or the solder material, and Controlling an irradiation amount of the laser beam so that the temperature is within a predetermined range above a melting point of the solder material. [6] A method for manufacturing the antenna device according to claim 5, wherein an irradiation amount of the laser beam is controlled so that the temperature is in a predetermined range higher than a decomposition temperature of the insulating sheath. [7] A method of manufacturing the antenna device according to any one of claims 1 to 6, the method further comprising a wire arranging step of arranging the coil wire, which is performed before the melting step, wherein the base comprises a wire fixing portion with which the coil wire can be fixed to the wire fixing portion, in the wire arranging step, one end of the coil wire is fixed to the wire fixing portion, and a part of the coil wire is arranged over the solder material provided on a surface of the pad portion, and in the wire arranging step, a pressurized portion, which is a partial area in the longitudinal direction between the one end portion and the part of the coil wire, is pressed against the base so that the coil wire is brought into press contact with the solder material. [8] The method of manufacturing the antenna device according to claim 7, wherein in the wire arranging step, the solder material is formed on the surface of the pad portion such that the solder material has a hill shape having an inclined surface inclined downward from a center of the pad portion to a peripheral edge of the pad portion, and the coil wire is brought into pressure contact with the inclined surface of the solder material. [9] A method of manufacturing the antenna device according to claim 8, wherein the coil wire is brought into pressure contact with the slope surface toward the center of the pad portion. [10] A method of manufacturing the antenna device according to any one of claims 7 to 9, the method further comprising: a cutting step of cutting the coil wire and the base to remove a part of the coil wire including the one end portion and a part of the base including the wire fixing portion after the pad portion and the coil wire are connected with the solder material. [11] A method for manufacturing the antenna device according to any one of claims 7 to 10, wherein the base comprises a support portion that changes a direction in which the coil wire is guided when the coil wire is pressed against the support portion, in the wire arranging step, a bent portion located between the part and the one end portion of the coil wire is pressed against the support portion of the base and thus bends, and the one end portion of the coil wire bent at the bent portion is tied to the wire fixing portion of the base. [12] A method of manufacturing the antenna device according to any one of claims 7 to 11, wherein in the melting step, an inert gas is supplied to the solder material along a direction in which the coil wire is pressurized. [13] Antenna device comprising: an antenna portion formed by winding a coil wire, the coil wire having a coil core and an insulating sheath covering the coil core; and a base comprising a pad portion, wherein the coil wire has an exposed portion where the coil core is not covered with the insulating sheath and is thus exposed, the coil wire and the pad section are connected to each other by a solder material, a part of the coil wire is embedded in the solder material, and a first boundary line, which is a boundary between an inner region in which a peripheral surface of the coil wire is embedded in the solder material, and an outer region of the coil wire outside the solder material, is arranged along a second boundary line, which is a boundary between the exposed portion and a covered portion of the coil wire covered with the insulating sheath. [14] The antenna device according to claim 13, wherein a thickness of the solder material is larger than a wire diameter of the coil wire. [15] The antenna device according to claim 13 or 14, wherein in a partial length range of the coil wire, a part of the coil wire in the radial direction corresponds to the exposed portion, whereas another part of the coil wire in the radial direction corresponds to the covered portion. [16] The antenna device according to claim 15, wherein, in the partial length region of the coil wire, a part of an upper side of the coil wire facing away from the pad portion and a part of a lower side of the coil wire facing the pad portion correspond to the exposed portion and thus are in contact with the soldering material, while a part of a lateral side in the partial length region of the coil wire corresponds to the covered portion and thus is not in contact with the soldering material. [17] The antenna device according to claim 16, wherein a part of an upper surface of the lateral side of the partial length region corresponds to the covered portion and thus is not in contact with the soldering material, whereas an entire lower surface of the lateral side of the partial length region corresponds to the exposed portion and thus is in contact with the soldering material. [18] The antenna device according to any one of claims 15 to 17, wherein a first insulating sheath and a second insulating sheath are connected by a bridge portion having a width smaller than a wire diameter of the coil wire and extending along an extending direction of the coil wire, the first insulating sheath and the second insulating sheath respectively covering entire portions in the radial direction of a first length portion and a second length portion of the coil wire, between which the partial length portion of the coil wire embedded in the solder material is arranged. [19] The antenna device according to any one of claims 13 to 18, wherein the two end surfaces of the coil wire and a lateral end surface of the base are arranged flush with each other. [20] Antenna device according to one of claims 13 to 19, wherein the two ends of the coil wire are connected by the solder material to a pair of pad portions provided on the base, each of the pair of pad sections is formed in a rectangular shape, the rectangular shape has a slanted side formed by beveling a corner on the inside of the pair of pad sections, and the slanted side runs along a direction in which the coil wire extends.

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