Component placement machine and placement line
By controlling the operation of one mounting head to suction only during the mounting process of another head, the machine reduces vibrations and enhances accuracy in component placement, addressing the precision issues in multi-head mounting systems.
Patent Information
- Application Number
- DE112022007933
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-10-21
- Publication Date
- 2025-07-31
AI Technical Summary
Existing component mounting work machines with multiple mounting heads face issues with reduced mounting accuracy due to vibrations generated by the operation of other heads, which affect the precision of component placement.
The component mounting work machine is equipped with a control device that limits the operation of one mounting head to a removal operation, such as suction, while the other head performs mounting operations, thereby reducing vibrations and enhancing accuracy.
This approach increases mounting accuracy by minimizing vibrations between multiple heads, allowing for precise component placement and maintaining production efficiency.
Smart Images

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Abstract
Description
TECHNICAL FIELDThe present disclosure relates to a component mounting work machine including a plurality of mounting heads that mount components on boards, and a mounting line.BACKGROUND ARTHeretofore, the technique has been developed about component mounting work machines having a plurality of mounting heads. In the following Patent Document 1, a component mounting work machine having a plurality of multiple mounting heads for component mounting boards is described. The multiple mounting head according to Patent Document 1 is provided with a plurality of suction nozzles that respectively suck a component from a component cartridge and mount the board thereon. When the mounting accuracy of a mounted component is required, during the mounting of the component whose mounting accuracy is required, the component mounting work machine restricts the operation of the multiple mounting head other than the multiple mounting head mounting the component whose mounting accuracy is required.PRIOR ART DOCUMENTPATENT DOCUMENTPatent Document 1: JP 2007-158115 ASUMMARY OF THE INVENTIONPROBLEM TO BE SOLVED OF THE INVENTIONIn the apparatus on which a plurality of mounting heads are operated as in Patent Document 1, there is a fear that, when performing the mounting operation of any mounting head, vibration, etc. generated by the operation of the other mounting head affect the mounting accuracy. Therefore, in the component mounting work machine according to Patent Document 1, during the mounting work of one of two multiple mounting heads opposing each other in the Y-axis direction with a conveying rail interposed therebetween for conveying the board, the operation of the other multiple mounting head is restricted. However, with a view to increasing the mounting accuracy, there remains room for improvement.In view of these circumstances, the present disclosure has an object to provide a component mounting work machine and a mounting line that can increase mounting accuracy.MEANS FOR ACHIEVING THE OBJECTIn order to achieve the above object, the component mounting work machine according to the present disclosure is provided with a plurality of mounting heads that have gripping members for gripping components and mount a board with the components gripped by the gripping members, feeders for supplying the components to the individual plurality of mounting heads, a moving device for moving the individual plurality of mounting heads, and a control device that limits the operation of the other mounting head to a removal operation for removing the component from the feeder depending on an arbitrary mounting head of the plurality of mounting heads performing a mounting operation.The present disclosure is extremely effective not only in the embodiment of the invention as the component mounting work machine but also in the embodiment as a mounting line having a plurality of component mounting work machines.ADVANTAGES OF THE INVENTIONBy the component mounting work machine according to the present disclosure, the mounting accuracy can be enhanced by performing the control depending on that any mounting head among a plurality of mounting heads performs a mounting operation.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a plan view illustrating a component mounting work machine according to a first embodiment. FIG. 2 is a structural view schematically illustrating the construction of the component mounting work machine according to the first embodiment as viewed in the X direction. FIG. 3 is a block diagram illustrating a control device. FIG. 4 is a side view illustrating a moving device. FIG. 5 is a schematic view for illustrating the internal structure of a mounting head. FIG. 6 is a flow chart showing the judgment processing for deciding the operation of the mounting head according to a second embodiment. FIG. 7 is a plan view of a mounting line according to a third embodiment.EMBODIMENT OF THE INVENTION(First Embodiment)An exemplary embodiment for carrying out the present disclosure is explained in more detail below with reference to the figures. FIG. 1 shows a component mounting work machine 10 according to a first exemplary embodiment. FIG. 2 shows a schematic construction of the component mounting work machine 10 as viewed in the X direction. The component mounting work machine 10 performs mounting work for a board 12 with electronic components 13 (see FIG. 2 ), and is provided with a board conveying / holding device 20, a moving device 22, a pair of mounting heads 26, 28, a pair of feeders 30, 32, a pair of mark cameras 34, 36, and a pair of component cameras 38, 40, as shown in FIGS. 1 and 2. The electronic component 13 is an example of the component according to the present disclosure, and is a semiconductor component such as an IC chip, etc. The component according to the present disclosure is not limited to the semiconductor component, and may be another component mounted on the board 12, for example, a passive component such as a resistor element, a capacitor, etc., mechanical component such as switches, relays, etc.The board conveying / holding device 20 is disposed on the upper surface of a base frame 16 of the component mounting work machine 10, and has a conveyor 41. The conveyor 41 has a pair of guide rails 43, 44. A conveyor belt (not shown) is provided on each guide rail 43, 44. The pair of guide rails 43, 44 are arranged in parallel with each other. In the following explanation, the direction in which the guide rails 43, 44 extend is referred to as an X direction, the direction horizontally perpendicular to the X direction is referred to as a Y direction, and the direction perpendicular to the X and Y directions is referred to as a Z direction, as shown in FIGS. 1 and 2. The conveyor belt is wound on a pulley (not shown) provided on each guide rail 43, 44 and is rotated about it by the drive of an electromagnetic motor 46 (see FIG. 3 ). The board 12 is conveyed along the X direction by the conveyor belts.In addition, the conveyor 41 conveys the board 12 conveyed into the component mounting work machine 10 along the X direction to a predetermined processing location 47. the board conveying / holding device 20 is provided with a jig 49 (see FIG. 3 ) for fixing the conveyed board 12 at the processing location 47. The component mounting work machine 10 mounts the board 12 fixed to the machining location 47 by the jig 49 with electronic components 13 by means of the mounting heads 26, 28.FIG. 4 is a side view of the moving device 22, and the moving device 22 is provided with an X-direction slide mechanism 51, a Y-direction slide mechanism 52, and a Z-direction slide mechanism 53 as shown in FIGS. 1 and 4. The Y-direction slide mechanism 52 includes a pair of Y-direction guide rails 55. The pair of Y-direction guide rails 55 are disposed so as to be parallel to each other above the base frame 16 and extend in the Y-direction. The X-direction slide mechanism 51 has a pair of X-direction guide rails 57. The pair of X-direction guide rails 57 are parallel to each other and are placed on the paired Y-direction guide rails 55 in an X-direction extending state.The Y-direction slide mechanism 52 includes an electromagnetic motor 59 (see FIG. 3 ), by driving which each X-direction guide rail 57 is moved to an arbitrary position in the Y-direction. On each X-direction guide rail 57, an X-direction slider 61 movable along its own axis is supported. The X-direction slide mechanism 51 includes an electromagnetic motor 63 (see FIG. 3 ) by driving which each X-direction slide 61 is moved to an arbitrary position in the X direction. The Z-direction slide mechanism 53 includes a pair of Z-direction slides 65. Each of the paired Z-direction sliders 65 is slidably supported in the Z-direction by each of the paired X-direction sliders 61. The Z-direction slide mechanism 53 includes an electromagnetic motor 67 (see FIG. 3 ) by driving which each Z-direction slide 65 is moved to an arbitrary position in the Z direction. To each Z-direction slider 65, a mounting head 26, 28 is detachably attached. With this structure, the mounting head 26, 28 is moved in the X and Y directions by the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to an arbitrary position on the base frame 16, and moved up and down in the Z direction (up and down direction) by the Z-direction slide mechanism 53.Each mounting head 26, 28 is provided with a frame 71 fixed to the Z-direction slider 65 (see FIG. 4 ), a head main body 75 on which a plurality of nozzle holders 73 are arranged at intervals of a predetermined angle (e.g., 30 degrees) in the circumferential direction, and suction nozzles 77 each fixed to the lower end of each nozzle holder 73, as shown in FIG. 5. In addition, the mounting head 26, 28 is provided with an R-axis motor 79 (see FIG. 3 ) for rotating (revolving) the plurality of nozzle holders 73 by rotating the head main body 75, a Q-axis motor 80 for rotating (rotating) the plurality of nozzle holders 73, and a lifting device 81 for upward and downward movement of the nozzle holder 73.The head main body 75 is provided with a shaft 83 rotatably supported on the frame 71 and a cylindrical holder support 85 whose diameter is larger than the shaft 83. On the holder support 85, a plurality of rod-shaped nozzle holders 73 are held displaceably in the Z direction in a posture extending in the Z direction. The upper end of the shaft 83 is coupled to the R-axis motor 79, by driving which the shaft 83 and the holder support 85 are rotated, thereby rotating (revolving) a plurality of nozzle holders 73.In addition, the head main body 75 includes a first gear 87 supported coaxially with the shaft 83 rotatably relative to the shaft 83, a second gear 88 rotated according to the rotation of the first gear 87, and a third gear 89 fixed to the rotation axis of the Q-axis motor 80. The first gear 87 and the third gear 89 mesh with each other so that the rotational driving force of the Q-axis motor 80 is transmitted to the first gear 87. The second gear 88 and the fourth gear 90, which are each fixed to the nozzle holder 73, mesh with each other. Thereby, each nozzle holder 73 and the suction nozzle 77 attached to each nozzle holder 73 rotate (rotate) in the same rotational direction by the same rotational amount (rotational angle), respectively, by the drive of the Q-axis motor 80. Between the lower surface of the fourth gear 90 and the upper surface of the holder bracket 85, a coil spring 91 is disposed in a pressed state. Thereby, each nozzle holder 73 is biased upward by the spring force of the coil spring 91, but at a predetermined height, this biasing upward is restricted by a stopper (not shown).The lifting device 81 is provided with a linear motor 93 and a presser 95 moved up and down in the Z direction by the driving of the linear motor 93. The presser 95 engages with the upper end of one of the plurality of nozzle holders 73 positioned at a predetermined lift position (e.g., left position in FIG. 5 ). By driving the linear motor 93, the presser 95 is moved downward, whereby the one of the plurality of nozzle holders 73 positioned at the predetermined lift position descends against the spring force of the coil spring 91. In addition, by driving the linear motor 93, the presser 95 is moved upward, whereby the one nozzle holder 73 positioned at the predetermined lift position rises by the spring force of the coil spring 91. That is, the nozzle holder 73 positioned at the elevation position rises and falls by the drive of the linear motor 93. Accordingly, the suction nozzle 77 of the nozzle holder 73 positioned at the elevation position also rises and falls. The plural nozzle holders 73 rotate by the drive of the R-axis motor 79 and therefore are moved to the lifting point in sequence.Each placement head 26, 28 is provided with an over / under pressure supply device 97 (see FIG. 3 ). The plurality of suction nozzles 77 of each placement head 26, 28 are connected to the positive / negative pressure supply device 97 via negative and positive air channels (not shown). As a result, the suction nozzle 77 sucks the electronic component 13 by negative pressure, holds it, and releases the held electronic component 13 by positive pressure.As shown in FIGS. 1 and 2, the pair of feeders 30, 32 are disposed on the both sides of the base 16 with the board conveying / holding device 20 interposed therebetween in the Y direction. Each feeding device 30, 32 can be equipped with a plurality of belt feeders 99. Each belt feeder 99 receives belted components in a wound state. The belted components are electronic components 13 which are formed into a band. The belt feeder 99 is provided with a feeder 100 (see FIG. 3 ) including, for example, a motor, a sprocket, etc., and the belted members are fed by driving the feeder 100. As a result, the belt feeder 99 feeds the electronic component 13 to each feeding device 30, 32 by the advancement of the belted components to a predetermined feeding location 101 (see FIG. 1 ). Each mounting head 26, 28 sucks and holds the electronic component 13 supplied to the supply location 101 by the suction nozzle 77. The feeder 30 corresponds to the mounting head 26, so that the mounting head 26 holds the electronic component 13 from the belt feeder 99 of the feeder 30. The feeder 32 corresponds to the mounting head 28, so that the mounting head 28 holds the electronic component 13 from the belt feeder 99 of the feeder 32.The mark camera 34 is fixed in a downward state to the X-direction slider 61 mounted with the mounting head 26, and is moved in the X- and Y-directions together with the mounting head 26. In addition, the mark camera 36 is attached in a downward state to the X-direction slider 61 mounted with the mounting head 28, and is moved in the X- and Y-directions together with the mounting head 28. Thereby, each mark camera 34, 36 is moved to an arbitrary position by the operation of the moving device 22, and captures an image of an arbitrary position on the base frame 16.The component camera 38 is disposed between the board conveying / holding device 20 and the feeding device 30 in an upward state in the Y direction. Thus, an image of the electronic component 13 held by the mounting head 26 is captured by the component camera 38 by moving the mounting head 26 holding the electronic component 13 to the upper side of the component camera 38 by the operation of the moving device 22. On the component mounting work machine 10, it is possible to capture an image of the electronic component 13 by the component camera 38 while moving the mounting head 26, that is, to perform so-called on-the-fly image capturing. Also, the component camera 40 is disposed between the board conveying / holding device 20 and the feeding device 32 in an upward state in the Y direction. Thus, an image of the electronic component 13 held by the mounting head 28 is captured by the component camera 40 by moving the mounting head 28 holding the electronic component 13 to the upper side of the component camera 40 by the operation of the moving device 22. On the component mounting work machine 10, the mounting head 28 also makes it possible to perform a so-called on-the-fly image recording.The component mounting work machine 10 is provided with a control device 103 as shown in FIG. 3. The control device 103 is provided with a controller 105, a plurality of driving circuits 107, an image processing device 109, and a storage device 111. A plurality of driving circuits 107 are connected to the above-mentioned electromagnetic motors 46, 59, 63, 67, the positive / negative pressure supply device 97, the R-axis motor 79, the Q-axis motor 80, the linear motor 93 and the feeding device 100. The controller 105 is provided with a central processing unit, RAM, etc., is substantially constituted by a computer, and is connected to a plurality of driving circuits 107 and the image processing apparatus 109.The storage device 111 is provided with, for example, ROM, flash memory, hard disk, etc. The construction of the storage device 111 is not limited to the above construction, and may be provided with, for example, SSD instead of the hard disk. In addition, the storage device 111 may be an external storage medium provided separately from the control device 103, such as USB memory, DVD, etc. The controller 105 controls the individual devices connected to the drive circuits 107 and the image processing device 109 by executing a control program 113 stored in the storage device 111 by the central processing unit. Thereby, the board conveying / holding device 20, moving device 22, mounting heads 26, 28, feeders 30, 32, mark cameras 34, 36, component cameras 38, 40, etc. are controlled by the controller 105. The controller 105 controls the X-direction slide mechanism 51, the Y-direction slide mechanism 52, the Z-direction slide mechanism 53 and the mounting heads 26, 28 based on the control program 113, The controller 105 controls the X-direction slide mechanism 51 and so on, and thereby moves each mounting head 26, 28 either to the mounting location determined in the control program 113 to have the mounting operation performed or to the supply location 101 to have the suction operation performed.The control program 113 contains a so-called recipe, i.e., data for instructing the work content, e.g., which coordinate position on the board 12 each mounting head 26, 28 mounts the electronic component 13, from which belt feeder 99 the electronic component 13 to be mounted is supplied, etc. Specifically, in the control program 113, for example, the mounting order, the XYZ coordinate of the mounting location, the XYZ coordinate of the supply location 101, the rotation angle of the component, the component type, the component shape, etc. are determined. In addition, in the control program 113, control information required for controlling the cameras, such as XYZ coordinates of the mounting heads 26, 28, and image pickup timing in image pickup by the mark camera 34, 36, XYZ coordinates of the mounting heads 26, 28, and image pickup timing in image pickup by the component camera 38, 40, etc., is determined. Further, in the control program 113, control information related to the control of suction and release such as timing for the control of the positive / negative pressure supply device 97, etc. is determined. In addition, the control program 113 includes a control program required for displaying a display panel 115 and receiving the input, for example. Therefore, in the control program 113, various information required for the control of the component mounting work machine 10 is determined.The image processing device 109 is for processing image data obtained by the mark cameras 34, 36 and component cameras 38, 40. The controller 105 acquires various information from the image data processed at the image processing device 109. The controller 105 acquires, as various information, for example, the identification information indicated on the board 12, information of the location of the board 12 held by the chuck 49, information of the posture of the electronic component 13 mounted on the board 12, etc. In addition, the controller 105 acquires, as various information, for example, the information of the deviation of the location of the electronic component 13 held by the mounting head 26, 28 and the held posture thereof from the image data of the component camera 38, 40. The control device 103 is also connected to the display panel 115. The display panel 115 is disposed on, for example, the outer wall surface of the component mounting work machine 10, and is provided with a touch screen and a plurality of operation switches, and receives the operation input from the user. The display panel 115 changes the display content of the touch screen due to the control of the control device 103.The component mounting work machine 10 performs, by the above-mentioned construction, the work for mounting the electronic components 13 on the board 12 held by the board conveying / holding device 20 by the mounting heads 26, 28. First, the controller 105 controls the conveyor 41 of the board conveying / holding device 20, thereby conveying the board 12 to the processing site 47. Subsequently, the controller 105 controls the chuck 49 of the board conveying / holding device 20, thereby holding the board 12 stationary at the processing position 47.Subsequently, the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52, thereby moving the pair of mark cameras 34, 36, e.g., the mark camera 34, toward the upper side of the board 12 to capture an image of the board 12. The controller 105 acquires the identification information indicated on the patty 12, information of the held location of the board 12, etc. on the basis of the image data captured by the mark camera 34. In addition, the pair of feeders 30, 32 feed the electronic components 13 to the feeding points 101 of the belt feeders 99 due to the control by the controller 105.The controller 105 performs the work for mounting the electronic components 13 on the board 12 by the mounting head 26, 28. In the component mounting work machine 10 according to the present embodiment, the operation of the mounting head 26, 28 mainly includes a "suction operation", a "mounting location moving operation", a "mounting location moving operation", and a "feed location moving operation" (hereinafter, referred to as four operations as appropriate). Further, the component mounting work machine 10 performs the processing by two mounting heads 26, 28 operated in conjunction with each other. In the following explanation, the operation of the mounting head 26 will be mainly explained in order to avoid the explanation from becoming complicated. The operation of the mounting head 28 is the same as that of the mounting head 26, but the operation of the mounting heads 26, 28 is restricted in a highly accurate mode so that the mutual mounting operation is not affected, as mentioned later.At the beginning of the work for mounting the electronic component 13 on the board 12, the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the mounting head 26 to the upper side of the feed position 101 of the feed device 30, and when the controller 105 mounts the mounting head 26 on the upper side of the feed position 101, it starts the suction operation. The "suction operation" is, for example, an operation from a time point when the mounting head 26 is disposed on the upper side of the feeding point 101 of the belt feeder 99 to a state where the suction nozzle 77 sucks the electronic component 13 and can start moving to the next moving destination while keeping the sucked electronic component 13. The controller 105 moves down the suction nozzle 77 of the mounting head 26 at the elevation position by performing, for example, at least one of the operation for downward movement of the mounting head 26 by controlling the Z-direction slide mechanism 53 and the operation for downward movement of the suction nozzle 77 by controlling the elevation device 81. The controller 105 supplies negative pressure by controlling the positive / negative pressure supply device 97 so that the suction nozzle 77 at the lifting position sucks and holds the electronic component 13 located at the supply position 101. When the electronic component 13 is held at the lifting position by the suction nozzle 77, the controller 105 controls at least one of the Z-direction slide mechanism 53 and the lifting device 81, and moves the suction nozzle 77 upward. The controller 105 may start the operation to move the mounting head 26 to the next moving destination by moving the suction nozzle 77 upward to a predetermined height, or start the operation to move the mounting head 26 to the next moving destination by moving the suction nozzle 77 upward to a predetermined height. In the upward movement, the operation until the start of the movement is regarded as the suction operation.As the next moving destination, the mounting location on the board 12 mounted with the drawn electronic component 13 or the feeding location 101 for drawing the electronic component 13 by another suction nozzle 77 is cited. The feeding points 101 of the plurality of belt feeders 99 according to the present embodiment are arranged side by side along the X direction as shown in FIG. 1. Therefore, the controller 105 changes the X-direction position of the mounting head 26 by controlling the X-direction slide mechanism 51, and changes the suction nozzle 77 at the lifting position by the drive of the R-axis motor 79, whereby an electronic component 13 is suctioned from another belt feeder 99 by the changed suction nozzle 77.When one or more suction nozzles 77 suck the electronic components 13, the controller 105 causes the mounting head 26 to start the "mounting location moving operation" by which it is moved to the mounting location of the board 12. The "mounting location moving operation" is, for example, an operation for moving the mounting head 26, 28 from the supply location 101 of the supply device 30, 32 to the mounting location of the board 12, and during this operation, an image of the electronic component 13 is captured by the component camera 38, 40 while moving the mounting head 26, 28. The controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 and thereby moves the mounting head 26 from the supply location 101 to the mounting location via the upper side of the component camera 38. In the case of the other mounting head 28, the controller 105 moves the mounting head 28 to the mounting location, for example, via the upper side of the component camera 40. in addition, the controller 105 may control at least one of the Z-direction slide mechanism 53 and the elevator 81 during imaging to adjust the height of the electronic component 13 such that the electronic component 13 is positioned at the depth of field of the component camera 38. The depth of field mentioned here represents a range of distance during the focusing between the camera and the object to be recorded. The controller 105 causes the component camera 38 to capture an image of the electronic component 13 according to the timing at which the electronic component 13 held by the suction nozzle 77 enters the depth of field of the component camera 38. The controller 105 acquires information on the posture, etc. of the held electronic component 13 based on the captured image data. The controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52, thereby moving the mounting head 26 to the upper side of the mounting location on the board 12 fixed to the processing location 47 by the board conveying / holding device 20.When the controller 105 arranges the mounting head 26 at the mounting location, it causes the mounting head 26 to start the "mounting operation". The "mounting operation" is, for example, an operation from a time point when the mounting head 26 reaches the upper side of the mounting location of the board 12 to a state in which it can start moving to the next moving destination after mounting the electronic component 13. For example, the controller 105 controls at least one of the Z-direction slide mechanism 53 and the lifting device 81, and moves the suction nozzle 77 downward at the lifting location. The controller 105 supplies positive pressure to, for example, the suction nozzle 77 disposed at the lifting position by controlling the positive / negative pressure supply device 97 to mount the electronic component 13 held at the lifting position by the suction nozzle 77. At this time, the controller 105 corrects the direction, posture, etc. of the electronic component 13 held by the suction nozzle 77 due to the location of the fixed board 12, posture of the held electronic component 13, etc., and then performs the mounting. The controller 105 may start the operation for moving the mounting head 26 to the next moving target location (next mounting location, etc.) by moving the suction nozzle 77 upward to a predetermined height, or start the operation for moving the mounting head 26 to the next moving target location after moving the suction nozzle 77 upward. In the upward movement, the operation until the start of the movement is regarded as the mounting operation.After completion of one or more pick and place operations, the controller 105 causes the pick and place head 26 to begin the "feed point move operation.". The "feed point moving operation" is, for example, an operation for moving from the mounting point to the feed point 101 of the belt feeder 99 where the next electronic component 13 is sucked. The controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52, thereby moving the mounting head 26 to the next feeding location 101. The controller 105 moves the mounting head 26 on, for example, a line (shortest distance) connecting the mounting location to the supply location 101. That is, unlike the "mounting location moving operation", the controller 105 moves the mounting head 26 over the shortest distance because the image capturing by the component camera 38 is not performed. The controller 105 can also move the mounting head 26 in the feed point moving operation on a path other than the shortest distance, such as a path that passes above the component camera 38, and so on. The controller 105 causes the mounting head 26 to start the suction operation when the mounting head 26 is moved to the supply position 101.The component mounting work machine 10 also controls the mounting head 28 in the same manner as in the above-mentioned control of the mounting head 26 and performs the mounting of the electronic components 13 by cooperation of two mounting heads 26, 28. In the component mounting work machine 10 having a plurality of mounting heads 26, 28 as in the present embodiment, there is a fear that, during execution of the mounting operation by any one mounting head 26, 28, the other mounting head 26, 28 is operated, whereby vibrations generated by the operation of the other mounting head 26, 28 are transmitted to the one mounting head 26, 28 in the mounting operation and reduce the mounting accuracy. Specifically, there is a fear that the lowering of the mounting accuracy is caused by, for example, during the execution of the mounting operation by the mounting head 26, the mounting head 28 executing the "mounting location moving operation", "mounting location moving operation", and "feeding location moving operation", respectively, and transmitting the vibration generated thereby to the mounting head 26.On the other hand, the reduction in production efficiency is effected when the operation of the mounting head 26, 28 other than the mounting head 26, 28 which is in the mounting operation is completely stopped. The "suction operation" is performed at a position farther from the mounting position than the positions of the other operations. The "suction operation" is also an operation for sucking the electronic component 13 by upward and downward movement of the suction nozzle 77 and the mounting head 26, 28, so that this operation shows a movement smaller than the "mounting position moving operation" and the "supply position moving operation". Therefore, during execution of the mounting operation by the one mounting head 26, 28 of the two mounting heads 26, 28, the controller 105 according to the present embodiment restricts the operation of the other mounting head 26, 28 to the suction operation. As a result, the vibrations generated during the mounting operation by the operation of the other mounting head 26, 28 can be reduced, and the mounting accuracy can thus be increased.Concretely, the controller 105 controls the mounting heads 26, 28, etc. based on the control program 113 and makes them perform the individual operations such as mounting operation, etc. as mentioned above. In the control program 113 according to the present embodiment, it is determined (programmed) that, during execution of the mounting operation by the one mounting head 26, 28 of the two mounting heads 26, 28, the operation of the other mounting head 26, 28 is limited to the suction operation. Thereby, the controller 105 can achieve the restriction processing of the operation and the increase in the mounting accuracy only by performing the control based on the control program 113.The larger the number of electronic components 13 to be mounted, the larger the proportion of the time for the suction operation and the mounting operation in the total time of the above-mentioned four operations, because the mounting heads 26, 28 provided with a plurality of suction nozzles 77 can continuously perform multiple suction operations and multiple mounting operations and reduce their frequency of movement between the board 12 and the feed point 101. The suction operation shows a movement smaller than the mounting operation because the correction of the posture of the drawn electronic component 13 is not performed in the suction operation unlike the mounting operation. Taking into account the time for movement to the upper side of the component camera 38, 40 for the on-the-fly image capturing, the time for the "mounting location moving operation" is longer than the time for the linearly moved "feeding location moving operation". Therefore, with respect to the relationship of the operation time between the four operations, the loading operation, the suction operation, the loading position moving operation, and the feeding position moving operation are mostly shorter in this order. Therefore, the reduction in production efficiency by the restriction processing of the operation will be suppressed by performing, during the mounting operation whose operation time is relatively long, the suction operation whose operation time is second long. With respect to one cycle of the four operations, the frequency of the continuously performed pick-and-place operation is basically identical to that of the continuously performed suction operation. Therefore, the reduction in production efficiency by the restriction processing of the operation can be suppressed by subjecting, among the four operations of one cycle, the mounting operation and suction operation that are easily matched in execution frequency to the restriction. The above-mentioned relationship of the operation timings is an example. The relationship of the operation times (long or short) is changed depending on the delay of the operation, the generation of errors, and the design of the apparatus. In addition, the mounting operation and the suction operation continuously performed among the four operations of one cycle may not match in frequency.In the control program 113, the XYZ coordinates for moving the two mounting heads 26, 28, the mounting order, the component type (information for judging the belt feeder 99 from which the component is taken out), etc. are determined as mentioned above. For example, the order, timing, position, etc. of the setting are determined such that, according to the timing at which the mounting head 26 reaches the mounting location and performs the mounting operation, the mounting head 28 reaches the supply location 101 and performs the suction operation. Here, it is determined that the mounting head 28 at the supply location 101 waits until completion of the mounting operation of the mounting head 26 when the suction operation of the mounting head 28 is previously finished according to the control content. Alternatively, it is determined that the mounting head 26 completes the mounting operation in advance and the feed point moving operation starts when the suction operation of the mounting head 28 is later completed according to the control content. When the mounting head 28 performs an operation other than the suction operation at the timing where the mounting head 26 starts the mounting operation, it is determined that the mounting head 26 is waiting at the mounting location. That is, in the control program 113, it is determined that, due to the type, number, and arrangement of the electronic components 13 mounted on the board 12, the type of the components in the belt feeder 99, the feeding points 101, the points of the component cameras 38, 40, etc. corresponding to the operation of the one mounting head 26, 28, the mounting operation of the other mounting head 26, 28 is limited to the suction operation, and that the work efficiency is optimized.For example, in the above-mentioned control program 113, it may be determined that a single mounting operation is associated with a single suction operation so that during the single mounting operation of the one mounting head 26, the other mounting head 28 performs only the single suction operation. In the control program 113, it may be determined that multiple continuous mounting operations are associated with multiple continuous suction operations because the mounting heads 26, 28 according to the present embodiment are provided with multiple suction nozzles 77. That is, in the control program 113, for example, it may be determined that the mounting head 28 performs multiple suction operations while moving to multiple supply points 101, while the mounting head 26 performs multiple mounting operations while moving to multiple mounting points. In this case, the mounting head 28 is allowed to have not only the suction operation but also the operation for moving from an arbitrary supply position 101 to another supply position 101 according to the plural mounting operations of the mounting head 26. While the one mounting head 26, 28 performs one or more mounting operations, the controller 105 may perform, as the operation allowed to the other mounting head 26, 28 (an example of a picking operation according to the present disclosure), the suction operation in which the mounting head 26, 28 is moved in the X direction by controlling the X-direction slide mechanism 51 and the electronic component 13 is picked up from the feeding location 101 of each of the plurality of belt feeders 99 by each of the plurality of suction nozzles 77.The Y-direction slide mechanism 52 (an example of a second moving device according to the present disclosure) moves the X-direction guide rails 57 extending in the X-direction in the Y-direction (an example of a second direction according to the present disclosure). The X-direction slide mechanism 51 (an example of a first moving device according to the present disclosure) moves the X-direction slides 61 in the X-direction (an example of a first direction according to the present disclosure). The X-direction slider 61 is a smaller component than the X-direction guide rail 57, which is sized so that the mounting head 26, 28 can be fixed thereto. Therefore, the mass of the component moved by the Y-direction slide mechanism 52 (X-direction guide rail 57) is heavier than the mass of the component moved by the X-direction slide mechanism 51 (X-direction slide 61). The mass of the X-direction guide rail 57 is, for example, about 4 to 5 times the mass of the X-direction slider 61, and therefore, the vibrations generated by the operation of the X-direction slide mechanism 51 are much smaller than the vibrations generated by the operation of the Y-direction slide mechanism 52. Further, the operation for X-direction movement between a plurality of feeding points 101 in the above-mentioned plural continuous suction operations is performed at a location away from the mounting point in the Y-direction. Therefore, the degree of lowering of the mounting accuracy by the vibrations generated by the plural continuous suction operations is very smaller than the degree of lowering of the mounting accuracy by the vibrations generated by the other operations. Therefore, both the increase in the mounting accuracy and the increase in the production efficiency can be achieved by allowing multiple suction operations and the movement in the X direction during the mounting operation.Further, the balance between the above-mentioned continuous mounting operations and the continuous suction operations can be achieved by having two mounting heads 26, 28 have the same number of the suction nozzles 77. That is, the difference between the total time of the continuous mounting operations and the total time of the continuous suction operations can be reduced by making the number of suction nozzles 77 of each mounting head 26, 28 equal. As a result, both the increase in the mounting accuracy and the increase in the production efficiency can be further achieved.In the above control, the restriction processing of the operation is executed in the entire period of the mounting operation. Therefore, from a point of time when the one mounting head 26, 28 reaches the upper side of the mounting location to a state in which it can start moving from the mounting location to the next moving destination (another mounting location or the supply location 101) after mounting the electronic component 13, the operation of the other mounting head 26, 28 is limited to the suction operation. As a result, during the mounting operation, the oscillations can be reduced by the operation of the other mounting head 26, 28 and the mounting accuracy can thus be increased.However, the restriction processing of the operation need not be executed in the entire period of the mounting operation. The vibrations generated during the operation for arranging and releasing the electronic component 13 on the board 12 particularly affect the mounting accuracy. Therefore, the restriction can be relaxed and the increase in production efficiency can be achieved by narrowing the mounting operation as the object. For example, from the time when any one mounting head 26, 28 reaches the upper side of the mounting location to completion of mounting of the electronic component 13, after moving down the suction nozzle 77 and then releasing the suction of the suction nozzle 77, the controller 105 restricts the operation of the other mounting head 26, 28 to the suction operation. On the other hand, after completion of the mounting and subsequent start of the operation for upward movement of the suction nozzle 77, the controller 105 cannot restrict the operation of the other mounting head 26, 28. That is, the mounting operation is divided into two sections, an operation until completion of mounting and an operation after completion of mounting, wherein only the operation until completion of mounting is subjected to restriction processing, and after completion of mounting, the restriction processing does not need to be executed. Thereby, the time of restricting the other mounting head 26, 28 can be shortened, and thus the production efficiency can be increased.Alternatively, from a time when any one mounting head 26, 28 reaches the upper side of the mounting location until completion of the downward movement of the suction nozzle 77, the controller 105 may not restrict the operation of the other mounting head 26, 28. In addition, during the suction release operation of the downwardly moved suction nozzle 77, the controller 105 restricts the operation of the other mounting head 26, 28 to the suction operation. The controller 105 does not restrict the operation of the other mounting head 26, 28 after completion of the release of the suction of the suction nozzle 77 and subsequent start of the operation for upward movement of the suction nozzle 77. That is, the mounting operation is subjected to restriction processing only in a period where the electronic component 13 is released after completion of the downward movement of the suction nozzle 77, and the restriction processing is not performed before and after this period. Thereby, the time of restricting the other mounting head 26, 28 can be extremely shortened, and the production efficiency can be further increased.In addition, the controller 105 can appropriately use the processing for executing the restriction processing in the entire period of the above mounting operation, the processing for executing the restriction processing only during the downward movement and mounting, and the processing for executing the restriction processing only during the mounting for each electronic component 13. The controller 105 can appropriately use these three processings depending on the accuracy required of the electronic component 13 to be mounted, respectively. Thereby, the further increase in the optimum mounting accuracy and the increase in the production efficiency can be achieved.In addition, the controller 105 may perform the above restriction processes depending on the mode of the component mounting work machine 10. The component mounting work machine 10 according to the present embodiment is provided with a normal mode and a high-accuracy mode. When the high-accuracy mode is set, the controller 105 performs the above restriction processing, and does not need to perform the restriction processing in the normal mode. The high-accuracy mode mentioned here is a mode that enhances the mounting accuracy as compared with the normal mode. In the high-precision mode, for example, the upper limit value of the operating speed (moving speed, up and down movement speed) of the mounting head 26, 28 is smaller than in the normal mode, or the degree of acceleration of the mounting head 26, 28 in the high-precision mode is smaller than in the normal mode. This enables the increase in the mounting accuracy to be achieved. For example, two control programs, i.e., a control program 113 in which the restriction processing is not determined and a control program 113 in which it is determined, are stored in the storage device 111. The controller 105 executes the control program 113 in which the restriction processing is not determined when the normal mode is set. The controller 105 executes the control program 113 in which the restriction processing is determined when the high-accuracy mode is set. In this way, the above restriction processing can be performed when the high-accuracy mode is set, i.e., the user requests the high accuracy. Depending on the mode set by the user, he can give priority to production efficiency without performing the restriction processing or give priority to mounting accuracy by performing the restriction processing.In the high-precision mode, so-called backlash reduction control can be performed. The "backlash reduction control" referred to herein is a control by which, when the mounting head 26, 28 is moved from the present location to a predetermined processing location (mounting location), the mounting head 26, 28 is once stopped at a certain preparation location and then moved to the processing location or its moving speed is restricted from the preparation location to the processing location, etc., as described in WO 2016 / 199241 A. When the linear motor is not used as the X-direction slide mechanism 51 or the Y-direction slide mechanism 52, etc., but a mechanism for coupling teeth such as a ball screw mechanism, etc., there is a fear that a deviation of about several μm occurs at the stop position of the moving target location due to backlash. To correct this deviation in positioning, the preparation location between the movement starting point and the movement destination may be determined, and the stop position may be corrected by adjusting the movement speed, etc., at the preparation location. The increase in mounting accuracy according to the user's needs can be achieved by performing the above restriction processing in the high-accuracy mode in which this backlash reduction control is performed. Note that the component mounting work machine 10 does not need to be provided with the normal mode and the high-precision mode, and whether or not the restriction processing is performed needs to be switched depending on the mode. For example, the component mounting work machine 10 may be configured such that the restriction processing is always performed.In the above-mentioned embodiment, the electronic component 13 is an example of a component according to the present disclosure. The suction nozzle 77 is an example of a grip member. The X-direction slide mechanism 51 is an example of a first moving device. The Y-direction slide mechanism 52 is an example of a second moving device. The belt feeder 99 is an example of a feeder.As mentioned above, the following advantages are obtained in the above-mentioned first embodiment.The controller 105 of the control device 103 as an embodiment of the present embodiment restricts the operation of the other mounting head 26, 28 to the suction operation depending on an arbitrary mounting head 26, 28 of the mounting heads 26, 28 performing the mounting operation. Thereby, the vibrations generated during the mounting operation of the any one mounting head 26, 28 by the operation of the other mounting head 26, 28 can be reduced. Therefore, the increase in the mounting accuracy can be achieved.(Second Embodiment)Next, a second embodiment of the component mounting work machine according to the present disclosure will be explained. In the above-mentioned first embodiment, the restriction processing is realized by being predetermined in the control program 113. In the second embodiment, on the other hand, the restriction processing is realized by the controller 105 performing the judgment for each operation of the mounting head 26, 28. Mentioned in detail, Fig. 6 shows a flow chart of the judgement processing for deciding the operation of the mounting head 26, 28 according to the second embodiment. The controller 105 causes the individual mounting heads 26, 28 to perform four operations in order determined in the control program 113, i.e., suction operation, mounting location moving operation, mounting operation, supply location moving operation, in sequence, as mentioned above. For example, when these four operations are performed in sequence, the controller 105 performs the judgment processing of FIG. 6 each time before the start of performing the next operation, and judges whether or not the next operation can start. That is, in the second embodiment, unlike the first embodiment, the control program 113 does not determine the timing and so on for the start, but determines only the order of the operations, and the controller 105 performs the judgment processing of FIG. 6 before the start of each operation, thereby judging whether or not the operation can be performed.In detail, before starting the next operation of one of the mounting heads 26, 28, the controller 105 judges in step (hereinafter referred to simply as S) 11 of FIG. 6 whether or not the next operation is the mounting operation. As an example in the following explanation, the next operation of the mounting head 26 as the judgment object will be explained. In this case, the controller 105 judges whether or not the next operation of the mounting head 26 is the device operation (S 11). When the controller 105 judges that the next operation of the mounting head 26 is the device operation (S 11: YES), it judges whether or not the operation performed by the other mounting head 28 is the suction operation (S 13). When the operation of the mounting head 28 is not the suction operation (S 13: NO), the controller 105 waits the mounting head 26 for a predetermined time without causing the mounting head 26 to start the next operation (S 15) even if the mounting head 26 is in a state in which it can finish the operation currently performed, e.g., the mounting location moving operation, and start the next operation. The controller 105 performs the judgment processing S 13 again after performing step S 15.In addition, the controller 105 causes the mounting head 26 to perform the next operation (S 17), when the operation performed by the mounting head 28 is not the suction operation (S 13: YES), or when the mounting head 28 has started the suction operation (S 13: YES). That is, the controller 105 causes the mounting head 26 to start the mounting operation. Therefore, before starting the mounting operation of the mounting head 26, the controller 105 confirms whether the mounting head 28 performs the suction operation (S 13). When the suction operation is not performed (S 13: NO), the controller 105 waits the mounting head 26 until the suction operation of the mounting head 28 starts, without starting the next operation of the mounting head 26 (S 15). Thereby, the mounting head 26 can perform the mounting operation only when the other mounting head 28 performs the suction operation, whereby the mounting accuracy can be increased. The controller 105 restarts the processing from S 11 after the next operation starts in S 17. Thereby, the controller 105 performs the judgment processing of S 11 for the next operation of the mounting head 26 (in this case, the next operation after the mounting operation started in S 17). At the time of starting the processing of S 17, when the performed operation (the foregoing operation, etc.) is not yet completed, the controller 105 performs the step S 17 after completion of the entire operation to be performed, and then starts the next operation.As the mounting operation and suction operation as the evaluation object according to the second embodiment, the single mounting operation and suction operation (for an electronic component 13) described in the first embodiment can be applied. Alternatively, as the mounting operation as the evaluation object, the operation including multiple mounting operations and operations for moving between multiple mounting locations, i.e., an operation series for continuously mounting multiple electronic components 13 on different mounting locations, may be employed. As the suction operation as the evaluation object, the operation including multiple suction operations and operations for moving between multiple supply points 101, i.e., an operation series for continuously sucking multiple electronic components 13 from the same or different supply points 101 may be employed. In this case, with respect to the suction operation judged in S 13, the controller 105 may judge whether or not a series of multiple suction operations and moving operations is performed. The controller 105 may start a series of multiple mounting operations and moving operations with respect to the mounting operation started in S 17. In the following S19, S21 and S23, the above series of operations may be applied in the same manner.In S 11, when the next operation of the mounting head 26 is not the mounting operation (S 11: NO), the controller 105 judges whether the operation performed by the other mounting head 28 is not the mounting operation (S 19). When the operation of the mounting head 28 is not the mounting operation (S 19: YES), the controller 105 causes the mounting head 26 to start the next operation (S 17). Thereby, the controller 105, which judges whether or not the next operation of the arbitrary mounting head 26, 28 can start, causes the mounting head to start the next operation when neither the next operation of the mounting head nor the operation of the other mounting head is the mounting operation. Each placement head 26, 28 may perform the operations determined in the control program 113 in sequence until these two placement heads 26, 28 begin the placement operation. In applying the above series of operations, the controller 105 judges whether or not a series of the mounting operations (operations including the movement between a plurality of mounting places) is performed in S 19.When the operation of the mounting head 28 is the mounting operation (S 19: NO), the controller 105 judges whether or not the next operation of the mounting head 26 is the suction operation (S 21). When the next operation of the mounting head 26 is the suction operation (S 21: YES), the controller 105 causes the mounting head 26 to start the suction operation (S 17). Thereby, the mounting head 26 can perform the suction operation during the execution of the mounting operation of the other mounting head 28. In applying the above series of operations, the controller 105 judges whether or not a series of the suction operations (operations including the movement between a plurality of delivery points 101) is the next operation in S 21.When the next operation of the mounting head 26 is not the suction operation (S 21: NO), the controller 105 performs step S 23. In this case, the next operation of the mounting head 26 is the "mounting location moving operation" or "feeding location moving operation", and the operation performed by the other mounting head 28 is the mounting operation. Therefore, the controller 105 judges in S 23 whether or not the mounting operation of the mounting head 28 is completed, and repeats the judgment processing from S 23 to its completion (S 23: NO) while the controller 105 waits the mounting head 26 for a predetermined time in the same manner as in S 15 (S 25). When applying the above series of operations, the controller 105 judges whether or not a series of the mounting operations (operations including the movement between a plurality of mounting places) is completed in S 23.After completion of the mounting operation of the mounting head 28, the controller 105 causes the mounting head 26 to perform the next operation (mounting location moving operation or supply location moving operation) (S 17). For example, the case where the controller 105 judges during the execution of the suction operation of the mounting head 26 whether the mounting location moving operation is being executed as the next operation of the mounting head 26 is assumed. In this case, the controller 105 confirms whether or not the mounting operation of the mounting head 28 is completed before the start of the mounting location moving operation, which is the next operation, when, during the execution of the mounting operation of the other mounting head 28 (an example of the first mounting head according to the present disclosure), the execution of the suction operation by the mounting head 26 (an example of the second mounting head according to the present disclosure) is completed (S 23). When the mounting operation of the mounting head 28 is not yet completed (S 23: NO), the controller 105 waits the mounting head 26 until completion of the mounting operation of the mounting head 28 (S 25). This can prevent the operation (mounting location moving operation, etc.) acting on the mounting accuracy from starting during the mounting operation. In this way, controller 105 may adjust the timing of execution prior to the beginning of the next operation of any one pick-and-place head 26, 28 of two pick-and-place heads 26, 28, confirming the operation of the other pick-and-place head.The control method of the mounting head 26, 28 shown in FIG. 6 is an example. For example, the controller 105 may perform the judgment processing of FIG. 6 only for one of the mounting heads 26, 28. For example, at a timing where the one mounting head 26, 28 starts the mounting operation, the controller 105 may stop the operation of the other mounting head 26, 28 when the other mounting head 26, 28 performs an operation other than the suction operation. For example, at a timing where the mounting head 26 starts the mounting operation, the controller 105 may stop the movement of the mounting head 28 or move and stop the mounting head 28 to the mounting location when the mounting head 28 performs the mounting location moving operation. The controller 105 can restart the operation of the mounting head 28 at a timing when the mounting operation of the mounting head 26 is completed. For example, at a timing where the mounting head 26 starts the mounting operation, the controller 105 may stop the movement of the mounting head 28 when the mounting head 28 performs the feed point moving operation. Then, the controller 105 can restart the operation of the mounting head 28 at a timing where the mounting operation of the mounting head 26 is completed. The controller 105 can perform the judgment processing of FIG. 6 in the same manner as in the first embodiment only for the operation during the downward movement of the suction nozzle 77 and subsequent mounting without performing the limitation on the entire period of the mounting operation. For example, in S 19, S 23, the controller 105 may judge the operation of the other mounting head 28 from the timing of starting the downward movement of the suction nozzle 77 at the mounting location to the completion of the release of the electronic component 13, namely, whether said operation is performed or completed. In addition, the control processing may be performed only during mounting. For example, in S 19, S 23, the controller 105 may judge the operation of the other mounting head 28 from the timing of completion of the downward movement of the suction nozzle 77 at the mounting location to the completion of the release of the electronic component 13, namely, whether said operation is performed or completed.In the above embodiment, the mounting heads 26, 28 constitute an example of the first and second mounting heads according to the present disclosure.As mentioned above, in the second embodiment, the same advantages as in the first embodiment are obtained. Further, the following advantages are obtained in the second embodiment. The controller 105 as an embodiment of the present embodiment judges the operation of the other mounting head 26, 28 before the start of the next operation of each mounting head 26, 28, performs the waiting processing, and sets the timing for the start. This can prevent the operation on the mounting accuracy from being performed other than the suction operation during the mounting operation. In addition, the work for determining the relationship of the operations between the mounting heads 26, 28 is no longer necessary at the stage of determining the control program 113 as in the first embodiment. That is, the load on the preparation of the control program 113 can be reduced.(Third Embodiment)Next, a third embodiment according to the present disclosure will be explained. In the first embodiment, depending on any one of the mounting heads 26, 28 of a plurality of mounting heads 26, 28 performing the mounting operation, one component mounting work machine 10 restricts the operation of the other mounting head 26, 28. In the following explanation of the third embodiment, the same construction as in the first embodiment is denoted by the same reference numerals, and the explanation thereof is omitted as appropriate according to circumstances. In FIG. 7, the illustration of a part of the constituent elements such as mark cameras 34, 36, component cameras 38, 40, Z-direction slide mechanism 53, etc. is omitted to avoid the drawing from becoming complicated.The mounting line 120 according to the third embodiment is provided with component mounting work machines 10A, 10B that are juxtaposed on a base frame 121 in the X direction for conveying a board 12 (an example of the conveyance direction according to the present disclosure), as shown in FIG. 7. The component mounting work machines 10A, 10B have the same construction and are each provided with a board conveying / holding device 20, a moving device 22A, a mounting head 26, a feeding device 30, and so on. The component mounting work machines 10A, 10B constitute a production line by coupling the two board conveyance / holding devices 20 to each other in the X direction. The moving device 22A has the same construction as the moving device 22 according to the first embodiment, but is configured to move a mounting head 26. For example, a Y-direction guide rail 55 is provided on a Y-direction slide mechanism 52 of the moving device 22A, and an X-direction guide rail 57 is provided on an X-direction slide mechanism 51. The moving device 22A, like the moving device 22, is provided with a Z-direction slide mechanism 53 (see FIG. 4 ) for moving the mounting head 26 in the Z direction. Each component mounting work machine 10A, 10B holds the X-direction conveyed board 12 stationary at each machining location 47A, 47B, and performs the mounting with the electronic component 13 by each mounting head 26. Therefore, the mounting line 120 can perform parallel mounting of individual boards 12 by two component mounting work machines 10A, 10B.Each component mounting work machine 10A, 10B is provided, at one end of the base frame 16 in the Y direction, with the feeding device 30, which can be equipped with a plurality of belt feeders 99 (see FIG. 1 ). The mounting head 26 of each component mounting work machine 10A, 10B takes out the electronic component 13 from the feeder 30, and performs the mounting work for the board 12 at the work location 47A, 47B. In an apparatus in which a plurality of component mounting work machines 10A, 10B are mounted on a base frame 121, such as mounting line 120, there is a fear that vibrations generated by the operation of any component mounting work machine 10A, 10B are transmitted to the other component mounting work machine 10A, 10B and reduce the mounting accuracy. Therefore, in the structure having a plurality of component mounting work machines 10A, 10B for performing the mounting work in parallel as in the third embodiment, the restriction processing can be performed in the same manner as in the first embodiment. Specifically, depending on the one component mounting work machine 10A, 10B performing the mounting head, the operation of the other component mounting work machine 10A, 10B is restricted. For example, the operation of the mounting head 26 of the component mounting work machine 10B is limited to the suction operation during the execution of the mounting operation of the mounting head 26 of the component mounting work machine 10A. Thereby, the increase in the mounting accuracy can be achieved even on the component mounting work machines 10A, 10B that are operated in parallel.The method for realizing the constraint processing on the mounting line 120 is not particularly limited. For example, in the control program 113 that executes each control device 103 of the two component mounting work machines 10A, 10B, the timing for executing the mounting work, the timing for executing the restriction processing, etc., may be predetermined as in the first embodiment. Alternatively, the mounting line 120 may be provided with a higher-order control device for integrally controlling the control devices 103 of the two component mounting work machines 10A, 10B. At this time, the supervisory control device can judge the start of the next operation of the two component mounting work machines 10A, 10B as in the second embodiment. Alternatively, the control devices 103 of the two component mounting work machines 10A, 10B may perform immediate communication and judge the start of the next operation.In the above individual embodiments, depending on that any one mounting head 26, 28 performs the mounting operation, the operation of the other mounting head 26, 28 is limited to the suction operation, but it is also possible to limit the operation not to this but to another operation or plural operations including the suction operation. In the construction of the adjacent component mounting work machines 10A, 10B shown in FIG. 7, unlike the first embodiment, for example, the pair of X-direction guide rails 57 do not engage with each other in the Y direction, or the mounting heads 26, 28 do not engage with each other in the XY direction. That is, the mounting operation of the component mounting work machine 10A does not interfere with the mounting operation of the component mounting work machine 10B, and therefore can be independently executed. In addition, the generated vibrations are smaller than those by the mounting location moving operation and the feeding location moving operation, because the position of the mounting head 26 is not changed in the mounting operation. Therefore, during execution of the mounting operation of the component mounting work machine 10A, the operation of the other component mounting work machine 10B can be limited to the mounting operation or two operations, i.e., suction operation and mounting operation.As mentioned above, in the third embodiment, the same advantages as in the first and second embodiments are obtained. Further, the following advantages are obtained in the third embodiment.The mounting line 120 as an aspect of the present disclosure restricts the operation of the other component mounting work machine 10A, 10B depending on any component mounting work machine 10A, 10B out of a plurality of component mounting work machines 10A, 10B performing the mounting operation. This makes it possible to achieve the increase in mounting accuracy when the mounting work is performed in parallel by a plurality of component mounting work machines 10A, 10B.The number of component mounting work machines 10 associated with the mounting line 120 is not limited to 2, but may be 3 or more. The construction of a plurality of component mounting work machines 10A, 10B is not limited to being mounted on a base frame 121. They can be designed in such a way that they are set independently on separate base frames 16. Also in this case, performing the restriction processing is effective because there is a fear of transmission of the vibrations via the coupled board conveying / holding devices 20.The present disclosure is not limited to the above individual embodiments, but may be embodied in various forms subject to various modifications or improvements due to knowledge of those skilled in the art.For example, the construction of the component mounting work machine 10, 10A, 10B according to the individual embodiments is an example. The component mounting work machine 10, 10A, 10B may be provided with 3 or more mounting heads, for example. The component mounting work machine 10 may be provided with two or more board conveying / holding devices 20 (conveyor devices 41) that are adjacent to each other in the Y direction. That is, the component mounting work machine 10 may be provided with two conveyance paths for conveying the electronic components 13 along the X direction. Here, the feeders 30, 32 may be arranged so that two conveyor paths (conveyor devices 41) are interposed therebetween on the both sides in the Y direction. The construction of the mounting head 26, 28 in the above individual embodiments is an example. The placement head 26, 28 can be designed, for example, in such a way that it is provided with a single suction nozzle 77. The moving device 22, 22A does not need to be provided with the Z-direction slide mechanism 53. That is, the moving device 22, 22A does not need to be provided with the mechanism for moving the mounting head 26, 28 up and down in the Z direction. Alternatively, the moving device 22, 22A may be provided with a Z-direction slide mechanism 53 for only one of the mounting heads 26, 28.In the individual embodiments, as the gripping member for gripping the electronic component 13, the suction nozzle 77 is employed, but the gripping member is not limited to these. As the gripping member, for example, a chuck member that clampingly holds the electronic component 13 may be employed. The feeding device 30, 32 according to the present disclosure is not limited to the belt feeder 99, but may be a tray-type feeding device for feeding the electronic components 13 disposed on the tray.The present disclosure content is not limited to the claimed dependence. For example, the present description also discloses the technical idea in which the "component mounting work machine according to claim 1 or 2" according to claim 5 is replaced with the "component mounting work machine according to any one of claims 1 to 4". For example, the present description also discloses the technical idea in which the "component mounting work machine according to claim 1 or 2" according to claim 6 is replaced with the "component mounting work machine according to any one of claims 1 to 5". For example, the present specification also discloses the technical idea in which the "component mounting work machine according to claim 1 or 2" according to claim 7 is replaced with the "component mounting work machine according to any one of claims 1 to 6".LIST OF REFERENCE CHARACTERS10, 10A, 10B component mounting work machine 12 board 13 electronic component (component) 22, 22A moving device 26, 28 mounting head (first and second mounting head) 30, 32 feeding device 51 X-direction slide mechanism (first moving device) 52 Y-direction slide mechanism (second moving device) 77 suction nozzle (gripping member) 99 belt feeder (feeder) 103 control device 113 control program 120 mounting lineReferences included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedJP 2007-158115 A
[0003] WO 2016 / 199241 A
[0047]
Claims
A component mounting work machine comprising a plurality of mounting heads having gripping members for gripping components and configured to mount a board with the components gripped by the gripping members, feeding devices for feeding the components to the individual plurality of mounting heads, a moving device for moving the individual plurality of mounting heads, and a control device configured to restrict the operation of the other mounting head to a removal operation for removing the component from the feeding device, depending on an arbitrary mounting head of the plurality of mounting heads performing a mounting operation.The component mounting work machine according to claim 1, wherein the mounting operation represents an operation from a time point when the mounting head reaches the upper side of a mounting location on the board mounted with the component to a state in which it can start moving from the mounting location to the next movement destination after mounting the component.The component mounting work machine according to claim 2, wherein the control device restricts the operation of the other mounting head to the extraction operation from a time point when the arbitrary mounting head reaches the upper side of the mounting location until completion of mounting of the component after moving the gripping member downward and then releasing the gripping of the gripping member, and does not restrict the operation of the other mounting head after completion of mounting and then starting an operation for moving the gripping member upward.The component mounting work machine according to claim 2 or 3, wherein the control device does not restrict the operation of the other mounting head from a time point when the arbitrary mounting head reaches the upper side of the mounting location until completion of the downward movement of the gripping member, restricts the operation of the other mounting head to the removal operation during the operation for releasing the gripping of the downward movement gripping member, and does not restrict the operation of the other mounting head after completion of the release of the gripping of the gripping member and subsequent start of the operation for upward movement of the gripping member.The component mounting work machine according to claim 1 or 2, wherein the control device controls the moving device and mounting heads based on a control program, and moves each of the plurality of mounting heads to a mounting location determined in the control program to have it perform the mounting operation, wherein it is determined in the control program that, depending on the arbitrary mounting head performing the mounting operation, the operation of the other mounting head is limited to the unloading operation.The component mounting work machine according to claim 1 or 2, wherein the plurality of mounting heads includes a first mounting head corresponding to the arbitrary mounting head and a second mounting head corresponding to the other mounting head, wherein the control device makes the first and second mounting heads perform four operations of the extraction operation, a mounting location moving operation for moving the mounting head from the supply device to the location of the board after the extraction operation, the mounting operation after the mounting location moving operation, and a supply location moving operation for moving the mounting head from the board to the location of the supply device after the mounting operation, respectively, in the case where the extraction operation of the second mounting head is completed during the execution of the mounting operation of the first mounting head, It confirms whether or not the mounting operation of the first mounting head is completed before the start of the mounting location moving operation, and in the case where it is not yet completed, it waits for the second mounting head to wait until the completion of the mounting operation of the first mounting head, and confirms whether or not the second mounting head performs the extraction operation before the start of the mounting operation of the first mounting head, and in the case where it does not perform it, it waits for the first mounting head until the start of the extraction operation of the second mounting head.The component mounting work machine according to claim 1 or 2, wherein the moving device includes a first moving device for moving the individual plurality of mounting heads in a first direction and a second moving device equipped with the first moving device for moving the first moving device in a second direction perpendicular to the first direction, the feeding devices include a plurality of feeders for feeding the components, each of the plurality of feeders feeds the component to the mounting head at a feeding location, the feeding locations of the individual feeders are arranged side by side in the first direction, and each of the plurality of mounting heads includes the plurality of gripping members, wherein the control device, in the picking operation, moves the mounting head in the first direction by controlling the first moving device, and each of the plurality of gripping members picks the component from the feeding location of each of the plurality of feeders.A mounting line comprising a plurality of component mounting work machines that are adjacent to each other in a conveyance direction of a board, the component mounting work machine comprising a mounting head having gripping members for gripping components and configured to perform a mounting operation for mounting the board with the components gripped by the gripping members, a feeding device for feeding the component to the mounting head, and a moving device for moving the mounting head, wherein, depending on any component mounting work machine of the plurality of component mounting work machines performing the mounting operation, the operation of the other component mounting work machine is restricted.
Citation Information
Patent Citations
Component mounting method
JP2007158115A
Method and device for controlling component mounting device
WO2016199241A1