Working head

Abstract

A work head for performing work on a plate in a plate processing machine comprises: an LED package configured to be used by an imaging device, the LED package being selectively turned on in a first mode in which the LED package is turned on when the imaging device is performing imaging, and in a second mode in which the LED package is turned on when the imaging device is not performing imaging.

Description

Technical area

[0001] The present invention relates to a working head for performing work on a plate in a plate processing machine. State of the art

[0002] The following patent literature describes that when the luminance of an LED package is reduced by a gas penetrating into the sealing resin of the LED package, the LED package is turned on under a predetermined environment to restore the luminance of the LED package. Citation listPatent literature

[0003] Patent Literature 1:JP-A-2017-117993 Summary of the inventionTechnical problem

[0004] One objective of the present description is to restore the luminance of an LED package in a working head containing the LED package. Solution to the problem

[0005] To solve the above problem, the present specification discloses a work head for performing work on a plate in a plate processing machine, the work head comprising: an LED package configured to be used by an imaging device, in which the LED package is selectively turned on in a first mode in which the LED package is turned on when the imaging device is performing imaging, and a second mode in which the LED package is turned on when the imaging device is not performing imaging. Advantageous effects of the invention

[0006] In the present disclosure, a working head includes an LED package configured to be used by an imaging device, wherein the LED package is selectively turned on in a first mode in which the LED package is turned on when the imaging device is performing imaging, and in a second mode in which the LED package is turned on when the imaging device is not performing imaging. Accordingly, it is possible to perform imaging by turning on the LED package in the first mode and to restore the luminance of the LED package by turning on the LED package in the second mode. Short description of the characters Fig. 1 is a perspective view showing a plate processing system. Fig. 2 is a perspective view of a mounting device. Fig. 3 is a schematic representation of an assembly head. Fig. 4 is a perspective view of an LED package. Fig. 5 is a block diagram showing a control device. Fig. 6 is a schematic diagram of a mounting head of a second example. Description of the embodiments

[0007] Hereinafter, exemplary embodiments of the present invention are described in detail with reference to the figures.

[0008] Fig. 1 shows a plate processing system 10. The Fig. The board processing system 10 shown in Figure 1 is a system for manufacturing a printed circuit board on which electronic components are mounted. The board processing system 10 includes three adjacently arranged electrical component mounting fixtures (hereinafter abbreviated as "mounting fixtures") 12 and a reflow oven 16.

[0009] The apparatus 12 includes a system base 20 and two electronic component mounters 22 (hereinafter abbreviated as "mounters") arranged side by side on the system base 20. That is, six mounters 22 are arranged in a row. When distinguishing six mounters 22 from each other, the mounters 22 may be referred to as the first to sixth mounters 22, from the most upstream mounter 22 to the most downstream mounter 22.

[0010] The reflow oven 16 is arranged downstream of the mounter 22 which is arranged most downstream of the six mounters 22, that is, the sixth mounter 22. In the following description, a direction in which the mounter 22 and the reflow oven 16 are arranged is referred to as an X-axis direction, and a horizontal direction perpendicular to the X-axis direction is referred to as a Y-axis direction.

[0011] First, the devices 12 will be described. Since three mounting devices 12 have essentially the same configuration, one mounting device 12 of three mounting devices 12 will be described as representative. As shown in Fig. As shown in Figure 2, the assembly device 12 includes a system base 20 and two assemblers 22 arranged side by side on the system base 20. Each assembler 22 essentially includes a assembler main body 24, a conveying device 26, a mounting head moving device (hereinafter abbreviated as "moving device") 28, a mounting head 30, and a feeding device 32.

[0012] The mounter main body 24 includes a frame 36 and a bracket 38 attached to the frame 36.

[0013] The conveyor device 26 comprises two conveyor belt devices 40 and 42. The two conveyor belt devices 40 and 42 are arranged parallel to each other on the frame 36 and extend in the X-axis direction. Each of the two conveyor belt devices 40 and 42 transports a printed circuit board, which is mounted on each of the conveyor belt devices 40 and 42, in the X-axis direction with an electric motor (see Fig. 5) 44. The printed circuit board conveyed by each of the conveyor belt devices 40 and 42 is held by a board holding device (see Fig. 5) 46 held at predetermined positions.

[0014] The movement device 28 is an XY robot movement device. The movement device 28 comprises an electric motor (see Fig. 5) 52, which moves the slider 50 in the direction of the X-axis, and an electric motor (see Fig. 5) 54, which moves the slider 50 in the Y-axis direction. The mounting head 30 is attached to the slider 50, and the mounting head 30 moves to any desired position on the frame 36 by actuating the two electric motors 52 and 54. The mounting head 30 is attached to and detached from the slider 50 by a worker with a single touch, without the use of any tools or the like.

[0015] The mounting head 30 is used to mount an electronic component on a printed circuit board. As shown in Fig. 3, the mounting head 30 comprises a suction nozzle 60 arranged in the center of a lower end face. The suction nozzle 60 is connected via vacuum and positive pressure air channels to a positive and negative pressure supply device (see Fig. 5) 62. The suction nozzle 60 picks up and holds an electronic component using negative pressure, and separates the held electronic component using positive pressure. Furthermore, the mounting head 30 includes a nozzle lifting and lowering device (see Fig. 5) 64, which raises and lowers the suction nozzle 60. The mounting head 30 changes the position of the held electronic component in an up-down direction with the nozzle raising and lowering device 64. Furthermore, the mounting head 30 includes an illumination device 66 and an imaging device 68, which are arranged so that the suction nozzle 60 is located therebetween at the lower end surface. An LED package 70 is integrated with the illumination device 66, and the illumination device 66 is arranged on the lower end surface of the mounting head 30 in a position where the LED package 70 opposes a tip of the suction nozzle 60. The imaging device 68 is arranged in a position where the imaging device 68 opposes the illumination device 66 with the suction nozzle 60 as the center.Accordingly, the electronic component held by the suction nozzle 60 is imaged by the imaging device 68 in a state illuminated by the LED package 70 of the illumination device 66. The mounting head 30 includes a control device 72 (see FIG. Fig. 5), and the operation of the nozzle raising and lowering device 64, the illumination device 66 and the imaging device 68 is controlled by the control device 72.

[0016] As in Fig. As shown in Figure 4, the LED package 70 includes a board 74, a pair of lead frames 76 and 78, an LED element 80, and a sealing resin 82. The board 74 has a generally elongated shape, and the pair of lead frames 76 and 78 are arranged at both end portions of the board 74 in the longitudinal direction. The LED element 80 is fixed to the first lead frame 76 of the pair of lead frames 76 and 78, and the second lead frame 78 and the LED element 80 are connected via a wire 84. The LED element 80 fixed to the lead frame 76 and the wire 84 connecting the lead frame 78 and the LED element 80 are covered with sealing resin 82.

[0017] As in Fig. 2, the feeding device 32 is a tape feeder arranged at one end portion of the frame 36. The feeding device 32 comprises a plurality of tape feeders 86. The tape feeder 86 receives a tape component that is wound around it. The tape component is obtained by winding electronic components onto a carrier tape. The tape feeder 86 feeds the tape component with a delivery device (see Fig. 5) 88. Consequently, the feeding device 32 delivers an electronic component to a feeding position by feeding the tape component.

[0018] The reflow oven 16 is a device that heats a circuit board on which an electronic component is mounted to melt a solder and then fixes the electronic component to the circuit board. The reflow oven 16 is connected to the mounter 22, which is located downstream of the six mounters 22, that is, the sixth mounter 22. The reflow oven 16 includes conveyor devices 90 and 92, which have the same structure as the conveyor devices 40 and 42 of the mounter 22. The conveyor device 90 of the reflow oven 16 is connected to the conveyor device 40 of the sixth mounter 22, and the conveyor device 92 of the reflow oven 16 is connected to the conveyor device 42 of the sixth mounter 22. The reflow oven 16 has a heater (see Fig. 5) 96, which heats a circuit board transported by each of the conveyor belt devices 90 and 92.

[0019] As in Fig. 5, the board processing system 10 further includes a control device 100. The control device 100 includes a controller 102, and the controller 102 is connected to the conveyor device 26, the moving device 28 and the mounting head 30 of the mounter 22, the tape feeder 86, and the reflow oven 16. The controller 102 includes CPU, ROM, RAM, and the like and is mainly configured with a computer. Accordingly, the operations of the conveyor device 26, the moving device 28 and the mounting head 30 of the mounter 22, the tape feeder 86, and the reflow oven 16 are controlled by the controller 102. The controller 102 stores the production program 110, and the controller 102 manufactures a printed circuit board by controlling the operations of the mounter 22 and the reflow oven 16 according to the production program 110.

[0020] When a printed circuit board is conveyed into the first mounter 22, the controller 102 issues a command according to the production program 110 so that the conveyor 26 of the first mounter 22 conveys the printed circuit board to a work position and holds the printed circuit board at that position. Furthermore, the tape feeder 86 feeds a taped component and places an electronic component at the feed position in response to the command from the controller 102 according to the production program 110. Then, the mounting head 30 moves over the electronic component feed position in response to the command from the controller 102 according to the production program 110, and the electronic component is picked up and held by the suction nozzle 60. Subsequently, the mounting head 30 turns on the LED package 70 at the command from the controller 102 according to the production program 110, and the electronic component held by the suction nozzle 60 is imaged.Then, the controller 102 calculates a holding position, a holding posture, and the like of the electronic component based on the image data. Next, the mounting head 30 moves over the circuit board in response to the command from the controller 102 according to the production program 110, and mounts the held electronic component on the circuit board. In this case, an orientation, a posture, and the like of the electronic component held by the suction nozzle 60 are corrected based on the calculated holding position, holding posture, and the like of the electronic component, and the electronic component is mounted on the circuit board. Then, when the mounting of the electronic component on the circuit board in the first mounter 22 is completed, the conveyor 26 conveys the circuit board to a downstream side in response to the command from the controller 102 according to the production program 110.Accordingly, the circuit board is conveyed to the second mounter 22.

[0021] Subsequently, the second to sixth mounters perform the same work as in the first mounter described above, so that the mounting work of the electronic component on the circuit board is completed. When the circuit board on which the mounting work is completed is transferred to the reflow oven 16, the conveyor devices 90 and 92 of the reflow oven 16 convey the circuit board to the working position and hold the circuit board in the working position in response to the command from the control unit 102 according to the production program 110. Subsequently, the heater 96 heats the circuit board to melt the solder at the command from the controller 102 according to the production program 110, so that the electronic component is mounted on the circuit board. Subsequently, the conveyor devices 90 and 92 convey the circuit board to the downstream side at the command from the controller 102 according to the production program 110.Accordingly, the circuit board is moved out of the reflow oven 16 and the circuit board is manufactured.

[0022] As described above, in the printed circuit board system 10, the electronic component is mounted in the mounters 22, and the solder is heated in the reflow oven 16, thereby manufacturing the printed circuit board. Meanwhile, when the solder is heated in the reflow oven 16, VOCs (volatile organic compounds) are generated, and the luminance of the LED package 70 of the mounting head 30 in the mounter 22 may decrease due to the VOCs. In particular, since silicone resin or the like is used as the sealing resin 82 of the LED package 70, and the silicone resin is likely to cause gas to permeate therethrough, the VOCs enter the sealing resin 82 of the LED package 70. When the LED package 70 is powered on in a state where the VOCs have entered the sealing resin 82, the VOCs in the sealing resin 82 change, and its color changes. Therefore, the transmittance of the sealing resin 82 decreases, and the luminance of the LED package 70 decreases.

[0023] In view of this, the controller 102 of the control device 100 stores the luminance restoration program 120, and the controller 102 restores the luminance of the LED package 70 in accordance with the luminance restoration program 120. Specifically, the LED package 70 in the sealing resin 82, whose color has been changed by the VOC, is turned on in an environment where the VOC is low, so that a component that caused the color change of the sealing resin 82 is released from the sealing resin 82, and the luminance of the LED package 70 is restored. During the assembly work in the board system 10, it is assumed that the reflow oven 16 is in operation and the VOC concentration in the board system 10 is high. Therefore, when the assembly work in the board system 10 is not performed, that is,When the work on a printed circuit board is not performed, the luminance restoration of the LED package 70 is performed in accordance with the luminance restoration program 120.

[0024] Specifically, the luminance recovery program 120 issues a turn-on command for the LED package 70 to the mounting head 30 when work on the circuit board is not being performed. Of the six mounters 22, the fifth and sixth mounters located near the reflow oven 16 have a high concentration of VOCs, and the luminance of the LED package 70 is significantly reduced, so the luminance recovery program 120 issues the turn-on command to the mounting heads 30 of the fifth and sixth mounters. In the mounting head 30 that has received the turn-on command, the control device 72 of the mounting head 30 turns on the LED package 70 by controlling the operation of the LED package 70.As described above, the LED package 70 of the mounting head 30 in the fifth and sixth mounters next to the reflow oven 16 is turned on when the work on the circuit board is not performed, and thus it is possible to restore the reduced luminance of the LED package 70 due to the VOC generated by the reflow oven 16.

[0025] It goes without saying that the suction nozzle 60 does not hold the electronic component when the LED package 70 is turned on and no work is being performed on the circuit board. Therefore, even if the LED package 70 is turned on when work is not being performed on the circuit board, the imaging device 68 is not used. That is, when the LED package 70 is turned on for the purpose of restoring the luminance of the LED package 70, the LED package 70 is turned on in a mode in which the LED package 70 is turned on when the imaging device 68 is not performing imaging. On the contrary, when the LED package 70 is turned on in a case where work is being performed on the circuit board, the suction nozzle 60 holds the electronic component, and imaging is performed with the imaging device 68.That is, when the LED package 70 is turned on for the purpose of imaging the electronic component, the LED package 70 is turned on in a mode in which the LED package 70 is turned on when imaging is performed by the imaging device 68. Therefore, the LED package 70 is selectively turned on in a first mode in which the LED package 70 is turned on when imaging is performed, and in a second mode in which the LED package 70 is turned on when imaging is not performed. In other words, the LED package 70 is selectively turned on in the first mode in which the LED package 70 is turned on when the component is held by the suction nozzle 60, and in the second mode in which the LED package 70 is turned on when the electronic component is not held by the suction nozzle 60.In other words, the LED package 70 is selectively turned on in the first mode, in which the LED package 70 is turned on for the purpose of imaging the electronic component, and in the second mode, in which the LED package 70 is turned on for the purpose of restoring the luminance of the LED package 70. As described above, by selectively turning on the LED package 70 in the first mode and the second mode, it is possible to restore the luminance of the LED package 70 for imaging.

[0026] The LED package 70 can be turned on continuously or intermittently. Incidentally, the intermittent turning on is a so-called flashing in which the turning on and off is repeated. By turning on the LED package 70 intermittently, the damage to the LED package 70 caused by high temperature can be reduced. In addition, a time when the turning on command of the LED package 70 is issued when work on the circuit board is not being carried out is a time when the circuit board is being changed as a production target, for example, a time when a factory or the like in which the circuit board processing system 10 is installed is not in operation during setup change work, for example, at night. The turning on command may be issued at a predetermined cycle, for example, every day, or it may be issued when a decrease in the luminance of the LED package 70 is confirmed.To confirm the decrease in the luminance of the LED package 70, the LED package 70 is turned on when no work is being performed on the circuit board, and an imaging device 68 is used. In this case, since the electronic component is not held by the suction nozzle 60, the light emitted from the LED package 70 is imaged by the imaging device 68. Then, brightness, saturation, and the like are calculated based on the data obtained by the imaging, and the luminance of the LED package 70 is estimated. If the estimated luminance is equal to or lower than a threshold value, it is detected that the luminance of the LED package 70 is reduced, and the turn-on command for the LED package 70 is issued.If the luminance recovery of the LED package 70 is performed after the luminance of the LED package 70 has dropped to or below the threshold value, the time required for luminance recovery may be considerably long. Therefore, issuing the turn-on command at the specified cycle can prevent the luminance of the LED package 70 from decreasing.

[0027] The luminance restoration program 120 can also issue the turn-on command for the LED package 70 at a predetermined time. That is, the worker sets a time in the luminance restoration program 120 during which work on the circuit board is assumed to be idle. Then, the luminance restoration program 120 issues the turn-on command for the LED package 70 at the set time. Accordingly, it is possible to perform the luminance restoration work of the LED package 70 at the time desired by the worker.

[0028] Solder and silver paste used for PCB manufacturing are also examples of VOC generation. That is, a solvent contained in the solder, silver paste, or the like evaporates and becomes VOC. Therefore, when solder, silver paste, or the like is used in large quantities in the PCB as a production target, the turn-on command of the LED package 70 is issued not only to the fifth and sixth mounters as described above, but to all the first through sixth mounters.

[0029] Specifically, the luminance restoration program 120 specifies a type of printed circuit board as a production target based on the production program 110. The printed circuit board as the production target is a printed circuit board manufactured by the printed circuit board processing system 10 when the LED package 70 is turned on in a mode in which the LED package 70 is turned on when the imaging device 68 performs imaging, that is, in the first mode. Since the production program 110 is a program for manufacturing a printed circuit board as described above, the luminance restoration program 120 can specify the type of printed circuit board as a production target based on the production program 110. Then, the luminance restoration program 120 determines whether a large amount of solder, silver paste, or the like is used in the specified type of printed circuit board. In this case, for example,Information indicating the type of printed circuit board in which solder, silver paste, or the like is used in a large amount can be programmed into the luminance restoration program 120, and the luminance restoration program 120 can determine, based on the information, whether the type of printed circuit board as the production target is the type of printed circuit board in which solder, silver paste, or the like is used in a large amount. Furthermore, if a consumption amount of solder, silver paste, or the like used in the printed circuit board specified based on the production program 110 can be estimated, if the estimated consumption amount is equal to or greater than a threshold value, it can be determined that the type of printed circuit board as the production target is a type of printed circuit board in which solder, silver paste, or the like is used in a large amount.Then, if it is determined that the type of circuit board as the production target is a circuit board in which solder, silver paste, or the like is used in a large amount, the luminance recovery program 120 issues the turn-on command of the LED package 70 to all the first to sixth mounters. Accordingly, it is possible to restore the reduced luminance of the LED package 70 due to the VOCs generated by the solder, silver paste, or the like by performing the luminance recovery work after the work on the circuit board in which the solder, silver paste, or the like is used in a large amount.In particular, since the lighting device 66 with the LED package 70 is arranged on the lower end surface of the mounting head 30, and the LED package 70 approaches a position close to an upper surface of the circuit board during the mounting work, the influence of the VOC generated from the solder, silver paste, or the like on the LED package 70 is large. In view of this, it is possible to restore the reduced luminance of the LED package 70 at an appropriate time by performing the luminance restoration work after the work on the circuit board in which solder, silver paste, or the like is used in a large amount is performed.

[0030] The luminance restoration work is started based on the turn-on command of the LED package 70, but terminates when the luminance of the LED package 70 is restored. Specifically, the LED package 70 is turned on in a state where the suction nozzle 60 does not hold the electronic component, and in this case, the light of the LED package 70 is imaged by the imaging device 68, so that it is possible to estimate the luminance of the LED package 70 based on the imaging data. Therefore, when performing the luminance restoration work, imaging with the imaging device 68 is performed in a predetermined cycle. Note that the imaging using the imaging device 68 when performing the luminance restoration work is for estimating the luminance, not for imaging the electronic component.Then, each time imaging is performed with the imaging device 68, the luminance is estimated based on the imaging data, and it is determined whether the estimated luminance exceeds the threshold. In this case, if it is determined that the estimated luminance exceeds the threshold, the luminance restoration work is terminated. The luminance restoration work can be terminated after the luminance restoration work is continuously performed for a predetermined time, regardless of whether the luminance of the LED package 70 is restored.

[0031] In a first example described above, the luminance restoration work is performed when the mounting head 30 is mounted in the mounter 22, but in a second example, the luminance restoration work is performed when the mounting head 30 is removed from the mounter 22. As described above, the mounting head 30 can be attached to and detached from the slider 50 of the moving device 28. Therefore, the mounting head 30 can be detached from the slider 50 and removed from the mounter 22. In addition, the VOC concentration outside the mounter 22 is generally low, except near the plate processing system 10. Therefore, the luminance restoration work is performed when the mounting head 30 is removed from the mounter 22. In the mounting head 30 in which the luminance restoration work is performed when the mounting head 30 is removed from the mounter 22, as in Fig.As shown in Figure 6, the luminance restoration program 150 is stored in the control device 72 of the mounting head 30. Since the mounting head 30 is not equipped with a battery, the mounting head 30 removed from the mounter 22 is connected to the power supply 160.

[0032] In this way, the luminance restoration work according to the luminance restoration program 150 is performed in a state where the mounting head 30 is removed from the mounter 22 and connected to the power supply 160. That is, when the luminance restoration program 150 determines that the mounting head 30 is removed from the slider 50 and powered by connecting the mounting head 30 to the power supply 160, the luminance restoration program 150 issues the power-on command to the LED package 70. It goes without saying that the suction nozzle 60 does not hold a component outside the mounter 22, and the imaging device 68 does not image the component when the LED package 70 is turned on. Therefore, the LED package 70 is turned on in the second mode, and the imaging device 68 does not perform imaging.As described above, in a state where the mounting head 30 is removed from the mounter 22, the LED package 70 is turned on in the second operation mode, so that it is possible to appropriately restore the luminance of the LED package 70. Since the luminance restoration work is performed outside the mounter 22, it is possible to restore the luminance of the LED package 70 without stopping the mounting work or the like in the panel processing system 10.

[0033] Mounter 22 is an example of a panel processing machine. Mounting head 30 is an example of a work head. Imaging device 68 is an example of an imaging device. LED package 70 is an example of an LED package. Production program 110 is an example of a program.

[0034] The present invention is not limited to the above-described examples and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described example, the luminance restoration work is performed in accordance with the luminance restoration programs 120 and 150, but the luminance restoration work may be performed by user operation. For example, operation buttons may be arranged on an operation panel of the mounter 22, the mounting head 30, the control device 100, and the like, and the luminance restoration work may be performed by operating the operation buttons.Furthermore, the present invention is not limited to the operation buttons, and the luminance restoration work can be performed by the worker inputting the LED package's power-on command. If the worker operates the operation buttons or inputs the power-on command while performing work on the circuit board, it is desirable that the operation, input, and the like be canceled, and the luminance restoration work is not performed.

[0035] In the example described above, the LED package 70 emits light toward the tip of the suction nozzle 60 as the imaging target, but the imaging target is not limited to the electronic component held by the suction nozzle 60, and various objects can be imaged. For example, if the circuit board is the imaging target, the LED package 70 emits light toward the circuit board.

[0036] Although the present invention is applied to the mounting head 30 in the example described above, the present invention can be applied to various working heads such as an inspection head and a discharge head.

[0037] In the first example described above, the luminance restoration program 120 sets the type of circuit board as the production target based on the production program 110, but the type of circuit board as the production target may be obtained from a host computer, a cloud, or the like.

[0038] In the first example described above, luminance restoration work is performed when the production target type of PCB is a PCB that uses a large amount of solder, silver paste, or the like. However, luminance restoration work can be performed when the production target type of PCB is another specific type of PCB. Examples of another specific type of PCB include PCBs that undergo treatment with a VOC-containing material.

[0039] Moreover, in the first example described above, the luminance restoration work is performed in a mounter 22 installed near the reflow oven 16, but the luminance restoration work may also be performed in a mounter 22 installed near a work machine other than the reflow oven 16, e.g., a solder printer.

[0040] In the first example described above, the luminance restoration program 120 is stored in the control device 100, but the luminance restoration program 120 may also be stored in the mounting head 30.

[0041] In the second example described above, the mounting head 30 detached from the mounter 22 is connected to the power supply 160 and the luminance restoration work is performed. However, the mounting head 30 may also be connected to a maintenance unit, a cleaning unit, or the like, and the luminance restoration work can be performed. Accordingly, it is possible to perform the luminance restoration work together with the maintenance or cleaning of the mounting head 30. When the mounting head 30 is connected to the maintenance unit, the cleaning unit, or the like and the luminance restoration work is performed, the luminance restoration program 150 may be stored in the maintenance unit or the like instead of the mounting head 30. Reference character list

[0042] 22: Mounter (Plate processing machine), 30: Mounting head (Working head), 68: Imaging device, 70: LED package, 110: Production program (Program) QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-A-2017-117993

[0003]

Claims

[1] A working head for performing work on a plate in a plate processing machine, the working head comprising: an LED package configured to be used by an imaging device, wherein the LED package is selectively switched on in a first mode in which the LED package is switched on when the imaging device is performing imaging, and in a second mode in which the LED package is switched on when the imaging device is not performing imaging. [2] The work head according to claim 1, wherein the LED package is turned on in the first mode when the work head is performing work on a disk, and the LED package is turned on in the second mode when the work head is not performing work on a disk. [3] The work head according to claim 2, wherein the LED package is turned on in the second mode according to a type of work that is performed when the LED package is turned on in the first mode when the work head is not performing work on a disk. [4] The working head according to claim 3, wherein the type of work is specified based on a program for executing work on a plate on the plate processing machine, and the LED package is turned on in the second mode according to the specified type of work. [5] The work head according to claim 2, wherein in the second mode, the LED package is turned on at a time reserved in advance when the work head is not performing work on a disk. [6] The working head according to claim 1, wherein the LED package is turned on in the first mode when the working head is mounted in the plate processing machine, and the LED package is turned on in the second mode when the working head is removed from the plate processing machine.

Images