REFRIGERATION

Abstract

The cooling device according to this disclosure comprises: a housing having a base plate placed on a heating element, a top plate opposite the base plate, and a side plate connecting the base plate and the top plate on an outer circumferential side, and formed in a hollow shape; a heat exchanger provided on the base plate in the housing, dividing and forming an outer circumferential channel between the heat exchanger and the side plate of the housing, and enabling a refrigerant to communicate through the heat exchanger; a supply unit for supplying the refrigerant from the outside to the outer circumferential channel; and a discharge unit connected to an area located in the top plate and overlapping the heat exchanger in plan view, which discharges the refrigerant from the interior of the housing to the outside.

Description

Technical field

[0001] The present disclosure relates to a cooling device.

[0002] Priority is claimed by the Japanese patent application No. 2023-018423, filed on February 9, 2023, the contents of which are incorporated herein by reference. State of the art

[0003] In recent years, advances have been made in the three-dimensional packaging of semiconductors, and the amount of heat generated by a central processing unit (CPU) or a graphics processing unit (GPU) has increased. For this reason, in a case of air cooling, a heating element such as the CPU or GPU may not be adequately cooled. Therefore, a measure has been taken, for example, to locally cool the heating element using a cold plate or the like, as disclosed in PTL 1. The cold plate of PTL 1 has a plate body in which a refrigerant flow path is formed.

[0004] Furthermore, several of the heating elements, such as the CPU and GPU, are installed in a server, and it is necessary to supply a refrigerant to the cold plate provided for each heating element. List of citations from patent literature

[0005] [PTL 1] Japanese Patent No. 4410065 Summary of the invention: Technical problem

[0006] However, if the refrigerant is to be supplied to several cold plates, it may not be possible to supply a sufficient amount to each one, resulting in an uneven supply of refrigerant to the cold plate. In particular, if the heating element is cooled with high heat generation by bringing the refrigerant to a boiling state, the supply of refrigerant to the cold plate may be significantly uneven, and the heating element may not be cooled sufficiently.

[0007] For such reasons, there was a need to develop a device with high cooling efficiency that is capable of cooling the heating element with high heat generation while stabilizing the supply quantity of refrigerant in the cold plate.

[0008] The present disclosure was made to solve the problems described above, and one of its objectives is to provide a cooling device capable of improving cooling efficiency. Solution to the problem

[0009] To solve the above problems, a cooling device according to the present disclosure comprises a housing having a base plate placed on a heating element, a top plate facing the base plate, and a side plate connecting the base plate and the top plate on an outer circumferential side, and formed in a hollow shape; a heat exchanger provided on the base plate in the housing, which divides and forms an outer circumferential channel between the heat exchanger and the side plate of the housing and which allows a refrigerant to flow through the heat exchanger; a supply unit that feeds the refrigerant from the outside to the outer circumferential channel; and a discharge unit that is connected to an area located in the top plate and that overlaps the heat exchanger in a top view, and that discharges the refrigerant from an interior of the housing to the outside.

[0010] A cooling device according to the present disclosure comprises a housing having a base plate placed on a heating element, a top plate facing the base plate, and a side plate connecting the base plate and the top plate on an outer circumferential side, and formed in a hollow shape; a heat exchanger provided on the base plate in the housing, allowing a refrigerant to flow through the heat exchanger; a supply unit that feeds the refrigerant from the outside to an interior of the housing; and a discharge unit connected to an area located in the top plate that overlaps the heat exchanger in a plan view and discharges the refrigerant from the interior of the housing to the outside, the heat exchanger having several grid fins extending such that they intersect a vertical direction.and which are arranged in the vertical direction, and the grid ribs that are adjacent to each other are arranged so that they are displaced in a direction that intersects the vertical direction. Advantageous effects of the invention

[0011] According to a cooling device of the present disclosure, cooling efficiency can be improved. Brief description of the drawings Fig. Figure 1 is a configuration view of a cooling system that includes a cooling device according to a first embodiment of the present disclosure. Fig. Figure 2 is a perspective view of the cooling device according to the first embodiment of the present disclosure. Fig. Figure 3 is a top view of the cooling device according to the first embodiment of the present disclosure. Fig. Figure 4 is an enlarged side view showing a configuration in the vicinity of a plate fin of a cooling device according to a first modification example of the first embodiment of the present disclosure. Fig. Figure 5 is a top view of a cooling device according to a second modification example of the first embodiment of the present disclosure. Fig. Figure 6 is a top view of a cooling device according to a third modification example of the first embodiment of the present disclosure. Fig. Figure 7 is a perspective view of a cooling device according to a fourth modification example of the first embodiment of the present disclosure. Fig. Figure 8 is a perspective view of a pin rib according to the fourth modification example of the first embodiment of the present disclosure. Fig. Figure 9 is a view of a cooling device according to a second embodiment of the present disclosure when viewed from one side. Fig. Figure 10 is an enlarged top view showing a heat exchanger body according to the second embodiment of the present disclosure. Fig. Figure 11 is a side view of a cooling device according to a first modification example of the second embodiment of the present disclosure. Fig. Figure 12 is an enlarged perspective view of a heat exchanger body according to a second modification example of the second embodiment of the present disclosure. Fig. Figure 13 is a top view of a cooling device according to a third embodiment of the present disclosure. Fig. Figure 14 is a top view of a cooling device according to a modification example of the third embodiment of the present disclosure. Fig. Figure 15 is a top view of a cooling device according to a fourth embodiment of the present disclosure. Fig. Figure 16 is an enlarged top view showing the arrangement of several pin ribs according to the fourth embodiment of the present disclosure. Fig. Figure 17 is an enlarged front view showing the multiple pin ribs according to the fourth embodiment of the present disclosure. Fig. Figure 18 is an enlarged top view showing the arrangement of several pin ribs according to a first modification example of the fourth embodiment of the present disclosure. Fig. Figure 19 is an enlarged side view showing several pin ribs according to a second modification example of the fourth embodiment of the present disclosure. Description of embodiments<Erste Ausführungsform>

[0012] Below, a cooling device 10 according to a first embodiment of the present disclosure is described with reference to Fig. 1 to 3 described.

[0013] As in Fig. As shown in Figure 1, the cooling device 10 of the present embodiment is mounted in a cooling system 1 which cools a server 4. Fig. Figure 1 is a schematic view showing the overall configuration of the cooling system 1. In one example shown, server 4 is housed in a rack 2 that extends vertically in the direction Dv. Several server enclosures 3 are inserted into the rack 2. The server enclosures 3 are box-shaped enclosures. The multiple server enclosures 3 are arranged vertically in the direction Dv. Furthermore, several servers 4 are inserted into the server enclosures 3. The multiple servers 4 are inserted laterally in a horizontal direction.

[0014] Server 4 comprises a server chassis 4a, a server board 4b, and a chip (heating element) 4c, such as a CPU or a GPU. The server chassis 4a is a rectangular parallelepiped enclosure extending horizontally. The server board 4b is housed within the server chassis 4a. The chip 4c is mounted on the server board 4b. Since the chip 4c generates heat during operation, the cooling system 1 is provided to cool the chip 4c. (Configuration of cooling system)

[0015] The cooling system 1 comprises a cooling device 10, a heat exchanger 5, a pump 6, and a control unit 7. The cooling device 10 is mounted for each chip 4c. A refrigerant F is supplied to the cooling device 10. The refrigerant F is, for example, a hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO) refrigerant, or water. The cooling device 10 is a cold plate that cools the chip 4c by causing heat exchange between the refrigerant F and the chip 4c. In this embodiment, the cooling device 10 cools the chip 4c with high heat generation by boiling and cooling the refrigerant F. The cooling device 10 is connected to the heat exchanger 5 and the pump 6 via a refrigerant line 8. The refrigerant F, heated by heat exchange with the chip 4c in the cooling device 10, is conveyed through the refrigerant line 8 to the heat exchanger 5.The heat exchanger 5 is a so-called condenser. The heat exchanger 5 cools the refrigerant F and condenses a gaseous refrigerant F into a liquid refrigerant F. The refrigerant F, cooled by the heat exchanger 5, is conveyed through the refrigerant pipe 8 to the pump 6. The pump 6 pumps the refrigerant F back to the cooling device 10. The refrigerant F pumped to the cooling device 10 again exchanges heat with each chip 4c and cools each chip 4c.

[0016] Various machines that make up the cooling system 1, such as the cooling device 10, the heat exchanger 5 and the pump 6, are controlled by the control unit 7.

[0017] In Fig. Figure 1 shows an example where three chips 4c and three cooling devices 10 are provided for each server 4, but the number of chips 4c and the number of cooling devices 10 can be changed as needed. For example, approximately eight chips 4c and cooling devices 10 could be provided for each server 4. (Configuration of cooling device)

[0018] The following describes a configuration of the cooling device 10.

[0019] As in Fig. 2 and Fig. As shown in Figure 3, the cooling device 10 includes a housing 11, a heat exchanger 20, a supply pipe (supply unit) 30 and a discharge pipe (discharge unit) 40.

[0020] In the following, a predetermined direction of directions intersecting the vertical direction Dv is referred to as a first direction D1, and a direction intersecting both the vertical direction Dv and the first direction D1 is referred to as a second direction D2. In the present embodiment, both the first direction D1 and the second direction D2 are horizontal directions. Furthermore, the first direction D1 and the second direction D2 are perpendicular to each other. (Housing)

[0021] The housing 11 is formed in a hollow shape by a material exhibiting excellent thermal conductivity, such as metal. An outer shape of the housing 11 is formed in the form of a rectangular parallelepiped, as if it were squashed in the horizontal direction. In a top view in the vertical direction Dv, four corner sections 11a of the housing 11 are formed in a curved shape, projecting as if they were chamfered. In the top view in the vertical direction Dv, the housing 11 is formed such that an outer circumferential edge of the housing 11 substantially coincides with an outer circumferential edge of the heating element.

[0022] The housing 11 described above can be designed to have any dimension.

[0023] For example, in the present embodiment, the housing 11 is formed in a square shape in the vertical direction Dv in the top view. The height H1 of the housing 11 in the vertical direction Dv is, for example, approximately 10 mm, and the width W1 of the housing 11 in the first direction D1 and the width L1 of the housing 11 in the second direction D2 are, for example, approximately 55 mm.

[0024] The housing 11 can be formed in a rectangular shape such that it is shorter in the second direction D2 than in the first direction D1. In this case, for example, the width L1 of the housing 11 in the second direction D2 can be approximately 30 mm.

[0025] The housing 11 contains a base plate 12, a top plate 13 and a side plate 14.

[0026] Base plate 12 is placed on chip 4c. Base plate 12 extends in the horizontal direction.

[0027] The top plate 13 is positioned above the bottom plate 12 and faces the bottom plate 12 in the vertical direction Dv. The top plate 13 extends in the horizontal direction.

[0028] The side plate 14 connects the base plate 12 and the top plate 13 on one of its outer circumferences. Four side plates 14 are arranged between the base plate 12 and the top plate 13. These four side plates 14 comprise two first side plates 14a, facing each other in the first direction D1, and two second side plates 14b, facing each other in the second direction D2. The first side plates 14a extend in the second direction D2, and the second side plates 14b extend in the first direction D1. Furthermore, each side plate 14 is arranged so that it is perpendicular to both the top plate 13 and the base plate 12. (Heat exchanger)

[0029] The heat exchanger 20 is provided on the base plate 12 within the housing 11. In particular, the heat exchanger 20 is arranged at a position that, in a top view, overlaps a region (hereinafter referred to as a central section Ac) containing a center of gravity of the housing 11 in the vertical direction Dv. In the present embodiment, the center of gravity of the heat exchanger 20 is arranged at a position that overlaps with the center of gravity of the housing 11 in a top view in the vertical direction Dv. The region of the housing 11 in which the heat exchanger 20 is formed is hereinafter referred to as a heat exchange region A1. The heat exchange region A1 contains the central section Ac of the housing 11 in a top view in the vertical direction Dv.The heat exchanger 20 divides and forms an outer circumferential channel 15 between the heat exchanger 20 and the side plate 14 of the housing 11. Viewed in the vertical direction Dv, the outer circumferential channel 15 is formed in a rectangular frame shape. Furthermore, the refrigerant F can flow through the heat exchanger 20. Details of the configuration of the heat exchanger 20 are described later. (supply pipe)

[0030] The feed tube 30 is connected to a first side plate 14a, located beneath several of the side plates 14 that form the housing 11, from the outside of the housing 11. The feed tube 30 is a circular tube connected to the side plate 14 and has a feed opening 31 that communicates with an interior of the housing 11. The feed opening 31 is open in a horizontal direction that intersects the vertical direction Dv. In the present embodiment, the feed opening 31 is located at the center of the first side plate 14a.

[0031] The supply pipe 30 is connected to the pump 6 via the refrigerant pipe 8 and supplies the refrigerant F from the outside of the housing 11 to the outer circumferential channel 15. (Exhaust pipe)

[0032] The discharge pipe 40 is connected to the cover plate 13, which forms the housing 11, from the outside of the housing 11. In particular, the discharge pipe 40 is connected to a section that overlaps the heat exchanger 20 in the vertical direction Dv at the cover plate 13 in plan view. The discharge pipe 40 is a circular pipe connected to the cover plate 13 and has a discharge opening 41 that communicates with the interior of the housing 11. The discharge opening 41 is open in the vertical direction Dv. A center point of the discharge opening 41 is located at a position that overlaps the central section Ac of the housing 11 in the vertical direction Dv in plan view. In the present embodiment, the center point of the discharge opening 41 is located in the central section Ac at a position that overlaps the center of gravity of the housing 11 in the vertical direction Dv.For this reason, the discharge opening 41 overlaps the heat exchanger body 20 in the vertical direction Dv.

[0033] The discharge pipe 40 is connected to the heat exchanger 5 via the refrigerant pipe 8 and discharges the refrigerant F from the inside of the housing 11 to the outside. (Configuration of heat exchanger body)

[0034] The heat exchanger body 20 of the present embodiment includes a separating section 21 and a plate fin 22. (Separating section)

[0035] The separating section 21 of the present embodiment is formed in a rectangular frame shape such that, in plan view, it surrounds the discharge tube 40 in the vertical direction Dv using a material with excellent thermal conductivity, such as metal. Furthermore, in plan view, four corner sections 21c of the separating section 21 are formed in a curved shape, projecting as if they were chamfered. That is, the corner sections 21c of the separating section 21 are formed in the same shape as the corner sections 11a of the housing 11.

[0036] The partition section 21 comprises a first partition 21a and a second partition 21b. The first partition 21a is formed in a plate shape extending in the second direction D2, and a pair of first partitions 21a are arranged to be separated in the first direction D1. The second partition 21b is also formed in a plate shape extending in the first direction D1, and a pair of second partitions 21b are arranged to be separated in the second direction D2. Each of the pairs of second partitions 21b connects to an end section of the first partition 21a in the second direction D2. The second partitions 21b are provided with inlet connections 23 that penetrate the second partitions 21b in the second direction D2. The inlet connections 23 extend in the first direction D1. Lower edges of the inlet connections 23 are in contact with the base plate 12.Meanwhile, the upper edges of the inlet connections 23 are located below the cover plate 13.

[0037] The separating section 21 blocks the flow of refrigerant F supplied by the supply pipe 30 in the first direction D1 via the first partition 21a on one side of supply pipe 30 and causes the flow of refrigerant F to branch off to both sides in the second direction D2.

[0038] The separating section 21 of the present embodiment connects with the base plate 12 and with the cover plate 13. (Plate rib)

[0039] Several of the plate ribs 22 are arranged side by side within the separating section 21 in the first direction D1. Each plate rib 22 is a rectangular, plate-shaped element extending in the second direction D2. The plate ribs 22 are formed from a material with excellent thermal conductivity, such as metal. In the present embodiment, the plate ribs 22 are made of copper. For this reason, the surface temperature of the plate ribs 22 is uniform. The plate ribs 22 extend upwards from the base plate 12. The upper edges of the plate ribs 22 are separated from the top plate 13, and a predetermined clearance C1 is provided between the plate ribs 22 and the top plate 13. The plate ribs 22 can be formed at a height similar to that of the separating section 21. Furthermore, each plate rib 22 is arranged in a position perpendicular to the base plate 12.

[0040] The multiple plate ribs 22 are arranged such that they face each other in the second direction D2. Sets of pairs of plate ribs 22 facing each other in the second direction D2 are located along the second partitions 21b, and each plate rib 22 extends from the second partitions 21b in the second direction D2. Furthermore, in a side view, a set of the multiple plate ribs 22 is located within the inlet ports 23 of the partition section 21 in the second direction D2.

[0041] The multiple plate fins 22 form narrow gaps S1 between them, such that the gaps S1 act as a flow path resistance for the refrigerant F. The gaps S1 between the plate fins 22 communicate with the inlet ports 23 of the separation section 21.

[0042] For example, the spacing P1 between the plate ribs 22 is 0.5 mm or more and 1.0 mm or less. Furthermore, the thickness T1 of the plate ribs 22 is, for example, approximately 0.5 mm, and the height H2 of the plate ribs 22 is, for example, 5.0 mm. (Processes and effects)

[0043] Next, the processes and effects of the cooling device 10 described above will be described.

[0044] First, the flow of refrigerant F in the cooling device 10 is described.

[0045] The refrigerant F, supplied to the housing 11 via the supply pipe 30, flows into the outer circumferential channel 15. Consequently, the refrigerant F branches out via the outer circumferential channel 15 to both sides in the second direction D2 and flows around the heat exchanger 20. The refrigerant F is then supplied to the heat exchanger 20. In the present embodiment, the refrigerant F is supplied from both sides in the second direction D2. The refrigerant F passes between the plate fins 22 and, viewed from above, flows from the outer circumferential side towards one side of the central section Ac. At this point, all plate fins 22 are immersed in the refrigerant F. The refrigerant F exchanges heat with the chip 4c via the plate fins 22 and the base plate 12. In this way, the chip 4c is cooled. Meanwhile, the refrigerant F is heated by receiving heat from the chip 4c.The refrigerant F boils and evaporates due to the heat from the chip 4c, changing from a liquid-phase refrigerant F to a gas-phase refrigerant. The heated refrigerant F is discharged from the heat exchanger 20 via the discharge pipe 40 directly to the outside of the housing 11.

[0046] In the present embodiment, the cooling device 10 comprises the housing 11, the heat exchanger 20, the inlet pipe 30, and the outlet pipe 40. The housing 11 includes the base plate 12, the top plate 13, and the side plate 14. The housing 11 is formed in a hollow shape. The heat exchanger 20 is located on the base plate 12 within the housing 11. The heat exchanger 20 divides and forms the outer circumferential channel 15 between the heat exchanger 20 and the side plate 14 of the housing 11, allowing the refrigerant F to flow through the heat exchanger 20. The inlet pipe 30 supplies the refrigerant F from the outside to the outer circumferential channel 15. The outlet pipe 40 is connected to the top plate 13 with a section that overlaps the heat exchanger 20 in a top view and discharges the refrigerant F from the interior of the housing 11 to the outside.

[0047] According to the present embodiment, the refrigerant F, supplied from the supply pipe 30 into the housing 11, is fed through the outer circumferential channel 15 to the interior of the heat exchanger 20. Since a pressure drop occurs in the refrigerant F as it flows through the outer circumferential channel 15, an excessive increase in the flow velocity of the refrigerant F is suppressed. For this reason, the refrigerant F is fed uniformly into the housing 11. Therefore, the refrigerant F can be supplied stably to the entire interior of the housing 11. Furthermore, the refrigerant F, which has flowed into the heat exchanger 20, is heated by heat exchange within the heat exchanger 20 and is then discharged directly from the heat exchanger 20 to the discharge pipe 40. Therefore, the refrigerant F is discharged smoothly from the housing 11 after the heat exchange.Accordingly, the refrigerant F is prevented from remaining in the housing 11 after the heat exchange, thus improving cooling efficiency.

[0048] Furthermore, since the pressure loss is high, the refrigerant F can be supplied evenly into the housing 11 without the need for a complicated control system to fine-tune the flow rate of the refrigerant F by installing a valve for each housing 11 (for each heating element), as is the case in the prior art.

[0049] In the present embodiment, the heat exchanger body 20 contains the multiple plate fins 22 which are arranged in the first direction D1, and each plate fin 22 extends in the second direction D2.

[0050] In this way, the refrigerant F, supplied from the supply pipe 30 into the housing 11, is fed through the outer circumferential channel 15 between the multiple plate fins 22. The refrigerant F then flows between the plate fins 22. Since a pressure drop occurs in the refrigerant F as it flows between the plate fins 22, the excessive increase in the flow velocity of the refrigerant F is further suppressed. For this reason, the refrigerant F continues to be fed uniformly into the housing 11. Furthermore, since the surface area (hereinafter referred to as a heat transfer surface) of the heat exchanger 20, which performs the heat exchange, is increased by the plate fins 22, the cooling efficiency can be further improved.

[0051] Furthermore, a flow path resistance can be adjusted, and the pressure loss can be adjusted to a suitable size by a simple procedure of changing the thickness T1 of the plate ribs 22 or the spacing P1 of the multiple plate ribs 22.

[0052] In the present embodiment, the separating section 21 is rectangular in plan view and is formed in the vertical direction Dv such that it surrounds the multiple plate ribs 22. However, the present disclosure is not limited to this. The separating section 21 can be configured solely by the pair of first partition walls 21a extending in the second direction D2. Furthermore, plate ribs 22 having the same length in the second direction D2 as the first partition walls 21a can be provided instead of the first partition walls 21a.

[0053] In the present embodiment, the inlet ports 23, which extend in the first direction D1, are formed in the second partition walls 21b. However, the present disclosure is not limited thereto. Instead of the inlet ports 23, the second partition walls 21b can be provided with slots extending in the vertical direction Dv, tiny through-holes having a circular or polygonal shape, or the like.

[0054] In the present embodiment, the separating section 21 is configured such that it is connected to the base plate 12 and the top plate 13 in the vertical direction Dv. However, the present disclosure is not limited to this. The separating section 21 can be configured such that it extends upwards from the base plate 12 and is separated downwards from the top plate 13. In this case, it is necessary to adjust the flow rate of the refrigerant F supplied by the feed pipe 30 so that all of the refrigerant F evaporates in the housing 11, preventing the refrigerant F from being discharged from the discharge pipe 40 without coming into contact with the heat exchanger 20. In this case, because the separating section 21 is small, the cooling device 10 can be reduced in weight, and manufacturing costs can be reduced. <Erstes Modifikationsbeispiel von erster Ausführungsform>

[0055] Next, a first modification example of the first embodiment will be presented with reference to Fig. 4 described.

[0056] As in Fig. As shown in Figure 4, in the present modification example, the heat exchanger 20 contains several particles 24 formed in a bead shape (spherical shape) between the plate fins 22. The particles 24 are made, for example, of metal, a resin, a polymer, or the like. The diameter of the particles 24 is, for example, approximately several micrometers to 1 mm.

[0057] In this case, it is necessary to prevent the particles 24 from flowing out of the plate fins 22, while allowing the refrigerant F to flow between the plate fins 22. In the present embodiment, for example, several slots 23A, which are narrower than the diameter of the particles 24, are formed on the second partition 21b, which is provided at an outer end section of the plate fins 22 in the second direction D2, instead of the inlet port 23. The slots 23A extend, for example, in the vertical direction Dv. Furthermore, a closing plate (not shown) is provided in which several similar slots 23A are formed at an inner end section of the plate fins 22 in the second direction D2.

[0058] In this modified example, the particles 24 move within the plate fins 22 due to the flow of refrigerant F or buoyancy generated by the boiling of refrigerant F, and the refrigerant F is stirred. This allows the refrigerant F to perform uniform heat exchange.

[0059] Furthermore, fine gaps through which the refrigerant F can flow are formed between the multiple particles 24. The refrigerant F rises as it is dispersed through the gaps between the multiple particles 24. Additionally, the multiple particles 24 move within the heat exchange due to the flow of the refrigerant F, or buoyancy, generated when the refrigerant F boils. Consequently, it is less likely that bubbles generated by the boiling of the refrigerant F will coalesce. Therefore, a transition point from nucleate boiling to film boiling can be shifted to a side with high heat flux (high-temperature side). Thus, with a simple configuration in which only the multiple particles 24 are arranged, it is possible to suppress a transition from nucleate boiling to film boiling.

[0060] Furthermore, the multiple particles 24 can be equipped with a function to absorb impurities such as dirt, moisture, and oil. Accordingly, the cooling device 10 can purify the refrigerant F flowing through the heat exchanger 20. Therefore, since the heat exchange between the refrigerant F and the chip 4c is promoted, the cooling efficiency can be further improved.

[0061] Examples of a method for imparting the function of absorbing impurities to the multiple particles 24 include a method of forming the particles 24 using a specific adsorbent and a method of increasing the density of the particles 24 so that the impurities are trapped in the gaps between the particles 24.

[0062] In the present modification, instead of the several particles 24, a porous section through which the refrigerant F can flow can be arranged in gaps between the plate ribs 22. <Zweites Modifikationsbeispiel von erster Ausführungsform>

[0063] Next, a second modification example of the first embodiment will be described with reference to Fig. 5 described.

[0064] As in Fig. As shown in Figure 5, each plate fin 22 extends over an entire surface of the heat exchanger body 20 in the second direction D2. For this reason, the plate fins 22 are provided in the central section Ac of the housing 11 and overlap the discharge opening 41 in the vertical direction Dv. Furthermore, in the present modification example, the separating section 21 need not be provided.

[0065] In this way, in the present modification example, since the length of each plate rib 22 is increased, the heat transfer area can be increased and the cooling efficiency can be improved. <Drittes Modifikationsbeispiel von erster Ausführungsform>

[0066] Next, a third modification example of the first embodiment will be described with reference to Fig. 6 described.

[0067] As in Fig. As shown in Figure 6, the plate ribs 22 can be formed in a wavy shape to extend in a zigzag shape in the second direction D2 in a top view.

[0068] In this way, the heat transfer surface can be further increased, and the cooling efficiency can be further improved. <Viertes Modifikationsbeispiel von erster Ausführungsform>

[0069] Next, a fourth modification example of the first embodiment will be described with reference to Fig. 7 and Fig. 8 described.

[0070] As in Fig. As shown in Figure 7, the heat exchanger body 20 further comprises a pin fin 50, which is positioned at a location that overlaps the discharge opening 41 of the discharge tube 40 in the vertical direction Dv in the plan view and extends in the vertical direction Dv. Several of the pin fins 50 are formed on the base plate 12. A region in which the pin fins 50 are formed (hereinafter referred to as a pin fin region A2) extends in the first direction D1. The pin fin region A2 is provided between sets of the multiple plate fins 22, which are separated in the second direction D2. That is, the multiple pin fins 50 are inserted in the second direction D2 by the sets of the multiple plate fins 22, which are separated in the second direction D2.

[0071] Each pin rib 50 is formed in a circular shape in the vertical direction Dv when viewed from above. Furthermore, as shown in Fig. Figure 8 shows the pin ribs 50 in a shape that tapers upwards from a base connected to the base plate 12. That is, the pin ribs 50 are formed in a shape where the diameter in the horizontal direction gradually decreases in the vertical direction Dv from the base on one side of the base plate 12. Furthermore, more precisely, the pin ribs 50 are conical elements and, in a side view, are formed in a teardrop shape in the horizontal direction. The pin ribs 50 are made of a material with excellent thermal conductivity, such as metal.

[0072] In this modified example, the heat exchanger body 20 further includes the pin fins 50, which are provided at the position that overlaps the discharge opening 41 of the discharge tube 40 in the vertical direction Dv in the top view and which extend in the vertical direction Dv. The pin fins 50 are inserted by the several plate fins 22 in the second direction D2 and are formed in a shape that tapers upwards.

[0073] In this way, the refrigerant F passes between the plate fins 22 and then exchanges heat further with the pin fins 50. Furthermore, the pin fins 50 are shaped in a way that tapers upwards. This increases the heat transfer surface area. Additionally, in the area where the pin fins 50 are formed, flow path resistance is reduced towards the top. Therefore, the refrigerant F can be released smoothly to the outside. In particular, when the refrigerant F boils and evaporates in the housing 11, the gaseous refrigerant F can be released more easily to the outside.

[0074] In this way, the refrigerant F can be discharged smoothly from the discharge pipe 40, which is located in an upper section, while heat transfer performance is improved, and thus cooling performance can be further improved. <Zweite Ausführungsform>

[0075] Below, a cooling device 210 according to a second embodiment of the present disclosure is described with reference to Fig. 9 and Fig. 10. With regard to a configuration of the second embodiment that is common to a configuration of the first embodiment, description may be omitted by giving the same name, the same reference numeral or the like.

[0076] As in Fig. 9 and Fig. As shown in Figure 10, in the present embodiment a heat exchanger body 220 includes the separating section 21, a grid fin 60 and a pin fin 250. (Separating section)

[0077] Several through-holes 26 are formed in the separating section 21 around its entire circumference. The through-holes 26 are, for example, arranged in a circular shape. The shape of the through-holes 26 can be suitably modified. The refrigerant F, supplied from the supply pipe 30 into the housing 11, passes through the several through-holes 26 and flows from the entire circumference into the heat exchanger 220. (lattice rib)

[0078] The lattice rib 60 extends in the horizontal direction to intersect the vertical direction Dv. Furthermore, each lattice 63 of the lattice ribs 60 is formed in a square shape by combining a first pole 61 extending in the first direction D1 and a second pole 62 extending in the second direction D2. Here, the shortest width between the inner edges of the lattice 63 is referred to as a "lattice diameter R1". In the present embodiment, since the lattice 63 is formed in a square shape, the length of one side of the lattice 63 is the lattice diameter R1.

[0079] The first pole 61 and the second pole 62 are both formed in a column shape. The shapes of the first pole 61 and the second pole 62 can be suitably modified. For example, the first pole 61 and the second pole 62 can both be formed in a square prism shape.

[0080] Several of the grid ribs 60 are arranged side by side at equal intervals in the vertical direction Dv. Hereinafter, one of these intervals between the several grid ribs 60 is referred to as a first spacing P2. Furthermore, the adjacent grid ribs 60 are arranged such that they are displaced in a direction (horizontal direction in the present embodiment) that intersects the vertical direction Dv.

[0081] The multiple lattice ribs 60 include a first lattice rib 60a and a second lattice rib 60b. The first lattice rib 60a and the second lattice rib 60b are arranged alternately in the vertical direction Dv. Therefore, in the top view, a lattice point 64 of the second lattice rib 60b is located at a center point of the lattice 63 of the first lattice rib 60a in the vertical direction Dv. The first lattice ribs 60a and the second lattice ribs 60b are arranged at the same horizontal position.

[0082] In one example shown, two steps of the first lattice ribs 60a and one step of the second lattice rib 60b are provided, but the present disclosure is not limited thereto. The number of steps of the first lattice rib 60a and the number of steps of the second lattice rib 60b can be suitably modified.

[0083] Furthermore, the predetermined clearance C1 is provided between a top lattice rib 60 under the multiple lattice ribs 60 and the top plate 13. (pencil case)

[0084] The pin ribs 250 are columns extending in the vertical direction Dv and supporting the lattice ribs 60. The pin ribs 250 are arranged in a lattice pattern, aligned in the first direction D1 and the second direction D2 in the top view along the vertical direction Dv. Here, a row of pin ribs 250 extending in the first direction D1 is referred to as a first pin row 251, and a row of pin ribs 250 extending in the second direction D2 is referred to as a second pin row 252. The first pin rows 251, which are adjacent to each other, are arranged alternately. For this reason, several of the pin ribs 250 that form a set of the first pin rows 251, which are adjacent to each other, are arranged in a zigzag pattern extending in the first direction D1. Similarly, the second pin rows 252, which are adjacent to each other, are arranged alternately.For this reason, several of the pin ribs 250, which form a set of the second rows of pins 252 that are adjacent to each other, are arranged in a zigzag shape extending in the second direction D2.

[0085] Furthermore, the distance between the pin ribs 250 forming the second row of pins 252 is smaller than the distance between the pin ribs 250 forming the first row of pins 251. Hereinafter, the distance between the pin ribs 250 forming the second row of pins 252 is referred to as a second distance P3.

[0086] The distance between the pin ribs 250 that form the first pin row 251 can be smaller than the distance between the pin ribs 250 that form the second pin row 252. In this case, the distance between the pin ribs 250 that form the first pin row 251 is the second distance P3.

[0087] Each pin rib 250 is perpendicular to the lattice rib 60. In the present embodiment, the pin ribs 250 are formed in a column shape. The shape of the pin ribs 250 can be suitably modified. For example, the pin ribs 250 can be formed in a square prism shape.

[0088] The dimensions of the grid ribs 60 and pin ribs 250 described above are described below.

[0089] It is preferred that the grid diameter R1, the first spacing P2 of the grid ribs 60, and the second spacing P3 of the pin ribs 250 are all several tens of micrometers or more. For example, the grid diameter R1 is designed to be 300 micrometers, the first spacing P2 is designed to be 150 micrometers, and the second spacing P3 is designed to be 0.45 mm or more and 0.6 mm or less. Furthermore, the height H3 of the pin ribs 250 in the vertical direction Dv is, for example, designed to be 3 mm.

[0090] The dimensions of the grid ribs 60 and the pin ribs 250 can be modified as needed. (Processes and effects)

[0091] Next, the processes and effects of the cooling device 210 described above will be described.

[0092] In the present embodiment, the heat exchanger body 220 has several grid fins 60 extending in the horizontal direction and arranged in the vertical direction Dv. The adjacent grid fins 60 are arranged such that they are displaced in the horizontal direction.

[0093] In this way, bubbles generated when the refrigerant F boils due to heat exchange are separated by the grid fins 60 in a process of rising. Therefore, the bubbles can be prevented from combining, and the generation of critical heat flow can be delayed.

[0094] Furthermore, since the heat transfer surface area can be increased by the grid fins 60, the cooling efficiency can be improved.

[0095] In the present embodiment, the pin ribs 250, which support the several grid ribs 60 and extend in the vertical direction Dv, are also provided.

[0096] Accordingly, the refrigerant F can exchange heat with the grid fins 60 and the pin fins 250, thus increasing the heat transfer surface area. Therefore, it is possible to further improve cooling efficiency.

[0097] In the present embodiment, the clearance C1 is provided between the uppermost lattice rib 60 under the several lattice ribs 60 and the cover plate 13.

[0098] As a result, an area on the top side of the heat exchanger 220 is enlarged, and the upward opening ratio of the heat exchanger 220 increases. For this reason, the bubbles generated when the refrigerant F boils are likely to detach from the heat exchanger 220. Therefore, the gaseous refrigerant F can be discharged smoothly from the discharge tube 40 in the housing 11.

[0099] Furthermore, when the refrigerant F is heated by the heat exchanger 220, some of the refrigerant F evaporates, and the interior of the housing 11 is in a gas-liquid two-phase state. Because of this, the liquid-phase refrigerant F is prevented from moving across the grid fins 60 due to a gas-liquid interface. Therefore, the liquid-phase refrigerant F typically comes into contact with the grid fins 60 to perform heat exchange and is then discharged to the outside of the housing 11.

[0100] In the present embodiment, the refrigerant F, which has flowed from the supply pipe 30 into the housing 11, flows from one point into the heat exchanger 220. However, the present disclosure is not limited to this. For example, the refrigerant F can branch off from several points and flow into the heat exchanger 220 by, for example, providing a sub-collector (not shown) within the housing 11, which communicates with the supply opening 31 of the supply pipe 30.

[0101] In the present embodiment, the arrangement of the grid ribs 60 and the first row of pins 251 and the second row of pins 252 can be suitably modified. For example, the grid ribs 60 and the first row of pins 251 and the second row of pins 252 can be inclined in the top view in the vertical direction Dv with respect to the first direction D1 and the second direction D2.

[0102] In the present embodiment, a case was described in which the grid ribs 60 are supported by the pin ribs 250. However, the present disclosure is not limited to this. The grid ribs 60 can also be supported by the separating section 21 provided on the outer circumferential side. In this case, the pin ribs 250 need not be provided.

[0103] In the present embodiment, the separating section 21 need not necessarily be provided to connect the base plate 12 and the top plate 13. For example, the separating section 21 may extend from the base plate 12, and an upper end of the separating section 21 may be separated from the top plate 13 downwards. Furthermore, the section 21 that surrounds the grid ribs 60 on the outer circumferential side need not be provided.

[0104] In the present embodiment, the grid 63 of the grid rib 60 is formed in a square shape. However, the present disclosure is not limited to this. The grid 63 of the grid rib 60 can, for example, be formed in a rectangular shape, a polygonal shape, or a circular shape. <Erstes Modifikationsbeispiel von zweiter Ausführungsform>

[0105] Next, a first modification example of the second embodiment will be presented with reference to Fig. 11 described.

[0106] As in Fig. As shown in Figure 11, in the present modification example, the grid fins 60 are designed over an entire area in the housing 11 in the horizontal direction. Therefore, in this modification example, the heat transfer area can be further increased. Consequently, it is possible to further improve the cooling efficiency.

[0107] In the present modification example, the grid ribs 60 can be supported by the side plate 14 of the housing 11. In this case, the pin ribs 250, which support the grid ribs 60, do not need to be provided. <Zweites Modifikationsbeispiel von zweiter Ausführungsform>

[0108] Next, a second modification example of the second embodiment will be presented with reference to Fig. 12 described.

[0109] As in Fig. As shown in Figure 12, in the present modification example, a pin rib 250A, which supports the lattice ribs 60, is formed in the same shape as the pin ribs 50 of the fourth modification example of the first embodiment. That is, the pin rib 250A is formed in a shape that tapers upwards.

[0110] In this way, the heat transfer surface can be further increased. Furthermore, in the area where the pin fin 250A is formed, flow path resistance towards the top is reduced. For this reason, the refrigerant F can be released smoothly to the outside. In particular, when the refrigerant F boils and evaporates in the housing 11, the gaseous refrigerant F can be released more easily to the outside.

[0111] Therefore, the refrigerant F can be discharged smoothly from the discharge pipe 40, which is located in an upper section, while heat transfer performance is further improved, and thus cooling performance can be further improved. <Dritte Ausführungsform>

[0112] Below, a cooling device 310 according to a third embodiment of the present disclosure is described with reference to Fig. 13 described. With regard to a configuration of the third embodiment that is common to configurations of the embodiments described above, description may be omitted by giving the same name, the same reference numeral or the like.

[0113] As in Fig. As shown in Figure 13, the cooling device 310 in the present embodiment further includes a porous section 27 through which the refrigerant F can flow.

[0114] A heat exchanger body 320 contains the porous section 27 instead of the multiple plate fins 22 in the first embodiment.

[0115] A pair of porous sections 27 is arranged such that it is separated in the second direction D2. Each porous section 27 extends in the first direction D1. A large number of holes (not shown), through which the refrigerant F can flow, are formed in the porous section 27. The porous section 27 acts as a flow path resistance and causes a pressure drop. (Processes and effects)

[0116] Next, the processes and effects of the cooling device 310 described above will be described.

[0117] In the present embodiment, the heat exchanger body 320 includes the porous section 27 through which the refrigerant F can pass.

[0118] In this way, a simple configuration, in which only the porous section 27 is provided, causes a pressure drop, and the refrigerant F can be supplied evenly into the housing 11. Therefore, the refrigerant F can be supplied stably to the entire interior of the housing 11, and the cooling efficiency can be improved. The bubbles that are generated when the refrigerant F boils due to heat exchange pass through the porous section 27 and are separated. This prevents the bubbles from coalescing and delays the generation of the critical heat flux. Furthermore, the porous section 27 can trap and absorb dirt, moisture, and oil contained in the refrigerant F through its internal holes. <Modifikationsbeispiel der dritten Ausführungsform>

[0119] Next, a modification example of the third embodiment will be given with reference to Fig. 14 described.

[0120] As in Fig. As shown in Figure 14, in the present modification example, the heat exchanger body 320 further comprises a pin fin 350 extending in the vertical direction Dv at a position (pin fin area A2) that overlaps a discharge opening of a discharge tube in the vertical direction Dv in the plan view. Several pin fins 350 are provided in the pin fin area A2. The multiple pin fins 350 are inserted in the second direction D2 by the pair of porous sections 27 separated in the second direction D2.

[0121] Furthermore, the pin ribs 350 are formed in the same shape as the pin ribs 50 of the fourth modification example of the first embodiment. That is, the pin ribs 350 are formed in a shape that tapers upwards.

[0122] In this way, the refrigerant F passes through the porous sections 27 and then continues to exchange heat with the pin fins 350. Furthermore, the pin fins 350 are shaped in a way that tapers upwards. This increases the heat transfer surface area. Additionally, in the area where the pin fins 350 are formed, flow path resistance is reduced towards the top. This allows the refrigerant F to be released smoothly to the outside. Therefore, it is possible to further improve cooling efficiency. <Vierte Ausführungsform>

[0123] Below, a cooling device 410 according to a fourth embodiment of the present disclosure is described with reference to Fig. Described in sections 15 to 17. With regard to a configuration of the fourth embodiment that is common to the configurations of the embodiments described above, description may be omitted by using the same name, reference numeral, or the like.

[0124] As in Fig. As shown in Figure 15, in the present embodiment a heat exchanger body 420 includes several pin fins 450 which are provided along the outer circumferential channel 15. Fig. Figure 15 shows a schematic arrangement of the pin ribs 450. Each pin rib 450 extends in the vertical direction Dv.

[0125] In the present embodiment, the pin-rib region A2, in which the multiple pin ribs 450 are formed, is provided in an annular shape to surround a central section of the housing 11 from the outer circumferential side in the top view in the vertical direction Dv. Furthermore, in the present embodiment, the outer circumferential channel 15 in the housing 11 is formed by the multiple pin ribs 450, and the separating section 21 as in the first embodiment is not provided. The separating section 21 may be provided, and in this case, the separating section 21 must be provided with through holes like the through holes 26 of the second embodiment around its entire circumference.

[0126] Here, using an area (hereinafter referred to as a representative area A3) that is located on one side in the second direction D2 with respect to the central section Ac in the pin rib area A2, an arrangement and a shape of the pin ribs 450 are shown as an example with reference to Fig. 16 and Fig. 17 described in detail.

[0127] As in Fig. 16 and Fig. As shown in Figure 17, the pin ribs 450 are formed in a columnar shape extending in the vertical direction Dv. The pin ribs 450 are arranged side by side at equal intervals in one direction in a horizontal plane, forming a row of pins 451 that extends linearly in the vertical direction Dv in plan view. Furthermore, several rows of pins 451 are arranged at equal intervals in a direction that intersects (perpendicular to) one of the extension directions of the pin rows 451 in the horizontal direction. In the representative area A3, the pin rows 451 are formed linearly in the second direction, and the pin rows 451 are arranged at equal intervals in the first direction D1. In addition, the pin ribs 450 are arranged in a zigzag pattern such that they alternate between two adjacent pin rows 451.

[0128] The dimensions of the pin ribs 450 and a distance P4 between the pin ribs 450 can be suitably changed.

[0129] For example, in a case where the diameter of the pin ribs 450 is 300 µm and the height H4 of the pin ribs 450 is 3 mm, the distance P4 between the pin ribs 450 forming the pin row 451 is set to be 0.45 mm or more and 0.60 mm or less.

[0130] For example, in a case where the diameter of the pin ribs 450 is 500 µm and the height H4 of the pin ribs 450 is 5 mm, the distance P4 between the pin ribs 450 forming the pin row 451 is set to be 1 mm or more and 0.75 mm or less.

[0131] For example, in a case where the diameter of the pin ribs 450 is 1000 µm and the height H4 of the pin ribs 450 is 10 mm, the distance P4 between the pin ribs 450 forming the pin row 451 is set to be 1.5 mm or more and 2 mm or less. (Processes and effects)

[0132] Next, the processes and effects of the cooling device 410 described above will be described.

[0133] In the present embodiment, a heat exchanger body 420 contains the several pin fins 450 which extend in the vertical direction Dv and which are provided along the outer circumferential channel 15.

[0134] In this way, the refrigerant F is fed through a space between the fins 450 into the interior of the heat exchanger 420. Since a pressure drop occurs in the refrigerant F as it passes between the fins 450, the excessive increase in the flow velocity of the refrigerant F is further suppressed. For this reason, the refrigerant F continues to be fed uniformly into the heat exchanger 420. Therefore, with a relatively simple configuration in which the fins 450 are provided, the refrigerant F can be fed uniformly into the housing 11.

[0135] Furthermore, the multiple pin ribs 450 can be manufactured, for example, by additive manufacturing (AM) modeling to improve manufacturing efficiency. (First modification example of fourth embodiment)

[0136] Next, a first modification example of the fourth embodiment will be presented with reference to Fig. 18 described.

[0137] As in Fig. As shown in Figure 18, in the present modification example the distance P4 between the several pin ribs 450 is provided such that it is larger towards one side of the delivery tube 41 of the delivery tube 40 in the horizontal direction.

[0138] For example, in a case where the diameter of the pin ribs 450 is 300 µm and the height H4 of the pin ribs 450 is 3 mm, the distance P4 between the pin ribs 450 forming the pin row 451 is 0.6 mm on the most upstream side and 1.8 mm on the most downstream side.

[0139] In a case where the refrigerant F boils in the housing 11 and exists in a gas-liquid two-phase state, the ratio of the gas-phase refrigerant F to a downstream side increases in the direction of refrigerant flow. According to the present modification example, the distance P4 between the multiple pin fins 450 increases towards the downstream side, and thus the gas-phase refrigerant F is more likely to flow towards the downstream side. Therefore, it is possible to suppress a rapid pressure rise of the gas-phase refrigerant F on the downstream side. Consequently, the gas-phase refrigerant F can be discharged smoothly.

[0140] Furthermore, an area in the vicinity of the discharge opening 41 (for example, approximately 0.5 to 5 times the diameter of the discharge opening 41 from the center of the discharge opening 41 in the top view in the vertical direction Dv) does not need to be provided with the pin ribs 450. (Second modification example of fourth embodiment)

[0141] Next, a second modification example of the fourth embodiment will be presented with reference to Fig. 19 described.

[0142] As in Fig. As shown in Figure 19, in the present modification example, in addition to a change in the distance between the pin ribs 450 as in the first modification example, pin ribs 450 which have a lower height H4 are arranged towards the downstream side in the flow direction of the refrigerant F.

[0143] For example, the height H4 of the pin rib 450 on the most upstream side is 3 mm, but from there pin ribs 450 are arranged with gradually lower heights, and the height H4 of the pin ribs 450 on the most downstream side is 1 mm.

[0144] According to the present modification example, the pin fins 450, which have the lower height H4, are arranged towards the downstream side, and thus it is more likely that the gaseous refrigerant F will flow towards the downstream side. Therefore, it is possible to suppress a rapid pressure rise of the gaseous refrigerant F on the downstream side. (Other embodiments)

[0145] The embodiments of the present disclosure have been described in detail herein with reference to the drawings. However, the specific configuration is not limited to these embodiments and includes design modifications and the like that do not deviate from the core of the present disclosure. It is also possible to suitably combine any of the embodiments and modification examples described above.

[0146] In the embodiments described above, one case was described in which the cooling devices 10, 210, 310, and 410 are the cold plates that cool the chip 4c, such as the CPU and GPU mounted in the server 4. However, the present disclosure is not limited to this. The cooling devices 10, 210, 310, and 410 can be used to cool a heating element other than the chip 4c.

[0147] In the embodiments described above, a case was described in which the cooling devices 10, 210, 310 and 410 boil and evaporate the refrigerant F in the housing 11. However, the present disclosure is not limited to this. The refrigerant F need not necessarily boil or evaporate in a process of heat exchange with the chip 4c and can circulate in a liquid phase within the cooling system 1.

[0148] In the embodiments described above, one case was described in which the housing 11 is formed in the shape of a rectangular parallelepiped. However, the present disclosure is not limited to this. The housing 11 can, for example, be formed in a polygonal shape other than that of a rectangular parallelepiped and can, for example, be formed in a disk shape. Similarly, the shape of the heat exchangers 20, 220, 320, and 420 is not limited to a rectangular parallelepiped shape, and the shape of the outer circumferential channel 15 is not limited to a rectangular frame shape. That is to say, the heat exchangers 20, 220, 320, and 420 can, for example, be formed in a polygonal shape other than that of a rectangular parallelepiped and can, for example, be formed in a disk shape.Furthermore, the outer circumferential channel 15 can be formed in a polygonal frame shape other than a rectangular shape and can, for example, be formed in a ring shape.

[0149] In the embodiments described above, a supply unit is the supply pipe 30, which has the supply opening 31, and a discharge unit is the discharge pipe 40, which has the discharge opening 41. However, the present disclosure is not limited thereto. The supply unit can be configured with only the supply opening 31, and the discharge unit can be configured with only the discharge opening 41. In this case, the refrigerant pipe 8 is directly connected to the supply opening 31 and to the discharge opening 41. Although the supply opening 31 is connected to the side plate 14, the present disclosure is not further limited thereto. For example, the supply opening 31 can be connected to a position of the cover plate 13 that overlaps the outer circumferential channel 15 in the vertical direction Dv.Although the discharge opening 41 is connected to the cover plate 13 on the central section Ac of the housing 11, the present disclosure is not limited thereto. The discharge opening 41 can be arranged in plan view in the vertical direction Dv with respect to the central section Ac of the housing 11 on the outer circumferential side, provided that one of its positions overlaps the heat exchangers 20, 220, 320 and 420 in the vertical direction Dv. <Zusätzliche Hinweise>

[0150] The cooling devices 10, 210, 310 and 410, which are described in each embodiment, are understood, for example, as follows. (1) A cooling device 10, 210, 310, 410 according to a first aspect comprises a housing 11 having a base plate 12 placed on a heating element, a top plate 13 facing the base plate 12, and a side plate 14 connecting the base plate 12 and the top plate 13 on an outer circumferential side, and being formed in a hollow shape; a heat exchanger 20, 220, 320, 420 provided on the base plate 12 in the housing 11, which divides and forms an outer circumferential channel 15 between the heat exchanger 20, 220, 320, 420 and the side plate 14 of the housing 11 and which allows a refrigerant F to flow through the heat exchanger 20, 220, 320, 420; and a supply unit that supplies the refrigerant F from the outside. feeds to the outer circumferential channel 15, and a delivery unit which is connected to an area located in the cover plate 13 and which overlaps the heat exchanger body 20, 220, 320, 420 in a top view,is connected and releases the refrigerant F from the inside of the housing 11 to the outside.

[0151] Examples of the supply unit include the supply pipe 30 of the embodiments described above, and examples of the delivery unit include the delivery pipe 40 of the embodiments described above.

[0152] According to the present aspect, the refrigerant F supplied by the supply unit into the housing 11 is fed through the outer circumferential channel 15 to the interior of the heat exchangers 20, 220, 320, and 420. Since a pressure drop occurs in the refrigerant F as it flows through the outer circumferential channel 15, an excessive increase in the flow velocity of the refrigerant F is suppressed. For this reason, the refrigerant F is fed uniformly into the housing 11. Therefore, the refrigerant F can be supplied stably to the entire interior of the housing 11. Furthermore, the refrigerant F, which has flowed into the heat exchangers 20, 220, 320 and 420, is heated by heat exchange within these heat exchangers and is then discharged directly from them to the delivery unit. Therefore, after heat exchange, the refrigerant F is discharged smoothly from the housing 11.Accordingly, the refrigerant F is prevented from remaining in the housing 11 after the heat exchange, thus improving cooling efficiency.

[0153] (2) A cooling device 10 of a second aspect is the cooling device 10 of (1), wherein the heat exchanger body 20 may contain several plate fins 22 arranged in a first direction D1 intersecting a vertical direction Dv, and each of the plate fins 22 may extend in a second direction D2 intersecting the vertical direction Dv and the first direction D1.

[0154] In this way, the refrigerant F supplied by the supply unit into the housing 11 is fed through the outer circumferential channel 15 between the multiple plate fins 22. The refrigerant F then flows between the plate fins 22. Since a pressure drop occurs in the refrigerant F during this process, the excessive increase in the flow velocity of the refrigerant F is further suppressed. For this reason, the refrigerant F continues to be fed uniformly into the housing 11. Furthermore, the plate fins 22 increase the surface area (heat transfer surface) of the heat exchanger 20, which performs the heat exchange.

[0155] (3) A cooling device 10 of a third aspect is the cooling device 10 of (2), wherein the heat exchanger body 20 may further include pin fins 50 which are provided at positions which overlap the discharge unit in plan view and which extend in the vertical direction Dv, and the pin fins 50 may be inserted by the multiple plate fins 22 in the second direction D2 and be formed in a shape which tapers upwards.

[0156] In this way, the refrigerant F passes between the plate fins 22 and then exchanges heat further with the pin fins 50. Furthermore, the pin fins 50 are shaped in a way that tapers upwards. This increases the heat transfer surface area. Additionally, in the area where the pin fins 50 are formed, flow resistance towards the top is reduced. Therefore, the refrigerant F can be released smoothly to the outside.

[0157] (4) A cooling device 210 of a fourth aspect is the cooling device 210 of (1), wherein the heat exchanger body 220 may include several grid fins 60 extending in such a way as to intersect a vertical direction Dv and arranged in the vertical direction Dv, and the grid fins 60 that are adjacent to each other may be arranged in such a way as to be displaced in a direction that intersects the vertical direction Dv.

[0158] In this way, bubbles, which are generated when the refrigerant F boils due to heat exchange, are divided by the grid fins 60 in a process of rising. Therefore, the coalescence of bubbles can be prevented.

[0159] (5) A cooling device 210 of a fifth aspect comprises a housing 11 having a base plate 12 placed on a heating element, a top plate 13 facing the base plate 12, and a side plate 14 connecting the base plate 12 and the top plate 13 on an outer circumferential side, and being formed in a hollow shape; a heat exchanger 220 provided on the base plate 12 in the housing 11, which allows a refrigerant F to flow through the heat exchanger 220; a supply unit that supplies the refrigerant F from the outside to an interior of the housing 11; and a discharge unit that is connected to an area located in the top plate 13 and overlapping the heat exchanger 220 in a plan view, and that discharges the refrigerant F from the interior of the housing 11 to the outside, the heat exchanger 220 having several grid fins 60 arranged in such a way as to extendthat they intersect a vertical direction Dv, and which are arranged in the vertical direction Dv, and the grid ribs 60, which are adjacent to each other, are arranged such that they are displaced in a direction that intersects the vertical direction Dv.

[0160] (6) A cooling device 210 of a sixth aspect is the cooling device 210 of (4) or (5), wherein the heat exchanger body 220 may further include pin fins 250, 250A which support the multiple grid fins 60 and which extend in the vertical direction Dv.

[0161] Accordingly, the refrigerant F can exchange heat with the grid fins 60 and with the pin fins 250 and 250A, thus increasing the heat transfer area.

[0162] (7) A cooling device 210 of a seventh aspect is the cooling device 210 of (6), wherein the pin fins 250A may be formed in a shape that tapers upwards.

[0163] In this way, the heat transfer surface can be further increased. Furthermore, in the area where the pin fin 250A is formed, flow path resistance towards the top is reduced. For this reason, the refrigerant F can be released smoothly to the outside.

[0164] (8) A cooling device 310 of an eighth aspect is the cooling device 310 of (1), wherein the heat exchanger body 320 may contain porous sections 27 through which the refrigerant F may pass.

[0165] In this way, a simple configuration, in which only the porous section 27 is provided, causes a pressure drop while heat transfer takes place between the porous section 27 and the refrigerant F, and the refrigerant F can be fed uniformly into the housing 11. The bubbles that are generated when the refrigerant F boils due to heat exchange pass through the porous section 27 and are separated. Accordingly, the coalescence of bubbles can be suppressed. Furthermore, the porous section 27 can absorb the dirt, moisture, and oil contained in the refrigerant F.

[0166] (9) A cooling device 310 of a ninth aspect is the cooling device 310 of (8), wherein the heat exchanger body 320 may further include pin fins 350 which are provided at positions which overlap the discharge unit in plan view and which extend in a vertical direction Dv, and the pin fins 350 may be inserted through the porous sections 27 in a direction which intersects the vertical direction Dv and be formed in a shape which tapers upwards.

[0167] In this way, the refrigerant F passes through the porous sections 27 and then continues to exchange heat with the pin fins 350. Furthermore, the pin fins 350 are shaped in a way that tapers upwards. This increases the heat transfer surface area. Additionally, in the area where the pin fins 350 are formed, flow path resistance is reduced towards the top. Therefore, the refrigerant F can be released smoothly to the outside.

[0168] (10) A cooling device 410 of a tenth aspect is the cooling device 410 of (1), wherein the heat exchanger body 420 may include several pin fins 450 extending in a vertical direction Dv and provided along the outer circumferential channel 15.

[0169] In this way, the refrigerant F is fed through a space between the fins 450 into the interior of the heat exchanger 420. Since a pressure drop occurs in the refrigerant F as it passes between the fins 450, the excessive increase in the flow velocity of the refrigerant F is further suppressed. For this reason, the refrigerant F continues to be fed uniformly into the heat exchanger 420.

[0170] (11) A cooling device 410 of an eleventh aspect is the cooling device 410 of (10), wherein a distance P4 between the pin ribs 450 towards a delivery unit side can increase in a direction that intersects the vertical direction Dv.

[0171] In a case where the refrigerant F boils in the housing 11 and exists in a gas-liquid two-phase state, the ratio of the gas-phase refrigerant F to the downstream side increases in the direction of refrigerant flow. According to the present aspect, the distance P4 between the multiple pin fins 450 increases towards the downstream side, and thus it is more likely that the gas-phase refrigerant F will flow towards the downstream side. Therefore, it is possible to suppress a rapid pressure rise of the gas-phase refrigerant F on the downstream side.

[0172] (12) A cooling device 410 of a twelfth aspect is the cooling device 410 of (10) or (11), wherein the pin ribs 450, which have a lesser height H4, may be arranged towards a dispensing unit side in a direction which intersects the vertical direction Dv.

[0173] According to the present aspect, the pin fins 450, which have the lower height H4, are arranged towards the downstream side, and thus it is more likely that the gaseous refrigerant F will flow towards the downstream side. Therefore, it is possible to suppress the rapid pressure rise of the gaseous refrigerant F on the downstream side, and the gaseous refrigerant F can be discharged smoothly. Industrial applicability

[0174] According to a cooling device of the present disclosure, cooling efficiency can be improved. Reference symbol list 1 Cooling system 2 Rack 3 server cases 4 servers 4a Server case 4b Server board 4c chip (heating element) 5 heat exchangers 6 pump 7 Control unit 8 Refrigerant pipe 10 Cooling device 11 cases 11a Corner section 12 Base plate 13 Cover plate 14 Side panel 14a first side panel 14b second side panel 15 Outer circumferential channel 20 heat exchangers 21 Separation section 21a first partition wall 21b second partition wall 21c Corner section 22 plate rib 23 Inlet connection 23A slot 24 particles 26 through hole 27 porous section 30 Supply pipe (supply unit) 31 Inlet 40 Dispensing tube (dispensing unit) 41. Drop-off opening 50 pin ribs 60 lattice rib 60a first lattice rib 60b second lattice rib 61 first pole 62 second pole 63 grids 64 grid points 210 Cooling device 220 heat exchangers 250 pin ribs 250A pin rib 251 first row of pens 252 second row of pens 310 Cooling device 320 heat exchangers 350 pin rib 410 Cooling device 420 heat exchangers 450 pin rib 451 pen row A1 Heat exchange area A2 pin rib area A3 Representative Area Ac Middle Section C1 game DV vertical direction D1 first direction D2 second direction Refrigerant H1 height H2 height H3 height H4 height L1 width P1 Distance P2 first distance P3 second distance P4 distance R1 grid diameter S1 gap T1 thickness W1 width QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2023-018423

[0002] JP 4410065

[0005]

Claims

[1] Cooling device comprising: a housing comprising a base plate placed on a heating element, a top plate facing the base plate, and a side plate connecting the base plate and the top plate on an outer circumferential side, and formed in a hollow shape; a heat exchanger provided on the base plate in the housing, which divides and forms an outer circumferential channel between the heat exchanger and the side plate of the housing and which allows a refrigerant to flow through the heat exchanger; a supply unit that feeds the refrigerant from outside to the outer circumferential channel; and a delivery unit connected to an area located in the cover plate that overlaps the heat exchanger body in a top view, and which delivers the refrigerant from an interior of the housing to the outside. [2] Cooling device according to claim 1, wherein the heat exchanger body contains several plate fins arranged in a first direction which intersects a vertical direction, and Each of the plate ribs extends in a second direction that intersects the vertical direction and the first direction. [3] Cooling device according to claim 2, wherein the heat exchanger further comprises pin fins which are provided at positions which overlap the discharge unit in plan view and which extend in the vertical direction, and the pin ribs are inserted through the several plate ribs in the second direction and are formed in a shape that tapers upwards. [4] Cooling device according to claim 1, wherein the heat exchanger body contains several grid fins extending in such a way that they intersect a vertical direction and are arranged in the vertical direction, and the adjacent lattice ribs are arranged in such a way that they are displaced in a direction that intersects the vertical direction. [5] Cooling device comprising: a housing comprising a base plate placed on a heating element, a top plate facing the base plate, and a side plate connecting the base plate and the top plate on an outer circumferential side, and formed in a hollow shape; a heat exchanger that is provided on the base plate in the housing and that allows a refrigerant to flow through the heat exchanger; a supply unit that feeds the refrigerant from the outside to the inside of the housing; and a delivery unit connected to an area located in the cover plate that overlaps the heat exchanger in a top view and that delivers the refrigerant from an interior of the housing to the outside, wherein the heat exchanger body contains several grid fins extending in such a way that they intersect a vertical direction and are arranged in the vertical direction, and the adjacent lattice ribs are arranged in such a way that they are displaced in a direction that intersects the vertical direction. [6] Cooling device according to claim 4 or 5, wherein the heat exchanger further comprises pin fins which support the multiple grid fins and which extend in the vertical direction. [7] Cooling device according to claim 6, wherein the pin ribs are formed in a shape that tapers upwards. [8] Cooling device according to claim 1, wherein the heat exchanger body contains porous sections through which the refrigerant may pass. [9] Cooling device according to claim 8, wherein the heat exchanger further comprises pin fins which are provided at positions which overlap the discharge unit in plan view and which extend in a vertical direction, and The pin ribs are inserted through the porous sections in a direction that intersects the vertical direction and are formed in a shape that tapers upwards. [10] Cooling device according to claim 1, wherein the heat exchanger body includes several pin fins extending in a vertical direction and provided along the outer circumferential channel. [11] Cooling device according to claim 10, wherein the distance between the pin ribs increases towards a dispensing unit side in a direction that intersects the vertical direction. [12] Cooling device according to claim 10 or 11, wherein the pin ribs, which have a lower height, are arranged towards a dispensing unit side in a direction which intersects the vertical direction.

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