METHOD FOR ROUGHING A COMPONENT SURFACE AND METHOD FOR MAKING A SPIRIT LEVEL

Abstract

The invention relates to a method for roughening a component surface (1) of a first component (2), preferably a frame part (3) of a spirit level (4), preferably having a spirit-level component (6), in which method the component surface (1) of the first component (2), in particular the frame part (3) of the spirit level (4), is roughened by means of a roughening laser (7), wherein a roughening-laser beam (8) passes over the component surface (2) of the first component (2) along at least one path (10) at least once in order to produce at least one groove (9).

Description

[0001] Method for roughening a component surface and method for producing a spirit level

[0002] The present invention relates to a method according to the preamble of claim 1 and a method according to the preamble of claim 11.

[0003] There are a wide variety of different techniques for joining components. The optimal joining technique is selected depending on the materials used, the strength requirements of the composite, the required manufacturing accuracy and tolerances, costs, labor and energy requirements, and other influencing factors.

[0004] With regard to joining techniques, component preparation also plays a crucial role in the success and quality of a joint between two or more components. For example, cleaning the future joining position is often crucial for the strength of the joint.

[0005] Another example of a process for preparing a component for subsequent joining is roughening. A roughened surface of a first component can provide various advantages for subsequent joining with at least one second component. For example, in a material-bonded joining process such as adhesive bonding, at least one roughened surface of the components to be joined can lead to a significant improvement in the strength and durability of the bond.

[0006] In the area of ​​spirit levels, joining processes and / or preparation steps of the spirit level components to be joined play an essential role in the stability, longevity and / or accuracy of the spirit level to be manufactured. A spirit level consists of at least a frame part and a vial. The frame part is usually a rectangular and elongated profile in which at least one vial is built in. The vial is usually a plastic or glass tube filled with a liquid and a marker (usually a gas bubble). The gas bubble can move within the tube depending on the inclination of the spirit level, and the tube usually has additional markings.By accurately calibrating the position of the gas bubble within the tube, usually within the markings, relative to a measuring surface of the spirit level, the spirit level can be used to determine spatial, usually horizontal and / or vertical, alignments of object surfaces by applying the measuring surface.

[0007] In the manufacture of spirit levels, the current state of the art involves joining the spirit level components—that is, individual spirit level components such as vials or sockets, or spirit level assemblies such as a vial already inserted into a socket—to a frame part. The joining techniques required for this usually include force-fitting, material-fitting, and / or positive-fitting joining processes.

[0008] It should be noted at this point that a frame part of a spirit level is also a spirit level component. Due to its importance, the frame part of a spirit level is explicitly named as such below. If another spirit level component is explicitly named, this can refer to any component of a spirit level, including a frame part of the frame of a spirit level.

[0009] A disadvantage of the state of the art in the manufacture of a spirit level is that assemblies with a large number of individual parts or individual parts with a large number of structural elements usually have to be joined to the frame part, since the assemblies or individual parts have clamping and / or spring elements in order to create a force connection.

[0010] A further disadvantage of the state of the art is that often a large number of work steps and / or complex and complicated process precautions are necessary, for example to adjust and maintain the position and / or alignment of a vial relative to the measuring surface of the spirit level and then to join the vial indirectly to the frame part via a socket or another spirit level component.

[0011] A further disadvantage of the prior art is that with the currently used material-locking, force-locking and / or form-locking joining techniques, slipping, even if only slight, can easily occur between the spirit level component and the frame part after joining, as these are only connected to one another by, for example, the curing of an adhesive or by spring or clamping elements or similar. In addition, with purely force-locking joining techniques there is a risk that the force-lock connection will weaken due to relaxation of the materials used. In addition, with the currently used material-locking joining techniques, such as gluing, the material connection between the spirit level component and the frame part can easily become at least partially loose after joining. This can therefore easily damage the spirit level and, on the other hand, severely impair the accuracy of the spirit level.

[0012] A further disadvantage of the state of the art is that the currently used joining techniques and the resulting multitude of individual parts, structural elements, and / or work steps entail a high level of control effort. To ensure sufficient quality of a finished spirit level, complex intermediate product inspections are necessary during the manufacturing process, which increases the complexity of the entire manufacturing process.

[0013] The object of the present invention is therefore to at least partially eliminate the disadvantages of the prior art and to provide a method which is improved compared to the prior art and which is characterized in particular by a lower complexity, for example by fewer individual parts, construction elements, work steps and / or product controls.

[0014] The object is achieved according to a first aspect of the invention by means of a method according to claim 1, namely by a method for roughening a component surface of a first component, preferably a frame part of a spirit level, with a second component, preferably with a spirit level component, wherein the roughening of the component surface of the first component, in particular the frame part of the spirit level, is carried out by means of a roughening laser, wherein a roughening laser beam travels over the component surface of the first component at least once along at least one path to produce at least one groove.

[0015] By preparing the component with a roughening laser to produce a groove running along at least one path on the component surface of the first component, the quality of a subsequently produced composite can be increased.

[0016] The at least one groove extending along the at least one path on the component surface of the first component enlarges the area of ​​a joining position to be created. On the other hand, the groove creates the possibility of a subsequent force fit with simultaneous positive locking.

[0017] For example, during subsequent thermal joining, the material of the second component, preferably the spirit level component, can soften and / or melt and then enter the at least one groove, thus creating a force-fitting and form-fitting connection. In this way, slipping of the components relative to one another can be prevented or at least made more difficult in the long term.

[0018] The object is achieved according to a second aspect of the invention by means of a method according to claim 11, namely by a method for producing a spirit level, comprising at least one vial and at least one frame part, wherein the spirit level has a measuring surface, wherein the, preferably horizontal and / or vertical, spatial orientation of an object surface can be determined by applying the measuring surface to the object surface, wherein at least the following method steps are provided:

[0019] - Providing a joining position on the at least one frame part, preferably by cleaning a region of the frame part and / or by roughening a region of the frame part according to a method according to the first aspect of the invention,

[0020] - Positioning a spirit level component at the joining position of at least one frame part,

[0021] - Joining the spirit level component to the at least one frame part, wherein thermal joining is used to join the spirit level component to the at least one frame part.

[0022] During thermal joining of the spirit level component to at least one frame part, a force-fitting, form-fitting, and / or material-fitting connection is created. This way, only the components to be joined, without any special design features, are required, and complex structures including various clamping devices and / or spring devices can be omitted.

[0023] By controlling the temperature influence and / or the heating points of the parts to be joined, thermal joining offers the possibility of flexibly and / or locally creating one or more joints with specific strengths. In this way, joining processes can be easily provided for a wide variety of spirit level components and / or for a wide variety of requirements, particularly strength requirements.

[0024] "Joining" is understood here as a process in which at least two individual parts, two assemblies or one individual part and one assembly are brought into a permanent connection.

[0025] Joining can be achieved, for example, via positive and / or non-positive connections, such as snap connections, screw connections, clamp connections, and / or the like. Joining can also be achieved additionally or instead via material-locking connections, such as gluing, welding, and / or the like. Positive, non-positive, and / or material-locking connections can be combined with one another during the joining process or each can be used individually.

[0026] Joining can therefore also include thermal joining.

[0027] "Thermal joining" is understood here to mean a joining process in which at least one temperature represents at least one parameter determining the joining process. Examples of thermal joining are welding, in which two joining partners are connected to one another in a form-fitting, force-fitting and / or material-fitting manner by at least partially melting at least one joining partner, or clamping, in which two joining partners are clamped together, for example by enlarging the opening of a first joining partner as a result of thermal expansion, so that the second joining partner can be inserted in the hot state and is then firmly clamped to the first joining partner in the cooled state.

[0028] A "roughening position" is understood here to be an area on a component surface which is roughened. This can be an area of ​​various shapes and sizes. The same applies analogously to a "joining position". For the roughening and joining of two components, it can be provided that a roughening position is arranged so as to at least partially overlap with a joining position on a component surface.

[0029] Further advantageous embodiments of the arrangement are defined in the dependent claims.

[0030] According to a preferred embodiment of the method, it can be provided that

[0031] - the roughening laser creates at least one groove with at least one undercut and / or

[0032] - the roughening laser creates at least one intersection pocket with at least one undercut at at least one intersection point on the component surface of the first component, wherein the at least one intersection point is created by at least one self-intersecting path of the roughening laser beam and / or by at least two mutually intersecting paths of the roughening laser beam. Undercuts are important design elements in connections because they make a significant contribution to strength by reinforcing the positive and / or force-locking of a connection.

[0033] For an undercut groove that follows the path of the roughening laser, an undercut can be created on either side of the groove running along the path of the roughening laser. This can improve the strength of a bond between the first component and the second component after subsequent joining, with particular emphasis on the strength perpendicular to the path of the roughening laser and the resulting groove.

[0034] If at least one path of the roughening laser intersects with itself or another path of the roughening laser, an intersection shaped pocket of the one self-intersecting groove or of the at least two intersecting grooves can be created. This creates an intersection point on the component surface with an intersection shaped pocket having at least one undercut. It is also conceivable for the intersection shaped pocket to have more than one undercut, thereby achieving increased strength of the bond between the first component and the second component.

[0035] In a preferred embodiment, it can be provided that the at least one intersection shaped pocket has at least two, in particular four, undercuts.

[0036] According to a preferred embodiment of the method, it can be provided that the roughening laser beam, in order to generate a grid from the at least one groove, travels over the component surface of the first component along at least one, preferably uninterrupted, path, preferably wherein the roughening laser beam is guided along at least one straight path section of the at least one path and / or along at least one curved path section of the at least one path.

[0037] A "grid" is understood here to mean the arrangement of one or more grooves on a component surface, wherein on the one hand one or more crossing points are present on the component surface due to the intersecting one groove or the intersecting several grooves and / or on the other hand, given the one or more grooves, there are corresponding, preferably parallel, track sections on the component surface.

[0038] Examples of a grid are patterns based on intersecting grooves, where the grooves can be orthogonal and / or inclined to each other.

[0039] According to a preferred embodiment of the method, it can be provided that the roughening laser beam for generating the at least one groove passes over the component surface of the first component more than once, preferably more than twice or more than three times, along the same path, preferably in the same direction along the same path.

[0040] By repeatedly passing the roughening laser over the component surface along the same path, the dimensions of the resulting groove can be precisely created, such as the groove depth, the groove opening width, the maximum groove width and / or the undercuts of the groove.

[0041] According to a preferred embodiment of the method, it can be provided that the roughening laser is a CW laser, preferably wherein the roughening laser is operated with a power of up to 3000 W, particularly preferably of up to 2000 W, very particularly preferably of up to 1500 W, and / or with a traversing speed of up to 70 m / s, particularly preferably of up to 50 m / s, very particularly preferably of up to 18 m / s.

[0042] A "CW laser" here refers to a continuous wave laser. The term "continuous wave laser" can be used synonymously for a CW laser. Unlike a pulsed laser, a CW laser can emit uninterrupted, i.e., unpulsed, laser radiation. In this way, a uniformly continuous groove can be created along the path of the roughening laser.

[0043] The parameters of the roughening laser, such as the power and / or the speed at which the laser moves over the component surface, can have an influence on the groove produced, in particular on the dimensions of the groove produced.

[0044] In a preferred embodiment, the roughening laser can have a wavelength of 1070 nm ± 10 nm, a spot diameter of 40 pm and / or a focal length of 330 mm.

[0045] In a preferred embodiment, it can be provided that the parameters of the roughening laser, for example the laser power and / or the traversing speed, are set to be constant when the component surface of the first component is traversed several times and / or to be set to different values ​​between individual traversals.

[0046] According to a preferred embodiment of the method, it can be provided that the roughening laser is controlled in such a way that the roughening laser beam is guided substantially perpendicularly onto the component surface of the first component, in particular at an angle of between 80° and 100° relative to the component surface of the first component, and / or inclined onto the component surface of the first component.

[0047] Depending on the angle at which the roughening laser hits the component surface, the shape of the groove created by the roughening laser changes.

[0048] In a preferred embodiment, it can be provided that the angle which the roughening laser beam has with the component surface of the first component is set to be constant when the component surface of the first component is passed over several times and / or to be set differently between individual passes.

[0049] According to a preferred embodiment of the method, it can be provided that the roughening laser produces a roughened microstructure and / or nanostructure on the component surface of the first component.

[0050] According to a preferred embodiment of the method, it can be provided that, in order to produce the at least one groove on the component surface of the first component, the roughening laser beam is controlled along the at least one path in such a way that

[0051] - at least partially corresponding, preferably parallel, track sections of the at least one

[0052] Path of at least one groove is generated and / or

[0053] - at least partially corresponding, preferably parallel, track sections of at least two

[0054] Grooves are produced, wherein the track sections have a substantially constant track spacing from one another of 50 pm to 300 pm, preferably of 100 pm to 200 pm, particularly preferably of approximately 180 pm. The number of tracks and track sections present on the component surface and consequently the number of groove or grooves present on the component surface can be determined by the track spacing. This can also influence the quality and / or strength of the bond between the first component and the second component.

[0055] According to a preferred embodiment of the method, it can be provided that the roughening laser

[0056] - a groove depth of 10 gm to 1000 gm, preferably 100 gm to 400 gm, particularly preferably about 230 gm, is produced along the at least one track, and / or

[0057] - a groove opening width of 1 gm to 1000 gm, preferably 10 gm to 100 gm, particularly preferably about 40 gm, is produced on the component surface of the first component, which width is substantially continuous along the at least one path, and / or

[0058] - a maximum groove width of 3 gm to 2000 gm, preferably 30 gm to 900 gm, particularly preferably about 60 gm, is produced along the at least one track, and / or

[0059] - at least one undercut of 1 gm to 500 gm, preferably of 10 gm to 400 gm, particularly preferably of 10 gm to 300 gm, is produced, which undercut is substantially continuous along the at least one web.

[0060] The specific dimensions of the at least one groove, namely the groove depth, groove opening width, maximum groove width and their undercuts, are dimensional for force-fitting, form-fitting and / or material-fitting connections after joining the first component to the second component. The number of tracks and track sections present on the component surface and consequently the number of groove or grooves present on the component surface can be determined by their dimensions. This can also influence the quality and / or strength of the connection between the first component and the second component.

[0061] According to a preferred embodiment of the method, it can be provided that the roughening laser

[0062] - a crossing pocket depth of 10 gm up to 1000 gm, preferably from 100 gm up to 400 gm, and / or

[0063] - a crossing shaped pocket opening width on the

[0064] Component surface of the first component of 1 gm to 1000 gm, preferably of about 40 gm, and / or

[0065] - a maximum mould pocket width below the component surface of the first component of 3 gm to 2000 gm, preferably of about 60 gm, is produced and / or

[0066] - a crossing shaped pocket undercut of 1 gm to 500 gm, preferably of 10 gm to 400 gm, particularly preferably of 10 gm to 300 gm.

[0067] What has been said so far regarding the existing grooves also applies analogously to the existing intersection pockets.

[0068] According to a preferred embodiment of the method, it can be provided that at least the following method steps are provided, preferably after positioning:

[0069] - Adjusting the spirit level component at the joining position of the at least one frame part relative to the at least one measuring surface,

[0070] - Holding the spirit level component in the adjusted position relative to the at least one measuring surface, - Thermally joining the spirit level component to the at least one frame part in the adjusted position relative to the at least one measuring surface, wherein the adjustment and / or holding of the spirit level component at the joining position of the at least one frame part is carried out by an adjustment device and / or by a holding device.

[0071] If the spirit level component is a vial and / or a spirit level assembly that includes a vial, it may be necessary to adjust the spirit level component and / or the spirit level assembly to align the vial with the measuring surface of the spirit level. After adjustment, a holding step may be provided to keep the vial constant at the adjusted position relative to the measuring surface. The adjustment and holding steps can therefore expediently be performed prior to thermal joining.

[0072] According to a preferred embodiment of the method, it can be provided that at least at an interface between the at least one frame part and the spirit level component for the thermal joining, the at least one frame part and / or the spirit level component is / are heated at least briefly at least up to the heat distortion temperature, softening temperature,

[0073] glass transition temperature and / or melting temperature and / or heated to a temperature below the decomposition temperature.

[0074] By heating the at least one frame part, the spirit level component at the interface to the at least one frame part can also be heated as a result of heat transfer. As a result of this heating to a temperature characteristic of the material of the spirit level component, the spirit level component can soften and / or melt and form a bond with the at least one frame part. Such a bond can be positively, non-positively, and / or materially bonded.

[0075] In a particularly preferred embodiment, it can be provided that the softened and / or molten material of the water tank component penetrates into the grooves and / or intersection pockets of the roughened component surface in order to create the bond between the frame part and the water tank component.

[0076] According to a preferred embodiment of the method, it can be provided that, before the thermal joining, the at least one frame part and / or the spirit level component is preheated at least at an interface between the at least one frame part and the spirit level component to a temperature below the heat distortion temperature, softening temperature, glass transition temperature and / or melting temperature, preferably with infrared radiation.

[0077] Preheating of the joining partners, specifically the at least one frame part and / or the spirit level component, can increase the efficiency of the process and / or the quality of the bond between the at least one frame part and the spirit level component.

[0078] According to a preferred embodiment of the method, it can be provided that laser joining, induction joining, infrared joining and / or ultrasonic joining is used as thermal joining.

[0079] According to a preferred embodiment of the method, it can be provided that laser joining is used as thermal joining, wherein - the parameters of a joining laser for the laser joining are matched to the nature of the joining position, preferably roughened according to a method according to the first aspect of the invention, and / or

[0080] - a CW laser is used and / or

[0081] - the laser joining is carried out selectively, preferably with a moving joining laser beam, and / or

[0082] - the laser joining is carried out over a large area.

[0083] It can be provided that the joining position between the at least one frame part and the spirit level component is irradiated with a laser sequentially, i.e. piece by piece one after the other, or the complete area of ​​the joining position is irradiated at once.

[0084] In a preferred embodiment, the parameters of a joining laser can be tailored to the nature of the joining position on the component surface. This is particularly important if the joining position on the component surface was roughened prior to thermal joining using a roughening method according to the invention.

[0085] Surface laser joining can be achieved, for example, using mask welding. With mask welding, only a specific geometric shape is welded. The shape of the geometry is determined by a so-called "mask" or "aperture."

[0086] According to a preferred embodiment of the method, it can be provided that the thermal joining takes place by means of welding, preferably by means of laser welding, particularly preferably by means of laser transmission welding. According to a preferred embodiment of the method, it can be provided that the thermal joining takes place with a joining laser, preferably by means of laser transmission welding, wherein

[0087] - a joining laser beam is guided through the spirit level component before hitting the at least one frame part, and / or

[0088] - a joining laser beam is guided parallel, orthogonal and / or inclined to the measuring surface and / or

[0089] - a joining laser beam is guided orthogonally or inclined onto an impact surface and / or

[0090] - a joining laser beam is guided onto an impact surface of the at least one frame part, wherein the impact surface is aligned parallel, orthogonal or inclined to the measuring surface, and / or

[0091] - a joining laser beam is guided through a hollow volume within the at least one frame part, and / or

[0092] - a joining laser beam is deflected at least once by a mirror and / or

[0093] - the joining laser is operated with a laser power of 100 W up to 3000 W, preferably from 500 W up to 2000 W, particularly preferably about 1200 W.

[0094] The flexible guidance of the joining laser beam makes it possible to join any desired area of ​​the at least one frame part to the spirit level component. For example, the flexible guidance of the joining laser beam allows the joining position to be provided on the outside and / or inside of the at least one frame part.

[0095] The term “impact surface” is understood here to mean at least part of a component surface, preferably of the first component and / or of at least one frame part, onto which the laser beam, preferably a joining laser beam, strikes. Such an impact surface can be flat and / or curved. The angle of impact between the laser beam and the impact surface results in the case of a flat impact surface from the angle between the flat impact surface and the laser beam, or in the case of an at least partially curved impact surface from the angle between a tangent of the impact surface at the point at which the laser beam strikes and the laser beam.

[0096] In a preferred embodiment, the same laser can be used for a method for roughening a component surface of a first component according to the first aspect of the invention and for a method for producing a spirit level according to the second aspect of the invention. In other words, the roughening laser can also be the joining laser, and vice versa.

[0097] In the event that the roughening laser is also the joining laser and vice versa, it can be provided that the parameters of the laser used are set to be constant and / or different between individual passes and / or between the processes for roughening a component surface of a first component and for producing a spirit level and / or between the individual process steps of the process.

[0098] According to a preferred embodiment of the method, it can be provided that the thermal joining takes place with a contact pressure between the spirit level component and the at least one frame part of at least 2 bar, preferably at least 3 bar, particularly preferably at least 5 bar.

[0099] According to a preferred embodiment of the method, it can be provided that the thermal joining takes place with a contact pressure, wherein a clamping device and / or a vacuum device exerts the contact pressure on the spirit level component and / or on the at least one frame part.

[0100] The joining process can be positively influenced by a contact force and / or contact pressure. For example, if a component surface roughened according to the first aspect of the invention is present at the joining position, the softened and / or molten material of the water tank component can penetrate the roughened component surface more easily, more quickly, and / or more extensively as a result of heating during thermal joining by means of the contact force and / or contact pressure. Thus, an improved bond can be generated than without contact force and / or contact pressure.

[0101] According to a preferred embodiment of the method, it can be provided that a joining aid is provided, wherein the joining aid supports the thermal joining by properties relevant for the thermal joining, in particular adsorption properties, wherein the joining aid is arranged on and / or in the at least one frame part and / or the spirit level component, preferably manually and / or automatically, before the thermal joining.

[0102] In a preferred embodiment, it can be provided that, before the thermal joining, the joining position of the at least one frame part and / or a region of the spirit level component to be joined to the joining position is coated with the joining aid, wherein coating is preferably carried out manually and / or automatically.

[0103] The joining aid can be used to increase radiation absorption at the interface between the parts to be joined, resulting in increased and / or faster heating. This allows for more targeted and / or faster joining.

[0104] In a preferred embodiment, the joining aid can be a liquid and / or viscous medium based on acetone, methyl ethyl ketone and / or ethanol.

[0105] In a preferred embodiment, the joining aid can be a component of the at least one frame part and / or the spirit level component. For example, the spirit level component can comprise two material components, one of which has a higher absorption capacity than the other component and thus represents the joining aid.

[0106] In a preferred embodiment of the method, it can be provided that the application of the joining aid to the joining position is carried out manually by personnel and / or automatically as a separate process step.

[0107] According to a preferred embodiment of the method, it can be provided that at least one vial and / or at least one socket and / or at least one adjusting part and / or at least one connecting part and / or at least one film and / or at least one handle and / or at least one end cap and / or at least one further frame part and / or at least one electrical module, preferably with at least one operating element and at least one output device, and / or at least one spirit level assembly is used as the spirit level component. The specific spirit level components mentioned are not to be understood as a limitation, since every conceivable component of a spirit level falls under the term "spirit level component".

[0108] According to a preferred embodiment of the method, it can be provided that two or more vials, preferably at least one horizontal vial and at least one vertical vial, are particularly preferably joined to the at least one frame part.

[0109] According to a preferred embodiment of the method, it can be provided that in the case of a spirit level which has at least one frame part, at least one first spirit level component, preferably a vial, and at least one second spirit level component, preferably a socket, the production of the spirit level takes place indirectly, wherein in the indirect production of the spirit level, the at least one first spirit level component is first joined, preferably glued, to the at least one second spirit level component and then the structure of the at least one first spirit level component and the at least one second spirit level component is thermally joined to the at least one frame part,or the at least one second spirit level component is first thermally joined to the at least one frame part and then the structure of the frame part and the at least one second spirit level component is joined, preferably glued, to the at least one first spirit level component.

[0110] In a preferred embodiment, it can be provided that, during indirect production of the spirit level, a first spirit level component, for example a film, is melted at the joining position by thermal joining, for example by laser welding, and a type of molten pool is created from the first spirit level component at the joining position on the component surface of the at least one frame part. As soon as the molten pool has solidified, a further spirit level component, for example a vial or a socket, can be joined to the first spirit level component using a different joining method, for example gluing. In addition, it can also be provided that the first spirit level component, for example the film, can be joined to the at least one frame part using contact pressure via thermal joining.

[0111] According to a preferred embodiment of the method, it can be provided that in the case of a spirit level which has at least one frame part and at least one vial, the production of the spirit level takes place directly, wherein in the direct production of the spirit level the at least one vial is thermally joined directly to the frame part.

[0112] According to a preferred embodiment of the method, it can be provided that the connection between the spirit level component and the at least one frame part as a result of the thermal joining has a compressive strength according to the standard DIN 50106 for withstanding a compressive force between 250 N and 2000 N, preferably between 300 N and 1500 N, at a pre-load of 2 N and a test speed of 10 mm / min and / or a tensile strength according to the standard DIN EN 205 for withstanding a tensile force between 250 N and 2000 N, at a pre-load of 2 N and a test speed of 10 mm / min.According to a preferred embodiment of the method, it can be provided that the first component and / or the at least one frame part consists at least partially of metal, preferably of an aluminum alloy, and / or at least partially of a composite material, preferably a reinforced composite material, particularly preferably of a glass fiber reinforced composite material, and / or at least partially of a plastic.

[0113] According to a preferred embodiment of the method, it can be provided that the second component and / or the spirit level component consists at least partially of plastic, preferably at least partially of cellulose acetate butyrate (CAB), polymethyl methacrylate (PMMA), methyl methacrylate acrylonitrile butadiene styrene (MABS), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyethylene (PE), polyvinyl chloride (PVC), polyamide (PA), polyoxymethylene (POM) and / or polypropylene (PP).

[0114] A plastic for the first component and / or the at least one frame part and / or the second component and / or the spirit level component can be a thermoplastic, a thermoset and / or elastomer.

[0115] According to a preferred embodiment of the method, it can be provided that the first component and / or the at least one frame part and / or the second component and / or the spirit level component has at least partially a coating, preferably at least partially an anodized coating and / or a powder coating.

[0116] Further advantages and details of preferred embodiments of the invention are apparent from the figures and the associated descriptions. Fig. 1: an exploded view of a first

[0117] Example of a spirit level;

[0118] Fig. 2 to 5: different views of the first

[0119] Embodiment of a spirit level from Fig. 1;

[0120] Fig. 6 to 16: various embodiments of

[0121] Profile cross-sections of a frame part of a spirit level;

[0122] Fig. 17: an embodiment of a socket for a

[0123] Horizontal libel le ;

[0124] Fig. 18: an embodiment of a socket for a

[0125] vertical spirit level;

[0126] Fig. 19: an exploded view of a second

[0127] Example of a spirit level as an exploded view;

[0128] Fig. 20 to 24: different views of the second embodiment of a spirit level from Fig. 19;

[0129] Fig. 25: a schematic representation of a method for at least partially producing the first embodiment of a spirit level from Fig. 1 with a horizontal vial;

[0130] Fig. 26: a schematic representation of a method for at least partially producing the first embodiment of a spirit level from Fig. 1 with a vertical vial;

[0131] Fig. 27: a schematic representation of a method for at least partially producing the second embodiment of a spirit level from Fig. 19 with a horizontal vial;

[0132] Fig. 28: a schematic representation of a method for at least partially producing the second embodiment of a spirit level from

[0133] Fig. 19 with a vertical spirit level;

[0134] Fig. 29 to 37: different views of different frame parts with different positions and shapes of the roughened areas;

[0135] Fig. 38 is a photograph of a roughened component surface for a horizontal vial on a frame part of a spirit level;

[0136] Fig. 39 is a photograph of a roughened component surface for a vertical vial on a frame part of a spirit level;

[0137] Fig. 40 to 42: various photographs of roughened component surfaces of a first component;

[0138] Fig. 43 is a schematic representation of a roughening process;

[0139] Fig . 44 and 45 : various embodiments for

[0140] Pathways and grids;

[0141] Fig. 46 to 52B: various microscopic and CT images of roughened component surfaces;

[0142] Fig. 53 is a schematic representation of a joining method;

[0143] Fig. 54 is a schematic sectional view of a first component with two grooves;

[0144] Fig. 55 to 57: various photographs of a roughening position 31 and a joining position 20 of a spirit level in different scales;

[0145] Fig . 58 to 60 : various microscopic photographs of

[0146] Interfaces between a spirit level

[0147] Component and a frame part of a spirit level.

[0148] Fig. 1 shows an exploded view of a first

[0149] From an exemplary embodiment of a spirit level 4 . The spirit level 4 of the first exemplary embodiment consists of a first component 2, as shown in Fig. 1 a frame part 3, a second component 5, as shown in Fig. 1 a spirit level component 6, specifically in this case a socket 27, and further spirit level components 6.

[0150] It should be noted at this point that all components of a spirit level 4 are spirit level components 6. It is conceivable that additional spirit level components 6 are also provided that are not explicitly mentioned in the figures shown here or in the descriptions formulated here. The quantity and types of spirit level components 6 are therefore not limited to the quantities and types listed here. For example, two or more vials 26, in a more specific example, one horizontal vial 26 and two vertical vials 26, or two or more sockets 27 may be provided.

[0151] Spirit level components 6 can, as shown in Fig. 1, include vials 26, light plates 29, adjusting parts 28, sockets 27, and / or end caps 30. As already mentioned, other spirit level components 6 are also conceivable.

[0152] In the specific case of Fig. 1, a frame part 3, two sockets 27, two vials 26, one vial 26 being a vertical vial 26 and one vial 26 being a horizontal vial 26, an adjusting part 28, a light plate 29 and two end caps 30 are provided.

[0153] Fig. 2 shows a side view of the first embodiment of a spirit level 4 from Fig. 1.

[0154] To better illustrate the side view of the spirit level 4, Fig. 2 includes two cutouts 34, each corresponding to a limited section along the section plane 41 of Fig. 3. One of these cutouts shows a spirit level 26 arranged centrally on the spirit level 4 in the installed state. The other of these two cutouts shows a spirit level 26 arranged closer to the edge of the spirit level 4 in the installed state.

[0155] In Fig. 2, all spirit level components 6 can be seen within the frame 3 of the spirit level 4 in the installed state.

[0156] Fig. 3 shows a plan view of the first embodiment of a spirit level 4 from Fig. 1.

[0157] Fig. 4 shows a sectional view of the first embodiment of a spirit level 4 from Fig. 1, wherein the sectional plane AA is visible in Fig. 2.

[0158] Fig. 5 shows a sectional view of the first embodiment of a spirit level 4 from Fig. 1, wherein the sectional plane BB can be seen in Fig. 2.

[0159] Figs. 6 to 16 show various embodiments of profile cross-sections of a frame part 3 of a spirit level 4.

[0160] The frame part 3 of a spirit level 4 can be designed as a hollow profile, a partially hollow profile, or a solid profile. However, the exemplary embodiments of the frame parts 3 shown here merely represent hollow profiles. The specific embodiment of cross-sections of a frame part 3 is not limited to the exemplary embodiments listed here.

[0161] The profile cross-sections of a frame part 3 of a spirit level 4 can have different shapes, as shown in Figs. 6 to 16. For example, the profile cross-sections, as shown in Figs. 6 to 11, 13, 15, and 16, can be substantially rectangular, with ribs, notches, grooves, struts, holes, projections, and the like being provided. However, I-profiles, as shown essentially in Figs. 12 and 14, can also be provided. Furthermore, other profile shapes such as T-, L-, U-, or round profiles can also be provided.

[0162] As shown in Fig. 6, a roughening position 31 and / or a joining position 20 can be provided at different locations of a profile cross-section.

[0163] In the case of a rectangular profile cross-section of the frame part 3, a measuring surface 19 of a spirit level 4 is usually located on a narrow side of the profile cross-section. The position of the measuring surface 19 is not limited to the exemplary embodiments shown here. In principle, each side of a frame part 3 of a spirit level 4 can be conceived as a measuring surface 19. If, as shown in Fig. 6, the measuring surface 19 is provided on the lower narrow side of the frame 3, the four positions 20, 31 shown with dashed lines can, for example, be provided for roughening and / or joining with a spirit level component 6.

[0164] The roughening positions 31 and / or joining positions 20 shown here are not limited to the embodiments shown here.

[0165] Fig. 12 shows a profile cross-section of a frame part 3 of a spirit level 4, which resembles an I-profile. As already described for Fig. 6, different positions 20, 31 for roughening and / or joining are also conceivable for the profile cross-section in Fig. 12, whereby the roughening positions 31 and / or joining positions 20 shown here are not limited to the exemplary embodiments shown here. Fig. 13 shows a profile cross-section which is essentially rectangular, wherein the two longer sides of the profile cross-section extend at least partially obliquely inwards from the narrow sides of the profile cross-section.

[0166] Fig. 14 shows a profile cross-section which is comparable to the I-profile from Fig. 12, wherein at two opposite ends of the profile cross-section a substantially triangular hollow profile section of the entire profile cross-section is provided.

[0167] Fig. 15 and 16 both show profile cross-sections with two essentially rectangular hollow profiles each.

[0168] Fig. 17 shows a perspective view of an embodiment of a socket 27 for a horizontal vial 26. The socket 27 in Fig. 17 corresponds to the socket 27 of the first embodiment from Figs. 1 to 5, which is arranged centrally on the spirit level 4.

[0169] Fig. 18 shows a perspective view of an embodiment of a socket 27 for a vertical vial 26. The socket 27 in Fig. 18 corresponds to the one located at the edge of the

[0170] Spirit level 4 arranged socket 27 of the first embodiment from Figs. 1 to 5

[0171] Fig. 19 shows an exploded view of a second embodiment of a spirit level 4.

[0172] What has been said so far regarding the first embodiment also applies analogously to the second embodiment. The differences from the first embodiment are described below. Similarities to the first embodiment are generally not repeated.

[0173] The second embodiment of a spirit level 4 comprises a frame part 3 and two vials 26. The vials 26 are directly connected to the frame part 3 of the spirit level 4.

[0174] In Fig. 19, a position 20, 31 is provided in the center of the spirit level 4, which can be roughened by a roughening process and thus be a roughened position and / or can serve as a joining position between the frame part 3 and the horizontal level 26 by a process for producing a spirit level 4.

[0175] As in the first embodiment, a light plate 29 can also be provided for the horizontal level 26 in the second embodiment.

[0176] As shown in Fig . 19 , both the horizontal spirit level 26 and the vertical spirit level 26 can be directly connected to the frame part 3 .

[0177] The vials 26 can be located within the profile of the frame part 3 of the spirit level 4 and can be visible from at least one side, preferably from two sides, particularly preferably from three sides, through at least one recess in the frame part 3.

[0178] Further spirit level components 6, such as covers 33, may be provided. As shown in Fig. 19, two spirit level covers may be covered. The spirit level covers 33 may be arranged on the frame part 3 and / or the vertical spirit level 26.

[0179] A suspension sleeve 32 may be provided, which may be arranged toward one end of the spirit level 4. A suspension sleeve 32 may be used to suspend the spirit level 4, for example, from a hook on a wall. The suspension sleeve 32 represents another spirit level component 6. As with all other spirit level components 6, the suspension sleeve 32 may be added to the frame part 3 using a method for manufacturing a spirit level.

[0180] Fig. 20 shows a side view of the spirit level 4 from Fig. 19, wherein two cutouts 34 are provided. The cutouts 34 run along the cutting plane 41 from Fig. 21.

[0181] Fig. 21 shows a top view of the spirit level 4 from Fig. 19. One of these sections shows a vial 26 arranged centrally on the spirit level 4 in the installed state. The other of these two sections shows a vial 26 arranged closer to the edge of the spirit level 4 in the installed state. In contrast to the first exemplary embodiment, here the vials are directly connected to the frame part 3 in the installed state.

[0182] Fig. 22 shows a sectional view of the spirit level 4 from Fig. 19, wherein the sectional plane CC runs through the vial 26 arranged centrally on the spirit level 4 in the installed state.

[0183] Fig. 23 shows a sectional view of the spirit level 4 from Fig. 19, wherein the cutting plane DD runs through the spirit level 26 arranged closer to the edge of the spirit level 4 in the installed state.

[0184] Fig. 24 shows a sectional view of the spirit level 4 from Fig. 19, wherein the sectional plane EE runs through the suspension sleeve 32 arranged closer to the edge of the spirit level 4 in the installed state. Fig. 25 shows a schematic representation of a method for at least partially producing the first embodiment of a spirit level from Fig. 1 with a horizontal vial.

[0185] As indicated in Fig. 25, one or more method steps 103 for roughening a component surface 1 of a first component 2, preferably a frame part 3, can be carried out beforehand.

[0186] In method step 104, a first component 2, preferably a frame part 3, can be joined to a second component 5, preferably a spirit level component 6, particularly preferably a socket 27, wherein the joining can be a thermal joining.

[0187] In method step 101, a spirit level component 6, preferably a luminous plate 29, can be inserted into another spirit level component 6, preferably an adjusting part 28, and / or joined to another spirit level component 6, preferably an adjusting part 28.

[0188] In method step 102, a spirit level component 6 and / or a spirit level assembly, preferably the spirit level assembly comprising the adjusting part 28 and the luminous plate 29 from the previous method step 101, can be joined to another spirit level component 6, preferably to a vial 26. The joining can result in a positive, non-positive, and / or material-locking connection and can be carried out in different ways, for example thermally by means of ultrasound and / or induction, or non-thermally by means of an adhesive.

[0189] In method step 105, a spirit level component 6 and / or a spirit level assembly, preferably the spirit level assembly comprising the adjustment part 28, the light plate 29, and the vial 26 from the previous method step 102, can be positioned and adjusted on and / or at a first component 2, preferably a frame part 3. In the case of using a vial as the spirit level component 6 and / or as part of the spirit level assembly, the adjustment can serve the purpose of precisely aligning the vial 26 with a measuring surface 19.

[0190] In method step 106, a spirit level component 6 and / or a spirit level assembly, preferably after adjustment, can be held in a position which is preferably aligned with a measuring surface 19.

[0191] In method step 102, a spirit level component 6 and / or a spirit level assembly can be joined to a first component 2, preferably a frame part 3.

[0192] Fig. 26 shows a schematic representation of a method for at least partially producing the first embodiment of a spirit level from Fig. 1 with a vertical vial.

[0193] Method steps 102 to 106 can be understood analogously to those described for Fig. 25. The difference between Fig. 25 and Fig. 26 is the joining of different spirit level components 6, in particular different sockets 27, to a first component 2, in particular a frame part 3.

[0194] Fig. 27 shows a schematic representation of a method for at least partially producing the second embodiment of a spirit level from Fig. 19 with a horizontal vial.

[0195] The process steps 101 and 103 to 106 can be carried out analogously to

[0196] Fig. 25. The difference between Figs. 25 and 26 on the one hand and Fig. 27 on the other hand is the indirect or direct joining of a spirit level component 6, preferably a vial 26, to a first component 2, preferably a frame part 3.

[0197] While in Fig. 25 and Fig. 26 a spirit level 26 can be joined indirectly to a frame part 3 via a socket 27, in Fig. 27 a spirit level 26 can be joined directly to a frame part 3.

[0198] Fig. 28 shows a schematic representation of a method for at least partially producing the second embodiment of a spirit level from Fig. 19 with a vertical vial.

[0199] The method steps 101 and 103 to 106 can be understood analogously to that described for Fig. 25. The difference between Fig. 28 and Fig. 27 is the joining of different spirit level components 6, in particular different vials 26, with a first component 2, in particular a

[0200] Frame part 3.

[0201] Fig. 29 to 37 show different views of different frame parts 3 with different positions and shapes of the roughening positions 31 and joining positions 20.

[0202] Figs. 29, 31, 33, 35, 36 and 37 show front views of frame parts 3 for spirit levels 4.

[0203] Figs. 30, 32 and 34 show top views of frame parts 3 for spirit levels 4.

[0204] It can be provided that the roughening position 31 on a component surface 1 of a first component 2, preferably a frame part 3, and / or the joining position 20 on a frame part 3 can be provided on the outside and / or on the inside of the first component 2 and / or the frame part 3.

[0205] It can be provided that the roughening position 31 on a component surface 1 of a first component 2, preferably a frame part 3, and / or the joining position 20 on a frame part 3 can be provided along at least one continuous contour line and / or at least one contour line that is interrupted at least once, wherein the at least one contour line can be straight and / or curved at least in some regions.

[0206] It can be provided that the roughening position 31 on a component surface 1 of a first component 2, preferably a frame part 3, and / or the joining position 20 on a frame part 3 can be at least one continuous surface and / or at least one surface that is interrupted at least once, wherein the at least one surface can be round and / or angular at least in some regions, preferably substantially rectangular and / or circular.

[0207] It can be provided that the roughening position 31 on a component surface 1 of a first component 2, preferably a frame part 3, and / or the joining position 20 on a frame part 3 is provided to follow the shape of a recess in the first component 2 and / or in the frame part 3 at least in some areas.

[0208] Fig. 38 shows a photograph of a roughened component surface 1 for a horizontal level 26 on a frame part 3 of a spirit level 4.

[0209] The roughening position 31 in Fig. 38 is essentially similar to the roughening position in Figs. 30, 32 and 34 and could be used for joining with a socket 27 in order to produce a spirit level 4 according to the first embodiment of Fig. 1.

[0210] Fig. 39 shows a photograph of a roughened component surface for a vertical vial on a frame part of a spirit level.

[0211] The roughening positions 31 in Fig. 39 are essentially similar to the roughening positions in Fig. 35 and could be used for joining with a vial 26 and / or a suspension sleeve 32 to produce a spirit level 4 according to the second embodiment of Fig. 19.

[0212] Fig. 40 to 42 show various photographs of roughened component surfaces 1 of a first component 2.

[0213] Fig. 40 and Fig. 41 are to the same scale. Fig. 42, however, is an enlarged section of a roughened component surface 1.

[0214] Fig. 43 shows a schematic representation of a roughening process.

[0215] As shown in Fig. 43, a laser beam 8 can be generated by means of a roughening laser 7, wherein the roughening laser beam 8 can locally heat the first component 2, preferably the frame part 3, at the point of impact of the component surface 1 in such a way that a groove 9 can be generated.

[0216] The groove 9 in Fig. 43 can be formed by one or two effects of the

[0217] On rough laser beam 8 are generated. An effect of the

[0218] The roughing laser beam 8 can melt and displace, specifically push out, the melt 18 from the groove 9. The second effect of the roughing laser beam 8 can be the sublimation and / or evaporation of the material of the first component 2, preferably the frame part 3, from the groove 9 and / or from the melt 18 in the form of a gas cloud 39. In order to produce one or both effects of the roughing laser beam 8, a specific frequency, intensity, power and / or travel speed along a path 10 of the roughing laser beam 8 can be essential.

[0219] Fig. 44 and 45 show various embodiments of paths 10 and grids 13 along which a roughening laser beam 8 can be guided.

[0220] As shown in Fig. 44 and 45, it can be provided that a grid 13, 37 is generated on a component surface 1 by several individual paths 10 being traversed by the roughening laser beam 8.

[0221] The individual tracks 10 can form two sets 35, 36. The sets 35 and 36 can each consist of tracks 10 that are essentially parallel to one another. However, it can also be provided that the tracks 10 of a set are not aligned parallel to one another or are only partially parallel to one another. The sets 35 and 36 can be aligned orthogonally or at an angle to one another.

[0222] As shown in Fig. 44, the set 35 can have vertical paths and the set 36 can have horizontal paths. Furthermore, it can be provided that a grid 13 is generated by a continuous path, for example, running in a meandering manner and generating a grid 38.

[0223] As shown in Fig. 45, the paths 10 of the sets 35, 36 can have an angle of inclination to one another that deviates from 90°. Using one or more paths 10, one or more intersection points 12 can be created.

[0224] With the help of one or more tracks 10, a roughening laser beam

[0225] 8 are guided along the one or more tracks 10, whereby one or more grooves 9 are produced. One or more grooves

[0226] 9 can have parallel sections which have a track spacing 14.

[0227] Fig. 44 and 45 serve to show different courses of paths

[0228] 10 and various grids 13. These exemplary embodiments are therefore not to be understood as limiting, neither with regard to the specific embodiments, their dimensions shown, nor the scale shown.

[0229] Fig. 46, 47, 48 and 49 show various images of roughened component surfaces 1. These images were created by cutting through the first component 2 and photographing the resulting cross-section of the roughening.

[0230] Fig . 50 , 51 and 52 show photographs of roughened

[0231] Component surfaces 1, wherein Fig. 50 shows a perspective view, Fig. 51 a cross-sectional view and Fig. 52 a plan view of the roughened component surface 1. In Figs. 51 and 52, the light areas show the material of the first component 2 and the dark areas show empty volumes which were created by the roughening process.

[0232] Fig. 52A and 52B each show perspective views of roughened component surfaces 2 such as Fig. 50. In contrast to Fig. 50, Fig. 52A and Fig. 52B show very large undercuts 11. Such an undercut 11 can be formed so large that either a projection over a groove 9 or even a bridge over a groove 9 is created. In Fig. 52B, individual regions can be seen which have such projections and bridges. These regions can be seen particularly in the rear half of the roughened component surface 2 in Fig. 52B. In Fig. 52A, projections and bridges can be seen distributed over the entire roughened component surface 2.

[0233] In a preferred embodiment, it can be provided that the roughening laser 7 produces at least one groove 9 with at least one undercut 11, wherein the at least one undercut 11 forms a projection or a bridge over the groove 9.

[0234] Fig. 53 shows a schematic representation of a joining process.

[0235] The joining process can be done by laser joining, as shown in Fig. 53.

[0236] When joining, as shown in Fig. 53, a first component 2, preferably a frame part 3, can be joined to a second component 5, preferably a water tank component 6, via a roughened component surface 1.

[0237] During joining, it can be provided that a first component 2, preferably a frame part 3, can at least partially absorb a joining laser beam 23 and a second component 5, preferably a spirit level component 6, can be at least partially permeable to a joining laser beam 23. In this way, with the first component and second component arranged next to one another, preferably the frame part 3 and spirit level component 6 arranged next to one another, a joining laser beam 23 can pass through the second component 5, strike the component surface 1 of the first component 2 on an impact surface and be at least partially absorbed there. As a result of the temperature increase, the second component can melt and / or soften at least briefly and / or locally.In the case of a roughened component surface 1 of the first component 1, the first component 2 and the second component 5 can be joined by the melted and / or softened material of the second component entering the roughened component surface and producing a force-fitting, form-fitting and / or material-fitting connection.

[0238] It can be provided that a contact pressure 25, as shown in Fig. 53, holds the two joining partners together until joining. Between the two joining partners there is a boundary layer 21 which, before joining, runs essentially completely along the component surface 1 and, after joining, essentially along the component surface and the profiles of the existing grooves 9.

[0239] A joining laser 22 can generate one or more joining laser beams 23, wherein one or more joining laser beams 23 run straight and directly to and through the second component, preferably a water tank component 6, and are largely absorbed by the first component 2, preferably the frame part 3, at the component surface 1.

[0240] It is conceivable that the joining laser beam 23 is deflected once or several times via a mirror 24 before the joining laser beam 23 passes to and through the second component 5, preferably a water tank component 6, and then strikes the component surface 1.

[0241] It can be provided that a joining laser beam 23 runs into a groove 9 and / or into an intersection pocket of one or more intersecting grooves 9, which is arranged on the component surface, and is reflected several times within the groove 9 and / or within the intersection pocket of one or more intersecting grooves 9. This has the advantage that, above all, the groove and / or the intersection pocket itself can be heated locally and / or quickly. In this way, a particularly rapid, gentle and / or complete filling of the groove 9 and / or the intersection pocket with molten and / or softened material of the second component 5 can be achieved, preferably as a result of heat transfer from the first component 2 to the second component 3 and / or as a result of heating of the second component 5 by the joining laser beam 23, preferably a spirit level component 6.

[0242] It may be intended that the joining is done at specific points or over a large area.

[0243] Fig. 54 shows a schematic sectional view of a first component 2 with two grooves 9.

[0244] As shown in Fig. 54, both grooves 9 have a groove depth 15, a groove opening width 16 and a maximum groove width 17 located within the first component 2, preferably the frame part 3.

[0245] Due to the maximum groove width 17 , which is greater than the groove opening width 16 , an undercut 11 is created on two sides of the groove 9 .

[0246] The grooves 9 are spaced apart by a distance corresponding to the path distance 14 of the roughening laser beam 8 that created the grooves 9. The path distance 14 and the distance between two grooves 9 can be measured directly on the component surface 1, starting from the center axis of the created grooves 9. Figs. 55 to 57 show various photographs of a roughening position 31 and a joining position 20 of a spirit level 4 at different scales.

[0247] In Fig. 55, a spirit level 26 can be seen joined to a frame part 3 of a spirit level. This represents a direct connection between the spirit level 26 and the frame part 3.

[0248] As can be seen in Fig. 56, the joining position 20 can at least partially overlap with the roughening position 31.

[0249] In a preferred embodiment, it can be provided that the joining position 20 is congruent with the roughening position 31 or the joining position 20 can be at least partially overlapping with the roughening position 31.

[0250] In Fig. 55 and Fig. 57 it can be seen that a layer of a joining aid is provided on the roughening position 31 and / or the joining position 20.

[0251] In Fig. 57, a grid 13 of the roughened component surface 1 can be seen, on which the spirit level 26 is joined to the first component 2, specifically the frame part 3, via the joining aid.

[0252] Fig. 58, 59 and 60 show various microscopic images of interfaces between a spirit level component 6 and a frame part 3 of a spirit level 4. Key to the reference numbers:

[0253] Component surface 32 Suspension sleeve first component 33 Bubble level cover

[0254] Frame part 34 cutout

[0255] Spirit level 35 first set of tracks second component 36 second set of tracks

[0256] Spirit level component 37 grid of individual grooves

[0257] On rau-Laser 38 grids of continuous

[0258] On rough laser beam groove

[0259] Groove 39 gas cloud

[0260] Train

[0261] Hint er schnitt 101 Inserting / Joining

[0262] Intersection point 102 Fügen

[0263] Grid 103 Roughen

[0264] Track spacing 104 Thermal joining

[0265] Groove depth 105 Adjust

[0266] Slot opening width 106 Hold maximum slot width

[0267] Schmel ze

[0268] Measuring area

[0269] Joining position

[0270] interface

[0271] Joining laser

[0272] Joining laser beam

[0273] Mirror

[0274] Contact pressure

[0275] dragon-fly

[0276] Version

[0277] Adjustment part

[0278] Light plates

[0279] End cap

[0280] On rough position

Claims

Patent claims 1. Method for roughening a component surface (1) of a first component (2), preferably a frame part (3) of a spirit level (4), preferably with a spirit level component (6), wherein the roughening of the component surface (1) of the first component (2), in particular of the frame part (3) of the spirit level (4), is carried out by means of a roughening laser (7), characterized in that a roughening laser beam (8) travels over the component surface (2) of the first component (2) at least once along at least one path (10) to produce at least one groove (9).

2. Method according to claim 1, characterized in that - the roughening laser (7) produces at least one groove (9) with at least one undercut (11) and / or - the roughening laser (7) produces at least one crossing shaped pocket with at least one undercut (11) in at least one crossing point (12) on the component surface (1) of the first component (2), wherein the at least one crossing point (12) is produced by at least one self-crossing path (10) of the roughening laser beam (8) and / or by at least two mutually crossing paths (10) of the roughening laser beam (8).

3. Method according to claim 1 or 2, characterized in that the roughening laser beam (8) for generating a grid (13) from the at least one groove (9) travels over the component surface (1) of the first component (2) along at least one, preferably uninterrupted, path (10), preferably wherein the roughening laser beam (8) travels along at least one straight path section of the at least one path (10) and / or along at least one curved path section of the at least one path (10).

4. Method according to one of claims 1 to 3, characterized in that the roughening laser beam (8) for producing the at least one groove (9) passes over the component surface (1) of the first component (2) more than once, preferably more than twice or more than three times, along the same path (10), preferably in the same direction along the same path (10).

5. Method according to one of claims 1 to 4, characterized in that the roughening laser (7) is a CW laser, preferably wherein the roughening laser (7) is operated with a power of up to 3000 W, particularly preferably of up to 2000 W, very particularly preferably of up to 1500 W, and / or with a traversing speed of up to 70 m / s, particularly preferably of up to 50 m / s, very particularly preferably of up to 18 m / s.

6. Method according to one of claims 1 to 5, characterized in that the roughening laser (7) is controlled such that the roughening laser beam (8) is guided substantially perpendicularly onto the component surface (1) of the first component (2), in particular at an angle between 80° and 100° relative to the component surface (1) of the first component (2), and / or inclined onto the component surface (1) of the first component (2).

7. Method according to one of claims 1 to 6, characterized in that the roughening laser (7) creates a roughened microstructure and / or nanostructure on the Component surface (1) of the first component (2) is generated.

8. Method according to one of claims 1 to 7, characterized in that for producing the at least one groove (9) on the component surface (1) of the first component (2), the roughening laser beam (8) is controlled along the at least one path (10) in such a way that - at least partially mutually corresponding, preferably parallel, track sections of the at least one track (10) of the at least one groove (9) are produced and / or - at least partially mutually corresponding, preferably parallel, track sections of at least two grooves (9) are produced, wherein the track sections have a substantially constant track spacing (14) from one another of 50 pm to 300 pm, preferably of 100 pm to 200 pm, particularly preferably of approximately 180 pm.

9. Method according to one of claims 1 to 8, characterized in that the roughening laser (7) - a groove depth (15) of 10 pm to 1000 pm, preferably of 100 pm to 400 pm, particularly preferably about 230 pm, is produced along the at least one track (10) and / or - a groove opening width (16) extending substantially continuously along the at least one path (10) is produced on the component surface (1) of the first component (2) of 1 pm to 1000 pm, preferably of 10 pm to 100 pm, particularly preferably of approximately 40 pm, and / or - one along the at least one track (10) in the Essentially continuous maximum groove width (17) below the component surface (1) of the first component (2) of 3 pm to 2000 pm, preferably of 30 pm to 900 pm, particularly preferably from about 60 pm, and / or - at least one undercut (11) of 1 pm to 500 pm, preferably of 10 pm to 400 pm, particularly preferably of 10 pm to 300 pm, is produced, which undercut is substantially continuous along the at least one path (1).

10. Method according to one of claims 2 to 9, characterized in that the roughening laser (7) - a crossing shape pocket depth of 10 pm up to 1000 pm, preferably from 100 pm up to 400 pm, is created and / or - a cross-shaped pocket opening width on the Component surface (1) of the first component (2) of 1 pm to 1000 pm, preferably of about 40 pm, and / or - a maximum mold pocket width below the component surface (1) of the first component (2) of 3 pm to 2000 pm, preferably of about 60 pm, is produced and / or - a crossing shaped pocket undercut of 1 pm to 500 pm, preferably of 10 pm to 400 pm, particularly preferably of 10 pm to 300 pm, is produced.

11. Method for producing a spirit level (4), comprising at least one vial (26) and at least one frame part (3), wherein the spirit level (4) has a measuring surface (19), wherein the, preferably horizontal and / or vertical, spatial orientation of an object surface can be determined by applying the measuring surface (19) to the object surface, wherein at least the following method steps are provided: - Providing a joining position (20) on the at least one frame part (3), preferably by cleaning a Area of ​​the frame part (3) and / or by roughening according to a method according to one of claims 1 to 10 of an area of ​​the frame part (3), - positioning a spirit level component (6) at the joining position (20) of the at least one frame part (3), - Joining the spirit level component (6) to the at least one frame part (3), characterized in that thermal joining is used to join the spirit level component (6) to the at least one frame part (3).

12. Method according to claim 11, characterized in that at least the following method steps are provided, preferably after positioning: - Adjusting the spirit level component (6) at the joining position (20) of the at least one frame part (3) relative to the at least one measuring surface (19), - Holding the spirit level component (6) in the adjusted position relative to at least one measuring surface (19), - Thermally joining the spirit level component (6) to the at least one frame part (3) in the adjusted position relative to the at least one measuring surface (19), wherein the adjustment and / or holding of the spirit level component (6) at the joining position (20) of the at least one frame part (3) is carried out by an adjustment device and / or by a holding device.

13. Method according to one of claims 11 or 12, characterized in that at least at one interface (21) between the at least one frame part (3) and the spirit level component (6) for the thermal joining, the at least one frame part (3) and / or the Spirit level component (6) is heated at least briefly at least to the heat distortion temperature, softening temperature, glass transition temperature and / or melting temperature and / or to a temperature below the decomposition temperature.

14. Method according to one of claims 11 to 13, characterized in that before the thermal joining, the at least one frame part (3) and / or the spirit level component (6) is preheated at least at an interface (21) between the at least one frame part (3) and the spirit level component (6) to a temperature below the heat distortion temperature, softening temperature, glass transition temperature and / or melting temperature, preferably with infrared radiation.

15. Method according to one of claims 11 to 14, characterized in that as thermal joining a laser joining, an induction joining, an infrared joining and / or a Ultrasonic joining is used.

16. Method according to one of claims 11 to 15, characterized in that laser joining is used as thermal joining, wherein - the parameters of a joining laser (22) for laser joining are adapted to the nature of the joining position (20), preferably roughened according to one of claims 1 to 10, and / or - a CW laser is used and / or - the laser joining is carried out selectively, preferably with a moving joining laser beam, and / or - the laser joining is carried out over a large area.

17. Method according to one of claims 11 to 16, characterized in that the thermal joining is carried out by means of welding, preferably by means of laser welding, particularly preferably by means of laser transmission welding.

18. Method according to one of claims 11 to 17, characterized in that the thermal joining is carried out with a joining laser (22), preferably by Laser transmission welding, where - a joining laser beam (23) is guided through the spirit level component (6) before striking the at least one frame part (3), and / or - a joining laser beam (23) is guided parallel, orthogonal and / or inclined to the measuring surface (19) and / or - a joining laser beam (23) is guided orthogonally or inclined onto an impact surface and / or - a joining laser beam (23) is guided onto an impact surface of the at least one frame part (3), wherein the impact surface is aligned parallel, orthogonal or inclined to the measuring surface (19), and / or - a joining laser beam (23) is guided through a hollow volume within the at least one frame part (3), and / or - a joining laser beam (23) is deflected at least once by a mirror (24) and / or - the joining laser (22) is operated with a laser power of 100 W up to 3000 W, preferably from 500 W up to 2000 W, particularly preferably about 1200 W.

19. Method according to one of claims 11 to 18, characterized in that the thermal joining is carried out with a Contact pressure between the spirit level component (6) and the at least one frame part (3) of at least 2 bar, preferably at least 3 bar, particularly preferably at least 5 bar, occurs.

20. Method according to one of claims 11 to 19, characterized in that the thermal joining is carried out with a contact pressure (25), wherein a clamping device and / or a vacuum device exerts the contact pressure (25) on the spirit level component (6) and / or on the at least one frame part (3).

21. Method according to one of claims 11 to 20, characterized in that a joining aid is provided, wherein the joining aid supports the thermal joining by properties relevant for the thermal joining, in particular adsorption properties, wherein the joining aid is arranged on and / or in the at least one frame part (20) and / or the spirit level component (6) before the thermal joining, preferably manually and / or automatically.

22. Method according to one of claims 11 to 21, characterized in that as a spirit level component (6) - at least one spirit level (26) and / or - at least one socket (27) and / or - at least one adjusting part (28) and / or - at least one connecting part and / or - at least one foil and / or - at least one handle and / or - at least one end cap (30) and / or - at least one further frame part and / or - at least one electrical module, preferably with at least one operating element and at least one output device, and / or - at least one spirit level assembly (31) is used.

23. Method according to one of claims 11 to 22, characterized in that two or more vials (26), preferably at least one horizontal vial and at least one vertical vial, are particularly preferably joined to the at least one frame part (3).

24. Method according to one of claims 11 to 23, characterized in that in the case of a spirit level (4) which has at least one frame part (6), at least one first spirit level component (6), preferably a vial (26), and at least one second spirit level component (6), preferably a socket (27), the production of the spirit level (4) is carried out indirectly, wherein in the indirect production of the spirit level (4) - the at least one first spirit level component (6) is first joined, preferably glued, to the at least one second spirit level component (6) and then the structure of the at least one first spirit level component (6) and the at least one second spirit level component (6) is thermally joined to the at least one frame part (3), or - the at least one second spirit level component (6) is first thermally joined to the at least one frame part (3) and then the structure of the frame part (3) and the at least one second spirit level component (6) is joined to the at least one first spirit level component (6) is joined, preferably glued.

25. Method according to one of claims 11 to 23, characterized in that in the case of a spirit level (4) which has at least one frame part (3) and at least one vial (26), the production of the spirit level (4) takes place directly, wherein in the direct production of the Spirit level (4) in which at least one spirit level (26) is thermally joined directly to the frame part (3).

26. Method according to one of claims 11 to 25, characterized in that the connection between the spirit level component (6) and the at least one frame part (3) as a result of the thermal joining - has a compressive strength according to DIN 50106 to withstand a compressive force between 250 N and 2000 N, preferably between 300 N and 1500 N, at a pre-load of 2 N and a test speed of 10 mm / min and / or - has a tensile strength in accordance with DIN EN 205 to withstand a tensile force between 250 N and 2000 N, with a preload of 2 N and a test speed of 10 mm / min.

27. Method according to one of claims 1 to 26, characterized in that the first component (2) and / or the at least one frame part (3) consists at least partially of metal, preferably of an aluminum alloy, and / or at least partially of a composite material, preferably a reinforced composite material, particularly preferably of a glass fiber reinforced composite material, and / or at least partially of a plastic.

28. Method according to one of claims 1 to 27, characterized in that the second component (5) and / or the spirit level component (6) is / are made at least partially of plastic, preferably at least partially of cellulose acetate butyrate (CAB), polymethyl methacrylate (PMMA), methyl methacrylate-acrylonitrile-butadiene-styrene (MABS), Acrylonitrile butadiene styrene (ABS), polycarbonate (PC), Polyethylene (PE), polyvinyl chloride (PVC), polyamide (PA), polyoxymethylene (POM) and / or polypropylene (PP).

29. Method according to one of claims 1 to 28, characterized in that the first component (2) and / or the at least one frame part (3) and / or the second component (5) and / or the spirit level component (6) has at least partially a coating, preferably at least partially an anodized coating and / or a powder coating.