METHOD FOR MANUFACTURING A CONDUCTOR BOARD WITH EMBEDDED CIRCUIT

Abstract

A method for manufacturing a printed circuit board with an embedded circuit is provided, which increases the proportion of flawless products by increasing the accuracy of the positional alignment between a circuit and electrode pads. It comprises a preparation step in which a film is prepared, a step in which two electrode pads are arranged on the film in a first direction, a step in which a circuit comprising a functional unit with an arbitrary pattern of thin metal wire, two wiring sections extending from its two ends, and two end sections extending from the wiring sections to the side facing away from the functional unit such that part of it overlaps the electrode pads and forms two position deviation absorption areas, is embedded in the film by means of an ultrasonic welding machine, and a step in which the electrode pads and the thin metal wire on them are joined, the ultrasonic welding machine being a sonotrode,which melts the contact surface between the foil and the thin metal wire by means of ultrasonic vibrations and embeds the thin metal wire in the foil, and has the thin metal wire running through the interior of the same and being continuously drawn out of its head end, wherein the positional deviation absorption areas are formed at the end sections, which are curved, and each have a width that absorbs a positional deviation between the electrode pads and the circuit in the first direction.

Description

Technical field

[0001] The present invention relates to a method for manufacturing a printed circuit board with an embedded circuit. General state of the art

[0002] Among other things, a foil heating device is known in which a single thin metal wire is embedded in a foil in an arbitrary pattern (see, for example, patent document 1). Referring to Fig. 10 such a foil heating device 100 comprises a foil 200, a square first electrode pad 500 and a second electrode pad 600, which are spaced apart from each other along a Y-direction on a circumferential edge section of the foil 200, and parallel to each other, and a circuit 400 consisting of a single thin metal wire 300 embedded in the foil 200.

[0003] The circuit 400 comprises a heating unit 450 with an arbitrary pattern, a first wiring section 430 and a second wiring section 440 extending from the two ends of the heating unit 450, and a first end section 410 and a second end section 420 extending from the first wiring section 430 and the second wiring section 440, respectively, to the side facing away from the heating unit 450 (+X direction in the view), and superimposing the first electrode pad 500 and the second electrode pad 600, respectively. The circuit 400 is embedded by melting the contact surface of the foil 200 to the thin metal wire 300 by applying ultrasonic vibrations using an ultrasonic welding machine.The embedding can, for example, be carried out in the sequence from the first end section 410 via the first wiring section 430, the heating unit 450, the second wiring section 440 and the second end section 420.

[0004] The first end section 410 and the second end section 420 each span in the X direction over the first electrode pad 500 and the second electrode pad 600. The upper surfaces of the first electrode pad 500 and the second electrode pad 600, and the upper surfaces of the first end section 410 and the second end section 420 that are in contact with the thin metal wire 300, are electrically connected. When a voltage is applied to the first electrode pad 500 and the second electrode pad 600, current flows in the circuit 400, causing the heating unit 450 to generate heat. State-of-the-art documents, patent documents

[0005] Patent document 1: JP 2022-066706 A Brief description of the invention Task of the invention

[0006] In a typical method for manufacturing the foil heating device 100, the electrode pads 500 and 600 are first arranged on the foil 200. A clamping device (not shown) is then applied to the corners of the foil 200, and the foil is inserted into it. Subsequently, the thin metal wire 300 is embedded in the foil 200 such that the first end section 410 and the second end section 420 overlap the electrode pads 500 and 600. Since arranging the electrode pads 500 and 600 and embedding the thin metal wire 300 are separate steps, the following positional deviations can occur: (1) a positional deviation of the electrode pads, (2) a positional deviation of the thin metal wire, and (3) an embedding positional deviation of the electrode pads and the thin metal wire. If, in this manufacturing process, the arrangement positions of the electrode pads 500, 600 in the +Y direction of Fig. 10(a) deviate, the embedding position of the thin metal wire 300 in the -Y direction deviates from Fig. 10(a) ab. In the prior art manufacturing process, the problem is that, due to the difficult positional coordination between the electrode pads 500, 600 and the circuit 400, it is hardly possible to increase the proportion of flawless products.

[0007] The present invention was made to solve this problem, and one of its objectives is to provide a method for manufacturing a printed circuit board with an embedded circuit, with which an increase in the proportion of flawless products can be achieved by increasing the accuracy of the positional alignment between the circuit and the electrode pads. Means of solving the task

[0008] A first invention for fulfilling the above-mentioned problem is a method for manufacturing a printed circuit board with an embedded circuit, comprising a preparation step in which a film is prepared, an arrangement step in which a first electrode pad and a second electrode pad are arranged parallel to each other at a first distance from each other in a first direction on a circumferential edge section of a first principal surface of the film, a circuit formation step in which a circuit comprising a functional unit arranged on the first principal surface with an arbitrary pattern formed from a thin metal wire, a first wiring section extending from one of the two ends of the functional unit, a second wiring section extending from the other of the two ends of the functional unit, and a first end section forming a first position deviation absorption region, and a second end section,which forms a second positional deviation absorption region extending from the first wiring section and second wiring section, respectively, to the side facing away from the functional unit, and of which a portion overlaps the first electrode pad and the second electrode pad, and the functional unit, the first wiring section and second wiring section, and a portion of the first end section and second end section that does not overlap the first electrode pad and the second electrode pad, are formed by means of an ultrasonic welding machine embedded in the first main surface, and a connection step in which the first electrode pad and second electrode pad and the thin metal wire located on the first electrode pad and second electrode pad are each electrically connected, the ultrasonic welding machine comprising a sonotrode,which melts the contact surface between the foil and the thin metal wire by applying ultrasonic vibrations and embeds the thin metal wire in the first main surface of the foil, and has the thin metal wire that runs through the interior of the sonotrode and is continuously pulled out of the head end of the sonotrode onto the first main surface of the foil, where the first Position deviation absorption area and second position deviation absorption area are formed at the first end section and second end section, which are curved and each have a width that absorbs a position deviation between the first electrode pad and second electrode pad and the circuit in the first direction. According to this manufacturing process, the first and second end sections are each curved and have a width that absorbs positional deviations of the electrode pads and the circuit in the first direction, even when there is a relative deviation in the embedding position of the first and second electrode pads and of the first and second end sections in the first direction. Therefore, the first and second end sections each have a portion that overlaps the first and second electrode pads. Consequently, since the accuracy of the positional alignment between the electrode pads and the circuit increases, a higher proportion of flawless products can be achieved.

[0009] A second invention is a method for manufacturing a printed circuit board with an embedded circuit, wherein in the first invention the curved shape, when viewed from above, is a zigzag shape or a U-shape. Effect of the invention

[0010] According to the method for manufacturing a printed circuit board with embedded circuitry, the accuracy of the positional alignment between the circuitry and the electrode pads can be increased, and an increase in the proportion of flawless products can be achieved. Brief description of the characters Fig. Figure 1 is a schematic perspective view illustrating an embodiment of the method for manufacturing a printed circuit board with an embedded circuit. Fig. Figure 2 is an enlarged partial view illustrating an example of a first end section and a second end section. Fig. Figure 3 is an enlarged view illustrating a state of positional deviation of an electrode pad in the +X direction. Fig. Figure 4 is an enlarged partial view illustrating another example of the first end section and the second end section. Fig. Figure 5 is an enlarged view illustrating a state of positional deviation of an electrode pad in the +X direction. Fig. 6 is an enlarged view showing a state opposite Fig. Figure 5 illustrates further positional deviation of the electrode pad in the +X direction. Fig. Figure 7 is an enlarged view illustrating a state of positional deviation of an electrode pad in the -X direction. Fig. Figure 8 is an enlarged view illustrating a state of positional deviation of an electrode pad of a foil heating device of the prior art in the +X direction. Fig. Figure 9 is an enlarged view illustrating a state of positional deviation of an electrode pad of the foil heating device of the prior art in the -X direction. Fig. Figure 10(a) is a schematic top view illustrating the foil heating device of the prior art. Fig. 10(b) is a sectional view of AA from Fig. 10(a). Embodiments of the invention (overview of the printed circuit board with embedded circuit)

[0011] With reference to Fig. 1(f) comprises a printed circuit board 1 with an embedded circuit, a film 2, a circuit 4 consisting of a thin metal wire 3 arranged on a first principal surface 2a of the film 2, a first electrode pad 5, and a second electrode pad 6. The circuit 4 has a functional unit 45, a first wiring section 43, a second wiring section 44, a first end section 41, and a second end section 42. The functional unit 45 has an arbitrary pattern. The first wiring section 43 extends from one side 45a of the two ends of the functional unit 45. The second wiring section 44 extends from the other side 45b of the two ends of the functional unit 45. The first end section 41 extends from the first wiring section 43 to the side facing away from the functional unit 45 (-Y direction) and overlaps the first electrode pad 5.The second end section 42 extends from the second wiring section 44 to the side facing away from the functional unit 45 (-Y direction) and overlaps the second electrode pad 6.

[0012] In the present embodiment, the first end section 41 and the second end section 42 are zigzag-shaped when viewed from above (example of the curved shape).

[0013] The functional unit 45, the first wiring section 43, and the second wiring section 44 are embedded in the first main area 2a of the foil 2. The portion of the first end section 41 and the second end section 42 that does not overlap the electrode pads 5 and 6 is not embedded in the first main area 2a, while the remaining portions are. In other words, the thin metal wire 3 located on the electrode pads 5 and 6 is not embedded in the first main area 2a, while the thin metal wire 3 not located on the electrode pads 5 and 6 is embedded.

[0014] In the present embodiment, the functional unit 45 is a heat-generating section, and the printed circuit board 1 with embedded circuitry is a foil heating device. For example, by applying a positive voltage to the first electrode pad 5 and a negative voltage to the second electrode pad 6, current flows in the circuit 4, which consists of the thin metal wire 3, causing the functional unit 45 to generate heat. The functional unit 45 has two ends, 45a and 45b, which are connected to the first wiring section 43 and the second wiring section 44, respectively, thus forming a loop-like pattern. More precisely, the functional unit 45 has a pattern that extends from the connection section 45a to the first wiring section 43 in the +X direction, then in the +Y direction, in the -X direction, in the -Y direction, and then in the +X direction, finally reaching the connection section 45b to the second wiring section 44.In this way, the functional unit 45 has the connection sections 45a, 45b to the first wiring section 43 and second wiring section 44 and has an arbitrary pattern extending from the connection sections 45a, 45b in the XY plane.

[0015] The film 2 can have any shape and is rectangular in the present embodiment. A transparent, opaque, or colored transparent film can be used for the film 2. The material of the film 2 can be a thermoplastic such as ethylene, propylene, polyolefin, thermoplastic polyester, polyamide, polyvinyl chloride, polycarbonate, or ABS. Two or more of these materials can be used. An inorganic fine powder or an organic filler, a dispersant, an antioxidant, a compatibilizing agent, a UV stabilizer, an antiblocking agent, an antistatic agent, or the like can be added to the film 2 as required. The thickness of the film 2 is, for example, 0.05 mm to 1 mm.

[0016] For the thin metal wire 3, an electrically conductive material such as copper, iron, gold, copper-nickel, nickel-chromium, iron-nickel-chromium, or the like can be used. From the perspectives of electrical resistance, durability, and cost, copper or a copper alloy in which one or more elements such as zinc, lead, tin, aluminum, nickel, beryllium, zirconium, or the like are combined with the copper is preferred. The diameter of the thin metal wire 3 is, for example, 0.01 mm to 0.5 mm. By using a diameter as small as possible, for example, 0.01 mm to 0.2 mm, the thin metal wire 3 can be made virtually invisible.

[0017] The circuit 4 can be formed from a conductor wire consisting of the thin metal wire 3 and an insulating sheath. The insulating sheath is an insulating plastic, and it can be, for example, polyester, polyethylene, polyurethane, polyvinyl chloride, polyamide, polyimide, polyesterimide, polyamideimide, a fluoropolymer, or the like. The diameter of the conductor wire is, for example, 0.05 mm–0.3 mm.

[0018] For electrode pads 5 and 6, an electrically conductive material such as copper, phosphor bronze, brass, a Corson alloy, nickel, molybdenum, or the like can be used. These materials can serve as a substrate, which can be metallized with nickel, tin, gold, silver, copper, or the like. The size of electrode pads 5 and 6 is, for example, 5 mm × 10 mm. The thickness is, for example, 0.1 mm.

[0019] In the present embodiment, the electrode pads 5, 6 are rectangular, but are not limited to this. For example, they can have a polygonal shape other than rectangular, a circular shape, an oval shape, or an L-shape. (Method for manufacturing the printed circuit board with embedded circuit)

[0020] With reference to Fig. 1 A method for manufacturing such a printed circuit board 1 with an embedded circuit is described.

[0021] The process for manufacturing the printed circuit board 1 with embedded circuitry comprises a preparation step (not shown) in which the sheet 2 is prepared, an assembly step ( Fig. 1(a)), in which the first electrode pad 5 and the second electrode pad 6 are arranged on the circumferential edge section of the first main surface 2a of the film 2, a circuit formation step ( Fig. 1(b)-1(e)), in which the circuit 4 is formed using an ultrasonic welding machine 7, and a connection step ( Fig. 1(f)), in which the first end section 41 and the second end section 42 of the circuit 4 are electrically connected to the electrode pads 5, 6 and .

[0022] In the preparation step, the film 2 can be fixed to a table (not shown). A clamping device (not shown) can be used to facilitate positioning of the film 2. In the assembly step, the first electrode pad 5 and the second electrode pad 6 are positioned on the circumferential edge section of the first main surface 2a of the film 2. In other words, they are arranged side by side in the X-direction along a side parallel to the X-direction (first direction) of the film 2. The two electrode pads 5 and 6 are rectangular and are arranged parallel to each other, spaced apart in the X-direction. The two electrode pads 5 and 6 each form connection sections of the printed circuit board 1 with embedded circuitry. The two electrode pads 5 and 6 can be fixed to the first main surface 2a, for example, using adhesive or the like.

[0023] With reference to Fig. 1(b) The ultrasonic welding machine 7 used in the circuit formation step comprises an oscillator (not shown) that generates ultrasonic vibrations, a sonotrode 71 to which the ultrasonic vibrations are transmitted from the oscillator, and the thin metal wire 3. By applying the ultrasonic vibrations, the sonotrode 71 can melt the contact surface of the foil 2 with the thin metal wire 3 and thus embed the thin metal wire 3 in the first main surface 2a of the foil 2. The thin metal wire 3 runs through the interior of the sonotrode 71 and is continuously drawn out of a head end 71a of the sonotrode 71 onto the first main surface 2a of the foil 2.

[0024] In the circuit formation step, as in Fig. As shown in Figure 1(b), the thin metal wire 3 is drawn out of the sonotrode 71 by a defined length and thereby embedded in the first main surface 2a of the foil 2, spanning the first electrode pad 5 in a zigzag pattern and forming the first end section 41. The zigzag-shaped section is embedded in the first main surface 2a, while the thin metal wire 3 superimposed on the first electrode pad 5 is not embedded in the first main surface 2a, but comes into contact with the upper surface of the first electrode pad 5.

[0025] As in Fig. As shown in Figure 1(c), the thin metal wire 3 is then pulled out from the embedding end of the first end section 41 by a defined length in the +Y direction and embedded in the first principal surface 2a, thus forming the first wiring section 43. Next, the thin metal wire 3 is pulled out from the embedding end 43a of the first wiring section 43 by a defined length and embedded in the first principal surface 2a in an arbitrary pattern extending in the XY plane, thus forming the functional unit 45. The embedding end 43a of the first wiring section 43 is the start end of the functional unit 45. In other words, the end end 43a of the first wiring section 43 forms one side 45a of the two ends of the functional unit 45 (see Figure 1(c)). Fig. 1(d)).

[0026] Next, the thin metal wire 3, as shown in Fig. 1(d) shows that the functional unit 45 is withdrawn from the sonotrode 71 to a defined length and is embedded in the first main surface 2a, extending from the end 45b of the functional unit 45 in the -Y direction, thus forming the second wiring section 44. The end 45b of the functional unit 45 is the starting end of the second wiring section 44 and forms the other side of the two ends of the functional unit 45.

[0027] Next, the thin metal wire 3, as shown in Fig. As shown in Figure 1(e), the second end section 42 is withdrawn by a defined length from the embedding termination end 44a of the second wiring section 44 and thereby embedded in the first main surface 2a. It spans the second electrode pad 6 in a zigzag pattern, thus forming the second end section 42. The zigzag-shaped section is embedded in the first main surface 2a, while the thin metal wire 3 superimposed on the second electrode pad 6 is not embedded in the first main surface 2a but comes into contact with the upper surface of the second electrode pad 6. After the second end section 42 has been formed, the thin metal wire 3 is cut at the embedding termination end of the second end section 42. A knife or pliers, for example, can be used as a cutting method.

[0028] Finally, in the connecting step, as at point P in Fig. Figure 1(f) shows the two electrode pads 5, 6 and the thin metal wire 3 located on the two electrode pads 5, 6 (in contact with their upper surfaces) electrically connected. A known metal joining technique such as welding (resistance welding, ultrasonic welding, laser welding, or the like), soft soldering, hard soldering, or the like can be used for this connection. The electrode pads 5, 6 and the thin metal wire 3 can be electrically connected at several points.

[0029] In this way, the printed circuit board 1 with embedded circuitry can be obtained. (First embodiment of the position deviation absorption area)

[0030] With reference to Fig. 2. The first end section 41 and the second end section 42 each form a first position deviation absorption region 41a and a second position deviation absorption region 42a. The first position deviation absorption region 41a and the second position deviation absorption region 42a are the regions shown with dashed lines in the figures. Fig. Figure 2 shows a state in which there is no positional deviation between the first electrode pad 5 and the second electrode pad 6 and the first end section 41 and the second end section 42.

[0031] The first positional deviation absorption region 41a has a width W 41 and the second positional deviation absorption area 42a a width W 42 up. These latitudes W 41 , W 42The widths of the zigzag shape of the end sections 41, 42 are equal to and greater than the widths W5, W6 of the two electrode pads 5, 6. It is understood that the permissible deviation of the electrode pads 5, 6 in the X-direction is greater the larger the width W. 41 , W 42 the position deviation absorption areas 41a, 42a.

[0032] For example, if the width W5, W6 of electrode pads 5, 6 is 5 mm each and the distance S between electrode pads 5, 6 is 10 mm, then the width W 41 , W 42 each measure 15 mm.

[0033] Even if, as in Fig. As shown in Figure 3, if the position of the electrode pads 5, 6 deviates in the +X direction by, for example, d, the positional deviation of the electrode pads 5, 6 can be absorbed, since the positional deviation absorption areas 41a, 42a each have a width W 41 , W 42exhibiting a value greater than d. Thus, the positional deviation absorption regions 41a, 42a each have a width W. 41 , W 42 The end sections 41, 42 overlap the electrode pads 5, 6 even if the position of the electrode pads 5, 6 relative to the foil 2 deviates by d in the X-direction. Therefore, the positional deviation of the electrode pads 5, 6 does not need to be considered for the embedding position of the end sections 41, 42. Thus, it is sufficient if the end sections 41, 42 are embedded at the same position when manufacturing a printed circuit board 1 with an embedded circuit.

[0034] Since in this way a positional alignment between the end sections 41, 42 and the electrode pads 5, 6 is possible even without taking into account the positional deviation of the electrode pads 5, 6, the proportion of flawless products can be increased. (Second embodiment of the position deviation absorption area)

[0035] With reference to Fig. 4. The curved shape of the first end section 41 and the second end section 42 can be U-shaped when viewed from above. The first end section 41 and the second end section 42 each form a first position deviation absorption region 41a and a second position deviation absorption region 42a. Fig. Figure 4 shows a state in which there is no positional deviation between the first electrode pad 5 and the second electrode pad 6 and the first end section 41 and the second end section 42.

[0036] The first positional deviation absorption region 41a has a width W 41 and the second positional deviation absorption area 42a a width W 42 up. The latitudes W 41 , W 42are equal to the width of the U-shape of the end sections 41, 42 and each satisfies equations (1) and (2) below. Here, S5, S6 are the distances between two thin metal wires 3 that span the electrode pads 5, 6 in the Y direction. W41=(2×W3)+S5 W42=(2×W3)+S6

[0037] When the thin metal wire 3 and the electrode pads 5, 6 are ultrasonically welded, the respective width W can be 41 , W 42The first position deviation absorption region 41a and the second position deviation absorption region 42a are set equal to the widths W5 and W6 of the two electrode pads 5 and 6. When the thin metal wire 3 and the electrode pads 5 and 6 are soldered, the solder paste must be applied to both flanks of the thin metal wire 3 (in other words, the solder paste must be positioned so that the thin metal wire 3 is sandwiched between them), and the thin metal wire 3 must be fixed in place, which is why W5 (W6) > W 41 (W 42 ) applies.

[0038] The width (diameter) W3 and the distance S5, S6 of the thin metal wire 3 in relation to the width W5, W6 of the electrode pads 5, 6 are set to values ​​that each satisfy the following equations (3) and (4). W5=2×W3+S5 W6=2×W3+S6

[0039] Once the widths W5 and W6 of the electrode pads 5 and 6 and the width (diameter) W3 of the thin metal wire 3 have been determined, the distance S5 and S6 can be calculated using equations (3) and (4) above. For example, using electrode pads 5 and 6 with a width W5 (= width W6) of 5 mm and a thin metal wire 3 with a width (diameter) W3 of 0.5 mm, the distance S5 (= S6) is 5 - 1 = 4 mm.

[0040] By forming the first position deviation absorption region 41a and the second position deviation absorption region 42a in a U-shape while maintaining the distance S5, S6, this also applies in the case where, as in Fig. Figure 5 shows that the electrode pads 5 and 6 deviate in position by d (=W5 / 2=W6 / 2) in the +X direction. This is the section where the thin metal wire 3 and the electrode pads 5 and 6 overlap (the section where the thin metal wire 3 spans the electrode pads 5 and 6). Since the accuracy of the positional alignment between the electrode pads 5 and 6 and the end sections 41 and 42 increases, the proportion of flawless products can be increased.

[0041] Even if, as in Fig. 6 and Fig. As shown in Figure 7, where the electrode pads 5 and 6 each deviate in position by d+d / 2 in the +X direction, this is the part where the thin metal wire 3 and the electrode pads 5 and 6 overlap, as long as the shape of the first end section 41 and the second end section 42 satisfies equation (3) and (4), respectively. Fig. 6 and Fig. 7 A thin metal wire 3 overlaps an edge part of the electrode pads 5, 6. As shown from Fig. 6 and Fig. As can be seen from Figure 7, the permissible range of positional deviation of electrode pads 5 and 6 in the X-direction is d + d / 2 in each case. Since d = W5 / 2 (= W6 / 2) applies here, W5 / 2 + W5 / 4 = 3 W5 / 4 (= 3 W 6 / 4).

[0042] Referring to Fig. 8 and Fig. In contrast, the first end section 410 and the second end section 420 of a foil heating device 100 of the prior art are linear. Fig. 8 and Fig. 9. The position of electrode pads 500, 600 deviates in the X-direction, but there is a section where the thin metal wire 300 and the electrode pads 500, 600 overlap. The deviation of the electrode pads 500, 600 in Fig. 8 and Fig. 9 is half the width of the electrode pads 500, 600 (W 500 / 2, W 600 / 2). The permissible range of positional deviation of the electrode pads 500, 600 in the X-direction is therefore half the width of the electrode pads 500, 600 (W 500 / 2, W 600 / 2).

[0043] By changing the shape of the first end section 41 and the second end section 42 from the usual straight line to the U-shape satisfying equations (3) and (4) above, a permissible range for the positional deviation of the electrode pads 5, 6 in the X-direction is obtained that is 1.5 times greater. Since this facilitates the positional alignment between the first end section 41 and the second end section 42 and the electrode pads 5, 6, the proportion of flawless products can be increased.

[0044] In the two embodiments described above, the electrode pads 5, 6 differ in position, while the embedding position of the thin metal wire 3 does not. However, the manufacturing method of the present invention achieves the same effect as the embodiments described above if there is no positional deviation of the electrode pads 5, 6 and instead the embedding position of the thin metal wire 3 differs. Even if both the position of the electrode pads 5, 6 and the embedding position of the thin metal wire 3 differ, the manufacturing method of the present invention achieves the same effect as the embodiments described above. Explanation of reference symbols 1 printed circuit board with embedded circuit Slide 2 2a first main area 3 thin metal wires 4 circuit 41 first final section 41a first positional deviation absorption range 42 second final section 42a second positional deviation absorption range 43 first wiring section 44 second wiring section 45 Functional unit 5 first electrode pad 6 second electrode pad 7 Ultrasonic welding machine 71 Sonotrode 100 foil heating device 200 slides 300 thin metal wire 400 circuit 410 first final section 420 second final section 430 first wiring section 440 second wiring section 450 heating unit 500 first electrode pad 600 second electrode pad 700 adhesive layer QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2022-066706 A

[0005]

Claims

[1] Method for manufacturing a printed circuit board with an embedded circuit, comprising: a preparatory step in which a slide is prepared, an arrangement step in which a first electrode pad and a second electrode pad are arranged parallel to each other in a first direction, spaced apart from each other, on a first main surface of the film at a circumferential edge section, a circuit formation step comprising a circuit comprising a functional unit arranged on the first main surface with an arbitrary pattern formed from a thin metal wire, a first wiring section extending from one of the two ends of the functional unit, a second wiring section extending from the other of the two ends of the functional unit, a first end section forming a first position deviation absorption area, and a second end section forming a second position deviation absorption area, extending from the first wiring section and second wiring section respectively to the side facing away from the functional unit, each of which a portion overlaps the first electrode pad and the second electrode pad, and the functional unit,the first wiring section and second wiring section and a part of the first end section and second end section that does not overlap the first electrode pad and the second electrode pad, are formed embedded in the first main surface using an ultrasonic welding machine, and, a connection step in which the first electrode pad and second electrode pad and the thin metal wire located on the first electrode pad and second electrode pad are each electrically connected, wherein the ultrasonic welding machine comprises a sonotrode which melts the contact surface between the foil and the thin metal wire by applying ultrasonic vibrations and embeds the thin metal wire into the first main surface of the foil, and the thin metal wire which runs through the interior of the sonotrode and is continuously drawn out of the head end of the sonotrode onto the first main surface of the foil, wherein the first position deviation absorption area and second position deviation absorption area are formed at the first end section and second end section, which are curved, and each have a width that absorbs a position deviation between the first electrode pad and second electrode pad and the circuit in the first direction. [2] Method for manufacturing a printed circuit board with an embedded circuit according to claim 1, wherein the curved shape is a zigzag shape or a U-shape when viewed from above.

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