Automatic test equipment, test setup and method for testing with individual acquisition in a multiple operating mode and device with guided power supply connection structure

Abstract

Exemplary embodiments according to the invention include an automatic test equipment for testing a test object, wherein the automatic test equipment comprises a plurality of device power supplies, the device power supplies being configured to operate in a multiple operating mode. The automatic test equipment is configured to provide individual acquisition measurement results that are assigned to the individual device power supplies of a set of device power supplies when the individual device power supplies of the set of device power supplies are grouped.

Description

Technical field

[0001] Exemplary embodiments according to the invention include an automatic test equipment, a test arrangement and a method for testing with individual acquisition in a multiple operating mode.

[0002] Further embodiments according to the invention feature a device with a guided power supply connection structure.

[0003] Exemplary embodiments according to the invention relate to differential voltage detection for hotspots. Background of the invention

[0004] Device testing is an essential step in modern manufacturing processes to ensure compliance with quality standards and to optimize cost efficiency by eliminating further processing steps for faulty devices.

[0005] As the complexity of devices increases, testing becomes a challenging task, particularly to obtain differentiated information for device subsections, such as different cores and / or device interfaces.

[0006] Furthermore, a challenge lies in protecting test equipment, such as charging boards (e.g., mounts), from failing tests due to faulty devices. For example, a device might exhibit a significant power surge, leading to critical temperatures at certain points, such as interfaces, which could damage the test equipment.

[0007] Accordingly, a further challenge lies in the design of the respective devices so that these devices not only perform their intended task, but can also be tested efficiently.

[0008] With regard to the challenges discussed above, one objective of the exemplary embodiments is to create a concept for fixture testing that overcomes some or even all of the above problems and thus provides an improved compromise between the complexity of testing, the robustness and therefore safety of testing, especially for the test equipment, and the quality of testing, e.g., with regard to the test information that provides differentiated insights into fixture behavior and / or test behavior.

[0009] This is resolved by the subject matter of the independent claims. Further embodiments of the invention are defined by the subject matter of the dependent claims. Brief description of the invention

[0010] Exemplary embodiments according to the invention include an automatic test equipment for testing a test object, wherein the automatic test equipment has a plurality of device power supplies, wherein the device power supplies are configured to be operable in a multiple operating mode (e.g., to provide electrical power to a common power supply area, for example also referred to as a supply voltage area, in a parallel configuration; e.g., to provide approximately equal currents to a common power supply area when operating in a parallel configuration).

[0011] The automatic test equipment is configured to provide individual acquisition measurement results (e.g., individual measurement results indicating a voltage between a positive acquisition input and a negative acquisition input of the respective device power supplies; e.g., individual measurement results of a voltage at a respective positive acquisition input and / or at a respective negative acquisition input, e.g., between a PS and GS input, e.g., between a power acquisition and ground acquisition input) to the individual device power supplies of a set of power supply devices when the individual device power supplies of the set of device power supplies are grouped (e.g., grouped together, e.g.,grouped to jointly supply power to a common power supply area (e.g., configured to operate in multi-operation mode).

[0012] Thus, as an example, a set of device power supplies can be considered a "group" (e.g., a cluster, a set) of device power supplies in multi-operation mode, and therefore these power supplies can jointly supply power to the device under test. For example, each device power supply can be assigned to a specific power outlet, and in multi-operation mode, all power outlets of the device power supply in the set, group, or cluster of device power supplies can be switched on together (and, for example, the respective outlets can be coupled to provide power to a common supply area, supply voltage range, or power range for the device under test).In grouped mode, the set of device power supplies can thus act as a "large" device power supply (e.g., large compared to the respective individual power supplies).

[0013] Nevertheless, individual device power supplies of such a set or group can be assigned to provide power to individual sections, e.g. functional subsections such as individual cores of the test object.

[0014] Furthermore, in multi-supply mode, one of the power device supplies can act as a master, receiving a first setpoint (e.g., a voltage) and providing a second setpoint (e.g., a current value) to one or more power device supplies acting as slaves. This ensures a balanced current distribution to the device under test (DUT) across the different power device power supplies. Balanced can be defined as the provision of substantially equal currents on the respective force signal lines from each power device supply to the respective section of the DUT (e.g., current from POGOA to coreA is substantially equal to current from POGOB to coreB, which is substantially equal to current from POGOC to coreC).

[0015] The inventors have recognized that providing individual acquisition measurement results, which are assigned to the individual device power supplies of a set of device power supplies, in a multiple operating mode enables the improvement of testing the test object.

[0016] In particular, differentiated information regarding different sections of the test object can be provided. It has been found that individual data acquisition, e.g., per device power supply, enables efficient and accurate monitoring of the test object's power dissipation.

[0017] Furthermore, information about differences in the power supplied to the device under test can be obtained between device power supplies. In particular, it was found that power supply balancing can be monitored, which makes it possible to prevent even spatially limited hotspots (e.g., those occurring only in a specific section) on the device under test.

[0018] Furthermore, the inventors have discovered that, by assigning individual measurements to individual device power supplies in group mode, in contrast to the idea of ​​grouping device power supplies that, for example, act as a "large" (more powerful than a single) device power supply, measurements performed on an individual basis, e.g., as if the power supplies were not grouped, e.g., by implementing a non-grouped device power supply measurement strategy, it is possible to power a test object that has a plurality of sections that individually deliver power, e.g., act individually, and thus have a considerable power consumption, while still allowing monitoring of device-internal power shifts, as well as capturing only section problems by directing the measurement to individual device sections or parts.

[0019] This allows temperature hotspots to be prevented with a fine spatial granularity. In particular, temperature hotspots can be prevented not only on the device itself, but also at interfaces between the device and the test equipment, thus preventing damage. Based on individual measurements, power supply interfaces can be monitored. For example, damage to a charging board can be prevented by detecting a faulty section, such as a faulty core of a test object or a faulty interface (e.g., a failure of several pins of an interface, leading to increased interface resistance).

[0020] For example, the overall power dissipation of the device may be measured to be within acceptable limits, but individual measurements may indicate dangerous power dissipation in a section of the device or at an interface between the charging board and the device. For instance, one device power supply in the group may provide a very high amount of power, while the other device power supplies in the group provide lower amounts. This might make the overall input power to the device under test appear normal, but could, for example, lead to the melting of an interface in the faulty device section receiving the very high power. Exemplary implementations allow for the detection of such behavior and thus the prevention of such damage to the device and the test equipment.

[0021] According to exemplary embodiments of the invention, each of the device power supplies of the set of device power supplies has at least two sensing inputs (e.g., a positive voltage sensing input and a negative voltage sensing input; e.g., a power sensing input, e.g., PS, and a ground sensing input, e.g., GS; e.g., a power sensing input and an additional sensing input, e.g., ES), and each of the device power supplies of the set of device power supplies is configured to measure a voltage between its at least two sensing inputs. Alternatively or additionally, each of the device power supplies of the set of device power supplies is configured to measure voltages at its at least two sensing inputs.Furthermore, such automatic test equipment is configured to provide one or more measured voltages for each device power supply of the set of device power supplies as individual acquisition measurement results when the individual device power supplies are grouped.

[0022] The inventors recognized that measuring voltage drops (e.g., between any two detection inputs, such as between the power supply and the DC supply) enables monitoring the power consumption of a given test object with fine spatial granularity. This is particularly advantageous for testing devices with multiple sections or cores, allowing even spatially confined hotspots to be detected.

[0023] Furthermore, voltages at detection inputs can be measured, e.g. not as voltage drop between respective detection inputs of a power supply, but as the voltages themselves, which are to be compared with corresponding voltage measurements of the other power supplies, e.g. to check within a respective power supply area or a voltage range whether power provision is balanced.

[0024] In general, individual measurement results can be provided, enabling a fine spatial granularity of the voltage and thus performance monitoring.

[0025] According to exemplary embodiments of the invention, the automatic test equipment is configured to provide the individual acquisition measurement results (e.g., individual measurement results representing voltages between corresponding acquisition inputs of a plurality of device power supplies that are grouped together, e.g., individual measurement results representing voltages at acquisition inputs of a plurality of device power supplies that are grouped together) assigned to the individual device power supplies of a set of device power supplies that are grouped together, for evaluation by a test program that is executed on the automatic test equipment, wherein the test program that is executed on the automatic test equipment can, for example, be provided by a user of the automatic test equipment.

[0026] This allows measurement results to be provided in a format suitable for further evaluation and processing, enabling time-critical (e.g., rapid, even responding to very rapid temperature spikes) device monitoring and the implementation of countermeasures to prevent damage. Furthermore, evaluation directly on the automated test equipment allows for rapid countermeasures if a malfunction, such as a temperature spike, is detected.

[0027] According to exemplary embodiments of the invention, the automatic test equipment is configured to provide the individual measurement results (e.g., individual measurement results representing voltages between corresponding measurement inputs of a plurality of device power supplies that are grouped; e.g., individual measurement results representing voltages at measurement inputs of a plurality of device power supplies that are grouped) assigned to the individual device power supplies of a set of device power supplies that are grouped together, in order to enable the detection of a deviation, e.g., a difference between voltage drops detected by different device power supplies of the set of device power supplies that are grouped (e.g., operated in a multiple operating mode) (e.g.,to enable the detection of a voltage deviation over a common supply voltage range) and / or to enable the detection of a deviation, e.g., difference, between voltages at corresponding detection inputs (e.g., at a corresponding positive voltage detection input or at corresponding negative voltage detection inputs) of a plurality of different device power supplies of the set of device power supplies that are grouped (e.g., operated in a multiple operating mode, e.g., to enable the detection of a voltage deviation over a common supply voltage range).

[0028] This can enable the achievement of highly efficient device performance monitoring with good spatial resolution.

[0029] According to exemplary embodiments of the invention, the automatic test equipment is configured to individually assess voltages (e.g., voltages VlocalA, VlocalB, VlocalC and / or voltages ExtdropA, ExtdropB, ExtdropC), for example between pairs of two detection inputs of a plurality of respective device power supplies of the set of device power supplies that are grouped together.

[0030] Optionally, such automated test equipment can be configured, for example, to assess voltages across different functional blocks (e.g., cores) of a single device under test that are coupled between the same pair of supply voltage ranges. As an example, such automated test equipment can be configured to individually assess voltages across a plurality of device contact structures that establish an electrical connection between a common device-external power supply area conductor structure associated with a particular power supply area (e.g., a power plane on a charging board) and one or more device-internal power supply area conductor structures associated with that particular power supply area.

[0031] As an example, such automatic test equipment can be configured to individually assess voltages to detect whether a voltage between two detection inputs from one of the device power supplies in the set of device power supplies exceeds a threshold; e.g., to provide a warning signal and / or to trigger a protective action (e.g., disabling one or more device power supplies or reducing a voltage and / or current from one or more device power supplies) in response to a detection that a voltage between two detection inputs from (one) of the device power supplies in the set of device power supplies exceeds a threshold.

[0032] According to exemplary embodiments of the invention, the automatic test equipment is configured to assess a deviation of two or more voltages (e.g., voltages VlocalA, VlocalB, VlocalC or voltages ExtdropA, ExtdropB, ExtdropC) between two sensing inputs of a plurality of respective, for example, different, device power supplies of the set of device power supplies that are grouped. As an example, such automatic test equipment can be configured to assess a difference between a maximum voltage of a plurality of voltages measured between two respective sensing inputs of a plurality of grouped device power supplies and a minimum voltage of a plurality of voltages measured between two respective sensing inputs of a plurality of grouped device power supplies.

[0033] As an example, such automatic test equipment can be configured to assess the deviation in order to detect whether the difference between the maximum voltage of a plurality of voltages measured between two respective sensing inputs of a plurality of grouped device power supplies and the minimum voltage of a plurality of voltages measured between the two respective sensing inputs ± a plurality of grouped device power supplies exceeds a threshold; e.g., to provide a warning signal and / or to trigger a protective action (e.g.,a deactivation of one or more device power supplies or a reduction of voltage and / or current from one or more device power supplies), responding to a detection that the difference between the maximum voltage s of a plurality of voltages measured between two respective detection inputs of a plurality of grouped device power supplies and the minimum voltage of a plurality of voltages measured between two respective detection inputs of a plurality of grouped device power supplies reaches or exceeds a threshold.

[0034] According to exemplary embodiments of the invention, the automatic test equipment is configured to individually assess voltages at sensing inputs of a plurality of respective device power supplies of the set of device power supplies that are grouped, e.g., to detect whether a voltage at a sensing input of one of the device power supplies of the set of device power supplies exceeds a threshold value, e.g., to provide a warning signal and / or to trigger a protective action (e.g.,a deactivation of one or more device power supplies or a reduction of voltage and / or current from one or more device power supplies), responding to a detection that a voltage at a detection input (of one) of the device power supplies of the set of device power supplies has reached or exceeded a threshold value.

[0035] According to exemplary embodiments of the invention, the automatic test equipment is configured to assess a deviation, e.g., a difference of two or more voltages at detection inputs of a plurality of respective device power supplies of the set of device power supplies that are grouped together.

[0036] As an example, such automatic test equipment can be configured to assess a difference between a maximum voltage of a plurality of voltages measured at the corresponding sensing inputs of a plurality of grouped device power supplies and a minimum voltage of a plurality of voltages measured at the respective sensing inputs of a plurality of grouped device power supplies.

[0037] As an example, such automatic test equipment can be configured to assess the deviation in order to detect whether the difference between the maximum voltage from the plurality of voltages measured at the corresponding sensing inputs of a plurality of grouped device power supplies and the minimum voltage from the plurality of voltages measured at the respective sensing inputs of a plurality of grouped device power supplies reaches or exceeds a threshold.

[0038] As an example, such automatic test equipment can be configured to assess the deviation in order to provide a warning signal and / or to trigger a protective action (e.g., disabling one or more device power supplies or reducing a voltage and / or current from one or more device power supplies), responding to a detection that the difference between the maximum voltage of a plurality of voltages measured between two respective detection inputs of a plurality of grouped device power supplies and the minimum voltage of a plurality of voltages measured between two respective detection inputs of a plurality of grouped device power supplies exceeds a threshold.

[0039] In other words, based on the use of individual sensing inputs from the respective power supplies of the power supply set, voltage drops between sensing inputs, e.g., PS and GS of a respective power supply, can be monitored, for example, to be compared with an expected (e.g., test-specific) reference value, or voltage drops measured by different power supplies powering different sections or cores of the device under test can be compared. This can enable the assessment of device power dissipation and power leveling of the supplies, even without prior knowledge of the test and / or device behavior.

[0040] On the other hand, as a redundant measure or alternatively, voltages at the respective inputs of different power supplies can be compared. This checks whether inputs connected to a common power or voltage range provide the same or at least similar values, e.g., whether a balanced power supply is indicated. Again, inputs from different power supplies can be compared with each other or individually evaluated against a reference value.

[0041] Thus, a number of safety measures for test monitoring can be implemented, based on the improved information extraction from the different acquisition inputs.

[0042] In accordance with this, for example, a direct assessment, e.g., a direct evaluation by the automatic test equipment (e.g., not by an external device, which could introduce information transmission delays), can enable rapid countermeasures and thus prevent damage.

[0043] In particular, individual stress assessment, e.g. stress evaluation, enables the extraction of information in a differentiated manner to evaluate the test, the status of the grouped power supply and its balance and / or device efficiency.

[0044] As discussed for the above embodiments, depending on the specific application, different options for comparison with reference voltages, reference voltage drops, or comparisons between voltages or voltage drops allow for the identification of differences in the behavior between device power supplies and device sections, such as device cores. Thus, each implementation of embodiments can be optimized for a specific application and enables redundant safety measures.

[0045] According to exemplary embodiments of the invention, the automatic test equipment is configured to separately monitor voltages at different locations of the test object, which are coupled to a common pair of power supply areas, using the different individual acquisition measurement results provided by the grouped device power supplies, e.g., using respective pairs of acquisition inputs (e.g., PS and GS) of the grouped device power supplies, e.g., to detect whether a voltage at one of the different locations of the test object reaches or exceeds a threshold value and / or, for example, to detect whether a difference between voltages at different locations of the test object shows a difference that is greater than or equal to a predetermined threshold value.

[0046] Thus, with limited hardware complexity, individual sections of the test object can be monitored, controlled, or tested in multi-operation mode. This allows even locally concentrated heat spikes to be detected and damage to be prevented. In particular, the inventors have found that comparing monitoring inputs that monitor a common supply area enables efficient monitoring of test and power dissipation and deployment behavior.

[0047] According to exemplary embodiments of the invention, each of the grouped device power supplies has at least three sensing inputs, and the automatic test equipment is configured to separately monitor voltage drops across a plurality of contact structures for contacting the test object, which are assigned to the same power supply area, at different locations, e.g., at different physical locations; e.g., at different pins of the test object, using respective pairs of sensing inputs [e.g., ES and PS of the grouped device power supplies and, for example, using the different individual sensing measurement results provided by the grouped device power supplies].

[0048] Furthermore, such automatic test equipment can optionally be configured to monitor voltage drops separately, e.g., to detect whether a voltage drop across one of the contact structures reaches or exceeds a threshold value and / or to detect whether voltage drops across the different contact structures (e.g., at different locations on the test object) show a difference that is greater than or equal to a predetermined threshold value.

[0049] The inventors recognized that providing an additional sensing input, such as a third sensing input (ES), enables monitoring and evaluation of test behavior at contact structures, i.e., interfaces between the device under test and the test equipment, e.g., a charging board. Accordingly, heat spikes can be detected with fine spatial granularity, preventing damage to such contact areas, e.g., contact structures. In particular, damage to complex test equipment, namely charging boards, due to faulty interfaces can be prevented. This is therefore especially advantageous for multiple operating modes where several power sources are used simultaneously, which increases the likelihood of an unbalanced power supply to the device between the sources, thus increasing the risk of overheating or even melting of faulty charging board-device interfaces.

[0050] According to exemplary embodiments of the invention, the automatic test equipment is configured to evaluate individual acquisition measurement results (e.g., individual measurement results indicating a voltage between a positive acquisition input and a negative acquisition input of the respective device power supplies; e.g., individual measurement results of a voltage at a respective positive acquisition input and / or at a respective negative acquisition input) that are assigned to the individual device power supplies of a set of device power supplies when the individual device power supplies of the set of device power supplies are grouped (e.g., grouped together, e.g., grouped to supply power jointly to a common power supply area, e.g., configured to operate in multi-operation mode) during the execution of a test of the test object, e.g.,in real time or near real time.

[0051] As an example, such automated test equipment can be configured to evaluate individual acquisition measurement results in order to detect a fault condition, e.g., indicating excessive current consumption of a functional block of the device under test or indicating excessive contact resistance of a power supply connection during the execution of a test of the device under test; e.g., to trigger fault handling during the execution of a test of the device under test.

[0052] As explained above, direct evaluation in the automatic test equipment allows for quick responses in the event of problematic behavior, such as when a heat spike occurs (e.g., identified by an unbalanced power supply).

[0053] According to exemplary embodiments of the invention, the automatic test equipment is configured to provide a power acquisition signal evaluation functionality with a per-device power supply granularity for device power supplies that are operated in a multiple operating mode, e.g. by making the individual acquisition measurement results assigned to the individual device power supplies of the set of grouped device power supplies available to a test program (e.g. a user-defined test program) that is executed on the automatic test equipment.

[0054] The inventors have discovered that the inventive approach enables evaluation with fine granularity, thus increasing test reliability and efficiency. In particular, the measurement capabilities of the power supplies are used efficiently.

[0055] Further embodiments according to the invention include a test arrangement comprising an automatic test equipment for testing a test object according to exemplary embodiments, e.g., in particular according to one of the exemplary embodiments discussed above, and a charging board configured to connect voltage sensing contact structures for contacting the test object, e.g., contact needles for contacting the test object, which are assigned to a common power supply area (e.g., are assigned to the same positive supply voltage or are assigned to the same reference potential), separately to sensing inputs of different power supplies of the grouped device, e.g., using separate conductor tracks.

[0056] Optionally, positive outputs of the grouped device power supplies can be connected to a common first supply voltage conductor (e.g., power level) of the charging board; as a further optional feature, negative outputs of the grouped device power supplies can be connected to a common second supply voltage conductor (e.g., power level) of the charging board; and as a further optional feature, e.g., alternatively or additionally, sensing inputs of the grouped device power supplies can be connected to sensing contacts for contacting a test object at different positions via separate conductors, e.g., via separate conductor tracks on the charging board.

[0057] The inventors have discovered that the features, functionalities, and details, as described for a specific automated test setup, enable an improved test arrangement that synergistically transfers the respective advantages to the configuration (e.g., test setup) as a whole, including the charging board. In particular, the improved granularity of the monitoring is advantageous for preventing damage to a specific charging board. Thus, based on the inventive improvement of a specific automated test setup, the charging board can be protected with little or no additional effort.

[0058] According to exemplary embodiments of the invention, the charging board has a plurality of voltage sensing contact structures, e.g. contact needles for contacting the test object, which are configured to contact a specific test object at different positions in order to connect a common power supply area of ​​the specific test object separately with respective sensing inputs of different of the grouped device power supplies.

[0059] Optionally, the voltage sensing contact structures can be configured to be de-energized when the device under test is powered by the grouped fixture power supplies; e.g., the voltage sensing contact structures do not carry any supply current to power the device under test.

[0060] Optionally, the test setup can be configured so that different device power supplies, grouped together, capture voltages at different positions within the common power supply area of ​​the test object.

[0061] For example, the charging board may alternatively or additionally have several sensing lines that contact voltage sensing contact structures (e.g., test object-side ends of contacts for contacting a test object) with connectors (e.g., POGO connectors, e.g., spring-loaded pin connectors) to establish a connection with the majority of grouped device power supplies.

[0062] Thus, exemplary embodiments can provide good test flexibility that is not limited to a specific spatial arrangement on the charging board, while providing the advantages of the invention described above.

[0063] Exemplary embodiments according to the invention include a method for testing a test object using automated test equipment comprising a plurality of device power supplies, wherein the method includes operating a plurality of device power supplies in a multiple operating mode (e.g., to supply electrical power to a common power supply area [also referred to as supply voltage area] in a parallel configuration); e.g., to provide approximately equal currents to a common line supply area when operating in a parallel configuration. Furthermore, the method includes providing (e.g., to a user interface and / or to a user-defined program executed on the automated test equipment) individual acquisition measurement results (e.g.,individual measurement results that indicate a voltage between a positive sensing input and a negative sensing input of the respective device power supplies; e.g., individual measurement results of a voltage at a respective positive sensing input and / or at a respective negative sensing input) that are assigned to the individual grouped device power supplies of the majority of grouped device power supplies (e.g., grouped together, e.g., grouped to supply power jointly to a common power supply area, e.g., configured to operate in the multiple operating mode).

[0064] The procedure, as described above, is based on the same considerations as the automated test equipment described above. Furthermore, the procedure can be supplemented with all the features and functionalities described for the automated test equipment.

[0065] In particular, each method according to the invention may have the same or similar or corresponding features, functionalities and details as the respective automatic test equipment according to the invention.

[0066] According to exemplary embodiments of the invention, the method involves using voltage sensing inputs from different of the grouped device power supplies (e.g., two or more device power supplies that are grouped or all device power supplies that are grouped) to monitor voltages at different locations of the test object and / or voltages between different pairs of voltage sensing contacts of the test object.

[0067] Embodiments according to the invention comprise a device (e.g., a semiconductor device, e.g., a 3D device, e.g., a semiconductor device comprising a plurality of stacked chips) comprising a first chip, e.g., a base chip, a second chip, e.g., an upper chip, a power supply interconnection structure connecting one or more first external contacts of the device and a voltage supply conductor (e.g., a power supply plane or a power supply layer) of the second chip, wherein the power supply interconnection structure is routed over the first chip (e.g., through a through-hole extending through the first chip or over a power supply conductor of the first chip), and a voltage sensing connection between a second external contact of the device and the power supply conductor of the second chip.

[0068] The inventors have discovered that, in addition to conducting such a power supply connection structure, e.g., in the form of a through-hole, the first chip's provision of a voltage sensing connection between a second external contact of the device and the power supply conductor of the second chip enables the acquisition of differentiated measurement information about the second chip. This has been found to be particularly useful in devices where the second chip is powered via the power supply connection structure of the first chip. Thus, in contrast to conventional approaches, monitoring of the second chip is possible, thereby preventing heat spikes and device damage in an improved manner, e.g., with better reliability and robustness.Furthermore, detailed information about the functionality of the second chip can be obtained, which would otherwise only be available indirectly. In particular, exemplary embodiments enable separate monitoring of a first and second chip, based on the interconnect structure according to the invention.

[0069] According to exemplary embodiments of the invention, the power supply connection structure comprises a supply voltage conductor arranged on or in the first chip, a plurality of first external contacts of the device are connected to the supply voltage conductor arranged on or in the first chip, the supply voltage conductor arranged on or in the first chip is connected to the supply voltage conductor of the second chip (e.g., using one or more connection structures; e.g., using one or more through holes and / or using one or more bumps and / or using one or more bond wires), and the voltage sensing connection is arranged to bypass the supply voltage conductor arranged on or in the first chip (e.g.,such that there is no current flow through the voltage sensing connection when the second chip is powered via the power supply connection structure; e.g., in such a way that the voltage sensing connection directly connects the second external contact of the device and the supply voltage conductor of the second chip; e.g., in such a way that there is no electrical connection between the voltage sensing connection and the supply voltage conductor located on or in the first chip in a region of the first chip; e.g., in such a way that the voltage sensing connection is electrically isolated from any other electrically conductive structure in a region of the first chip; e.g.,in such a way that the detection connection via the power supply conductor of the second chip is only indirectly connected to the power supply conductor located on or in the first chip, but not directly on or in the first chip.

[0070] Bypassing the supply voltage conductor located on or within the first chip allows for a separate and independent measurement of the behavior of the second chip, thus enabling a precise and differentiated evaluation of the second chip, even though it is coupled to the first chip.

[0071] According to exemplary embodiments of the invention, the voltage sensing connection is configured to be de-energized, e.g., free of current, when the second chip is supplied with power via the power supply connection structure.

[0072] This allows for precise voltage measurements to be provided for analyzing the behavior of the second chip.

[0073] According to exemplary embodiments of the invention, the entire extent of the voltage sensing connection (e.g., from an external contact, such as a pin or a terminal of the device, to the second chip) is separated from, e.g., mechanically separated from; e.g., spaced apart from a current path between the one or more first external contacts of the device and the supply voltage conductor, e.g., a power supply level or a power supply layer of the second chip.

[0074] This can guarantee the independence of the measurements for the second chip, thus increasing the efficiency and robustness of device testing. Brief description of the drawings

[0075] The drawings are not necessarily to scale; instead, the focus is on illustrating the principles of the invention. Various embodiments of the invention are described below with reference to the following drawings. Fig. Figure 1 shows a schematic view of an automatic test equipment for testing a test object according to exemplary embodiments of the invention; Fig. Figure 2 shows a schematic view of a test setup with an automatic test equipment and a charging board according to exemplary embodiments of the invention; Fig. Figures 3 to 6 show schematic views of the test setup as it appears in Fig. 2 is shown in different situations; Fig. Figure 7 shows a schematic view of a device according to exemplary embodiments of the invention; Fig. Figure 8 shows a schematic view of an embodiment for providing good spatial hotspot resolution; Fig. Figure 9 shows a schematic block diagram for a method for testing a test object using automatic test equipment comprising a plurality of device power supplies according to embodiments of the invention; and Fig. Figure 10 shows a schematic view of a test setup with power supplies in a multiple operating mode according to embodiments of the invention. Detailed description of the exemplary implementations

[0076] Identical or equivalent elements, or elements with the same or equivalent functionality, are designated with the same or equivalent reference symbols in the following description, even if they appear in different figures.

[0077] The following description includes numerous details to provide a more thorough explanation of embodiments of the present invention. However, it is clear to those skilled in the art that embodiments of the present invention can be implemented without these specific details. In other cases, well-known structures and devices are shown in block diagram form rather than in detail to avoid hindering embodiments of the present invention. Furthermore, features of the different embodiments described herein can be combined unless specifically noted otherwise.

[0078] Fig. Figure 1 shows a schematic view of an automatic test equipment for testing a test object according to exemplary embodiments of the invention. The automatic test equipment 100 has a first and a second device power supply 110, 120. In the Fig. In the configuration shown in Figure 1, the device power supplies 110 and 120 are operated in a multiple operating mode and provide a common power output 103, based on individual power signals 1031, 1032 from power supplies 110 and 120.

[0079] Furthermore, the automatic test equipment 100 is configured to provide individual acquisition measurement results 101 and 102, which are assigned to the individual device power supplies of a set of device power supplies (here, as an example, the set which has both device power supplies 110, 120), when the individual device power supplies of the set of device power supplies are grouped, as is indicated, for example, by the combined output 103.

[0080] The following section explains a number of optional features, functionalities, and details relating to test setups according to exemplary embodiments, wherein the test setups include automatic test equipment according to exemplary embodiments and charging boards according to exemplary embodiments.

[0081] For the sake of brevity, individual features, functionalities, and details for automatic test equipment and for charging boards according to exemplary embodiments of the invention are discussed in connection with such test arrangements. It should be noted, however, that in particular, the respective automatic test equipment of the following test arrangements may have any combination of the features presented herein for the respective automatic test equipment, regardless of its use in a particular test arrangement.

[0082] It should therefore be noted that although they are explained in connection with a test setup, the features, functionalities and details disclosed for the automatic test equipment can be used individually, in particular without the presence of a respective charging board or without a configuration as a test setup.

[0083] Fig. Figure 2 shows a schematic view of a test setup with an automatic test equipment and a charging board according to exemplary embodiments of the invention. The test setup 200 includes an automatic test setup 300, which has a plurality of device power supplies 310, 320, 330. In the example of Fig. 2. The device power supplies are represented as PogoA, PogoB and PogoC, thus, as an example, they focus on their respective coupling devices or interfaces (e.g., using POGO pins).

[0084] The test setup 200 further comprises a charging board 400, the charging board optionally having a first layer 410 and a second layer 420. As indicated by lines 311, 321, and 331, the device power supplies can be coupled to the second layer 420 of the charging board, and as indicated by lines 312, 322, and 332, to the first layer 410 of the charging board. Layers 410 and 420 can be implemented on the charging board as individual conductive layers, for example, to supply power to a respective test object.

[0085] As an optional feature, the charging board 400 is configured to connect voltage sensing contact structures separately (e.g., as indicated by resistors 620) to contact the device under test, which is assigned to a common power supply area, with sensing inputs from different of the grouped device power supplies.

[0086] As indicated by element 430, layers 410 and 420 can be capacitively coupled, for example using capacitors or networks of capacitors. Such coupling can also be parasitic (e.g., alternatively or partially).

[0087] Furthermore, it shows Fig. 2. A test object 500, which has different sections 510, 520, 530, shown here as an example in the form of different cores (A, B and C). As shown as an optional feature, each section 510, 520 and 530 can have a first layer 511, 521, 531 and a second layer 512, 522, 532.

[0088] The first layer 410 of the charging board 400 and the first layers 511, 521 and 531 of the device 500 can form a common supply voltage range, and the second layer 420 of the charging board 400 and the second layers 512, 522 and 532 of the device 500 can form a reference voltage range or a ground voltage range.

[0089] Accordingly, the device 500 can be coupled between these areas for power supply. Interfaces between the charging board 400 and the test object 500 are in Fig. 2 as an example as resistors 600 (e.g. modeling device-side interface sections), 630 (e.g. modeling supply voltage range-side interface sections of the charging board), 640 (e.g. modeling reference voltage range-side interface sections of the charging board) and connection surfaces or bumps 700.

[0090] As an example, each power supply unit 310, 320, 330 has three data inputs, namely 313, 314, 315 and 333, 334, 335. For example, the respective data inputs are shown as PS, e.g., power input (313, 323, 333), GS, e.g., mass input (314, 324, 334), and ES, e.g., extended input (315, 325, 335). It should be noted that the respective third data inputs, ES, are optional.

[0091] It should be noted that detection lines 323 and 324 as well as 333 and 334 (and for example 313, 314) are optionally de-energized (as can be seen from the different appearance of the respective resistors 620 in Fig. 2 is displayed).

[0092] As modeled by further resistors 610, the device 500 can have an internal coupling of the respective device sections 510, 520 and 530.

[0093] As it is in Fig. As indicated in diagram 2 (see connections 312, 322, and 332), the device power supplies 310, 320, and 330 are configured to operate in a multi-operation mode. The device power supplies 310, 320, and 330 each deliver a power P to a common power supply area, as is the case, for example, in Fig. 2 is shown, which has a layer 410 of the charging board 400. Power is supplied to the test object 500 via a charging board device interface, which is in Fig. 2 is modeled by the resistors and inputs between device 500 and layer 410. The common power supply area can further include the respective first layers 511, 521, and 531 of device 500. The power supply area can thus be an area in which a specific supply voltage is present or expected, or in which a specific supply voltage (e.g., different voltages for layer 410 and layers 511, 521, and 531) is desired or provided for testing.

[0094] Furthermore, the automatic test equipment 300 is configured to provide individual acquisition measurement results, e.g. results of respective inputs (313, 314, 315, 323, 324, 325, 333, 334, 335) that are assigned to the individual device power supplies of a set of device power supplies when the individual device power supplies of the set of device power supplies are grouped.

[0095] At the in Fig. The setup shown in Figure 2 demonstrates a number of optional measurement configurations.

[0096] Each of the device power supplies 310, 320, 330 has sensing inputs PS (313, 323, 333) and GS (314, 324, 334). Thus, as an optional feature, each of the device power supplies can be configured to measure a voltage between its at least two sensing inputs (e.g., a voltage between the respective PS and GS, e.g., between 313 and 314, e.g., between 323 and 324). Alternatively or additionally, each of the device power supplies can be configured to measure voltages at its at least two sensing inputs (e.g., a first voltage assigned to a respective PS, e.g., 313, and a second voltage assigned to a respective GS, e.g., 314, e.g., both compared to a common reference).

[0097] Accordingly, the automatic test equipment is configured to provide such individual measurement results, e.g., power supply-specific, or can be configured to assess, evaluate and / or compare them.

[0098] Thus, using the setup as described in Fig. As shown in Figure 2, a number of evaluation approaches can be performed according to the exemplary embodiments. The automatic test equipment can be configured to detect voltage drops across a particular section of the test object, for example, using detection inputs 323 and 324 to measure a voltage across CoreB 520. Such a voltage drop can be compared to a reference voltage drop (e.g., a voltage drop expected for a particular test and core) or, for example, to a voltage drop across another section of the test object, such as CoreA 510 or CoreB 530.

[0099] Thus, exemplary embodiments allow for the assessment of respective stresses with regard to predefined threshold values ​​and additionally with regard to, for example, desired balanced power dissipation from different sections of the test object.

[0100] Accordingly, individual voltages can be measured and compared. For example, the voltages of a given PS input can be compared with predefined threshold values ​​or with PS inputs addressing other sections of the device under test. Again, comparison with measurements from other device sections allows monitoring of power balancing among the device power supplies 310, 320, and 330.

[0101] Beyond mere comparisons, gradients of voltage drops or voltages, e.g., voltage deviations or rates of change, can be monitored, which, for example, indicate a sudden increase resulting from the melting of an interface.

[0102] In the drawing of Fig. In simple terms, embodiments 2 enable monitoring of device sections by voltage from a power range or a section thereof, e.g. 410, to a reference range or a section thereof, e.g. 420, thus in one direction of power consumption (vertical in the image) as well as, for example, by voltage within a range (horizontal in the image), e.g. by comparing respective corresponding detection inputs, e.g. comparing 313, 323 and 332, which are assigned to different device sections, e.g. 510, 520 and 530, but within the same range.

[0103] In other words, exemplary implementations allow for the balancing of power supply between and within the areas (in Fig. 2 “vertical” and “horizontal”). This increases the device's testability and safety.

[0104] The optional additional third inputs ES, 315, 325, and 335 allow for further increases in monitoring granularity. Using these inputs, contact structures for contacting the test object, assigned to the same power supply area, can be monitored at different locations on the test object. Again, in accordance with the explanations above, voltage drops, e.g., between a particular power supply unit (PS) and ES, can be monitored, ES from different power supplies can be compared, or ES voltage behavior, e.g., gradients, can be assessed.

[0105] The assessments of PS, GS, and ES described above can be performed in real time, for example, during testing. This allows for the rapid correction of any reduction in balance or symmetry in the power supply.

[0106] Fig. Figures 3 to 6 show schematic views of the test setup as it appears in Fig. 2 is shown in different situations. Fig. Figures 2 to 6 can show an example of a description of the construction and operation of embodiments according to the invention.

[0107] With reference to Fig. 2. In contrast to the classical approach, embodiments according to the invention can use multiple measurement signals to gather more details, based on the device / mounting structure. In other words, Fig. Figure 2 shows a schematic view of a typical setup for different voltage detection for hotspot detection.

[0108] Fig. Figure 2 shows, as an example, a setup with three tester Pogos 310, 320, and 330 operating in parallel to power the device under test (DUT) 500. The master channel (PogoA) can be configured to control the power output (signal P) to achieve the programmed output voltage at the DUT. This voltage can be remotely measured, for example, as the difference between GS (ground), e.g., 314, and PS (power), e.g., 313, of the master. Pogos B and C can be configured, for example, to share the current so that PogoA, PogoB, and PogoC are balanced, resulting in identical outputs. Thus, device power supplies 310, 320, and 330 can operate in a multi-mode, specifically a balanced or symmetrical multi-mode.

[0109] As explained above, embodiments according to the invention can use multiple detection signals for individual device cores and their mounting connection (e.g., charging board interface): power detection (PS), ground detection (GS), and optionally extended detection (ES). It should be noted that the marked contacts (620) in Fig. 2 measuring leads can indicate when there is no current flow.

[0110] As in the example of Fig. As shown in Figure 3, power can ideally be provided in a balanced manner, for example, by the power supplies 310, 320 and 330 (see arrows 710, 720 and 730 of equal width, indicating a balanced provision and dissipation of power between the different device sections), resulting in similar voltage drops Extdrop A, Exdrop B and Extdrop C as well as Vlocal A, Vlocal B and Vlocal C.

[0111] Thus, Fig. 3. Show an example of a regulated, balanced device current. In other words, Fig. Figure 3 can show the example for fully balanced core power and current flows (arrows 710, 720, 730) in device 500. Extvdrop (ES - PS) and Vlocal (PS - GS) are the same or at least approximately the same for all cores.

[0112] Fig. Figure 4 shows a schematic view of the facility as it is located in Fig. 2 is explained as an example with a CoreC hotspot. If, for example, CoreC, 530, shows a very high current draw (see increased width of arrow 730 compared to a balanced state, as described in Fig. (as shown in Figure 3), the local CoreC voltage (e.g., VlocalC) can drop or will drop, as well as the extVdrop (e.g., denoted in Figure 3). Fig. 4 as Extdrop) close to CoreC. Due to the core connection (e.g. by bond wire, metal layer, device substrate, ...) (see e.g. 610) with a finite resistance, the neighboring cores may or will also experience an increased current.

[0113] As an example, further current flows, e.g. power flows, are indicated by arrows 810, 820, 830 and 840, which show the unbalanced power distribution.

[0114] Voltage drop measurements may or will increase for adjacent cores. The device, e.g., 200 or 300, can be configured to measure and / or compare the individual drop measurements, and the lower local voltage of Core C (and Core B) may clearly indicate a hotspot in that area. Cores with higher resistance values ​​between local supplies may or will be less affected by the hotspot.

[0115] Fig. Figure 5 shows a schematic view of the facility as it appears in Fig. 2 is explained as an example with locally increased contact resistance (supply side).

[0116] As an example, as indicated by the X symbol 900, situations can arise where contacts are faulty and thus the contact resistance can increase. Accordingly, Extdrop C can increase, as indicated by the increased arrow width, e.g., compared to... Fig. 2.

[0117] If a contact of the holder (e.g., charging board 400) exhibits increased resistance or the core connection within the device deteriorates, extVdrop (also referred to as extdrop) may or will increase (see, e.g., Extdrop C). This is of particular interest for multi-chip devices (3D devices, chip-to-chip bonding, chip-to-substrate bonding, etc.). As a side effect, the internal connection, e.g., as modeled by resistors 610, may or will draw additional current (see, e.g., arrow 850) from closer cores, e.g., Core B here, and increase extVdrop at these pogos.

[0118] Fig. Figure 6 shows a schematic view of the facility as it is located in Fig. 2 is explained as an example with locally increased contact resistance (GND side).

[0119] An increase in contact resistance on the GND side of a core (see, for example, markings X, 900, as in the context of Fig. (as explained in section 5) can or will lead to a reduction in Vlocal of this Pogos, as well as a slight reduction in neighboring nuclei.

[0120] With reference to Fig. According to the exemplary embodiments, the following measurement procedure can be carried out for 2 to 6: • Triggering the function performs a measurement of all related VLocal and extVdrop (ADV: proPogo feature) • Each individual Vlocal can be assessed against boundaries. • The delta between the minimum and maximum Vlocal values ​​is calculated, and if this is too high, an outlier is found and the test can be marked as failed and the test can be aborted to avoid further damage to the device / mount. • Each individual extVdrop can be assessed against limits. • The delta between the extVdrop minimum and maximum values ​​is calculated, and if this is too high, an outlier is found and the test can be marked as failed and the test can be aborted to avoid further damage to the device / mount.

[0121] According to exemplary embodiments, a real-time monitoring procedure (e.g., asynchronous) can have the following features: • A common threshold for extVdrop can be defined, and as soon as one of the cores' extVdrops exceeds this level for a specific minimum time period, the tester can trigger an alarm condition and optionally disconnect the device under test to stop the current flow and prevent potential damage. • Optionally, it is possible to use a peak follower in a pro-pogo setup to catch Vlocal bumps (and optionally to log Vlocal bumps and / or respond to Vlocal bumps, e.g., by using a modification of a test flow and / or by using a failsafe procedure).

[0122] Next, we will look at Fig. 7 referenced. Fig. Figure 7 shows a schematic view of a device according to exemplary embodiments of the invention. The device 1000 comprises a first chip 1100 and a second chip 1200, a power supply connection structure 1110 which connects one or more first external contacts 1120 of the device and a supply voltage conductor 1210 of the second chip, wherein the power supply connection structure 1110 is routed via the first chip 1100.

[0123] The device 1000 further comprises a voltage sensing connection 1130 between a second external contact 1140 of the device and the power supply connector 1210 of the second chip 1200.

[0124] For example, Fig. Figure 7 shows, simply put, an embodiment according to the invention for detecting stacked chips, e.g. 1100, 1200, within a device, e.g. 1000.

[0125] As it is in Fig. If 7 is displayed, the first chip 1100 can be a base chip (e.g., test object A) and the second chip 1200 can be an upper chip (e.g., test object TB). Both can be part of a test object 1000 (e.g., "test object"). Thus, Fig. 7 In other words, show a device according to exemplary embodiments, wherein the devices provide “additional” sensing connections (PS and GS) for 3D / TVS-type devices for sensing actual voltages on the “UPPER” chip: Optional features include external contacts, for which the 1120 and 1140 are examples, in the form of power connection pads or power bumps (e.g. PWR connection pad / bump).

[0126] As an optional feature, the power supply interconnect structure 1110 includes a silicon via, TSV 1112, and a supply voltage conductor 1114, wherein a plurality of contacts, here as an example contact pads or bumps, are connected to or attached to the supply voltage conductor 1114. As shown in Fig. As shown in Figure 7, the device can have 1000 additional TSVs.

[0127] As it is in Fig. As shown in Figure 7, the voltage sensing connection 1130 can, according to exemplary embodiments, bypass the supply voltage conductor 1114, which is arranged on or in the first chip 1100. In particular, such a device allows a voltage sensing connection, e.g., from 1120 to 1140, to be de-energized even when the chip 1200 is supplied with power via the power supply structure 1114 or 1210. As shown in Figure 7, the voltage sensing connection 1130 can bypass the supply voltage conductor 1114, which is located on or in the first chip 1100, according to exemplary embodiments. In particular, such a device allows a voltage sensing connection, e.g., from 1120 to 1140, to be de-energized even when the chip 1200 is supplied with power via the power supply structure 1114 or 1210. Fig. As shown in Figure 7, power can be supplied via a voltage force input of 1300.

[0128] Here, a current path, e.g., between a voltage force input 1300 (e.g., Voltage Force A) through the chip 1200 to a ground grid (e.g., GND grid) and the respective ground output, e.g., GND (e.g., GND A), can be separated from the voltage sensing connection 1130.

[0129] Fig. Figure 8 shows a schematic view of an exemplary embodiment for providing good spatial hotspot resolution. Fig. Figure 8 shows a charging board 2000 (also referred to as a holder) with a respective device or device sections 2400 and respective detection inputs PS, 2100, GS, 2200 and ES, 2300.

[0130] Thus, distributing the respective detection lines allows for achieving fine spatial granularity with regard to hotspot detection and prevention. Spatial resolution can therefore be achieved by arranging the detection contacts along the device.

[0131] Fig. Figure 9 shows a schematic block diagram for a method for testing a test object using an automatic test equipment having a plurality of device power supplies, according to embodiments of the invention, wherein the method 3000 comprises operating 3100 a plurality of device power supplies in a multiple operating mode and providing 3200 individual acquisition measurement results, which are assigned to individual multiple device power supplies of the plurality of multiple device power supplies.

[0132] Fig. Figure 10 shows a schematic view of a test setup with power supplies in a multiple operating mode according to embodiments of the invention. Fig. Figure 10 shows a test setup 4000 with an automatic test equipment, wherein the automatic test equipment has a plurality of device power supplies 4100, 4200 and 4300. In the example of Fig. 10. The majority of device power supplies form a set of device power supplies.

[0133] According to the in Fig. In the embodiment shown in Figure 2, the automatic test equipment is configured to provide individual acquisition measurement results using respective inputs PS1, GS1, ES1 for the power supply 4100 and PS2, GS2, ES2 for the power supply 4200 and PS3, GS3, ES3 for the power supply 4300, when the individual device power supplies of the set of device power supplies are grouped to supply power to a test object 4600.

[0134] It should be noted that the third acquisition inputs ES1, ES2, and ES3 are optional. Power coupling between device power supplies 4100, 4200, 4300 and the test object 4600 is described in Fig. 10 modeled, taking into account resistance values ​​4700 of the respective force signal lines P1, P2 and P3, which supply power to a common power / voltage supply area, wherein this area has power supply conductor sections on the charging board 4400 and power supply conductor sections on the test object, wherein the coupling between the charging board and the test object is shown with interfaces 4500.

[0135] As it is in Fig. Figure 10 shows the coupling of test object sections, and here, as an example, power supply conductor sections, with further resistive connections 4800. The respective sections or cores of the test object are modeled as ICoreA, ICoreB, and ICoreC.

[0136] Furthermore, with regard to Fig. 10. The multiple operating mode is explained in more detail. As it is described in Fig. As shown in Figure 10, a voltage reference VForce 4110 can be provided to a first device power supply 4100, which can be a master device power supply, for example, designated POGOA / Master. Based on a comparison of VForce and PS1 in the subtractor 4120, a voltage 4130 can be set to provide an initial current via the power line P1. The current 4150 can be measured using the measuring unit 4140, and further device power supplies can be provided, e.g., slave power supplies, designated, for example, POGOB / Slave and POGOC / Slave. Based on this, the respective power supply can provide currents to the device under test via the current sources 4210 and 4310 and via the respective power lines P2 and P3.In this multiple operating mode, based on a target value, here as an example VForce 4110, a master power supply can provide an initial current that can serve as a reference for a plurality of slave power supplies to provide essentially the same or at least similar currents through the respective power lines P1, P2 and P3 in order to maintain a balanced power supply operating mode.

[0137] Thus, Fig. 10. In other words, the balancing of the current per pogo by duplicating the measured master current, e.g., 4150, through each slave channel, e.g., using 4210, 4310, indicates that the device power supplies can thus act as a current balancing element, or, as an example, the multi-channel operating mode can be considered a current balancing operating mode. In other words, a current balancing element can be implemented (or be effective) in a device power supply instrument (e.g., in a multi-channel device power supply instrument, which may be implemented using a single hardware module or using a combination of multiple hardware modules).

[0138] Thus, Fig. 10 as a schematic view of a detailed signal model of Fig. 2. Consider, for example, the following characteristics for a good or even optimal device setting: • The holder (e.g., charging board) provides "additional" sensing contacts (e.g., needle) for PS per pogo (e.g., per device power supply) • The holder (e.g., charging board) provides "additional" detection contacts (e.g., needle) for GS per Pogo (e.g., per device power supply) • The holder (e.g., charging board) provides "additional" detection contacts (e.g., needle) for ES per Pogo (e.g., per device power supply) • Device (e.g., as in Fig. 7 shown and as indicated by 4600) provides “additional” sensing links (PS and GS) for 3D / TVS-type devices to sense true voltages on the “UPPER” chip: Implementation alternatives

[0139] Although some aspects have been described in connection with a device, it is understood that these aspects also constitute a description of the corresponding process, such that a block or component of a device can also be understood as a corresponding process step or as a feature of a process step. Similarly, aspects described in connection with or as a process step also constitute a description of a corresponding block, detail, or feature of a corresponding device. Some or all of the process steps can be performed by (or using) a hardware device, such as a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, some or more of the key process steps can be performed by such a device.

[0140] Depending on specific implementation requirements, embodiments of the invention can be implemented in hardware or in software. The implementation can be carried out using a digital storage medium, for example, a floppy disk, DVD, Blu-ray disc, CD, ROM, PROM, EPROM, EEPROM, FLASH memory, hard disk, or other magnetic or optical storage medium, on which electronically readable control signals are stored. These control signals can interact with, or interact with, a programmable computer system in such a way as to execute the respective method. Therefore, the digital storage medium can be computer-readable.

[0141] Some embodiments according to the invention therefore include a data carrier which has electronically readable control signals which are able to interact with a programmable computer system in such a way that one of the methods described herein is carried out.

[0142] In general, embodiments of the present invention can be implemented as a computer program product with program code, wherein the program code is effective in carrying out one of the methods when the computer program product runs on a computer. The program code can, for example, also be stored on a machine-readable medium.

[0143] Other embodiments include the computer program for carrying out one of the methods described herein, wherein the computer program is stored on a machine-readable medium.

[0144] In other words, an embodiment of the method according to the invention is thus a computer program that includes program code for carrying out one of the methods described herein when the computer program runs on a computer.

[0145] Another embodiment of the methods according to the invention is thus a data carrier (or a digital storage medium or a computer-readable medium) on which the computer program for carrying out one of the methods described herein is recorded. The data carrier, the digital storage medium, or the recorded medium is typically tangible and / or non-volatile.

[0146] Another embodiment of the method according to the invention is thus a data stream or a sequence of signals that represents the computer program for carrying out one of the methods described herein. The data stream or sequence of signals can be configured, for example, to be transmitted via a data communication connection, such as the Internet.

[0147] Another embodiment comprises a processing device, for example a computer or a programmable logic device, which is configured or adapted to perform one of the methods described herein.

[0148] Another embodiment comprises a computer on which the computer program for performing one of the procedures described herein is installed.

[0149] Another embodiment of the invention comprises a device or system designed to transmit a computer program for carrying out at least one of the methods described herein to a receiver (for example, electronically or optically). The receiver may be, for example, a computer, a mobile device, a storage device, or a similar device. The device or system may, for example, include a file server for transmitting the computer program to the receiver.

[0150] In some embodiments, a programmable logic device (for example, a field-programmable gate array, an FPGA) can be used to perform some or all of the functionalities of the methods described herein. In some embodiments, a field-programmable gate array can interact with a microprocessor to perform one of the methods described herein. Generally, the methods are preferably performed by any hardware device.

[0151] The devices described herein can be implemented, for example, using a hardware device, or using a computer, or using a combination of a hardware device and a computer.

[0152] The devices described herein, or any component of the devices described herein, may be implemented at least partially in hardware and / or in software.

[0153] The methods described herein can be implemented, for example, using a hardware device, or using a computer, or using a combination of a hardware device and a computer.

[0154] The procedures described herein, or any component of the procedures described herein, may be performed at least partially by hardware and / or by software.

[0155] The embodiments described above are merely illustrative of the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be obvious to other people skilled in the art. Therefore, it is intended that the invention be limited only by the scope of protection set forth in the following claims and not by the specific details presented herein by way of description and explanation of the embodiments. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] ES 315, 325, 335

[0104]

Claims

[1] An automatic test equipment (100, 300) for testing a test object (500, 1000, 4600), wherein the automatic test equipment has a plurality of device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300); wherein the device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) are configured to be operable in a multiple operating mode; wherein the automatic test equipment is configured to provide individual acquisition measurement results (313-315, 323-325, 333-335) that are assigned to the individual device power supplies of a set of device power supplies when the individual device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of the set of device power supplies are grouped. [2] The automatic test equipment (100, 300) according to claim 1, wherein each of the device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of the set of device power supplies has at least two acquisition inputs (313-315, 323-325, 333-335); and wherein each of the device power supplies of the set of device power supplies is configured to measure a voltage between its at least two sensing inputs and / or wherein each of the device power supplies of the set of device power supplies is configured to measure voltages at its at least two sensing inputs; and wherein the automatic test equipment is configured to provide one or more measured voltages for each device power supply of the set of device power supplies as individual acquisition measurement results when the individual device power supplies are grouped. [3] The automatic test equipment (100, 300) according to one of claims 1 to 2, wherein the automatic test equipment is configured to provide the individual acquisition measurement results (313-315, 323-325, 333-335) associated with the individual device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of a set of device power supplies grouped together for evaluation by a test program executed on the automatic test equipment. [4] The automatic test equipment (100, 300) according to one of claims 1 to 3, wherein the automatic test equipment is configured to provide the individual acquisition measurement results (313-315, 323-325, 333-335) assigned to the individual power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of a set of device power supplies that are grouped together, in order to enable the detection of a variation between voltage drops detected by different device power supplies of the set of device power supplies that are grouped and / or to enable the detection of a deviation between voltages at corresponding detection inputs of a plurality of different device power supplies of the set of device power supplies that are grouped. [5] The automatic test equipment (100, 300) according to any one of claims 1 to 4, wherein the automatic test equipment is configured to individually assess voltages between two detection inputs (313-315, 323-325, 333-335) of a plurality of respective device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of the set of device power supplies that are grouped. [6] The automatic test equipment (100, 300) according to any one of claims 1 to 5, wherein the automatic test equipment is configured to assess a deviation of two or more voltages between two detection inputs (313-315, 323-325, 333-335) of a plurality of respective device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of the set of device power supplies that are grouped together. [7] The automatic test equipment (100, 300) according to any one of claims 1 to 6, wherein the automatic test equipment is configured to individually assess voltages at detection inputs (313-315, 323-325, 333-335) of a plurality of respective device power supplies (110, 120, 130, 320, 330, 4100, 4200, 4300) of the set of device power supplies that are grouped. [8] The automatic test equipment (100, 300) according to any one of claims 1 to 7, wherein the automatic test equipment is configured to assess a deviation of two or more voltages at detection inputs (313-315, 323-325, 333-335) of a plurality of respective device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of the set of device power supplies that are grouped together. [9] The automatic test equipment (100, 300) according to any one of claims 1 to 8, wherein the automatic test equipment is configured to separately monitor voltages at different locations (510, 520, 530) of the test object (500, 1000, 4600) coupled to a common pair of power supply areas, using the different individual acquisition measurement results (313-315, 323-325, 333-335) provided by the grouped device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300). [10] The automatic test equipment (100, 300) according to any one of claims 1 to 9, wherein each of the grouped device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) has at least three acquisition inputs, wherein the automatic test equipment is configured to separately monitor voltage drops across a plurality of contact structures (630, 700) for contacting the test object (500, 1000, 4600) assigned to the same power supply area at different locations (510, 520, 530) of the test object using respective pairs of sensing inputs (313-315, 323-325, 333-335) of the grouped device power supplies. [11] Automatic test equipment (100, 300) according to any one of claims 1 to 11, wherein the automatic test equipment is configured to evaluate individual acquisition measurement results (313-315, 323-325, 333-335) that are assigned to the individual device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) of a set of device power supplies when the individual device power supplies of the set of device power supplies are grouped during an execution of a test of a test object (500, 1000, 4600). [12] The automatic test equipment (100, 300) according to any one of claims 1 to 11, wherein the automatic test equipment is configured to provide a power acquisition signal evaluation functionality with a per-device power supply granularity for device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) that are operated in a multi-operation mode. [13] A test setup (200, 4000) which has the following features: an automatic test equipment (100, 300) for testing a test object (500, 1000, 4600) according to one of claims 1 to 12; and a charging board configured to connect voltage sensing contact structures for contacting the test object, which is assigned to a common power supply area, separately to sensing inputs (313-315, 323-325, 333-335) of different grouped device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300). [14] The test setup according to claim 13, wherein the charging board has a plurality of voltage sensing contact structures configured to contact a specific test object (500, 1000, 4600) at different positions, to connect a common power supply area of ​​the specific test object separately with respective acquisition inputs (313-315, 323-325, 333-335) of different grouped device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300). [15] A method (3000) for testing a test object (500, 1000, 4600) using automatic test equipment having a plurality of device power supplies, wherein the method comprises operating (3100) a plurality of device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) in a multiple operating mode in a parallel configuration, for example to provide approximately equal currents to a common power supply area when operating in a parallel configuration; wherein the procedure includes a provision (3200) of individual acquisition measurement results (313-315, 323-325, 333-335), the individual grouped device power supplies are assigned to the majority of grouped device power supplies. [16] The method according to claim 15, wherein the method comprises using voltage sensing inputs from different of the grouped device power supplies (110, 120, 310, 320, 330, 4100, 4200, 4300) to monitor voltages at different locations of the test object (500, 1000, 4600) and / or voltages between different pairs of voltage sensing contacts (313-315, 323-325, 333-335) of the test object. [17] A device (500, 1000, 4600) having the following features: a first chip (1100); and a second chip (1200); a power supply interconnect structure (1110) that connects one or more first external contacts (1120) of the device and a supply voltage conductor (1210) of the second chip, wherein the power supply link structure (1110) is routed via the first chip; and a voltage sensing connection (1130) between a second external contact (1140) of the device and the power supply conductor (1210) of the second chip. [18] The device (500, 1000, 4600) according to claim 17, wherein the power supply interconnect structure (1110) includes a supply voltage conductor (1114) which is arranged on or in the first chip, wherein a plurality of first external contacts of the device are connected to the supply voltage conductor which is arranged on or in the first chip, wherein the supply voltage conductor arranged on or in the first chip is connected to the supply voltage conductor (1210) of the second chip; and wherein the voltage sensing connection (1130) is arranged to bypass the supply voltage conductor which is located on or in the first chip. [19] The device (500, 1000, 4600) according to claim 17 or 18, wherein the voltage sensing connection (1130) is configured to be de-energized when the second chip is supplied with power via the power supply connection structure (1110). [20] The device (500, 1000, 4600) according to any one of claims 17 to 19, wherein an entire extension of the voltage sensing connection (1130) is separated from a current path between the one or more first external contacts (1120) of the device and the supply voltage conductor (1210) of the second chip.

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