ARRANGEMENT AND METHOD FOR TESTING A WAFER

DE112024003403T5Undetermined Publication Date: 2026-07-02AUSTRIAMICROSYSTEMS AG
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
AUSTRIAMICROSYSTEMS AG
Filing Date
2024-09-24
Publication Date
2026-07-02
Patent Text Reader

Abstract

An arrangement comprising a wafer chuck and a light source is provided. The wafer chuck has a plate with a mounting surface for mounting a wafer; the plate is positioned in the beam path of the light source and is translucent. Furthermore, a method for testing a wafer using this arrangement is provided.
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