Arrangement for mounting a vacuum sensor with a semiconductor package in a surrounding device housing

Abstract

Arrangement for fastening a vacuum sensor (1) with a semiconductor housing in a surrounding device housing (9), in particular a vacuum connection flange, wherein the semiconductor housing is connected at least section by section to adjacent sections of the device housing (9) by means of an adhesive connection (17) in a vacuum-tight manner.

Description

[0001] The invention relates to an arrangement for mounting a vacuum sensor with a semiconductor housing in a surrounding device housing.

[0002] The components of vacuum sensors, such as MEMS chips from Pirani Sensors or membranes with integrated deformation sensors, are very often housed, especially in their miniaturized versions, in packages adopted from semiconductor technology. These packages are referred to below as semiconductor packages. Such semiconductor packages are known by various designations, including DO (diode outline), TO (transistor outline), SIP (single inline package), and DIP (dual inline package). The term "semiconductor package" is also used below to refer to SMD packages. SMD packages are surface-mount devices in which an electronic component, as an SMD package, is directly electrically contacted and attached to a printed circuit board without wire connections. The abbreviation SMD stands for "surface-mounted device."

[0003] TO and DO semiconductor packages are package configurations derived from original transistor and diode designs, respectively. Hereinafter, the terms "TO package" and "DO package" will be used to refer to general external semiconductor package shapes with a specific basic structure and external contour.

[0004] A TO package, as described herein, consists, for example, of a TO socket, which serves as a carrier for the sensor components, and a TO lid, which covers the components on the TO socket in a dome shape. The TO lid has a TO end face that contains openings, at least in sections, allowing direct contact between the sensor components and the medium surrounding the vacuum sensor. The wiring is brought out of the TO socket on one side in the form of pins. This type of TO design enables a compact vacuum sensor and thus particularly easy handling with maximum protection of the sensor from external damage. The socket typically protrudes beyond the TO lid.

[0005] A DO enclosure, as described here, has a substantially cylindrical shape. The wiring is routed out of the enclosure on both sides, along the cylinder axis. A base is not necessarily required for the DO enclosure. The DO enclosure has no overhang and is purely cylindrical.

[0006] The design of the other semiconductor packages is correspondingly variable.

[0007] For the actual installation of such a vacuum sensor housed in a semiconductor package, for example in the area of ​​a receiver, a vacuum chamber, a container, and similar arrangements, a device housing is required. This housing must protect the vacuum sensor and securely anchor it in a defined position relative to the vacuum being measured. The device housing is therefore robustly constructed and features the appropriate external connection means for securely attaching it to the receiver, such as screw threads, clamps, swivel joints, plug connectors, and similar coupling options.

[0008] Of particular importance is the secure mounting of the vacuum sensor's semiconductor package within the device housing itself. This mounting must be sufficiently stable and vacuum-tight, and it must not impair the functionality of the vacuum sensor or the cleanliness of the overall system (e.g., through outgassing). Furthermore, it must be compatible with the specific semiconductor package used for the vacuum sensor.

[0009] Typically, the entire vacuum sensor is mounted in a vacuum. Vacuum sealing and electrical contact are then achieved via a separate vacuum feedthrough. Clamping is also an option. For example, to mount a vacuum sensor with a TO (tubular envelope) package inside a device housing, a configuration is used where the TO package is clamped within the device housing. A constant clamping force, combined with a sealing material located between the TO package and an adjacent contact surface of the device housing, secures the TO package in position and achieves the required vacuum seal. This clamping effect is achieved by a clamping plate pressing against the TO socket, which is tightened using clamping screws.The TO end face of the TO cap typically serves as the counter bearing. This end face is pressed towards the base of a receiving socket that accommodates the TO body. A sealing material located between the base and the TO end face, such as an elastic O-ring, absorbs the pressure and simultaneously creates a seal.

[0010] The aforementioned clamping plate typically fulfills additional functions besides clamping. In particular, it serves as a circuit board for electronics that operate the sensor components of the pressure sensor system located inside the TO package.

[0011] This configuration, common in the prior art, is problematic in several respects. Firstly, it cannot be ruled out that the clamping force and the resulting pressure on the TO housing could adversely affect the sensors and the housing itself. At the very least, care must be taken during installation of the TO housing in the device enclosure to ensure that the clamping force is not excessive. On the other hand, however, it is precisely this clamping force that ensures the vacuum tightness of the entire sensor assembly. Therefore, it is essential to ensure that the clamping force is not too low. It goes without saying that this requires a certain level of experience when installing the TO housing in the device enclosure.

[0012] Furthermore, the sealing material clamped between the TO end face and the base of the receiving socket is subject to progressive fatigue over time. After a certain period of use of the vacuum sensor, leaks can no longer be ruled out with the necessary certainty. To ensure operational reliability with the required measurement accuracy of the pressure sensor, regular maintenance work is therefore necessary, during which at least the sealing material must be replaced. This necessitates the removal and subsequent reinstallation of the TO housing, the latter of which must be carried out with the necessary care as described.

[0013] In addition, the sealing material clamped in this way has two significant disadvantages in vacuum technology. Firstly, an elastomer-sealed connection cannot achieve a leakage rate lower than 10 -8mbar l / s can be achieved. This is due to the physically limited permeation rate of the elastomer material. Furthermore, the material composition of the elastomer connectors is characterized by fluorine compounds, which impart important properties to the material. In vacuum applications, fluorine compounds can leach from the material and enter the actual vacuum process. This can lead to impermissible fluorine contamination, negatively impacting the vacuum process and potentially causing complete system failure.

[0014] Ultimately, the entire configuration is too complex and disadvantageous in its complexity and the arrangement of the required parts. The clamping plate and clamping screws take up a relatively large amount of space, thus limiting the miniaturization of the entire assembly. Furthermore, the clamping plate is, in a sense, a disruptive component. It requires at least feedthroughs for the contacts and wiring of the sensor components in the TO package. If the clamping plate also carries electronic components of the measuring sensor, corresponding wiring to the components inside the TO package is necessary. In most cases, this wiring is permanently integrated to achieve the most miniaturized design possible, because plug connections take up too much space. On the other hand, this means that the TO package with the sensor components and the connected electronics on the clamping plate cannot be replaced separately.Both components must then be replaced as a whole.

[0015] Finally, the electronics are located relatively close to the recipient and therefore at the point of pressure measurement itself. This means that it cannot be ruled out that the electronics and the processes within the recipient will influence each other, thereby at least distorting the result of the pressure measurement. For certain measurements, gases, and pressure conditions, however, electronics located so close to the recipient are undesirable. While the electronics can then be positioned further away from the mounting plate, the mounting plate, as described, limits the possible miniaturization of the pressure sensor itself.

[0016] Integrating a vacuum sensor into a different semiconductor package within the intended device housing is correspondingly variable and multifaceted. Suitable sealing materials must be selected and adapted to the semiconductor package in each case. The mechanical clamping devices and the routing of the wiring to the corresponding downstream electronics of the vacuum sensor also require individual adaptation. This necessitates a considerable amount of design work for each specific semiconductor package design.

[0017] The task is therefore to eliminate the described disadvantages and to create an arrangement for mounting a vacuum sensor with a semiconductor housing in a surrounding device housing, in which these disadvantages are avoided from the outset.

[0018] The problem is solved by an arrangement for mounting a vacuum sensor with a semiconductor housing in a surrounding device housing, having the features of claim 1. The dependent claims contain expedient and / or advantageous embodiments and configurations.

[0019] The arrangement for fastening a vacuum sensor with a semiconductor housing in a surrounding device housing, in particular a vacuum connection flange, is designed according to the invention such that the semiconductor housing is connected at least section by section to adjacent sections of the device housing in a vacuum-tight manner by means of an adhesive connection.

[0020] According to the invention, the semiconductor package is thus bonded into the surrounding device housing in the intended position. The adhesive bond ensures the secure hold of the semiconductor package in place within the device housing and also provides a vacuum-tight seal around the installed semiconductor package. A clamping connection and additional sealing materials adapted to the specific design are therefore no longer required. The disadvantages associated with such a clamping connection, mentioned at the outset, are thus completely eliminated. The wiring of the vacuum sensor can therefore be easily routed out of the surrounding device housing, the space otherwise required for clamping devices is no longer needed, and the device housing can be reduced in size accordingly. Furthermore, leakage rates of less than 10 -9mbar l / s are achieved. These are therefore an order of magnitude lower than mechanical elastomer seals.

[0021] In a first embodiment, the arrangement for mounting a vacuum sensor is a semiconductor package in the form of a TO package within a device housing. The TO package consists of a TO socket and a TO lid, and the surrounding device housing, which is in particular a vacuum connection flange, is designed according to the invention such that the TO package is vacuum-tightly connected, at least partially, to adjacent sections of the device housing by means of an adhesive bond.

[0022] In one embodiment of the arrangement, the TO package is inserted into a receiving socket of the device housing via its TO lid, with the adhesive connection being provided between a cladding surface of the TO lid and the inner wall of the receiving socket.

[0023] In another embodiment, the TO housing is inserted into the receiving socket of the device housing via its TO cover, with the adhesive connection being provided between a TO socket flank of the TO socket and a corresponding section of the inner wall of the receiving socket.

[0024] In another embodiment, the TO housing is inserted into the receiving socket of the device housing via its TO cover, with the adhesive connection being provided between a TO shoulder of the TO socket and a stepped shaping of the receiving socket.

[0025] Finally, in a further embodiment, the adhesive bond is provided as a vacuum-tight filling that continuously covers the contact surface between the outer surface of the TO cover and the inner wall of the receiving socket, as well as between the TO base flank and the TO shoulder of the TO socket and the corresponding contact surfaces of the receiving socket. In this embodiment, the TO housing is cast into the designated mounting location via the adhesive bond.

[0026] In another embodiment, the semiconductor housing is an SMD package mounted directly on a circuit board, with a housing body that accommodates the vacuum sensor. The adhesive bond is formed between the housing body and the receiving socket of the device housing.

[0027] In another embodiment, the semiconductor package is a TO or DO package without overhangs and has a straight side surface, wherein the adhesive bond is formed in the area of ​​the surface and / or the end face of the semiconductor package.

[0028] In another embodiment, the adhesive bond is formed in the area of ​​a wiring of the semiconductor housing and a mechanical guide for the wiring.

[0029] The arrangement according to the invention will be explained in more detail below using exemplary embodiments. The accompanying figures serve to illustrate this.

[0030] It shows: Fig. 1. a basic structure of a TO package for a vacuum sensor that is known and common in the prior art, Fig. 2 a clamping connection between the TO package and a device housing that is known and common in the prior art, Fig. 3 a first exemplary embodiment according to the invention with an adhesive bond between the outer surface of the TO cover and the inner wall of the receiving socket, Fig. 4 an exemplary embodiment with an adhesive connection between a TO shoulder of the TO socket and a stepped shaping of the receiving socket, Fig. 5 an embodiment with a TO package protruding from the receiving socket of the device housing, Fig. 6 an exemplary embodiment with an adhesive bond as a vacuum-tight filling between the TO housing and the receiving socket, Fig. 7 A top view of several TO enclosures inserted into a common device housing and attached by means of adhesive bonding, Fig. 8 a vacuum sensor with an SMD package and the corresponding connection components, Fig. 9 an exemplary installation of the vacuum sensor with SMD housing into a surrounding device housing, Fig. 10 a vacuum sensor with a purely cylindrical semiconductor package, in particular a DO package, without overhang in a device housing with an adhesive bond in the jacket area, Fig. 11 a vacuum sensor with a purely cylindrical semiconductor package, in particular a DO package, without overhang in a device housing with an adhesive connection in the end area, Fig. 12 an exemplary adhesive bond in the area of ​​the wiring of the vacuum sensor.

[0031] Fig. Figure 1 shows a known and common TO package for a vacuum sensor. The vacuum sensor 1 is only indicated in this example. It could, for instance, be a MEMS chip for a Pirani pressure sensor. The MEMS chip is located in a TO package 2, consisting of a TO socket 3, which serves as a carrier and contact surface for the MEMS chip. The TO socket has wires 3a through which the vacuum sensor can be connected to evaluation electronics. A TO cover 6 is also provided, which at least partially covers the area of ​​the MEMS chip in the direction of the vacuum to be measured. The TO cover has an opening (not shown) through which the vacuum sensor is in contact with the medium to be measured in the receiver.

[0032] The TO socket 3 has a TO socket flank 5 and a TO shoulder 4. The TO lid 6 includes a TO shell surface 7 and a TO end face 8. The opening for the medium to enter the vacuum sensor is usually located in the TO end face.

[0033] The TO package itself is vacuum-tight; the individual components of the TO package, i.e., the TO socket and the TO cap, are usually welded or soldered together. Crimp connections and other similar vacuum-tight connections are also possible.

[0034] Fig. Figure 2 shows a known and common clamping connection between a TO package and a surrounding device housing in a sectional view and a top view. The TO package 2 corresponds in its construction to the illustration from Figure 2. Fig. 1 and is additionally highlighted by hatching. The device housing 9 surrounds the TO housing inserted therein. The TO housing 2 is inserted into a receiving socket 10 of the device housing. The receiving socket 10 has a socket base 11. The socket base 11 contains bores 12 to ensure the connection between the vacuum in the volume of the recipient to be measured and the TO housing 2, and ultimately the vacuum sensor. A sealant in the form of an elastic O-ring 13 is located between the socket base 11 and the TO end face 8 of the TO housing. This also serves as a spacer between the socket base 11 and the TO end face 8.

[0035] The TO package 2 is clamped in the receiving socket 10 of the device housing 9. A clamping plate 14 serves this purpose, exerting a compressive force on the rear of the TO socket of the TO package 2. Clamping screws 15 are provided to generate this compressive force. These screws pass through corresponding bores in the clamping plate 14 and are screwed into threaded bores 16 in corresponding sections of the device housing 9. The socket base 11 and the O-ring 13 serve as abutments for the clamping force exerted on the TO package.

[0036] The following examples illustrate a series of adhesive bonds between a semiconductor package and a device housing. The semiconductor package is initially, for example, a TO package.

[0037] Fig. Figure 3 shows a first exemplary embodiment of the invention with an adhesive bond between the outer surface of the TO cover and the inner wall of the receiving socket. For clarity, the adhesive bond is shown only from one side below. However, it is clear that the adhesive bond is advantageously applied around the entire periphery of the corresponding sections.

[0038] The TO package 2 is shown in the illustration in Fig. 3 is highlighted by hatching. The TO package 2 again consists of the TO socket 3 and the TO cover 6. The device housing 9 contains the receiving socket 10. The TO package 2 is inserted into the receiving socket along the TO cover 6. The TO cover 6 has a cladding surface 7. This is located directly opposite an inner wall 10a of the receiving socket 10.

[0039] In the area of ​​the TO socket 3, the TO socket has a socket flank 5. When the TO package is inserted into the receiving socket 10, the socket flank 5 is located directly opposite a section 10b of the inner wall 10a of the receiving socket 10. The gap between the opposing sections 7 and 10a, as well as 5 and 10b, is filled with an adhesive, forming an adhesive bond 17 between each of these sections. The adhesive bond covers the entire circumference of the outer surface 7 and the inner wall 10a, as well as the socket flank 5 and section 10b of the inner wall of the receiving socket. The adhesive thus completely fills the gap in these areas and seals it vacuum-tight, securely and stably anchoring the TO package in the receiving socket.

[0040] In the example from Fig. 3. Therefore, an adhesive bond is provided both between the TO socket and the receiving socket, and between the TO lid and the receiving socket. It is clear that one of these adhesive bonds can be omitted as long as the TO package is anchored in the receiving socket in a positionally stable and vacuum-tight manner.

[0041] The adhesive bond eliminates the need for a socket base as a counter bearing for the receiving socket. The entire surface of the TO end face 8 is thus completely exposed, and the vacuum sensor within the TO package is therefore maximally accessible to the medium in the receiver being measured.

[0042] Fig. Figure 4 shows an exemplary embodiment with an adhesive bond between a TO shoulder of the TO socket and a stepped recess of the receiving socket. For clarity, the adhesive bond is shown only on one side. The adhesive bond extends over the entire periphery of the TO shoulder and the recess.

[0043] In the exemplary embodiment in Fig. Figure 4 takes advantage of the fact that the diameter of the TO socket 3 is larger than that of the TO lid, and the TO socket therefore has the TO shoulder 4. The TO shoulder 4 on the TO socket 3 rests on a projection 18 on the terminal socket 10. The contact surface thus formed is wetted with an adhesive, so that the adhesive bond 17 is formed in this area. It is clear that the adhesive bond covers the entire periphery of the projection 3b and the projection 18, so that the adhesive bond is vacuum-tight.

[0044] The adhesive connection between the TO shoulder 4 and the molding 18 enables a space-saving and material-reduced design of the device housing 9, in particular a tight dimensioning of the receiving socket.

[0045] Fig. Figure 5 shows an example of a reduced-depth receiving socket 10, in which the TO package 2, with its TO lid 6 and TO end face 8, projects from the device housing into the vacuum to be measured and is thus maximally exposed. The adhesive bond between the TO shoulder 4 and the recess 18 is located inside the device housing in a position not exposed to the vacuum, but in any case ensures a firm, vacuum-tight anchoring of the TO package in the device housing.

[0046] Fig. Figure 6 shows an example where the adhesive bond 17 covers and completely fills all contact areas between the TO package 2 and the receiving socket 10 of the device housing 9. Here, the adhesive bond 17 is designed as a filler that completely seals the gap between the TO package and the receiving socket. It completely covers the portion of the TO lid's outer surface 7 located within the receiving socket, the inner wall 10a of the receiving socket, the TO base 3 at its base flank 5, the corresponding section 10b of the receiving socket, the TO shoulder 4, and the recess 18. With such a filler, the TO lid of the TO package 2 can protrude from the receiving socket 10 into the vacuum region in the area of ​​the TO end face 8.

[0047] Fig. Figure 7 shows a top view of several TO enclosures 2 inserted into a common device housing 9 and secured by adhesive bonds. In this example, the device housing 9 has two receiving sockets 10, into each of which a TO enclosure 10 is inserted and vacuum-tightly secured by the adhesive bond 17. It is understood that the number of individual receiving sockets in the device housing 9 can be arbitrary.

[0048] Adhesive bonding offers a number of advantages. In particular, bonding is possible on almost all surfaces and geometries. This allows for the simple attachment of highly variable semiconductor packages. Force vectors do not need to be considered with adhesive bonds. Furthermore, an adhesive bond serves as a sensor mount, sensor attachment, and sensor seal all in one. This allows for greater degrees of freedom and increased flexibility in the design of the device housing. These advantages can be used for miniaturization, component savings, and / or reduced manufacturing effort. Additionally, adhesive bonding enables easy adaptation and application to any vacuum sensor geometry, i.e., to a wide variety of different semiconductor packages.

[0049] The described adhesive bond ensures a reliable seal even on undefined surfaces or surfaces with generous or uncertain dimensional tolerances. Furthermore, such adhesive bonds guarantee improved force transmission to the semiconductor package. This prevents unfavorable, one-sided, and excessively high force vectors on the package and eliminates the risk of damage. The bonding process itself can be performed at sufficiently low temperatures, ensuring that the components of the vacuum sensor located within the TO package, particularly the MEMS chip, are not damaged and that a vacuum seal is established. Epoxy resin or polymer adhesives can be used for this purpose. Additionally, the adhesive used is characterized by its absence of fluorine compounds. This prevents unwanted contamination of the process vacuum.

[0050] The following examples of embodiments relate to semiconductor packages in further configurations.

[0051] Fig. Figure 8 shows an example of a vacuum sensor with an SMD package. In this example, the vacuum sensor 1 is a MEMS chip with a surrounding SMD package 19, which protects the MEMS chip from external damage and also has an access opening 20 that allows the MEMS chip to connect to the surrounding vacuum to be measured. According to the basic structure of an SMD configuration, the MEMS chip and the package are mounted directly onto a printed circuit board 21, which typically contains other electronic components for operating the MEMS chip. The SMD package and external components are connected via pins 22 on the printed circuit board 21.

[0052] Fig. Figure 9 shows an example of the SMD vacuum sensor. Fig. 8. The SMD vacuum sensor is installed in an external device housing 9. Its package 19 is inserted into a designated receiving socket 10 of the device housing 9 and secured with vacuum-tight adhesive bonds 17. In this example, the adhesive bonds are located in the area of ​​the access opening 20 and in the area of ​​the upper section of the receiving socket 10 towards the circuit board 21. It is clear that, in principle, an adhesive bond should be provided at every contact point between the package and the receiving socket.

[0053] Fig. 10 and Fig. Figure 11 shows exemplary installation situations for a generally cylindrical sensor housing 23 without a protrusion in the area of ​​a base in the surrounding device housing 9. This can be, for example, a DO housing or a modified TO housing from one of the previously mentioned embodiments. The cylindrical sensor housing 23 is inserted into a receiving socket 10 and according to Fig. 10 in the area of ​​the outer surface is vacuum-tightly bonded to the inside of the receiving bushing 10 by means of an adhesive bond 17. In the case of the Fig. In the example shown in 11, the adhesive joint 17 is arranged in the area of ​​the end face of the cylindrical semiconductor housing.

[0054] It is obvious that an end-face adhesive joint 17 can also be arranged in all previously described embodiments, provided that the receiving bushing is designed accordingly and provided that such an end-face adhesive joint is desired or required.

[0055] Fig. Figure 12 shows an exemplary adhesive bond in the wiring area of ​​the vacuum sensor. This embodiment is illustrated here using a TO package 2 from one of the preceding embodiments. However, it is not limited to a TO package, but can also be applied analogously to other semiconductor packages. The assembly is designed to consist of Fig.12 A guide for the wiring 3a of the TO package in the form of a guide plate 24, which is provided with feedthroughs 25 for the wiring 3a, i.e., at least for pins present in the area of ​​the TO package. The guide plate does not exert any force-fit or clamping effect on the semiconductor package. It merely defines an area for the adhesive bond 17. In the present example, the adhesive bond 17 is provided between the guide plate 24 and the section of the semiconductor package located below it, here the TO socket 3. In addition, in this example, the adhesive bond also surrounds the flanks of the guide plate 24 and its upper surface as a kind of potting compound.

[0056] It is one-sided that the various exemplary configurations of the adhesive bonds can be combined with each other, so that further designs are possible here.

[0057] The invention has been explained using exemplary embodiments. Further embodiments are possible within the scope of expert knowledge. Further embodiments are also described in the dependent claims. Reference symbol list 1 vacuum sensor, indicated 2 TO enclosures 3 TO sockets 3a Wiring 4 TO paragraph 5 TO base flank 6 TO lids 7 TO shell area 8 TO end face 9 Device housings 10 Recording socket 10a Interior wall 10b Interior wall in the area of ​​the TO base 11 socket bottom 12 bore 13 O-ring 14 Chipboard 15 Tensioning screw 16 threaded holes 17 Adhesive bond 18 Formation 19 SMD package 20 Access opening 21 circuit board 22-pin 23 Cylindrical sensor housing 24 Guide plate 25 Implementation

Claims

[1] Arrangement for fastening a vacuum sensor (1) with a semiconductor housing in a surrounding device housing (9), in particular a vacuum connection flange, wherein the semiconductor housing is connected at least in sections to adjacent sections of the device housing (9) by means of an adhesive connection (17) in a vacuum-tight manner. [2] Arrangement according to claim 1, characterized by that the semiconductor housing is a TO housing (2) consisting of a TO base (3) and a TO cover (6), wherein the TO housing (2) is connected at least in sections to adjacent sections of the device housing (9) by means of an adhesive connection (17) in a vacuum-tight manner. [3] Arrangement according to claim 2, characterized by that the TO housing (2) is inserted via its TO cover (6) into a receiving socket (10) of the device housing (9), wherein the adhesive connection (17) is provided between a jacket surface (7) of the TO cover (6) and the inner wall (10a) of the receiving socket (10). [4] Arrangement according to claim 2 or 3, characterized by that the TO housing (2) is inserted into the receiving socket (10) of the device housing (9) via its TO cover (6), wherein the adhesive connection (17) is provided between a TO socket flank (5) of the TO socket (3) and a corresponding section (10b) of the inner wall (10a) of the receiving socket (10). [5] Arrangement according to one of claims 2 to 4, characterized by that the TO housing (2) is inserted into the receiving socket (10) of the device housing (9) via its TO cover (6), wherein the adhesive connection (17) is provided between a TO shoulder (4) of the TO base (3) and a step-shaped formation (18) of the receiving socket (10). [6] Arrangement according to one of claims 2 to 5, characterized bythat the adhesive connection (17) is provided as a vacuum-tight filling that continuously covers the contact surface between the outer surface (7) of the TO cover (6) and the inner wall (10a) of the receiving socket (10) as well as between the TO socket flank (5) and the TO shoulder (4) of the TO socket (3) and the corresponding contact surfaces of the receiving socket (10). [7] Arrangement according to claim 1, characterized by that the semiconductor housing (1a) is an SMD package (19) which sits directly on a printed circuit board (21) and accommodates the vacuum sensor (1), wherein the adhesive connection (17) is formed between the SMD package and the receiving socket (10) of the device housing (9). [8] Arrangement according to claim 1, characterized bythat the semiconductor housing is a protrusion-free cylindrical housing, in particular a TO or DO housing, with a straight lateral surface, wherein the adhesive connection (17) is formed in the region of the surface and / or the end face of the semiconductor housing. [9] Arrangement according to one of the preceding claims, characterized by that the adhesive connection (17) is formed in the region of a wiring (3a) of the semiconductor housing and a mechanical guide means of the wiring.

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