Coil former, inductive component and power converter with this coil former

Abstract

Coil former (1) for an inductive component (2), e.g. an electrical coil (3) or an electrical transformer (4), wherein the coil former (1) comprises a heat sink (5), wherein the heat sink (5) contains a cooling channel (6), wherein the coil former (1) comprises an electrically insulating plate (7), preferably an FR4 plate, wherein the electrically insulating plate (7) and the heat sink (5) are connected to each other and the coil former (1) is arranged to enclose a core (8), in particular completely, wherein a plurality of cooling pins (12) are arranged in the cooling channel (6), the cooling pins extend into the cooling channel, wherein the heat sink (5) is made of metal using an additive manufacturing process.

Description

[0001] The invention relates to a coil former for an inductive component, in particular for an electrical coil or an electrical transformer, as well as to an inductive component comprising such a coil former and to an electronic power converter for an industrial process arrangement comprising such an inductive component. Background of the invention

[0002] The invention lies in the field of electrical power conversion for special power-intensive industrial processes prone to instability, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging devices for large batteries, such as flow batteries, melting of solids, heating and / or gasification of liquid substances using, for example, microwave energy or induction heating. What all these processes have in common is that they are designed to generate and accelerate charged atomic particles in a gas and / or plasma environment or liquid or even in a solid. Such processes are often prone to unpredictable reflections, impedance changes and other instabilities. What all these processes also have in common is that they have a high power consumption in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more.Many of these processes also have very high requirements for the stability of the power supply due to the highly complex processes, such as semiconductor production using plasma processes and / or heating by electromagnetic fields. Typically, power is converted from a mains frequency, which is in the range of approximately 50 Hz to 60 Hz, to different frequencies, which can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also called DC power, is also conceivable. For this conversion of electrical power into other frequencies, a large number of electronic components and assemblies are required, in particular power semiconductor components, such as transistors or diodes designed for currents ≥ 10 A and voltages ≥ 400 V. In addition to these components that require cooling, a power converter also has one or more inductive components. An inductive component, such asA coil or a transformer has at least one, and often several, turns of an electrical conductor. When current flows, this conductor heats up due to its unavoidable ohmic resistance and other electromagnetic effects. An inductive component, such as a coil or a transformer, also often has an iron core, made of iron sheets or ferritic material, for example, to increase the magnetic field strength. Such a core also heats up during operation due to various electromagnetic effects. The resulting heat loss must be dissipated to protect the component from overheating. Often, there is only a very limited area of ​​just a few cm available for dissipating the heat loss. 2available. It is a particular challenge, particularly for the power converter described here for an industrial process arrangement, to dissipate this waste heat in order to protect the component(s) from being destroyed by overheating. Very large and material-intensive heat sinks are often provided for this purpose, the production of which is very expensive and also counteracts the desired reduction in space requirements. In addition, the electrical conductor is temperature-dependent; for the materials commonly used, its resistance increases with temperature. As the resistance of the electrical conductor increases, so do the losses, generating even more heat. Cooling therefore not only protects the components from overheating but also enables better efficiency of the entire inductive component.

[0003] DE202018103875U1 discloses a transformer for a power converter with cooling described above. To improve cooling, a heat sink is provided, which is electrically and thermally connected to at least one conductor intended for current conduction. However, this type of cooling is not sufficient for all applications. The heat sink could be made larger or multiple heat sinks could be provided.

[0004] Since the space in the housing of such a power supply is limited, expanding the cooling surface is not possible indefinitely. Reducing the performance of individual components is also not effective. Overall, inadequate cooling of the electrical components results in costs.

[0005] Heat sinks are designed to dissipate the heat generated during operation of a unit to be cooled. Some have a cooling channel through which coolant, particularly coolant liquid, preferably cooling water, can flow. To achieve high cooling performance, it is advantageous to design the interior of the cooling channel so that close thermal contact is established between the heat sink and the coolant. At the same time, however, the interior of the cooling channel should be designed so that the pressure loss of the coolant flowing through the cooling channel is not excessive.

[0006] There is a desire to make power converters ever smaller, partly with the goal of being able to place them closer to the industrial process. To achieve this, the inductive components must also be made smaller. Adequate cooling is often the main problem. The smaller a component becomes, the smaller its surface area becomes where heat transfer can occur. Problem underlying the invention

[0007] The invention is based on the object of creating a coil former for an inductive component, in particular for an electrical coil or an electrical transformer, with improved cooling. A further object of the invention is to provide an inductive component with such a coil former. Furthermore, it is an object of the invention to provide an electronic power converter for an industrial process arrangement with such an inductive component. Inventive solution

[0008] With respect to the coil former, this object is achieved by a coil former having the features of claim 1. With respect to the inductive component, the object is achieved by an inductive component having the features of claim 22. With respect to the industrial process arrangement, the object is achieved by an industrial process arrangement having the features of claim 27.

[0009] The coil former is provided for an inductive component, for example for an electrical coil or an electrical transformer. The coil former comprises a heat sink. In particular, the coil former comprises two or more heat sinks. Each heat sink contains a cooling channel designed for the flow of a cooling liquid. Furthermore, the coil former comprises an electrically insulating plate. In particular, the coil former comprises two or more electrically insulating plates. Preferably, the electrically insulating plate is an FR4 plate. The electrically insulating plate and the heat sink are connected to one another. In particular, several electrically insulating plates and heat sinks are connected to one another. These are connected in such a way that a mechanically connected arrangement is created. The arrangement of electrically insulating plates and heat sinks is designed to enclose a core.In particular, the arrangement completely encloses the core. A cooling channel preferably comprises cooling pins. A plurality of cooling pins is particularly preferably arranged in the cooling channel. The cooling pins extend into the cooling channels. The heat sink is made of metal using an additive manufacturing process.

[0010] In one aspect, the cooling channel of the heat sink has a designated flow direction through which coolant flows.

[0011] In one aspect, the cooling channel may have a first cooling wall on the side of the cooling channel facing the unit to be cooled, i.e. a core or a winding.

[0012] In one aspect, the cooling channel may include a plurality of cooling pins within the cooling channel extending from the first cooling wall into the cooling channel.

[0013] A heat sink made of metal can dissipate heat very effectively. However, it has the disadvantage of being electrically conductive. Due to this electrical conductivity, there is a risk that currents will be induced within it. These could lead to additional undesirable losses. This current flow can be reduced, preferably eliminated, by combining such a heat sink with the electrically insulating plate. In one aspect, the heat sink and the electrically insulating plate are arranged such that the heat sink cannot completely enclose a core.

[0014] FR4 is a class of flame-retardant composite materials consisting of epoxy resin and fiberglass fabric. The abbreviation FR stands for "flame retardant."

[0015] Additive manufacturing processes enable the layer-by-layer construction of components directly from digital models by selectively applying material. In contrast to subtractive methods, which require material to be removed, additive processes offer high flexibility in the design of complex geometries and are particularly efficient in material consumption. Furthermore, additive manufacturing processes offer the possibility of producing monolithic components with cavities and complex internal structures. These technologies are widely used in prototype development, small-scale production, and increasingly also in industrial production.

[0016] A heat sink made of metal using an additive manufacturing process has a surface structure specific to this manufacturing process. This structure is characterized by a rough surface because the metal is first melted during the additive manufacturing process and then hardens upon cooling. This roughness is similar to a very fine crystal structure, such as that found in nature. This roughness leads to a particularly large surface area between the coolant and the metal. This increased surface area increases heat transfer between the heat sink and the coolant. In addition, turbulence forms particularly well on the rough surface, which is also beneficial for heat transfer between the heat sink and the coolant.The heat sink therefore has this rough surface structure, which is typical of the additive manufacturing process, at least partially, preferably predominantly, on the wall facing the cooling liquid.

[0017] One or more outer surfaces of the heat sink can be ground or shaped after the additive manufacturing process step. This allows for favorable heat transfer from a winding or an electrical conductor of the inductive component and / or from a core of the inductive component to the heat sink.

[0018] In one aspect, the heat sink is manufactured using selective laser melting (SLM). Selective laser melting is an additive manufacturing process used to produce metal components. The metal powder is applied layer by layer and precisely melted and solidified using a high-power laser to create a three-dimensional component. A heat sink made of metal using SLM exhibits a surface structure specific to this manufacturing process. This structure is characterized by a particularly rough surface.

[0019] SLM is widely used in industries that place high demands on component quality and precision, such as aerospace, medical technology, automotive, and tool manufacturing. Thanks to its ability to produce components with complex internal structures and high material utilization, the process is increasingly being used for demanding, customized applications.

[0020] The advantages of SLM processes include the production of complex geometries. The process enables the manufacture of highly complex and intricate structures that are difficult or impossible to achieve using conventional manufacturing methods. Furthermore, the SLM process allows for a wide variety of materials. SLM can be performed with various metals such as aluminum, titanium, stainless steel, and nickel, as well as numerous alloys containing these materials, making it attractive for numerous industries. The SLM process is also very cost-effective for small series production. Especially for the production of prototypes and small series, SLM can be more cost-effective than conventional manufacturing processes because no special tools or molds are required.

[0021] Typically, the process of an SLM procedure is divided into the following steps: 1. Powder deposition: A thin layer of metal powder is evenly distributed on a build platform. The powder consists of fine metal particles, typically in the micrometer range. 2. Laser melting: A laser beam, controlled by a CAD model of the component, scans the applied powder layer and melts the metal where the component is to be created. The laser beam moves very precisely and in a controlled manner over the powder, creating the desired geometry of the current layer. 3. Lowering the build platform: After a layer has been melted and solidified, the build platform lowers by the thickness of a powder layer. 4. Repeat the process: A new layer of powder is applied, and the laser melts the relevant areas again. This process is repeated until the entire component is built up layer by layer. 5. Post-processing: After the printing process, the excess, unsolidified powder is removed and the part can undergo post-processing, such as heat treatment, surface treatment or removal of support structures.

[0022] The disadvantages of the SLM manufacturing process are the time and cost. For the same component size, a heat sink manufactured using an additive manufacturing process, especially an SLM manufacturing process, would be many times more expensive than one produced by machining, pressing, or casting. In the past, this manufacturing process was therefore discouraged for larger series and cost-critical developments. However, since the size of the heat sink has been significantly reduced due to its significantly increased efficiency, costs and production time have also been reduced. This makes heat sinks manufactured using this additive manufacturing process, especially the SLM manufacturing process, attractive again. Since the weight and dimensions of the coil former could also be significantly reduced, this type of heat sink became even more attractive.Over the course of development, even more heat could be dissipated from a smaller area on the inductive component. This allowed the conductors and / or core of the inductive component to be improved, in particular, further reduced in size, leading to a further reduction in the dimensions of a power converter. Components surrounding the inductive component could also be arranged in a more space-efficient manner. This also reduced the length of the supply lines to these components. This led to a reduction in electromagnetic interference and susceptibility to interference in the device and a further reduction in power loss. All of these positive effects combined justify the higher manufacturing costs of a heat sink manufactured additively, particularly using the SLM manufacturing process.

[0023] In one aspect, the heat sink comprises a one-piece main body. This means that the heat sink is designed as a single, continuous component. This enables increased mechanical stability and improved heat dissipation. By eliminating a multi-piece construction, potential weak points that could arise from connections or joints are avoided. This contributes to the longevity and reliability of the coil former. This is particularly advantageous in the context of liquid cooling of the heat sink, as the one-piece main body does not require seals or the like, which would be necessary with multi-piece designs. This eliminates the risk of coolant leakage, further increasing the operational reliability and efficiency of the cooling system.This design also simplifies the manufacture and assembly of the coil former, as fewer individual parts are required and the heat sink can be manufactured more efficiently as an integral part of the coil former.

[0024] In one aspect, the heat sinks are made of metal, specifically copper. Copper offers excellent thermal conductivity, further improving cooling efficiency.

[0025] In one aspect, the heat sink may be configured to simultaneously cool a winding of the inductive component and a core of the inductive component.

[0026] In one aspect, the heat sink may be configured to simultaneously cool multiple turns of the inductive component.

[0027] In one aspect, the heat sink may be configured to simultaneously cool multiple cores of the inductive component.

[0028] In one aspect, the cooling channels of the heat sinks are suitable for the flow of a liquid, in particular water. The liquid is particularly advantageously suitable for liquid cooling.

[0029] In one aspect, the heat sink has a length and / or width of at least 40 mm.

[0030] In one aspect, the heat sink has a maximum length and / or width of 200 mm.

[0031] In one aspect, the heat sink has a thickness of at least 1 mm.

[0032] In one aspect, the heat sink has a thickness of at most 4 mm.

[0033] In one aspect, the electrically insulating plate has the geometry of a cuboid.

[0034] In one aspect, the electrically insulating plate has a length and / or width of at least 40 mm.

[0035] In one aspect, the electrically insulating plate has a length and / or width of a maximum of 200 mm.

[0036] In one aspect, the electrically insulating plate has a thickness of at least 1 mm.

[0037] In one aspect, the electrically insulating plate has a thickness of at most 4 mm.

[0038] In one aspect, two electrically insulating plates and two heat sinks are arranged such that they form the geometric shape of a tube in cross-section. The two heat sinks can be arranged parallel to each other. The electrically insulating plates can be arranged parallel to each other. Furthermore, the two electrically insulating plates and the two heat sinks are arranged such that they enclose the core.

[0039] The coil body advantageously has a rectangular cross-section. The cross-section can be in the shape of a tube, in particular a rectangular tube.

[0040] A rectangular tube is a hollow body with a rectangular cross-section. It consists of four side walls arranged at right angles to each other and enclosing an internal cavity.

[0041] In one aspect, the cooling pins of the heat sink are manufactured using an additive manufacturing process, in particular selective laser melting (SLM). Using such additive manufacturing processes, the cooling pins can be applied to the first cooling wall of the heat sink in virtually any orientation. Even with additive manufacturing, certain restrictions must be observed in the structure, for example, on the inside, such as the installation angle, which should in particular be less than 45°, which would otherwise be impossible to achieve without a support structure.

[0042] In one aspect, the plurality of cooling pins may include at least one cooling pin of a first category oriented in a first inclination direction that is obliquely inclined relative to a normal to the first cooling wall.

[0043] In one aspect, the plurality of cooling pins may be arranged such that one cooling pin of the plurality of cooling pins does not intersect another cooling pin of the plurality of cooling pins.

[0044] In one aspect, a cooling pin, in particular a plurality of cooling pins, preferably the majority of the cooling pins, particularly preferably all cooling pins, has an oval or round cross-section.

[0045] In one aspect, a cooling pin, in particular a plurality of cooling pins, preferably the majority of the cooling pins, particularly preferably all cooling pins, has one of the following shapes: - Cylindrical shape - Pyramid shape, especially cone shape - Truncated pyramid shape, especially truncated cone shape - Pyramid shape with obliquely cut tip, especially cone shape with obliquely cut tip.

[0046] For shapes with a pointed tip, such as a pyramid or cone, the base of the mold is preferably positioned at the first cooling wall. For shapes with a larger base, such as a truncated pyramid or truncated cone, the larger base of the mold is preferably positioned at the first cooling wall. This allows for particularly effective heat transfer from the cooling wall into the cooling fluid.

[0047] In one aspect, each cooling pin of the plurality of cooling pins is arranged such that coolant can flow around it all around. This enables high heat transfer from the cooling pins to the coolant.

[0048] In one aspect, the plurality of cooling pins can be arranged such that one cooling pin of the plurality of cooling pins does not touch another cooling pin of the plurality of cooling pins. In this way, a distance is created between the cooling pins. This facilitates flow through the cooling channel; pressure loss is reduced.

[0049] In one aspect, the first inclination direction, viewed in a first projection direction, can be inclined obliquely to the perpendicular to the first cooling wall, wherein the first projection direction is the intended flow direction of the coolant, and the first inclination direction, viewed in a second projection direction, is also inclined obliquely to the perpendicular to the first cooling wall, wherein the second projection direction is orthogonal to both the intended flow direction and the perpendicular to the first cooling wall. This oblique orientation of the cooling pin, viewed both in the projection direction and in the second projection direction, results in an advantageous flow pattern in the cooling channel, which, on the one hand, reduces the flow resistance in the cooling channel and, on the other hand, enables efficient heat transfer from the cooling pins to the coolant.

[0050] In one aspect, when viewed in a first projection direction, the first inclination direction in a first projection plane can be obliquely inclined to the perpendicular to the first cooling wall, wherein the first projection direction is the intended flow direction of the coolant and wherein the first projection plane is the plane perpendicular to the first projection direction, and also when viewed in a second projection direction, the first inclination direction in a second projection plane is obliquely inclined to the perpendicular to the first cooling wall, wherein the second projection direction is orthogonal to both the intended flow direction and the perpendicular to the first cooling wall, and wherein the second projection plane is the plane perpendicular to the second projection direction. An obliquely inclined orientation of the cooling pin results in both the first projection plane and the second projection plane.

[0051] In one aspect, the plurality of cooling pins may comprise at least one cooling pin of a second category oriented in a second inclination direction that is inclined relative to the perpendicular to the first cooling wall, wherein the second inclination direction is different from the first inclination direction. In this embodiment, the plurality of pins comprises cooling pins of the first category oriented in a first inclination direction and cooling pins of the second category oriented in a second inclination direction. The different orientation of the cooling pins creates a flow pattern in the cooling channel that has proven advantageous for efficient heat dissipation.

[0052] In one aspect, viewed in a first projection direction, the second inclination direction may be obliquely inclined to the perpendicular to the first cooling wall, wherein the first projection direction is the intended flow direction of the coolant, and also viewed in a second projection direction, the second inclination direction is obliquely inclined to the perpendicular to the first cooling wall, wherein the second projection direction is orthogonal to both the intended flow direction and the perpendicular to the first cooling wall.

[0053] In one aspect, the cooling pins of the second category may be oriented at an angle both when viewed in the first projection direction and when viewed in the second projection direction.

[0054] In one aspect, a plurality of cooling pins of the first category are arranged along a first straight line running along the first cooling wall. In this embodiment, a plurality of cooling pins are arranged along a straight line with a consistent orientation. The resulting structure of a plurality of cooling pins spaced apart from one another and oriented in the same direction enables effective heat transfer to the flowing coolant with low flow resistance.

[0055] In one aspect, the plurality of cooling pins is arranged such that a cooling pin of the first category overlaps with a cooling pin of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Overlapping" here means that at least one cooling pin of the first category at least partially obscures another cooling pin of the second category in the predetermined viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and consequently the heat transfer from the cooling pins to the coolant.

[0056] In one aspect, the plurality of cooling pins is arranged such that a cooling pin of the first category is intertwined with two cooling pins of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Intertwined" here means that at least one first cooling pin of the first category at least partially obscures a second cooling pin of the second category in the predetermined viewing direction, and the first cooling pin itself is also at least partially obscured by another cooling pin of the second category in the predetermined viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.

[0057] In one aspect, the coil former is advantageously provided for an inductive component. The inductive component has a winding.

[0058] In one aspect, an insulating film, in particular polyimide film or Kapton film, can be arranged on the coil former. In particular, the insulating film is arranged between the coil former and the winding.

[0059] Polyimide film is a special type of plastic film made from polyimide, a high-performance polymer. This film is characterized by its excellent electrical insulation properties, high heat resistance, and chemical stability. Polyimide is resistant to temperatures up to 200°C as an insulation material, and up to 180°C with self-adhesive film.

[0060] Kapton film is a trademark of DuPont and is used for a special type of polyimide film developed and manufactured by DuPont. This film is characterized by its outstanding thermal, electrical, and mechanical stability and is used in many demanding industrial applications.

[0061] In one aspect, the winding at least partially surrounds the coil former. The winding is made of an electrically conductive material. Furthermore, the winding comprises multiple layers. An insulating film, in particular polyimide film or Kapton film, is arranged between the layers of the winding. For example, this insulating film can also be structurally identical to the one between the coil former and the winding.

[0062] In one aspect, the inductive component comprises a core. The core is made of a ferromagnetic material. In particular, it is made of iron, preferably ferrite.

[0063] In one aspect, a gap is formed between the coil body and the core.

[0064] In one aspect, the gap is filled with a thermally conductive, electrically insulating material. In particular, the gap is filled with casting resin.

[0065] In one aspect, the inductive component is designed such that the water-cooled coil former can reduce the energy loss of the winding and the core through cooling.

[0066] In one aspect, an electronic power converter for an industrial process arrangement may comprise the inductive component described here. Furthermore, the electronic power converter comprises a circuit board and further electronic components arranged on the circuit board. In particular, the further electronic components can be cooled by the same liquid as the coil former. In particular, the electronic power converter is designed for a plasma process arrangement or heating arrangement. Brief description of the drawings

[0067] Further advantageous embodiments are described in more detail below with reference to several exemplary embodiments shown in the drawings, to which the development described here is not, however, limited.

[0068] Not all claimed features are necessarily visible in the figures.

[0069] Embodiments of the invention are explained below with reference to the drawings. They show: Fig. 1 a schematic oblique view of a liquid-cooled inductive component, Fig. 2 a schematic sectional view of a liquid-cooled inductive component, Fig. 3 a schematic representation of a section of a heat sink comprising a cooling channel with cooling pins, Fig. 4 a schematic sectional view of a liquid-cooled electrical coil.

[0070] Fig. Figure 1 shows an oblique view of an inductive component 2 as an exemplary embodiment. The inductive component 2 shown here is an electrical coil. A comparable arrangement for a transformer would also be conceivable.

[0071] The inductive component 2 comprises a coil body 1.

[0072] The coil former 1 comprises two opposing heat sinks 5 and two opposing electrically insulating plates 7. The electrically insulating plates 7 and the heat sinks 5 are connected to one another to form a cuboid-shaped tube enclosing the core 8. Other geometries are also conceivable. A winding 9 is wound around the coil former 1. The heat sinks 5 can cool both the winding 9 and the core 8. Since the coil former 1 completely encloses the core 8 and the heat sink 5 is electrically conductive, it is advantageous that the heat sink 5 does not completely enclose the core in an electrically conductive connection, but rather such an electrical connection is separated by the two electrically insulating plates 7. The cooling channel 6 and the cooling pins 12, 14 are shown and explained in more detail in the following figures.

[0073] Fig. 2 shows, as an exemplary embodiment, a cross section through an inductive component 2. The inductive component 2 shown can be an electrical coil or an electrical transformer.

[0074] The inductive component 2 comprises a coil body 1.

[0075] The coil former 1 comprises two heat sinks 5 and two electrically insulating plates 7. Each heat sink 5 contains a cooling channel 6. The two electrically insulating plates 7 are preferably FR4 plates. The electrically insulating plates 7 and the heat sinks 5 are connected to each other to form a cuboid tube enclosing the core 8. Other geometries are also conceivable.

[0076] The coil body 1 completely encloses a core 8.

[0077] Cooling pins 12, 14 are arranged in the cooling channel 6. The cooling pins 12, 14 extend into the cooling channels 6. The cooling pins 12, 14 can have different shapes, such as cylinders, pyramids, cones, truncated pyramids, or truncated cones. Since both the winding 9 and the core 8 are cooled by the heat sink 5, each heat sink 5 has two first cooling walls 15, from which the cooling pins 12, 14 extend into the cooling channel 6. The cooling pins 12, 14 can touch the respective opposite cooling wall. The two heat sinks 5 are manufactured using an additive manufacturing process.

[0078] For example, the core 8 consists of a ferromagnetic material, in particular iron or ferrite.

[0079] The heat sink 5 comprises a one-piece main body. The one-piece main body is a monolithic component. A monolithic component is a component manufactured from a single piece and does not consist of assembled components. The one-piece main body must fulfill the essential functions of the heat sink 5. This is cooling by means of a liquid. The liquid enables good heat transfer.

[0080] The heat sink 5 consists mainly of metal, in particular copper.

[0081] The cooling channel 6 is designed for the flow of a liquid. The liquid is suitable for liquid cooling.

[0082] An example is the cooling liquid, water.

[0083] The heat sink 5 has the geometry of a cuboid.

[0084] The heat sink 5 has a width 22 of at least 40 mm.

[0085] The heat sink 5 has a width 22 of maximum 200 mm.

[0086] The heat sink 5 has a thickness 23 of at least 1 mm.

[0087] The heat sink 5 has a thickness 23 of at most 4 mm.

[0088] The electrically insulating plate 7 has the geometry of a cuboid.

[0089] The electrically insulating plate 7 has a width 24 of at least 40 mm.

[0090] The electrically insulating plate 7 has a width 24 of maximum 200 mm.

[0091] The electrically insulating plate 7 has a thickness 25 of at least 1 mm.

[0092] The electrically insulating plate 7 has a thickness 25 of at most 4 mm.

[0093] According to the embodiment in Fig. 1 and Fig. 2, the two electrically insulating plates 7 and the two heat sinks 5 are arranged such that they form the geometric shape of a tube in cross-section. The two heat sinks 5 are arranged parallel to each other. The two electrically insulating plates 7 are arranged parallel to each other. All four components, namely the two heat sinks 5 and the two electrically insulating plates 7, enclose the core 8.

[0094] The coil body 1 has a rectangular cross-section.

[0095] According to the embodiment in Fig. 1 and Fig. 2, the inductive component 2 has a winding 9. An electrically insulating film 16 is arranged between the winding 9 and the coil former 1. The insulating film 16 can be made of polyimide film or Kapton film.

[0096] The winding 9 surrounds the coil former 1. The winding 9 is made of an electrically conductive material. In particular, the winding 9 is made of copper. The winding 9 comprises several layers wound around the coil former 1. An insulating film can be located between the layers of the winding 9. This insulating film can also be made of polyimide film or Kapton film. Alternatively, the electrically conductive material of the winding 9 can be surrounded by electrical insulation.

[0097] A gap 21 is formed between coil body 1 and core 8.

[0098] The gap 21 is formed with thermally conductive electrically insulating material, in particular cast resin.

[0099] Fig. 3 shows an exemplary section of a cooling channel 6 within the heat sink 5. A plurality of cooling pins 12 extend within the cooling channel 6. The cooling channel 6 comprises a first cooling wall 15. The first cooling wall 15 is, for example, the side of the cooling channel 6 facing the core 8. The first cooling wall 15 can also be, for example, the side of the cooling channel 6 facing the winding 9. The plurality of cooling pins 12 comprise cooling pins of a first category. The cooling pins of the first category are oriented in a first inclination direction. The first inclination direction is inclined relative to a vertical of the first cooling wall 15. The individual cooling pin of the plurality of cooling pins 12 is arranged such that it does not intersect any other cooling pin of the plurality of cooling pins 12.

[0100] Furthermore, Fig. 3 cooling pins 14 of a second category. The cooling pins 14 of the second category are oriented in a second inclination direction. The second inclination direction is inclined relative to the vertical of the first cooling wall. The second inclination direction is different from the first inclination direction.

[0101] In a first projection direction, the second inclination direction is inclined obliquely to the vertical of the first cooling wall 15. The first projection direction is the intended flow direction 13 of the coolant. In a second projection direction, the second inclination direction is inclined obliquely to the vertical of the first cooling wall 15. The second projection direction is orthogonal to both the intended flow direction and the vertical of the first cooling wall.

[0102] The cooling pins of the first category run along a first straight line. The first straight line runs along the first cooling wall 15.

[0103] Out of Fig. 3 shows that the plurality of cooling pins 12, 14 overlap at a viewing angle parallel to the cooling wall 50, in particular at a viewing angle of the coolant flow direction 13. "Overlapping" here means that at least one cooling pin 12 of the first category at least partially obscures another cooling pin 14 of the second category in the given viewing direction.

[0104] Out of Fig. 3 further shows that the plurality of cooling pins 12 can be arranged such that one cooling pin 12 of the first category is intertwined with two cooling pins 14 of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Intertwined" here means that at least one first cooling pin 12 of the first category at least partially obscures a second cooling pin 14 of the second category in the predetermined viewing direction, and the first cooling pin 12 itself is also at least partially obscured by another cooling pin 14 of the second category in the predetermined viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.

[0105] Fig.Figure 4 shows an industrial process arrangement 17, preferably a plasma process arrangement or heating arrangement. The industrial process arrangement 17 comprises: - a coil body 1 and / or an inductive component 2, each designed according to the features of the invention in the various embodiments, - a circuit board 475, - further electronic components arranged on the circuit board, wherein in particular the further electronic components 48a, 48b, 48c, together 48, can be cooled by the same liquid.

[0106] The power converter 18 further comprises: - another heat sink 5, as described above and below, - a cooling unit 22 comprising, as described above and below, one or more distribution units 20 and a carrier unit 21, - a circuit board 75, - a unit 10 to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, - further electronic components 8a, 8b, 8c, wherein the further electronic components 8a, 8b, 8c and the unit 10 to be cooled are arranged on or at a printed circuit board 75 and are connected by electrical contacts, wherein the unit 10 to be cooled has a fixed, in particular material-locking, connection with the heat sink 5.

[0107] Furthermore, the industrial process arrangement 17 comprises a load 19, preferably a plasma process or heating process, e.g., an induction or microwave heating process. The load 42 is electrically connected to the electronic power converter 18 so that the electrical power converter 18 can supply the load 42 with the required electrical power.

[0108] In addition, the industrial process arrangement 17 has an additional matching unit 43. The additional matching unit 43 is connected between the power converter 18 and the load 42.

[0109] The power converter 18 described here may include the additional features and components of the power converter 4 from the unpublished application PCT / EP2024 / 074228 entitled: "Heat sink with pressure loss-optimized arrangement of cooling pins within the cooling channel," filed on August 29, 2024. This application is incorporated in its entirety by reference into the present application.

[0110] The cooling liquid cooling can advantageously be used for the components as described in the unpublished application PCT / EP2024 / 074228 and simultaneously for the coil body 2 described here.

[0111] The further electronic components 48a, 48b, 48c, together 48, may correspond to the components 8a, 8b, 8c described in the application PCT / EP2024 / 074228.

[0112] The power converter 18 further comprises: - another heat sink 45, as described in the application PCT / EP2024 / 074228 as heat sink 5, - a cooling unit 422, as described in the application PCT / EP2024 / 074228 as cooling unit 22, - one or more distribution units 420, as described in the application PCT / EP2024 / 074228 as distribution units 20, and - a carrier unit 421, as described in the application PCT / EP2024 / 074228 as carrier unit 21, - a printed circuit board 475 as described in application PCT / EP2024 / 074228 as printed circuit board 75, - a unit 410 to be cooled, as described in the application PCT / EP2024 / 074228 as unit 10 to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, - further electronic components 48a, 48b, 48c, wherein the further electronic components 48a, 48b, 48c and the unit 410 to be cooled are arranged on or at a circuit board 475 and are connected by electrical contacts. The unit 410 to be cooled can have a fixed, in particular integral, connection to the further heat sink 45. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE202018103875U1

[0003] EP2024 / 074228 [0109, 0110, 0111, 0112]

Claims

[1] Coil body (1) for an inductive component (2), e.g. an electrical coil (3) or an electrical transformer (4), wherein the coil body (1) comprises a heat sink (5), wherein the heat sink (5) contains a cooling channel (6), wherein the coil body (1) comprises an electrically insulating plate (7), preferably FR4 plate, wherein the electrically insulating plate (7) and the heat sink (5) are connected to one another and the coil body (1) is designed to enclose a core (8), in particular completely, wherein a plurality of cooling pins (12) are arranged in the cooling channel (6), wherein the cooling pins extend into the cooling channel, wherein the heat sink (5) is made of metal by means of an additive manufacturing process. [2] Coil body according to claim 1, characterized bythat the coil body (1) comprises several, in particular two, heat sinks (5), and wherein the coil body (1) comprises several, in particular two, electrically insulating plates (7). [3] Coil body according to claim 1, characterized by that the heat sink(s) (5) comprise a one-piece main body. [4] Coil body according to claim 1, characterized by that the metal of the heat sink(s) (5) comprises copper, in particular made of copper. [5] Coil body according to one of the preceding claims, characterized by that the cooling channels are suitable for the flow of a liquid, wherein the liquid is suitable for liquid cooling. [6] Coil body according to claim 4, characterized by that the liquid is water. [7] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has the geometry of a cuboid. [8] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has a length and / or width (22) of at least 40 mm. [9] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has a length and / or width (22) of maximum 200 mm. [10] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has a thickness (23) of at least 1 mm. [11] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has a thickness (23) of at most 4 mm. [12] Coil body according to one of the preceding claims, characterized by that the electrically insulating plate (7) has the geometry of a cuboid, wherein the cuboid has a length and / or width (24) of at least 40 mm. [13] Coil body according to one of the preceding claims, characterized bythat the electrically insulating plate (7) has the geometry of a cuboid, wherein the cuboid has a length and / or width (24) of a maximum of 200 mm. [14] Coil body according to one of the preceding claims, characterized by that the electrically insulating plate (7) has the geometry of a cuboid, wherein the cuboid has a thickness (25) of at least 1 mm. [15] Coil body according to one of the preceding claims, characterized by that the electrically insulating plate (7) has the geometry of a cuboid, wherein the cuboid has a thickness (25) of at most 4 mm. [16] Coil body according to one of the preceding claims, characterized bythat two electrically insulating plates (7) and two heat sinks (5) are arranged such that they form the geometric shape of a tube in cross-section, wherein the two heat sinks (5) are arranged parallel to one another, wherein the electrically insulated plates (7) are arranged parallel to one another and wherein the two heat sinks (5) and the two electrically insulating plates (7) enclose the core (8). [17] Coil body according to one of the preceding claims, characterized by that the coil body (1) has a rectangular cross-section. [18] Coil body according to one of the preceding claims, characterized byin that the cooling channel (6) has a first cooling wall (15) and the first cooling wall (15) is the side of the cooling channel (6) facing the core (8) of the coil former, wherein the plurality of cooling pins (12) comprises at least one cooling pin of a first category which is oriented in a first inclination direction which is inclined obliquely relative to a perpendicular to the first cooling wall (15), wherein the cooling pin of the plurality of cooling pins is arranged such that one cooling pin of the plurality of cooling pins (12) does not intersect any other cooling pin of the plurality of cooling pins (12). [19] Coil body according to one of the preceding claims, characterized by in that the plurality of cooling pins (12) comprises at least one cooling pin of a second category (14) which is oriented in a second inclination direction which is inclined relative to the perpendicular to the first cooling wall (15), wherein the second inclination direction is different from the first inclination direction. [20] Coil body according to one of the preceding claims, characterized by that the heat sink (5), viewed in a first projection direction, the second direction of inclination is inclined obliquely to the perpendicular to the first cooling wall (15), wherein the first projection direction is the intended flow direction (13) of the coolant, and that, viewed in a second projection direction, the second direction of inclination is inclined obliquely to the perpendicular to the first cooling wall (15), wherein the second projection direction is orthogonal both to the intended flow direction (13) and to the perpendicular to the first cooling wall (15). [21] Coil body according to one of the preceding claims, characterized by that the heat sink (5) has a plurality of cooling pins of the first category arranged along a first straight line which runs along the first cooling wall (15). [22] Inductive component (2) comprising a coil body (1) according to one of the preceding claims, characterized bythat the inductive component (2) has a winding (9) and an insulating film (16), in particular polyimide film or Kapton film, is arranged on the coil body (1), and the insulating film (16) is arranged between the coil body (1) and the winding (9). [23] Inductive component according to claim 22, characterized by that the winding (9) at least partially surrounds the coil body (1), and the winding (9) consists of an electrically conductive material and comprises several layers and between the layers of the winding (9) there is also an insulating film (16), in particular polyimide film or Kapton film, preferably an insulating film (16) of the same construction as that between the coil body (1) and the winding (9). [24] Inductive component according to one of the preceding claims 22 or 23, characterized by that the inductive component (2) comprises a core (8) which consists in particular of iron, preferably of ferrite. [25] Inductive component according to claim 24, characterized by that a gap (21) is formed between the coil body (1) and the core (8). [26] Inductive component according to claim 25, characterized by that the gap (21) is filled with thermally conductive electrically insulating material, in particular with casting resin. [27] Electronic power converter (18) for an industrial process arrangement (17), preferably a plasma process arrangement or heating arrangement, comprising: - a coil body (1) and / or an inductive component (2) according to one of the preceding claims, - a circuit board, - further electronic components arranged on the circuit board, wherein in particular the further electronic components can be cooled by the same liquid.

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