Large-scale substrate with sacrificial substrate to reduce substrate deflection

Abstract

Large-scale substrate (1) for power semiconductor modules with a first main surface (2,3) having a normal direction (N) and a second main surface opposite the first for power semiconductor modules, wherein the large-scale substrate (1) is structured matrix-like into a plurality of first surface sections (5) and a second surface section (6) of equal extent in orthogonal directions (O) perpendicular to the normal direction (N), wherein the first surface sections (5) on the first main surface (2) have a plurality of conductor tracks (4) forming first metallization surfaces (50) and the second surface section (6) has at least a second metallization surface (60) on the first main surface (2).

Description

[0001] The invention describes a large card substrate for power semiconductor modules consisting of individual and sacrificial substrates, as well as the design and arrangement of the metallization surfaces of the individual and sacrificial substrates.

[0002] DE 10 2021 122 633 A1 describes a substrate for a power electronic circuit with a planar insulating body and with planar metallic conductor tracks arranged on the second main surface thereof and with planar metal laminations arranged on the first main surface thereof, wherein a first partial lamination and a second partial lamination thereof are arranged on or adjacent to an outer edge of the insulating body and wherein both partial laminations are separated from one another by a trench preferably extending to the first main surface and wherein the trench either has a dam in which the trench is partially filled with a dam material or has a trench structure.

[0003] Given the above-mentioned circumstances, the invention seeks to provide a large-card substrate whose manufacturing-related deflection is minimized. By applying sacrificial substrates to the large-card substrate, the metallization mass fraction of the front and back sides is modified in such a way that fewer defective parts due to cracks and fractures in the ceramic are produced during manufacturing.

[0004] This object is achieved according to the invention by a large card substrate for power semiconductor modules with a first main side having a normal direction and a second main side opposite the first for power semiconductor modules, wherein the large card substrate is divided in a matrix-like manner into a plurality of first surface sections and a second surface section, each of the same extent, in orthogonal directions (O) perpendicular to the normal direction, wherein the first surface sections on the first main side have a plurality of first metallization surfaces forming conductor tracks and the second surface section has at least one second metallization surface on the first main side with the following features.

[0005] It is preferred if conductor tracks are located on first surface sections and second surface sections of the first and second main sides, wherein a plurality of individual substrates are arranged on a large card substrate, wherein at least one sacrificial substrate is also arranged on the large card substrate adjacent to the individual substrates.

[0006] It can be advantageous if predetermined separation lines in an orthogonal direction, perpendicular to the normal direction, divide the large card substrate into individual substrates and sacrificial substrates, whereby these individual and sacrificial substrates are separated along the predetermined separation lines.

[0007] It may also be preferred if the sacrificial substrate is arranged centrally on the large card substrate surrounded by individual substrates.

[0008] It may be advantageous if the sacrificial substrate is arranged in sections at the edge on the large card substrate, partially surrounded by individual substrates, wherein at least one edge of a sacrificial substrate forms an outer edge of the large card substrate.

[0009] It may also be preferred if at least one individual substrate is adjacent to at least two sides of the sacrificial substrate.

[0010] It may also be preferred if the sacrificial substrate is designed such that the metallization mass fraction of the individual and sacrificial substrates on the first main side and the second main side of the large card substrate is in a ratio of between 0.6:1 and 1:1, particularly preferably in a ratio of 0.6:1, particularly preferably 0.7:1, further preferably 0.8:1, likewise preferably 0.9:1, furthermore preferably 1:1.

[0011] Furthermore, it may be advantageous if at least one first metallization surface is arranged on the first surface section of the individual substrate on the second main side of the large card substrate, wherein at least one second metallization surface is located on at least one second surface section of at least one sacrificial substrate, wherein the metallization surfaces of the individual and sacrificial substrates on the second main side are identical.

[0012] It may also be preferred if at least one first metallization surface is arranged on the first surface sections of the individual substrates on the second main side of the large card substrate, wherein at least one second metallization surface is located on at least one second surface section of at least one sacrificial substrate, wherein the metallization surfaces of the individual and sacrificial substrates on the second main side differ from one another.

[0013] It is preferred if the conductor tracks are preferably copper or aluminum, as well as silver or gold conductor tracks and their alloys and coatings thereof.

[0014] It can be advantageous if the metallization surfaces can be constructed from several metallization layers and conductor tracks as well as insulating foils.

[0015] It may also be preferred if the centers of the metallization surfaces of the individual and sacrificial substrates on the first main side and the second main side are congruent with one another.

[0016] It may be advantageous if the centers of the second metallization surface on the second surface section of the sacrificial substrates, the first main side, are not arranged centrally in the center of the surface section, wherein the centers of at least two metallization surfaces of at least two different sacrificial substrates are arranged symmetrically or mirror-symmetrically to one another.

[0017] It may also be preferred if the centers of the metallization surfaces of the sacrificial substrates on the first main side and the second main side do not coincide with each other.

[0018] It may also be preferred if the height of the individual metallization surfaces of the sacrificial and individual substrates can differ measured in a normal direction starting from the base substrate.

[0019] It may also be preferred if the height of the metallization surfaces of the sacrificial and individual substrates of the first main side, measured from the base substrate in a normal direction, differs from the height of the metallization surfaces of the sacrificial and individual substrates of the second main side.

[0020] It is further preferred if the sacrificial and individual substrates have at least one continuous perforation, wherein these perforations are introduced by means of drilling, etching or lasering.

[0021] The term "predetermined dividing lines" should be understood as imaginary lines that indicate where the large-card substrate can be separated. These lines can intersect, thus forming a grid that divides the large-card substrate into the first and second surface sections.

[0022] The term "break line" should be understood as an imaginary line extending perpendicular to the base substrate in a normal direction, from a first main page to a second main page. The large-card substrate is separated along this book edge.

[0023] The term "matrix-like" should be understood as a grid structure whose grid consists of first and second surface elements, with the number of them being identical per row. The number of surface elements per column can vary. A checkerboard-like alternation of first and second surface elements is also possible.

[0024] The term "perforation" should be understood as a continuous recess extending from a first main side to a second main side, which can be created by drilling, etching, lasering, or a manufacturing method known to those skilled in the art. Screws can be passed through such a perforation to assemble the components into a larger assembly.

[0025] It is understood that the various embodiments of the invention, regardless of whether they are mentioned in connection with the large card substrate, can be implemented individually or in any combination to achieve improvements. In particular, the features mentioned and explained above and below can be used not only in the specified combinations, but also in other combinations or on their own, without departing from the scope of the present invention.

[0026] Further explanations of the invention, advantageous details and features, emerge from the following description of the Fig. 1 to 13 schematically illustrated embodiments of the invention, or of respective parts thereof. Fig. 1 shows a sectional view of a large card substrate with perforations Fig. 2 shows a sectional view of a large card substrate with first and second metallization surfaces of different heights on the second main side. Fig. 3 shows a sectional view of a large card substrate with metallization areas of different heights on the first and second main sides. Fig. 4 shows a sectional view of a large card substrate with offset centers of the metallization area and the area portion of a sacrificial substrate on the first main side. Fig. 5 shows a sectional view of a large card substrate with identically offset centers of the metallization area and the surface portion of a sacrificial substrate on the first and second main sides. Fig. 6 shows a sectional view of a large card substrate with a reduced second metallization area of ​​the sacrificial substrate on the second main side. Fig. Figure 7 shows a plan view of the first main side of the large card substrate. Fig. 8 shows a top view of the second main side of the large card substrate with identical first and second metallization areas of the individual and sacrificial substrates. Fig. 9 shows a plan view of the second main side of the large card substrate with differently designed first and second metallization surfaces of the individual and sacrificial substrates. Fig. 10 shows a plan view of the first main side of the large card substrate with sacrificial substrates partially arranged at the edge. Fig. 11 shows a plan view of the first main side of the large card substrate with mirror-symmetrically offset second metallization surfaces of two sacrificial substrates. Fig. 12 shows a top view of the first main side of the large card substrate with two individual substrates and a centrally arranged sacrificial substrate. Fig. 13 shows a top view of the second main side of the large card substrate with two individual substrates and a centrally arranged sacrificial substrate.

[0027] The Fig. 1 shows a sectional view of a large card substrate 1. The first main side 2 is located on top of the base substrate G, with the second main side 3 located opposite it on the underside of the base substrate G. The base substrate G is divided into three equal-sized sections by two break edges B. The two outer sections are individual substrates 51 and the middle section represents a sacrificial substrate 61. The individual substrates 51 each have a first metallization area 50 on the first and second main sides 2, 3. The sacrificial substrate 61 also has a second metallization area 60 on the first and second main sides 2, 3. Perforations 9 extend through the metallization areas 50, 60 and the base substrate G. These perforations are used to screw the isolated individual and sacrificial substrates 51, 61 to larger assemblies.

[0028] The Fig. Figure 2 shows a sectional view of an alternative large card substrate 1. The center point M1 of the metallization area and the center point M2 of the area section on the first main side 2 are congruent. The height H of the first metallization areas 50 on the second main side 3 differs from the height H of the second metallization area 60 on the second main side 3, with the height H of the second metallization area 60 being less than the height H of the first metallization areas 50.

[0029] The Fig. 3 shows a further sectional view of an alternative large card substrate 1. The height H of the first and second metallization areas 50, 60 on the first main side 2 is higher than the height H of the first and second metallization areas 50, 60 on the second main side 3. The height H of the first and second metallization areas 50, 60 is identical on the first main side 2. The height H of the first and second metallization areas 50, 60 is identical on the second main side 3.

[0030] Fig. 4 shows a further sectional view with an alternative large card substrate 1. In each of the two individual substrates 51 arranged on the outside, there is at least one perforation 9. The sacrificial substrate 61 in the middle has no perforation 9. The center point M1 of the second metallization area 60 on the first main side 2 is not congruent with the center point M2 of the second surface section 6. The center point M1 of the second metallization area 60 on the first main side 2 is not congruent with the center point M1 of the second metallization area 60 on the second main side 3.

[0031] Fig. 5 shows a further sectional view with an alternative large card substrate 1. The center point M1 of the second metallization surface 60 on the first and second main side 2, 3 is not congruent with the center point M2 of the second surface section 6. The first metallization surfaces 50 of the two individual substrates 51 are composed of several metallization layers 7 and at least one insulating film 8.

[0032] Fig. 6 shows a further sectional view with an alternative large card substrate 1. The first metallization surfaces 50 of the two individual substrates 51 on the first main side 2 are composed of a plurality of conductor tracks 4, wherein these conductor tracks 4 consist of several metallization layers 7. An additional insulating film 8 can be introduced between the metallization layers 7 of the conductor tracks 4, as can be seen in the individual substrate 51 on the left. The first and second metallization surfaces 50, 60 on the second main side 3 are of different heights, wherein the second metallization surface has a lower height H. The second metallization surfaces of the first and second main sides 2, 3 are not congruent in size, wherein the centers of the metallization surfaces M1 lie congruently on one another.

[0033] Fig. 7 shows a plan view of the first main side 2 of a large card substrate 1. On the large card substrate 1, two second surface sections 6 are arranged next to one another in the center, surrounded by first surface sections 5. Conductor tracks 4 are formed on the first surface sections 5.

[0034] The Fig. 8 shows a plan view of the second main page 3 of the Fig. 7. The first and second surface sections 5, 6 are arranged identically. The first and second metallization surfaces 50, 60 are also configured identically.

[0035] The Fig. 9 shows a plan view of the second main page 3 of the Fig. 7. In this alternative embodiment, the first metallization areas 50 of the first surface sections 5 differ from the second metallization areas 60 of the second surface sections 6 of the sacrificial substrates 61. The second metallization areas 60 can be composed of a plurality of smaller metallization areas; it is also possible for the second metallization areas 60 to have a different height H than the first metallization areas 50.

[0036] Fig. 10 shows a plan view of the first main side 2 of a large card substrate 1. The sacrificial substrates 61 with their second metallization surface 60 are located at the outer edges 12 of the large card substrate 1. The edges 62 of the sacrificial substrate 61 form the edges 11 of the large card substrate. The predetermined separation lines S divide the large card substrate 1 into first and second surface sections 5, 6, which form the individual and sacrificial substrates 51, 61. In this embodiment, the individual substrates 51 have perforations 9, although these perforations 9 are missing in the sacrificial substrates 61. The first metallization surfaces 50 have conductor tracks 4, whereas the second metallization surfaces 60 have no conductor tracks.

[0037] Fig. 11 shows a plan view of the first main side 2 of another alternative large-card substrate 1. Two sacrificial substrates 61 are arranged centrally on the large-card substrate 1, surrounded by individual substrates 51. The centers M1 of the metallization area are not congruent with the centers M2 of the surface section of the sacrificial substrates 61. This arrangement of the second metallization areas 60 is mirror-symmetrical. The second metallization areas 60 do not extend over the entire second surface sections 6.

[0038] Fig. 12 shows a plan view of the first main side 2 of another alternative large card substrate 1. The predetermined separation lines S divide the large card substrate into two individual substrates 51 and a sacrificial substrate 61. The sacrificial substrate 61 is arranged centrally between the two individual substrates 51. Each of the individual and sacrificial substrates has a perforation 9. The first metallization area 50 is different from the second metallization area 60. Conductor tracks 4 are formed on the first metallization area 50, wherein the second metallization areas have a different structure.

[0039] Fig. 13 shows a plan view of the second main page 3 of the Fig. 12 described alternative large card substrate 1. The first and second metallization surfaces 50,60 are designed identically. List of reference symbols B Break edge N Normal direction O orthogonal direction S dividing lines M1 Center of metallization area M2 Center point area section H Height G Base substrate 1 large card substrate 2 first main page 3 second main page 4 conductor tracks 5 first area section 6 second area section 7 metallization layers 8 Insulating foil 9 holes 11 Edge 12 Outer edge 50 first metallization area 51 single substrate 60 second metallization surface 61 sacrificial substrate 62 edge QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 122 633 A1

[0002]

Claims

[1] Large card substrate (1) for power semiconductor modules with a first main side having a normal direction (N) and a second main side (2, 3) opposite the first for power semiconductor modules, wherein the large card substrate (1) is divided in a matrix-like manner into a plurality of first surface sections (5) and a second surface section (6), each of the same extent in orthogonal directions (O) perpendicular to the normal direction (N), wherein the first surface sections (5) on the first main side (2) have a plurality of first metallization surfaces (50) forming conductor tracks (4), and the second surface section (6) has at least one second metallization surface (60) on the first main side (2). [2] Large card substrate (1) for power semiconductor modules according to claim 1, wherein conductor tracks (4) are located on first surface sections (5) and second surface sections (6) of the first and second main sides (2, 3), wherein a plurality of individual substrates (51) are arranged on a large card substrate (1), wherein adjacent to the individual substrates (51) at least one sacrificial substrate (61) is also arranged on the large card substrate (1). [3] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein predetermined separation lines (S) in the orthogonal direction (O), perpendicular to the normal direction (N), divide the large card substrate (1) into individual substrates (51) and sacrificial substrates (61), wherein these individual and sacrificial substrates (51, 61) are separated along the predetermined separation lines (S). [4] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the sacrificial substrate (61) is arranged centrally on the large card substrate (1) surrounded by individual substrates (51). [5] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the sacrificial substrate (61) is arranged in sections at the edge (11) on the large card substrate (1) partially surrounded by individual substrates (51), wherein at least one edge (62) of a sacrificial substrate (61) forms an outer edge (12) of the large card substrate (1). [6] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein at least one individual substrate (51) adjoins at least two sides of the sacrificial substrate (61). [7] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the sacrificial substrate (61) is designed such that the metallization mass fraction of the individual and sacrificial substrates (51, 61) on the first main side (2) and the second main side (3) of the large card substrate (1) is in a ratio between 0.6:1 and 1:1, particularly preferably in a ratio of 0.6:1, particularly preferably 0.7:1, further preferably 0.8:1, likewise preferably 0.9:1, furthermore preferably 1:

1. [8] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein on the second main side (3) of the large card substrate (1) at least one first metallization area (50) is arranged on the first surface section (5) of the individual substrate (51), wherein at least one second metallization area (60) is located on at least one second surface section (6) of at least one sacrificial substrate (61), wherein the metallization areas (50, 60) of the individual and sacrificial substrates (51, 61) on the second main side (3) are identical. [9] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein on the second main side (3) of the large card substrate (1) at least one first metallization area (50) is arranged on the first surface sections (5) of the individual substrates (51), wherein at least one second metallization area (60) is located on at least one second surface section (6) of at least one sacrificial substrate (61), wherein the metallization areas (50, 60) of the individual and sacrificial substrates (51, 61) on the second main side (3) differ from one another. [10] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the conductor tracks (4) are preferably copper or aluminum, as well as silver or gold conductor tracks and their alloys and coatings thereof. [11] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the metallization surfaces (50, 60) can be constructed from several metallization layers (7) and conductor tracks (4) as well as insulating films (8). [12] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the centers (M1) of the metallization surfaces (50, 60) of the individual and sacrificial substrates (51, 61) on the first main side (2) and the second main side (3) are congruent with one another. [13] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the center points (M1) of the second metallization area (60) on the second surface section (6) of the sacrificial substrates (61), of the first main side (2) are not arranged centrally in the center point (M2) of the surface section (6), wherein the center points (M1) of at least two metallization areas (60) of at least two different sacrificial substrates (61) are arranged symmetrically or mirror-symmetrically to one another. [14] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the centers (M1) of the metallization surfaces (60) of the sacrificial substrates (61) on the first main side (2) and the second main side (3) do not lie congruently with one another. [15] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the height (H) of the individual metallization surfaces (50, 60) of the sacrificial and individual substrates (51, 61) measured from the base substrate (G) in a normal direction (N) can differ. [16] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the height (H) of the metallization surfaces (50, 60) of the sacrificial and individual substrates (51, 61) of the first main side (2) measured from the base substrate (G) in a normal direction (N) differs from the height (H) of the metallization surfaces (50, 60) of the sacrificial and individual substrates (51, 61) of the second main side (3). [17] Large card substrate (1) for power semiconductor modules according to one of the preceding claims, wherein the sacrificial and individual substrates (51, 61) have at least one continuous perforation (9), said perforation (9) being introduced by means of drilling, etching or by lasering.

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