Imaging lens array module and electronic device

Abstract

Imaging lens array module (100) defining an optical axis (X) and comprising: an optical component (110) comprising: a light-blocking part (120) which is opaque, the light-blocking part (120) being closer to the optical axis (X) than the remaining part of the optical component (110) is to the optical axis (X), and an anti-reflection thin film (130) applied to at least one surface of the light-blocking part (120), the anti-reflection thin film (130) comprising: a nanostructure layer (131) having a plurality of rib-like projections (132) extending in an undirected manner, wherein the bottom of each of the rib-like projections (132) is closer to the optical component (110) than the tip of each of the rib-like projections (132), each of the rib-like projections (132) tapers from the bottom to the tip, and an average structural height of the rib-like projections (132) is greater than 108 nm and less than 368 nm, and at least one intermediate layer (133) arranged between the nanostructure layer (131) and the optical component (110), wherein the nanostructure layer (131) consists mainly of aluminum oxide and the nanostructure layer (131) comprises a metallic dopant material (134), wherein the metallic dopant material (134) is distributed at least within each of the rib-like projections (132), and the metallic dopant material (134) contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.

Description

BACKGROUNDArtThe present disclosure relates to an imaging lens array module. More particularly, the present disclosure relates to an imaging lens array module applicable to portable electronic devices.Description of the Prior ArtIn recent years, portable electronic devices have rapidly evolved. For example, smart electronic devices and tablets have entered modern people's lives, and imaging lens array modules incorporated into portable electronic devices have also increased. As the technique progresses, however, the quality requirements of imaging lens array modules are also growing more and more. Therefore, development of an imaging lens array module that has low mirroring and provides an anti-mirroring effect is required.SUMMARYIn one aspect of the present disclosure, an imaging lens array module defining an optical axis includes an optical component. The optical component includes a light blocking part and an anti-reflection film. The light blocking part is opaque and the light blocking part is closer to the optical axis than the remaining part of the optical component is to the optical axis. The anti-reflection film is coated on at least one surface of the light blocking part. The anti-reflection film comprises a nanostructure layer and at least one intermediate layer. The nanostructure layer includes a plurality of ridge-like protrusions running unaligned, wherein the bottom of each of the ridge-like protrusions is closer to the optical component than the tip of each of the ridge-like protrusions, each of the ridge-like protrusions tapers from bottom to tip, and an average structure height of the ridge-like protrusions is greater than 108 nm and less than 368 nm. The intermediate layer is arranged between the nanostructure layer and the optical component. The nanostructure layer is primarily comprised of aluminum oxide and the nanostructure layer comprises a metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions and the metallic dopant material contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, or chromium oxide.In the imaging lens array module of the above aspect, with DO for the shortest distance between the light blocking part and the optical axis, the following condition is satisfied: 0.01 mm≤DO≤6.8 mm.In the imaging lens array module of the above aspect, the light blocking part includes an object-side surface, an image-side surface, and a connection surface. The object-side surface is located near the object-side direction of the imaging lens array module. The image-side surface corresponds to the object-side surface. The connection surface connects the object-side surface to the image-side surface. The bonding surface is closer to the optical axis than the object-side surface and the image-side surface are to the optical axis, and the anti-reflection film is coated at least on the bonding surface.In the imaging lens array module of the above aspect, the anti-reflection film is also coated on the object-side surface or the image-side surface.In the imaging lens array module of the above aspect, the light blocking part includes a first end surface and a second end surface. The first end surface is inclined relative to the optical axis. The second end face is connected to the first end face, wherein a folding angle is enclosed between the first end face and the second end face. The fold angle is closer to the optical axis than the first end surface and the second end surface of the optical axis are, and the anti-reflection film is plotted at least on the fold angle. With θC for the folding angle, the following condition is satisfied: 9°<θC<162°.In the imaging lens array module of the above aspect, the anti-reflection film is also coated on the first end surface and the second end surface.In the imaging lens array module of the foregoing aspect, the at least one intermediate layer is mainly made of silicon dioxide.In the imaging lens array module of the foregoing aspect, a main component of the at least one intermediate layer is equal to a part of the components of the nanostructure layer.In the imaging lens array module of the foregoing aspect, the metallic dopant material is also dispersed on a surface of each of the rib-like protrusions.In the imaging lens array module of the foregoing aspect, the metallic dopant material distributed within each of the rib-like protrusions narrows away from the optical member.In the imaging lens array module of the foregoing aspect, TM for the coating thickness of the metallic dopant material on the surface of each of the rib-like protrusions satisfies the following condition: 1 nm ≤ TM ≤ 40 nm. In addition, the following condition is satisfied: 1 nm ≤ TM ≤ 30 nm.In the imaging lens array module of the foregoing aspect, the metallic dopant material is titanium or titanium oxide.In the imaging lens array module of the foregoing aspect, the anti-reflection film may further include a dark layer disposed between the at least one intermediate layer and the optical member, which serves to give the optical member a dark appearance.In one aspect of the present disclosure, an electronic device includes the imaging lens array module of the foregoing aspect.BRIEF DESCRIPTION OF THE DRAWINGSThe present invention will become more fully understood upon reading the following detailed description of the embodiment with reference to the following accompanying drawings: FIG. 1A is a three-dimensional view of an imaging lens array module in the 1st embodiment of the present disclosure. FIG. 1B is a schematic view of the imaging lens array module in the 1st embodiment of FIG. 1A. FIG. 1C is a three-dimensional view of the optical component in the 1st embodiment of FIG. 1A. FIG. 1D is an enlarged partial view of the optical component in the 1st embodiment of FIG. 1C. FIG. 1E is a schematic view of an anti-reflection film and a light blocking part in the 1st embodiment of FIG. 1A. FIG. 1F is a cross-sectional view with a transmission electron microscope of the anti-reflection film and the light blocking part in the 1st embodiment of FIG. 1E. FIG. 1G is an element distribution map of aluminum in the anti-reflection film in the 1st embodiment of FIG. 1F. FIG. 1H is an element distribution map of silicon in the anti-reflection film in the 1st embodiment of FIG. 1F. FIG. 1I is an element distribution map of titanium in the anti-reflection film in the 1st embodiment of FIG. 1F. FIG. 2A is a three-dimensional view of an imaging lens array module in the 2nd embodiment of the present disclosure. FIG. 2B is an exploded view of the imaging lens array module in the 2nd embodiment of FIG. 2A. FIG. 2C is a schematic view of the imaging lens array module in the 2nd embodiment of FIG. 2A. FIG. 2D is a three-dimensional view of the optical component in the 2nd embodiment of FIG. 2A. FIG. 2E is an enlarged partial view of the optical component in the 2nd embodiment of FIG. 2D. FIG. 2F is a three-dimensional view of the optical components in the 2nd embodiment of FIG. 2A. FIG. 2G is a partial schematic view of the optical components in the 2nd embodiment of FIG. 2F. FIG. 3A is an exploded view of the imaging lens array module in the 3rd embodiment of the present disclosure. FIG. 3B is a schematic view of the imaging lens array module in the 3rd embodiment of FIG. 3A. FIG. 3C is a three-dimensional view of the optical component and the reflective component in the 3rd embodiment of FIG. 3A. FIG. 3D is a composite schematic view of the optical member and the reflective member in the 3rd embodiment of FIG. 3A. FIG. 3E is a schematic view of the optical component in the 3rd embodiment of FIG. 3A. FIG. 3F is a three-dimensional view of the optical component in the 3rd embodiment of FIG. 3A. FIG. 3G is another three-dimensional view of the optical component in the 3rd embodiment of FIG. 3A. FIG. 3H is a schematic view of the optical component in the 3rd embodiment of FIG. 3F. FIG. 4A is a three-dimensional view of an imaging lens array module in the 4th embodiment of the present disclosure. FIG. 4B is an exploded view of the imaging lens array module in the 4th embodiment of FIG. 4A. FIG. 4C is a schematic view of the imaging lens array module in the 4th embodiment of FIG. 4A. FIG. 4D is a three-dimensional view of the optical component in the 4th embodiment of FIG. 4A. FIG. 4E is a schematic view of the optical component in the 4th embodiment of FIG. 4D. FIG. 4F is a schematic view of an anti-reflection film and a light blocking part in the 4th embodiment of FIG. 4D. FIG. 4G is a three-dimensional view of the optical component in the 4th embodiment of FIG. 4A. FIG. 4H is a schematic view of the optical component in the 4th embodiment of FIG. 4G. FIG. 5A is a schematic view of an imaging lens array module in the 5th embodiment of the present disclosure. FIG. 5B is a three-dimensional view of the optical component in the 5th embodiment of FIG. 5A. FIG. 5C is a schematic view of the optical component in the 5th embodiment of FIG. 5A. FIG. 6A is a schematic view of an imaging lens array module in the 6th embodiment of the present disclosure. FIG. 6B is a three-dimensional view of the optical component in the 6th embodiment of FIG. 6A. FIG. 6C is a schematic view of the optical component in the 6th embodiment of FIG. 6A. FIG. 7A is a schematic view of an imaging lens array module in the 7th embodiment of the present disclosure. FIG. 7B is a three-dimensional view of the optical component and the lens element in the 7th embodiment of FIG. 7A. FIG. 7C is a partial sectional view of the optical component and the lens element in the 7th embodiment of FIG. 7B. FIG. 7D is a schematic view of the optical component and the lens element in the 7th embodiment of FIG. 7A. FIG. 8A is a schematic view of an electronic device in the 8th embodiment of the present disclosure. FIG. 8B is another schematic view of the electronic device in the 8th embodiment of FIG. 8A. FIG. 8C is a schematic view of an image captured by the electronic device in the 8th embodiment in FIG. 8A. FIG. 8D is another schematic view of an image captured by the electronic device in the 8th embodiment in FIG. 8A. FIG. 8E is another schematic view of an image captured by the electronic device in the 8th embodiment in FIG. 8A. FIG. 9 is a schematic view of an electronic device in the 9th embodiment of the present disclosure. FIG. 10A is a schematic view of imaging lens array modules applied in a vehicle device in the 10th embodiment of the present disclosure. FIG. 10B is another schematic view of the imaging lens array modules disposed in the vehicle device in the 10th embodiment in FIG. 10A. FIG. 10C is another schematic view of the imaging lens array modules disposed in the vehicle device in the 10th embodiment in FIG. 10A.DETAILED DESCRIPTIONThe present disclosure provides an imaging lens array module defining an optical axis and including an optical component. The optical component includes a light blocking part and an anti-reflection film. The light blocking part is opaque and the light blocking part is closer to the optical axis than the remaining part of the optical component is to the optical axis. The anti-reflection film is coated on at least one surface of the light blocking part. The anti-reflection film comprises a nanostructure layer and at least one intermediate layer. The nanostructure layer includes a plurality of ridge-like protrusions running unaligned, wherein the bottom of each of the ridge-like protrusions is closer to the optical component than the tip of each of the ridge-like protrusions, each of the ridge-like protrusions tapers from bottom to tip, and an average structure height of the ridge-like protrusions is greater than 108 nm and less than 368 nm. The intermediate layer is arranged between the nanostructure layer and the optical component. The nanostructure layer is primarily comprised of aluminum oxide and the nanostructure layer comprises a metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions and the metallic dopant material contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, or chromium oxide. Note that "consisting mainly of" means the component having the highest weight percentage.This is advantageous for forming a refractive index gradient by the rib-like protrusions, and advantageous for providing excellent performance with low reflectance for light of different wavelengths and at different incident angles of the light beams. In addition, since stray light is easily formed at the light blocking portion located near the optical axis, by applying the anti-reflection film, it is advantageous for improving the image quality. In addition, by incorporating the metallic dopant material such that the effect of environmental changes on the layered structure can be reduced, it is advantageous for improving the environmental resistance of the nanostructure layer, and also the anti-reflection performances of the anti-reflection film can be obtained.Furthermore, the metallic dopant material may be selected from tantalum, zirconium, niobium, tantalum oxide, zirconium oxide and niobium oxide, and the environmental changes may be temperature, humidity, or other chemical damage disturbances, without being limited thereto.The height of each of the rib-like protrusions can be defined by evaluating the cross-sectional view (which means destructive measurement) as a vertical height from the absolute bottom of each of the rib-like protrusions (the root of each of the rib-like protrusions) to the tip of each of the rib-like protrusions (the peak of each of the rib-like protrusions). The height of each of the rib-like protrusions may be different, so that an average structural height of at least three or more rib-like protrusions may be measured, and rib-like protrusions having clear contours may be considered first.The metallic doping material can be detected and analyzed by a transmission electron microscope (TEM) or energy-dispersive X-ray spectroscopy (EDS) or scanning electron microscope (SEM). The distribution of the metallic element is the main basis of the assessment, regardless of whether the metallic doping material is present as elemental metal or as oxide.Specifically, the following are the conditions and analysis steps with TEM and EDS. (1) A conductive layer of 10 nm to 20 nm is applied with SEM for observation and search of the measurement site, wherein the conductive layer may consist of platinum. (2) A piece having a thickness of about 50 nm to 100 nm is cut with a focused ion beam (FIB). (3) A sample is taken out by means of a probe, and the sample is deposited on a copper mesh for EDS detection by TEM. (4) A field electron microscope (FE-TEM) is used with an accelerating voltage of 200 keV, the EDS scanning time is 400 seconds, and the corresponding energy intensity depends on the material of the structure.The surface of the optical component may be roughened, such as by sandblasting or laser, which may scatter light. The surface of the nanostructure layer may have a plurality of holes, such that the change in the equivalent refractive index of the nanostructure layer through the holes may be more linear. There is no other shielding part between the light blocking part and the optical axis.The light blocking part may include an object-side surface, an image-side surface, and a connection surface. The object-side surface is located near the object-side direction of the imaging lens array module. The image-side surface corresponds to the object-side surface. The connection surface connects the object-side surface to the image-side surface. The bonding surface is closer to the optical axis than the object-side surface and the image-side surface are to the optical axis, and the anti-reflection film is coated at least on the bonding surface.The anti-reflection film may also be coated on the object-side surface or the image-side surface. This is advantageous in preventing stray light in the object-side direction or the image-side direction.The light blocking part may further include a first end surface and a second end surface. The first end surface is inclined relative to the optical axis. The second end face is connected to the first end face, wherein a folding angle is enclosed between the first end face and the second end face. The fold angle is closer to the optical axis than the first end surface and the second end surface of the optical axis are, and the anti-reflection film is plotted at least on the fold angle, and θC for the fold angle satisfies the following condition: 9°<θC<162°. This is advantageous for changing the reflected beam path of scattered light due to the arrangement of the first end face inclined with respect to the optical axis, so that the impairment of the image quality due to scattered light can be avoided. The possibility of reflection of stray light can be reduced by the folding angle, and it is advantageous for further reducing the reflection of stray light that the anti-reflection film is expanded to the folding angle. The reflection of scattered light is facilitated by arranging the folding angle close to the optical axis. Specifically, the folding angle may be a chamfered angle, a rounded angle, an edged angle, etc. to connect both end surfaces.The anti-reflection film may also be coated on the first end surface and the second end surface.The intermediate layer may consist mainly of silicon dioxide. This is advantageous for the stability of the connection between the anti-reflection film and the optical component. In addition, the number of the intermediate layers may be more than one so as to provide a multilayer structure in which high refractive index layers and low refractive index layers can be alternately stacked. Thus, by forming a thin film interference structure, the refractive index can be reduced.A main component of the at least one intermediate layer may be equal to a part of the components of the nanostructure layer. This is advantageous for the connection of the nanostructure layer. More specifically, the above-mentioned component (the same component) may be aluminum, titanium, vanadium, chromium, aluminum oxide, titanium oxide, vanadium oxide or chromium oxide.The metallic dopant material is also distributed on a surface of each of the rib-like protrusions. This is advantageous for protecting the rib-like projections from structural changes due to environmental influences, so that the anti-reflection effect can be maintained. In addition, the component of the metallic dopant material dispersed on the surface of each of the rib-like protrusions and the component of the metallic dopant material dispersed in each of the rib-like protrusions may be the same or different.The metallic dopant material distributed within each of the rib-like protrusions may taper from the optical component. This is advantageous for adjusting the equivalent refractive index in that the weather resistance of the rib-like protrusions is improved and the anti-reflection effect is maintained.The metallic dopant material may be titanium or titanium oxide. This is particularly advantageous for improving the stability of the anti-reflection film by using titanium as the metallic dopant.The anti-reflection film may further include a dark layer disposed between the at least one intermediate layer and the optical component, which serves to give the optical component a dark appearance. This promotes light absorption by changing the color of the optical member. The dark layer may be a sprayed black ink layer of fast drying epoxy-based ink, a black coating by chemical vapor deposition, a light resistant coating, or other dark coatings having light absorption effects.With DO for the shortest distance between the light blocking part and the optical axis, the following condition is satisfied: 0.01 mm≤DO≤6.8 mm. This is advantageous for restricting scattered light in the peripheral region of the optical axis. In addition, the following condition can be satisfied: 0.5 mm≤DO≤5.2 mm.With TM for the coating thickness of the metallic dopant material on the surface of each of the rib-like protrusions, the following condition is satisfied: 1 nm ≤ TM ≤ 40 nm. This is advantageous for maintaining the shape of the rib-like protrusions and also for enhancing their weather resistance by satisfying the appropriate thickness condition. In particular, the coating thickness can be measured by the average value of a plurality of thicknesses at different locations. In addition, the following condition may be satisfied: 1 nm≤TM≤30 nm.Each of the above-mentioned features of the lens array module may be applied in various combinations to achieve the respective effects.In one aspect of the present disclosure, an electronic device includes the above-mentioned lens array module.In accordance with the above description of the present disclosure, the following specific embodiments are given for further explanation.<1 Embodiment>FIG. 1A is a three-dimensional view of an imaging lens array module 100 in the 1st embodiment of the present disclosure. FIG. 1B is a schematic view of the imaging lens array module 100 in the 1st embodiment of FIG. 1A. In FIGS. 1A and 1B, the imaging lens array module 100 defines an optical axis X and includes an optical component 110, a lens element 141, and an image sensor 142, wherein the optical component 110 is a lens barrel, the optical component 110 serves to receive the lens element 141, and the image sensor 142 is disposed in the image surface IMG of the imaging lens array module 100. In particular, a surface of the optical component may be roughened, for example by sandblasting or laser, which may scatter light.FIG. 1C is a three-dimensional view of the optical component 110 in the 1st embodiment of FIG. 1A. FIG. 1D is an enlarged partial view of the optical component 110 in the 1st embodiment of FIG. 1C. FIG. 1E is a schematic view of an anti-reflection film 130 and a light blocking part 120 in the 1st embodiment of FIG. 1A. In FIGS. 1A and 1C to 1E, the optical member 110 includes the light blocking part 120 and the anti-reflection film 130. The light blocking part 120 is opaque and the light blocking part 120 is closer to the optical axis X than the remaining part of the optical member 110 is to the optical axis X. The anti-reflection film 130 is coated on at least one surface of the light blocking part 120. The anti-reflection thin film 130 comprises a nanostructure layer 131 and at least one intermediate layer 133, wherein the intermediate layer 133 is arranged between the nanostructure layer 131 and the optical component 110. The nanostructure layer 131 includes a plurality of ridge-like protrusions 132 that extend non-directionally, a bottom of each of the ridge-like protrusions 132 being closer to the optical component 110 than a tip of each of the ridge-like protrusions 132, each of the ridge-like protrusions 132 tapering from bottom to tip.This is advantageous for forming a refractive index gradient by the rib-like protrusions 132 and advantageous for providing excellent performance with low reflectance for light of different wavelengths and at different incident angles of the light beams. Moreover, since stray light is easily generated at the light blocking portion 120 located near the optical axis X, by applying the anti-reflection film 130, it is advantageous for improving the image quality.The surface of the nanostructure layer 131 may also have a plurality of holes, such that the variation of the equivalent refractive index of the nanostructure layer 131 through the holes may be more linear.It should be noted that the dotted region in FIG. 1E is the region of the metallic dopant material 134.FIG. 1F is a cross-sectional view with a transmission electron microscope of the anti-reflection film 130 and the light blocking part 120 in the 1st embodiment of FIG. 1E. FIG. 1G is an element distribution map of aluminum in the anti-reflection film 130 in the 1st embodiment of FIG. 1F. FIG. 1H is an element distribution map of silicon in the anti-reflection film 130 in the 1st embodiment of FIG. 1F. FIG. 1I is an element distribution map of titanium in the anti-reflection film 130 in the 1st embodiment of FIG. 1F. In FIGS. 1F to 1I, the nanostructure layer 131 is mainly made of aluminum oxide. The nanostructure layer 131 includes the metallic dopant material 134, wherein the metallic dopant material 134 is distributed within at least each of the rib-like protrusions 132, and the metallic dopant material 134 is made of titanium oxide to improve the stability of the anti-reflective film 130. It should be noted that "consisting mainly of" means the component having the highest weight percentage.This is advantageous for improving the environmental resistance of the nanostructure layer 131, by incorporating the metallic dopant material 134 such that the effect of environmental changes on the layer structure can be reduced, and also the anti-reflection effect of the anti-reflection film 130 can be obtained. The environmental changes may be, but are not limited to, temperature, humidity, or other chemical degradations.In FIG. 1D, the light blocking part 120 may include a first end surface 121 and a second end surface 122, the first end surface 121 being inclined relative to the optical axis X, and the second end surface 122 being connected to the first end surface 121, a folding angle 123 being included between the first end surface 121 and the second end surface 122. This is advantageous for changing the reflection beam path of scattered light due to the arrangement of the first end face 121 inclined with respect to the optical axis X, so that the impairment of the image quality by scattered light can be avoided.The folding angle 123 is closer to the optical axis X than the first end surface 121 and the second end surface 122 are to the optical axis X, the anti-reflection film 130 is coated at least on the folding angle 123, the folding angle 123 is an angular angle, and the range of the anti-reflection film 130 can be further expanded to the first end surface 121 and the second end surface 122. This is advantageous for reducing the possibility of reflection of stray light by the folding angle 123, and it is advantageous for further reducing the reflection of stray light that the anti-reflection film 130 is expanded to the folding angle 123. In addition, by arranging the folding angle 123 near the optical axis X, the reduction of the reflection of scattered light is facilitated.In FIG. 1H, the intermediate layer 133 may be mainly made of silicon dioxide (SiO 2). This is advantageous for the stability of the connection between the anti-reflection film 130 and the optical component 110. In addition, the number of the intermediate layers 133 may be more than one so as to provide a multilayer structure in which high refractive index layers and low refractive index layers may be alternately stacked. Thus, by forming a thin film interference structure, the refractive index can be reduced.In FIGS. 1E, 1F, and 1I, the metallic dopant material 134 is also distributed on a surface of each of the fin-like protrusions 132. This is advantageous for protecting the rib-like protrusions 132 from structural changes due to environmental influences, so that the anti-reflection effect can be maintained. In addition, the component of the metallic dopant material 134 dispersed on the surface of each of the rib-like protrusions 132 and the component of the metallic dopant material 134 dispersed in each of the rib-like protrusions 132 may be the same or different.The metallic dopant material 134 distributed within each of the rib-like protrusions 132 may taper from the optical component 110. This is advantageous for adjusting the equivalent refractive index in that the weather resistance of the rib-like protrusions 132 is improved and the anti-reflection effect is maintained.In FIGS. 1D and 1F, with DO for the shortest distance between the light blocking part 120 and the optical axis X, θC for the folding angle 123, TM for the coating thickness of the metal dopant material 134 on the surface of each of the rib-like protrusions 132, H for the vertical height of one of the rib-like protrusions 132, and HI for the thickness of the intermediate layer 133, the parameters may satisfy the conditions in the following Table 1.DO (mm)3,26H (nm)240,1θC (°)70HI (nm)96,1TM (nm)18,4Specifically, an average structure height of the rib-like protrusions 132 is greater than 108 nm and less than 368 nm. The height of each of the rib-like protrusions 132 can be defined by evaluating the cross-sectional view (which means destructive measurement) as a vertical height from the absolute bottom of each of the rib-like protrusions 132 (the root of each of the rib-like protrusions 132) to the tip of each of the rib-like protrusions 132 (the peak of each of the rib-like protrusions 132). The height of each of the rib-like protrusions 132 could also be different, such that an average structural height of at least three or more rib-like protrusions 132 can be measured and rib-like protrusions 132 having clear contours can be considered first.Note that the anti-reflection film 130 and the light blocking part 120 in FIGS. 1G to 1I correspond to the structure arrangement in FIG. 1F, and detection and analysis of the metallic doping material 134 may be performed using EDS or TEM or SEM. The distribution of the metallic elements is the main basis of the assessment, regardless of whether the metallic doping material is present in the form of elemental metal or as oxide. In addition, the distribution of the metallic dopant material 134 in the nanostructure layer 131 of FIG. 1I may be analyzed.<2 Embodiment>FIG. 2A is a three-dimensional view of an imaging lens array module 200 in the 2nd embodiment of the present disclosure. FIG. 2B is an exploded view of the imaging lens array module 200 in the 2nd embodiment of FIG. 2A. FIG. 2C is a schematic view of the imaging lens array module 200 in the 2nd embodiment of FIG. 2A. In FIGS. 2A to 2C, the imaging lens array module 200 defines an optical axis X and includes optical components 211, 212, a lens array 242, and an image sensor 243. The optical component 211 is a cover of an iris diaphragm, the optical components 212 are lamellae of the iris diaphragm, wherein the iris diaphragm can consist of the optical components 211, 212 and the iris diaphragm is arranged on the lens arrangement 242. The image sensor 243 is disposed in the image surface IMG of the imaging lens array module 200.FIG. 2D is a three-dimensional view of the optical component 211 in the 2nd embodiment of FIG. 2A. FIG. 2E is an enlarged partial view of the optical component 211 in the 2nd embodiment of FIG. 2D. In FIGS. 2A, 2B, 2D, and 2E, the optical member 211 includes a light blocking part 220 and the anti-reflection film 230. The light blocking part 220 is opaque and the light blocking part 220 is closer to the optical axis X than the remaining part of the optical member 211 is to the optical axis X. The anti-reflection film 230 is coated on at least one surface of the light blocking part 220. The anti-reflection thin film 230 comprises a nanostructure layer and at least one intermediate layer, wherein the intermediate layer is arranged between the nanostructure layer and the optical component 211. The nanostructure layer includes a plurality of ridge-like protrusions extending non-directionally, a bottom of each of the ridge-like protrusions being closer to the optical component 211 than a tip of each of the ridge-like protrusions, each of the ridge-like protrusions tapering from bottom to tip.The nanostructure layer is primarily comprised of aluminum oxide. The nanostructure layer comprises the metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions and the metallic dopant material includes at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide. In addition, the metallic doping material can be selected from tantalum, zirconium, niobium, tantalum oxide, zirconium oxide and niobium oxide.In FIG. 2E, the light blocking part 220 may include a first end surface 221 and a second end surface 222, the first end surface 221 being inclined relative to the optical axis X, and the second end surface 222 being connected to the first end surface 221. A folding angle 223 is enclosed between the first end face 221 and the second end face 222. Here, the folding angle 223 is closer to the optical axis X than the first end surface 221 and the second end surface 222 are to the optical axis X, the anti-reflection film 230 is coated at least on the folding angle 223, the folding angle 223 is an angular angle, and the range of the anti-reflection film 230 may be extended to the first end surface 221 and the second end surface 222.FIG. 2F is a three-dimensional view of the optical components 212 in the 2nd embodiment of FIG. 2A. FIG. 2G is a partial schematic view of the optical components 212 in the 2nd embodiment of FIG. 2F. In FIGS. 2F and 2G, each of the optical members 212 includes a light blocking part and an anti-reflection film 230. The light blocking part includes an object-side surface 224, an image-side surface, and a connection surface 226. The object-side surface 224 is located near the object-side direction of the imaging lens array module 200, the image-side surface is corresponding to the object-side surface 224, and the connection surface 226 connects the object-side surface 224 to the image-side surface. In addition, the bonding surface 226 is closer to the optical axis X than the object-side surface 224 and the image-side surface are to the optical axis X, and the anti-reflection film is coated only on the bonding surface 226.In FIG. 2C, there is no other shielding part between each of the optical members 211, 212 and the optical axis X.In FIG. 2E, with DO for the shortest distance between the light blocking part 220 and the optical axis X, and θC for the folding angle 223, the parameters may satisfy the conditions in the following Table 2.DO (mm)2,4θC (°)90<3 Embodiment>FIG. 3A is an exploded view of the imaging lens array module 300 in the 3rd embodiment of the present disclosure. FIG. 3B is a schematic view of the imaging lens array module 300 in the 3rd embodiment of FIG. 3A. In FIGS. 3A and 3B, the imaging lens array module 300 defines an optical axis X and includes optical components 311, 312, a lens element 341, a mounting part 342, a reflecting part 343, and an image sensor 344. The optical component 311 is a lens barrel, the optical component 312 is a light blocking ring. The optical component 311 serves to house the lens element 341, the reflective part 343, and the optical component 312, the mounting part 342 serves to position the reflective part 343, and the image sensor 344 is disposed in the image surface IMG of the imaging lens array module 300.Specifically, the optical axis X in the imaging lens array module 300 may be folded by the reflecting part 343, and the optical axis X after folding is defined as the same optical axis.FIG. 3C is a three-dimensional view of the optical member 312 and the reflecting part 343 in the 3rd embodiment of FIG. 3A. FIG. 3D is a composite schematic view of the optical member 312 and the reflecting part 343 in the 3rd embodiment of FIG. 3A. FIG. 3E is a schematic view of the optical component 312 in the 3rd embodiment of FIG. 3A. In FIGS. 3C to 3E, the optical member 312 includes a light blocking part 320 aand an anti-reflection film 330. The light blocking part 320 ais opaque and the light blocking part 320 ais closer to the optical axis X than the remaining part of the optical member 312 is to the optical axis X. The anti-reflection film 330 is coated on at least one surface of the light blocking part 320 a. The anti-reflection thin film 330 comprises a nanostructure layer and at least one intermediate layer, wherein the intermediate layer is arranged between the nanostructure layer and the optical component 312. The nanostructure layer includes a plurality of ridge-like protrusions extending non-directionally, a bottom of each of the ridge-like protrusions being closer to the optical component 312 than a tip of each of the ridge-like protrusions, each of the ridge-like protrusions tapering from bottom to tip.The nanostructure layer is primarily comprised of aluminum oxide. The nanostructure layer comprises a metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions, and the metallic dopant material is at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.In FIG. 3D, the light blocking part 320 aincludes an object-side surface 324, an image-side surface 325, and a connection surface 326. The object-side surface 324 is located near the object-side direction of the imaging lens array module 300, the image-side surface 325 is corresponding to the object-side surface 324, and the connection surface 326 connects the object-side surface 324 to the image-side surface 325. The anti-reflection film 330 is deposited at least on the bonding surface 326. In addition, the anti-reflection film 330 may be further expanded to the object-side surface 324 to further restrict the stray light in the object-side direction.In FIGS. 3C and 3E, the optical member 312 may further include an adhesive G, the adhesive G being disposed on the object-side surface 324, and the optical member 312 being bonded to the reflecting part 343 through the adhesive G.FIG. 3F is a three-dimensional view of the optical component 311 in the 3rd embodiment of FIG. 3A. FIG. 3G is another three-dimensional view of the optical component 311 in the 3rd embodiment of FIG. 3A. FIG. 3H is a schematic view of the optical component 311 in the 3rd embodiment of FIG. 3F. In FIGS. 3F to 3H, the optical member 311 includes a light blocking part 320 band an anti-reflection film 330. The light blocking part 320 bmay include a first end surface 321 and a second end surface 322, the first end surface 321 being inclined relative to the optical axis X, and the second end surface 322 being connected to the first end surface 321, wherein a folding angle 323 is included between the first end surface 321 and the second end surface 322. The folding angle 323 is closer to the optical axis X than the first end surface 321 and the second end surface 322 are to the optical axis X, the anti-reflection film 330 is coated at least on the folding angle 323, the folding angle 323 is an angular angle, and the range of the anti-reflection film 330 can be expanded to the first end surface 321 and the second end surface 322.In FIGS. 3D and 3H, with DO for the shortest distance between the light blocking parts 320 a, 320 band the optical axis X, θC for the folding angle 323 of the light blocking part 320 b, the parameters may satisfy the conditions in the following Table 3.DO (mm) (light blocking part 320 a)0,05θC (°)45DO (mm) (light blocking part 320 b)0,77<4. Embodiment>FIG. 4A is a three-dimensional view of an imaging lens array module 400 in the 4th embodiment of the present disclosure. FIG. 4B is an exploded view of the imaging lens array module 400 in the 4th embodiment of FIG. 4A. FIG. 4C is a schematic view of the imaging lens array module 400 in the 4th embodiment of FIG. 4A. In FIGS. 4A to 4C, the imaging lens array module 400 defines an optical axis X and includes optical members 411, 412, a lens element 441, and a reflecting part 442. The optical member 411 is a cover, the optical member 412 is a holder. The optical member 411 is for accommodating the optical member 412, the lens element 441, and the reflecting part 442. The optical member 412 and the reflecting member 442 are arranged corresponding to each other.FIG. 4D is a three-dimensional view of the optical component 411 in the 4th embodiment of FIG. 4A. FIG. 4E is a schematic view of the optical component 411 in the 4th embodiment of FIG. 4D. FIG. 4F is a schematic view of an anti-reflection film 430 and a light blocking part 420 ain the 4th embodiment of FIG. 4D. In FIGS. 4D to 4F, the optical member 411 includes a light blocking part 420 aand an anti-reflection film 430. The light blocking part 420 ais opaque and the light blocking part 420 ais closer to the optical axis X than the remaining part of the optical member 411 is to the optical axis X. The anti-reflection film 430 is coated on at least one surface of the light blocking part 420 a. The anti-reflection thin film 430 comprises a nanostructure layer 431 and at least one intermediate layer 433, wherein the intermediate layer 433 is arranged between the nanostructure layer 431 and the optical component 411. The nanostructure layer 431 has a plurality of ridge-like protrusions 432 that extend unaligned, with a bottom of each of the ridge-like protrusions 432 being closer to the optical component 411 than a tip of each of the ridge-like protrusions 432, each of the ridge-like protrusions 432 tapering from bottom to tip.The nanostructure layer 431 is mainly made of aluminum oxide. The nanostructure layer 431 comprises the metallic dopant material 434, wherein the metallic dopant material 434 is distributed within at least each of the rib-like protrusions 432, and the metallic dopant material 434 is made of at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.Specifically, the intermediate layer 433 is made of titanium oxide (TiO 2) and the metallic dopant 434 is made of chromium oxide (Cr x O y), wherein a main component of the intermediate layer 433 may be the same as a part of the components of the nanostructure layer 431, and the above-mentioned component (the same component) may be aluminum, titanium, vanadium, chromium, aluminum oxide, titanium oxide, vanadium oxide, or chromium oxide. This is advantageous for improving the adhesion of the nanostructure layer 431.In FIGS. 4D and 4E, the light blocking part 420 aincludes an object-side surface 424 a, an image-side surface 425 a, and a connection surface 426 a. The object-side surface 424 ais located near the object-side direction of the imaging lens array module 400, the image-side surface 425 ais corresponding to the object-side surface 424 a, and the connection surface 426 aconnects the object-side surface 424 ato the image-side surface 425 a. In addition, the connection surface 426 aof the optical axis X is closer than the object-side surface 424 aand the image-side surface 425 aof the optical axis X are, and the anti-reflection film 430 is coated at least on the connection surface 426. In addition, the anti-reflection film 430 may be further extended to the object-side surface 424 aand the image-side surface 425 a.In FIG. 4F, the anti-reflective film may further include a dark layer 435 disposed between the intermediate layer 433 and the optical member 411, which serves to give the optical member 411 a dark appearance. This is advantageous for light absorption by changing the color of the optical component. The dark layer 435 may be a sprayed black epoxy-based fast drying ink ink ink layer, a chemical vapor deposition black coating, a light resistant coating, or other dark coatings with light absorption effects.It should be noted that the optical member 411 is made of metal, and the dotted region in the rib-like protrusions 432 in FIG. 4F is the region of the metallic doping material 434.FIG. 4G is a three-dimensional view of the optical component 412 in the 4th embodiment of FIG. 4A. FIG. 4H is a schematic view of the optical component 412 in the 4th embodiment of FIG. 4G. In FIGS. 4G and 4H, the optical member 412 includes a light blocking part 420 band an anti-reflection film 430. The light blocking part 420 bincludes an object-side surface 424 b, an image-side surface 425 b, and a connection surface 426 b. The object-side surface 424 bis located near the object-side direction of the imaging lens array module 400, the image-side surface 425 bis corresponding to the object-side surface 424 b, and the connection surface 426 bconnects the object-side surface 424 bto the image-side surface 425 b. Further, the connection surface 426 bis closer to the optical axis X than the object-side surface 424 band the image-side surface 425 bare to the optical axis X, and the anti-reflection film 430 is coated on at least the connection surface 426 b. In addition, the anti-reflection film 430 can be further extended to the image-side surface 425 b.In FIGS. 4E and 4H, with DO for the shortest distance between the light blocking parts 420 a, 420 band the optical axis X, the parameters may satisfy the conditions in the following Table 4.DO (mm) (light blocking part 420 a)2,72DO (mm) (light blocking part 420 b)2,38<5. Embodiment>FIG. 5A is a schematic view of an imaging lens array module 500 in the 5th embodiment of the present disclosure. In FIG. 5A, the imaging lens array module 500 defines an optical axis X, and includes an optical component 510, a lens element 541, a lens barrel 542, and an image sensor 543. The optical component 510 is a spacer ring, the lens barrel 542 serves to house the optical component 510 and the lens element 541. The image sensor 543 is disposed in the image surface IMG of the imaging lens array module 500.FIG. 5B is a three-dimensional view of the optical component 510 in the 5th embodiment of FIG. 5A. FIG. 5C is a schematic view of the optical component 510 in the 5th embodiment of FIG. 5A. In FIGS. 5B and 5C, the optical member 510 includes a light blocking part 520 and an anti-reflection film 530. The light blocking part 520 is opaque and the light blocking part 520 is closer to the optical axis X than the remaining part of the optical member 510 is to the optical axis X. The anti-reflection film 530 is coated on at least one surface of the light blocking part 520. The anti-reflection thin layer 530 comprises a nanostructure layer and at least one intermediate layer, wherein the intermediate layer is arranged between the nanostructure layer and the optical component 510. The nanostructure layer includes a plurality of ridge-like protrusions extending non-directionally, wherein a bottom of each of the ridge-like protrusions 432 is closer to the optical component 510 than a tip of each of the ridge-like protrusions and each of the ridge-like protrusions tapers from bottom to tip.The nanostructure layer is primarily comprised of aluminum oxide. The nanostructure layer comprises the metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions, and the metallic dopant material is at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.The light blocking part 520 may have a first end surface 521 and a second end surface 522, the first end surface 521 being inclined relative to the optical axis X, and the second end surface 522 being connected to the first end surface 521, a folding angle 523 being included between the first end surface 521 and the second end surface 522. The folding angle 523 is closer to the optical axis X than the first end surface 521 and the second end surface 522 are of the optical axis X, the anti-reflection film 530 is coated at least on the folding angle 523, the folding angle 523 is a combination of a angular angle and a rounded angle, and the range of the anti-reflection film 530 can also be extended to the first end surface 521 and the second end surface 522.In FIG. 5C, with DO for the shortest distance between the light blocking part 520 and the optical axis X, and θC for the folding angle 523, the parameters may satisfy the conditions in the following Table 5.DO (mm)1,55θC (°)60<6. Embodiment>FIG. 6A is a schematic view of an imaging lens array module 600 in the 6th embodiment of the present disclosure. In FIG. 6A, the imaging lens array module 600 defines an optical axis X and includes an optical component 610, a lens element 641, a lens barrel 642, and an image sensor 643. The optical component 610 is a light blocking ring, and the lens barrel 642 is for accommodating the optical component 610 and the lens element 641. The image sensor 643 is disposed in the image surface IMG of the imaging lens array module 600.FIG. 6B is a three-dimensional view of the optical component 610 in the 6th embodiment of FIG. 6A. FIG. 6C is a schematic view of the optical component 610 in the 6th embodiment of FIG. 6A. In FIGS. 6B and 6C, the optical member 610 includes a light blocking part 620 and an anti-reflection film 630. The light blocking part 620 is opaque and the light blocking part 620 is closer to the optical axis X than the remaining part of the optical component 610 is to the optical axis X. The anti-reflection film 630 is coated on at least one surface of the light blocking part 620. The anti-reflection thin layer 630 comprises a nanostructure layer and at least one intermediate layer, wherein the intermediate layer is arranged between the nanostructure layer and the optical component 610. The nanostructure layer includes a plurality of ridge-like protrusions extending non-directionally, a bottom of each of the ridge-like protrusions being closer to the optical component 610 than a tip of each of the ridge-like protrusions, each of the ridge-like protrusions tapering from bottom to tip.The nanostructure layer is primarily comprised of aluminum oxide. The nanostructure layer comprises the metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions, and the metallic dopant material is at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.The light blocking part 620 has an object-side surface 624, an image-side surface 625, and a connection surface 626. The object-side surface 624 is located near the object-side direction of the imaging lens array module 600, the image-side surface 625 corresponds to the object-side surface 624, and the connection surface 626 connects the object-side surface 624 to the image-side surface 625. In addition, the connection surface 626 is closer to the optical axis X than the object-side surface 624 and the image-side surface 625 are to the optical axis X, and the anti-reflection film 630 is coated at least on the connection surface 626. In addition, the anti-reflection film 630 may also be extended to the object-side surface 624.Specifically, the connecting surface 626 of the light blocking part 620 may be additionally processed to make the connecting surface 626 uneven, so that the reflection of stray light at the connecting surface 626 may be avoided.In FIG. 6C, with DO for the shortest distance between the light blocking part 620 and the optical axis X, the parameter may satisfy the condition in the following Table 6.DO (mm)2,82<7. Embodiment>FIG. 7A is a schematic view of an imaging lens array module 700 in the 7th embodiment of the present disclosure. In FIG. 7A, the imaging lens array module 700 defines an optical axis X and includes an optical component 710, lens elements 741, 742, a lens barrel 743, and an image sensor 744. The optical component 710 is a spacer ring, the lens barrel 743 serves to accommodate the optical component 710 and the lens elements 741, 742. The image sensor 744 is disposed in the image surface IMG of the imaging lens array module 700.FIG. 7B is a three-dimensional view of the optical component 710 and the lens element 742 in the 7th embodiment of FIG. 7A. FIG. 7C is a partial cross-sectional view of the optical component 710 and the lens element 742 in the 7th embodiment of FIG. 7B. FIG. 7D is a schematic view of the optical component 710 and the lens element 742 in the 7th embodiment of FIG. 7A. In FIGS. 7A to 7D, the lens element 742 is bonded to the optical component 710 in an insert molding process to form a molded glass lens element.In FIGS. 7B to 7D, the optical member 710 includes a light blocking part 720 and an anti-reflection film 730. The light blocking part 720 is opaque and the light blocking part 720 is closer to the optical axis X than the remaining part of the optical component 710 is to the optical axis X. The anti-reflection film 730 is coated on at least one surface of the light blocking part 720. The anti-reflection thin layer 730 comprises a nanostructure layer and at least one intermediate layer, wherein the intermediate layer is arranged between the nanostructure layer and the optical component 710. The nanostructure layer includes a plurality of ridge-like protrusions running unaligned, wherein a bottom of each of the ridge-like protrusions is closer to the optical component 710 than a tip of each of the ridge-like protrusions, and each of the ridge-like protrusions tapers from bottom to tip.The nanostructure layer is primarily comprised of aluminum oxide. The nanostructure layer comprises the metallic dopant material, wherein the metallic dopant material is distributed within at least each of the rib-like protrusions, and the metallic dopant material is at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.In FIG. 7B, the anti-reflection film 730 may be extended to the lens element 742.In FIG. 7D, with DO for the shortest distance between the light blocking part 720 and the optical axis X, the parameter may satisfy the condition in the following Table 7.DO (mm)0,94<8. Embodiment>FIG. 8A is a schematic view of an electronic device 80 in the 8th embodiment of the present disclosure. FIG. 8B is another schematic view of the electronic device 80 in the 8th embodiment of FIG. 8A. In FIGS. 8A and 8B, the electronic device 80 is a smartphone, and includes a user interface 821 and a plurality of imaging lens array modules. Further, the imaging lens array modules include an ultra wide angle imaging lens array module 822, a high resolution imaging lens array module 823, and telephoto imaging lens array modules 824, 825, and the user interface 821 is a touch screen, but is not limited thereto. Specifically, the ultra wide angle imaging lens array module 822 may be the imaging lens array module 100 of the above-mentioned 1st embodiment, the high resolution imaging lens array module 823 may be the imaging lens array module 200 of the above-mentioned 2nd embodiment, the telephoto imaging lens array module 824 may be the imaging lens array module 300 of the above-mentioned 3rd embodiment, and the telephoto imaging lens array module 825 may be the imaging lens array module 400 of the above-mentioned 4th embodiment, but the present disclosure is not limited thereto.In addition, users input a photographing mode through the user interface 821, the user interface 821 serves to display the subject, and the photographing angle can be manually set to switch between the various imaging lens array modules. At this time, the image-forming light is cast onto the image sensor by the imaging lens array module, and an electronic signal over an image is output to an image signal processor (ISP) 826.In order to satisfy a technical feature of the electronic device 80, the electronic device 80 in FIGS. 8A and 8B may further include an optical anti-shake mechanism (not illustrated in the drawings). In addition, the electronic device 80 may include at least one focusing aid module (not illustrated in the drawings) and at least one sensor component (not illustrated in the drawings). The focusing aid module may be a flash module for compensating for color temperature, an infrared ranging component, a laser focusing module, etc. The sensor component may have functions for detecting torque and kinetic energy, such as accelerometers, gyroscope, and Hall effect element, to detect shake or shake applied by user's hands or external environmental influences. Accordingly, the imaging lens array module of the electronic device 80 equipped with the autofocus mechanism and the optical shake prevention mechanism can be improved to achieve high image quality. In addition, the electronic device 80 of the present disclosure may have a capturing function having multiple capturing modes such as to capture optimized selfies, high depth of field (HDR) under low light source, 4K resolution recording, etc. Moreover, the users may view an image captured by the camera through the user interface 821 and manually set the finder range on the user interface 821 to apply the autofocus function on the principle of "what you are viewing, what you are getting".In addition, the imaging lens array modules, the optical shake prevention mechanism, the sensor component, and the focusing aid module may be disposed on a flexible printed circuit board (FPC) (not shown in the drawings) and electrically connected to the related components such as the image signal processor 826 via a connector (not shown in the drawings) to perform a capturing operation. Since current electronic devices such as smart phones tend to be compact, the method of first arranging the imaging lens array module and related parts on the flexible circuit board and then integrating the circuit through a connector into the main board of the electronic device can satisfy the requirements of the mechanical design and the circuit design with limited space in the electronic device and achieve greater latitude. The autofocus function of the imaging lens arrangement module can also be set more flexibly via the touch-sensitive screen of the electronic device. In the 8th embodiment, the electronic device 80 may include a plurality of sensor components and a plurality of focusing aid modules. The sensor components and focusing aid modules are disposed on the flexible circuit board and at least one other flexible circuit board (not shown in the drawings) and electrically connected to the related components such as the image signal processor 826 via corresponding connectors to perform the capturing operation. In other examples (not shown in the drawings), the sensor components and the focusing aid modules may also be arranged on the main board of the electronic device or supports of a different type depending on the requirements of the mechanical design and the circuit design.Moreover, the electronic device 80 may also include, but is not limited to, a screen, a controller, a storage unit, a volatile memory (RAM), a read only memory (ROM), or combinations thereof.FIG. 8C is a schematic view of an image captured by the electronic device 80 in the 8th embodiment of FIG. 8A. As shown in FIG. 8C, a larger-range image may be captured by the ultra-wide-angle lens imaging lens array module 822, and the ultra-wide-angle lens imaging lens array module 822 may have the function of capturing a larger range of the subject.FIG. 8D is another schematic view of an image captured by the electronic device 80 in the 8th embodiment of FIG. 8A. As shown in FIG. 8D, a high-resolution image of a certain area can be captured by the high-resolution imaging lens array module 823, and the high-resolution imaging lens array module 823 has a function of high resolution and low distortion.FIG. 8E is another schematic view of an image captured with the electronic device 80 in the 8th embodiment of FIG. 8A. As shown in FIG. 8E, the telephoto imaging lens array modules 824, 825 have the function of high magnification, and a remote image can be captured and high magnification by the telephoto imaging lens array modules 824, 825.As shown in FIGS. 8C to 8E, a zoom function can be obtained with the electronic device 80 when the subject is captured by camera modules having different focal lengths and processed by the image processing function.<9. Embodiment>FIG. 9 is a schematic view of an electronic device 90 in the 9th embodiment of the present disclosure. In FIG. 9, the electronic device 90 is a smartphone and includes a plurality of imaging lens array modules. Here, the imaging lens array modules are ultra wide angle lens imaging lens array modules 921, 922, wide angle lens imaging lens array modules 923, 924, telephoto lens imaging lens array modules 925, 926, 927, 928, and a time-of-flight (TOF) module 929. The TOF module 929 may be an imaging lens array module of another type, and the arrangement is not limited thereto.Specifically, the ultra wide angle lens array module 921 may be the imaging lens array module 100 of the above-mentioned 1st embodiment, the ultra wide angle lens array module 922 may be the imaging lens array module 700 of the above-mentioned 7th embodiment, the wide angle lens array module 923 may be the imaging lens array module 200 of the above-mentioned 2nd embodiment, the wide angle lens array module 924 may be the imaging lens array module 600 of the above-mentioned 6th embodiment, the tele lens array module 925 may be the imaging lens array module 500 of the above-mentioned 5th embodiment, the telephoto imaging lens array module 926 may be the imaging lens array module 300 of the aforementioned 3rd embodiment, and the telephoto imaging lens array module 927 may be the imaging lens array module 400 of the aforementioned 4th embodiment.In addition, the telephoto imaging lens array modules 927, 928 are configured for beam path folding, but the present disclosure is not limited thereto.In order to satisfy a technical feature of the electronic device 90, the electronic device 90 may further include an optical shake prevention mechanism (not illustrated in the drawings). In addition, the electronic device 90 may include at least one focusing aid module (not illustrated in the drawings) and at least one sensor component (not illustrated in the drawings). The focusing aid module may be a flash module 930 for compensating for color temperature, an infrared ranging component, a laser focusing module, etc. The sensor component may have functions for sensing torque and kinetic energy, such as accelerometers, gyroscope, and Hall effect element, to sense shake or shake applied by user's hands or external environmental influences. Thus, the camera module of the electronic device 90 equipped with the autofocus function and the optical shake prevention mechanism can be improved to achieve high image quality. In addition, the electronic device 90 of the present disclosure may have a recording function with multiple recording modes such as recording optimized selfies, high depth of field (HDR) with a low light source, 4K resolution recording, etc.Incidentally, all other constructions and arrangements in the 9th embodiment are the same as the structures and arrangements in the 8th embodiment and will not be described again here.<10. Embodiment>FIG. 10A is a schematic view of imaging lens array modules 1010 applied in a vehicle device 1000 in the 10th embodiment of the present disclosure. FIG. 10B shows another schematic view of the imaging lens array modules 1010 arranged in the vehicle device 1000 in the 10th embodiment in FIG. 10A. FIG. 10C shows another schematic view of the imaging lens array modules 1010 arranged in the vehicle device 1000 in the 10th embodiment in FIG. 10A. In FIGS. 10A to 10C, the vehicle device 1000 includes the imaging lens array modules 1010. In the 10th embodiment, the number of imaging lens array modules 1010 is six, which are automobile imaging lens array modules. Each of the imaging lens array modules 1010 may be the imaging lens array module according to any one of the above-mentioned 1st embodiment to 7th embodiment, but the present disclosure is not limited thereto.In FIGS. 10A to 10B, the imaging lens array modules 1010 are located on the left and right sides, respectively, among two rear-view mirrors, which is for capturing image information of a visual field θ. Specifically, the visual field θ may satisfy the following condition: 40°<θ<90°. The image information in the region of two lanes on the left side and the right side can thus be recorded.In FIGS. 10B and 10C, two other ones of the imaging lens array modules 1010 may be disposed in the interior of the vehicle device 1000 such that the traffic information outside the vehicle may be obtained, such as I 1, I 2, I 3, I 4, without being limited thereto. In particular, the two mentioned imaging lens arrangement modules 1010 may be arranged near the rearview mirror inside the vehicle device 1000 and near the rear window, respectively. In addition, the imaging lens array modules 1010 may be disposed on non-reflective surfaces on the rear mirrors of the vehicle device 1000 on the left and right sides, respectively, but are not limited thereto.Two other ones of the imaging lens array modules 1010 may be disposed at the front end and the rear end of the vehicle device 1000. Here, the traffic information outside the vehicle can be detected helpful by arranging the imaging lens array modules 1010 at the front end, the rear end, and below the left and right rear view mirrors of the vehicle device 1000. Therefore, the angle of view can be made wide to reduce the blind spot, which is advantageous for enhancing the driving safety. In addition, this is advantageous for sensing the exterior information outside the in-vehicle device 1000 by arranging the imaging lens array modules 1010 around the in-vehicle device 1000, so that the automatic driver assistance function can be achieved.

Claims

An imaging lens array module (100) defining an optical axis (X), and comprising: an optical component (110) comprising: a light blocking part (120) that is opaque, wherein the light blocking part (120) is closer to the optical axis (X) than the remaining part of the optical component (110) is closer to the optical axis (X), and a anti-reflection film (130) coated at least on a surface of the light blocking part (120), wherein the anti-reflection film (130) comprises: a nanostructure layer (131) having a plurality of ridge-like protrusions (132) that are non-directional, wherein the bottom of each of the ridge-like protrusions (132) is closer to the optical component (110) than the tip of each of the ridge-like protrusions (132), Each of the rib-like protrusions (132) tapers from the bottom to the tip and an average structure height of the rib-like protrusions (132) is greater than 108 nm and less than 368 nm, and at least one intermediate layer (133) disposed between the nanostructure layer (131) and the optical component (110), wherein the nanostructure layer (131) is mainly made of aluminum oxide and the nanostructure layer (131) comprises a metallic dopant material (134), wherein the metallic dopant material (134) is distributed at least within each of the rib-like protrusions (132) and the metallic dopant material (134) contains at least one of titanium, vanadium, chromium, titanium oxide, vanadium oxide, and chromium oxide.The imaging lens array module (100) according to claim 1, wherein DO for the shortest distance between the light blocking part (120) and the optical axis (X) satisfies the following condition: 0.01 mm ≤ DO ≤ 6.8 mm.The imaging lens array module (200) according to claim 2, wherein the light blocking part includes: an object-side surface (224) located near the object-side direction of the imaging lens array module (200), an image-side surface corresponding to the object-side surface (224), and a connection surface (226) connecting the object-side surface (224) to the image-side surface, wherein the connection surface (226) is closer to the optical axis (X) than the object-side surface (224) and the image-side surface of the optical axis (X), and the anti-reflection film is coated at least on the connection surface (226).The imaging lens array module (300) according to claim 3, wherein the anti-reflection film (330) is further coated on the object-side surface (324) or the image-side surface (325).The imaging lens array module (100) according to claim 2, wherein the light blocking part (120) comprises: a first end surface (121) inclined relative to the optical axis (X); and a second end surface (122) connected to the first end surface (121), wherein a folding angle (123) is included between the first end surface (121) and the second end surface (122), wherein the folding angle (123) is closer to the optical axis (X) than the first end surface (121) and the second end surface (122) is to the optical axis (X), the anti-reflection film (130) is coated at least on the folding angle (123), and θC for the folding angle (123) satisfies the following condition: 9° < θC < 162°.The imaging lens array module (100) according to claim 5, wherein the anti-reflection film (130) is further coated on the first end surface (121) and the second end surface (122).The imaging lens array module (100) according to claim 1, wherein the at least one intermediate layer (133) is mainly made of silicon dioxide.The imaging lens array module (400) of claim 1, wherein a main component of the at least one intermediate layer (433) is equal to a part of the components of the nanostructure layer (431).The imaging lens array module (100) of claim 1, wherein the metallic dopant material (134) is further dispersed on a surface of each of the rib-like protrusions (132).The imaging lens array module (100) of claim 9, wherein the metallic dopant material (134) distributed within each of the rib-like protrusions (132) tapers away from the optical component (110).The imaging lens array module (100) according to claim 9, wherein TM for the coating thickness of the metallic dopant material (134) on the surface of each of the rib-like protrusions (132) satisfies the following condition: 1 nm ≤ TM ≤ 40 nm.The imaging lens array module (100) according to claim 11, wherein TM for the coating thickness of the metallic dopant material (134) on the surface of each of the rib-like protrusions (132) satisfies the following condition: 1 nm ≤ TM ≤ 30 nm.The imaging lens array module (100) of claim 1, wherein the metallic dopant material (134) is titanium or titanium oxide.The imaging lens array module (400) of claim 1, wherein the anti-reflective film further comprises: a dark layer (435) disposed between the at least one intermediate layer (433) and the optical component (411), which serves to provide the optical component (411) with a dark appearance.An electronic device (80) comprising: the imaging lens array module (100) according to claim 1.

Images