Hot press

The hot press incorporates a thermal insulation layer and limiting element to prevent heat transfer from the heating plate to the circuit board, addressing the issue of shortened lifespan and improving user experience by reducing the need for frequent replacements.

DE202025107798U1Active Publication Date: 2026-03-26SHENZHEN AIDUODUO TECH CO LTD
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2025-12-18
Publication Date
2026-03-26

AI Technical Summary

Technical Problem

The heat generated by the heating plate assembly in existing heat presses is conducted through the air to the control circuitry, leading to a shortened lifespan of the control circuit and frequent replacements, resulting in a poor user experience.

Method used

A hot press design that includes a thermal insulation layer and a limiting element to space the printed circuit board apart from the heating plate assembly, preventing heat transfer via air and reducing high-temperature exposure.

Benefits of technology

The design extends the service life of the printed circuit board, reducing the frequency of hot press replacements and enhancing user experience by minimizing thermal damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

Hot press (10), characterized in that it comprises a housing (100) and a printed circuit board (200), a thermal insulation layer (300) and a heating plate assembly (400) which are provided from top to bottom within the housing (100), wherein the printed circuit board (200) is electrically connected to the heating plate assembly (400), wherein the heating plate assembly (400) is used to generate the heat required for thermal transfer printing, wherein a heating surface of the heating plate assembly (400) is exposed to the housing (100), and that the hot press (10) further comprises a limiting element (500) which is provided between the printed circuit board (200) and the thermal insulation layer (300), such that the printed circuit board (200) and the thermal insulation layer (300) are spaced apart from each other.
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Description

Technical field

[0001] The present invention relates to the technical field of hot pressing equipment, in particular a hot press. State of the art

[0002] The heat press generates heat through the heating plate assembly and, through a specific pressure and time applied by the user, transfers patterns, text, and similar designs onto the transfer paper on the material surface. In current heat press technology, although the heating plate assembly and control circuitry are spaced apart, the heat generated by the heating plate assembly during operation is conducted through the air to the control circuitry. This high temperature environment shortens the lifespan of the control circuitry, requiring frequent replacement of the heat press, resulting in a poor user experience. Content of the invention

[0003] The purpose of the present invention is to provide a hot press to solve the problem that the heat generated by the heating plate assembly during the operation is conducted into the control circuit via the air, that the high temperature environment shortens the service life of the control circuit, that the user has to replace the hot press frequently, and that the user experience is not good.

[0004] To solve the above problem technically, the present invention uses the following technical solutions:

[0005] A hot press comprising a housing and a printed circuit board, a thermal insulation layer and a heating plate assembly arranged from top to bottom within the housing, wherein the printed circuit board is electrically connected to the heating plate assembly, wherein the heating plate assembly is used to generate the heat required for thermal transfer printing, and wherein a heating surface of the heating plate assembly is exposed to the housing.

[0006] The hot press also includes a limiting element that is provided between the circuit board and the thermal insulation layer, so that the circuit board and the thermal insulation layer are spaced apart from each other.

[0007] Furthermore, the circuit board comprises a first control plate and a second control plate, wherein the hot press comprises a push button and a power cable, wherein the push button is electrically connected to the first control plate, wherein the power cable is electrically connected to the second control plate, and wherein the limiting element is connected at opposite ends to the second control plate and to the thermal insulation layer.

[0008] Furthermore, the housing comprises an upper housing and a lower housing, wherein the upper housing comprises a hot press section housing and a handle section housing, wherein the upper housing is provided with a recess space, the recess space being provided between the hot press section housing and the handle section housing, the recess space being used to hold the handle section housing.

[0009] Furthermore, the thermal insulation layer comprises a first thermal insulation layer and a second thermal insulation layer, wherein the first thermal insulation layer is provided between the lower housing and the second control plate, while the second thermal insulation layer is provided between the heating plate assembly and the lower housing.

[0010] Furthermore, the limiting element is a limiting column, wherein the first thermal insulation layer is provided with a plurality of limiting columns at one end facing the second control plate, the limiting columns being abutting the second control plate.

[0011] Furthermore, the distance between the first thermal insulation layer and the second control plate is greater than 5 mm.

[0012] Furthermore, the lower housing is provided with a support element on one side facing the first thermal insulation layer, the support element being used to support the first thermal insulation layer.

[0013] Furthermore, the heating plate assembly comprises a transfer pressure plate and a heating element, wherein the heating element is installed on the transfer pressure plate, wherein the transfer pressure plate is provided with a support column, the support column supporting the second thermal insulation layer.

[0014] Furthermore, the transfer printing plate is provided with a protective housing, wherein the heating element is provided inside the protective housing, the shape of the protective housing being adapted to the shape of the heating element.

[0015] Furthermore, the hot press also includes a base, the base being located at an end of the heating plate assembly facing away from the housing. As can be seen from the solutions above, the present invention has at least the following advantages and beneficial effects:

[0016] The hot press according to the embodiments of the present invention comprises a housing and a printed circuit board, a thermal insulation layer, and a heating plate assembly arranged from top to bottom within the housing. The hot press further comprises a limiting element positioned between the printed circuit board and the thermal insulation layer, thus spacing the two apart. The heat generated by the heating plate assembly during operation cannot be transferred to the printed circuit board via the air, thereby reducing the likelihood of a situation where the service life of the printed circuit board is shortened due to high temperature. This also reduces the frequency of hot press replacements, resulting in a better user experience. Details of the drawings

[0017] In order to better illustrate the technical solutions of the embodiments of the present invention and in the prior art, the attached drawings, which are necessary for the description of the embodiments and the prior art, are briefly described below in terms of the prior art. Fig. Figure 1 shows a schematic representation of the overall structure of a hot press in an embodiment of the present invention; Fig. Figure 2 shows a schematic representation of a cross-sectional structure of the in Fig. 1 hot press shown; Fig. Figure 3 is a schematic representation of an explosion structure of the in Fig. 1 hot press shown; Fig. Figure 4 shows a schematic representation of the structure of a first thermal insulation layer of the Fig. 3 hot presses shown; Fig. Figure 5 shows a schematic representation of the structure of a lower housing of the in Fig. 3 hot presses shown. Reference symbol list: 10 Hot press; 100 cases; 110 upper case; 111 Hot press section housing; 112 Handle section housing; 113 Recess space; 120 lower case; 121 Support element; 200 printed circuit boards; 210 first control plate; 220 second control plate; 300 thermal insulation layer; 310 first thermal insulation layer; 320 second thermal insulation layer; 400 Heating plate assembly; 410 Transfer printing plate; 411 Support column; 412 Protective housing; 420 Heating element; 500 boundary element; 510 Boundary column; 600 push buttons; 700 power cables; 800 base. Specific embodiments

[0018] Typical embodiments that exemplify the features and advantages of the present invention are described in detail below. It should be understood that the present invention permits various variations in different embodiments, none of which are outside the scope of the present invention, and the descriptions and illustrations contained therein serve only to illustrate the invention and are not intended to limit it.

[0019] With reference to Fig. 1. The present invention provides a heat press 10, which is used for the heat transfer of a pattern or text on transfer paper to a material. When the user uses the heat press 10 to process a workpiece, he holds the handle of the heat press 10 firmly and exerts force on the handle, and the pattern or text on the transfer paper is thermally transferred to the material.

[0020] As in Fig. 2 and Fig. As shown in Figure 3, the hot press 10 comprises a housing 100 and a printed circuit board 200, a thermal insulation layer 300 and a heating plate assembly 400, which are provided from top to bottom inside the housing 100, wherein the printed circuit board 200 is electrically connected to the heating plate assembly 400, wherein the heating plate assembly 400 is used to generate the heat required for thermal transfer printing, wherein a heating surface of the heating plate assembly 400 is exposed to the housing 100.

[0021] As in Fig. 3 and Fig. As shown in Figure 4, it should be noted that the hot press 10 further comprises a limiting element 500 which is provided between the circuit board 200 and the thermal insulation layer 300, so that the circuit board 200 and the thermal insulation layer 300 are spaced apart from each other.

[0022] In summary, the present application states that the hot press 10 comprises a housing 100 and a printed circuit board 200, a thermal insulation layer 300, and a heating plate assembly 400, arranged from top to bottom within the housing 100. The hot press 10 further includes a limiting element 500 positioned between the printed circuit board 200 and the thermal insulation layer 300, thus spacing the two apart. The heat generated by the heating plate assembly 400 during operation cannot be transferred to the printed circuit board 200 via the air, thereby reducing the likelihood of the printed circuit board 200's service life being shortened due to high temperatures. This also reduces the need for frequent replacement of the hot press 10, resulting in a positive user experience.

[0023] As in Fig. 2 and Fig. As shown in Figure 3, the circuit board 200 comprises a first control board 210 and a second control board 220. The hot press 10 includes a push button 600 and a power cable 700. The push button 600 is electrically connected to the first control board 210. After the user presses the push button 600, an electrical signal from the push button 600 is transmitted from the first control board 210 to the heating plate assembly 400, and the heating plate assembly 400 starts or stops its operation under the control of the push button 600. The power cable 700 is electrically connected to the second control board 220 and supplies power to the heating plate assembly 400. The limiting element 500 is connected at opposite ends to the second control board 220 and to the thermal insulation layer 300.

[0024] As in Fig. 2 and Fig. As shown in Figure 3, the housing 100 comprises an upper housing 110 and a lower housing 120, wherein the upper housing 110 includes a hot press section housing 111 and a handle section housing 112, the upper housing 110 being provided with a recessed space 113, the recessed space 113 being located between the hot press section housing 111 and the handle section housing 112, the recessed space 113 being used to hold the handle section housing 112. In this way, it is possible to design the housing 100 in an approximately C-shaped form, which makes it easier for a user to hold the handle section housing 112 in their hand to move the hot press 10 for processing.

[0025] As in Fig. 2 and Fig. As shown in Figure 3, the thermal insulation layer 300 comprises a first thermal insulation layer 310 and a second thermal insulation layer 320, wherein the first thermal insulation layer 310 is provided between the lower housing 120 and the second control plate 220, while the second thermal insulation layer 320 is provided between the heating plate assembly 400 and the lower housing 120. Based on the first thermal insulation layer 310, the second thermal insulation layer 320 is provided so that the heat-insulating effect of the first thermal insulation layer 310 further improves the thermal insulation effect of the hot press 10, which effectively prevents the heat generated by the heating plate assembly 400 from being transferred to the circuit board 200, thus preventing the high temperature from burning out the circuit board 200 and preventing the heating plate assembly 400 from scalding the user.It is understood that the second thermal insulation layer 320 cannot be provided either; any solution in which the thermal insulation layer 300 prevents the heat generated by the heating plate assembly 400 from being transferred to the circuit board 200 should be protected.

[0026] As in Fig. 2 and Fig. As shown in Figure 3, it should be noted that in this embodiment, the limiting element 500 is provided as a limiting column 510, wherein the first thermal insulation layer 310 is provided with a plurality of limiting columns 510 at one end facing the second control plate 220, the limiting columns 510 bearing against the second control plate 220. A limiting column 510 is provided, and the limiting column 510 supports the second control plate 220, so that the limiting column 510 effectively prevents the second control plate 220 from approaching the first thermal insulation layer 310 along the vertical direction of the hot press 10, and ensures the distance between the second control plate 220 and the first thermal insulation layer 310. At the same time, the limiting column 510 also ensures the distance between the second control plate 220 and the first thermal insulation layer 310 when the second control plate 220 is installed.It is understood that the limiting column 510 can also be provided in other forms, e.g., two snap grooves are provided in the hot-pressed section housing 111, and the two snap grooves are each installed with the second control plate 220 and the first thermal insulation layer 310, which can effectively ensure the distance between the second control plate 220 and the first thermal insulation layer 310. Any solution in which the distance between the second control plate 220 and the first thermal insulation layer 310 can be ensured should be protected.

[0027] It should be noted that the distance between the first thermal insulation layer 310 and the second control plate 220 is greater than 5 mm.

[0028] As in Fig. As shown in Figure 5, the lower housing 120 is provided with a support element 121 on one side facing the first thermal insulation layer 310, the support element 121 being used to support the first thermal insulation layer 310. The support element 121 can reinforce the first thermal insulation layer 310, which can effectively prevent the first thermal insulation layer 310 from breaking due to the force exerted on it when the user processes the workpiece with the hot press 10. It is understood that the support element 121 may also be omitted.

[0029] As in Fig. 2 and Fig. As shown in Figure 3, the heating plate assembly 400 comprises a transfer pressure plate 410 and a heating element 420, wherein the heating element 420 is installed on the transfer pressure plate 410, the transfer pressure plate 410 being provided with a support column 411, the support column 411 supporting the second thermal insulation layer 320. The support column 411 can reinforce the second thermal insulation layer 320, which can effectively prevent the second thermal insulation layer 320 from breaking due to the force exerted on it when the user processes the workpiece with the hot press 10. It is understood that the support column 411 may also be omitted, and as long as the heating plate assembly 400 is capable of generating heat, it should be protected.

[0030] As in Fig. As shown in Figure 3, the transfer printing plate 410 is provided with a protective housing 412, wherein the heating element 420 is located inside the protective housing 412, the shape of which is adapted to the shape of the heating element 420. The heating element 420 is located within the protective housing 412 and is spaced away from the second thermal insulation layer 320 or other elements, so that the heating element 420 does not directly heat the second thermal insulation layer 320 when in operation. This effectively prevents the second thermal insulation layer 320 or other elements from catching fire and increases safety when using the hot press 10. It is understood that the protective housing 412 cannot be provided without regard to operational safety; any solution in which the heating element 420 can generate energy should be protected.

[0031] As in Fig. 1 and Fig.As shown in Figure 3, the hot press 10 further comprises a base 800, the base 800 being located at an end of the heating plate assembly 400 facing away from the housing 100. The base 800 can effectively reduce the friction between the transfer pressure plate 410 and the support surface and increase the service life of the hot press 10. It is understood that the base 800 may not be provided.

[0032] Although the present invention has been described with reference to several exemplary embodiments, it is to be understood that the above embodiments are not limited to the aforementioned details, but should be interpreted broadly within the spirit and scope of the appended claims, and therefore all variations and adaptations that fall within the scope of the claims or their equivalents should be covered by the appended claims.

[0033] The present invention relates to a hot press comprising a housing and a printed circuit board, a thermal insulation layer, and a heating plate assembly arranged from top to bottom within the housing, wherein the printed circuit board is electrically connected to the heating plate assembly, the heating plate assembly being used to generate the heat required for thermal transfer printing, and wherein a heating surface of the heating plate assembly is exposed to the housing. The hot press further comprises a limiting element provided between the printed circuit board and the thermal insulation layer, such that the printed circuit board and the thermal insulation layer are spaced apart from each other. In the hot press according to the embodiments of the present invention, a limiting element is provided between the printed circuit board and the thermal insulation layer, such that the printed circuit board and the thermal insulation layer are spaced apart from each other.The heat generated by the heating plate assembly during the operation cannot be transferred to the circuit board via the air, thus reducing the occurrence of a situation where the lifespan of the circuit board is shortened due to high temperature, and the user does not have to replace the hot press frequently, resulting in a good user experience.

Claims

[1] Hot press (10), characterized by that it comprises a housing (100) and a printed circuit board (200), a thermal insulation layer (300) and a heating plate assembly (400) arranged from top to bottom within the housing (100), wherein the printed circuit board (200) is electrically connected to the heating plate assembly (400), wherein the heating plate assembly (400) is used to generate the heat required for thermal transfer printing, wherein a heating surface of the heating plate assembly (400) is exposed to the housing (100), that the hot press (10) further comprises a limiting element (500) provided between the printed circuit board (200) and the thermal insulation layer (300), such that the printed circuit board (200) and the thermal insulation layer (300) are spaced apart from each other. [2] Hot press (10) according to claim 1, characterized by, that the circuit board (200) comprises a first control board (210) and a second control board (220), wherein the hot press (10) comprises a push button (600) and a power cable (700), wherein the push button (600) is electrically connected to the first control board (210), wherein the power cable (700) is electrically connected to the second control board (220), and wherein the limiting element (500) is connected at opposite ends to the second control board (220) and to the thermal insulation layer (300). [3] Hot press (10) according to claim 2, characterized by, that the housing (100) comprises an upper housing (110) and a lower housing (120), wherein the upper housing (110) comprises a hot press section housing (111) and a handle section housing (112), wherein the upper housing (110) is provided with a recess space (113), wherein the recess space (113) is provided between the hot press section housing (111) and the handle section housing (112), wherein the recess space (113) is used to hold the handle section housing (112). [4] Hot press (10) according to claim 3, characterized by , that the thermal insulation layer (300) comprises a first thermal insulation layer (310) and a second thermal insulation layer (320), wherein the first thermal insulation layer (310) is provided between the lower housing (120) and the second control plate (220), while the second thermal insulation layer (320) is provided between the heating plate assembly (400) and the lower housing (120). [5] Hot press (10) according to claim 4, characterized by , that the limiting element (500) is a limiting column (510), wherein the first thermal insulation layer (310) is provided with a plurality of limiting columns (510) at one end facing the second control plate (220), the limiting columns (510) being in contact with the second control plate (220). [6] Hot press (10) according to claim 4, characterized by , that the distance between the first thermal insulation layer (310) and the second control plate (220) is greater than 5 mm. [7] Hot press (10) according to claim 4, characterized by , that the lower housing (120) is provided with a support element (121) on one side facing the first thermal insulation layer (310), wherein the support element (121) is used to support the first thermal insulation layer (310). [8] Hot press (10) according to claim 4, characterized by, that the heating plate assembly (400) comprises a transfer pressure plate (410) and a heating element (420), wherein the heating element (420) is installed on the transfer pressure plate (410), wherein the transfer pressure plate (410) is provided with a support column (411), wherein the support column (411) supports the second thermal insulation layer (320). [9] Hot press (10) according to claim 8, characterized by , that the transfer printing plate (410) is provided with a protective housing (412), wherein the heating element (420) is provided inside the protective housing (412), wherein the shape of the protective housing (412) is adapted to the shape of the heating element (420). [10] Hot press (10) according to claim 1, characterized by , that the hot press (10) further comprises a base (800), wherein the base (800) is provided at an end of the heating plate assembly (400) facing away from the housing (100).