Composite heat dissipation mechanism

The compound heat dissipation mechanism addresses the challenge of heat management in powerful processors by utilizing liquid-cooled devices with airflow generators and heat dissipation fins to enhance cooling efficiency through staged heat transfer.

DE202026102240U1Active Publication Date: 2026-06-18COOLER MASTER CO LTD
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
COOLER MASTER CO LTD
Filing Date
2026-04-22
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

The increasing heat generated by powerful processors in electronic devices poses a challenge for effective heat dissipation, impacting device performance and lifespan, necessitating improved cooling solutions.

⚗Method used

A compound heat dissipation mechanism comprising first and second liquid-cooled heat dissipation devices with heat-conducting flow tubes, airflow generators, heat dissipation fins, and cold plates, configured to efficiently transfer and dissipate heat from multiple heat sources through staged convection and conduction.

🎯Benefits of technology

Enhances cooling efficiency by distributing airflow over multiple heat dissipation areas, promoting thermal conductivity and convection, and optimizing heat transfer paths, thereby improving overall heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

A combined heat dissipation mechanism (100) for dissipating heat from heat sources, comprising: a first liquid-cooled heat dissipation device (200), comprising: a first heat-conducting flow tube (230) configured to receive a first cooling fluid, a first fluid drive (210) which is connected to the first heat-conducting flow tube (230) to form a first circulation flow path and which is configured to drive the first cooling fluid to circulate within the first circulation flow path, a first cooling device with: a first airflow generator (250) with a first air outlet and a first heat dissipation fin (240) which is arranged adjacent to the first air outlet of the first airflow generator (250) and configured to be thermally connected to the first heat-conducting flow tube (230), and a first heat exchange device (220) comprising: a first cold plate (224) which is thermally connected to the first heat-conducting flow tube (230) and is configured to be thermally connected to a first heat source, and a second liquid-cooled heat dissipation device (300), comprising: a second heat-conducting flow tube (330) configured to accommodate a second cooling fluid, and a second fluid drive (310) which is connected to the second heat-conducting flow tube (330) to form a second circulation flow path, and which is configured to drive the second cooling fluid to circulate within the second circulation flow path, and a second cooling device with: a second airflow generator (350) with a second air outlet, and a second heat dissipation fin (340) which is arranged adjacent to the second air outlet of the second airflow generator (350) and configured to be thermally connected to the second heat-conducting flow tube (330), and a second heat exchange device (320) with: a second cold plate (324) which is thermally connected to the second heat-conducting flow tube (330) and is configured to be thermally connected to a second heat source.
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