Thermal module, in particular for a device for the production of plastic blister packaging, and a device for the production of blister packaging equipped with this thermal module

Abstract

A heat module (3), in particular for a device for the production of plastic blister packaging, comprising at least one heat radiator (4), characterized in that each heat radiator (4) of the heat module (3) has a thermocouple (5) arranged on the radiating surface of the respective heat radiator (4), wherein the output of the thermocouple (5) is connected to the input of a PID controller (6) and the output of the PID controller (6) is connected to an electronic switch (7) connected to the heat radiator (4), wherein a control unit (8) is connected to the second input of the PID controller (6).