LIGHT SOURCE WITH AT LEAST ONE FIRST LIGHT-EMPLOYING SEMICONDUCTOR ELEMENT, ONE FIRST SUPPORT ELEMENT AND ONE DISPENSING ELEMENT

Description

[0001] The present invention relates to a light source comprising components superimposed on each other in this order. a) at least one first light-emitting semiconductor device; b) a first support element comprising i) a first support surface facing the at least one first light-emitting semiconductor device, and ii) additionally a first cooling surface; and c) a distribution element comprising i) a first cavity, and ii) a further cavity; wherein the first cavity and the further cavity are fluid-conductingly connected to each other by means of a first fluid path; wherein the first fluid path is at least partially bounded by the first cooling surface; wherein the first support surface and the first cooling surface are opposing outer surfaces of the first support element; wherein the distributor element extends longitudinally in a longitudinal direction; wherein the first cavity a] includes a first channel extending longitudinally, and b] additionally includes a second channel extending longitudinally from the first channel towards the first support element, wherein the first channel and the second channel of the first cavity are fluid-conductingly connected to each other, wherein the diameter of the first channel of the first cavity is greater than the diameter of the second channel of the first cavity; wherein the further cavity a} includes a first channel extending longitudinally, and b} additionally includes a second channel extending longitudinally from the first channel in the direction of the first support element, wherein the first channel and the second channel of the further cavity are fluidly connected to each other, wherein the diameter of the first channel of the further cavity is greater than the diameter of the second channel of the further cavity. The invention further relates to a printing press; a method, in particular for producing a printed product, for irradiating a substrate, and for producing a light source; an arrangement with the light source according to the invention; and uses of the light source according to the invention.

[0002] In the technical field of the invention—the printing industry—the use of light sources for curing printing inks and varnishes has long been known. Furthermore, the use of UV-curable inks and varnishes—that is, inks and varnishes that can be cured by irradiation with suitable ultraviolet radiation—is also known. Traditionally, mercury vapor lamps are used to cure such inks and varnishes. However, these light sources exhibit significant disadvantages, for example, with regard to their lifespan, maintenance requirements, and heat generation. This was already recognized in the prior art. Consequently, light-emitting semiconductor devices, in particular light-emitting diode modules (LED modules), are increasingly being used instead of mercury vapor lamps for irradiating UV-curable inks and varnishes.Although the use of LEDs already offers many advantages over the familiar mercury vapor lamps, there is still room for improvement in the design of LED light sources, particularly, but not exclusively, UV LEDs. For example, high-performance LEDs are frequently used in the printing industry. Despite their significantly higher efficiency compared to vapor lamps, LEDs generate waste heat that must be dissipated. If this dissipation is insufficient, the efficiency of the LEDs decreases considerably. Furthermore, the lifespan of the LEDs can be shortened. Therefore, inadequate cooling of LEDs negates key advantages of LEDs over vapor lamps. This must be prevented not only for individual LEDs, but for as many LEDs as possible within a light source.To achieve this, all LEDs in a light source, which can be on the order of meters in length, must be cooled as homogeneously as possible. Various methods are known in the prior art to approach this goal.

[0003] WO 2017 / 008042 A1 describes a light-emitting diode (LED) module that includes a carrier formed by strands, on which the module's LED packages—i.e., the LED chips themselves—are mounted on a substrate. The carrier has an internal passage through which a cooling fluid can flow to cool the LEDs. Since cooling in such a design is not very efficient, a powerful, and therefore costly and energy-intensive, cooling circuit must be used to compensate.

[0004] To increase cooling efficiency, prior art also reveals carriers for LED modules that, instead of simply having a single passage, feature a very fine cooling structure consisting of numerous interconnected micro- and macrochannels. Such carriers are often constructed from multiple copper layers that must be tightly bonded during manufacturing. This specialized manufacturing process is very complex and correspondingly expensive. Furthermore, the wall thickness of such carriers is quite thin. This makes the delicate cooling structure mechanically weak, so pressure spikes in the cooling circuit can lead to damage. Even mounting the LED onto the carrier can damage it. Additionally, the specialized and complex manufacturing process results in production tolerances that are too large for some applications.

[0005] US 2011 / 037390 A1 teaches a lighting device for providing light with mixtures of different color temperatures and intensities. The device includes a housing containing: a multi-chip LED for emitting mixtures of color temperatures and light intensities, with a plurality of blocks of LEDs, each having a predetermined color temperature, wherein the multi-chip LED is mounted on a printed circuit board (PCB); a cooling system attached to the back of the PCB, wherein the cooling system uses a liquid coolant to dissipate the heat generated by the multi-chip LED; and a control system electrically connected to the PCB of each block and to the cooling system, wherein the control system is capable of powering the multi-chip LED and selecting the blocks of LEDs to obtain the color temperature and light intensity to achieve the mixtures.

[0006] JP 2005 079065 A relates to a light source device capable of cooling a solid-state light source with high efficiency, even when a large amount of heat is generated by the solid-state light source in a small heat-generating area. The light source device comprises a solid-state light source and a base material on which the solid-state light source is mounted. The base material is provided on a surface of the solid-state light source that faces a mounting surface. The surface is uneven.

[0007] Furthermore, US 2009 / 039380 A1 teaches an LED package comprising a base substrate, which is a metal plate electrically connected to one electrode of a UV LED, and a cover substrate, which is a metal plate electrically connected to the other electrode and stacked on the base substrate. A plurality of LED packages are mounted on a header such that the centerlines of the base substrates, extending in their width direction, are aligned with each other.

[0008] German patent application DE 10 2006 016529 A1 discloses a liquid-cooled semiconductor radiation source with high output power and the most effective possible protection against damage or even destruction of the radiation source due to reduced cooling capacity. Here, a temperature sensor is in direct contact with a coolant and is therefore able to detect temperature changes with minimal delay. The temperature sensor is heated, and a change in its temperature is a measure of the flow rate of the coolant.

[0009] In general, it is an object of the present invention to overcome, at least partially, a disadvantage arising from the prior art.

[0010] A further object of the invention is to provide a light source for a printing press, wherein the light source enables the spatially homogeneous curing of a printing ink or varnish over the largest possible area by irradiation with light from light-emitting semiconductor devices, in particular light-emitting diodes. According to a further object, the aforementioned curing can occur as quickly as possible. According to a further object of the invention, the light source according to the invention enables the aforementioned curing using the least complex cooling system possible, preferably a cooling circuit with the lowest possible pressure. A further object of the invention is to provide a light source for a printing press, wherein the light source can be adapted as flexibly as possible to the ink or varnish to be cured with the least possible effort.Furthermore, it is an object of the invention to provide a light source for curing ink or varnish in a printing press that is as easy to maintain or retrofit as possible, or both. It is also an object of the invention to provide one of the aforementioned advantageous light sources, which is additionally as mechanically stable as possible. This applies in particular to a heat sink for the light source. Preferably, this light source is also as resistant as possible to damage during its manufacture, especially when mounting light-emitting semiconductor components on a heat sink, for example, by a joining process such as soldering, gluing, or sintering. Furthermore, the light source according to the invention preferably exhibits the lowest possible tendency to damage under high pressures in a cooling circuit or under pressure peaks in the cooling circuit for cooling the light-emitting semiconductor components of the light source.A further object of the invention is to provide a light source for a printing press, wherein the light source is as simple and cost-effective to manufacture as possible. Preferably, the light source, in particular a heat sink of the light source, is to be manufactured as far as possible using conventional tools, such as a CNC milling machine. Furthermore, it is an object of the invention to provide one of the aforementioned advantageous light sources, wherein this light source is additionally manufacturable with the smallest possible manufacturing tolerances. A further object of the invention is to provide one of the aforementioned advantageous light sources, wherein the mounting of the light-emitting semiconductor component onto a heat sink, in particular by soldering or sintering, is as simple as possible in the manufacture of the light source.A further object of the invention is to provide a light source for a printing press, wherein as many components of the light source as possible are reusable, and in particular recyclable. All of the aforementioned advantageous light sources are preferably semiconductor light sources.

[0011] Furthermore, it is an object of the invention to provide a printing press incorporating one of the advantageous light sources described above. Accordingly, this printing press preferably exhibits one or more of the advantages described above for the light source.

[0012] Furthermore, it is an object of the invention to provide a method for manufacturing a light source for a printing press, which is characterized by an advantageous combination of short manufacturing time, high process stability, low tool wear and simple mechanical processing of materials used for a heat sink, preferably copper or aluminum.

[0013] The independent claims contribute to at least partially fulfilling at least one, preferably several, of the above problems. The dependent claims provide preferred embodiments that contribute to at least partially fulfilling at least one of the problems.

[0014] An embodiment 1 of a light source 1, comprising components superimposed on each other in this sequence, contributes to fulfilling at least one of the tasks according to the invention. a) at least one first light-emitting semiconductor device; b) a first support element comprising i) a first support surface facing the at least one first light-emitting semiconductor device, and ii) additionally a first cooling surface; and c) a distribution element comprising i) a first cavity, and ii) a further cavity; wherein the first cavity and the further cavity are fluid-conductingly connected to each other by means of a first fluid path; wherein the first fluid path is at least partially bounded by the first cooling surface; wherein the first support surface and the first cooling surface are opposing outer surfaces of the first support element; wherein the distributor element extends longitudinally in a longitudinal direction; wherein the first cavity a] includes a first channel extending longitudinally, and b] additionally includes a second channel extending longitudinally from the first channel towards the first support element, wherein the first channel and the second channel of the first cavity are fluid-conductingly connected to each other, wherein the diameter of the first channel of the first cavity is greater than the diameter of the second channel of the first cavity; wherein the further cavity a} includes a first channel extending longitudinally, and b} additionally includes a second channel extending longitudinally from the first channel in the direction of the first support element, The first channel and the second channel of the further cavity are fluid-conductingly connected, with the diameter of the first channel of the further cavity being greater than the diameter of the second channel of the further cavity. The first fluid path is precisely the fluid path that directly connects the first cavity to the further cavity in a fluid-conducting manner. The first fluid path does not exclusively include the shortest connection. The first fluid path is not limited to the path between the first and the second cavity, but rather to all paths that are in the same direction, i.e., those leading from the first cavity but not away from the second cavity. Here, the first fluid path is at least partially limited by the first cooling surface insofar as at least a portion of the first fluid path is bounded by at least a portion of the first cooling surface. Therefore, the first cooling surface can also contain one or more parts that do not limit the first fluid path.

[0015] In an embodiment 2 according to the invention, the light source 1 is configured according to its embodiment 1, wherein the first support element is detachably connected to the distribution element, preferably by means of at least one fastening element. A detachable connection exists between two elements if one of the two elements is directly or indirectly firmly, preferably rigidly, connected to the other of the two elements, and this connection can be released without damaging or destroying either element and, in the case of an indirect connection, preferably also without damaging or destroying an intervening element. A screw is a preferred fastening element in this context.

[0016] In an embodiment 3 according to the invention, the light source 1 is configured according to its embodiment 1 or 2, wherein the cooling surface is at least partially a surface of a cooling structure of the first support element.

[0017] In an embodiment 4 according to the invention, the light source 1 is designed according to its embodiment 3, wherein the cooling structure includes a plurality of cooling fins, preferably formed therefrom.

[0018] In one embodiment 5 of the invention, the light source 1 is configured according to embodiment 4, wherein at least a portion of the cooling fins of the plurality of cooling fins are in contact with the distribution element. Preferably, each of the cooling fins of the plurality of cooling fins is in contact with the distribution element.

[0019] In an embodiment 6 according to the invention, the light source 1 is designed according to embodiment 4 or 5, wherein the plurality of cooling fins consists of 3 to 30 cooling fins, preferably 5 to 25 cooling fins, more preferably 10 to 20 cooling fins.

[0020] In one embodiment 7 of the invention, the light source 1 is configured according to one of its embodiments 4 to 6, wherein at least a portion of the cooling fins of the plurality of cooling fins extends longitudinally along the first fluid path. Preferably, the cooling fins of the plurality of cooling fins extend longitudinally along the first fluid path. Preferably, the cooling fins of the plurality of cooling fins are plane-parallel to each other.

[0021] In an embodiment 8 according to the invention, the light source 1 is designed according to one of its embodiments 4 to 7, wherein the cooling fins of the plurality of cooling fins each have a thickness in a range of 0.2 to 2 mm, preferably 0.3 to 1.5 mm, more preferably 0.4 to 1.2 mm, most preferably 0.5 to 1.0 mm.

[0022] In an embodiment 9 according to the invention, the light source 1 is configured according to one of its embodiments 4 to 8, wherein each pair of adjacent cooling fins of the plurality of cooling fins has a distance in a range of 0.2 to 2 mm, preferably 0.3 to 1.5 mm, more preferably 0.5 to 1.2 mm.

[0023] In one embodiment 10 of the invention, the light source 1 is configured according to one of its embodiments 4 to 9, wherein the first fluid path comprises a plurality of channels passing between each pair of adjacent cooling fins of the plurality of cooling fins. These channels preferably each have a width equal to the distance between two adjacent cooling fins. The plurality of channels passing between each pair of adjacent cooling fins of the plurality of cooling fins preferably consists of 4 to 31, more preferably 6 to 26, and most preferably 11 to 21, channels. The channels of the plurality of channels passing between each pair of adjacent cooling fins of the plurality of cooling fins are preferably extended longitudinally in a transverse direction perpendicular to the longitudinal direction.Preferably, the channels of the plurality of channels passing between each pair of adjacent cooling fins of the plurality of cooling fins run parallel to each other. The channels passing between each pair of adjacent cooling fins of the plurality of cooling fins preferably have a depth that is at least 3 times, more preferably at least 4 times, and most preferably at least 5 times as large as their width.

[0024] In one embodiment 11 of the invention, the light source 1 is configured according to one of its embodiments 4 to 10, wherein the cooling fins of the plurality of cooling fins each comprise a first section and at least one further section, wherein the first sections of the cooling fins are located in the first fluid path, and the further sections of the cooling fins are not located in the first fluid path. The further sections preferably contribute to the best possible distribution of a cooling fluid, which enables the most homogeneous cooling possible of the first support element. In this context, there may be an interruption in the cooling fin or a region of reduced cooling fin height between the first section and the at least one further section of a cooling fin.Preferably, the first section of a cooling fin and at least one further section of the same cooling fin are arranged side by side in a direction perpendicular to the height and thickness of the cooling fin. This direction is preferably a longitudinal extension of the cooling fin. Particularly preferably, the cooling fins of the plurality of cooling fins each comprise a first section and at least two, more preferably exactly two, further sections. Here, in the direction perpendicular to the height and thickness of a cooling fin, a further section of this cooling fin, the first section, and a further section of the cooling fin preferably follow one another. Preferably, the first fluid path runs section by section between each further section of a cooling fin and its first section.

[0025] In an embodiment 12 according to the invention, the light source 1 is designed according to its embodiment 11, wherein the cooling fins in their at least one further section have a decreasing height in a direction perpendicular to the thicknesses and heights of the cooling fins, which is directed away from the first sections.

[0026] In one embodiment 13 of the invention, the light source 1 is configured according to one of its embodiments 3 to 12, wherein the first fluid path in the direction from the first cavity to the further cavity after the first cavity and in front of at least a part of the cooling structure, preferably in front of the cooling structure, includes a distribution chamber, wherein the distribution chamber is arranged and configured to distribute a cooling fluid flowing along the first fluid path onto the cooling structure. For this purpose, the distribution chamber connects the first cavity preferably fluid-conductingly to a plurality of inlets of the cooling structure in the direction from the first cavity to the further cavity. If the cooling structure includes the plurality of cooling fins, the distribution chamber preferably connects the first cavity fluid-conductingly to the channels leading between each pair of adjacent cooling fins of the plurality of cooling fins.

[0027] In one embodiment 14 of the invention, the light source 1 is configured according to one of its embodiments 3 to 13, wherein the first fluid path in the direction from the first cavity to the further cavity includes a collection chamber downstream of at least a portion of the cooling structure, preferably downstream of the cooling structure, and upstream of the further cavity, wherein the collection chamber is arranged and configured to direct a cooling fluid flowing along the first fluid path through at least a portion of the cooling structure into the further cavity. For this purpose, the collection chamber preferably connects a plurality of outlets of the cooling structure to the further cavity in a fluid-conducting manner in the direction from the first cavity to the further cavity. If the cooling structure includes the plurality of cooling fins, the collection chamber preferably connects the channels leading between each pair of adjacent cooling fins of the plurality of cooling fins to the further cavity in a fluid-conducting manner.Preferably, the first fluid path in the direction from the first cavity to the next cavity consists of the distribution chamber, the channels running between each pair of adjacent cooling fins of the plurality of cooling fins, and the collection chamber. Additionally, channels running between the outermost cooling fins of the plurality of cooling fins and an edge of the first support element can also be part of the first fluid path.

[0028] In an embodiment 15 according to the invention, the light source 1 is designed according to one of its embodiments 3 to 14, wherein the cooling structure is located at least partially in the first fluid path.

[0029] In one embodiment 16 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the first fluid path is additionally limited, at least partially, by a surface of the distributor element facing the first support element. Preferably, the first fluid path is limited over its entire extent between the first cavity and the further cavity by the cooling surface and preferably additionally by the surface of the distributor element facing the first support element.

[0030] In an embodiment 17 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the first support element along the first fluid path has a minimum thickness in a range of 0.5 to 5 mm, preferably 0.5 to 3 mm, more preferably 0.5 to 2 mm, more preferably 0.5 to 1.5 mm, most preferably 0.7 to 1.3 mm.

[0031] In one embodiment 18 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein each first light-emitting semiconductor device comprises a substrate and at least one semiconductor chip superimposed on the substrate on a side facing away from the first support element. Preferably, each first light-emitting semiconductor device additionally comprises at least one optic superimposed on the at least one semiconductor chip on a side facing away from the substrate. In the case of an LED as the light-emitting semiconductor device, the above structure, comprising the substrate and the semiconductor chip and, optionally, one or more optics, is also referred to in the technical field as a Package designated. PackageLEDs and LEDs are often used synonymously. In the case of the chip-on-board technology, which is also relevant to the invention, several semiconductor chips are arranged on a common substrate. In this case, the Package that is, several semiconductor chips. Generally speaking, a Package It also contains other elements such as electrical contacts, protective circuits and heat dissipation elements.

[0032] In one embodiment 19 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the at least one first light-emitting semiconductor device is at least one first light-emitting diode. A preferred first light-emitting diode is one of the packages described above.

[0033] In an embodiment 20 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the first cavity is arranged and designed as an inlet for a cooling medium, and wherein the further cavity is arranged and designed as a return for the cooling medium.

[0034] In one embodiment 21 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the at least one first light-emitting semiconductor device is connected to the substrate surface. Preferably, the at least one first light-emitting semiconductor device is selected from the group consisting of components that are bonded to the substrate surface, soldered to the substrate surface, and sintered to the substrate surface, or a combination of at least two of these. Preferably, the substrate of the at least one first light-emitting semiconductor device is connected to the substrate surface, preferably in one of the aforementioned ways.

[0035] In an embodiment 22 according to the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the light source includes at least one further support element, wherein each further support element a. the distributor element is superimposed, b. has another support surface, c. additionally has another cooling surface, and d. is superimposed on its support surface by at least one other light-emitting semiconductor device, wherein the first cavity and the further cavity of each further support element are fluidly connected to each other by means of a further fluid path, wherein the respective further fluid path is at least partially limited by the further cooling surface of the respective further support element.

[0036] In an embodiment 23 according to the invention, the light source 1 is configured according to embodiment 22, wherein the light source 5 to 150, preferably 10 to 150, more preferably 15 to 120, more preferably 15 to 100, most preferably 15 to 75, includes further support elements. The sum of the first support element and the further support elements of the light source is particularly preferably an integer multiple of 2. This particularly facilitates the control of a cooling system for the light source.

[0037] In an embodiment 24 according to the invention, the light source 1 is designed according to its embodiment 22 or 23, wherein each further support element is detachably connected to the distributor element, preferably by means of at least one fastening means.

[0038] In one embodiment 25 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the first support element has a width in the range of 5 to 100 mm, preferably 10 to 50 mm, more preferably 15 to 40 mm, even more preferably 20 to 35 mm, and most preferably 20 to 30 mm. Preferably, each further support element also has the aforementioned width in the range of 5 to 100 mm, preferably 10 to 50 mm, more preferably 15 to 40 mm, even more preferably 20 to 35 mm, and most preferably 20 to 30 mm. Often, the support elements are about one inch, i.e., about 25.4 mm, wide. The width of a support element is greater than its thickness and less than its length. Preferably, the width of a support element in the light source extends in the longitudinal direction.

[0039] In an embodiment 26 according to the invention, the light source 1 is configured according to one of its embodiments 22 to 25, wherein the at least one further light-emitting semiconductor component is at least one further light-emitting diode.

[0040] In an embodiment 27 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the distribution element has a length in the longitudinal direction in a range of 100 to 3000 mm, preferably 200 to 3000 mm, more preferably 300 to 3000 mm, even more preferably 400 to 3000 mm, most preferably 400 to 2000 mm.

[0041] In an embodiment 28 according to the invention, the light source 1 is designed according to its embodiment 27, wherein the first support element and the at least one further support element are arranged one after the other in the longitudinal direction.

[0042] In one embodiment 29 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the first cavity includes two second channels, each extending longitudinally from the first channel towards the first support element. Preferably, the second channels of the first cavity extend in the same direction, preferably parallel to each other. Preferably, each second channel of the first cavity has a diameter in the range of 0.5 to 5 mm, more preferably 0.7 to 3 mm, more preferably 0.8 to 2 mm, even more preferably 1 to 1.8 mm, and most preferably 1.1 to 1.5 mm.

[0043] In an embodiment 30 according to the invention, the light source 1 is configured according to its embodiment 29, wherein no cross-sectional area of ​​the first channel of the first cavity is less than a sum of each of the cross-sectional areas of every second channel of the first cavity.

[0044] In one embodiment 31 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the further cavity includes two second channels, each extending longitudinally from the first channel towards the first support element. Preferably, the second channels of the further cavity extend in the same direction, preferably parallel to each other. More preferably, the second channels of the first and the further cavity extend in the same direction, preferably parallel to each other. Preferably, each second channel of the further cavity has a diameter in the range of 0.5 to 5 mm, more preferably 0.7 to 3 mm, more preferably 0.8 to 2 mm, even more preferably 1 to 1.8 mm, and most preferably 1.1 to 1.5 mm.

[0045] In an embodiment 32 according to the invention, the light source 1 is configured according to its embodiment 31, wherein no cross-sectional area of ​​the first channel of the further cavity is less than a sum of each cross-sectional area of ​​every second channel of the further cavity.

[0046] In an embodiment 33 according to the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distributor element is limited in the longitudinal direction by a first end face and a further end face opposite the first end face, wherein the first cavity or the further cavity or both extend longitudinally from the first end face to the further end face.

[0047] In one embodiment 34 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the first cavity additionally includes at least one third channel for each further support element, which extends longitudinally from the first channel of the first cavity towards the respective further support element, wherein the first channel and each third channel of the first cavity are fluidly connected to one another, and wherein the diameter of the first channel of the first cavity is greater than the diameter of each third channel of the first cavity. Preferably, the first cavity additionally includes two third channels for each further support element, each extending longitudinally from the first channel of the first cavity towards the respective further support element. Preferably, the third channels of the first cavity extend in the same direction, preferably parallel to each other.

[0048] In one embodiment 35 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the further cavity additionally includes at least one third channel for each further support element, which extends longitudinally from the first channel of the further cavity towards the respective further support element, wherein the first channel and each third channel of the further cavity are fluidly connected to one another, and wherein the diameter of the first channel of the further cavity is greater than the diameter of each third channel of the further cavity. Preferably, the further cavity additionally includes two third channels for each further support element, each extending longitudinally from the first channel of the further cavity towards the respective further support element. Preferably, the third channels of the further cavity extend in the same direction, preferably parallel to each other.Furthermore, the third channels of the first and the further cavity preferably run in the same direction, preferably parallel to each other.

[0049] In one embodiment 36 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distribution element is formed in one piece. An element is formed in one piece if it is manufactured in one piece, preferably from a shapeless material, without subsequent joining of different components. Accordingly, the distribution element preferably does not include any joining point, such as a seam, weld, solder joint, or adhesive joint. The distribution element is preferably produced in one piece by extrusion and optional downstream subtractive processing steps, such as drilling.

[0050] In one embodiment 37 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distribution element is designed as a housing of the light source. Here, a housing is a component of the light source that accommodates the other components of the light source and essentially, that is, apart from any windows, openings, and connections, forms an outer surface of the light source that protects internal components from environmental influences such as dust and mechanical stresses.

[0051] In one embodiment 38 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distributor element has no internal cooling structure. In particular, the distributor element has no macroscopic or microscopic channels in its interior that serve to increase the surface area of ​​the distributor element for heat transfer to a cooling fluid. Here, the first cavity and the subsequent cavity do not serve to increase the surface area as described above, but rather as directed inlet and outlet for a cooling fluid. This is particularly evident from the absence of multiple branching channels that would represent ineffective detours for an inlet or outlet. Furthermore, preferably, the distributor element does not have a cooling structure on any external surface, either alternatively or additionally.

[0052] In one embodiment 39 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distribution element comprises, and preferably consists of, an electrically conductive material. A preferred electrically conductive material is a metal. A preferred metal is one selected from the group consisting of aluminum, copper, gold, nickel, and steel, or a combination of at least two of these. Preferably, the distribution element consists of aluminum.

[0053] In an embodiment 40 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the first support element includes an electrically conductive material, preferably consisting of it.

[0054] In an embodiment 41 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the first support element in the direction from the support surface to the cooling surface as superimposed layers of a layer sequence I) a first coating, and II) a base body includes, wherein the first coating forms at least part, preferably the entire, substrate surface.

[0055] In an embodiment 42 according to the invention, the light source 1 is designed according to its embodiment 41, wherein the first coating contains gold, preferably consists of it.

[0056] In an embodiment 43 according to the invention, the light source 1 is configured according to its embodiment 41 or 42, wherein the first coating has a thickness in a range of 0.01 to 1 µm, preferably 0.01 to 0.5 µm, more preferably 0.01 to 0.3 µm, most preferably 0.02 to 0.2 µm.

[0057] In an embodiment 44 according to the invention, the light source 1 is configured according to one of its embodiments 41 to 43, wherein the base body comprises a selected material from the group consisting of aluminium, copper, and steel, or a combination of at least two thereof, preferably consisting of, with copper being particularly preferred.

[0058] In an embodiment 45 according to the invention, the light source 1 is designed according to one of its embodiments 41 to 44, wherein the first support element includes a second coating between the first coating and the base body.

[0059] In an embodiment 46 according to the invention, the light source 1 is designed according to its embodiment 45, wherein the second coating includes nickel, preferably consists of it.

[0060] In an embodiment 47 according to the invention, the light source 1 is configured according to its embodiment 45 or 46, wherein the further coating has a thickness in a range of 1 to 50 µm, preferably 1 to 40 µm, more preferably 1 to 30 µm, more preferably 1 to 20 µm, more preferably 1 to 10 µm, more preferably 2 to 8 µm, most preferably 3 to 7 µm.

[0061] In an embodiment 48 according to the invention, the light source 1 is designed according to one of its embodiments 45 to 47, wherein the first support element includes a third coating between the first coating and the second coating.

[0062] In an embodiment 49 according to the invention, the light source 1 is designed according to its embodiment 48, wherein the third coating includes palladium, preferably consists of it.

[0063] In one embodiment 50 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the distribution element further includes a holder which is arranged and configured to hold an emission window. Here, the distribution element is preferably also configured as the housing of the light source.

[0064] In an embodiment 51 according to the invention, the light source 1 is configured according to its embodiment 50, wherein the emission window is superimposed on the at least one first light-emitting semiconductor component on a side of the at least one first light-emitting semiconductor component facing away from the first support element.

[0065] In an embodiment 52 according to the invention, the light source 1 is designed according to its embodiment 50 or 51, wherein the light source includes the emission window.

[0066] In one embodiment 53 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the light source additionally includes a first sealing element, the first sealing element being arranged and configured to provide a fluid-tight seal for the first fluid path. Preferably, the first sealing element is arranged at least partially between the first support element and the distributor element. More preferably, the first sealing element contacts the first support element and the distributor element. More preferably, the first sealing element connects the first support element and the distributor element in a fluid-tight manner. Preferably, the first sealing element is received in a groove in the distributor element. A preferred first sealing element is configured as an O-ring, wherein this O-ring preferably has a rectangular shape instead of a circular one.

[0067] In one embodiment 54 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the at least one first light-emitting semiconductor device is arranged and configured to emit light in a UV wavelength range or an IR wavelength range, or both. A preferred UV wavelength range is selected from the group consisting of a UV-A wavelength range, a UV-B wavelength range, and a UV-C wavelength range, or from a combination of at least two of these.

[0068] In an embodiment 55 according to the invention, the light source 1 is designed according to one of its preceding embodiments, wherein the light source preferably includes an LED module.

[0069] In one embodiment 56 of the invention, the light source 1 is configured according to one of its preceding embodiments, wherein the light source includes a ballast. A preferred ballast is an electronic ballast. A preferred electronic ballast is an LED driver.

[0070] An embodiment 1 of a method 1 for producing a light source, comprising the method as process steps, contributes to fulfilling at least one of the tasks according to the invention. A} Providing a) at least one first light-emitting semiconductor device, b) a first support element comprising i) a first support surface, and ii) additionally a first cooling surface, and c) a distribution element comprising i) a first cavity, and ii) a further cavity; and B} Detachably connecting the first support element, preferably by means of at least one fastening means, to the distribution element, such that the first cavity and the further cavity are fluidly connected to each other by means of a first fluid path; wherein the at least one first light-emitting semiconductor device superimposes the first support element on one side of the first support surface; wherein the first fluid path is at least partially bounded by the first cooling surface; wherein the first support surface and the first cooling surface are opposing outer surfaces of the first support element; wherein the distributor element extends longitudinally in a longitudinal direction; wherein the first cavity a] includes a first channel extending longitudinally, and b] additionally includes a second channel extending longitudinally from the first channel towards the first support element, wherein the first channel and the second channel of the first cavity are fluid-conductingly connected to each other, wherein the diameter of the first channel of the first cavity is greater than the diameter of the second channel of the first cavity; wherein the further cavity a} includes a first channel extending longitudinally, and b} additionally includes a second channel extending longitudinally from the first channel in the direction of the first support element, wherein the first channel and the second channel of the further cavity are fluidly connected to each other, wherein the diameter of the first channel of the further cavity is greater than the diameter of the second channel of the further cavity. The detachable connection in process step B} preferably includes, more preferably, a screw connection. Furthermore preferably, in process step B}, a first sealing element is arranged at least partially between the first support element and the distributor element. Components and elements used in process 1 are preferably identical or corresponding components or elements of the light source m1 according to the invention. one of its embodiments. Preferably, method 1 is a method for producing the light source 1 according to the invention in one of its embodiments.

[0071] In an embodiment 2 of the invention, the method 1 is configured according to its embodiment 1, wherein the first cooling surface is at least partially a surface of a cooling structure of the first support element, wherein in method step A}, providing the first support element includes generating the cooling structure by means of a disc cutter. Preferably, the generation includes milling cooling fins by means of a disc cutter. The disc cutter preferably comprises a plurality of disc-shaped milling blades. Preferably, the disc cutter comprises 4 to 31, more preferably 6 to 26, and most preferably 11 to 21, disc-shaped milling blades. Particularly preferably, the disc cutter comprises one disc-shaped milling blade for each channel passing between any two adjacent cooling fins of a plurality of cooling fins of the cooling structure, and more preferably, two further disc-shaped milling blades.

[0072] In an embodiment 3 according to the invention, the method 1 is configured according to its embodiment 1 or 2, wherein in the method step A} at least one further light-emitting semiconductor device and at least one further support element are provided, wherein each further support element a. has another support surface, b. has an additional cooling surface, and c. is superimposed on its additional support surface with at least one further light-emitting semiconductor device, the procedure continues by one procedural step C} Detachable connection of the at least one further support element, preferably by means of at least one fastening means, to the distributor element, so that the first cavity and the further cavity of each further support element are fluidly connected to each other by means of a further fluid path, wherein the respective further fluid path is at least partially limited by the further cooling surface of the respective further support element.

[0073] Furthermore, an embodiment 1 of a light source 2, obtainable by method 1 according to one of its embodiments, is disclosed. The light source 2 is preferably designed like the light source 1 according to one of its embodiments, particularly preferably according to embodiment 11 or 12.

[0074] An embodiment 1 of a printing press, comprising the light source 1 according to one of its preceding embodiments, contributes to fulfilling at least one of the problems according to the invention. Any type of printing press suitable for using the light source 1 according to the invention is suitable as a printing press according to the invention. A preferred printing press is designed to carry out the method 2 according to one of its embodiments.

[0075] In an embodiment 2 according to the invention, the printing machine is designed according to its embodiment 1, wherein the light source in the printing machine is arranged and designed to irradiate a composition printed on a printing substrate.

[0076] In an embodiment 3 according to the invention, the printing machine is designed according to its embodiment 2, wherein the composition is a printing ink or a varnish or both.

[0077] In one embodiment 4 of the invention, the printing machine is configured according to one of its embodiments 1 to 3, wherein the printing machine is a printing machine without image storage. A preferred printing machine without image storage is designed for non-impact printing (NIP). A preferred printing machine without image storage is an inkjet printer or a laser printer or both.

[0078] In one embodiment 5 of the invention, the printing machine is configured according to one of its embodiments 1 to 3, wherein the printing machine includes a print image storage device. A preferred print image storage device is a printing roller or a printing plate.

[0079] In one embodiment 6 of the invention, the printing press is configured according to embodiment 5, wherein the printing press is arranged and configured for indirect printing by means of the print image storage. A preferred printing press for indirect printing is an offset printing press. A preferred offset printing press is a sheet-fed offset printing press.

[0080] An embodiment 1 of a method 2, comprising as method steps, contributes to the fulfillment of at least one of the tasks according to the invention. A) Providing I) the light source 1 according to one of its embodiments, and II) an object; B) superimposing the object with a composition; and C) irradiating the composition with light emitted by the at least one first light-emitting semiconductor device.

[0081] In an embodiment 2 according to the invention, the method 2 is designed according to its embodiment 1, wherein the composition is liquid in process step B), preferably also in process step C).

[0082] In an embodiment 3 according to the invention, the method 2 is configured according to its embodiment 1 or 2, wherein the composition in process step B) includes at least one colorant, preferably in a proportion in the range of 0.5 to 20 wt.%, more preferably in 1 to 15 wt.%, more preferably in 2 to 10 wt.%, most preferably in 3 to 8 wt.%, in each case based on the composition in process step B).

[0083] In an embodiment 4 according to the invention, the method 2 is configured according to one of its embodiments 1 to 3, wherein the composition in process step B) includes a vehicle, preferably to a proportion in a range of 10 to 95 wt.%, more preferably 20 to 95 wt.%, more preferably 30 to 95 wt.%, most preferably 40 to 90 wt.%, in each case based on the composition in process step B).

[0084] In an embodiment 5 according to the invention, the method 2 is configured according to one of its embodiments 1 to 4, wherein the composition in the process step B) includes a photoinitiator, preferably in a proportion in a range of 1 to 30 wt.%, more preferably 2 to 25 wt.%, more preferably 3 to 20 wt.%, most preferably 5 to 15 wt.%, in each case based on the composition in the process step B).

[0085] In an embodiment 6 according to the invention, the method 2 is configured according to one of its embodiments 1 to 5, wherein the composition in process step B) includes at least one monomer, preferably in a proportion in the range of 10 to 95 wt.%, more preferably in the range of 20 to 95 wt.%, more preferably in the range of 30 to 90 wt.%, more preferably in the range of 40 to 85 wt.%, more preferably in the range of 50 to 85 wt.%, most preferably in the range of 60 to 80 wt.%, in each case based on the composition in process step B).

[0086] In an embodiment 7 according to the invention, the method 2 is configured according to one of its embodiments 1 to 6, wherein the composition in process step B) includes at least one oligomer, preferably to a proportion in a range of 1 to 50 wt.%, preferably 1 to 40 wt.%, more preferably 2 to 30 wt.%, more preferably 3 to 25 wt.%, most preferably 5 to 20 wt.%, in each case based on the composition in process step B).

[0087] In an embodiment 8 according to the invention, the method 2 is designed according to one of its embodiments 1 to 7, wherein the method step C) includes hardening the composition.

[0088] In an embodiment 9 according to the invention, the method 2 is configured according to its embodiment 8, wherein the hardening involves reducing a proportion of a vehicle in the composition.

[0089] In an embodiment 10 according to the invention, the method 2 is configured according to its embodiment 8 or 9, wherein the hardening includes polymerizing a monomer or an oligomer or both in the composition.

[0090] In an embodiment 11 according to the invention, the method 2 is configured according to one of its embodiments 1 to 10, wherein the composition is a printing ink or a varnish or both.

[0091] In an embodiment 12 according to the invention, the method 2 is configured according to one of its embodiments 1 to 11, wherein the method is a method for producing a printed product.

[0092] In an embodiment 13 according to the invention, the method 2 is configured according to one of its embodiments 1 to 12, wherein in the method step A) the printing press according to the invention is provided according to one of its embodiments.

[0093] In one embodiment 14 of the invention, the method 2 is configured according to one of its embodiments 1 to 13, wherein the layering in method step B) is a printing of the composition onto the object. A preferred object is a printing substrate, also called a printing material.

[0094] In an embodiment 15 according to the invention, the method 1 is designed according to one of its embodiments 1 to 14, wherein in the method step C) a cooling fluid flows through the first fluid path.

[0095] In an embodiment 16 according to the invention, the method 2 is designed according to its embodiment 15, wherein in the method step C) the cooling fluid flows through the first fluid path at a pressure in a range of more than 1 to 20 bar, preferably more than 1 to 15 bar, more preferably more than 1 to 10 bar, more preferably more than 1 to 8 bar, more preferably 2 to 6 bar, most preferably 3 to 5 bar.

[0096] In one embodiment 17 of the invention, the method 2 is configured according to one of its embodiments 1 to 16, wherein in method step C) the first support element is cooled with a cooling capacity in the range of 100 to 1000 W, preferably 100 to 500 W, more preferably 200 to 400 W. If the light source includes at least one further support element, each further support element is preferably cooled with a cooling capacity in one of the aforementioned ranges.

[0097] In an embodiment 18 according to the invention, the method 2 is configured according to one of its embodiments 1 to 17, wherein the light source is the light source 1 according to one of its embodiments 21 to 50, wherein in the method step C) a maximum temperature of the support surface of the first support element deviates by no more than 10 K, preferably no more than 8 K, more preferably no more than 6 K, most preferably no more than 5 K, from a maximum temperature of the support surface of each further support element.

[0098] Also disclosed is an embodiment 1 of a printed product obtainable by method 2 according to one of its embodiments 1 to 18.

[0099] In embodiment 2, the printed product is designed according to embodiment 1, wherein the printed product is selected from the group consisting of a magazine, a book, a poster, an advertising medium, and a label, or a combination of at least two of them.

[0100] An embodiment 1 of an arrangement comprising contributes to the fulfillment of at least one of the tasks according to the invention. A. the light source 1 according to one of its embodiments, and B. an irradiation material, wherein the light source and the irradiated material are arranged and configured for irradiating the irradiated material with light emitted by the at least one first light-emitting semiconductor device.

[0101] In an embodiment 2 of the invention, the arrangement is configured according to embodiment 1, wherein the irradiation material comprises an object and a composition superimposed on the object, and wherein the light source and the irradiation material are arranged and configured to irradiate the composition with the light emitted by the at least one first light-emitting semiconductor device. A preferred object is a printing substrate. The composition is preferably configured according to an embodiment of the method 2 of the invention.

[0102] An embodiment 1 of a method 3, comprising as method steps, contributes to the fulfillment of at least one of the tasks according to the invention. A] Providing the arrangement according to the invention in one of its embodiments; and B] Irradiating the material to be irradiated with light emitted by the at least one first light-emitting semiconductor device.

[0103] In a preferred embodiment, method 3 is a method for irradiating the material to be irradiated.

[0104] In an embodiment 2 according to the invention, the method 3 is configured according to its embodiment 1, wherein process step B includes hardening a composition. The method 3 is preferably a method for hardening the composition.

[0105] In an embodiment 3 according to the invention, the method 3 is designed according to its embodiment 2, wherein the hardening involves reducing a proportion of a vehicle in the composition.

[0106] In an embodiment 4 according to the invention, the method 3 is configured according to its embodiment 2 or 3, wherein the hardening includes polymerizing a monomer or an oligomer or both in the composition.

[0107] An embodiment 1 of a use 1 of the light source 1 according to one of its embodiments contributes to the fulfillment of at least one of the problems according to the invention by hardening a composition. The composition is preferably designed according to an embodiment of the method 2 according to the invention. Furthermore, the hardening is preferably carried out according to an embodiment of the method 2 according to the invention.

[0108] An embodiment 1 of a use 2 of the light source 1 according to one of its embodiments, in a printing press, contributes to fulfilling at least one of the problems according to the invention. A preferred printing press is designed like the printing press according to one of its embodiments. Furthermore, the light source in the printing press is preferably used for hardening a composition. The hardening is preferably carried out according to an embodiment of the method 2 according to the invention.

[0109] Features that are described as preferred in one category according to the invention, for example according to the light source 1 or the method 1 of the invention, are also preferred in an embodiment of the further categories according to the invention, for example an embodiment of the arrangement according to the invention or of the use 1 or 2. light source

[0110] Within the scope of the invention, any device designed to emit electromagnetic radiation that appears suitable to a person skilled in the art for the application according to the invention, preferably for use in a printing press, can serve as a light source. The term electromagnetic radiation includes not only visible light but also components of the electromagnetic spectrum that are invisible to the human eye. Preferred electromagnetic radiation lies in the wavelength range from 10 nm to 1 mm. Further preferred electromagnetic radiation is infrared radiation (IR radiation), ultraviolet radiation (UV radiation), or a mixture of both. According to the standard DIN 5031-7, the wavelength range of UV radiation extends from 10 to 380 nm. By definition, UV-A radiation lies in the range of 315 to 380 nm, UV-B radiation in the range of 280 to 315 nm, UV-C radiation in the range of 100 to 280 nm, and EUV radiation in the range of 10 to 121 nm.Within the scope of the invention, UV radiation selected from the group consisting of UV-A radiation, UV-B radiation, and UV-C radiation, or a combination of at least two thereof, is particularly preferred. It should be noted that while the aforementioned standard defines the wavelength ranges of UV radiation, in the technical field of LEDs, which, as described below, are preferred light-emitting semiconductor devices within the scope of the invention, LEDs with maxima of emitted intensity (also referred to in the technical field as...) Peak wavelengthLEDs emitting light at wavelengths outside the wavelength ranges specified in the standard are referred to as UV-LEDs. For example, LEDs with maximum emitted intensity at wavelengths of 385 nm, 395 nm, and 405 nm are also referred to as UV-A LEDs. Within the scope of the invention, such LEDs are also among the preferred light-emitting semiconductor devices. Furthermore, the terminology of the technical field is adopted here, and such LEDs are also referred to as UV-LEDs. A preferred light source includes or is an LED module. An LED module preferably includes a circuit board on which several LEDs are arranged. Each LED can be equipped with an optic. Furthermore, an optic can also be assigned to several LEDs. An optic is defined here as an element that is arranged and configured for manipulating electromagnetic radiation. Both optical components and optical devices are suitable for this purpose.A preferred optical system is one selected from the group consisting of a transmission optical system, a conversion optical system, and a reflection optical system, or a combination of at least two of these. A transmission optical system is an optical system through which electromagnetic radiation is traversed for manipulation. A preferred transmission optical system is a lens or a transmission grating. A conversion optical system is an optical system arranged and configured to change a wavelength of electromagnetic radiation. In the case of an LED, this can preferably serve to adjust the color of the light emitted by the LED. A preferred conversion optical system is a conversion layer, i.e., a layer containing at least one fluorescent dye. A reflection optical system is an optical system that reflects electromagnetic radiation for manipulation, in particular its direction of propagation.A preferred reflective optic is a mirror or a reflective grating. The light source further preferably includes a ballast, which is arranged and configured to operate the LED module. A preferred ballast is an LED driver. Light-emitting semiconductor device

[0111] Any component containing a semiconductor that appears suitable to a person skilled in the art as a light-emitting component of the light source according to the invention is eligible. Light-emitting semiconductor components include, in particular, light-emitting diodes (LEDs) and laser diodes (also called semiconductor lasers), with LEDs being especially preferred. A particularly preferred LED is an IR LED or a UV LED, or both. A preferred UV LED is one selected from the group consisting of a UV-A LED, a UV-B LED, and a UV-C LED, or a combination of at least two of these. Support element

[0112] Any component suitable for use in a light source according to the invention can serve as a support element. A preferred support element is plate-shaped, i.e., a support plate. A particularly preferred support element is a cooling plate. A plate, as defined herein, is a planar element whose thickness at any point is at least twice, preferably at least five times, less than its length and width. The support element preferably consists of at least 80 wt.%, more preferably at least 90 wt.%, and even more preferably at least 95 wt.% of a material with a thermal conductivity of at least 50 W / (m·K), more preferably at least 100 W / (m·K), more preferably at least 200 W / (m·K), and most preferably at least 230 W / (m·K). Preferably, the support element comprises at least 80 wt.%, more preferably at least 90 wt.%, and even more preferably at least 95 wt.% of a metal.A preferred metal is copper or aluminum, or an alloy containing one or both of the aforementioned metals. In a preferred embodiment, the aforementioned material forms a base body of the support element, which may also have one or more coatings. A preferred coating consists of a metal selected from the group consisting of nickel, palladium, and gold, or of an alloy containing at least one of the aforementioned metals. If the support element contains several coatings, these are preferably layered over the base body from the base body outwards in the aforementioned sequence. The layer sequences base body, nickel coating, gold coating, and base body, nickel coating, palladium coating, gold coating are particularly preferred. The support element particularly preferably has the aforementioned coatings at least on the side of its support surface.The elements referred to herein as carrier elements are preferably not a substrate or circuit board of an LED or an LED module. Rather, the carrier element is preferably a component on whose carrier surface a plurality of LEDs or an LED module can be arranged. The carrier surface of a carrier element is preferably largely flat. Cooling structure

[0113] Any structure suitable for cooling purposes is one that, to the person skilled in the art, appears appropriate for increasing the heat dissipation of the support element from its cooling surface to an environment, particularly to a cooling fluid. A preferred cooling structure comprises one selected from the group consisting of fins, cooling ribs, pores, and channels, or a combination of at least two of these. Cooling ribs are particularly preferred. Cooling ribs are also referred to as cooling fins. Cooling ribs are planar elements. These planar elements are preferably connected at one edge to a support element to which the respective cooling structure belongs. In the light source according to the invention, an opposite edge of the planar element is preferably in contact with the distribution element. The planar elements are preferably arranged parallel to each other. Furthermore, the planar elements preferably have rectangular side faces. Distribution element

[0114] In principle, any component suitable for the application according to the invention can be used as a distribution element. The distribution element preferably serves as a distributor for a cooling fluid and as a component that supports the first support element and any further support elements of the light source according to the invention. For this purpose, the distribution element preferably has electrical connections as well as connections for an inlet and an outlet of a cooling fluid. The aforementioned connections are preferably located on one or both end faces of the distribution element. Furthermore, the distribution element preferably includes an inlet and an outlet for a cooling fluid. Overlay

[0115] If it is defined herein that one element, for example a layer or a component, superimposes another element, these elements can follow each other directly, that is, without any intervening element, or indirectly, that is, with at least one intervening element. Directly successive elements preferably abut each other, that is, they are in contact with each other. Furthermore, superimposed elements are preferably connected to each other. Superimposed elements can be connected directly or indirectly. Two elements are connected to each other if their adhesion to each other exceeds van der Waals forces. Connected elements are preferably selected from the group consisting of those that are soldered, welded, sintered, screwed, or bonded together, or a combination of at least two of these.A formulation that includes a layer sequence containing enumerated layers or coatings means that at least the specified layers or coatings are present in the specified order. This formulation does not necessarily imply that these layers or coatings follow each other directly. A formulation that states two layers are adjacent to each other means that these two layers follow each other directly, without an intermediate layer. If, in a layer sequence, one layer overlaps another, the layer does not necessarily overlap the other layer over the entire surface of either layer, but preferably over a planar region of both layers. The layers forming the layer sequence of the planar composite are preferably bonded together planarly. Fluidway

[0116] If two cavities or regions of one or more cavities are fluid-conductingly connected to each other, they can be directly fluid-conducting, i.e., adjacent to each other, or indirectly fluid-conducting, i.e., connected to each other via a cavity or a region of a cavity in between. In either case, the aforementioned regions or cavities are connected to each other in such a way that a fluid can flow from one region or cavity to the other. A cooling fluid is a preferred fluid in this context. Cooling fluid

[0117] Any fluid suitable to a person skilled in the art for cooling the light source according to the invention, and in particular for cooling it, can be used as a cooling fluid. In this context, a fluid is a flowable medium. This includes, in particular, gases and liquids. A cooling liquid is preferred. A preferred cooling liquid contains water or glycol or a mixture of both. Preferably, the cooling liquid consists of water or a water-glycol mixture. Hardening

[0118] The hardening of a composition, as described above, is the solidification of the composition, whereby a layer is obtained from the composition which, during hardening, is preferably also bonded to the underlying object. The layer can be a continuous layer, which is preferred in the case of a varnish composition, or a non-continuous layer, for example, in the form of letters formed from printing ink. A preferred hardening method is physical hardening, chemical hardening, or both. A preferred physical hardening method is drying. Drying preferably involves reducing the proportion of a vehicle in the composition, preferably to 0 wt.%, preferably by evaporating the vehicle. A preferred vehicle is an organic vehicle or an inorganic vehicle. Water is preferred as an inorganic vehicle. Another preferred vehicle is a solvent.Chemical hardening involves a chemical reaction. A preferred chemical reaction is a polymerization reaction, a crosslinking reaction, or both. If the composition is a powder, the hardening process involves bonding particles of the powder to form a cohesive solid, which is preferably also bonded to the underlying object. In the case of a liquid composition, the hardening process causes it to transition from a liquid to a solid state. printing medium

[0119] Any object suitable to a person skilled in the art within the scope of the invention can serve as a printing substrate, also called a substrate. A preferred printing substrate is planar. This means that the length and width of the printing substrate are greater than the thickness of the printing substrate by a factor of at least 10, more preferably at least 100, and even more preferably at least 1000. A preferred planar printing substrate is web-like. This means that the length of the printing substrate is greater than the width of the printing substrate by a factor of at least 2, more preferably at least 5, even more preferably at least 10, and most preferably at least 100. A preferred printing substrate comprises, and preferably consists of, paper, a film, or a laminate. A preferred laminate comprises one or more polymer layers, one or more paper layers, one or more metal layers, or a combination of the aforementioned layers in a layer sequence. Printing ink

[0120] Printing inks are colorant-containing mixtures that have a suitable viscosity for application as a thin film. In its cured state, this thin film preferably has a thickness (dry thickness) in the range of 0.5 to 50 µm, more preferably 1 to 30 µm, and more preferably 1 to 20 µm. A preferred printing ink comprises one or more colorants, a binder, a vehicle, and an additive, selected from the group consisting of, or a combination of at least two, preferably all, of the aforementioned. A preferred binder is a resin, a polymer, or a mixture of both. A preferred vehicle is a solvent. A preferred additive serves to adjust a desired property of the printing ink, preferably a desired processing property, for example, the viscosity of the printing ink.A preferred additive is one selected from the group consisting of a dispersing additive, an defoamer, a wax, a lubricant, and a substrate wetting agent, or a combination of at least two of these. Furthermore, a preferred printing ink is one selected from the group consisting of a toner, an ink for an inkjet printer, an offset printing ink, an illustration printing ink, a liquid ink, and a radiation-curing printing ink, or a combination of at least two of these. A preferred offset printing ink is a web offset printing ink or a sheetfed offset printing ink, or both. A preferred web offset printing ink is a web offset coldset printing ink or a web offset heatset printing ink, or both. A preferred liquid ink is a water-based liquid ink or a solvent-based liquid ink, or both. A particularly preferred printing ink comprises 8 to 15 wt. of the following:-% at least one colorant, preferably at least one pigment, and at least one resin or at least one polymer or a mixture of the two to a total of 25 to 40 wt.%, at least one high-boiling mineral oil (boiling range 250 to 210 °C) to a total of 30 to 45 wt.%, and at least one additive to a total of 2 to 8 wt.%, each based on the weight of the printing ink. paint

[0121] A lacquer is a liquid or powdered coating material that has a suitable viscosity for application as a thin layer and from which a solid, preferably continuous, film can be obtained by hardening. Lacquers often contain at least one component selected from the group consisting of at least one binder, at least one filler, at least one vehicle, at least one colorant, at least one resin and / or at least one acrylate, and at least one additive, or a combination of at least two of these, wherein a combination of all the aforementioned components (with resin and / or acrylate) is preferred. A preferred additive is a biocide. A preferred biocide is an in-can preservative.Coatings often serve to protect the object they are applied to, to decorate it, to functionalize a surface of the object (for example, by altering electrical properties or increasing abrasion resistance), or a combination of these functions. A coating preferred within the scope of the invention is one selected from the group consisting of a water-based coating, a solvent-based coating, a UV-based (i.e., UV-curable) coating, and a dispersion coating, or a combination of at least two of these. A particularly preferred coating is designed to protect a printed surface. colorant

[0122] Suitable colorants include both solid and liquid substances known to those skilled in the art and suitable for the present invention. According to DIN 55943:2001-10, "colorant" is the collective term for all coloring substances, in particular dyes and pigments. A preferred colorant is a pigment. A preferred pigment is an organic pigment. Pigments of particular importance in connection with the invention are those mentioned in DIN 55943:2001-10 and in "Industrial Organic Pigments, Third Edition." (Willy Herbst, Klaus Hunger Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 3-527-30576-9). A pigment is a colorant that is preferably insoluble in the application medium. A dye is a colorant that is preferably soluble in the application medium. Procedural steps

[0123] In the procedure described herein, the steps of a sequence are carried out in the specified order of their ordinal symbols. The steps of a sequence can follow one another directly or indirectly. Furthermore, successive steps can be performed sequentially, overlapping in time, or simultaneously. MEASUREMENT METHODS

[0124] Unless otherwise stated, the measurements used within the scope of the invention were carried out at an ambient temperature of 23°C, an ambient air pressure of 100 kPa (0.986 atm) and a relative humidity of 50%.

[0125] The invention is described in more detail below by means of examples and drawings, whereby the examples and drawings do not constitute a limitation of the invention. Furthermore, unless otherwise indicated, the drawings are not to scale.

[0126] Unless otherwise stated in the description or the respective figure, the figures are shown schematically and not to scale: Figure 1 is a schematic representation of a light source according to the invention; Figure 2 is a schematic partial representation of a section of the light source according to the invention. Figure 1 Figure 3 shows a further schematic partial representation of a section of the light source according to the invention. Figure 1 Figure 4 shows a schematic representation of the first support element of the light source according to the invention. Figure 1 Figure 5 shows a schematic cross-sectional view of the light source according to the invention. Figure 1Figure 6 is a flowchart of a method according to the invention for producing a light source; Figure 7 is a schematic representation of a printing press according to the invention; Figure 8 is a flowchart of a method according to the invention for producing a printed product; Figure 9 is a schematic representation of a printed product according to the invention; Figure 10 is a schematic representation of an arrangement according to the invention; and Figure 11 is a flowchart of a method according to the invention for irradiating a material to be irradiated.

[0127] Figure 1Figure 1 shows a schematic representation of a light source 100 according to the invention. The light source 100 includes a distribution element 103 made of aluminum. The distribution element 103 is formed in one piece and extends longitudinally in a longitudinal direction 104. A transverse direction 105 is perpendicular to the longitudinal direction 104. A total of 28 support elements 102 are screwed onto the distribution element 103. Each of the support elements 102 is individually replaceable. Furthermore, each of the support elements 102 carries a light-emitting semiconductor device 101, more precisely an LED module 101. The light source 100 also has a connection 107 for a cooling fluid inlet and a connection 108 for a cooling fluid return of a cooling circuit. The connections 107 and 108 are connected to the distribution element 103 by means of a connecting element 106. The distribution element 103 also serves as the housing of the light source 100.

[0128] Figure 2shows a schematic partial representation of a section of the light source 100 according to the invention. Figure 1 . In the Figure 2Only one of the 28 carrier elements 102 of the light source 100 is shown. A first light-emitting semiconductor device 101, which is an LED module 101, is soldered onto the first carrier element 102. The first carrier element 102 is screwed onto the distributor element 103 with two countersunk screws 201. Thus, the first light-emitting semiconductor device 101, the first carrier element 102, and the distributor element 103 are superimposed on each other in the aforementioned order. The LED module 101 shown contains a substrate 204 made of a ceramic material, onto which several LED chips 203 are applied using chip-on-board technology. The LED module 101 is a UV LED module. The distributor element 103 further has, in the longitudinal direction 104, a sealing groove 202 next to each of the 28 support elements 102 for receiving a sealing element 301 (see Figure 3 ) on.

[0129] Figure 3shows a further schematic partial representation of a section of the light source 100 according to the invention. Figure 1 As in the Figure 2 Here, only the first support element 102 of the total of 28 support elements 102 of the light source 100 is shown. Furthermore, a sealing element 301 is included in each sealing groove 202. The sealing elements 301 are designed as rectangular O-rings. When the support element 102 is mounted, a sealing element 301 included in a sealing groove 202 is arranged between the support element 102 and the distributor element 103 around a fluid-conducting connection such that the fluid-conducting connection is laterally fluid-tight. Furthermore, in the Figure 3For each mounting position of a further support element 102 (not shown), two third channels 302 of a first cavity 501 in the distributor element 103 and two third channels 303 of a further cavity 502 in the distributor element 103 can be seen. The first 501 and the further cavity 502 are connected below to Figure 5 explained.

[0130] Figure 4 shows a schematic representation of the first support element 102 of the light source 100 according to the invention. Figure 1 The first support element 102 has external dimensions of 59.5 mm × 24.3 mm × 5 mm. It consists of a copper base body with the material designation Cu-ETP R250 and the material number CW004A. A nickel layer with a thickness of 3 to 7 µm is applied to this base body. A gold layer with a thickness of 0.03 to 0.13 µm is then coated on top of the nickel layer. Both coatings are known in the technical field as Electroless Nickel Immersion Gold(ENIG) coatings, which serve in particular for surface protection and also facilitate the application of the LED module 101 to a flat substrate surface 401 of the first substrate element 102 (in the figure on the concealed underside of the first substrate element 102). The first substrate element 102 also has an outer surface opposite the substrate surface 401, which is referred to here as the cooling surface 402. This cooling surface 402 is partially a surface of a cooling structure 403, which consists of 13 cooling fins 404 and 14 channels 405. Except for the two outermost channels 405, the channels 405 extend between each pair of adjacent cooling fins 404. Each cooling fin 404 has a thickness of 0.65 mm. The width of the channels 405 is approximately 0.82 mm. The cooling fins 404 each have two breaks.A distribution chamber 407 forms one interruption of the cooling fins 404, while a collection chamber 408 forms the second interruption of each cooling fin 404. The thickness of the first support element 102 is minimal in the channels 405, the distribution chamber 407, and the collection chamber 408. This minimal thickness is 1 mm. This material thickness provides the first support element 102 with sufficient mechanical stability for mounting the LED module 101 by gluing, soldering, or sintering. Furthermore, the first support element 102 with this material thickness is sufficiently mechanically stable to withstand typical pressure surges in the cooling circuit. The selected material thickness also allows for sufficient heat dissipation from the first support element 102 to a cooling fluid. The cooling fluid can flow along a first fluid path 409, indicated by arrows in the figure.This first fluid path 409 connects the first cavity 501 and the further cavity 502 of the distributor element 103 fluidly (see . Figure 5The first fluid path 409 leads from the first cavity 501 of the distributor element 102 (not shown here) into the distributor chamber 407, through the 14 channels 405 into the collection chamber 408, and from there into the further cavity 502 of the distributor element (not shown here). Thus, the cooling surface 402 partially defines the first fluid path 409. The distributor chamber 407 is arranged and configured to distribute the cooling fluid flowing along the first fluid path 409 onto the channels 405. Similarly, the collection chamber 408 is arranged and configured to direct the cooling fluid flowing out of the channels 405 into the further cavity 502. Each of the cooling fins 404 consists of a first section 410 and two further sections 411. The sections 410 and 411 are separated from each other by interruptions in the form of the distribution chamber 407 or the collection chamber 408. The first sections 410 are located in the first fluid path 409, the further sections 411 are not.Nevertheless, the additional sections 411 contribute to a good distribution of the cooling fluid and thus to homogeneous cooling of the first support element 102. In the first sections 410, the height of the cooling fins 404 is constant. In the subsequent sections 411, the height of the cooling fins 404 decreases outwards in the transverse direction 105, i.e., in a direction perpendicular to the thickness and height of the cooling fins 404 and directed away from the first sections 410. This is because the depth of the channels 405 decreases outwards in the transverse direction 105 in the subsequent sections 411. The first support element 102 also has through threads 412. These M2 threads can be used to attach components such as holders for optics, or to attach mounting aids, for example, a protective cap for the LED module 101.The countersunk screws mentioned above can be passed through the through holes 406 to detachably fasten the first support element 102 to the distributor element. Each of the 28 support elements 102 of the light source 100 is designed like the first support element 102 described above.

[0131] Figure 5 shows a schematic cross-sectional representation of the light source 100 according to the invention. Figure 1Here it can be seen that the distributor element 103 includes a first cavity 501, which is designed as an inlet for the cooling fluid. The first cavity 501 comprises a first channel 503, which runs under each of the support elements 102. From the first channel 503, two second channels 504 of the first cavity 501 lead into the first fluid path 409. For each additional support element 102, two third channels 302 of the first cavity 501 lead into a further fluid path, i.e., to the cooling surface 402 of the respective support element 102 (see figure). Figure 3Furthermore, the distributor element 103 includes a further cavity 502, which is designed as a return for the cooling fluid. The further cavity 502 comprises a first channel 505 that runs under each of the 28 support elements 102. From the first fluid path 409, two second channels 506 of the further cavity 502 lead into its first channel 505. For each further support element 102, two third channels 303 of the further cavity 502 lead from a further fluid path, i.e., from the cooling surface 402 of the respective further support element 102, into the first channel 505. (cf. Figure 3 ). By means of the first fluid path 409 and each subsequent fluid path, the first cavity 501 and the further cavity 502 are therefore fluid-conductingly connected to each other. Furthermore, in the Figure 5As can be seen in the figure, the first fluid path 409, indicated by an arrow, is bounded by the first cooling surface 402 and an opposing outer surface of the distributor element 103. Also visible is the first sealing element 301, arranged between the first support element 102 and the distributor element for sealing purposes. The distributor element 103, in its function as a housing, further comprises a holder 507, which is arranged and designed to hold an emission window 508 of the light source 100.

[0132] Figure 6 Figure 1 shows a flowchart of a method according to the invention for producing a light source 100. In a process step A} 601, 28 support elements 102 are provided, which, like the one in Figure 1, are Figure 4 The first support element 102 shown is formed and provided. An LED module 101 is applied to the support surface 401 of each of these support elements 102. Furthermore, in this process step A} 601, the Figure 5The distributor element 103 shown is provided. In process step B}, the support elements 102 are each detachably screwed onto the distributor element 103 by means of two countersunk screws, so that the first cavity 51 and the further cavity 502 of the distributor element 103 are fluid-conductingly connected to each other by means of a fluid path 409 for each support element 102. Here, each of the fluid paths 409 is bounded by a surface of the distributor element 103 and by a cooling surface 402 of the respective support element 102. The provision of the distributor element 103 involves extrusion to obtain an aluminum molded body, into which the second channels 504 and 506 as well as the third channels 302 and 303 are introduced by drilling.Each of the support elements 102 is produced by providing a copper mold, machining this copper mold, including with a CNC milling machine, and coating the machined copper mold with the ENIG coatings. Machining with the CNC milling machine involves milling with a disc cutter. This cutter has 14 disc-shaped cutting edges, each with a diameter of 27.7 mm and a thickness of 0.82 mm. This disc cutter can simultaneously produce all 14 channels 405 and thus the cooling fins 404 of the cooling structure 403 of the support element 102. Subsequently, the distribution chamber 407 and the collection chamber 408 are milled with an end mill, thus dividing the cooling fins 404 into the first 410 and further sections 411. Finally, the through holes 406 are drilled and the through threads 412 are drilled and cut. The process 600 makes the light source 100 of the . Figure 1manufactured. Process 600 is characterized by short production times, stable process control (low manufacturing tolerances), and low tool wear, particularly in the production of the support elements 102. Furthermore, the copper of the support elements 102 can be easily machined with the aforementioned tools.

[0133] Figure 7 Figure 1 shows a schematic representation of a printing press 701 according to the invention. The printing press 701 includes the light source 100 of the Figure 1 The light source 100 is arranged in the printing press 701 for illuminating a composition printed on a printing substrate 702. The printing press 701 is a sheet-fed offset printing press.

[0134] Figure 8 shows a flowchart of a method 800 according to the invention for producing a printed product 900 (cf. Figure 9 In process step A) 801, the printing press 701 of the Figure 7 and a printing medium 1002 provided as object 1002 (see Figure 10In a subsequent process step B) 802, a liquid composition 1003, which is a sheet-fed offset printing ink, is printed onto the printing substrate 1002 using the printing press 701. In a process step C) 803, the printed sheet-fed offset printing ink is irradiated with UV light emitted by the LED modules 101 of the light source 100 and thereby cured by polymerization. Due to the inventive design of the light source 100, each of the 28 support elements of the light source 100 can be cooled in process step C) 803 by means of a water-glycol mixture as a cooling fluid, which flows in a cooling circuit at about 5 bar, with a cooling capacity of about 300 W, so that the two support elements 102 furthest apart in the longitudinal direction 104 exhibit a temperature difference of a maximum of 4 K.This allows all LED modules 101 of the light source 100 to be operated at approximately the same efficiency, thus enabling homogeneous irradiation and therefore homogeneous curing of the printing ink 1003 over a large area.

[0135] Figure 9 Figure 1 shows a schematic representation of a printed product 900 according to the invention. This is a printed product produced according to method 800 of the invention. Figure 8 available brochure 900.

[0136] Figure 10 Figure 1 shows a schematic representation of an arrangement 1000 according to the invention. This includes the printing press 701 of the Figure 7and an irradiation material 1001, which consists of an object 1002, here a printing substrate 1002, and a printing ink 1003 printed onto the printing substrate 1002. The light source 100 of the printing machine 701 and the irradiation material 1001 are arranged such that the printed printing ink 1003 can be irradiated with light 1004, here UV light, emitted by the LED modules 101 of the light source 100.

[0137] Figure 11 Figure 1 shows a flowchart of a process 1100 according to the invention for irradiating a material 1001. In process step A] 1101, the arrangement 1000 of the Figure 10 provided. In process step B] 1102, the irradiation material 1001 is irradiated with UV light emitted by the LED modules 101 of the light source 100.

[0138] The invention is defined by the attached claims. LIST OF REFERENCE MARKS

[0139] 100 Light source according to the invention 101light-emitting semiconductor device / LED module 102 Support element 103 Distribution element 104 longitudinal direction 105 transverse direction 106 Connecting element 107 Connection for cooling fluid supply 108 Connection for cooling fluid return 201 Fastener / screw 202 Sealing groove 203 LED chips 204 LED substrate 301 Sealing element 302 third channel of the first cavity 303 third channel of the further cavity 401 first support surface 402 first cooling surface 403 Cooling structure 404 cooling fin 405 Channel between two adjacent cooling fins 406 Through hole 407 Distribution room 408 Collection room 409 first fluid path 410 first section 411 further section 412 Through thread 501 first cavity 502further cavity 503 first channel of the first cavity 504 second channel of the first cavity 505 first channel of the further cavity 506 second channel of the further cavity 507 bracket 508 Emission window 600 Inventive method for producing a light source 601 Process step A} 602 Process step B} 701 printing press according to the invention 702 printing medium 800 Method according to the invention for producing a printed product 801 Procedure step A) 802 Procedure step B) 803 Procedure step C) 900 Printed product / brochure according to the invention 1000 arrangement according to the invention 1001 Irradiated material 1002 Object / Printing medium 1003 Composition / Printing ink 1004 Light 1100 Method according to the invention for irradiating an object to be irradiated 1101[Procedure step A] 1102 [Procedure step B]

Claims

1. A light source (100) comprising, as components superimposed on each other in this order a) at least one first light-emitting semiconductor component (101); b) a first carrier element (102) comprising i) a first support surface (401) facing the at least one first light-emitting semiconductor device (101), and ii) additionally a first cooling surface (402); and c) a distribution element (103) comprising i) a first cavity (501), and ii) a further cavity (502); wherein the first cavity (501) and the further cavity (502) are connected to each other in a fluid-conducting manner by means of a first fluid path (409); wherein the first fluid path (409) is at least partially bounded by the first cooling surface (402); wherein the first carrier surface (401) and the first cooling surface (402) are opposite outer surfaces of the first carrier element (102); wherein the distribution element (103) is elongated in a longitudinal direction (104); wherein the first cavity (501) a] includes a first channel (503) extending longitudinally in the longitudinal direction (104), and b] additionally includes a second channel (504) extending longitudinally from the first channel (503) towards the first support element (102), wherein the first channel (503) and the second channel (504) of the first cavity (501) are fluidically connected to each other, wherein a diameter of the first channel (503) of the first cavity (501) is greater than a diameter of the second channel (504) of the first cavity (501); wherein the further cavity (502) a} includes a first channel (505) extending longitudinally in the longitudinal direction (104), and b} additionally includes a second channel (506) which extends longitudinally from the first channel (505) in the direction of the first carrier element (102), wherein the first channel (505) and the second channel (506) of the further cavity (502) are fluidically connected to each other, wherein a diameter of the first channel (505) of the further cavity (502) is greater than a diameter of the second channel (506) of the further cavity (502).

2. The light source (100) according to claim 1, wherein the first carrier element (102) is detachably connected to the distributor element (103).

3. The light source (100) according to claim 1 or 2, wherein the cooling surface (402) is at least partially a surface of a cooling structure (403) of the first carrier element (102).

4. The light source (100) according to claim 3, wherein the cooling structure (403) includes a plurality of cooling fins (404).

5. The light source (100) according to one of the preceding claims, wherein the first fluid path (409) is additionally at least partially bounded by a surface of the distribution element (103) facing the first carrier element (102).

6. A method (600) for manufacturing a light source (100), the method (600) comprising the following steps A} providing a) at least one first light-emitting semiconductor device (101), b) a first carrier element (102) comprising i) a first carrier surface (401), and ii) additionally a first cooling surface (401), and c) a distribution element (101) comprising i) a first cavity (501), and ii) a further cavity (502); and B} detachably connecting the first carrier element (102) to the distributor element (103) so that the first cavity (501) and the further cavity (502) are connected to each other in a fluid-conducting manner by means of a first fluid path (409); wherein the at least one first light-emitting semiconductor device (101) overlays the first carrier element (102) on one side of the first carrier surface (401); wherein the first fluid path (409) is at least partially bounded by the first cooling surface (402); wherein the first support surface (401) and the first cooling surface (402) are opposite outer surfaces of the first support element (102); wherein the distribution element (103) is elongated in a longitudinal direction (104); wherein the first cavity (501) a] includes a first channel (503) extending longitudinally in the longitudinal direction (104), and b] additionally includes a second channel (504) extending longitudinally from the first channel (503) towards the first support element (102), wherein the first channel (503) and the second channel (504) of the first cavity (501) are fluidically connected to each other, wherein a diameter of the first channel (503) of the first cavity (501) is greater than a diameter of the second channel (504) of the first cavity (501); wherein the further cavity (502) a} includes a first channel (505) extending longitudinally in the longitudinal direction (104), and b} additionally includes a second channel (506) which extends longitudinally from the first channel (505) in the direction of the first carrier element (102), wherein the first channel (505) and the second channel (506) of the further cavity (502) are fluidically connected to each other, wherein a diameter of the first channel (505) of the further cavity (502) is greater than a diameter of the second channel (506) of the further cavity (502).

7. The method (600) according to claim 6, wherein the first cooling surface (401) is at least partially a surface of a cooling structure (403) of the first carrier element (102), wherein, in process step A} (601), providing the first carrier element (102) includes creating the cooling structure (403) by means of a disc cutter.

8. A printing machine (701) comprising the light source (100) according to any one of claims 1 to 5.

9. A method (800) comprising the following method steps A) providing I) the light source (100) according to one of claims 1 to 5, and II) an object (1002); B) superpositioning the object (1002) with a composition (1003); and C) irradiating the composition (1003) with light (1004) emitted by the at least one first light-emitting semiconductor device (101).

10. The method (800) according to claim 9, wherein process step C) includes curing the composition (1003). wherein the curing involves reducing a proportion of a vehicle in the composition (1003).

11. An arrangement (1000) comprising A. the light source (100) according to any one of claims 1 to 5, and B. an irradiation object (1001), wherein the light source and the irradiation object (1001) are arranged and designed to irradiate the irradiation object (1001) with light (1003) emitted by the at least one first light-emitting semiconductor device (101).

12. A method (1100) comprising the steps of A] providing the arrangement (1000) according to claim 11; and B] irradiating the irradiation material (1001) with light (1004) emitted by the at least one first light-emitting semiconductor device (101).

13. Use of the light source (100) according to any one of claims 1 to 5 for curing a composition (1003).

14. Use of the light source (100) according to any one of claims 1 to 5 in a printing machine (701).