METHOD FOR FORMING SOLDER JOINTS AND SOLDERING EQUIPMENT

Description

[0001] The invention relates to a method for forming soldered joints and a soldering device for carrying out the method.

[0002] In the technical field of power electronics, it is common practice to solder components to a substrate. The components can be in the form of power semiconductor components, pins and / or sleeves, for example. The components are arranged on the substrate, with a solder arranged between each component and the substrate. The entire assembly is heated, for example, in an oven or by induction, so that the solder melts and, after it has resolidified, the soldered connections between the components and the substrate are formed. The disadvantage of this is that the soldered connections can be of varying quality due to locally uneven heating and / or cooling of the solder on the substrate. In particular, some of the soldered connections may have quality defects.

[0003] From the prior art (see document EP3067143) a method for forming soldered connections between components to be soldered and a substrate is known, wherein the substrate has an electrically non-conductive insulation layer and a metal layer arranged on the insulation layer and structured to form conductor tracks, wherein the components are arranged on the metal layer and a solder is arranged between the components and the metal layer, with the following method steps: a) Carrying out a relative movement of the substrate to an energizable winding in such a way that, after carrying out the relative movement, a central region of a winding surface enclosed by the winding is arranged in the normal direction (N) of the substrate in alignment with a first component to be soldered, b) Heating the solder arranged between the first component and the metal layer by inducing eddy currents in the region of the first component by means of a magnetic field generated by the winding, wherein a relative movement of the substrate to the winding is carried out in such a way that, after carrying out the relative movement, the central region of the winding surface is arranged in the normal direction of the substrate in alignment with a second component to be soldered, c) Heating the solder arranged between the second component and the metal layer by inducing eddy currents in the region of the second component by means of a magnetic field generated by the winding.

[0004] The object of the invention is to provide a method for forming high-quality solder joints between components to be soldered and a substrate and a soldering device which is designed to carry out the method.

[0005] This object is achieved by a method according to claim 1.

[0006] Furthermore, this object is achieved by a soldering device according to claim 12, which is designed to carry out a method according to the invention.

[0007] Advantageous designs of the soldering device result in an analogous manner to advantageous designs of the process and vice versa.

[0008] It proves to be advantageous if, in process step c), the heating of the solder is terminated by inducing eddy currents in the area of the second component by means of a magnetic field generated by the winding, by carrying out a relative movement of the substrate to the winding in such a way that, after carrying out the relative movement, the central region of the winding surface is arranged in the normal direction of the substrate in alignment with a further component to be soldered, or by switching off a current flowing through the winding, wherein a relative movement of the substrate to the winding is carried out in such a way that, after carrying out the relative movement, the central region of the winding surface is arranged in the normal direction of the substrate in alignment with a further component to be soldered. In the first case, the method can be carried out particularly efficiently. In the second case, the method can be carried out with particularly low energy consumption.

[0009] Furthermore, it proves advantageous if method step c) is repeated with each additional component to be soldered until all components to be soldered are soldered to the substrate. During the soldering of the last component to be soldered, if the temperature in the region of the last component to be soldered exceeds the limit temperature, the heating of the solder is terminated immediately or after a predetermined waiting time by inducing eddy currents in the region of the last component to be soldered. As a result, all components to be soldered are soldered to the substrate by means of the method according to the invention.

[0010] Furthermore, it proves advantageous if, in process steps a), b), and optionally c), the substrate is arranged between the respective component to be soldered and the winding, at least after the respective relative movement has been performed. This allows the relative movement of the substrate to the winding to be particularly simple, since none of the components to be soldered can collide with the winding during the relative movement. The relative movement can thus be performed particularly quickly.

[0011] One advantage of the invention is that the temperature in the region of the respective component is measured by measuring the temperature of a surface region of the substrate arranged in the normal direction of the substrate and aligned with the region of the respective component, in particular aligned with the respective component, on a side of the substrate facing away from the respective component. As a result, the relative movement of the substrate to the winding can be designed particularly simply, since during the relative movement none of the components to be soldered can collide with a measuring device designed to measure a respective temperature in a respective region of a respective component to be soldered to the substrate. The relative movement can therefore be carried out particularly quickly.

[0012] A further advantage of the invention is that the temperature measurement in the area of the respective component is carried out contactlessly using a pyrometer. This allows for particularly rapid temperature measurement in the area of the respective component. The measuring device is therefore preferably designed as a pyrometer.

[0013] In this context, it proves advantageous to measure the temperature in the area of the respective component based on thermal radiation radiated from the area of the respective component through the central area of the winding surface. This allows the temperature in the area of the respective component to be determined with high precision.

[0014] Furthermore, it proves to be advantageous if the winding is a component of a winding element, wherein the winding element has a first winding connection element that is electrically conductively connected to a first end of the winding, and a second winding connection element that is electrically conductively connected to a second end of the winding, wherein at least a portion of the first winding connection element and a portion of the second winding connection element extend away from each other in a V-shape. As a result, the winding can be connected particularly easily to a winding current generating device or to a

[0015] A winding current generating arrangement designed to generate a current flowing through the winding can be electrically connected.

[0016] In this context, it proves advantageous if the first and second winding connection elements are formed integrally with the winding. This makes the winding connection element particularly simple.

[0017] Furthermore, it proves advantageous if the winding has a starting section, a substantially circular arc-shaped central section adjoining the starting section, and an end section adjoining the central section, with the starting section and the end section extending toward each other in a V-shape. Due to this geometric shape of the winding, the magnetic field generated by the winding is configured in such a way that a particularly efficient induction of eddy currents occurs in the area of the respective component to be soldered.

[0018] Furthermore, it proves advantageous if, in method step b), the winding continues to generate or no longer generates the magnetic field during the execution of the relative movement of the substrate to the winding. If the winding continues to generate the magnetic field during the execution of the relative movement of the substrate to the winding, the method can be carried out particularly efficiently.

[0019] Furthermore, it proves advantageous if the components to be soldered are designed as pins or sleeves. Solder joints between pins or sleeves and a substrate are often subjected to significant mechanical stress, e.g., due to mechanical vibrations, so these solder joints must be of high quality.

[0020] Furthermore, a method for the simultaneous formation of a certain number of soldered connections of components to be soldered to a substrate is disclosed, wherein in the method, corresponding to the certain number of soldered connections which are to be formed simultaneously, a corresponding number of methods according to the invention are carried out in parallel on the substrate, wherein, corresponding to the certain number of soldered connections which are to be carried out simultaneously, at least a corresponding number of windings for generating a respective magnetic field are present, which are spaced apart from one another in a direction perpendicular to the normal direction of the substrate, wherein in method step b) and optionally in method step c) a relative movement of the substrate to the windings takes place when the temperatures in the areas of the components to be soldered simultaneously each reach a respective limit temperature,which is at least as high as the melting temperature of the respective solder. Using this process, several solder joints between components to be soldered and the substrate can be formed simultaneously, thus enabling a particularly efficient formation of the solder joints.

[0021] In this context, the invention enables a soldering device according to claim 13, which is designed to carry out a method for the simultaneous formation of a certain number of solder joints of components to be soldered to a substrate.

[0022] In this context, it proves to be advantageous if the winding current generating arrangement has a winding current generating device assigned to the respective winding, which is designed to generate a current flowing through the winding assigned to it.

[0023] It should be noted that, within the meaning of the invention, a relative movement of a substrate to an energizable winding is understood to mean both a movement of the substrate relative to a winding stationary relative to the earth's surface, a movement of the winding relative to a substrate stationary relative to the earth's surface, and a movement in which the substrate and the winding move relative to the earth's surface. The relative movement of the substrate to the energizable winding can occur in all three spatial directions in a Cartesian coordinate system.

[0024] It should also be noted that the heating of the solder arranged between the respective component and the metal layer by inducing eddy currents in the region of the respective component, by means of a magnetic field generated by the winding, in the sense of the invention, can take place both by indirectly heating the solder, for example by directly heating the metal layer and, if present, the further metal layer of the substrate by inducing eddy currents into the metal layer and, if present, into the further metal layer in the region of the respective component and the respective solder is heated by the metal layer and / or the respective component is heated by inducing eddy currents into the respective component and the respective solder is heated by the respective component, and by directly heating the solder, by heating the respective solder by inducing eddy currents into the respective solder.

[0025] Embodiments of the invention are explained below with reference to the figures below. FIG 1 shows a soldering arrangement to be soldered after carrying out a first method step of the method according to the invention and a soldering device according to the invention, FIG 2 shows a plan view of a winding element with one winding and with a first and a second winding connection element and of a region of a substrate ora further metallization of a substrate, FIG 3 a soldering arrangement to be soldered after carrying out a further method step of the method according to the invention, as well as a winding and a measuring device of the soldering device, FIG 4 a soldering arrangement to be soldered after carrying out a further method step of the method according to the invention, as well as a winding and a measuring device of the soldering device, FIG 5 the soldering arrangement after carrying out the method according to the invention, as well as a winding and a measuring device of the soldering device and FIG 6 a soldering arrangement to be soldered after carrying out a first method step of a further method and a further soldering device. .

[0026] In FIG 1 a soldering arrangement 23 to be soldered is shown after carrying out a first method step a) of the method according to the invention and a soldering device 13 according to the invention for carrying out the method. FIG 2 a winding element 16 with a winding 6 and with a first and a second winding connection element 14a and 14b is shown.

[0027] The method according to the invention serves to form soldered joints 8a' to 8f' (see FIG 5 ) of components 1a to 1f to be soldered to a substrate 2, which has an electrically non-conductive insulation layer 3 and a metal layer 4 arranged on the insulation layer 3 and structured into conductor tracks 4a to 4f, wherein the components 1a to 1f are arranged on the metal layer 4 and a solder 8a to 8f is arranged between the components 1a to 1f and the metal layer 4 (see FIG 1 ).

[0028] The substrate 2 preferably has an electrically conductive, preferably unstructured, further metal layer 5, wherein the insulation layer 3 is arranged between the metal layer 4 and the further metal layer 5. The insulation layer 3 can be formed, for example, as a ceramic plate. The respective substrate 2 can be formed, for example, as a direct copper bonded substrate (DCB substrate), an active metal brazing substrate (AMB substrate), or an insulated metal substrate (IMS).

[0029] The components 1a to 1f to be soldered can be designed, for example, as pins or sleeves, as in the exemplary embodiment. The respective pin can have a press-fit section (not shown in the figures) arranged at its end region facing away from the substrate 2. The press-fit section preferably serves to form an electrically conductive press-in connection with a printed circuit board.

[0030] In a first method step a), a relative movement of the substrate 2 to a current-carrying winding 6 is carried out in such a way that, after the relative movement has been carried out, a central region 19 of a winding surface 18 enclosed by the winding 6 is arranged in the normal direction N of the substrate 2 in alignment with a first component 1a to be soldered. The outer edge of the winding surface 18 surrounds the central region 19, wherein the central region 19 is arranged at a distance from the entire outer edge of the winding surface 18. The central region 19 is preferably, as in FIG 2 shown, circular in shape.

[0031] In a subsequent further method step b), the solder 8a arranged between the first component 1a and the metal layer 4 is heated by inducing eddy currents in the region Ba of the first component 1a by means of a magnetic field generated by the winding 6 and measuring a temperature in the region Ba of the first component 1a, wherein, if the temperature in the region Ba of the first component 1a exceeds a limit temperature which is at least as high as the liquidus temperature of the solder 8a, a relative movement of the substrate 2 to the winding 6 is carried out immediately or after a predetermined waiting time such that, after the relative movement has been carried out, the central region 19 of the winding surface 18 is arranged in the normal direction N of the substrate 2 in alignment with a second component 1b to be soldered. The limit temperature is specified as a limit value.During the execution of the relative movement of the substrate 2 to the winding 6, the winding 6 can continue to generate the magnetic field or can no longer generate it by switching off a current flowing through the winding 6. In . FIG 3 the soldering arrangement 23 to be soldered is shown after carrying out the further method step b), as well as the winding 6 and a measuring device 12 of the soldering device 13, which is designed to measure a respective temperature in a respective range Ba to Bf of the respective component 1a to 1f to be soldered to the substrate 2.

[0032] In a subsequent further method step c), the solder 8b arranged between the second component 1b and the metal layer 4 is heated by inducing eddy currents in the region Bb of the second component 1b by means of a magnetic field generated by the winding 6 and measuring the temperature in the region of the second component 1b, wherein, if the temperature in the region of the second component Bb exceeds the limit temperature, the heating of the solder 8b by inducing eddy currents in the region Bb of the second component 1b by means of a magnetic field generated by the winding 6 is terminated immediately or after a predetermined waiting time.Within the scope of the exemplary embodiment, in method step c), the heating of the solder 8b is terminated by inducing eddy currents in the region Bb of the second component 1b by means of a magnetic field generated by the winding 6, by carrying out a relative movement of the substrate 2 to the winding 6 in such a way that after carrying out the relative movement, the central region 19 of the winding surface 18 is arranged in the normal direction N of the substrate 2 in alignment with a further component 1c to be soldered.In method step c), the heating of the solder 8b by inducing eddy currents in the region Bb of the second component 1b by means of a magnetic field generated by the winding 6 can also be stopped by switching off a current flowing through the winding, wherein, preferably after switching off the current, a relative movement of the substrate 2 to the winding 6 is carried out in such a way that after the relative movement has been carried out, the central region 19 of the winding surface 18 is arranged in the normal direction N of the substrate 2 in alignment with a further component 1c to be soldered. In . FIG 4 the soldering arrangement 23 to be soldered after carrying out process step c), as well as the winding 6 and the measuring device 12 are shown.

[0033] The method according to the invention enables a uniform local heating and cooling of the respective solder on the substrate that can be adapted to the desired solder joint with high process repeatability, so that high-quality solder joints are achieved by means of the method according to the invention.

[0034] The method step c) is preferably repeated with a further component 1c, 1d, 1e or 1f to be soldered until all components 1a to 1f to be soldered are soldered to the substrate 2, wherein during the soldering of the last component 1f to be soldered, if the temperature in the region Bf of the last component 1f to be soldered exceeds the limit temperature, the heating of the solder 8f by induction of eddy currents in the region Bf of the last component 1f to be soldered is terminated immediately or after a predetermined waiting time. The heating of the solder 8f by induction of eddy currents in the region Bf of the last component 1f to be soldered can, for example,be terminated by carrying out a relative movement of the substrate 2 to the winding 6 in such a way that, after the relative movement has been carried out, no or only very small eddy currents are induced in the region Bf of the component 1f by means of the magnetic field generated by the winding 6, or by switching off a current flowing through the winding 6. In . FIG 5 the soldering arrangement 23 after carrying out the method according to the invention, as well as the winding 6 and the measuring device 12 are shown.

[0035] In method steps a), b) and c), as in the exemplary embodiment, the substrate 2 is preferably arranged between the respective component 1a to 1f to be soldered and the winding 6, at least after the respective relative movement has been carried out. Alternatively, and this is not shown in the figures, the winding 6 can also be arranged at a distance from the substrate 2 on the side of the substrate 2 facing the components 1a to 1f, at least after the respective relative movement has been carried out. In this case, the respective component 1a to 1f can extend through the winding 6 after the respective relative movement has been carried out.

[0036] The measurement of the temperature in the region Ba-Bf of the respective component 1a to 1f is carried out, as in the exemplary embodiment, by measuring the temperature of a side 22 of the substrate 2 facing away from the respective component 1a to 1f in the normal direction N of the substrate 2, aligned with the region Ba-Bf of the respective component 1a to 1f, in particular aligned with the respective component 1a to 1f (see FIG 1 ) arranged surface area of the substrate 2.

[0037] The measuring device 12 is designed as a pyrometer. The temperature in the Ba-Bf region of the respective component 1a to 1f is measured contactlessly using a pyrometer 12. In this case, the temperature in the region of the respective component 1a to 1f is preferably measured using thermal radiation 17 radiated from the Ba-Bf region of the respective component 1a to 1f through the central region 19 of the winding surface 18, which is detected by the pyrometer 12.

[0038] In FIG 2 a plan view of a winding element 16 with the winding 6 and with a first and a second winding connection element 14a and 14b and of a region of the substrate 2 or the further metallization 5 of a substrate 2 is shown. FIG 2 shows a top view in FIG 1 from below in the normal direction N of the substrate 2 aligned with the respective component 1a to 1f to be soldered, whereby the respective component 1a to 1f, since actually in the plan view according to FIG 2 not visible, shown in dashed lines.

[0039] As exemplified in FIG 2 As shown, the winding 6 is preferably a component of a winding element 16. The winding element 16 has a first winding connection element 14a, which is electrically conductively connected to a first end 6a of the winding 6. The winding element 16 further has a second winding connection element 14b, which is electrically conductively connected to a second end 6b of the winding 6. At least a portion of the first winding connection element 14a and a portion of the second winding connection element 14b extend away from each other in a V-shape. The boundary A from the winding 6 to the first and second winding connection elements 14a and 14b is in FIG 2 represented by a dotted line. The boundary A preferably runs through a constriction region 15 of the winding 6.

[0040] The winding 6 is preferably formed from a wire, in particular from a copper wire.

[0041] The first and second winding connection elements 14a and 14b are preferably formed integrally with the winding 6.

[0042] The winding 6 preferably has a starting section 6c, a central section 6d adjoining the starting section 6c and configured in a substantially circular arc, in particular in a circular arc, and an end section 6e adjoining the central section 6d. The starting section 6c and the end section 6e extend toward each other in a V-shape. The starting section 6c and the end section 6e converge toward the constriction region 15 of the winding 6. The center of the central region 19 of the winding surface 18 preferably coincides with the center point from which the radius of the central section 6d extends.

[0043] In FIG 1 A soldering device 13 according to the invention, which is designed to carry out the inventive method described above, is shown. The soldering device 13 has the current-carrying winding 6 and a winding current generating device 7, which is designed to generate a current flowing through the winding 6. The winding current generating device 7 is electrically connected to the winding 6 via electrical lines 11.

[0044] The soldering device 13 further comprises a relative movement device 9, which is designed to carry out a relative movement of the substrate 2 to the winding 6. The relative movement of the substrate 2 to the winding 6 can preferably take place in all three spatial directions in a Cartesian coordinate system. In the exemplary embodiment, the relative movement device 9 has a substrate holding device 9a, which is designed to hold the substrate 2, and a drive device 9b, which is designed to move the substrate holding device 9a and thus the substrate 2 relative to the winding 6. The substrate holding device 9a can, for example, be in the form of two clamping jaws into which the substrate 2 is clamped.

[0045] It should be noted that the relative movement device 9 can alternatively or additionally be designed to move the winding 6 relative to the substrate 2, which is shown in the FIG 1 and FIG 6 is not shown.

[0046] The soldering device 13 further comprises a pyrometer as measuring device 12, which is designed to measure a respective temperature in a respective range Ba-Bf of a respective component 1a to 1f to be soldered to the substrate 2.

[0047] The soldering device 13 further comprises a soldering device controller 21, which is designed to receive the respective temperature measured by the measuring device 12 and to control the winding current generating device 7 and the relative movement device 9 in accordance with the method steps to be carried out. For this purpose, the respective temperature measured by the measuring device 12 is transmitted from the measuring device 12 in the form of a temperature variable T1 to the soldering device controller 21. The soldering device controller 21 transmits at least one control signal S1 for controlling the relative movement device 9 to the relative movement device 9 and at least one control signal S2 for controlling the winding current generating device 7, e.g., for switching the current flowing through the winding 6 and generated by the winding current generating device 7 on and off.As a result of the current flowing through it, the winding 6 generates a magnetic field, by means of which eddy currents are generated in the region of the respective component Ba to Bf to be soldered, with which the central region 19 of the winding surface 18 of the winding 6 is aligned in the normal direction N of the substrate 2. In . FIG 62 shows a soldering arrangement 23 to be soldered after carrying out a first method step of a further method and a further soldering device 13' which is designed to carry out the further method. The further method is a method for the simultaneous formation of a specific number of solder connections 8a'-8f' of components 1a to 1f to be soldered to a substrate 2, wherein in the method, corresponding to the specific number of solder connections, here two solder connections 8a' and 8b', which are to be carried out simultaneously, a corresponding number of the above-described methods according to the invention are carried out in parallel on the substrate 2. The method for the simultaneous formation of a specific number of solder connections 8a' to 8f' of components 1a to 1f to be soldered to a substrate 2 thus includes all features of the method according to the invention.

[0048] According to the specific number of solder joints, here two solder joints 8a' and 8b', which are to be carried out simultaneously, at least a corresponding number of turns, here two turns 6 and 6', are present for generating a respective magnetic field, which are spaced apart from each other in a direction perpendicular to the normal direction N of the substrate 2.

[0049] In process steps b) and optionally c) of the process according to the invention, a relative movement of the substrate 2 to the windings, here the windings 6 and 6', is carried out when the temperatures in the areas, here the two areas Ba and Bb, of the components to be soldered simultaneously, here the two components 1a and 1b, each exceed a respective limit temperature which is at least as high as the melting temperature of the respective solder, here the respective solder 4a and 4b.

[0050] By means of the method for simultaneously forming a certain number of solder joints, several solder joints, here the two solder joints 8a' and 8b', of components 1a to 1f to be soldered to the substrate 2 can be formed simultaneously, so that this method enables a particularly efficient formation of the solder joints.

[0051] The soldering device 13' has a plurality of current-carrying windings, here the two windings 6 and 6', which are spaced apart from one another in a direction perpendicular to the normal direction N of the substrate 2, and a winding current generating arrangement 24 designed to generate currents flowing through the windings 6 and 6'. The winding current generating arrangement 24 preferably has a winding current generating device 7 or 7' assigned to the respective winding 6 or 6, which is designed to generate a current flowing through the winding 6 or 6' assigned to it. In the exemplary embodiment, the winding current generating device 7 is electrically connected to the winding 6 via electrical lines 11, and the winding current generating device 7' is electrically connected to the winding 6' via electrical lines 11'.It should be noted that the winding current generating arrangement 24 may also comprise only one winding current generating device, in which case the windings 6 and 6' are electrically connected in series and the respective current flowing through the respective winding 6 or 6' is physically the same current.

[0052] The soldering device 13' further comprises a relative movement device 9, which is designed to carry out a relative movement of the substrate 2 to the winding 6. The relative movement device 9 of the soldering device 13' is designed identically to the relative movement device 9 of the soldering device 13, so that, to avoid duplicate descriptions, with regard to the description of the relative movement device 9 of the soldering device 13', reference is made to the description of the relative movement device 9 of the soldering device 13.

[0053] The soldering device 13' further comprises a plurality of measuring devices 12 and 12', respectively, each designed to measure a respective temperature in a respective Ba-Bf range of a respective component 1a to 1f to be soldered to the substrate 2. The measuring device 12' is preferably designed identically to the measuring device 12, including the advantageous embodiments of the measuring device 12 described above. The measuring devices 12 and 12' are designed as pyrometers.

[0054] The soldering device 13' further comprises a soldering device control 21', which is designed to receive the temperatures measured by means of the measuring devices 12 and 12' and to control the winding current generation arrangement 24 and the relative movement device 9, in accordance with the method steps of the method to be carried out.

[0055] The respective temperature measured by the respective measuring device 12 or 12' is transmitted from the respective measuring device 12 or 12 in the form of a respective temperature variable T1 or T2 to the soldering device control 21'. The soldering device control 21' transmits at least one control signal S1 for controlling the relative movement device 9 to the relative movement device 9 and at least one control signal, here at least one control signal S1 and at least one control signal S3 to the winding current generating arrangement 24 for controlling the winding current generating arrangement 24, e.g. for switching on and off the currents flowing through the windings 6 and 6' and generated by the winding current generating arrangement 24. In the exemplary embodiment, the control signal S2 is transmitted to the winding current generating device 7 and the control signal S3 is transmitted to the winding current generating device 7'. The respective winding 6 or6' generates, as a result of the respective current flowing through it, a respective magnetic field by means of which respective eddy currents are generated in the region of the respective component Ba to Bf to be soldered, to which the respective central region 19 of the respective winding surface 18 of the respective winding 6 or 6 is aligned in the normal direction N of the substrate 2.

Claims

1. Method for forming solder joints (8a'-8f') between components (1a-1f) to be soldered and a substrate (2) that has an electrically non-conductive insulation layer (3) and a metal layer (4) arranged on the insulation layer (3) and structured to form conductor tracks (4a-4f), wherein the components (1a-1f) are arranged on the metal layer (4) and a solder (8a-8f) is arranged in each case between the components (1a-1f) and the metal layer (4), said method having the following method steps: a) carrying out a relative movement of the substrate (2) with respect to an energizable winding (6) such that, after the relative movement has been carried out, a central region (19) of a winding surface (18) enclosed by the winding (6) is arranged in alignment in the normal direction (N) of the substrate (2) with a first component (1a) to be soldered, b) heating the solder (8a) arranged between the first component (1a) and the metal layer (4) by induction of eddy currents in the region (Ba) of the first component (1a) by means of a magnetic field generated by the winding (6), and contactlessly measuring a temperature in the region (Ba) of the first component (1a) by means of a pyrometer, wherein the measurement is effected in the normal direction (N) of the substrate (2) in alignment with the region (Ba) of the first component (1a), in particular in alignment with the first component (1a), on a surface region of the substrate (2) arranged on a side (22) of the substrate (2) that is remote from the first component (1a), wherein, if the temperature in the region (Ba) of the first component (1a) exceeds a limit temperature, which is at least as high as the liquidus temperature of the solder (8a), a relative movement of the substrate (2) with respect to the winding (6) is carried out, immediately or after a given waiting time, such that, after the relative movement has been carried out, the central region (19) of the winding surface (18) is arranged in alignment in the normal direction (N) of the substrate (2) with a second component (1b) to be soldered, c) heating the solder (8b) arranged between the second component (1b) and the metal layer (4) by induction of eddy currents in the region (8b) of the second component (1b) by means of a magnetic field generated by the winding (6), and contactlessly measuring the temperature by means of a pyrometer (12) in the region of the second component (1b), wherein the measurement is effected in the normal direction (N) of the substrate (2) in alignment with the region (Bb) of the second component (1b), in particular in alignment with the second component (1b), on a surface region of the substrate (2) arranged on a side (22) of the substrate (2) that is remote from the second component (1b), wherein, if the temperature in the region of the second component (Bb) exceeds the limit temperature, heating of the solder (8b) by induction of eddy currents in the region (Bb) of the second component (1b) by means of a magnetic field generated by the winding is ended immediately or after a given waiting time.

2. Method according to Claim 1, characterized in that, in method step c), heating of the solder (8b) by induction of eddy currents in the region (Bb) of the second component (1b) by means of a magnetic field generated by the winding (6) is ended by carrying out a relative movement of the substrate (2) with respect to the winding (6) such that, after the relative movement has been carried out, the central region (19) of the winding surface (18) is arranged in alignment in the normal direction (N) of the substrate (2) with a further component (1c) to be soldered, or by switching off a current flowing through the winding, wherein a relative movement of the substrate (2) with respect to the winding (6) is carried out such that, after the relative movement has been carried out, the central region (19) of the winding surface (18) is arranged in alignment in the normal direction (N) of the substrate (2) with a further component (1c) to be soldered.

3. Method according to Claim 2, characterized in that method step c) is repeated with a respective further component (1c, 1d, 1e, 1f) to be soldered until all components (1a-1f) to be soldered have been soldered to the substrate (2), wherein, during soldering of the last component (1f) to be soldered, if the temperature in the region (Bf) of the last component (1f) to be soldered exceeds the limit temperature, heating of the solder (8f) by induction of eddy currents in the region (Bf) of the last component (1f) to be soldered is ended immediately or after a given waiting time.

4. Method according to one of the preceding claims, characterized in that, in method steps a), b) and optionally c), the substrate (2) is arranged between the respective component (1a-1f) to be soldered and the winding (6) at least after the respective relative movement has been carried out.

5. Method according to Claim 1, characterized in that the measurement of the temperature in the region of the respective component (1a-1f) is effected by means of thermal radiation (17) emitted from the region (Ba-Bf) of the respective component (1a-1f) and passing through the central region (19) of the winding surface (18).

6. Method according to one of the preceding claims, characterized in that the winding (6) is part of a winding element (16), wherein the winding element (16) has a first winding connection element (14a), which is electrically conductively connected to a first end (6a) of the coil (6), and a second winding connection element (14b), which is electrically conductively connected to a second end (6b) of the coil (6), wherein at least a portion of the first winding connection element (14a) and a portion of the second winding connection element (14b) extend away from one another in a v-shape.

7. Method according to Claim 6, characterized in that the first and second winding connection elements (14a, 14b) are formed integrally with the winding (6).

8. Method according to one of the preceding claims, characterized in that the winding (6) has a starting portion (6c), a substantially arcuate middle portion (6d) adjoining the starting portion (6c), and an end portion (6e) adjoining the middle portion (6d), wherein the starting portion (6c) and the end portion (6e) extend towards one another in a v-shape.

9. Method according to one of the preceding claims, characterized in that, in method step b), while the relative movement of the substrate (2) with respect to the winding (6) is being carried out, the winding (6) continues to generate the magnetic field or no longer generates the magnetic field.

10. Method according to one of the preceding claims, characterized in that the components to be soldered are in the form of pins or sleeves.

11. Method for simultaneously forming a specific number of solder joints (8a'-8f') between components (1a-1f) to be soldered and a substrate (2), wherein in the method, in accordance with the specific number of solder joints (8a', 8b') that are simultaneously to be formed, a corresponding number of methods according to one of Claims 1 to 10 are carried out on the substrate (2) temporally in parallel, wherein, in accordance with the specific number of solder joints (8a', 8b') that are simultaneously to be carried out, at least a corresponding number of windings (6, 6') for generating a respective magnetic field are present, said windings being spaced apart from one another in the perpendicular direction to the normal direction (N) of the substrate (2), wherein, in method step b) and optionally in method step c), a relative movement of the substrate (2) with respect to the windings (6, 6') is carried out if the temperatures in the regions (Ba, Bb) of the components (1a, 1b) that are simultaneously to be soldered in each case exceed a respective limit temperature, which is at least as high as the melting temperature of the respective solder (4a, 4b).

12. Soldering apparatus configured to carry out a method according to one of Claims 1 to 10, having a winding (6) capable of carrying current, a winding current generating device (7), which is configured to generate a current that flows through the winding (6), a relative movement device (9), which is configured to carry out a relative movement of a substrate (2) with respect to the winding (6), having a pyrometer as a measuring device (12), which is configured to contactlessly measure a respective temperature in a respective region (Ba-Bf) of a respective component (1a-1f) to be soldered to the substrate (2), such that the temperature in the region (Ba-Bf) of the respective component (1a-1f) is effected by measuring the temperature of a in alignment in the normal direction (N) of the substrate (2) with the region (Ba-Bf) of the respective component (1a-1f), and a soldering apparatus controller (21), which is configured to receive the respective temperature measured by means of the measuring device (12) and to control the winding current generating device (7) and the relative movement device (9), in accordance with the method steps of the method that are to be carried out.

13. Soldering apparatus configured to carry out a method according to Claims 11, having multiple windings (6, 6') capable of carrying current, which are spaced apart from one another in the perpendicular direction to the normal direction (N) of the substrate (2), a winding current generating arrangement (24), which is configured to generate currents that flow through the windings (6, 6'), a relative movement device (9), which is configured to carry out a relative movement of a substrate (2) with respect to the windings (6, 6'), multiple pyrometers as measuring devices (12, 12'), which are each configured to contactlessly measure a respective temperature in a respective region (Ba-Bf) of a respective component (1a-1f) to be soldered to the substrate (2), such that the temperature in the region (Ba-Bf) of the respective component (1a-1f) is effected by measuring the temperature of a in alignment in the normal direction (N) of the substrate (2) with the region (Ba-Bf) of the respective component (1a-1f), and a soldering apparatus controller (21'), which is configured to receive the temperatures measured by means of the measuring devices (12, 12') and to control the winding current generating arrangement (24) and the relative movement device (9), in accordance with the steps of the method that are to be carried out.