ELECTRICAL CONTACT ARRANGEMENT AS WELL AS CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THEIR MANUFACTURE

Description

State of the art

[0001] The present invention relates to an electrical contact arrangement for electrically contacting elements of a printed circuit board arrangement or the like, as well as a printed circuit board arrangement with such an electrical contact arrangement and a method for manufacturing it.

[0002] Electrical contact arrangements, for example, belong to the group of cold contacting technologies, in which a permanent, force-fit, and form-fit electrical contact is achieved. Here, the electrical contact is established solely by pressing or clamping the joining partners. Such press-fit connections are used in printed circuit boards, for example, in control units for vehicles or similar devices. This results in a wide variety of configurations, from single pins to large connector strips with several hundred electrical contacts. Especially with a large number of press-fit pins, the requirements for pin accuracy, circuit board accuracy, and positioning during the pressing process increase. A further set of problems arises from the increasing use of so-called...Insulated Metal Substrate (IMS) printed circuit boards are used, which consist of a base layer made of an electrically conductive material and an insulating layer applied to it. Due to technological requirements, it is not possible to create a through-hole connection using press-fit pins. To establish a connection between the IMS power electronics and other printed circuit boards or electronic components, various connection concepts are used, for example, using cables or SMD press-fit pins. Cable solutions always require a complex contacting process or an expensive and space-consuming connector. Furthermore, an SMD press-fit pin is known from DE 10 2008 007 310 B4, which is held in position during soldering using stencils.However, feeding and removing the stencil interrupts the SMD manufacturing process, leading to increased manufacturing costs and lead times.

[0003] DE 10 2016 218 788 A1 describes a connecting element for connecting a first printed circuit board (PCB) to a second PCB, comprising a central section extending along a longitudinal axis; a head section designed for surface mounting on a surface of the first PCB; and a press-fit section designed for pressing into a recess of the second PCB. JP 2011-138894 A describes the use of a pin head to electrically connect a first PCB and a second PCB, maintaining an approximately parallel alignment with a predetermined distance. Disclosure of the invention

[0004] The electrical contact arrangement according to the invention for electrical contacting on a printed circuit board or the like, with the features of claim 1, has the advantage that a very cost-effective and reliable electrical contacting solution has been found. In particular, the electrical contacting can be integrated into SMD manufacturing without special processes or complex and time-consuming manufacturing steps. The electrical contact arrangement according to the invention requires only minimal installation space and also allows for free design of the contacting, especially with regard to the position and number of electrical contacts. Furthermore, the electrical contact arrangement can be flexibly adapted to a wide variety of requirements during the production of printed circuit boards or the like. Finally, the invention enables a reduction in tolerance chain due to simple and precise joining processes.The joining processes can be carried out at ambient temperature. This also allows for simple process control and monitoring of the electrical contacting. According to the invention, this is achieved by the electrical contact arrangement comprising a mounting ring with an opening and a press-fit pin. The mounting ring is designed to be fixed to the printed circuit board or the like. The mounting ring can be integrated into the SMD manufacturing process as an SMD component. The press-fit pin has a first and a second zone. The first zone has greater mechanical flexibility than the second zone. Thus, the press-fit pin comprises a first flexible zone and a second rigid zone. The first flexible zone is designed to be fixed to another electronic component, for example, a second printed circuit board. The second, more rigid zone is inserted into the opening of the mounting pin by means of a first press fit.The electrical contact arrangement further includes an insertion aid located on the second zone. This insertion aid is fixed to the second zone as a circumferential closed ring flange. The circumferential ring flange includes an insertion shoulder for the engagement of an insertion tool.

[0005] The insertion aid is preferably fixed to the second, more rigid zone, for example by soldering or welding. Alternatively, the insertion aid and the second zone are made of a single material.

[0006] According to the invention, a printed circuit board is understood to be a circuit carrier, for example a PCB (Printed Circuit Board) made of FR4 material, or a circuit carrier made of ceramic substrates (LTCC (Low Temperature Cofired Ceramics), DBC (Direct Bonded Copper)) as well as other FR materials.

[0007] Thus, the electrical contact arrangement can be provided in a first step by fixing the mounting ring to a printed circuit board, in particular an IMS printed circuit board, and subsequently by inserting the press-fit pin into the opening of the mounting ring. In a further joining step, the electrical connection between the first printed circuit board and a second printed circuit board or the like can then be continued by joining the press-fit pin to the first, more flexible zone of the second printed circuit board.

[0008] The mounting ring can, for example, be manufactured simply as a stamped component with a central opening for the initial press fit. If necessary, the mounting ring can be electroplated. The mounting ring's fixation can then be integrated into a standardized SMD manufacturing process. The mounting ring can be attached to a surface using various joining methods, such as soldering. After the mounting ring is fixed in place, the press-fit pin can then be inserted into the mounting ring's opening using the initial press fit. This ensures very precise positioning of the electrical contact arrangement on the circuit board.

[0009] The dependent claims describe preferred embodiments of the invention.

[0010] The press-fit pin, comprising the first and second zones, is preferably formed in one piece from a single material. Preferably, the press-fit pin is made from a wire or strip material with a thickness of 0.4 to 0.8 mm.

[0011] The first, more flexible zone of the press-fit pin is preferably produced by a geometric deformation of the base material of the press-fit pin. Thus, the first zone is a geometrically deformed area, which can be, for example, an oval eyelet, a ring, or the like.

[0012] Preferably, the second zone, which is less flexible than the first zone of the press-fit pin, is a solid material area, for example a cylindrical area of ​​the starting material of the press-fit pin.

[0013] Furthermore, the flexible first zone is preferably designed for a second press fit with the additional electronic component. Thus, the press-fit pin of the electrical contact assembly has two press-fit connection areas.

[0014] Furthermore, the present invention relates to a printed circuit board arrangement comprising at least one first printed circuit board having a base region made of an electrically conductive material and an insulating layer on the base region made of an electrically non-conductive material, and comprising an electrical contact arrangement according to the invention. The printed circuit board is preferably an IMS printed circuit board and more preferably a printed circuit board manufactured by SMD production.

[0015] This makes it possible to integrate the mounting ring into the SMD manufacturing process as an SMD component to be assembled and to integrate the fixing of the mounting ring within the usual SMD procedure.

[0016] The printed circuit board arrangement preferably comprises a plurality of electrical contact arrangements according to the invention.

[0017] Preferably, a soldered connection is formed between the mounting ring and the printed circuit board of the circuit board assembly. A reflow soldered connection is particularly preferred. This allows for simple and cost-effective mounting of the mounting ring onto the surface of the insulating layer of the circuit board.

[0018] According to a particularly preferred embodiment of the invention, the printed circuit board arrangement further comprises a second printed circuit board or the like, wherein the flexible first zone of the press-fit pin is connected to the second printed circuit board by means of a second press connection. Of course, electrical contact can also be made between other components using the electrical contact arrangement according to the invention, instead of the printed circuit boards.

[0019] The first printed circuit board is preferably an IMS printed circuit board and preferably has an electrically insulating insulating layer only on one side of a metal substrate or the like.

[0020] The insulation layer is preferably made of a flame-retardant composite material and is in particular an FR4 layer.

[0021] Thus, in the circuit board arrangement according to the invention, a large number of plug connections can be implemented quickly and cost-effectively by means of the electrical contact arrangement with first and second zones.

[0022] The printed circuit board arrangement is preferably used in a vehicle control unit.

[0023] Furthermore, the present invention relates to a method for manufacturing a printed circuit board arrangement comprising a first printed circuit board made of an insulated metal substrate, in particular an IMS printed circuit board, and a second printed circuit board or the like, comprising the steps: Providing the first printed circuit board, performing surface mount device (SMD) manufacturing to fix at least one SMD component and at least one mounting ring of an electrical contact arrangement according to the invention within the SMD process, pressing in a press-fit pin of the electrical contact arrangement into the mounting ring fixed on the first printed circuit board, so that a first press connection is formed between the press-fit pin and the mounting ring, and pressing in a second printed circuit board or the like onto the at least one press-fit pin on the first printed circuit board in order to create a second press connection between the press-fit pin and the second printed circuit board.

[0024] The inventive method thus makes it possible to fix electrical contact arrangements within an SMD manufacturing process. The mounting ring of the electrical contact arrangement is therefore an SMD component, enabling simple process control and monitoring during assembly. The mounting rings can, for example, be fed onto the circuit board as bulk material via a suitable feeding device, such as a pick-and-place machine, and fixed to it, particularly by soldering. drawing

[0025] A preferred embodiment of the invention is described in detail below with reference to the accompanying drawing. The drawing shows: Figure 1 is a schematic side view of a press-fit pin of an electrical contact arrangement according to a preferred embodiment of the invention, Figure 2 is a top view of a mounting ring of the electrical contact arrangement, Figure 3 is a schematic sectional view of the entire electrical contact arrangement, and Figure 4 is a schematic sectional view of a printed circuit board arrangement with several electrical contact arrangements according to the Figures 1 to 3 . embodiment of the invention

[0026] The following refers to the Figures 1 to 4 An electrical contact arrangement 1 and a printed circuit board arrangement 10 as well as a method for manufacturing a printed circuit board arrangement according to a preferred embodiment of the invention are described in detail.

[0027] The Figures 1 to 3Figure 1 shows the electrical contact arrangement 1 according to the invention. The electrical contact arrangement comprises two main components, namely a mounting ring 3 ( Figure 2 ) and a press-fit pin 2, which in detail consists of Figure 1 as is evident. Figure 3 shows the assembled state of the mounting ring 3 with the press-fit pin 2.

[0028] The mounting ring 3 is a closed ring made of an electrically conductive material, preferably metal. The mounting ring 3 has an inner opening 3a. The inner opening 3a is designed to receive the press-fit pin 2.

[0029] The press-fit pin 2 comprises a first zone 21 and a second zone 22. The first zone 21 exhibits greater mechanical flexibility than the second zone 22. Thus, the second zone 22 is the stiffer zone of the press-fit pin. The second zone 22 is essentially a cylindrical solid material pin.

[0030] In this embodiment, the first zone 21 is a geometrically transformed area from the initial shape, e.g., a cylindrical pin, which is formed as an oval loop. Here, raw material can be formed at a free end into a geometrically shaped, closed loop area of ​​the first zone 21, and then the raw material can be cut to the desired length of the press-fit pin. This creates the second zone 22, which can be untreated raw material, for example, wire.

[0031] The press-fit pin 2 further comprises a press-fit shoulder as a press-fit aid 20, which in this embodiment is a circumferentially closed ring that is fixed to the second, stiffer zone 22 of the press-fit pin 2. This can be done, for example, by means of a soldered or welded connection.

[0032] Figure 1The side view shows the finished press-fit pin 2 with first zone 21, rod-shaped, stiffer second zone 22 and the press-fit shoulder.

[0033] It should be noted that the first zone 21 can also be produced by attaching an eyelet or ring made of another material to a rod-shaped material which provides the second zone 22 of the press-fit pin 2.

[0034] Figure 3 Figure 1 shows the assembled state, in which the press-fit pin 2 is pressed into the opening 3a of the mounting ring 3. This creates a first press connection 4 between the mounting ring 3 and the press-fit pin 2 in the area of ​​the second free end of the press-fit pin 2.

[0035] Figure 4Figure 1 shows the printed circuit board arrangement 10 with a plurality of electrical contact arrangements 1. The printed circuit board arrangement 10 comprises a first printed circuit board 11 and a second printed circuit board 12, which is arranged at a distance above the first printed circuit board 11. The printed circuit board arrangement 10 further comprises a plurality of electrical contact arrangements 1. Based on the Figure 4 The inventive method is also explained.

[0036] As from Figure 4 As can be seen, the first circuit board 11 is an IMS circuit board with a metal body 11a and an insulating layer 11b made of FR4 material. A large number of electronic components 14 can be fixed to the FR4 material using SMD technology. Figure 4Figure 1 schematically shows an SMD component 14 fixed to the insulating layer 11b. The mounting ring 3 of the electrical contact arrangement 1 is also provided as an SMD component and is fixed to the surface of the insulating layer 11b by means of a solder connection 6. This makes it possible to integrate the fixing of the mounting ring 3 into the existing SMD manufacturing process. As a result, the production of the first printed circuit board 11 can be carried out very cost-effectively and in a very short time.

[0037] To complete the electrical contact arrangement, the press-fit pin 2 is now pressed into the mounting ring 3, which is fixed to the surface of the insulation layer 11b, so that the first press connection 4 between the mounting ring 3 and the press-fit pin 2 is formed. This is achieved using a press-fit tool (not shown), which engages the press-fit shoulder of the press-fit pin 2.

[0038] The press-in pins 1 can be pressed individually into a respective mounting ring 3, or several press-in pins 2 can be pressed in parallel into respective mounting rings 3.

[0039] In a final step, the second circuit board 12 is pressed onto the press-fit pins 2 protruding from the surface of the first circuit board 11. For this purpose, the first zones 21 are inserted into through-holes 13 of the second circuit board 12, so that a second press connection 5 is formed between the first zone 21 of the press-fit pin 2 and the second circuit board 12.

[0040] The second circuit board 12 has an insulating carrier 12a made of an FR4 material and electrical conductors 12b on a surface of the insulating carrier 12a.

[0041] Thus, according to the invention, a plurality of electrical contacts between the first printed circuit board 11 and the second printed circuit board 12 can be achieved in one step. The press-fit pins 2 are preferably all identical.

[0042] Thus, a printed circuit board (PCB) arrangement 10 can be produced while maintaining a standard SMD manufacturing process without special processes. This allows for flexible design of the electrical contacts, particularly regarding their position and number. Furthermore, rapid adaptation to diverse requirements and quick changeovers to a different PCB arrangement are possible. The joining steps can be performed without heat treatment of the PCBs 11 and 12. This also results in simple process control and monitoring.

Claims

1. Electrical contact arrangement (1) for electrically contacting a printed circuit board (11) or the like, comprising: - a mounting ring (3), wherein the mounting ring (3) is designed to be fixed to the printed circuit board (11), and - a press-in pin (2) having a first zone (21) and a second zone (22), wherein the first zone (21) exhibits greater mechanical flexibility than the second zone (22), - wherein the first zone (21) is designed to be connected to a further electronic component, and characterized in that the mounting ring (3) has an opening (3a), the second zone (22) is fitted into the opening (3a) in the mounting ring (3) by means of a first press fit (4), and the electrical contact arrangement (1) comprises a press-in assistance device (20) which is arranged on the second zone (22), wherein the press-in assistance device (20) is fixed on the second zone (22) as a circumferential closed ring flange, wherein the circumferential ring flange comprises a press-in shoulder for a press-in tool to act on.

2. Electrical contact arrangement (1) according to Claim 1, wherein the press-in pin (2) is produced in one piece from one material.

3. Electrical contact arrangement (1) according to either of the preceding claims, wherein the first zone (21) of the press-in pin (2) is a geometrically formed region, in particular an oval sleeve or a ring.

4. Electrical contact arrangement (1) according to any of the preceding claims, wherein the second zone (22) is produced from an, in particular cylindrical, solid material.

5. Electrical contact arrangement (1) according to any of the preceding claims, wherein the first zone (21) is designed for a second press fit (5) with the further electronic component.

6. Printed circuit board arrangement (10), comprising: - a first printed circuit board (11), which has a base region (11a) composed of an electrically conductive material and has an insulation layer (11b) arranged on the base region (11a) and composed of an electrically non-conductive material, and - an electrical contact arrangement (1) according to any of the preceding claims, - wherein the mounting ring (3) of the electrical contact arrangement (1) is fixed on the insulation layer (11b).

7. Printed circuit board arrangement (10) according to Claim 6, wherein a soldered connection or a welded connection is formed between the first printed circuit board (11) and the mounting ring (3).

8. Printed circuit board arrangement (10) according to Claim 6 or 7, further comprising a second printed circuit board (12) or the like, wherein a second press-fit connection (5) is formed between the second printed circuit board (12) and the first zone (21) of the press-in pin (2).

9. Printed circuit board arrangement (10) according to any of Claims 6 to 8, wherein the first printed circuit board (11) is produced from an insulated metal substrate and in particular an IMS printed circuit board.

10. Printed circuit board arrangement (10) according to any of Claims 6 to 9, wherein an insulation layer (11b) composed of a flame-resistant composite material, in particular FR4, is produced on one side of the base region (11a).

11. Method for producing a printed circuit board arrangement (10) comprising a first printed circuit board (11) composed of an insulated metal substrate, in particular an IMS printed circuit board, and a second printed circuit board (12), comprising the steps of - providing the first printed circuit board (11), - carrying out an SMD process for fixing at least one SMD component (14) and at least one mounting ring (3) of an electrical contact arrangement (1) according to any of Claims 1 to 5 within the SMD process, - pressing a press-in pin (2) into the mounting ring (3) fixed on the first printed circuit board (11), so that a first press-fit connection (4) is formed between the press-in pin (2) and the mounting ring (3), wherein the press-in pin (2) has a first zone (21) and a second zone (22), wherein the first zone (21) is more flexible than the second zone (22) and the second zone (22) is formed on the first press-fit connection (4), and - pressing the second printed circuit board (12) onto the at least one press-in pin (2) in the first zone (21) of the press-in pin (2) in order to establish a second press-fit connection (5) between the press-in pin (2) and the second printed circuit board (12).