ARRANGEMENT OF REFRIGERATION EQUIPMENT AND REFRIGERATION ITEM

Description

[0001] The present invention relates to an arrangement with a cooling device for dissipating heat from objects to be cooled, such as power electronics modules, comprising at least one preferably rigid heat sink having a preferably flat heat-absorbing surface made of metal for absorbing heat from one or more objects to be cooled, as well as a cooling fluid chamber for receiving cooling fluid, in particular coolant, to which the heat absorbed by the heat sink can be transferred, and with at least one object to be cooled, in particular a power electronics module, having a preferably flat heat-dissipating surface made of metal.

[0002] Such arrangements of the object to be cooled and the cooling device are known. Particularly, but not exclusively, when the objects to be cooled are power electronics modules, it is often necessary to dissipate large amounts of heat energy generated in a very small space as efficiently as possible to prevent damage to the objects being cooled. In the prior art, the heat-dissipating surface of the object to be cooled and the heat-absorbing surface of the heat sink are arranged opposite each other. To optimize the heat transfer performance between the heat-dissipating and heat-absorbing surfaces, thermally conductive pastes of a specific thickness are used. These pastes prevent or displace air pockets between the surfaces that would adversely affect heat conduction. However, the thermal conductivity of these thermally conductive pastes is limited by the material properties of the components.

[0003] US Patent 7,535,715 B2 deals with the improvement of such thermal pastes or thermal conductivity materials, in particular through the use or addition of carbon particles.

[0004] US patent 6,111,749 shows heat sinks connected by flexible coolant lines, which are placed on components to be cooled. The flexibility of the coolant lines allows the heat sinks to be adjusted to different heights of the components to be cooled.

[0005] Therefore, the object of the present invention is to further develop the aforementioned arrangement, in particular with regard to improved heat conduction between the heat-emitting surface and the heat-absorbing surface.

[0006] This problem is solved by an arrangement with the features of claim 1. Accordingly, an arrangement according to the invention is characterized in that, to optimize heat conduction between the heat sink and the object to be cooled, the heat-absorbing surface of the heat sink is in direct contact with the heat-absorbing surface of the object to be cooled (metal-to-metal contact) without the use of an intermediate layer of air-displacing material (and in particular also without air and / or without a material-bonded connection between the heat-discharging surface and the heat-absorbing surface) or, at most, with the use of an intermediate layer of air-displacing material, in particular thermally conductive material, which is, however, only very thin and in particular only partially present, with a maximum thickness of < 2 µm, wherein a) the heat absorption surface of the heat sink and / or the heat dissipation surface of the object to be cooled is machined such that it has a roughness Ra < 0.3 µm and / or a flatness < 0.5 µm, and / or wherein b) the heat absorption surface of the heat sink and the heat dissipation surface of the object to be cooled are pressed together with a contact pressure of at least 0.05 N / mm².

[0007] It has surprisingly been shown that implementing even one of the aforementioned measures leads to a significantly improved heat conduction compared to the state of the art, and thus a considerably improved cooling performance of the cooling system. Combining these measures further enhances these effects.

[0008] According to the invention, by suitable, ultra-fine machining of the heat-dissipating and heat-absorbing surfaces (for example, by lapping, hone, diamond milling, etc.), with which the specified roughness and / or flatness values ​​can be achieved, it is ensured that the metallic heat-dissipating and heat-absorbing surfaces can make direct contact either over their entire surface or at least in the majority of their areas, without air pockets forming between the surfaces – unlike in the prior art – which would have to be displaced by a comparatively thick layer of thermally conductive material, which would negatively affect thermal conductivity. Accordingly, the high thermal conductivity values ​​of the metals involved can be directly utilized according to the invention. The background to this is that conventional thermal pastes generally have thermal conductivities that are sometimes 100 times lower than the thermal conductivities of metals.

[0009] However, it is also within the scope of the invention to continue using a full or partial surface intermediate layer of the air-displacing material, in particular thermal conductivity material, for the specified roughness and / or flatness values, which, however, is very thin compared to the prior art, namely < 2 µm.

[0010] It can even have a maximum thickness of < 40 nm, preferably < 25 nm, particularly preferably < 10 nm.

[0011] The air-displacing material of the intermediate layer can be, for example, thermal paste or wax with or without particularly thermally conductive additives, such as graphite particles.

[0012] As has been further demonstrated, alternatively or additionally, such direct (full or partial) metal-to-metal contact with the aforementioned advantages can also be achieved by pressing the heat-emitting and heat-absorbing surfaces together according to the invention with contact forces of > 0.05 N / mm². This pressing can also compensate for roughness and / or flatness exceeding the aforementioned values ​​and thus, even as a standalone measure, optimize heat conduction between the surfaces in question.

[0013] Particularly preferably, according to the invention, the heat absorption surface of the cooling element and / or the heat emission surface of the object to be cooled can even be (ultrafinely) machined in such a way that it has a roughness Ra < 0.1 µm and / or a flatness < 0.1 µm.

[0014] Furthermore, it is advantageous for the heat-emitting surface of the object to be cooled and the heat-absorbing surface of the cooling element to be positioned parallel to each other.

[0015] According to a preferred embodiment of the invention, the cooling device has at least two preferably rigid cooling elements, each of which has a (planar) heat-absorbing surface formed in particular by its underside, and which are articulated to each other in particular by a cooling element joint, so that the two cooling elements and with them the heat-absorbing surfaces can be moved relative to each other in different, in particular parallel, planes, wherein for each heat-absorbing surface of each cooling element it is the case that it is in direct contact with the heat-dissipating surface of one of two objects to be cooled without using the respective intermediate layer of the air-displacing material or at most using the only thin intermediate layer of the air-displacing material.

[0016] By using two heat sinks connected to each other by a hinge, and thus also two such connected heat absorption surfaces to be arranged on the respective object to be cooled, a cooling device is created that can compensate for larger tolerances or distances between the (planar) heat absorption surface(s) of the respective heat sink and the (planar) heat dissipation surfaces of the object(s) to be cooled, which could otherwise result from the fact that, in the case of several separate heat dissipation surfaces, these do not lie in a common plane, or that, with respect to each heat dissipation surface, it has individual surface areas that lie in different planes.

[0017] As a result, it is advantageously no longer necessary to use thermal paste with a large layer thickness, especially to bridge such larger gaps.

[0018] The heat dissipation surfaces of the two objects to be cooled can be arranged in different, in particular parallel, planes, whereby the flat heat absorption surfaces of the cooling elements, which are in contact with the heat dissipation surfaces, would also be arranged in different, in particular parallel, planes.

[0019] As regards the aforementioned heat sink joint, it can have two axes of rotation spaced apart from each other, in particular parallel axes of rotation, about which the two heat sinks can be moved, i.e. pivoted, relative to each other in the different planes.

[0020] The heat sink joint can further comprise a flexible, in particular flexible, preferably plate-shaped joint section, which is either integrally connected to the heat sinks and has a smaller material thickness than the two heat sinks, or which is integrally connected to a base body, in particular made of plastic, which is connected to the two heat sinks in a fluid-tight manner.

[0021] The flexible joint section can be adjacent on two opposite sides to one of two connecting sections with which it is integrally connected, each of the two connecting sections in turn being integrally connected to one of the two cooling sinks, and wherein the thickness of each connecting section in its area adjacent to the joint section corresponds to the thickness of the joint section and wherein its thickness increases continuously from this point towards the cooling sink with which it is integrally connected, in particular until it corresponds to the thickness of this cooling sink.

[0022] The two axes of rotation of the heat sink joint can be located in the area of ​​the opposite sides of the joint section, which each border the respective connecting section, or on these sides.

[0023] To generate the contact pressure according to the invention, see above, the cooling device can include a clamping device with which the heat absorption surface of each cooling element can be pressed or is pressed against the heat emission surface of the object to be cooled or of the respective object to be cooled.

[0024] Furthermore, the cooling element can be clamped or clampable together with the object(s) to be cooled in the clamping device, in particular between a first, in particular movable, preferably elastic clamping component and a second, in particular stationary clamping component.

[0025] The first clamping component can be pressed against the cooling sinks by means of spring force, or can be pressed against them.

[0026] Furthermore, each heat sink can preferably be rigidly and fluid-tight, in particular liquid-tight, connected to a base body, preferably made of plastic, in particular on the side of the respective heat sink facing away from the respective heat absorption surfaces, wherein the respective heat sink and the base body together completely or partially enclose the cooling fluid space or limit it to the outside.

[0027] The object or objects to be cooled can also be located on a stationary component of the cooling device, in particular either in direct contact with it on a preferably flat heat absorption surface (especially made of metal) of a stationary second, in particular made of solid material, further heat sink of the cooling device arranged at a distance from the (first) heat sinks for absorbing heat from the objects to be cooled, or via an intermediate layer of air-displacing, preferably pasty material, in particular thermally conductive material, such as thermal paste.

[0028] As regards the cooling fluid chamber of the cooling device, it can preferably be formed from or comprise a plurality of fluid lines inserted into the respective cooling body, in particular milled into it.

[0029] Further features of the present invention will become apparent from the attached patent claims, the following description of preferred embodiments, and the attached drawings.

[0030] It shows: Fig. 1: an arrangement according to the invention with a cooling device and three objects to be cooled by it in oblique view, Fig. 2: the cooling device made of Fig. 1 in side view, Fig. 3: the arrangement according to Fig. 1 , however, with three objects to be cooled, one of which is taller than the other two, Fig. 4: another embodiment of a cooling device according to the invention in a side view analogous to Fig. 2 .

[0031] The arrangement shown in the figures includes a cooling device 10, which serves to dissipate heat from objects 11 to be cooled, in this case power electronic components (such as inverter modules), as are used, for example, in connection with batteries or accumulators of electric vehicles.

[0032] The cooling device 10 has a lower cooling element 12 on which the objects 11 to be cooled are arranged or sit and which cools the undersides of the objects 11 to be cooled or absorbs heat from them, as well as several, in this case three, upper cooling elements 20, 21, 22, which each rest on the tops of the objects 11 to be cooled and cool them or absorb heat from their tops.

[0033] The lower heat sink 12 and the upper heat sinks 20, 21, 22 are each designed as solid metal bodies, for example made of aluminum.

[0034] The lower heat sink 12 is part of a lower cooling component 14, which has an internal (not shown) cooling fluid chamber. This chamber is bounded externally by the lower heat sink 12 and a base body, for example, made of plastic. The lower heat sink 12 and its associated base body are fluid-tight, in this case liquid-tight, connected to each other (e.g., by a material bond). For the sake of simplicity, the figures do not show the lower heat sink 12 of the lower cooling component 14 and its base body as separate units, but rather as a single unit or block.

[0035] The upper heat sinks 20, 21, 22 are part of an upper cooling component 15, which also has an internal cooling fluid chamber (not shown). This chamber is bounded externally on one side by the upper heat sinks 20, 21, 22 and on the other side by a base body 19, also made of plastic, which is common to these upper heat sinks 20, 21, 22. The upper heat sinks 20, 21, 22 and the base body 19 of the upper cooling component 15 are also fluid-tight, in this case also liquid-tight, connected to each other (e.g., by a material bond).

[0036] One or both cooling fluid spaces can, for example, consist of or comprise a plurality of fluid lines inserted, in particular milled, into the respective cooling bodies 12 or 20, 21, 22.

[0037] The lower cooling component 14 and the upper cooling component 15, more precisely their cooling fluid chambers, are connected to each other in a fluid-conducting manner via laterally arranged connecting lines 16, in particular perpendicular to them.

[0038] The cooling device 10 also has a medium inlet 17 and a medium outlet 18.

[0039] As a result, cooling fluid can be supplied via the medium inlet 17 first to the lower cooling component 14 and subsequently also to the upper cooling component 15, which can dissipate the (waste) heat during operation of the cooling device 10 that the cooling elements 12 or 20, 21, 22 absorb from the objects 11 to be cooled.

[0040] The cooling fluid will typically be a liquid coolant. However, it is understood that using a gaseous medium as the cooling fluid is also within the scope of the invention. The corresponding fluid-tight connections between the respective base body and the lower or upper cooling element 12 or 20, 21, 22, etc., would then have to be designed to be gas-tight.

[0041] According to the invention, the upper cooling elements 20, 21, 22 are connected to each other in pairs by means of a pivot joint, so that they are movable relative to each other. A first pair of upper cooling elements 20, 21 is pivotally connected to each other via a first cooling element joint 23, and a second pair of upper cooling elements 21, 22 is pivotally connected by a second cooling element joint 24.

[0042] Each upper cooling element 20, 21, 22 has a flat underside, which forms an (outer) flat or planar heat absorption surface 25, which, in operation of the cooling device 10, rests against or is parallel to an opposite, in this case also flat, heat emission surface 26 of the respective object 11 to be cooled, formed by its respective top side.

[0043] The articulated connections of the upper cooling elements 20, 21, 22 enable a special tolerance compensation when the respective upper cooling element 20, 21, 22 is attached to the objects 11 to be cooled, as will be explained in more detail below.

[0044] Specifically, this can also compensate for somewhat larger differences in the height dimensions of the individual objects to be cooled 11, the compensation of which using thermal paste would be (too) disadvantageous with regard to optimized heat conduction due to the layer thicknesses required.

[0045] In such a case of larger differences in height (but also in other sensible cases), the individual, flat heat absorption surfaces 25 of the respective upper cooling elements 20, 21, 22 can then be moved into different planes, so that despite the heat emission surfaces 26 of the objects 11 not being in a common plane, they are nevertheless directly opposite each other with no or only the smallest possible distance to the (flat) heat emission surface 26 of the respective object 11 to be cooled.

[0046] The necessary mobility between the individual upper cooling elements 20, 21, 22 is made possible, as already indicated above, by the cooling element joints 23 and 24.

[0047] To further clarify, in Fig. 3 A situation is shown in which one of the objects 11 to be cooled, namely the left outer object 11 to be cooled, has a greater height than the other two objects 11 to be cooled. Accordingly, its heat dissipation surface 26 lies in a different (higher) plane than the heat dissipation surfaces 26 of the other two objects 11 to be cooled.

[0048] To compensate for this, the upper cooling component 15 was modified compared to the situation of the Fig. 1, in which all heat-absorbing surfaces 25 of the upper cooling component 15 or the upper cooling elements 20, 21, 22 lie in a common plane, are deformed by applying pressure to the upper cooling component 15 or indirectly to the upper cooling elements 20, 21, 22. Forces 27 acting from above on the upper cooling component 15 or, correspondingly, on the upper cooling elements 20, 21, 22 to cause this deformation are shown schematically.

[0049] Specifically, these forces 27 act on the individual upper heat sinks 20, 21, 22 and in particular cause a relative movement between the outer upper heat sink 20 and the adjacent, middle upper heat sink 21.

[0050] For this purpose, the first and second heat sink joints 23 and 24 each comprise a joint section 29, for example a plate-shaped section, which is integrally connected to the upper heat sinks 20, 21, 22. This joint section has a significantly smaller material thickness than the two upper heat sinks 20, 21 and 21, 22, which the respective heat sink joints 23 and 24 connect to each other.

[0051] The (reduced) material thickness is chosen such that the respective joint section 29 is flexible (deformable) or bendable overall. Defined, spaced-apart, parallel axes of rotation 28a and 28b are formed on opposite sides of the respective joint section 29. These axes run parallel to the plane of the respective heat-absorbing surface 25, and the cooling elements 20, 21, 22 can each be rotated around them (by deforming the joint section 29 in this area).

[0052] In the area of ​​both opposite sides of the respective joint section 29, this joint section is adjacent to a connecting section 30 which is integrally connected to the two upper cooling elements 20, 21 or 21, 22 of a pair of adjacent cooling elements 20, 21, 22, the thickness of which in its area adjacent to the joint section 29 corresponds to the thickness of the joint section 29 and whose thickness increases continuously from this point towards the respective cooling element 20, 21 or 22, in particular until it corresponds to the thickness of the cooling element 20, 21 or 22.

[0053] Regarding the aforementioned relative movement between the outer upper heat sink 20 and the adjacent, middle upper heat sink 21, it enables a corresponding alignment or movement of the individual heat sinks 20 and 21 such that subsequently both the heat absorption surface 25 of the outer upper heat sink 20 and the heat absorption surface 25 of the middle upper heat sink 21 are in contact with their respective assigned heat emission surface 26 of the object 11 to be cooled ( Fig. 3 ).

[0054] The aforementioned forces 27 are applied in the present example by a clamping device not shown, in which the lower and upper cooling components 14 and 15 respectively, together with the objects to be cooled 11 arranged between them, are clamped between a first, in particular movable, preferably spring-shaped clamping component and a second, in particular stationary clamping component.

[0055] It may also be provided that, for example, the lower cooling component 14 simultaneously forms the second, stationary clamping component.

[0056] In Figure 4 Figure 10 shows an embodiment of a cooling device 10 according to the invention, in which the individual cooling elements 20, 21, 22 are arranged differently than in the Figures 1-3 are connected to each other by a hinge. Namely, not directly via a hinge section 29 or connecting section 30 integrally connected to them, but only indirectly via a flexible hinge section 31 arranged between the pairs of cooling elements 20, 21 or 21, 22, which in this case is part of the base body 19 made of plastic, which is connected (fluid-tight) to the upper cooling elements 20, 21, 22, or is integrally connected to it.

[0057] In this case, the upper heat sinks 20, 21, 22 are materially separate or separately manufactured components that were (only) connected to each other by the common base body 19, whereas in the embodiment of the Figures 1-3 are made from a common block of material or metal, into which the connecting sections 30 or the joint sections 29 have been or are incorporated by suitable processing of the material block, so that the upper cooling bodies 20, 21, 22 are as a result connected to each other in one piece.

[0058] In particular, the heat conduction between the heat emitting surfaces 26 and the heat receiving surfaces 25 is further optimized according to the invention.

[0059] Both the heat dissipation surfaces 26 and the heat absorption surfaces 25 are ultra-flat, produced by ultra-fine machining such as lapping, honing, diamond milling, and exhibit roughness values ​​Ra < 0.3 µm and / or flatness values ​​< 0.5 µm.

[0060] In combination with a contact pressure of at least 0.05 N / mm², with which the heat-absorbing surfaces 25 and the heat-dissipating surfaces 26 are pressed against each other and which is applied by means of the clamping device, this leads, as already described in detail at the beginning of this application, to the metal of the heat-dissipating surface 26 and the metal of the heat-absorbing surface 25 contacting each other directly either over the entire surface or at least in predominant areas, without – unlike in the prior art – air cushions forming between the surfaces 25 and 26, which would otherwise have to be displaced by a comparatively thick layer of air-displacing material, in particular thermally conductive material, which would have a negative effect with regard to thermal conductivity.

[0061] Therefore, such an intermediate layer made of a material that is inherently or materially significantly less conductive than a pure metal-to-metal contact can be omitted. If such an intermediate layer is nevertheless used, it can be very thin due to the roughness and / or flatness values ​​and / or the contact pressure according to the invention, and may, for example, have a maximum thickness of less than 2 µm. Reference symbol list:

[0062] 10 Cooling device 11 Object to be cooled 12 Lower cooling element 14 Lower cooling component 15 Upper cooling component 16 Connecting line 17 Medium inlet 18 Medium outlet 19 Base body of upper cooling component 20 Outer upper cooling element 21 Middle upper cooling element 22 Outer upper cooling element 23 First cooling element joint 24 Second cooling element joint 25 Heat absorption surface 26 Heat dissipation surface 27 Force 28a Axis of rotation 28b Axis of rotation 29 Joint section 30 Connecting section 31 Joint section

Claims

1. Arrangement having a cooling device for removing heat from objects to be cooled, such as power electronics modules, which has at least one preferably rigid cooling body (20, 21, 22) which has a preferably flat heat absorption surface made of metal and is intended for absorbing heat from one or more objects to be cooled, and a cooling-fluid space for receiving cooling fluid, in particular cooling liquid, to which the heat absorbed by the cooling body (20, 21, 22) can be conducted, and with at least one object to be cooled, in particular a power electronics module, which preferably has a flat heat emission surface made of metal, characterized in that, to optimize the heat conduction between the cooling body (20, 21, 22) and the object to be cooled, the heat absorption surface of the cooling body (20, 21, 22) directly adjoins the heat emission surface of the object to be cooled without the use of an intermediate layer of air-displacing material, in particular heat-conducting material, or at most with the use of an intermediate layer, however only a thin one, of air-displacing material, in particular heat-conducting material, with a maximum thickness of < 2µm, wherein a) the heat absorption surface of the cooling body (20, 21, 22) and / or the heat emission surface of the object to be cooled is processed in such a way that it has a roughness Ra < 0.3 µm and / or a flatness < 0.5 µm, and / or wherein b) the heat absorption surface of the cooling body (20, 21, 22) and the heat emission surface of the object to be cooled are pressed against each other with a contact pressure of at least 0.05 N / mm2.

2. Arrangement according to claim 1, characterized in that the heat absorption surface of the cooling body (20, 21, 22) and / or the heat emission surface of the object to be cooled is processed in such a way that it has a roughness Ra < 0.1 µm and / or a flatness < 0.1 µm, and / or that the intermediate layer of air-displacing material has a maximum thickness < 40 nm, preferably < 25 nm, particularly preferably < 10 nm.

3. Arrangement according to one or more of the preceding claims, characterized in that the heat emission surface of the object to be cooled and the heat absorption surface of the cooling body (20, 21, 22) are located opposite one another in parallel.

4. Arrangement according to one or more of the preceding claims, characterized in that the cooling device has at least two preferably rigid cooling bodies (20, 21, 22) which in each case have a heat absorption surface, in particular a flat heat absorption surface formed in particular by their bottom surface, and which are connected to one another in an articulated manner in particular via a cooling-body joint (23, 24), so that the two cooling bodies (20, 21, 22) and, with them, the heat absorption surfaces can be moved relative to one another in different, in particular parallel, planes, wherein each heat absorption surface of each cooling body (20, 21, 22) is in direct contact with the heat emission surface of one of two objects to be cooled without the use of the associated intermediate layer of air-displacing material or, at most, with the use of only a thin intermediate layer of the air-displacing material.

5. Arrangement according to claim 4, characterized in that the heat emission surfaces of the two objects to be cooled are arranged in different, in particular parallel, planes, and in that the planar heat absorption surfaces of the cooling bodies (20, 21, 22), which abut the heat emission surfaces, are arranged correspondingly as well in different, in particular parallel, planes.

6. Arrangement according to claim 4 or 5, characterized in that the cooling body joint (23, 24) has two axes of rotation, which are spaced apart from one another and, in particular, are parallel, about which the two cooling bodies (20, 21, 22) can be moved, namely pivoted, relative to one another into the different planes.

7. Arrangement according to claim 4, 5 or 6, characterized in that the cooling body joint (23, 24) has a flexible, in particular pliable, preferably plate-shaped joint section, which is either connected in one piece to the cooling bodies (20, 21, 22) and in this case has a smaller material thickness than the two cooling bodies (20, 21, 22), or which is connected in one piece to a basic body, in particular made of plastic, which is connected to the two cooling bodies (20, 21, 22), in particular in a fluid-tight manner.

8. Arrangement according to claim 7, characterized in that the flexible joint section is adjacent in each case to one of two connection sections on two sides located opposite one another, to which it is integrally connected, wherein each of the two connection sections, on the other hand, is connected in one piece to one of the two cooling bodies (20, 21, 22), and wherein the thickness of each connection section in its area adjacent to the joint section corresponds to the thickness of the joint section and wherein its thickness increases, in particular continuously, from there in the direction of the cooling body (20, 21, 22) to which it is connected in one piece, until it corresponds to the thickness of said cooling body (20, 21, 22).

9. Arrangement according to one or more of the preceding claims 4-8, characterized in that the two rotation axes of the cooling body joint (23, 24) are arranged in the area of the opposing sides of the joint section, each of which being adjacent to the associated connection section, or to these sides.

10. Arrrangement according to one or more of the preceding claims, characterized in that the cooling device for generating the contact pressure comprises a clamping device with which the heat absorption surface of each cooling body (20, 21, 22) can be or is pressed against the heat emission surface of the object to be cooled or of the associated object to be cooled.

11. Arrangement according to claim 10, characterized in that each cooling body (20, 21, 22) is clamped or can be clamped in the clamping device together with the object or objects to be cooled, in particular between a first, in particular movable, preferably elastic clamping component and a second, in particular stationery clamping component.

12. Arrangement according to claim 11, characterized in that the first clamping component can be pressed or is pressed against the cooling bodies (20, 21, 22) by means of spring force.

13. Arrangement according to one or more of the preceding claims, characterized in that each cooling body (20, 21, 22) is firmly and in a fluid-tight, in particular liquid-tight manner connected to one or the in particular common basic body, preferably formed from plastic, in particular on the side of the associated cooling body (20, 21, 22) facing away from the or the associated heat absorption surface, wherein the associated cooling body (20, 21, 22) and the basic body together completely or partially enclose the cooling fluid space or delimit it towards the outside.

14. Arrangement according to one or more of the preceding claims 4-13, characterized in that the object or each object to be cooled is placed on a stationary component of the cooling device, in particular either in direct contact with the latter on a preferably flat heat absorption surface of a stationary second, further cooling body (12) of the cooling device, in particular consisting of solid material, arranged at a distance from the (first) cooling bodies (20, 21, 22) for receiving heat from the objects to be cooled, or with the interposition of an intermediate layer of an air-displacing material, in particular a heat-conducting material.